JP2009008971A - Electro-optical device and method for manufacturing the same, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an in-plane switching electro-optical device which can surely release static electricity to the outside without increasing its external dimension. <P>SOLUTION: A liquid crystal device has a liquid crystal interposed between a pair of first and second substrates. The first substrate has a common electrode and pixel electrodes on the liquid crystal layer side. A conductive layer is formed on the outside surface of the second substrate, and a polarizing plate is disposed on the outside surface of the conductive layer. The second substrate has a through hole, and the first substrate has a grounding electrode which extends from an overhang region overhanging from an edge of the second substrate to the outside, to a region two-dimensionally overlapping with the through hole. The conductive layer and the grounding electrode are electrically connected to each other via a conductive member arranged from the through hole to the grounding electrode. In accordance with such a construction, the conductive layer and the grounding electrode are electrically connected to each other via the conductive member on the inside between the first substrate and the second substrate. Accordingly, the in-plane switching liquid crystal device which can surely release the static electricity to the outside without increasing its external dimension is obtained. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electro-optical device suitable for displaying various information.

  In recent years, as an example of an electro-optical device, a horizontal electric field type liquid crystal device has been in the spotlight. This method is a method in which the direction of the electric field applied to the liquid crystal is substantially parallel to the substrate, and has an advantage that visual characteristics can be improved as compared with a TN (Twisted Nematic) method or the like. As such a horizontal electric field liquid crystal device, a liquid crystal device such as an IPS (In-Plane Switching) method or an FFS (Fringe Field Switching) method is known. A liquid crystal is sandwiched between a pair of substrates disposed opposite to each other, and a comb-shaped pixel electrode and a common electrode for generating an electric field between the pixel electrode are provided on the same substrate. Composed.

  However, in such a horizontal electric field type liquid crystal device, when electric charges are charged in a substrate having no electrode due to external static electricity or the like, an unnecessary electric field is generated between the substrate having an electrode and the substrate having no electrode. May occur and appropriate display may not be possible.

  An example of a lateral electric field type liquid crystal display device capable of improving such a problem is described in Patent Document 1.

  The liquid crystal display device described in Patent Document 1 has a configuration in which an adhesive layer in which conductive fine particles are dispersed is interposed between a transparent substrate and a polarizing plate in the upper substrate. This adhesive layer is supposed to function as a conductive film that shields against static charges such as external static electricity. As a result, in this liquid crystal display device, the static electricity is high from the outside of the surface of the liquid crystal display panel. Even when a potential is applied, the occurrence of display abnormality can be prevented.

Japanese Patent No. 2758864

  In the above-mentioned Patent Document 1, several examples that can improve the above-described problem are listed, and in one of the examples, the lower substrate is formed using a cable. The ground terminal provided on the upper substrate and the conductive layer provided on the liquid crystal layer side of the polarizing plate of the upper substrate are grounded.

  In the case of this mode, in order to connect the cable and the conductive layer, it is necessary to secure a region of the conductive layer corresponding to the connection portion. In particular, when a conductive paste is used to connect the cable and the conductive layer, the conductive paste has fluidity, so that the conductive paste applied on the conductive layer and the polarizing plate are in contact with each other. The optical properties may be adversely affected.

  Therefore, in such an aspect, it is necessary to enlarge the region of the conductive layer corresponding to the connection portion in consideration of the fluidity of the conductive paste. Then, in this aspect, in order to secure the area, the dimension of the upper substrate (“dimension”: the length corresponding to the cable drawing direction, the same applies hereinafter) must be increased, and the lower substrate is accordingly changed. There is a possibility that the size of the liquid crystal display device is increased as compared with a TN (Twisted Nematic) method, a VA (Virtical Alignment) method, or an ECB (Electrically Controlled Birefringence) liquid crystal device. . As a result, there is a problem in that the degree of mounting of the liquid crystal display device on the electronic device or the like is reduced due to restrictions on the size of the electronic device or the like on which the liquid crystal display device is mounted.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above points. A lateral electric field type electro-optical device capable of reliably discharging static electricity to the outside without increasing the external dimension, a manufacturing method thereof, and the electro-optical device thereof An object is to provide an electronic device using the device.

  In one aspect of the present invention, an electro-optical device includes a first substrate, a second substrate disposed to face the first substrate, the first substrate, and the second substrate. The sandwiched electro-optical material, the common electrode and the pixel electrode formed on the surface of the first substrate on the electro-optical material side, and the surface of the second substrate opposite to the first substrate side The second substrate has a through-hole penetrating from the surface on the conductive layer side to the surface on the first substrate side, and the first substrate includes the conductive layer A grounding electrode extending outward from one end of the second substrate, and a grounding electrode extending from the projecting region to a region overlapping with the through hole on the surface of the second substrate; The conductive layer and the grounding electrode are arranged in front of the through hole of the second substrate. It is electrically connected through a conductive member disposed over the ground electrodes. In a preferred example, the conductive layer may be an optical member such as a polarizing plate formed of a conductive material such as ITO.

  The electro-optical device includes a first substrate, a second substrate disposed opposite to the first substrate, an electro-optical material sandwiched between the first substrate and the second substrate, Formed on the surface of the first substrate on the electro-optic material side, formed on a common electrode and pixel electrode made of a transparent conductive member such as ITO, and formed on the surface of the second substrate opposite to the first substrate side, ITO And a conductive layer made of a transparent conductive member. In a preferred example, the electro-optical device may be a lateral electric field type electro-optical device that generates an electric field between the pixel electrode and the common electrode. The conductive member is preferably a conductive paste.

  In particular, in this electro-optical device, the second substrate has a through-hole penetrating from the surface on the conductive layer side to the surface on the first substrate side, and the first substrate is outside from one end of the second substrate. A grounding electrode that extends from the projecting region to a region that planarly overlaps the through hole on the second substrate side surface, and has a grounding electrode that is electrically grounded. And the grounding electrode are electrically connected through a conductive member disposed from the through hole of the second substrate to the grounding electrode.

  According to this configuration, when a charge is charged on the surface of the conductive layer due to static electricity from the outside, the charged charge is released to the outside through the conductive member and the grounding electrode that is electrically grounded. Therefore, an unnecessary electric field can be prevented from being generated between the first substrate and the second substrate due to the static electricity, and appropriate display can be performed.

  Furthermore, according to this electro-optical device, the conductive layer and the grounding electrode are electrically connected to each other on the inner side between the first substrate and the second substrate through the conductive member. In order to electrically connect the conductive layer and the grounding electrode through the conductive member, it is not necessary to expose the vicinity of the end of the conductive layer on the protruding region side to the outside. Thereby, it is possible to prevent the dimension of the second substrate (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing, and accordingly the dimension of the first substrate (the second substrate). The length corresponding to the direction perpendicular to the one end) can be prevented from becoming large. Therefore, it is possible to prevent the outer dimension of the electro-optical device (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing. As a result, the external dimensions of the electro-optical device can be made substantially the same size as the TN, VA, or ECB electro-optical device. As a result, it is difficult to receive restrictions on the external dimensions of the electro-optical device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type electro-optical device on the electronic device or the like can be increased.

  In one aspect of the electro-optical device, the first substrate and the second substrate are bonded to each other via a frame-shaped sealing material, and the electro-optical device is formed in a region partitioned by the frame-shaped sealing material. A substance is enclosed, and a part of the frame-shaped sealing material is disposed in a region overlapping with the through hole and a part of the grounding electrode, and the frame-shaped sealing material includes the second sealing material. An opening penetrating from the surface on the substrate side to the surface on the grounding electrode side is provided, and the conductive layer and the grounding electrode pass through the conductive member arranged from the through hole to the opening and the grounding electrode. Electrically connected. According to this aspect, since the conductive layer and the grounding electrode are electrically connected to each other on the inner side between the first substrate and the second substrate through the conductive member, the same as the above electro-optical device An effect can be obtained.

  In another aspect of the electro-optical device, the first substrate and the second substrate are bonded to each other through a frame-shaped sealing material, and the electric region is separated from the region defined by the frame-shaped sealing material. An optical material is enclosed, and the through hole, the conductive member, and the ground electrode are located outside the frame-shaped sealing material. For this reason, in the process of manufacturing the electro-optical device, when the conductive member is disposed (or coated) in the through hole of the second substrate, a part of the conductive member flows or diffuses to the electro-optical material side. Can be prevented. As a result, it is possible to prevent the electro-optical material from being contaminated and to prevent adverse effects on the display quality.

  In another aspect of the present invention, an electro-optical device includes a first substrate, a second substrate disposed to face the first substrate, the first substrate, and the second substrate. The sandwiched electro-optical material, the common electrode and the pixel electrode formed on the surface of the first substrate on the electro-optical material side, and the surface of the second substrate opposite to the first substrate side The second substrate includes a through hole penetrating from the conductive layer side surface to the first substrate side surface, and a first hole disposed in the through hole. A conductive member and a conductor formed on the first substrate side surface and electrically connected to the first conductive member, wherein the first substrate is one end of the second substrate. And projecting from the projecting region on the second substrate side surface. And the conductive layer and the grounding electrode are interposed between the first conductive member, the conductor, and the conductor and the grounding electrode. The second conductive member is electrically connected.

  The electro-optical device includes a first substrate, a second substrate disposed opposite to the first substrate, an electro-optical material sandwiched between the first substrate and the second substrate, Formed on the surface of the first substrate on the electro-optic material side, formed on a common electrode and pixel electrode made of a transparent conductive member such as ITO, and formed on the surface of the second substrate opposite to the first substrate side, ITO And a conductive layer made of a transparent conductive member. In a preferred example, the electro-optical device may be a lateral electric field type electro-optical device that generates an electric field between the pixel electrode and the common electrode. In a preferred example, the conductive layer may be an optical member such as a polarizing plate formed of a conductive material such as ITO.

  In particular, in this electro-optical device, the second substrate includes a through hole penetrating from the surface on the conductive layer side to the surface on the first substrate side, and the first substrate such as a conductive paste disposed in the through hole. A conductive member; and a conductor formed on a surface on the first substrate side and electrically connected to the first conductive member and having electrical conductivity, such as a metal wiring, and the first substrate is And a grounding region having a projecting region projecting outward from one end of the second substrate, and extending from the projecting region to a region planarly overlapping the conductor on the second substrate side surface, and being electrically grounded The conductive layer and the grounding electrode are electrically connected through a first conductive member, a conductor, and a second conductive member such as a conductive paste or conductive particles interposed between the conductor and the grounding electrode. It is connected to the.

  According to this configuration, when a charge is charged on the surface of the conductive layer due to static electricity from the outside, the charged charge is the first conductive member, the conductor, the second conductive member, and the ground that is electrically grounded. Escapes to the outside through the electrode. Thereby, it is possible to prevent an unnecessary electric field from being generated between the first substrate and the second substrate due to the static electricity, and appropriate display can be performed.

  Further, according to the electro-optical device, the conductive layer and the grounding electrode are electrically connected to the inner side between the first substrate and the second substrate through the first conductive member, the conductor, and the second conductive member. Therefore, as a countermeasure against static electricity, it is not necessary to expose the vicinity of the end of the conductive layer to the outside in order to electrically connect the conductive layer and the grounding electrode. Thereby, it is possible to prevent the dimension of the second substrate (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing, and accordingly the dimension of the first substrate (the second substrate). The length corresponding to the direction perpendicular to the one end) can be prevented from becoming large. Therefore, it is possible to prevent the outer dimension of the electro-optical device (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing. As a result, the outer dimensions of the electro-optical device can be made substantially the same as those of a TN, VA, or ECB electro-optical device. As a result, it is difficult to receive restrictions on the external dimensions of the electro-optical device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type electro-optical device on the electronic device or the like can be increased.

  In a preferred example of the electro-optical device, the conductor is located on the projecting region side of the first substrate from a region overlapping the first conductive member disposed in the through hole in a plane. The one end of the conductor is electrically connected to the first conductive member, and the other end of the conductor is the one end of the second substrate. The second conductive member is electrically connected to the second conductive member disposed at a position corresponding to the side, and the second conductive member is electrically connected to one end of the ground electrode located in a region overlapping the conductor in plan view. It is connected to the.

  In another preferable example of the electro-optical device, the first substrate and the second substrate are bonded together via a frame-shaped sealing material, and the region partitioned by the frame-shaped sealing material is The electro-optic material is enclosed, and a part of the frame-shaped sealing material is disposed in a region overlapping at least a part of the conductor and the grounding electrode, and the conductor and the grounding electrode are It is electrically connected through the second conductive member disposed inside the frame-shaped sealing material.

  In another aspect of the electro-optical device, the first substrate and the second substrate are bonded to each other through a frame-shaped sealing material, and the electric region is separated from the region defined by the frame-shaped sealing material. An optical substance is enclosed, and the through hole, the first conductive member, the conductor, the second conductive member, and the ground electrode disposed in the through hole are outside the frame-shaped sealing material. Is provided.

For this reason, in the manufacturing process of the electro-optical device, the second conductive member is interposed between the conductor and the ground electrode when the first conductive member is disposed (or coated) in the through hole of the second substrate. In this case, it is possible to prevent a part of the first conductive member and the second conductive member from flowing or diffusing to the electro-optical material side. As a result, it is possible to prevent the electro-optical material from being contaminated and to prevent adverse effects on the display quality.

  In another preferable example of the electro-optical device, it is preferable that the conductive member, the first conductive member, or the second conductive member is made of either a conductive paste or conductive particles.

  In still another aspect of the invention, an electronic apparatus including the electro-optical device as a display unit can be configured.

  In still another aspect of the present invention, a method for manufacturing an electro-optical device includes: a first substrate preparation step of preparing a first substrate including a common electrode, a pixel electrode, and a ground electrode on one surface; Preparing a second substrate by forming a through hole in the base material by a predetermined method, and preparing the prepared second substrate; and The one surface of one substrate and the second substrate are opposed to each other so as to form an overhanging region in which the first substrate projects outward from one end of the second substrate, and the grounding electrode And bonding the first substrate and the second substrate so that the first substrate and the second substrate are disposed so as to extend from the projecting region of the first substrate to a region overlapping the through hole of the second substrate. An electro-optic material is sandwiched between the first substrate and the second substrate An electro-optical panel manufacturing process for manufacturing the electro-optical panel; and a conductive member is disposed from the through hole of the second substrate to the grounding electrode to electrically connect the conductive member and the grounding electrode. Conductive member disposing step, conductive layer formed on each surface of the conductive member and the second substrate opposite to the first substrate side, and electrically connecting the conductive layer and the conductive member A layer forming step.

  In the above-described electro-optical device manufacturing method, the first substrate preparation step includes a common electrode and a pixel electrode made of a transparent conductive member such as ITO, and a grounding electrode electrically provided on one surface. 1 substrate is prepared. In the second substrate preparation step, a base material having translucency such as glass is prepared, and a second substrate is prepared by forming a through hole in the base material by a predetermined method. The prepared second substrate is prepared. Here, as a method for forming a through hole in the base material, for example, silicon carbide (SiC) is attached to the tip of a piano wire attached to the ultrasonic generator, and the tip is formed with a through hole in the base material. A method of forming a through hole in a base material by generating ultrasonic waves with respect to a piano wire in contact with the power region, or a region in which a through hole of the base material is to be formed with a laser beam. And various known methods such as a method of forming a through-hole in a substrate by irradiating the substrate, or a method of forming a through-hole in a region where a through-hole is to be formed using a photoetching technique. Can do. Note that the order of execution of the first substrate preparation step and the second substrate preparation step may be first.

