JP2009012105A - Cutting tool unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting tool unit having the angle adjusting mechanism which is effectively usable in the whole length of a cutting edge of a tip, and has a simple structure, the cutting tool suitable when a workpiece such as a semiconductor is comparatively small. <P>SOLUTION: This cutting tool unit is provided with: a shank 51 fixed to a frame 36 of a cutting unit; and a cutting tool 61 mounted to be attachable/detachable to/from the shank 51 by a screw 67 substantially parallel to a rotating direction of the frame 36 and oscillatable by making the screw 67 as an oscillation shaft. A projecting part 64 is formed at one end part of the cutting tool 61 with the tip 62 at the other end part thereof fixed. A plurality of recessed parts 54 to which the projecting part 64 is engaged according to an oscillation angle are formed on the shank 51. By recess-projection engagement of the projecting part 64 on the cutting tool 61 side and a recessed part on the shank 51 side, a contact part of the cutting edge of the tip 62 with the workpiece is changed by adjusting a mounting angle of the cutting tool 61. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a cutting tool unit in which a cutting tip is fixed to the tip of a cutting tool.

  As one of semiconductor chip mounting techniques, a flip chip is known in which a protruding electrode called a bump is formed on an electrode portion on a chip surface, and this electrode is directly bonded to an electrode on the mounting substrate side. The bump is formed by a method such as plating. However, if the height of the plurality of bumps varies, there arises a problem that the relatively low bump is not bonded to the counterpart electrode. This problem becomes more prominent as the integration density increases and the density of bumps arranged on the chip surface increases.

  Therefore, in order to properly bond all the bumps to the mating electrode, at the stage of the wafer before dividing it into semiconductor chips, the bump tips are collectively cut to make the height uniform. ing. As a bump cutting tool, a tool in which a cutting tool is attached to a rotating body such as a wheel mount is known (see Patent Document 1).

  This Patent Document 1 describes a method of reciprocating a cutting operation that has been moved only in one direction in order to eliminate uneven wear of a tip fixed to the tip of a cutting tool. In this method, since the contact portion of the cutting edge at the tip of the tip with the workpiece is constant, an effect that the contact portion is evenly worn in the reciprocating direction by the reciprocating operation can be obtained. However, if a chip occurs at the contact portion with the work piece, the tool becomes unusable and the tool must be replaced. In this way, it is uneconomical to replace the cutting tool only when chipping occurs at one place on the chip. For this reason, it is possible to change the contact portion of the chip having a certain cutting edge length with the workpiece. A byte is proposed (Patent Document 2).

JP 2006-245493 A JP 2002-346808 A

  The cutting tool described in Patent Document 2 is capable of bringing the cutting edge into contact with the workpiece evenly by adjusting the mounting angle with respect to the shank. When the cutting tool tip is worn, it is periodically polished and processed into a usable state. However, if the entire cutting edge can be used effectively, the tool life is greatly extended and the replacement frequency is reduced. However, the cutting tool described in Patent Document 2 is a general lathe tool, and this type of cutting tool is unsuitable in terms of size to be dimensionally applied to the processing of the semiconductor. In addition, it is difficult to reduce the angle adjusting mechanism disclosed in this document to the same size as that applicable to semiconductor processing because the structure is complicated.

  Therefore, the present invention has a simple structure of an angle adjustment mechanism that enables the tip edge of the chip to be used effectively over almost the entire length, and thereby a bite unit that is particularly useful when a workpiece such as semiconductor processing is relatively small. It is intended to provide.

  The bite unit of the present invention has a base fixed to a rotating body that rotates along a circumferential direction around a rotating shaft, and an axial center that is screwed to the base in a state that is substantially parallel to the rotating direction of the rotating body. A screw member, and a bite that can be attached to and detached from the base by the screw member and that can be swung along a plane substantially perpendicular to the rotation direction of the rotating body with the screw member as a rocking shaft. Has a first oscillating end portion and a second oscillating end portion, a tip is fixed to the first oscillating end portion, and an engaging portion is provided at the second oscillating end portion. The base is provided with an engaged portion that fixes the swinging angle of the cutting tool to an arbitrary angle by engaging the engaging portion of the cutting tool.

