CN113299714B - Display module, display device and manufacturing method - Google Patents
Display module, display device and manufacturing method Download PDFInfo
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- CN113299714B CN113299714B CN202110558376.4A CN202110558376A CN113299714B CN 113299714 B CN113299714 B CN 113299714B CN 202110558376 A CN202110558376 A CN 202110558376A CN 113299714 B CN113299714 B CN 113299714B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 54
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- 238000005452 bending Methods 0.000 claims description 115
- 239000002184 metal Substances 0.000 claims description 115
- 229910052751 metal Inorganic materials 0.000 claims description 115
- 230000001681 protective effect Effects 0.000 claims description 84
- 239000003292 glue Substances 0.000 claims description 51
- 239000012044 organic layer Substances 0.000 claims description 45
- 239000000853 adhesive Substances 0.000 claims description 30
- 230000001070 adhesive effect Effects 0.000 claims description 30
- 238000001514 detection method Methods 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 29
- 230000000694 effects Effects 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
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- 238000005516 engineering process Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
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- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000003068 static effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a display module, a display device and a manufacturing method, wherein the display module comprises: the display module comprises a substrate, a driving circuit layer and a cover plate, wherein the driving circuit layer and the cover plate are sequentially arranged on the substrate in a stacked mode, the display module comprises a display area and a non-display area, the non-display area comprises a conductive opening, a first conductive structure, a second conductive structure and a conductive output part, the conductive opening is filled with a conductive medium, and the conductive medium is used for leading out the first conductive structure, leading in the charges on one side of the cover plate away from the substrate into the second conductive structure, and leading in the conductive output part through the second conductive structure so as to prevent the charges from entering the driving circuit layer. The display module can prevent charges on the cover plate from entering the driving circuit layer, so that the display module can work normally, and the display module has wide application prospect.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display module, a display device, and a manufacturing method.
Background
With the increasing demands of customers and markets on OLED screens, new technologies applied to OLEDs are increasing, such as integrated touch structures (FMLOC) and back films (U-Film), which also raise other problems. For example, in the testing process of the OLED screen, the problem that electrostatic charges generated in the testing process enter the driving circuit to cause abnormal circuits occurs.
Disclosure of Invention
In order to solve at least one of the above problems, a first embodiment of the present invention provides a display module including a substrate, a driving circuit layer and a cover plate sequentially stacked on the substrate, the display module including a display region and a non-display region, the non-display region including a conductive opening, a first conductive structure, a second conductive structure and a conductive output portion, wherein
The conductive opening is filled with a conductive medium, and is used for guiding charges of one side, away from the substrate, of the cover plate, which is led out from the first conductive structure, into the second conductive structure, and guiding the charges into the conductive output part through the second conductive structure so as to prevent the charges from entering the driving circuit layer.
In a specific example, the display module includes a touch control organic layer disposed on a side of the driving circuit layer, which is close to the cover plate, and the non-display area includes a bending portion for bending a signal line of the display module to a backlight side of the display module;
the conductive opening is a through hole penetrating through the touch control organic layer of the bending part.
In one specific example of this embodiment, the method comprises,
the first conductive structure is positioned at the bending part and at least comprises first protective glue;
the display area further comprises a metal grid pattern layer arranged on one side of the touch organic layer close to the substrate, and the second conductive structure is positioned at the bending part and is auxiliary metal arranged on the same layer as the metal grid pattern layer;
the conductive output part is positioned at the bending part and is a crack detection signal line which is arranged on the same layer as the source-drain layer of the driving circuit layer.
In a specific example, the bending part comprises a central area and an edge area which is arranged at the edge of the central area and corresponds to the conductive opening, the bending part comprises a second protective adhesive arranged at the central area and a third protective adhesive arranged at the edge area, and the first conductive structure is positioned at the bending part and at least comprises the third protective adhesive;
the display area further comprises a metal grid pattern layer arranged on one side of the touch organic layer close to the substrate, and the second conductive structure is positioned at the bending part and is auxiliary metal arranged on the same layer as the metal grid pattern layer;
the conductive output part is positioned at the bending part and is a crack detection signal line which is arranged on the same layer as the source-drain layer of the driving circuit layer.
In a specific example, the first conductive structure is located at the bending part and at least includes a first protective glue;
the display area also comprises a metal grid pattern layer arranged on one side of the touch control organic layer close to the substrate, the display module also comprises an integrated touch control structure,
the second conductive structure is positioned at the bending part and is an auxiliary metal arranged at the same layer as the metal grid pattern layer, the conductive output part is positioned at the bending part and is a grounding signal wire of the integrated touch structure arranged at the same layer as the metal grid pattern layer,
or alternatively
The second conductive structure and the conductive output part are positioned at the bending part and are grounding signal wires of the integrated touch structure, wherein the grounding signal wires and the metal grid pattern layer are arranged on the same layer.