  Next, in the electro-optical panel manufacturing process, the one surface of the first substrate and the second substrate are formed so as to form an overhanging region in which the first substrate projects outward from one end of the second substrate. The first substrate and the second substrate are bonded together so that the grounding electrodes are arranged from the projecting region of the first substrate to the region overlapping the through hole of the second substrate in a plane. An electro-optic panel is manufactured by sandwiching an electro-optic material between the first substrate and the second substrate. In a preferred example, the manufactured electro-optical panel may be a lateral electric field type that generates an electric field between the pixel electrode and the common electrode.

  Next, in the conductive member arranging step, a conductive member such as a conductive paste is arranged from the through hole of the second substrate to the grounding electrode to electrically connect the conductive member and the grounding electrode. Next, in the conductive layer forming step, a conductive layer made of a transparent conductive member such as ITO is formed on each surface of the conductive member and the second substrate opposite to the first substrate side. The members are electrically connected. Thereby, the conductive layer and the grounding electrode are electrically connected through the conductive member. In a preferred example, the conductive layer may be an optical member such as a polarizing plate formed of a conductive material such as ITO.

  A transverse electric field type electro-optical device is manufactured through the above steps. In the lateral electric field type electro-optical device manufactured in this way, the conductive layer and the grounding electrode are electrically connected to each other inside the first substrate and the second substrate through the conductive member. Therefore, as a countermeasure against static electricity, in order to electrically connect the conductive layer and the grounding electrode, it is not necessary to expose the vicinity of the end of the conductive layer on the protruding region side to the outside. Thereby, it is possible to prevent the dimension of the second substrate (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing, and accordingly the dimension of the first substrate (the second substrate). The length corresponding to the direction perpendicular to the one end) can be prevented from becoming large. Therefore, it is possible to prevent the outer dimension of the electro-optical device (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing. As a result, the outer dimensions of the electro-optical device can be made substantially the same as those of a TN, VA, or ECB electro-optical device. As a result, it is difficult to receive restrictions on the external dimensions of the electro-optical device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type electro-optical device on the electronic device or the like can be increased.

  In still another aspect of the present invention, a method for manufacturing an electro-optical device includes: a first substrate preparation step of preparing a first substrate including a common electrode, a pixel electrode, and a ground electrode on one surface; Preparing a second substrate by forming a through hole in the base material by a predetermined method, and preparing the prepared second substrate; and The one surface of one substrate and the second substrate are opposed to each other so as to form an overhanging region in which the first substrate projects outward from one end of the second substrate, and the grounding electrode And bonding the first substrate and the second substrate so that the first substrate and the second substrate are disposed so as to extend from the projecting region of the first substrate to a region overlapping the through hole of the second substrate. An electro-optic material is sandwiched between the first substrate and the second substrate Forming an electro-optic panel, and forming a conductive layer on a surface of the second substrate opposite to the first substrate so as not to block the through hole of the second substrate. A conductive layer forming step, and a conductive member is disposed from another through hole of the conductive layer formed by the conductive layer forming step to the through hole of the second substrate and the grounding electrode, and the conductive layer And a conductive member disposing step of electrically connecting the grounding electrode through the conductive member.

  In the above electro-optical device manufacturing method, the first substrate preparation step includes a common electrode and a pixel electrode made of a transparent conductive member such as ITO on one surface, and a ground electrode that is electrically installed. Prepare the board. In the second substrate preparation step, a base material having translucency such as glass is prepared, and a second substrate is prepared by forming a through hole in the base material by a predetermined method. The prepared second substrate is prepared. Here, examples of the method for forming the through hole in the substrate include the above-described method. Note that the order of execution of the first substrate preparation step and the second substrate preparation step may be first.

  Next, in the electro-optical panel manufacturing process, the one surface of the first substrate and the second substrate are formed so as to form an overhanging region in which the first substrate projects outward from one end of the second substrate. The first substrate and the second substrate are bonded together so that the grounding electrodes are arranged from the projecting region of the first substrate to the region overlapping the through hole of the second substrate in a plane. An electro-optic panel is manufactured by sandwiching an electro-optic material between the first substrate and the second substrate. In a preferred example, the manufactured electro-optical panel may be a lateral electric field type that generates an electric field between the pixel electrode and the common electrode.

  Next, in the conductive layer forming step, a conductive layer made of a transparent conductive member such as ITO is formed on the surface of the second substrate opposite to the first substrate side so as not to block the through hole of the second substrate. Form. Next, the conductive member arranging step arranges a conductive member such as a conductive paste from another through hole of the conductive layer formed by the conductive layer forming step to the through hole of the second substrate and the grounding electrode, The conductive layer and the grounding electrode are electrically connected through the conductive member. In a preferred example, the conductive layer may be an optical member such as a polarizing plate formed of a conductive material such as ITO.

  A transverse electric field type electro-optical device is manufactured through the above steps. In the lateral electric field type electro-optical device thus manufactured, the conductive layer and the grounding electrode are connected to the first substrate and the first substrate through the conductive member disposed in the other through hole of the conductive layer and the through hole of the second substrate. Electrical connection is made on the inner side between the two substrates. Therefore, as a countermeasure against static electricity, in order to electrically connect the conductive layer and the grounding electrode, it is not necessary to expose the vicinity of the end of the conductive layer on the protruding region side to the outside. Thereby, it is possible to prevent the dimension of the second substrate (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing, and accordingly the dimension of the first substrate (the second substrate). The length corresponding to the direction perpendicular to the one end) can be prevented from becoming large. Therefore, it is possible to prevent the outer dimension of the electro-optical device (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing. As a result, the outer dimensions of the electro-optical device can be made substantially the same as those of a TN, VA, or ECB electro-optical device. As a result, it is difficult to receive restrictions on the external dimensions of the electro-optical device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type electro-optical device on the electronic device or the like can be increased.

  In still another aspect of the present invention, a method for manufacturing an electro-optical device includes: a first substrate preparation step of preparing a first substrate including a common electrode, a pixel electrode, and a ground electrode on one surface; First, a through hole is formed in the base material by a predetermined method, and a conductor is formed on an area of one surface of the base material that closes at least a part of the through hole. A second substrate preparing step of preparing the second substrate prepared, and the one surface of the first substrate and the one surface of the second substrate. The first substrate is opposed to form an overhanging region projecting outward from one end of the second substrate, and a second conductive member is provided on one surface of the conductor and the grounding electrode. Further, the grounding electrode extends over the first substrate. The first substrate so that the second conductive member is sandwiched between the conductor and the grounding electrode so that the second conductive member is disposed between the conductor and the grounding electrode. And an electro-optical panel manufacturing process for manufacturing an electro-optical panel by sandwiching an electro-optical material between the first substrate and the second substrate; and A conductive member disposing step of disposing a first conductive member in the through hole of the second substrate and electrically connecting the first conductive member and the conductor; the first conductive member and the second conductive member; Forming a conductive layer on each surface of the substrate opposite to the first substrate, and electrically connecting the conductive layer and the first conductive member.

  In the above electro-optical device manufacturing method, the first substrate preparation step includes a common electrode and a pixel electrode made of a transparent conductive member such as ITO on one surface, and a ground electrode that is electrically installed. Prepare the board. In the second substrate preparation step, a base material having translucency such as glass is prepared, a through hole is formed in the base material by a predetermined method, and one surface of the base material is formed. A second substrate is prepared by forming a conductor such as a metal wiring having electrical conductivity in a region where at least a part of the through hole is closed, and the prepared second substrate is prepared. Here, examples of the method for forming the through hole in the substrate include the above-described method. Note that the order of execution of the first substrate preparation step and the second substrate preparation step may be first.

  Next, in the electro-optical panel manufacturing process, the first substrate and the one surface of the second substrate protrude from the one end of the second substrate to the outside. And a second conductive member such as a conductive paste or conductive particles is disposed on one surface of the conductor and the ground electrode, and the ground electrode is further connected to the first substrate. The first substrate and the second substrate are disposed so as to be arranged from the projecting region to a region overlapping with the conductor of the second substrate in a plane, and so that the second conductive member is sandwiched between the conductor and the grounding electrode. An electro-optical panel is manufactured by attaching the substrate and sandwiching an electro-optical material between the first substrate and the second substrate. Thereby, the second conductive member is electrically connected to the conductor and the grounding electrode. In a preferred example, the manufactured electro-optical panel may be a lateral electric field type that generates an electric field between the pixel electrode and the common electrode.

  Next, in the conductive member disposing step, a first conductive member such as a conductive paste is disposed in the through hole of the second substrate, and the first conductive member and the conductor are electrically connected. Next, in the conductive layer forming step, a conductive layer is formed on each surface of the first conductive member and the second substrate opposite to the first substrate side, and the conductive layer and the first conductive member are electrically connected. Connect to. Thereby, the conductive layer and the grounding electrode are electrically connected through the first conductive member, the conductor, and the second conductive member disposed in the through hole of the second substrate. In a preferred example, the conductive layer may be an optical member such as a polarizing plate formed of a conductive material such as ITO.

  A transverse electric field type electro-optical device is manufactured through the above steps. In the lateral electric field type electro-optical device thus manufactured, the conductive layer and the grounding electrode are connected to the first through the first conductive member, the conductor, and the second conductive member disposed in the through hole of the second substrate. Electrical connection is made on the inner side between the substrate and the second substrate. Therefore, as a countermeasure against static electricity, in order to electrically connect the conductive layer and the grounding electrode, it is not necessary to expose the vicinity of the end of the conductive layer on the protruding region side to the outside. Thereby, it is possible to prevent the dimension of the second substrate (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing, and accordingly the dimension of the first substrate (the second substrate). The length corresponding to the direction perpendicular to the one end) can be prevented from becoming large. Therefore, it is possible to prevent the outer dimension of the electro-optical device (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing. As a result, the outer dimensions of the electro-optical device can be made substantially the same as those of a TN, VA, or ECB electro-optical device. As a result, it is difficult to receive restrictions on the external dimensions of the electro-optical device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type electro-optical device on the electronic device or the like can be increased.

  In still another aspect of the present invention, a method for manufacturing an electro-optical device includes: a first substrate preparation step of preparing a first substrate including a common electrode, a pixel electrode, and a ground electrode on one surface; First, a through hole is formed in the base material by a predetermined method, and a conductor is formed on an area of one surface of the base material that closes at least a part of the through hole. A second substrate preparing step of preparing the second substrate prepared, and the one surface of the first substrate and the one surface of the second substrate. The first substrate is opposed to form an overhanging region projecting outward from one end of the second substrate, and a second conductive member is provided on one surface of the conductor and the grounding electrode. Further, the grounding electrode extends over the first substrate. The first substrate so that the second conductive member is sandwiched between the conductor and the grounding electrode so that the second conductive member is disposed between the conductor and the grounding electrode. And an electro-optical panel manufacturing process for manufacturing an electro-optical panel by sandwiching an electro-optical material between the first substrate and the second substrate; and A conductive layer forming step of forming a conductive layer on a surface of the second substrate opposite to the first substrate side so as not to block the through hole of the second substrate, and the conductive layer forming step. A first conductive member is disposed from another through hole of the conductive layer to the through hole and the conductor of the second substrate, and the first conductive member, the conductive layer, and the conductor are electrically connected to each other. A conductive member arranging step to be connected.

  In the above electro-optical device manufacturing method, the first substrate preparation step includes a common electrode and a pixel electrode made of a transparent conductive member such as ITO on one surface, and a ground electrode that is electrically installed. Prepare the board. In the second substrate preparation step, a base material having translucency such as glass is prepared, a through hole is formed in the base material by a predetermined method, and one surface of the base material is formed. A second substrate is prepared by forming a conductor such as a metal wiring having electrical conductivity in a region where at least a part of the through hole is closed, and the prepared second substrate is prepared. Here, examples of the method for forming the through hole in the substrate include the above-described method. Note that the order of execution of the first substrate preparation step and the second substrate preparation step may be first.

  Next, in the electro-optical panel manufacturing process, the first substrate and the one surface of the second substrate protrude from the one end of the second substrate to the outside. And a second conductive member such as a conductive paste or conductive particles is disposed on one surface of the conductor and the ground electrode, and the ground electrode is further connected to the first substrate. The first substrate and the second substrate are disposed so as to be arranged from the projecting region to a region overlapping with the conductor of the second substrate in a plane, and so that the second conductive member is sandwiched between the conductor and the grounding electrode. An electro-optical panel is manufactured by attaching the substrate and sandwiching an electro-optical material between the first substrate and the second substrate. Thereby, the second conductive member is electrically connected to the conductor and the grounding electrode. In a preferred example, the manufactured electro-optical panel may be a lateral electric field type that generates an electric field between the pixel electrode and the common electrode.

  Next, in the conductive layer forming step, a conductive layer made of a transparent conductive member such as ITO is formed on the surface of the second substrate opposite to the first substrate side so as not to block the through hole of the second substrate. Form. Next, the conductive member arranging step arranges a first conductive member such as a conductive paste from another through hole of the conductive layer formed in the conductive layer forming step to the through hole and the conductor of the second substrate. The first conductive member is electrically connected to the conductive layer and the conductor. In a preferred example, the conductive layer may be an optical member such as a polarizing plate formed of a conductive material such as ITO.

  A transverse electric field type electro-optical device is manufactured through the above steps. In the lateral electric field type electro-optical device thus manufactured, the conductive layer and the grounding electrode are disposed in the other through hole of the conductive layer and the through hole of the second substrate. The two conductive members are electrically connected on the inner side between the first substrate and the second substrate. Therefore, as a countermeasure against static electricity, in order to electrically connect the conductive layer and the grounding electrode, it is not necessary to expose the vicinity of the end of the conductive layer on the protruding region side to the outside. Thereby, it is possible to prevent the dimension of the second substrate (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing, and accordingly the dimension of the first substrate (the second substrate). The length corresponding to the direction perpendicular to the one end) can be prevented from becoming large. Therefore, it is possible to prevent the outer dimension of the electro-optical device (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing. As a result, the outer dimensions of the electro-optical device can be made substantially the same as those of a TN, VA, or ECB electro-optical device. As a result, it is difficult to receive restrictions on the external dimensions of the electro-optical device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type electro-optical device on the electronic device or the like can be increased.

  In still another aspect of the present invention, a method for manufacturing an electro-optical device includes: a first substrate preparation step of preparing a first substrate including a common electrode, a pixel electrode, and a ground electrode on one surface; First, a through hole is formed in the base material by a predetermined method, and a conductor is formed on an area of one surface of the base material that closes at least a part of the through hole. A second substrate preparation step of preparing the second substrate prepared by preparing the second substrate, and either the first substrate or the second substrate, wherein the ground electrode A sealing material forming step of forming a frame-shaped sealing material in which a second conductive member is mixed on a part of the first substrate or a region including a part of the conductor, the one surface of the first substrate, and the first 2 and the one surface of the second substrate, the first substrate is removed from one end of the second substrate And the grounding electrode is arranged to extend from a projecting region of the first substrate to a region overlapping the conductor of the second substrate in a plane, and And bonding the first substrate and the second substrate through the frame-shaped sealing material so that the second conductive member is sandwiched between the conductor and the grounding electrode, An electro-optical panel manufacturing step of manufacturing an electro-optical panel by enclosing an electro-optical material in a region surrounded by the first substrate, the second substrate, and the frame-shaped sealing material; A conductive member disposing step of disposing a first conductive member in the through-hole and electrically connecting the first conductive member and the conductor; and the first conductive member and the second substrate. 1 on the opposite side of the board To form a conductive layer, and a conductive layer forming step of electrically connecting the said conductive layer and the first conductive member.