  The cutting tool of the present invention is swingably attached to the base, and the entire cutting edge of the tip fixed to the first swinging end is adjusted by swinging and adjusting the mounting angle. It can be contacted evenly. As a result, the tool life is greatly extended, the replacement frequency is reduced, and the machining cost is reduced. The bite is fixed and fixed by engaging the engaging part of the second swing end part with the engaged part on the base side, whereby the mounting angle is adjusted. Thereafter, the cutting tool is fixed to the base by a screw member.

  According to the present invention, the tool is attached to the base so as to be swingable with a screw member for fixing the tool to the base as a swing shaft, and is provided at one end of the tool, that is, at the second swing end. With a simple configuration in which the engaging portion is engaged with the engaged portion provided on the base, the attachment angle of the tool can be adjusted and the tool can be fixed to the base. Thus, since the structure for adjusting the angle is simple, it can be sufficiently manufactured even with a relatively small size, and is therefore suitably used as a tool unit for processing semiconductors.

  In the present invention, it is preferable that the cutting tool is provided with a gripping part for gripping the cutting tool itself and that the tool is operated to swing the cutting tool through the gripping part.

  According to the present invention, the angle adjustment mechanism that allows the tip edge of the chip to be used effectively over its entire length has a simple structure, which is advantageous particularly when a workpiece to be processed such as semiconductor processing is relatively small. Play.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[1] Workpiece (semiconductor wafer)
FIG. 1 shows a disk-shaped semiconductor wafer whose surface is cut by a bite unit according to an embodiment. The wafer 1 is a silicon wafer or the like, and a plurality of semiconductor chips 2 are formed on the surface. These semiconductor chips 2 are configured by forming an electronic circuit (not shown) such as an IC or LSI on the surface of a rectangular area partitioned in a grid pattern by the division lines 3. A V-shaped notch 4 indicating the crystal orientation of the semiconductor is formed at a predetermined location on the peripheral surface of the wafer 1.

  As shown in the enlarged view on the right side of FIG. 1A, each semiconductor chip 2 is formed with a plurality of bumps (projection electrodes) 5 protruding from the surface. These bumps 5 are bonded to electrodes formed in the semiconductor chip 2 and are formed by a plating method or the like. A resin layer 6 made of polyimide, resist, or the like is formed on the surface of the wafer 1. As shown in FIG. 2A, the resin layer 6 is thicker than the bump 5, and all the bumps 5 are embedded in the resin layer 6. The surface of the resin layer 6 is not flat, and the height of the bump 5 from the wafer surface is not uniform. The wafer 1 is subjected to predetermined processing such as thinning processing by backside grinding in addition to cutting the front surface, and then cut and divided along the division lines 3 to be separated into individual semiconductor chips 2. Is done.

  The separated semiconductor chip 2 is mounted by mounting each bump 5 directly on, for example, an electrode of a mounting substrate by a mounting technique such as flip chip. For this purpose, each bump 5 is attached to the resin layer 6. It is necessary to expose the surface and make the height uniform. Therefore, the wafer 1 is subjected to a cutting process in which the front ends of all the bumps 5 are cut together with the surface of the resin layer 6.

[2] Cutting Device A cutting device 10 shown in FIG. 3 is suitably used for cutting the wafer surface. According to this cutting apparatus 10, the back surface of the wafer 1 is held by being sucked and held on the suction surface of the vacuum chuck type chuck table 20, and the front surface side of the wafer 1 is cut by the rotating cutting tool 30 of the cutting unit 30. The tip of the bump 5 and the surface of the resin layer 6 are cut. By this cutting process, the wafer 1 is processed so that the bumps 5 and the resin layer 6 are flush with each other and the bumps 5 are evenly arranged as shown in FIG.

Hereinafter, the configuration and operation of the cutting apparatus 10 shown in FIG. 3 will be described.
The cutting apparatus 10 has a rectangular parallelepiped base 11, and the wafer 1 is on the surface side on which the resin layer 6 is formed in a supply cassette 12 that is detachably set at a predetermined location on the base 11. A plurality are stacked and stored with the side facing up. One wafer 1 is pulled out from the supply cassette 12 by the transfer robot 13, and the wafer 1 is placed on the positioning table 14 with the front side facing up, and is determined at a certain position here.