In a specific example, the bending part comprises a central area and an edge area which is arranged at the edge of the central area and corresponds to the conductive opening, the bending part comprises a second protective adhesive arranged at the central area and a third protective adhesive arranged at the edge area, and the first conductive structure is positioned at the bending part and at least comprises the third protective adhesive;
the display area also comprises a metal grid pattern layer arranged on one side of the touch control organic layer close to the substrate, the display module also comprises an integrated touch control structure,
the second conductive structure is positioned at the bending part and is an auxiliary metal arranged at the same layer as the metal grid pattern layer, the conductive output part is positioned at the bending part and is a grounding signal wire of the integrated touch structure arranged at the same layer as the metal grid pattern layer,
or alternatively
The second conductive structure and the conductive output part are positioned at the bending part and are grounding signal wires of the integrated touch structure, wherein the grounding signal wires and the metal grid pattern layer are arranged on the same layer.
In a specific example, the conductive medium is a conductive paste, or Ag/conductive liquid.
A second embodiment of the present invention provides a display device including a display module set as described in the first embodiment.
A third embodiment of the present invention provides a method for manufacturing the display module set according to the first embodiment, including sequentially stacking a driving circuit layer and a cover plate on a substrate, where the display module set includes a display area and a non-display area, and further includes:
forming a conductive output portion in the non-display region;
forming a second conductive structure in the non-display area;
forming a conductive opening in the non-display area, and filling the conductive opening with a conductive medium;
and forming a first conductive structure in the non-display area, wherein the first conductive structure guides charges on one side of the cover plate far away from the substrate to the conductive opening, guides the charges into the second conductive structure through the conductive opening, and guides the charges into the conductive output part through the second conductive structure so as to prevent the charges from entering the driving circuit layer.
In a specific example, the display module includes a touch organic layer disposed on a side of the driving circuit layer near the cover plate, the display area further includes a metal mesh pattern layer disposed on a side of the touch organic layer near the substrate, and the non-display area includes a bending portion for bending a signal line of the display module to a backlight side of the display module;
the forming of the conductive output portion in the non-display area further includes: a conductive output portion is formed on the substrate of the bent portion,
the conductive output part is a crack detection signal line which is arranged on the same layer as the source-drain layer of the driving circuit layer;
or alternatively
The conductive output part is a grounding signal line of the integrated touch structure, and the grounding signal line and the metal grid pattern layer are arranged on the same layer;
the forming the second conductive structure in the non-display region further includes: forming a second conductive structure on the substrate of the bending part, wherein the second conductive structure is auxiliary metal arranged on the same layer as the metal grid pattern layer;
or alternatively
The forming a conductive output in the non-display region and forming a second conductive structure in the non-display region further comprises:
forming a conductive output part and a second conductive structure on the substrate of the bending part, wherein the conductive output part and the second conductive structure are grounding signal lines of the integrated touch structure, which are arranged on the same layer as the metal grid pattern layer;
the forming a conductive opening in the non-display region further comprises:
forming a through hole penetrating through the touch control organic layer of the bending part;
the forming the first conductive structure in the non-display region further includes:
forming first protective glue at the bending part, wherein the first protective glue fills the conductive opening;
or alternatively
The bending part comprises a central area and an edge area which is arranged at the edge of the central area and corresponds to the conductive opening, a second protective adhesive arranged in the central area and a third protective adhesive arranged in the edge area are formed on the wrapping surface of the bending part, and the third protective adhesive fills the conductive opening.
The beneficial effects of the invention are as follows:
aiming at the existing problems at present, the invention designs a display module, a display device and a manufacturing method, and leads the accumulated charges on the cover plate led out from the first conductive structure into the second conductive structure through the arranged conductive opening, and leads the accumulated charges into the conductive output part through the second conductive structure to prevent the accumulated charges from entering the driving circuit layer, thereby ensuring the normal operation of the driving circuit and having wide application prospect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 shows a schematic diagram of a test method according to an embodiment of the present invention;
FIGS. 2a-2b are schematic diagrams showing charge patterns of the display module during testing according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a display module according to an embodiment of the invention;
fig. 4 is a schematic view showing a bending area of the display module according to an embodiment of the invention;
FIG. 5 is a top view of a bending area of the display module according to an embodiment of the invention;
FIG. 6 is a cross-sectional view of a bending area of a display module according to an embodiment of the invention;
FIG. 7 is a top view of a bending area of a display module according to another embodiment of the invention;
FIG. 8 is a top view of a bending area of a display module according to another embodiment of the invention;
FIG. 9 is a cross-sectional view showing a bending area of a display module according to still another embodiment of the present invention;
FIG. 10 is a top view of a bending area of a display module according to another embodiment of the invention;
fig. 11 shows a flow chart of a method of making according to another embodiment of the invention.