  In the above electro-optical device manufacturing method, the first substrate preparation step includes a common electrode and a pixel electrode made of a transparent conductive member such as ITO on one surface, and a ground electrode that is electrically installed. Prepare the board. In the second substrate preparation step, a base material having translucency such as glass is prepared, a through hole is formed in the base material by a predetermined method, and one surface of the base material is formed. A second substrate is prepared by forming a conductor such as a metal wiring having electrical conductivity in a region where at least a part of the through hole is closed, and the prepared second substrate is prepared. Here, examples of the method for forming the through hole in the substrate include the above-described method. Note that the order of execution of the first substrate preparation step and the second substrate preparation step may be first.

  Next, the sealing material forming step is either one of the first substrate and the second substrate, and the second material such as conductive particles is formed on a region including a part of the grounding electrode or a part of the conductor. A frame-shaped sealing material mixed with the conductive member is formed. Next, in the electro-optical panel manufacturing process, the first substrate and the one surface of the second substrate protrude from the one end of the second substrate to the outside. And the second conductive member is disposed between the projecting region of the first substrate and the region overlapping the conductor of the second substrate in a plane. The first substrate and the second substrate are bonded together via a frame-shaped sealing material so as to be sandwiched between the grounding electrodes, and the first substrate, the second substrate, and the frame-shaped sealing material are bonded together. An electro-optic panel is manufactured by enclosing an electro-optic material in a region surrounded by Thus, the conductor and the grounding electrode are electrically connected through the second conductive member mixed in the frame-shaped sealing material. In a preferred example, the manufactured electro-optical panel may be a lateral electric field type that generates an electric field between the pixel electrode and the common electrode.

  Next, in the conductive member disposing step, a first conductive member such as a conductive paste is disposed in the through hole of the second substrate, and the first conductive member and the conductor are electrically connected. Next, in the conductive layer forming step, a conductive layer made of a transparent conductive member such as ITO is formed on each surface of the first conductive member and the second substrate on the opposite side to the first substrate side. The layer and the first conductive member are electrically connected. Thereby, the conductive layer and the grounding electrode are electrically connected through the first conductive member, the conductor, and the second conductive member disposed in the through hole of the second substrate. In a preferred example, the conductive layer may be an optical member such as a polarizing plate formed of a conductive material such as ITO.

  A transverse electric field type electro-optical device is manufactured through the above steps. In the lateral electric field type electro-optical device thus manufactured, the conductive layer and the grounding electrode are connected to the first through the first conductive member, the conductor, and the second conductive member disposed in the through hole of the second substrate. Electrical connection is made on the inner side between the substrate and the second substrate. Therefore, as a countermeasure against static electricity, in order to electrically connect the conductive layer and the grounding electrode, it is not necessary to expose the vicinity of the end of the conductive layer on the protruding region side to the outside. Thereby, it is possible to prevent the dimension of the second substrate (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing, and accordingly the dimension of the first substrate (the second substrate). The length corresponding to the direction perpendicular to the one end) can be prevented from becoming large. Therefore, it is possible to prevent the outer dimension of the electro-optical device (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing. As a result, the outer dimensions of the electro-optical device can be made substantially the same as those of a TN, VA, or ECB electro-optical device. As a result, it is difficult to receive restrictions on the external dimensions of the electro-optical device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type electro-optical device on the electronic device or the like can be increased.

  In still another aspect of the present invention, a method for manufacturing an electro-optical device includes: a first substrate preparation step of preparing a first substrate including a common electrode, a pixel electrode, and a ground electrode on one surface; First, a through hole is formed in the base material by a predetermined method, and a conductor is formed on an area of one surface of the base material that closes at least a part of the through hole. A second substrate preparation step of preparing the second substrate prepared by preparing the second substrate, and either the first substrate or the second substrate, wherein the ground electrode A sealing material forming step of forming a frame-shaped sealing material in which a second conductive member is mixed on a part of the first substrate or a region including a part of the conductor, the one surface of the first substrate, and the first 2 and the one surface of the second substrate, the first substrate is removed from one end of the second substrate And the grounding electrode is arranged to extend from the projecting region of the first substrate to a region overlapping the conductor of the second substrate in a planar manner, and And bonding the first substrate and the second substrate through the frame-shaped sealing material so that the second conductive member is sandwiched between the conductor and the grounding electrode, An electro-optical panel manufacturing step of manufacturing an electro-optical panel by enclosing an electro-optical material in a region surrounded by the first substrate, the second substrate, and the frame-shaped sealing material; A conductive layer forming step of forming a conductive layer on a surface of the second substrate opposite to the first substrate side so as not to close the through hole; and other than the conductive layer formed by the conductive layer forming step Through the through hole Toward the through hole and the conductor of the second substrate a first conductive member is disposed, and a conductive member arranging step of electrically connecting the first conductive member and the conductive layer and the conductor.

  In the above electro-optical device manufacturing method, the first substrate preparation step includes a common electrode and a pixel electrode made of a transparent conductive member such as ITO on one surface, and a ground electrode that is electrically installed. Prepare the board. In the second substrate preparation step, a base material having translucency such as glass is prepared, a through hole is formed in the base material by a predetermined method, and one surface of the base material is formed. A second substrate is prepared by forming a conductor such as a metal wiring having electrical conductivity in a region where at least a part of the through hole is closed, and the prepared second substrate is prepared. Here, examples of the method for forming the through hole in the substrate include the above-described method. Note that the order of execution of the first substrate preparation step and the second substrate preparation step may be first.

  Next, the sealing material forming step is either one of the first substrate and the second substrate, and the second material such as conductive particles is formed on a region including a part of the grounding electrode or a part of the conductor. A frame-shaped sealing material mixed with the conductive member is formed. Next, in the electro-optical panel manufacturing process, the first substrate and the one surface of the second substrate protrude from the one end of the second substrate to the outside. And the second conductive member is disposed between the projecting region of the first substrate and the region overlapping the conductor of the second substrate in a plane. The first substrate and the second substrate are bonded together via a frame-shaped sealing material so as to be sandwiched between the grounding electrodes, and the first substrate, the second substrate, and the frame-shaped sealing material are bonded together. An electro-optic panel is manufactured by enclosing an electro-optic material in a region surrounded by Thus, the conductor and the grounding electrode are electrically connected through the second conductive member mixed in the frame-shaped sealing material. In a preferred example, the manufactured electro-optical panel may be a lateral electric field type that generates an electric field between the pixel electrode and the common electrode.

  Next, in the conductive layer forming step, a conductive layer made of a transparent conductive member such as ITO is formed on the surface of the second substrate opposite to the first substrate side so as not to block the through hole of the second substrate. Form. Next, the conductive member arranging step arranges a first conductive member such as a conductive paste from another through hole of the conductive layer formed in the conductive layer forming step to the through hole and the conductor of the second substrate. The first conductive member is electrically connected to the conductive layer and the conductor. In a preferred example, the conductive layer may be an optical member such as a polarizing plate formed of a conductive material such as ITO.

  A transverse electric field type electro-optical device is manufactured through the above steps. In the lateral electric field type electro-optical device thus manufactured, the conductive layer and the grounding electrode are disposed in the other through hole of the conductive layer and the through hole of the second substrate. The two conductive members are electrically connected on the inner side between the first substrate and the second substrate. Therefore, as a countermeasure against static electricity, in order to electrically connect the conductive layer and the grounding electrode, it is not necessary to expose the vicinity of the end of the conductive layer on the protruding region side to the outside. Thereby, it is possible to prevent the dimension of the second substrate (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing, and accordingly the dimension of the first substrate (the second substrate). The length corresponding to the direction perpendicular to the one end) can be prevented from becoming large. Therefore, it is possible to prevent the outer dimension of the electro-optical device (the length corresponding to the direction orthogonal to the one end of the second substrate) from increasing. As a result, the outer dimensions of the electro-optical device can be made substantially the same as those of a TN, VA, or ECB electro-optical device. As a result, it is difficult to receive restrictions on the external dimensions of the electro-optical device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type electro-optical device on the electronic device or the like can be increased.

  Hereinafter, various embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the present invention is applied to a liquid crystal device as an example of an electro-optical device.

[First embodiment]
(Configuration of liquid crystal device)
First, the configuration of the liquid crystal device according to the first embodiment of the present invention will be described with reference to FIG.

  FIG. 1 is a plan view schematically showing the configuration of the liquid crystal device according to the first embodiment. In FIG. 1, the color filter substrate 92 that is an element of the liquid crystal display panel 81 is on the front side (observation side) of the paper, and the array substrate 91 is an element of the liquid crystal display panel 81 on the back side of the paper (opposite side to the observation side). Are arranged respectively. However, in the present invention, the arrangement relationship between the color filter substrate 92 and the array substrate 91 may be the reverse of the configuration of FIG. In FIG. 1, regions corresponding to each of the three colored layers 4 of R (red), G (green), and B (blue) having a rectangular planar shape provided on the color filter substrate 92 side. The region overlapping each common electrode 3 and each pixel electrode 9 provided on the array substrate 91 side shows one sub-pixel region SG which is the minimum unit of display and is arranged in one row and three columns. A region including the sub-pixel regions SG of each color of R, G, and B indicates one pixel region G. A region where the pixel regions G are arranged in a matrix is an effective display region V (a region surrounded by a two-dot chain line) in which images such as characters, numbers, and figures are displayed. The area outside the effective display area V is a frame area 38 that does not contribute to display.

  In the liquid crystal device 100 according to the first embodiment, an array substrate 91 and a color filter substrate 92 disposed to face the array substrate 91 are bonded together via a frame-shaped seal material 43. A liquid crystal layer 15 is formed by enclosing a liquid crystal exhibiting homogeneous alignment in a partitioned region.

  Here, the liquid crystal device 100 controls the alignment of the liquid crystal molecules by a fringe field (electric field) E component substantially parallel to the substrate surface of the array substrate 91 in the array substrate 91 on which the electrodes are formed (display display). FFS (Fringe Field Switching) type liquid crystal device as an example of the horizontal electric field type. The liquid crystal device 100 is also a transmissive liquid crystal device having a transmissive display mode in which transmissive display is performed using a light source such as the backlight 17. Further, the liquid crystal device 100 is a color display liquid crystal device constituted by using three colored layers 4 of R, G, and B, and an α-Si type TFT (Thin) as an example of a switching element. This is an active matrix drive type liquid crystal device using a film transistor) element 22.

  However, the present invention is not limited to the FFS liquid crystal device, and can be applied to various horizontal electric field liquid crystal devices such as an IPS (In-Plane Switching) method. In the present invention, the present invention is not limited to a transmissive liquid crystal device, and a reflective liquid crystal device having a reflective display mode in which reflective display is performed using external light, or external light is used in a bright place. The present invention can also be applied to a transflective liquid crystal device having a reflective display mode for performing reflective display and a transmissive display mode for performing transmissive display using a light source such as a backlight in a dark place. In the present invention, the colored layer 4 is not limited to the three colors of R, G, and B, and may be configured to have the colored layer 4 of two or less colors or four or more colors. Furthermore, the present invention is not limited to the α-Si type TFT element 22, but various switching elements such as other three-terminal elements or two-terminal elements including LTPS (Low-Temperature Poly-Silicon) type TFT elements. You may be comprised using.

  The liquid crystal device 100 according to the first embodiment includes a liquid crystal display panel (electro-optical panel) 81 having an array substrate 91 and a color filter substrate 92 arranged to face each other with the liquid crystal layer 15 therebetween, and the liquid crystal display panel 81. A conductive layer 12 formed on one surface of the liquid crystal display panel, a pair of a first polarizing plate 13 and a second polarizing plate 14 (see FIG. 3) disposed at a position where the liquid crystal display panel 81 is sandwiched, and the other And an element. In the present invention, the liquid crystal display panel 81 may be a horizontal electric field type, and the specific configuration is not limited.

  First, the planar configuration of the array substrate 91 will be described.

  The array substrate 91 mainly includes a plurality of source lines 32, a plurality of gate lines 7, a routing wiring 25, a plurality of common wirings 19, a grounding electrode 17, a plurality of α-Si type TFT elements 22, and a plurality of common electrodes 3. A plurality of pixel electrodes 9, a driver IC 41, a plurality of external connection wirings 35, and an FPC 42.

  The array substrate 91 has a projecting region 36 projecting outward from one end (one side) 2a of the color filter substrate 92, and a driver IC 41 for driving liquid crystal is mounted on the surface 1a of the projecting region 36. Has been. Each terminal (not shown) on the input side of the driver IC 41 is electrically connected to one end of each external connection wiring 35, and the other end of each external connection wiring 35 is connected to each terminal on the output side of the FPC 42 ( (Not shown). Each terminal (not shown) on the input side of the FPC 42 is electrically connected to each terminal (not shown) on the output side of the electronic device, for example.

Each source line 32 is formed to extend from the overhang area 36 to the effective display area V. One end of each source line 32 is electrically connected to each terminal (not shown) on the output side of the driver IC 41 corresponding to each of the address numbers S ₁ , S ₂ ... S _n−1 , S _n (n: natural number). It is connected to the. An image signal is applied to each source line 32 from the driver IC 41 side.

Each gate line 7 includes a linear first gate line 7a extending in a direction substantially parallel to (including parallel to) the extending direction of the source line 32, and an effective display area from one end of the first gate line 7a. And a second gate wiring 7b that bends substantially at right angles (including right angles) to the V side. One end of each first gate wiring 7a is connected to each terminal (not shown) on the output side of the driver IC 41 corresponding to each of the address numbers G ₁ , G ₂ ... G _m−1 , G _m (m: natural number). Electrically connected. A gate signal (scanning signal) is applied to each gate line 7 from the driver IC 41 side at a predetermined timing.

  The routing wiring 25 is routed so as to surround the effective display area V. One end of the routing wiring 25 is electrically connected to the COM terminal on the output side of the driver IC 41 {terminal to which a common potential (reference potential) is applied}, and the other end of the routing wiring 25 is not shown. Is electrically grounded.

  Each common line 19 is provided corresponding to each second gate line 7b. Each common line 19 is formed to extend in a direction substantially parallel to (including parallel to) the extending direction of the second gate line 7b with a certain distance from each second gate line 7b. ing. Although not shown, each common wiring 19 is electrically connected to the lead wiring 25.

  The ground electrode 17 is provided in a region including the overhang region 36 on the first substrate 1 and is electrically grounded. A part (one end or connecting portion) 17a of the grounding electrode 17 is disposed in a region overlapping the through hole 2h provided in the second substrate 2 of the color filter substrate 92, and is disposed in the through hole 2h. The other end of the grounding electrode 17 is electrically connected to the ground wiring GND (electrically grounded wiring) of the FPC 42 while being electrically connected to the conductive layer 12 through the conductive member 18 formed. ing.

  Each α-Si type TFT element 22 is provided corresponding to the intersection position of each source line 32 and each second gate wiring 7b and each sub-pixel region SG, and is electrically connected to each source line 32 and each gate line 7. It is connected to the.