  The wafer 1 positioned on the positioning table 14 is picked up from the positioning table 14 by the supply arm 15 and concentrically on the disk-shaped chuck table 20 that is operated in vacuum with the front side facing up. Placed. As shown in FIG. 4, the chuck table 20 is a pin chuck type in which a suction portion 22 </ b> A in which a large number of pins 22 are erected is formed at the center upper portion of the frame body 21. It is adsorbed and held in such a state that the back surface is in contact with the adsorbing surface which is the upper surface of 22A and the resin layer 6 on the front surface side is exposed.

  As shown in FIG. 3, the chuck table 20 is supported on a table base 25 provided on the base 11 so as to be movable in the Y direction, and the wafer 1 passes through the table base 25 and the chuck table 20 in the Y direction. It is sent to the processing position on the back side. A cutting unit 30 for cutting the wafer surface is disposed above the processing position. On the base 11, a bellows-like cover 26 is provided so as to be stretchable so as to block the moving path of the table base 25 and prevent cutting chips and the like from falling into the base 11.

  The cutting unit 30 is installed on the front surface of the column 16 erected at the end on the back side of the base 11 so as to be movable up and down along the Z direction (vertical direction). That is, a guide 41 extending in the Z direction is provided on the front surface of the column 16, and the cutting unit 30 is slidably mounted on the guide 41 via the slider 42. The cutting unit 30 is moved up and down in the Z direction via the slider 42 by a ball screw type feed mechanism 44 driven by a servo motor 43.

  In the cutting unit 30, a spindle shaft (rotating shaft) 32 shown in FIG. 4 is coaxially and rotatably supported in a cylindrical spindle housing 31 whose axial direction extends in the Z direction. The spindle motor 31 is rotationally driven by a spindle motor 33 fixed to the upper end of the spindle housing 31. As shown in FIG. 4, a cutting tool 35 is attached to the lower end of the spindle shaft 32 via a disk-shaped flange 34.

  In this cutting tool 35, a bite unit 50 is detachably attached to the lower surface of an annular frame (rotating body) 36, and the frame 36 is concentrically attached to the flange 34. The bite unit 50 is made of diamond or the like, and has a tip 62 that actually cuts and cuts a workpiece. The cutting tool 35 rotates integrally with the spindle shaft 32, and the cutting outer diameter of the rotating tool unit 50 (the outer diameter of the rotation locus of the chip 62) is set larger than the diameter of the wafer 1. The byte unit 50 relates to one embodiment of the present invention, and will be described in detail later.

  In order to cut the bump 5 and the resin layer 6 on the surface of the wafer 1, the cutting unit 30 is moved to a position where the cutting edge height of the cutting tool unit 50 becomes a height at which the tip of the bump 5 is cut by a predetermined amount. Then, the cutting tool 35 is rotated by the spindle motor 33. Then, the table base 25 is moved to the back side, and the wafer 1 is moved toward the processing position that hits the lower side of the cutting unit 30. Then, the tip of the bump 5 and the surface of the resin layer 6 are cut by the bite unit 50 of the cutting tool 35, and the entire surface is cut flat by moving until the wafer 1 is covered with the frame 36.

  When the entire surface of the wafer is cut, the cutting unit 30 is lifted and retracted from the wafer 1, while the table base 25 is moved to the near side, and the wafer 1 is placed on the chuck table 20 from the supply arm 15. It is returned to the attachment / detachment position. The vacuum operation of the chuck table 20 is stopped at this attachment / detachment position, and then the wafer 1 is transported to the spinner type cleaning device 18 by the recovery arm 17 and cleaned and dried, and then transferred into the recovery cassette 19 by the transport robot 13. Transported and contained. In addition, the chip and the like are removed from the chuck table 20 from which the wafer 1 has been removed by the air sprayed from the air nozzle 27.

[3] Tool Unit Next, the tool unit 50 attached to the cutting unit 30 will be described.
As shown in FIGS. 5 to 7, the cutting tool unit 50 is mainly composed of a substantially rectangular parallelepiped shank (base) 51 and a cutting tool 61 attached to the shank 51.

  The cutting tool 61 has a plate shape, and a tip 62 formed in a predetermined shape with diamond or the like is fixed to the surface side of one end portion (first swing end portion) in the longitudinal direction. The chip 62 has a symmetrical shape, and the workpiece (the surface of the wafer 1) is cut by a cutting edge 63 (see FIG. 8) formed in a circular arc shape at the lower end. The portion of the cutting edge 63 that comes into contact with the workpiece is not the entire length of the arc, but the lower edge of the length, for example, about 1/3.