Detailed Description
In order to more clearly illustrate the present invention, the present invention will be further described with reference to preferred embodiments and the accompanying drawings. Like parts in the drawings are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and that this invention is not limited to the details given herein.
It should be noted that, as used herein, "on … …", "formed on … …", and "disposed on … …" may mean that one layer is directly formed or disposed on another layer, or that one layer is indirectly formed or disposed on another layer, i.e., that other layers are present between the two layers. In this document, unless otherwise indicated, the term "in the same layer" is used to mean that two layers, components, members, elements, or portions may be formed by the same patterning process, and that the two layers, components, members, elements, or portions are generally formed of the same material. In this context, unless otherwise indicated, the expression "patterning process" generally includes the steps of coating of photoresist, exposure, development, etching, stripping of photoresist, and the like. The expression "one patterning process" means a process of forming a patterned layer, feature, component, etc. using a single mask.
In the prior art, a copper bar is generally used to test a display module, specifically, as shown in fig. 1, a copper bar 3 is used to perform a friction test on an edge of the display module, for example, the copper bar 3 is used to perform a friction test along a display area 1 of the display module by taking a rectangular edge of the display area 1 as a test path, and the test path is encircled. As shown in fig. 2a and 2b, during the friction test, the copper bar 3 rubs against the cover plate 105 of the display module to generate a great amount of negative charges, and the heat dissipation film (SCF) 4 disposed on the far side of the display module from the light emitting side induces static electricity to generate positive charges, so that charges of the film layer 103 in the driving circuit layer of the display module are rearranged, causing a great amount of negative charges to enter the driving circuit layer and gather on the surface of the film layer 103, as shown in 1031, so that the thin film transistors T3 and T4 in the circuit of the driving circuit layer work abnormally, thereby affecting the first driving voltage VSS of the display module, causing the display module to display abnormally.
In view of the above problems, as shown in fig. 3 and 4, one embodiment of the present invention provides a display module including a substrate, a driving circuit layer and a cover plate sequentially stacked on the substrate, the display module including a display region and a non-display region, the non-display region including a conductive opening, a first conductive structure, a second conductive structure and a conductive output portion, wherein
The conductive opening is filled with a conductive medium, and is used for guiding charges of one side, away from the substrate, of the cover plate, which is led out from the first conductive structure, into the second conductive structure, and guiding the charges into the conductive output part through the second conductive structure so as to prevent the charges from entering the driving circuit layer.
According to the embodiment, the electric charges accumulated on the cover plate led out by the first conductive structure are led into the second conductive structure through the arranged conductive opening, and the electric charges accumulated on the cover plate led out by the first conductive structure are led into the conductive output part through the second conductive structure so as to be prevented from entering the driving circuit layer, so that the driving circuit is ensured to work normally, and the driving circuit has a wide application prospect.
In consideration of the narrow frame design, in a specific example, as shown in fig. 3, the non-display area 2 includes a bending portion 20 for bending the signal line of the display module to the backlight side of the display module, as shown in fig. 4, the non-display area corresponding to the bending portion includes a substrate 201, a driving circuit layer 202 and a touch organic layer 203 sequentially stacked on the substrate, and the conductive opening 2031 is a through hole penetrating the touch organic layer 203 of the bending portion.
In this embodiment, as shown in fig. 4, the conductive opening 2031 is disposed at the bending portion of the non-display area to avoid increasing the frame width of the display module, the conductive opening 2031 penetrates through the touch organic layer 203, specifically, a conductive medium filled in the conductive opening 2031 is electrically connected with the first conductive structure 204 to introduce charges collected on the cover plate, the polarizer and each film layer, and introduce the charges into the second conductive structure 207, and the second conductive structure 207 introduces the charges into the conductive output portion 206, so as to avoid that the charges on the cover plate enter the driving circuit layer to affect the normal operation of the display module.