  Each common electrode 3 is provided corresponding to each sub-pixel region SG, and is electrically connected to each corresponding common wiring 19. Therefore, a common potential is applied to each common electrode 3 from the driver IC 41 side via the lead wiring 25 and each common wiring 19.

  Each pixel electrode 9 is provided at a position overlapping with each common electrode 3 in a plane and corresponding to each sub-pixel region G, and is electrically connected to each corresponding α-Si TFT element 22. Each pixel electrode 9 generates a fringe field (electric field) E with each corresponding common electrode 3.

  Next, the planar configuration of the color filter substrate 92 will be described.

  The color filter substrate 92 is a light-shielding layer (generally referred to as “black matrix”, hereinafter simply abbreviated as “BM”) made of black resin or metal film that shields light, and three colors of R, G, and B Color layers 4R, 4G, 4B, and the like. In the following description, when referring to a colored layer regardless of color, it is simply referred to as “colored layer 4”, and when referring to a colored layer by distinguishing colors, it is referred to as “colored layer 4R”.

  Although not shown, the BM is disposed at a position that divides each sub-pixel region SG, a position corresponding to each α-Si TFT element 22, or the like. The colored layers 4 for each color of R, G, and B are provided corresponding to each of the sub-pixel regions SG, and are provided at positions where the corresponding pixel electrodes 9 and the common electrodes 3 are planarly overlapped. Yes. In the first embodiment, the colored layer 4 is arranged in the order of R, G, and B in the extending direction of each common wiring 19 and each second gate wiring 7b, but the arrangement order is not particularly limited. Absent.

  The liquid crystal device 100 having the above configuration operates as follows when driven.

First, a source line 32 to which an image signal is supplied is electrically connected to a source electrode 22s (see FIGS. 2 and 3) of the α-Si TFT element 22, and the pixel electrode 9 is an α-Si type. The TFT element 22 is electrically connected to the drain electrode 22d (see FIGS. 2 and 3). The gate line 22 is electrically connected to the gate electrode 22g of the α-Si type TFT element 22, and the α-Si type TFT element 22 which is a switching element is closed for a certain period of time, thereby closing the source. supplied from line 32, the address numbers _{S 1,} S 2, ..., and writes the image signal corresponding to _{S n} at a predetermined timing. The image signal _{S 1, S 2, ...,} S n is to may be supplied line-sequentially in this order, or, to a plurality of gate lines 7 between adjacent phases, so as to supply each group Also good. Further, the gate signals corresponding to the address numbers G ₁ , G ₂ ,..., G _m are applied to the gate line 7 in a pulse-sequential manner in a predetermined order at a predetermined timing. Thereby, the orientation direction of the liquid crystal molecules (not shown) of the liquid crystal layer 15 is controlled, and the display image is visually recognized by the observer.

(Pixel configuration)
Next, the pixel configuration of the liquid crystal device 100 according to the first embodiment will be described.

  First, with reference to FIG. 2, a planar configuration of a pixel including a plurality of sub-pixel regions SG in the array substrate 91 will be described. FIG. 2 is a plan view showing a pixel configuration including a plurality of sub-pixel regions SG in the array substrate 91 according to the first embodiment.

  In FIG. 2, the source line 32, the second gate wiring 7 b of the gate line 7, and the common wiring 19 extend in a direction substantially orthogonal (including orthogonal) to each other. An α-Si TFT element 22 is provided at the intersection of the source line 32, the second gate line 7 b of the gate line 7, and the common line 19. The α-Si TFT element 22 includes a gate electrode 22g that forms part of the second gate wiring 7b, a gate insulating film 5 (see FIG. 3) formed on the gate electrode 22g, and a gate insulating film 5 An amorphous silicon layer (α-Si layer) 22a as an example of the semiconductor layer formed on the source line 32 is branched from the main line of the source line 32 to the amorphous silicon layer 22a side, and is electrically connected to the α-Si layer 22a. It has a source electrode 22s and a drain electrode 22d that is arranged at a certain distance from the source electrode 22s and is electrically connected to the α-Si layer 22a.

  Each common electrode 3 is provided corresponding to each sub-pixel region SG, and is electrically connected to each corresponding common wiring 19. Each pixel electrode 9 is provided corresponding to each sub-pixel region SG, and is planar with each corresponding common electrode 3 via the gate insulating film 5 and the passivation layer (reaction prevention layer) 8 (see FIG. 3). Overlap each other. Each pixel electrode 9 has a plurality of rectangular slits 9 s extending in a direction intersecting the source line 32, and each of the slits 9 s is spaced apart from the extending direction of the source line 32. Is provided. Each pixel electrode 9 is electrically connected to the drain electrode 22d of the α-Si TFT element 22 through a contact hole 8a provided in the passivation layer 8 (see also FIG. 3).

  Next, a cross-sectional configuration of the sub-pixel region SG will be described with reference to FIG. FIG. 3 is a cross-sectional view showing a cross-sectional configuration of the sub-pixel region SG along the cutting line AA ′ of FIG.

  The liquid crystal device 100 has a configuration in which a liquid crystal layer 15 including liquid crystal molecules exhibiting homogeneous alignment is sandwiched between an array substrate 91 disposed on the observation side and a color filter substrate 92 disposed to face the array substrate 91. Have

  First, the cross-sectional configuration of the array substrate 91 corresponding to FIG. 3 is as follows.

  The array substrate 91 includes a first substrate 1 made of a translucent material such as glass, and a plurality of components formed on the liquid crystal layer 15 side of the first substrate 1.

  Specifically, on the inner surface of the first substrate 1 on the liquid crystal layer 15 side, the gate electrode 22g, which is an element of the gate line 7, the common wiring 19, the common electrode 3, the gate insulating film 5, and the like are formed. . The common electrode 3 is formed of a transparent conductive material such as ITO (Indium-Tin-Oxide). One end side of the common electrode 3 covers a common wiring 19 formed of a metal such as ITO, chromium, or aluminum, for example. Thereby, the common electrode 3 and the common wiring 19 are electrically connected. The gate insulating film 5 is formed of a material having insulating properties and translucency, and covers the gate electrode 22g and the common electrode 3. Here, paying attention to the α-Si TFT element 22, the layer structure is as follows. The α-Si TFT element 22 includes a gate electrode 22g formed on the inner surface of the first substrate 1 on the liquid crystal layer 15 side, a gate insulating film 5 formed on the inner surface of the gate electrode 22g, and a gate insulating film. 5 on the inner surface of the gate insulating film 5 from the substantially central portion on the inner surface of the α-Si layer 22a and the α-Si layer 22a provided on the inner surface of the gate electrode 22g. The drain electrode 22d provided to extend to one end side of the pixel electrode 9 and the substantially central portion on the inner surface of the α-Si layer 22a, on the inner surface of the gate insulating film 5 and on the source line Source electrode 22s provided so as to extend toward the 32 side. A passivation layer 8 made of an insulating and translucent material is formed on the inner surface of the α-Si TFT element 22, and the α-Si TFT element 22 is covered with the passivation layer 8. ing.

  A passivation layer 8 is formed on the inner surface of the gate insulating film 5 that exists at a position overlapping the common electrode 3 in plan view. A pixel electrode 9 formed of a transparent conductive film such as ITO is formed on the inner surface of the passivation layer 8 that exists in a position overlapping the common electrode 3 in a planar manner. For this reason, the pixel electrode 9 and the common electrode 3 overlap each other in a plane. One end side of the pixel electrode 9 located on the α-Si TFT element 22 side enters into a contact hole (opening) 8a provided in the passivation layer 8, and is electrically connected to the drain electrode 22d. . For this reason, the pixel electrode 9 is electrically connected to the α-Si type TFT element 22. An alignment film (not shown) made of an organic material such as a horizontal alignment polyimide resin is formed on the inner surface of the passivation layer 8 covering the α-Si TFT element 22 and the inner surface of the pixel electrode 9 and the like. Has been.

  On the other hand, on the outer surface of the array substrate 91 opposite to the liquid crystal layer 15 side, a first polarizing plate 13 and a backlight 17 as an illumination device are arranged in this order. The first polarizing plate 13 has a first transmission axis (not shown). The first transmission axis of the first polarizing plate 13 is substantially orthogonal (including orthogonal) to the axis (not shown) of the initial alignment direction of the liquid crystal molecules of the liquid crystal layer 15. The backlight 17 is preferably a point light source such as an LED (Light Emitting Diode) or a combination of a linear light source such as a cold cathode fluorescent tube and a light guide plate.

  Next, the cross-sectional configuration of the color filter substrate 92 corresponding to FIG. 3 is as follows.

  The color filter substrate 92 includes a second substrate 2 made of a light-transmitting material such as glass, and a plurality of components formed on the liquid crystal layer 15 side of the second substrate 2.

  Specifically, on the inner surface of the second substrate 2 on the liquid crystal layer 15 side, the colored layers 4R, 4G, and 4B (colored layer 4R in FIG. 3) of each color of R, G, and B, and light-shielding properties are provided. Each BM is formed.

  Each colored layer 4 is provided corresponding to a position overlapping the common electrode 3 and the pixel electrode 9 in a plan view, and BM is provided corresponding to the α-Si TFT element 22 and the like. An overcoat layer 6 made of an insulating and translucent material such as an acrylic resin is formed on the inner surface of each colored layer 4 and BM. The overcoat layer 6 has a function of protecting the colored layer 4 from corrosion and contamination by chemicals used during the manufacturing process of the color filter substrate 92. On the inner surface of the overcoat layer 6, an alignment film (not shown) formed of an organic material such as a horizontal alignment polyimide resin is formed.

  On the other hand, the conductive layer 12 and the second polarizing plate 14 are formed or arranged in this order on the outer surface of the color filter substrate 92 opposite to the liquid crystal layer 15 side. The second polarizing plate 14 has a second transmission axis (not shown) that is substantially orthogonal (including orthogonal) to the first transmission axis of the first polarizing plate 13.

  In the liquid crystal device 100 having the above configuration, when a voltage is applied to the liquid crystal layer 15 in the liquid crystal display panel 81, an electric field E is formed between the common electrode 3 and the pixel electrode 9 through the slit 9s. The film 5 and the passivation layer 8 are distorted in an arch shape and pass through the liquid crystal layer 15 to control the alignment direction of the liquid crystal molecules. At this time, the illumination light emitted from the backlight 17 travels along the path L shown in FIG. 3, passes through the common electrode 3, the pixel electrode 9, the colored layer 4, etc., and reaches the observer. In this case, the illumination light exhibits a predetermined hue and brightness by transmitting through the colored layer 4 and the like. Thus, a desired color display image is visually recognized by the observer.

(Antistatic structure)
First, prior to describing the static electricity countermeasure structure according to the first embodiment of the present invention, the static electricity countermeasure structure according to the comparative example and its problem will be described with reference to FIG. In the following, the same elements as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

  FIG. 5 shows a static electricity countermeasure structure of a liquid crystal device 500 according to a comparative example corresponding to a cross-sectional view taken along the cutting line B-B ′ of the liquid crystal device 100 according to the first embodiment shown in FIG. 1.

  In the liquid crystal device 500 according to the comparative example, an electrically grounded electrode 17 x is formed on the surface 1 a of the overhang region 36 of the first substrate 1, and the liquid crystal layer 15 of the second substrate 2. A conductive layer 12 is formed on the outer surface opposite to the side, and a polarizing plate 14 is disposed on the outer surface of the conductive layer 12 opposite to the second substrate 2 side. The end 12a of the conductive layer 12 located on the overhanging region 36 side is exposed from the polarizing plate 14, and the end 12a of the conductive layer 12 and the ground electrode 17x are electrically conductive such as a conductive paste. The members 26 are electrically connected.

  In the liquid crystal device 500 of the comparative example having such a configuration, when a charge is charged on the surface of the polarizing plate 14 due to static electricity from the outside, the charged charge is transferred to the conductive layer 12, the conductive member 26, the ground electrode 17x, and the FPC 42. Through the ground wiring GND. Thereby, it is possible to prevent an unnecessary electric field from being generated between the first substrate 1 and the second substrate 2 due to the static electricity, and it is possible to perform appropriate display.

  Although the comparative example has such advantages, the following problems remain.

  That is, in the manufacturing process of the liquid crystal device 500 according to the comparative example, the end portion 12a of the conductive layer 12 and the ground electrode 17x located on the projecting region 36 side of the first substrate 1 are connected to the conductive member 26 having fluidity. When the conductive member 26 is electrically connected, an unnecessary region of the end portion 12a of the conductive layer 12, for example, the side of the polarizing plate 14 positioned on the opposite side to the one end 2a side of the second substrate 2 is used. Or the conductive member 26 may come into contact with the polarizing plate 14. If it does so, there exists a possibility of having a bad influence on the optical characteristic of the polarizing plate 14 by this. Therefore, in order to prevent the occurrence of such a problem, in the comparative example, the dimension of the end portion 12a of the conductive layer 12 exposed to the outside from the polarizing plate 14 (corresponding to the direction orthogonal to the one end 2a of the second substrate 2). By increasing the length d10, the conductive member 26 diffuses or flows to the polarizing plate 14 side when the end 12a of the conductive layer 12 using the conductive member 26 is connected to the ground electrode 17x. Try to prevent. Here, the dimension d10 of the end 12a of the conductive layer 12 exposed to the outside from the polarizing plate 14 is set to at least 1 mm or more. For this reason, in the comparative example, in order to increase the dimension d10, the dimension of the second substrate 2 (the length corresponding to the dimension d1 in FIG. 1) must be increased, and the first substrate 1 accordingly. (The length corresponding to the dimension d2 in FIG. 1) is also increased, and as a result, the external dimensions of the liquid crystal device 500 (corresponding to the dimension d1 in FIG. 1) are compared with those of the TN mode, VA mode, or ECB mode. Length). Then, in the comparative example, there is a problem that the degree of mounting of the liquid crystal display device on the electronic device or the like is reduced due to the restriction on the external dimension of the liquid crystal device required for mounting on the electronic device or the like.

  Therefore, in the liquid crystal device 100 according to the first embodiment, in order to prevent such problems from occurring while maintaining the advantages of the comparative example, the connection method between the conductive layer 12 and the ground electrode 17 has been devised. Yes.

  Hereinafter, with reference to FIG.1 and FIG.4 (a), the static electricity countermeasure structure of the liquid crystal device 100 which concerns on 1st Embodiment of this invention is demonstrated. FIG. 4A is a cross-sectional view taken along the cutting line B-B ′ in FIG. 1, and particularly shows the anti-static structure according to the first embodiment.

  In the comparative example, the electrical connection between the conductive layer 12 and the grounding electrode 17x is performed outside the liquid crystal device 500, but in the liquid crystal device 100 according to the first embodiment of the present invention. The conductive layer 12 and the grounding electrode 17 are electrically connected to each other inside the liquid crystal device 100 (between the first substrate 1 and the second substrate 2).

  Specifically, in the liquid crystal device 100 according to the first embodiment, the second substrate 2 has a through hole 2h that penetrates from the surface on the conductive layer 12 side to the surface on the first substrate 1 side. The substrate 1 has a projecting region 36 projecting outward from one end (one side) 2a of the second substrate 2 and planarly overlaps the through hole 2h from the projecting region 36 on the surface on the second substrate 2 side. The conductive layer 12 and the grounding electrode 17 (part of the grounding electrode 17, one end or the connecting portion 17 a) are grounded from the through hole 2 h of the second substrate 2. It is electrically connected through a conductive member 18 disposed over the electrode 17. In a preferred example, the part 17a of the ground electrode 17 is preferably at least 0.1 mm in length and width in order to secure a connection area with the conductive member 18. The conductive member 18 is preferably a conductive paste.