  On the other hand, on the end portion (second swing end portion) opposite to the side to which the tip 62 of the cutting tool 61 is fixed, a triangular convex portion (engaging portion) whose tip protrudes toward the center in the width direction. ) 64 is formed. Further, a lever (gripping portion) 65 protruding from the surface is provided on the surface of the end portion of the cutting tool 61 on the convex portion 64 side. Further, a screw insertion hole 66 is formed at a position slightly closer to the tip 62 than the center part in the longitudinal direction of the cutting tool 61 and in the center part in the width direction.

  On the other hand, on one side surface of the shank 51, there is a depth equivalent to the thickness of the cutting tool 61, and a pit 52 for storing the cutting tool that opens to the end face of the shank 51 (the lower side in FIGS. 6 and 7). Is formed. A screw hole 53 extending in a direction perpendicular to the bottom surface is formed near the one end of the bottom surface of the pit 52 and in the center in the width direction. A plurality of (in this case, three) triangular recesses are engaged with the inner wall surface on the inner side of the pit 52 (the upper side in FIGS. 6 and 7) with the tips of the protrusions 64 of the cutting tool 61 coming into contact. (Engaged portions) 54 are formed in a state of being arranged in the width direction. Of these concave portions 54 (54a, 54b, 54c), the central concave portion 54a is formed at the central portion in the width direction of the shank 51, and the concave portions 54b, 54c are formed symmetrically on both sides of the central concave portion 54a. ing.

  The bite 61 is fastened by screwing a screw (screw member) 67 passed through the screw insertion hole 66 into the screw hole 53 of the shank 51 in a state where the convex part 64 faces the concave part 54 on the back side of the pit 52. , And fixed to the shank 51 in a state of being housed in the pit 52. In this state, the end portion of the cutting tool 61 on the tip 62 side protrudes from the one end of the shank 51 by a predetermined length, and the convex portion 64 on the tip side engages with any of the concave portions 54 on the shank 51 side. In this case, the concave portion 54 with which the convex portion 64 engages can be selected, and thereby the attachment angle of the cutting tool 61 with respect to the shank 51 is adjusted.

  The bite unit 50 of the present embodiment is detachably attached to the frame 36 of the cutting unit 30 as follows. As shown in FIG. 6, the tip 62 side of the cutting tool 61 is directed downward, and the upper end of the shank 51 on the side where the pits 52 are not formed is downwardly formed at one place on the lower surface of the frame 36. Insert into the opening mounting hole 36a. A screw hole 36b is formed in the frame 36 from the outer peripheral surface to the attachment hole 36a. A screw 57 is screwed into the screw hole 36b and pressed against the side surface of the shank 51 to be tightened. Thereby, the shank 51 is firmly sandwiched and fixed between the screw 57 and the inner surface of the attachment hole 36 a, and the bite unit 50 is attached to the frame 36.

  When the shank 51 is inserted into the mounting hole 36a, the side surface of the shank 51 on the side where the cutting tool 61 is mounted is positioned on the side of the frame 36 in the direction of rotation (the direction of arrow R in FIGS. 5 and 6). Determine the direction. In this attached state, the axis of the screw 67 for fixing the cutting tool is substantially parallel to the rotation direction of the frame 36.

  In the bite unit 50 attached to the frame 36 in this way, the attachment angle of the bite 61 can be adjusted as follows. First, the screw 67 is loosened, the cutting tool 61 is pulled out along the screw 67 in a direction away from the shank 51, and the cutting tool 61 is taken out from the pit 52. In this state, the cutting tool 61 can be swung in the directions of arrows L and R in FIG. In other words, the cutting tool 61 swings along a plane substantially perpendicular to the rotation direction of the frame 36 with the screw 67 as a swinging shaft.

  Next, the cutting tool 61 is swung by a necessary angle so that the convex portion 64 is engaged with the target concave portion 54 (one of 54a to 54c), and the cutting tool 61 is fitted into the pit 52 so that the convex portion 64 is It engages with the recess 54. Thereafter, the screw 67 is tightened to fix the cutting tool 61 to the shank 51. It should be noted that the lever 65 may be used when the cutting tool 61 is swung or taken into and out of the pit 52.