  According to this configuration, when a charge is charged on the surface of the polarizing plate 14 due to static electricity from the outside, the charged charge is externally transmitted through the conductive layer 12, the conductive member 18, the ground electrode 17 and the ground wiring GND of the FPC 42. Escaped to. Therefore, similarly to the comparative example described above, it is possible to prevent an unnecessary electric field from being generated between the first substrate 1 and the second substrate 2 due to the static electricity, and perform appropriate display. It becomes possible. In a preferred example, the conductive layer 12 may be an optical member such as a polarizing plate formed of a conductive material such as ITO. In this case, it is not necessary to provide the polarizing plate 14 on the surface of the conductive layer 12 opposite to the surface on the liquid crystal layer 15 side.

  Further, according to the configuration of the liquid crystal device 100, the conductive layer 12 and the ground electrode 17 are electrically connected to each other on the inner side between the first substrate 1 and the second substrate 2 through the conductive member 18. The Therefore, in this liquid crystal device 100, as a countermeasure against static electricity, in order to electrically connect the conductive layer 12 and the grounding electrode 17 through the conductive member 18, the vicinity of the end of the conductive layer 12 on the projecting region 36 side is exposed to the outside. No need to expose. Thereby, in FIG. 1, it can prevent that the dimension (length corresponding to the direction orthogonal to the one end 2a of the 2nd board | substrate 2) d1 of the 2nd board | substrate 2 becomes large, and according to this, the 1st board | substrate. It is possible to prevent the dimension 1 (the length corresponding to the direction orthogonal to the one end 2a of the second substrate 2) d2 from increasing. Therefore, in FIG. 1, it can prevent that the external dimension (length corresponding to the direction orthogonal to the one end 2a of the 2nd board | substrate 2) d2 of the liquid crystal device 100 becomes large. As a result, the external dimensions of the liquid crystal device 100 can be made substantially the same as those of a TN, VA, or ECB liquid crystal device. As a result, it is difficult to receive restrictions on the external dimensions of the liquid crystal device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type liquid crystal device 100 on the electronic device or the like can be increased.

  Further, in the liquid crystal device 100 according to the first embodiment, the through hole 2h, the conductive member 18 and the grounding electrode 17 of the second substrate 2 are located outside the frame-shaped sealing material 43. There are the following advantageous effects.

  Here, when a configuration is adopted in which the through hole 2h of the second substrate 2 is disposed inside the frame-shaped sealing material 43 that encloses the liquid crystal layer 15 (region partitioned by the frame-shaped sealing material 43). Has the following problems. That is, in the manufacturing process of the liquid crystal device, when the conductive member 18 is disposed (or coated) in the through hole 2h of the second substrate 2, a part of the conductive member 18 flows or diffuses toward the liquid crystal layer 15 side. As a result, the liquid crystal layer 15 may be contaminated, which may cause deterioration in display quality.

  In this regard, in the liquid crystal device 100 according to the first embodiment, as described above, the through hole 2h, the conductive member 18, and the grounding electrode 17 of the second substrate 2 are located outside the frame-shaped sealing material 43. ing. Therefore, when the conductive member 18 is disposed (or coated) in the through hole 2h of the second substrate 2 in the manufacturing process of the liquid crystal device 100, a part of the conductive member 18 flows into the liquid crystal layer 15 side. Or it can prevent spreading. As a result, the liquid crystal layer 15 can be prevented from being contaminated, and the display quality can be prevented from being adversely affected.

(Another example of the first embodiment)
In the first embodiment, the electrical connection between the conductive layer 12 and the grounding electrode 17 through the conductive member 18 is performed outside the frame-shaped sealing material 43. However, the present invention is not limited to this. In the present invention, the electrical connection between the conductive layer 12 and the grounding electrode 17 through the conductive member 18 may be performed at the position of the frame-shaped sealing material 43.

  This configuration will be described with reference to FIG.

  FIG. 4B is a cross-sectional view corresponding to FIG. 4A and shows a static electricity countermeasure structure of the liquid crystal device 100A according to another example of the first embodiment of the present invention. In the following, the same elements as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

  In the liquid crystal device 100A according to the first embodiment and other embodiments, a part of the frame-shaped sealing material 43 is a part of the through hole 2h of the second substrate 2 and a part of the grounding electrode 17 (one end or a connecting part). An opening (through hole) 43h is provided in the frame-shaped sealing material 43, which is disposed in a region overlapping with 17a, penetrating from the surface on the second substrate 2 side to the surface on the part 17a side of the ground electrode 17; The conductive layer 12 and the grounding electrode 17 are electrically connected through the conductive member 18 arranged from the through hole 2h of the second substrate 2 to the opening 43h of the frame-shaped sealing material 43 and a part 17a of the grounding electrode 17. Has been. Thus, in the liquid crystal device 100A, the conductive layer 12 and the grounding electrode 17 are disposed between the first substrate 1 and the second substrate 2 through the conductive member 18, as in the first embodiment. Is electrically connected. Therefore, the liquid crystal device 100A can obtain the same operational effects as the liquid crystal device 100 according to the first embodiment described above.

[Second Embodiment]
Next, with reference to FIG. 6A, a static electricity countermeasure structure of the liquid crystal device 200 according to the second embodiment of the present invention will be described. FIG. 6A is a cross-sectional view corresponding to the cutting line BB ′ of FIG.

  The second embodiment is different from the first embodiment in the anti-static structure described later, and is otherwise the same. Therefore, below, the same code | symbol is attached | subjected about the element same as 1st Embodiment, and the description is abbreviate | omitted suitably.

  The liquid crystal device 200 according to the second embodiment of the present invention includes a liquid crystal display panel 82 that sandwiches the liquid crystal layer 15 between the first substrate 1 and the second substrate 2, and the second substrate 2 includes a conductive layer. A through hole 2h penetrating from a surface on the 12th side to a surface on the first substrate 1 side, a first conductive member 18x disposed in the through hole 2h, and a surface on the first substrate 1 side; A conductive member (or wiring) 27 electrically connected to the first conductive member 18x, and the first substrate 1 is outside the one end (one side) 2a of the second substrate 2 A grounding electrode 17 extending from the projecting region 36 to a region overlapping with the conductor 27 on the surface of the second substrate 2 on the surface of the second substrate 2. The electrode 17 includes a first conductive member 18x, a conductor 27, and a conductor 27. It is electrically connected through the second conductive member 28 interposed between the ground electrode 17. In a preferred example, the first conductive member 18x and the second conductive member 28 are preferably conductive paste. In the present invention, the second conductive member 28 may be conductive particles as shown in FIG.

  Here, the conductor 27 is formed on the second substrate 2 located on the projecting region 36 side of the first substrate 1 from a position corresponding to the first conductive member 18 x disposed in the through hole 2 h of the second substrate 2. The one end of the conductor 27 is electrically connected to the first conductive member 18x, and the other end of the conductor 27 corresponds to the one end 2a side of the second substrate 2. The second conductive member 28 is electrically connected to the second conductive member 28 disposed at a position where the second conductive member 28 is a part (one end or a connecting portion) of the ground electrode 17 located in a region overlapping the conductor 27 in a plane. ) 17a is electrically connected.

  According to this configuration, when a charge is charged on the surface of the polarizing plate 14 due to static electricity from the outside, the charged charge is transferred to the conductive layer 12, the first conductive member 18 x, the conductor 27, and the second conductive member 28. The ground electrode 17 and the ground wiring GND of the FPC 42 are escaped to the outside. As a result, as in the first embodiment, it is possible to prevent an unnecessary electric field from being generated between the first substrate 1 and the second substrate 2 due to the static electricity. Display can be performed. In a preferred example, the conductive layer 12 may be an optical member such as a polarizing plate formed of a conductive material such as ITO (the same applies to various embodiments and modifications below). In this case, it is not necessary to provide the polarizing plate 14 on the surface of the conductive layer 12 opposite to the surface on the liquid crystal layer 15 side.

  Furthermore, according to the liquid crystal device 200, the conductive layer 12 and the grounding electrode 17 are connected to the first substrate 1 and the second substrate 2 through the first conductive member 18x, the conductor 27, and the second conductive member 28. It is electrically connected on the inside side. For this reason, in the liquid crystal device 200, as a countermeasure against static electricity, in order to electrically connect the conductive layer 12 and the ground electrode 17, it is necessary to expose the vicinity of the end of the conductive layer 12 on the projecting region 36 side to the outside. Disappear. As a result, as in the first embodiment, the size of the second substrate 2 (the size corresponding to the size d1 in FIG. 1) can be prevented from increasing, and the size of the first substrate 1 (see FIG. 1) (a dimension corresponding to the dimension d2 of 1) can be prevented from increasing. Therefore, it is possible to prevent the external dimension of the liquid crystal device 200 (the dimension corresponding to the dimension d2 in FIG. 1) from increasing. As a result, the external dimensions of the liquid crystal device 200 can be made substantially the same as those of a TN, VA, or ECB liquid crystal device. As a result, it is difficult to receive restrictions on the external dimensions of the liquid crystal device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type liquid crystal device 200 on the electronic device or the like can be increased.

  Further, in the liquid crystal device 200 according to the second embodiment, the through hole 2h of the second substrate 2, the first conductive member 18x, the conductor 27, the second conductive member 28, and the ground electrode disposed in the through hole 2h. 17 is located outside the frame-shaped sealing material 43. Therefore, in the manufacturing process of the liquid crystal device 200, the conductive member 18 is disposed (or coated) in the through hole 2h of the second substrate 2 and the second conductive member 28 is interposed between the conductor 27 and the grounding electrode 17. In this case, it is possible to prevent a part of the conductive member 18 and the second conductive member 28 from flowing or diffusing to the liquid crystal layer 15 side. As a result, the liquid crystal layer 15 can be prevented from being contaminated, and the display quality can be prevented from being adversely affected. However, in the present invention, as the liquid crystal device 200A according to another example of the second embodiment, the conductive layer 12 and the conductor 27 through the first conductive member 18x disposed in the through hole 2h of the second substrate 2 are used. As shown in FIG. 6B, the electrical connection may be made at the position of the frame-shaped sealing material 43. In the liquid crystal device 200A, the second conductive member 28 may be conductive particles as shown in FIG. 7B.

[Third Embodiment]
In the second embodiment, the electrical connection between the conductor 27 and the grounding electrode 17 through the second conductive member 28 is performed outside the frame-shaped sealing material 43. However, the present invention is not limited to this. In the present invention, the electrical connection between the conductor 27 and the grounding electrode 17 through the second conductive member 28 may be performed at the position of the frame-shaped sealing material 43.

  Hereinafter, with reference to FIG. 8A, a static electricity countermeasure structure of the liquid crystal device 300 according to the third embodiment of the present invention will be described. FIG. 8A is a cross-sectional view corresponding to the cutting line B-B ′ of FIG. 1 and shows a static electricity countermeasure structure of the liquid crystal device 300 according to the third embodiment of the present invention.

  The third embodiment is different from the first and second embodiments in the anti-static structure described later, and is otherwise the same. Therefore, below, the same code | symbol is attached | subjected about the element same as 1st and 2nd embodiment, and the description is abbreviate | omitted suitably.

  The liquid crystal device 300 according to the third embodiment of the present invention includes a liquid crystal display panel 83 that sandwiches the liquid crystal layer 15 between the first substrate 1 and the second substrate 2, and a part of the frame-shaped sealing material 43. Is disposed in a region overlapping at least a part of the conductor 27 and the grounding electrode 17 (one end or connecting portion or part 17a of the grounding electrode 17). The conductor 27 and the grounding electrode 17 are frame-shaped seals. The second conductive member (conductive particles in this example) 28 disposed inside the material 43 is electrically connected.

  More specifically, the through hole 2h of the second substrate 2 and the first conductive member 18x disposed in the through hole 2h are disposed outside the frame-shaped sealing material 43, and one end of the conductor 27 is The other end of the conductor 27 is electrically connected to the second conductive member 28 disposed inside the frame-shaped sealing material 43, and is electrically connected to the first conductive member 18x. The one end 17 a of the grounding electrode 17 is electrically connected to the second conductive member 28 disposed inside the frame-shaped sealing material 43. Thus, the conductive layer 12 and the grounding electrode 17 are electrically connected through the first conductive member 18x, the conductor 27, and the second conductive member 28.

  According to such a configuration, when a charge is charged on the surface of the polarizing plate 14 due to static electricity from the outside, the charged charge is transferred to the conductive layer 12 and the first conductive member as in the second embodiment. 18 x, the conductor 27, the second conductive member 28, the grounding electrode 17, and the ground wiring GND of the FPC 42 are escaped to the outside. Therefore, similarly to the second embodiment, an unnecessary electric field can be prevented from being generated between the first substrate 1 and the second substrate 2 due to the static electricity, and an appropriate display can be performed. Can be performed.

  Further, according to the liquid crystal device 300, the conductive layer 12 and the grounding electrode 17 are connected to the first conductive member 18 x, the conductor 27, and the second conductive member 28 mixed in the frame-shaped sealing material 43. Are electrically connected on the inner side between the substrate 1 and the second substrate 2. Therefore, in the liquid crystal device 300, as a countermeasure against static electricity, in order to electrically connect the conductive layer 12 and the grounding electrode 17, it is necessary to expose the vicinity of the end of the conductive layer 12 on the projecting region 36 side to the outside. Disappear. As a result, as in the first and second embodiments, the size of the second substrate 2 (the size corresponding to the size d1 in FIG. 1) can be prevented from increasing, and the first substrate 1 can be reduced accordingly. It is possible to prevent the dimension (a dimension corresponding to the dimension d2 in FIG. 1) from increasing. Therefore, it is possible to prevent the external dimension of the liquid crystal device 300 (the dimension corresponding to the dimension d2 in FIG. 1) from increasing. As a result, the external dimensions of the liquid crystal device 300 can be made substantially the same size as a TN, VA, or ECB liquid crystal device. As a result, it is difficult to receive restrictions on the external dimensions of the liquid crystal device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type liquid crystal device 300 on the electronic device or the like can be increased.

  In the present invention, as another example of the liquid crystal device 300A according to the third embodiment, the conductive layer 12 and the conductor 27 through the first conductive member 18x disposed in the through hole 2h of the second substrate 2 are used. The second conductive member 28 and the grounding electrode 17 may be electrically connected at the position of the frame-shaped sealing material 43 as shown in FIG.

[Modification 1]
Next, with reference to FIG. 9A, a configuration of a liquid crystal device 100B according to Modification 1 of the first embodiment will be described. In the following, the same elements as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted as appropriate. FIG. 9A is a cross-sectional view corresponding to the cutting line BB ′ of FIG. 1 and shows a static electricity countermeasure structure of the liquid crystal device 100B according to the first modification of the first embodiment.

  In the liquid crystal device 100B according to the first modification of the first embodiment, the second substrate 2 has a through hole 2h penetrating from the surface on the conductive layer 12 side to the surface on the first substrate 1 side. Has another through-hole 12h at a position connected to and corresponding to the through-hole 2h of the second substrate 2, and the first substrate 1 is outward from one end (one side) 2a of the second substrate 2. In addition to having an overhanging region 36 and a surface on the second substrate 2 side, it has a grounding electrode 17 extending from the overhanging region 36 to a region overlapping with the through holes 2h and 12h in a plane, The grounding electrode 17 (one end of the grounding electrode 17 or the connecting portion 17a) is disposed from the other through hole 12h of the conductive layer 12 to the through hole 2h of the second substrate 2 and the grounding electrode 17. Is electrically connected through. As a result, in the liquid crystal device 100B, the conductive layer 12 and the ground electrode 17 are connected between the first substrate 1 and the second substrate 2 through the conductive member 18, as in the first embodiment. Is electrically connected. Therefore, this liquid crystal device 100B can obtain the same operational effects as the liquid crystal device 100 according to the first embodiment described above.

[Modification 2]
Next, with reference to FIG. 9B, a configuration of the liquid crystal device 200B according to the second modification of the second embodiment will be described. In the following, the same elements as those of the second embodiment are denoted by the same reference numerals, and the description thereof is omitted as appropriate. FIG. 9B is a cross-sectional view corresponding to the cutting line BB ′ in FIG. 1 and shows a static electricity countermeasure structure of the liquid crystal device 200B according to Modification 2 of the second embodiment.

  In the liquid crystal device 200B according to the second modification of the second embodiment, the second substrate 2 includes a through hole 2h that penetrates from the surface on the conductive layer 12 side to the surface on the first substrate 1 side, and the through hole 2h. A first conductive member 18x disposed; and a conductor (or wiring) 27 formed on the first substrate 1 side surface and electrically connected to the first conductive member 18x. 12 includes another through hole 12h provided at a position connected to the through hole 2h of the second substrate 2 and a corresponding position, and a first conductive member 18x disposed in the through hole 12h. The first substrate 1 has a projecting region 36 projecting outward from one end (one side) 2a of the second substrate 2 and is planar with the conductor 27 from the projecting region 36 on the surface on the second substrate 2 side. A grounding electrode 17 extending over a region overlapping with the conductive layer 1 The grounding electrode 17 is electrically passed through the first conductive member 18x disposed in the through holes 2h and 12h, the conductor 27, and the second conductive member 28 interposed between the conductor 27 and the grounding electrode 17. It is connected. Thereby, in the liquid crystal device 200B, the conductive layer 12 and the grounding electrode 17 are connected between the first substrate 1 and the second substrate 2 through the first conductive member 18x, the conductor 27, and the second conductive member 28. It is electrically connected on the inside side. Therefore, this liquid crystal device 300B can obtain the same operational effects as the liquid crystal device 200 according to the second embodiment described above.

[Modification 3]
Next, with reference to FIG. 9C, a configuration of a liquid crystal device 300B according to Modification 3 of the third embodiment will be described. In the following, the same elements as those in the third embodiment are denoted by the same reference numerals, and the description thereof is omitted as appropriate. FIG. 9C is a cross-sectional view corresponding to the cutting line BB ′ of FIG. 1 and shows a static electricity countermeasure structure of the liquid crystal device 300B according to the third modification of the third embodiment.

  In the liquid crystal device 300B according to the third modification of the third embodiment, the second substrate 2 has a through hole 2h penetrating from the surface on the conductive layer 12 side to the surface on the first substrate 1 side, and the through hole 2h. A first conductive member 18x disposed; and a conductor (or wiring) 27 formed on the first substrate 1 side surface and electrically connected to the first conductive member 18x. 12 includes another through hole 12h provided at a position connected to the through hole 2h of the second substrate 2 and a corresponding position, and a first conductive member 18x disposed in the through hole 12h. The first substrate 1 has a projecting region 36 projecting outward from one end (one side) 2a of the second substrate 2 and is planar with the conductor 27 from the projecting region 36 on the surface on the second substrate 2 side. Has a grounding electrode 17 extending over a region overlapping with A part of the wire 43 is disposed in a region overlapping at least a part of the conductor 27 and the grounding electrode 17 (one end or connecting portion or part 17 a of the grounding electrode 17), and the conductor 27 and the grounding electrode 17. Are electrically connected through a second conductive member (conductive particles in this example) 28 disposed inside the frame-shaped sealing material 43. Accordingly, in the liquid crystal device 300B, the conductive layer 12 and the grounding electrode 17 are connected to the first conductive member 18x, the conductor 27, and the second conductive member 28 mixed in the frame-shaped sealing material 43. Electrical connection is made between the substrate 1 and the second substrate 2. Therefore, this liquid crystal device 300B can obtain the same operational effects as the liquid crystal device 300 according to the third embodiment described above.

[Method of manufacturing liquid crystal device]
Next, with reference to FIGS. 10 to 18, a method for manufacturing the liquid crystal device according to the first to third embodiments of the present invention and the first to third modifications will be described. FIG. 10 shows a flowchart of a method for manufacturing a liquid crystal device according to the present invention. In the following, points particularly relevant to the present invention will be described in detail, and descriptions of other points will be omitted as appropriate.

(Method for Manufacturing Liquid Crystal Device According to First Embodiment)
11 to 14 show manufacturing process diagrams of the liquid crystal device 100 according to the first embodiment corresponding to the flowchart of FIG. 10. 14 (a) to 14 (d) are cross-sectional views taken along the cutting line BB 'of FIG. 13, and are respectively a liquid crystal display panel manufacturing process P3, a conductive member arranging process P4, and a conductive layer forming process P5. The optical member arrangement | positioning process P6 is shown.

  The manufacturing method of the liquid crystal device 100 according to the first embodiment includes a first substrate preparation process P1, a second substrate preparation process P2, a liquid crystal display panel manufacturing process P3, a conductive member arranging process P4, a conductive layer forming process P5, and an optical. A member arrangement step P6 and other element arrangement step P7 are provided. In the present invention, the execution order of the first substrate preparation process P1 and the second substrate preparation process P2 may be reversed.

  First, in the first substrate preparation step P1, as shown in FIG. 11, the first substrate 1 having the common electrode 3, the pixel electrode 9, the ground electrode 17 and the like on one surface (the array substrate having the above-described configuration). 91) is prepared. The driver IC 41 may be mounted in a subsequent process of the first substrate preparation process P1.

  Next, the second substrate preparation process P2 is executed. Specifically, in the second substrate preparation step P2, as shown in FIG. 12, a base material 2x made of a transparent material such as glass is prepared, and the base material 2x is prepared by a predetermined method. The second substrate 2 is manufactured by forming the through-hole 2h, and each color of R, G, B, for example, in a stripe arrangement, is formed in the region to be the effective display region V on the manufactured second substrate 2. The second substrate 2 (the color filter substrate 92 having the above-described configuration) in which the BM (not shown) is arranged at the position where each colored layer 4 is partitioned is prepared. Here, as a method of forming the through-hole 2h with respect to the base material 2x, for example, silicon carbide (SiC) is attached to the tip of a piano wire attached to the ultrasonic generator, and the tip is the through-hole of the base material 2x. A method of forming a through-hole 2h in the base material 2x by generating ultrasonic waves with respect to the piano wire by contacting an area where 2h is to be formed, or by applying a laser beam to the base material 2x A method of forming the through hole 2h in the substrate 2x by irradiating the region where the through hole 2h is to be formed, or the through hole 2h is formed in the region of the substrate 2x in which the through hole 2h is to be formed by using a photoetching technique. Various known methods such as the method of

  Next, a liquid crystal display panel manufacturing process P3 is executed. Specifically, in the liquid crystal display panel manufacturing process P3, as shown in FIGS. 13 and 14A, the one surface of the first substrate 1 and the second substrate 2 are connected to the first substrate. 1 is opposed to form an overhang region 36 projecting outward from one end 2 a of the second substrate 2, and the ground electrode 17 extends from the overhang region 36 of the first substrate 1 to the through hole of the second substrate 2. The first substrate 1 and the second substrate 2 are bonded to each other through a frame-shaped sealing material 43 so as to be arranged over a region that overlaps with the plane 2h, and is further divided by the frame-shaped sealing material 43 A liquid crystal display panel 81 is manufactured by enclosing the liquid crystal layer 15 and sandwiching the liquid crystal layer 15 between the first substrate 1 and the second substrate 2.

  Next, the conductive member arranging step P4 is executed. Specifically, in the conductive member arranging step P4, as shown in FIG. 14B, the grounding electrode 17 (a part, one end or a connecting portion of the grounding electrode 17) is formed from the through hole 2h of the second substrate 2. 17a), a conductive member 18 such as a conductive paste is disposed, and the conductive member 18 and the grounding electrode 17 are electrically connected.

  Next, the conductive layer forming step P5 is performed. Specifically, in this conductive layer forming step P5, as shown in FIG. 14C, for example, ITO or the like is formed on each surface of the conductive member 18 and the second substrate 2 opposite to the first substrate 1 side. The conductive layer 12 is formed using the transparent conductive member, and the conductive layer 12 and the conductive member 18 are electrically connected.

  Next, the optical member arranging step P6 is executed. Specifically, in this optical member arranging step P6, as shown in FIG. 14D, for example, a polarizing plate 14 (optical member) is arranged on the surface of the conductive layer 12 opposite to the second substrate 2 side. In addition, for example, a polarizing plate 13 (optical member) is disposed on the surface of the first substrate 1 opposite to the liquid crystal layer 15 side. In the present invention, when the conductive layer 12 is an optical member such as a polarizing plate having conductivity, it is not necessary to provide the optical member placement step P6 (the same applies to the following various embodiments and modifications).

  Next, the other element arrangement process P7 is executed. In the other element arrangement process, each terminal on the output side of the FPC 42 and the external connection terminal 35 are electrically connected, the ground wiring GND of the FPC 42 and the ground electrode 35 are electrically connected, and further the polarizing plate A backlight 17 and the like are arranged on the side opposite to the first substrate 1 side of 13. Thus, the liquid crystal device 100 of the first embodiment shown in FIGS. 1 to 3 and FIG. 4A is manufactured. In the liquid crystal device 100 according to the first embodiment manufactured as described above, the conductive layer 12 and the grounding electrode 17 are electrically connected to each other between the first substrate 1 and the second substrate 2 through the conductive member 18. Connected to. Therefore, the liquid crystal device 100 can obtain the same effects as those of the first embodiment.

(Method for Manufacturing Liquid Crystal Device According to Modification 1 of First Embodiment)
When the method for manufacturing the liquid crystal device 100 according to the first embodiment is compared with the method for manufacturing the liquid crystal device 100B according to the first modification of the first embodiment, the liquid crystal device 100B according to the first modification of the first embodiment In the manufacturing method, the execution order of the conductive member arranging step P4 and the conductive layer forming step P5 is reversed as compared with the manufacturing method of the liquid crystal device 100 according to the first embodiment, and other than that according to the first embodiment. This is the same as the manufacturing method of the liquid crystal device 100. Therefore, in the following, the description of the points common to the method for manufacturing the liquid crystal device 100 according to the first embodiment is omitted.

  FIG. 15 is a manufacturing process diagram of the liquid crystal device 100B according to the first modification of the first embodiment corresponding to the flowchart of FIG. FIG. 15A is a cross-sectional view corresponding to the cutting line B-B ′ of FIG. 13 and shows a conductive layer forming step P5 according to Modification 1 of the first embodiment. FIG.15 (b) is sectional drawing corresponding to Fig.15 (a), and shows the electroconductive member arrangement | positioning process P4 which concerns on the modification 1 of 1st Embodiment. FIG.15 (c) is sectional drawing corresponding to Fig.15 (a), and shows the optical member arrangement | positioning process P6 which concerns on the modification 1 of 1st Embodiment.

  In the manufacturing method of the liquid crystal device 100B according to the first modification of the first embodiment, the first substrate preparation step P1 and the second substrate are performed in the same manner as the manufacturing method of the liquid crystal device 100 according to the first embodiment described above. The liquid crystal display panel 81 is manufactured by executing the substrate preparation process P2 and the liquid crystal display panel manufacturing process P3.

  Next, the conductive layer forming step P5 is performed. Specifically, in this conductive layer forming step P5, as shown in FIG. 15A, the first substrate 1 side of the second substrate 2 is not closed so as not to close the through hole 2h of the second substrate 2. The conductive layer 12 is formed on the opposite surface using a transparent conductive member such as ITO. As a result, another through hole 12 h is formed in the conductive layer 12 corresponding to the through hole 2 h of the second substrate 2. In the conductive layer forming step P5, the conductive layer 12 may be formed on at least a part of the surface of the through hole 2h of the second substrate 2.

  Next, the conductive member arranging step P4 is executed. Specifically, in this conductive member arranging step P4, as shown in FIG. 15B, the second substrate 2 is formed from the other through holes 12h of the conductive layer 12 formed in the conductive layer forming step P5. A conductive member 18 such as a conductive paste is disposed (or coated) over the through-hole 2h and the ground electrode 17 (a part, one end or the connection portion 17a of the ground electrode 17), and the conductive layer 18 and the ground electrode 17 are disposed. (Part of the grounding electrode 17, one end or the connecting portion 17 a) is electrically connected through the conductive member 18.

  Next, the optical member arranging step P6 is executed. Specifically, in this optical member arranging step P6, as shown in FIG. 15C, the polarizing plate 14 (optical member) is formed on each surface of the conductive member 18 and the conductive layer 12 opposite to the second substrate 2 side. ) And a polarizing plate 13 (optical member) is disposed on the surface of the first substrate 1 opposite to the liquid crystal layer 15 side.

  Next, the other element arrangement process P7 is executed by the same method as the method for manufacturing the liquid crystal device 100 according to the first embodiment. Thereby, the liquid crystal device 100B according to the first modification of the first embodiment is manufactured. In the liquid crystal device 100B according to the modification of the first embodiment manufactured in this way, the conductive layer 12 and the grounding electrode 17 are disposed on the inner side between the first substrate 1 and the second substrate 2 through the conductive member 18. Are electrically connected. Therefore, the liquid crystal device 100B can obtain the same effects as those of the first embodiment.

(Method for Manufacturing Liquid Crystal Device According to Second Embodiment)
When the method for manufacturing the liquid crystal device 200 according to the second embodiment and the method for manufacturing the liquid crystal device 100 according to the first embodiment are compared, in the method for manufacturing the liquid crystal device 200 according to the second embodiment, the second substrate is used. The contents of the preparation process P2, the liquid crystal display panel manufacturing process P3, the conductive member arranging process (first conductive member arranging process) P4, and the conductive layer forming process P5 are different, and the rest of the contents of the liquid crystal device 100 according to the first embodiment. This is the same as the manufacturing method. Therefore, in the following, the description of the points common to the manufacturing method of the liquid crystal device 100 according to the first embodiment will be omitted.

  FIG. 16 is a manufacturing process diagram of the liquid crystal device 200 according to the second embodiment corresponding to the flowchart of FIG. 10. FIG. 16A is a cross-sectional view corresponding to the cutting line B-B ′ of FIG. 13 and shows a liquid crystal display panel manufacturing process P3 according to the second embodiment. FIG.16 (b) is sectional drawing corresponding to Fig.16 (a), and shows the 1st electrically-conductive member arrangement | positioning process P4 which concerns on 2nd Embodiment. FIG. 16C is a cross-sectional view corresponding to FIG. 16A and shows a conductive layer forming step P5 according to the second embodiment.

  In the manufacturing method of the liquid crystal device 200 according to the second embodiment, first, the first substrate preparation step P1 is executed by the same method as the manufacturing method of the liquid crystal device 100 according to the first embodiment described above.