[4] Effect of Tool Unit According to the tool unit 50, as shown in FIG. 8, the convex part 64 of the tool 61 is engaged with one of the three concave parts 54a, 54b, 54c on the shank 51 side. Thus, the attachment angle can be changed to three patterns. Then, by changing the attachment angle of the cutting tool 61 in this way, it is possible to change the portion where the cutting edge 63 of the tip 62 contacts the workpiece. That is, as shown in FIG. 8, when the convex portion 64 is engaged with the central concave portion 54a, the central portion A of the blade edge 63 is arranged at the lowermost end and becomes a contact portion with the workpiece. Further, when the convex portion 64 is engaged with the left concave portion 54b, the left portion B of the cutting edge 63 is disposed at the lowermost end and becomes a contact portion with the workpiece, and the convex portion 64 is engaged with the right concave portion 54c. Then, the right side portion C of the blade edge 63 is arranged at the lowermost end and becomes a contact portion to the workpiece.

  By adjusting the mounting angle of the cutting tool 61 with respect to the shank 51 in this way, almost all of the cutting edge 63 of the tip 62 can be brought into contact with the workpiece evenly. Therefore, when cutting is first performed using the A portion of the cutting edge 63, if the A portion is chipped, the contact portion is then changed to the B portion, and if the B portion cannot be used, the C portion is changed. The cutting can be continued by changing the contact portion to the workpiece one after another. As a result, the life of the cutting tool 61 is greatly extended and the replacement frequency is reduced, so that the machining cost is greatly reduced.

  According to the bite unit 50 of the present embodiment, the bite 61 is slidably attached to the shank 51 with the screw 67 for fixing the bite 61 to the shank 51 as a swing shaft, and is formed on one end of the bite 61. The attachment angle of the cutting tool 61 can be adjusted and the cutting tool 61 can be fixed to the shank 51 with a simple configuration in which the portion 64 is engaged with the plurality of recesses 54 formed in the shank 51. Since the structure for adjusting the mounting angle of the cutting tool 61 is simple as described above, it can be sufficiently manufactured even with a relatively small size. Therefore, as a cutting unit provided in the cutting unit 30 for cutting the wafer 1, Very suitable.

It is the (a) perspective view and (b) side view of the wafer by which the cutting process is given to the surface with the bite unit concerning one embodiment of the present invention. It is an expanded sectional view of a wafer surface, and (a) shows the surface before cutting, and (b) shows after cutting. It is a perspective view of a cutting device provided with a cutting tool unit of one embodiment. It is a side view which shows the state which cuts the wafer surface with the cutting unit of the cutting device. It is a perspective view which shows the state where the bite unit of one Embodiment was attached to the flame | frame of the cutting unit, and this flame | frame. It is the (a) side view and (b) front view which show the attachment structure of the bite unit to a flame | frame. It is a disassembled perspective view of the bite unit of one embodiment. It is a figure which shows the contact part to the to-be-processed object of the blade edge | tip of the chip | tip according to the attachment angle of a cutting tool with respect to a shank, and the attachment angle.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer 10 ... Cutting device 30 ... Cutting unit 32 ... Spindle shaft (rotating shaft)
36 ... Frame (rotating body)
50 ... Byte unit 51 ... Shank (base)
54 (54a, 54b, 54c) ... concave portion (engaged portion)
61 ... Byte 62 ... Chip 64 ... Convex (engaging part)
65 ... Lever (gripping part)
67 ... Screw (screw member)

Claims (2)

A base fixed to a rotating body that rotates along a circumferential direction around a rotation axis;
A screw member screwed on the base in a state in which an axis is substantially parallel to a rotation direction of the rotating body;
A tool that can be attached to and detached from the base by the screw member, and that can be swung along a plane substantially perpendicular to the rotation direction of the rotating body with the screw member as a swing shaft,
The cutting tool has a first oscillating end and a second oscillating end, and a tip is fixed to the first oscillating end, and the second oscillating end is engaged with the tip. There is a joint,
The bite unit, wherein the base is provided with an engaged portion that fixes the rocking angle of the bite to an arbitrary angle by engaging the engaging part of the bite.   The bite unit according to claim 1, wherein a gripping portion is provided on the bite.

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