  Next, the second substrate preparation process P2 is executed. Specifically, in the second substrate preparation step P2, a base material 2x made of a transparent material such as glass is prepared, and through holes 2h are formed in the base material 2x by a predetermined method. The second substrate 2 is produced by forming the conductor 27 on one surface of the base material 2x and covering at least a part of the through-hole 2h, and on the produced second substrate 2. In the region to be the effective display region V, for example, the colored layers 4 of R, G, and B are arranged in a stripe arrangement, and BMs (not shown) are arranged at positions where the colored layers 4 are partitioned. A second substrate 2 (color filter substrate) is prepared.

  Next, a liquid crystal display panel manufacturing process P3 is executed. Specifically, in the liquid crystal display panel manufacturing process P3, as shown in FIG. 16A, the one surface of the first substrate 1 and the one surface of the second substrate 2 are formed on the first surface. Of the second substrate 2 so as to form an overhanging region 36 projecting outward from one end 2 a of the second substrate 2, and the second conductive member 28 is disposed on one surface of the conductor 27 and the ground electrode 17. Arrangement (in this example, the second conductive member 28 is arranged on one surface of the grounding electrode 17), and the grounding electrode 17 further extends from the overhang region 36 of the first substrate 1 to the conductor of the second substrate 2. 27 and the second conductive member 28 such as a conductive paste or conductive particles is disposed on the conductor 27 and the grounding electrode 17 (a part of the grounding electrode, one end or a connecting portion). 17a) to be sandwiched by the first substrate And the second substrate 2 are bonded to each other through a frame-shaped sealing material 43, and the liquid crystal layer 15 is sealed in a region partitioned by the frame-shaped sealing material 43. A liquid crystal display panel 82 is manufactured by holding the liquid crystal layer 15 between the substrate 2 and the substrate 2.

  Next, the first conductive member arranging step P4 is executed. Specifically, in the first conductive member disposing step P4, as shown in FIG. 16B, the first conductive member 18x such as a conductive paste is disposed in the through hole 2h of the second substrate 2, for example. Then, the first conductive member 18x and the conductor 27 are electrically connected.

  Next, the conductive layer forming step P5 is performed. Specifically, in this conductive layer forming step P5, as shown in FIG. 16C, on each surface of the first conductive member 18x and the second substrate 2 opposite to the first substrate 1 side, For example, the conductive layer 12 is formed using a transparent conductive member such as ITO, and the conductive layer 12 and the first conductive member 18x are electrically connected. As a result, the conductive layer 12 and the grounding electrode 17 are electrically connected through the first conductive member 18 x, the conductor 27, and the second conductive member 28.

  Next, the optical member arranging step P6 and the other element arranging step P7 are sequentially executed by the same method as the manufacturing method of the liquid crystal device 100 according to the first embodiment described above. Thereby, the liquid crystal device 200 according to the second embodiment is manufactured. In the liquid crystal device 200 according to the second embodiment manufactured in this way, the conductive layer 12 and the grounding electrode 17 are connected to the first substrate 1 and the first substrate 1 through the first conductive member 18x, the conductor 27, and the second conductive member 28. They are electrically connected on the inner side between the two substrates 2. Therefore, the liquid crystal device 200 can obtain the same effects as those of the second embodiment described above.

(Method for Manufacturing Liquid Crystal Device According to Modification 2 of Second Embodiment)
When the method for manufacturing the liquid crystal device 200 according to the second embodiment is compared with the method for manufacturing the liquid crystal device 200B according to the second modification of the second embodiment, the liquid crystal device 200B according to the second modification of the second embodiment In the manufacturing method, the execution order of the first conductive member arranging step P4 and the conductive layer forming step P5 is reversed as compared with the manufacturing method of the liquid crystal device 200 according to the second embodiment, otherwise the second embodiment. This is the same as the manufacturing method of the liquid crystal device 200 according to the embodiment. Therefore, in the following, the description of the points common to the manufacturing method of the liquid crystal device 200 according to the second embodiment will be omitted.

  FIG. 17 is a manufacturing process diagram of the liquid crystal device 200B according to the second modification of the second embodiment corresponding to the flowchart of FIG. FIG. 17A is a cross-sectional view corresponding to the cutting line B-B ′ of FIG. 13 and shows a conductive layer forming step P5 according to Modification 2 of the second embodiment. FIG. 17B is a cross-sectional view corresponding to FIG. 17A, and shows a first conductive member arranging step P4 according to Modification 2 of the second embodiment. FIG.17 (c) is sectional drawing corresponding to Fig.17 (a), and shows the optical member arrangement | positioning process P6 which concerns on the modification 2 of 2nd Embodiment.

  In the manufacturing method of the liquid crystal device 200B according to the second modification of the second embodiment, first, the first substrate preparation process P1 and the first method are performed in the same method as the manufacturing method of the liquid crystal device 200 according to the second embodiment described above. The liquid crystal display panel 82 is manufactured by executing the second substrate preparation process P2 and the liquid crystal display panel manufacturing process P3.

  Next, the conductive layer forming step P5 is performed. Specifically, in this conductive layer forming step P5, as shown in FIG. 17A, the first substrate 1 side of the second substrate 2 is not closed so as not to close the through hole 2h of the second substrate 2. The conductive layer 12 is formed on the opposite surface using a transparent conductive member such as ITO. As a result, another through hole 12 h is formed in the conductive layer 12 corresponding to the through hole 2 h of the second substrate 2. In the conductive layer forming step P5, the conductive layer 12 may be formed on at least a part of the surface of the through hole 2h of the second substrate 2.

  Next, the first conductive member arranging step P4 is executed. Specifically, in the first conductive member disposing step P4, as shown in FIG. 17B, the second through hole 12h of the conductive layer 12 formed by the conductive layer forming step P5 is used for the second step. A first conductive member 18x such as a conductive paste is disposed (or applied) over the through-hole 2h and the conductor 27 of the substrate 2, and the first conductive member 18x, the conductive layer 12, and the conductor 27 are electrically connected. To do. As a result, the conductive layer 12 and the grounding electrode 17 are electrically connected through the first conductive member 18 x, the conductor 27, and the second conductive member 28.

  Next, the optical member arranging step P6 is executed. Specifically, in the optical member arranging step P6, as shown in FIG. 17C, the polarizing plate 14 is formed on each surface of the first conductive member 18x and the conductive layer 12 opposite to the second substrate 2 side. (Optical member) is disposed, and a polarizing plate 13 (optical member) is disposed on the surface of the first substrate 1 opposite to the liquid crystal layer 15 side.

  Next, the other element arrangement process P7 is executed by the same method as the method for manufacturing the liquid crystal device 100 according to the first embodiment. Thereby, the liquid crystal device 200B according to the second modification of the second embodiment is manufactured. In the liquid crystal device 200B according to the modification of the second embodiment manufactured in this way, the conductive layer 12 and the grounding electrode 17 are connected to the first substrate through the first conductive member 18x, the conductor 27, and the second conductive member 28. Electrical connection is made on the inner side between the first substrate 2 and the second substrate 2. Therefore, the liquid crystal device 200B can obtain the same effects as those of the above-described second embodiment.

(Method for Manufacturing Liquid Crystal Device According to Third Embodiment)
When the method for manufacturing the liquid crystal device 300 according to the third embodiment is compared with the method for manufacturing the liquid crystal device 200 according to the second embodiment, the method for manufacturing the liquid crystal device 300 according to the third embodiment uses the second substrate. The difference between the preparation process P2 and the liquid crystal display panel manufacturing process P3 is that a frame-shaped sealing material forming process P10 is provided, and the content of the liquid crystal display panel manufacturing process P3 is different. Otherwise, the liquid crystal device according to the second embodiment This is the same as the manufacturing method 200. Therefore, in the following, the description of the points common to the manufacturing method of the liquid crystal device 200 according to the second embodiment will be omitted.

  FIG. 18 is a manufacturing process diagram of the liquid crystal device 300 according to the third embodiment corresponding to the flowchart of FIG. 10. FIG. 18A is a cross-sectional view corresponding to the cutting line B-B ′ of FIG. 13 and shows a liquid crystal display panel manufacturing process P3 according to the third embodiment. FIG. 18B is a cross-sectional view corresponding to FIG. 18A and shows a first conductive member arranging step P4 according to the third embodiment. FIG. 18C is a cross-sectional view corresponding to FIG. 18A and shows a conductive layer forming step P5 according to the third embodiment. FIG. 18D is a cross-sectional view corresponding to FIG. 18A and shows an optical member arranging step P6 according to the third embodiment.

  In the manufacturing method of the liquid crystal device 300 according to the third embodiment, first, the first substrate preparation step P1 and the second substrate preparation are performed by the same method as the manufacturing method of the liquid crystal device 200 according to the second embodiment described above. Step P2 is executed.

  Next, the sealing material formation process P10 is performed. Specifically, in this sealing material forming step P10, although not shown, it is one of the first substrate 1 and the second substrate 2 and a part of the grounding electrode 17 (the grounding electrode 17). A frame-shaped sealing material 43 mixed with, for example, a second conductive member 28 such as conductive particles is formed on a region including a part, one end or the connecting portion 17a) or a part of the conductor 27.

  Next, a liquid crystal display panel manufacturing process P3 is executed. Specifically, in the liquid crystal display panel manufacturing process P3, as shown in FIG. 18A, the one surface of the first substrate 1 and the one surface of the second substrate 2 are formed on the first surface. The substrate 1 of the second substrate 2 is opposed so as to form an overhanging region 36 projecting outward from the one end 2 a of the second substrate 2, and the grounding electrode 17 extends from the overhanging region 36 of the first substrate 1 to the second substrate 2. The second conductive member 28 is sandwiched between the conductor 27 and the grounding electrode 17 (a part, one end of the grounding electrode 17 or the connecting portion 17a) so as to be disposed over a region overlapping the conductor 27 in a plane. Thus, the first substrate 1 and the second substrate 2 are bonded together via a frame-shaped sealing material 43, and further, the first substrate, the second substrate, and the frame-shaped sealing material 43 are used. A liquid crystal display panel with a liquid crystal layer 15 sandwiched in the enclosed region 3 to fabricate. As a result, the conductor 27 and the grounding electrode 17 (a part, one end of the grounding electrode 17 or the connection portion 17a) are electrically connected through the second conductive member 28.

  Next, the first conductive member arranging step P4 is executed. Specifically, in the first conductive member arranging step P4, as shown in FIG. 18B, the first conductive member 18x such as a conductive paste is arranged in the through hole 2h of the second substrate 2, for example. Then, the first conductive member 18x and the conductor 27 are electrically connected.

  Next, the conductive layer forming step P5 is performed. Specifically, in this conductive layer forming step P5, as shown in FIG. 18C, on each surface of the first conductive member 18x and the second substrate 2 opposite to the first substrate 1 side, For example, the conductive layer 12 is formed using a transparent conductive member such as ITO, and the conductive layer 12 and the first conductive member 18x are electrically connected. As a result, the conductive layer 12 and the grounding electrode 17 are electrically connected through the first conductive member 18 x, the conductor 27, and the second conductive member 28.

  Next, the optical member arranging step P6 is executed. Specifically, in the optical member arranging step P6, as shown in FIG. 18D, the polarizing plate 14 (optical member) is arranged on the surface of the conductive layer 12 opposite to the first conductive member 18x side. At the same time, a polarizing plate 13 (optical member) is disposed on the surface of the first substrate 1 opposite to the liquid crystal layer 15 side.

  Next, the other element arrangement process P7 is executed by the same method as the method for manufacturing the liquid crystal device 100 according to the first embodiment. Thereby, the liquid crystal device 300 according to the third embodiment is manufactured. In the liquid crystal device 300 according to the third embodiment manufactured as described above, the conductive layer 12 and the ground electrode 17 are connected to the first substrate 1 and the first substrate 1 through the first conductive member 18x, the conductor 27, and the second conductive member 28. They are electrically connected on the inner side between the two substrates 2. Therefore, the liquid crystal device 300 can obtain the same effects as those of the third embodiment described above.

(Manufacturing method of a liquid crystal device according to a modification of the third embodiment)
When the method for manufacturing the liquid crystal device 300 according to the third embodiment is compared with the method for manufacturing the liquid crystal device 300B according to the third modification of the third embodiment, the liquid crystal device 300B according to the third modification of the third embodiment In the manufacturing method, the execution order of the first conductive member arranging step P4 and the conductive layer forming step P5 is reversed compared to the manufacturing method of the liquid crystal device 300 according to the third embodiment, and otherwise the third embodiment. This is the same as the manufacturing method of the liquid crystal device 300 according to the embodiment. Therefore, in the following, the description of the points common to the manufacturing method of the liquid crystal device 300 according to the third embodiment will be omitted.

  FIG. 19 is a manufacturing process diagram of a liquid crystal device 300B according to Modification 3 of the third embodiment corresponding to the flowchart of FIG. FIG. 19A is a cross-sectional view corresponding to the cutting line B-B ′ of FIG. 13 and shows a conductive layer forming step P5 according to Modification 3 of the third embodiment. FIG. 19B is a cross-sectional view corresponding to FIG. 19A and shows a conductive member arranging step P4 according to Modification 3 of the third embodiment. FIG.19 (c) is sectional drawing corresponding to Fig.19 (a), and shows the optical member arrangement | positioning process P6 which concerns on the modification 3 of 3rd Embodiment.

  In the manufacturing method of the liquid crystal device 300B according to the third modification of the third embodiment, first, the first substrate preparation step P1 and the first method are performed in the same manner as the manufacturing method of the liquid crystal device 300 according to the third embodiment described above. 2 substrate preparation process P2, liquid crystal display panel manufacturing process P3, and sealing material formation process P10 are performed.

  Next, the conductive layer forming step P5 is performed. Specifically, in this conductive layer forming step P5, as shown in FIG. 19A, the first substrate 1 side of the second substrate 2 and the through-hole 2h of the second substrate 2 are not closed. The conductive layer 12 is formed on the opposite surface using a transparent conductive member such as ITO. As a result, another through hole 12 h is formed in the conductive layer 12 corresponding to the through hole 2 h of the second substrate 2. In the conductive layer forming step P5, the conductive layer 12 may be formed on at least a part of the surface of the through hole 2h of the second substrate 2.

  Next, the first conductive member arranging step P4 is executed. Specifically, in the first conductive member disposing step P4, as shown in FIG. 19B, the second through hole 12h of the conductive layer 12 formed in the conductive layer forming step P5 is used for the second process. A first conductive member 18x such as a conductive paste is disposed (or applied) over the through-hole 2h and the conductor 27 of the substrate 2, and the first conductive member 18x, the conductive layer 12, and the conductor 27 are electrically connected. To do.

  Next, the optical member arranging step P6 is executed. Specifically, in the optical member arranging step P6, as shown in FIG. 19C, the polarizing plate 14 is formed on each surface of the first conductive member 18x and the conductive layer 12 opposite to the second substrate 2 side. (Optical member) is disposed, and a polarizing plate 13 (optical member) is disposed on the surface of the first substrate 1 opposite to the liquid crystal layer 15 side.

  Next, the other element arrangement process P7 is executed by the same method as the method for manufacturing the liquid crystal device 100 according to the first embodiment. Thereby, the liquid crystal device 300B according to the third modification of the third embodiment is manufactured. In the liquid crystal device 300B according to Modification 3 of the third embodiment manufactured in this way, the conductive layer 12 and the grounding electrode 17 are connected to the first through the first conductive member 18x, the conductor 27, and the second conductive member 28. Electrical connection is made on the inner side between the substrate 1 and the second substrate 2. Therefore, the liquid crystal device 300B can obtain the same effects as those of the third embodiment described above.

[Electronics]
Next, the liquid crystal device according to the first to third embodiments of the present invention, the other embodiments, and the modifications 1 to 3 (hereinafter, representatively referred to as “the liquid crystal device 1000 of the present invention”). A specific example of an electronic device to which can be applied will be described with reference to FIG.

  First, an example in which the liquid crystal device 1000 of the present invention is applied to a display unit of a portable personal computer (so-called notebook personal computer) will be described. FIG. 20A is a perspective view showing the configuration of this personal computer. As shown in the figure, the personal computer 710 includes a main body 712 having a keyboard 711 and a display 713 to which the liquid crystal device 1000 of the present invention is applied as a panel.

  Next, an example in which the liquid crystal device 1000 of the present invention is applied to a display unit of a mobile phone will be described. FIG. 20B is a perspective view showing the configuration of this mobile phone. As shown in the figure, a cellular phone 720 includes a plurality of operation buttons 721, a reception port 722, a transmission port 723, and a display unit 724 to which the liquid crystal device 1000 of the present invention is applied.

  Electronic devices to which the liquid crystal device 1000 according to the embodiment of the present invention can be applied include a liquid crystal television, a personal computer shown in FIG. 20A and a mobile phone shown in FIG. A viewfinder type / monitor direct-view type video tape recorder, a car navigation device, a pager, an electronic notebook, a calculator, a word processor, a workstation, a video phone, a POS terminal, a digital still camera, and the like.

1 is a plan view of a liquid crystal device according to a first embodiment of the present invention. FIG. 3 is a plan view showing a pixel configuration of the liquid crystal device according to the first embodiment. FIG. 3 is a cross-sectional view corresponding to a sub-pixel of the liquid crystal device according to the first embodiment. Sectional drawing which shows the static electricity countermeasure structure of the liquid crystal device which concerns on 1st Embodiment etc. Sectional drawing which shows the static electricity countermeasure structure of the liquid crystal device which concerns on a comparative example. Sectional drawing which shows the static electricity countermeasure structure of the liquid crystal device which concerns on 2nd Embodiment. Sectional drawing which shows the static electricity countermeasure structure of the liquid crystal device which concerns on the other aspect of 2nd Embodiment. Sectional drawing which shows the static electricity countermeasure structure of the liquid crystal device which concerns on 3rd Embodiment. Sectional drawing which shows the static electricity countermeasure structure of the liquid crystal device which concerns on the modification of 1st thru | or 3rd embodiment. 5 is a flowchart showing a method for manufacturing a liquid crystal device according to the present invention. FIG. 5 is a plan view showing a manufacturing process of the liquid crystal device according to the first embodiment. FIG. 5 is a plan view showing a manufacturing process of the liquid crystal device according to the first embodiment. FIG. 5 is a plan view showing a manufacturing process of the liquid crystal device according to the first embodiment. Sectional drawing which shows the manufacturing process of the liquid crystal device which concerns on 1st Embodiment. Sectional drawing which shows the manufacturing process of the liquid crystal device which concerns on the modification 1 of 1st Embodiment. Sectional drawing which shows the manufacturing process of the liquid crystal device which concerns on 2nd Embodiment. Sectional drawing which shows the manufacturing process of the liquid crystal device which concerns on the modification 2 of 2nd Embodiment. Sectional drawing which shows the manufacturing process of the liquid crystal device which concerns on 3rd Embodiment. Sectional drawing which shows the manufacturing process of the liquid crystal device which concerns on the modification 3 of 3rd Embodiment. FIG. 14 is a perspective view of an electronic apparatus to which the liquid crystal device of the invention is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 1st board | substrate, 2 2nd board | substrate, 2a one end, 2h Through-hole, 3 Common electrode, 9 Pixel electrode, 12 Conductive layer, 12h Other through-holes 13, 13, 14 Polarizing plate (optical member), 15 Liquid crystal layer , 17 grounding electrode, 18 conductive member, 18x first conductive member, 27 conductor, 28 second conductive member, 36 projecting region, 81, 82, 83 liquid crystal display panel, 43 frame-shaped sealing material, 43h opening, 100, 100A, 100B, 200, 200A, 200B, 300, 300A, 300B Liquid crystal device

Claims (15)

A first substrate;
A second substrate disposed opposite the first substrate;
An electro-optic material sandwiched between the first substrate and the second substrate;
A common electrode and a pixel electrode formed on the surface of the first substrate on the electro-optic material side;
A conductive layer formed on a surface opposite to the first substrate side of the second substrate,
The second substrate has a through-hole penetrating from the surface on the conductive layer side to the surface on the first substrate side,
The first substrate has a projecting region projecting outward from one end of the second substrate, and extends from the projecting region to a region overlapping with the through hole on the surface of the second substrate. Has an existing grounding electrode,
The electro-optical device, wherein the conductive layer and the grounding electrode are electrically connected through a conductive member disposed from the through hole of the second substrate to the grounding electrode. The first substrate and the second substrate are bonded through a frame-shaped sealing material,
The electro-optical material is enclosed in a region partitioned by the frame-shaped sealing material,
The electro-optical device according to claim 1, wherein the through hole, the conductive member, and the grounding electrode are located outside the frame-shaped sealing material. The first substrate and the second substrate are bonded through a frame-shaped sealing material,
The electro-optical material is enclosed in a region partitioned by the frame-shaped sealing material,
A part of the frame-shaped sealing material is disposed in a region overlapping with the through hole and a part of the grounding electrode,
The frame-shaped sealing material is provided with an opening penetrating from the surface on the second substrate side to the surface on the grounding electrode side,
2. The electro-optical device according to claim 1, wherein the conductive layer and the grounding electrode are electrically connected through the conductive member disposed from the through hole to the opening and the grounding electrode. . A first substrate;
A second substrate disposed opposite the first substrate;
An electro-optic material sandwiched between the first substrate and the second substrate;
A common electrode and a pixel electrode formed on the surface of the first substrate on the electro-optic material side;
A conductive layer formed on a surface opposite to the first substrate side of the second substrate,
The second substrate includes a through-hole penetrating from a surface on the conductive layer side to a surface on the first substrate side, a first conductive member disposed in the through-hole, and a first substrate-side surface. A conductor formed on a surface and electrically connected to the first conductive member;
The first substrate has a projecting region projecting outward from one end of the second substrate, and extends from the projecting region to a region overlapping the conductor in a plane on the second substrate side. A grounding electrode to
The conductive layer and the grounding electrode are electrically connected through the first conductive member, the conductor, and a second conductive member interposed between the conductor and the grounding electrode. An electro-optical device. The conductor extends from a region overlapping the first conductive member disposed in the through hole in a plan view to one end side of the second substrate located on the projecting region side of the first substrate. And
One end of the conductor is electrically connected to the first conductive member, and the other end of the conductor is disposed at a position corresponding to the one end side of the second substrate. Electrically connected to the conductive member,
5. The electro-optical device according to claim 4, wherein the second conductive member is electrically connected to one end of the grounding electrode located in a region overlapping the conductor in a planar manner. The first substrate and the second substrate are bonded through a frame-shaped sealing material,
The electro-optical material is enclosed in a region partitioned by the frame-shaped sealing material,
A part of the frame-shaped sealing material is disposed in a region overlapping at least a part of the conductor and the grounding electrode,
The electro-optical device according to claim 4, wherein the conductor and the grounding electrode are electrically connected through the second conductive member disposed inside the frame-shaped sealing material. The first substrate and the second substrate are bonded through a frame-shaped sealing material,
The electro-optical material is enclosed in a region partitioned by the frame-shaped sealing material,
The through hole, the first conductive member, the conductor, the second conductive member, and the ground electrode arranged in the through hole are provided outside the frame-shaped sealing material. The electro-optical device according to claim 4.   The electro-optical device according to claim 1, wherein the conductive member, the first conductive member, or the second conductive member is made of any one of a conductive paste and conductive particles. .   An electronic apparatus comprising the electro-optical device according to claim 1 as a display unit. A first substrate preparation step of preparing a first substrate having a common electrode, a pixel electrode and a ground electrode on one surface;
A second substrate preparation step of preparing a base material, preparing a second substrate by forming a through-hole in the base material by a predetermined method, and preparing the prepared second substrate; ,
The one surface of the first substrate and the second substrate are opposed to each other so as to form an overhanging region in which the first substrate projects outward from one end of the second substrate, and the grounding Bonding the first substrate and the second substrate so that the electrode for use is disposed from the projecting region of the first substrate to the region overlapping the through hole of the second substrate in a plane; An electro-optical panel manufacturing process for manufacturing an electro-optical panel by sandwiching an electro-optical material between the first substrate and the second substrate;
A conductive member disposing step of disposing a conductive member from the through hole of the second substrate to the grounding electrode and electrically connecting the conductive member and the grounding electrode;
Forming a conductive layer on each surface of the conductive member and the second substrate opposite to the first substrate, and electrically connecting the conductive layer and the conductive member; A method for manufacturing an electro-optical device. A first substrate preparation step of preparing a first substrate having a common electrode, a pixel electrode and a ground electrode on one surface;
A second substrate preparation step of preparing a base material, preparing a second substrate by forming a through-hole in the base material by a predetermined method, and preparing the prepared second substrate; ,
The one surface of the first substrate and the second substrate are opposed to each other so as to form an overhanging region in which the first substrate projects outward from one end of the second substrate, and the grounding Bonding the first substrate and the second substrate so that the electrode for use is disposed from the projecting region of the first substrate to the region overlapping the through hole of the second substrate in a plane; An electro-optical panel manufacturing process for manufacturing an electro-optical panel by sandwiching an electro-optical material between the first substrate and the second substrate;
A conductive layer forming step of forming a conductive layer on a surface of the second substrate opposite to the first substrate so as not to block the through hole of the second substrate;
A conductive member is arranged from another through hole of the conductive layer formed by the conductive layer forming step to the through hole and the grounding electrode of the second substrate, and the conductive layer and the grounding electrode are arranged. And a conductive member disposing step of electrically connecting through the conductive member. A first substrate preparation step of preparing a first substrate having a common electrode, a pixel electrode and a ground electrode on one surface;
A base material is prepared, and a through hole is formed in the base material by a predetermined method, and a conductor is formed on one surface of the base material in a region where at least a part of the through hole is blocked. A second substrate preparation step of preparing the second substrate by preparing the second substrate thus manufactured;
The one surface of the first substrate and the one surface of the second substrate face each other so as to form an overhanging region in which the first substrate projects outward from one end of the second substrate. And a second conductive member is disposed on one surface of the conductor and the grounding electrode, and the grounding electrode extends from the projecting region of the first substrate to the conductor of the second substrate. The first substrate and the second substrate so that the second conductive member is sandwiched between the conductor and the ground electrode And an electro-optical panel manufacturing process for manufacturing an electro-optical panel by sandwiching an electro-optical material between the first substrate and the second substrate;
A conductive member disposing step of disposing a first conductive member in the through hole of the second substrate and electrically connecting the first conductive member and the conductor;
A conductive layer is formed on each surface of the first conductive member and the second substrate opposite to the first substrate side to electrically connect the conductive layer and the first conductive member. A method of manufacturing an electro-optical device. A first substrate preparation step of preparing a first substrate having a common electrode, a pixel electrode and a ground electrode on one surface;
A base material is prepared, and a through hole is formed in the base material by a predetermined method, and a conductor is formed on one surface of the base material in a region where at least a part of the through hole is blocked. A second substrate preparation step of preparing the second substrate by preparing the second substrate thus manufactured;
The one surface of the first substrate and the one surface of the second substrate face each other so as to form an overhanging region in which the first substrate projects outward from one end of the second substrate. And a second conductive member is disposed on one surface of the conductor and the grounding electrode, and the grounding electrode extends from the projecting region of the first substrate to the conductor of the second substrate. The first substrate and the second substrate so that the second conductive member is sandwiched between the conductor and the ground electrode And an electro-optical panel manufacturing process for manufacturing an electro-optical panel by sandwiching an electro-optical material between the first substrate and the second substrate;
A conductive layer forming step of forming a conductive layer on a surface of the second substrate opposite to the first substrate so as not to block the through hole of the second substrate;
A first conductive member is arranged from another through hole of the conductive layer formed by the conductive layer forming step to the through hole and the conductor of the second substrate, and the first conductive member and the conductive layer are arranged. And a conductive member disposing step of electrically connecting the layer and the conductor. A first substrate preparation step of preparing a first substrate having a common electrode, a pixel electrode and a ground electrode on one surface;
A base material is prepared, and a through hole is formed in the base material by a predetermined method, and a conductor is formed on one surface of the base material in a region where at least a part of the through hole is blocked. A second substrate preparation step of preparing the second substrate by preparing the second substrate thus manufactured;
A frame-shaped seal in which a second conductive member is mixed on a region including one part of the grounding electrode or part of the conductor, which is one of the first substrate and the second substrate A sealing material forming step for forming a material;
The one surface of the first substrate and the one surface of the second substrate face each other so as to form an overhanging region in which the first substrate projects outward from one end of the second substrate. And the second conductive member is disposed between the projecting region of the first substrate and a region overlapping the conductor of the second substrate in a plane. The first substrate and the second substrate are bonded together via the frame-shaped sealing material so as to be sandwiched between the grounding electrodes, and further, the first substrate and the second substrate An electro-optical panel manufacturing process for manufacturing an electro-optical panel by enclosing an electro-optical material in a region surrounded by the frame-shaped sealing material;
A conductive member disposing step of disposing a first conductive member in the through hole of the second substrate and electrically connecting the first conductive member and the conductor;
A conductive layer is formed on each surface of the first conductive member and the second substrate opposite to the first substrate side to electrically connect the conductive layer and the first conductive member. A method of manufacturing an electro-optical device. A first substrate preparation step of preparing a first substrate having a common electrode, a pixel electrode and a ground electrode on one surface;
A base material is prepared, and a through hole is formed in the base material by a predetermined method, and a conductor is formed on one surface of the base material in a region where at least a part of the through hole is blocked. A second substrate preparation step of preparing the second substrate by preparing the second substrate thus manufactured;
A frame-shaped seal in which a second conductive member is mixed on a region including one part of the grounding electrode or part of the conductor, which is one of the first substrate and the second substrate A sealing material forming step for forming a material;
The one surface of the first substrate and the one surface of the second substrate face each other so as to form an overhanging region in which the first substrate projects outward from one end of the second substrate. And the second conductive member is disposed between the projecting region of the first substrate and a region overlapping the conductor of the second substrate in a plane. The first substrate and the second substrate are bonded together via the frame-shaped sealing material so as to be sandwiched between the grounding electrodes, and further, the first substrate and the second substrate An electro-optical panel manufacturing process for manufacturing an electro-optical panel by enclosing an electro-optical material in a region surrounded by the frame-shaped sealing material;
A conductive layer forming step of forming a conductive layer on a surface of the second substrate opposite to the first substrate so as not to block the through hole of the second substrate;
A first conductive member is arranged from another through hole of the conductive layer formed by the conductive layer forming step to the through hole and the conductor of the second substrate, and the first conductive member and the conductive layer are arranged. And a conductive member disposing step of electrically connecting the layer and the conductor.

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