In a specific embodiment, as shown in fig. 5 and fig. 6, the first conductive structure 204 is located at the bending portion and includes at least a first protective glue 2041; the display area further includes a metal grid pattern layer disposed on a side of the touch organic layer 203, which is close to the substrate, and the second conductive structure 207 is disposed at the bending portion and is an auxiliary metal disposed on the same layer as the metal grid pattern layer; the conductive output portion 206 is located at the bending portion and is a crack detection signal line arranged on the same layer as the source/drain layer of the driving circuit layer.
In this embodiment, fig. 5 is a top view (not shown as a cover plate), and fig. 6 is a cross-sectional view of AA' in fig. 5, including a crack detection signal line as the conductive output portion 206, an auxiliary metal as the second conductive structure 207, a conductive opening 2031, and a first protective glue 2041 as the first conductive structure 204.
The first protective glue 2041 is conductive protective glue, and is used for preventing cracks from occurring at the bending part. In this embodiment, the charges accumulated on the cover plate, the polarizer and the film layers are introduced into the conductive medium of the conductive openings 2031 of the touch organic layer 203 through the first protective glue 2041. The auxiliary metal 207 as the second conductive structure introduces the electric charge to the crack detection signal line 206 of the crack detection structure for crack detection, and one end of the crack detection signal line 206 is connected to the ground of the display module.
It should be noted that, the metal mesh pattern layer is not specifically limited in this application, and those skilled in the art should select the first metal mesh pattern layer TMA or the second metal mesh pattern layer TMB or the auxiliary metal in the first metal mesh pattern layer TMA and the second metal mesh pattern layer TMB according to the actual application requirement.
In the present embodiment, the following charge transfer paths are formed: the electric charges accumulated on the cover plate, the polaroid and the film layers, the first protective glue, the conductive openings and the auxiliary metal are led out from the crack detection signal line, so that the electric charges accumulated on the cover plate, the polaroid and the film layers are prevented from entering the driving circuit layer to influence the normal operation of the driving circuit, the display effect of the display module is effectively improved, the user experience is improved, and the display module has a wide application prospect.
In a specific example, the following details are made for the display module:
first, a conductive output portion is formed in a non-display area.
Specifically, a driving circuit layer is formed on the substrate, and the driving circuit layer comprises a source electrode, a drain electrode and a crack detection signal line which is arranged on the same layer as the source electrode and the drain electrode and serves as the conductive output part.
And secondly, forming a second conductive structure in the non-display area.
Specifically, an auxiliary metal which is arranged on the same layer as the metal grid pattern layer and serves as the second conductive structure is formed on the substrate.
Again, conductive openings are formed in the non-display area.
Specifically, a touch organic layer is formed on the substrate, and at the same time, a conductive opening is formed on the touch organic layer corresponding to a bending part of the display module, wherein the bending part is a region for bending a signal line of the display module to a backlight side of the display module, and a through hole which is used as the conductive opening and penetrates through the touch organic layer is formed on the touch organic layer corresponding to the region.
Finally, a first conductive structure is formed in the non-display area.
Specifically, a first protective adhesive serving as the first conductive structure is formed at the bending part, meanwhile, the first protective adhesive is used as a conductive medium to fill the conductive opening, and the first protective adhesive is used for preventing cracks from being generated at the bending part and guiding out charges accumulated near the cover plate.
In the present embodiment, the following charge transfer paths are formed: the electric charges accumulated on the cover plate, the polaroid and the film layers, the first protective glue, the conductive openings and the auxiliary metal are led out from the crack detection signal line, so that the electric charges accumulated on the cover plate, the polaroid and the film layers are prevented from entering the driving circuit layer to influence the normal operation of the driving circuit, the display effect of the display module is effectively improved, the user experience is improved, and the display module has a wide application prospect.
In a specific embodiment, as shown in fig. 6 and fig. 7, the bending portion includes a central area and an edge area disposed at an edge of the central area and disposed corresponding to the conductive opening, the bending portion includes a second protective glue 2043 disposed at the central area and a third protective glue 2042 disposed at the edge area, and the first conductive structure 204 is located at the bending portion and includes at least the third protective glue 2042; the display area further comprises a metal grid pattern layer arranged on one side of the touch control organic layer close to the substrate, the second conductive structure is positioned at the bending part and is an auxiliary metal 207 arranged on the same layer as the metal grid pattern layer; the conductive output portion is located at the bending portion and is a crack detection signal line 206 that is disposed on the same layer as the source/drain layer of the driving circuit layer.
In this embodiment, fig. 7 is a top view of the bending portion (not shown in the cover plate), including a central area and an edge area, wherein the central area is provided with a second protective glue 2043, and the edge area is provided with a third protective glue 2042. Fig. 6 is a cross-sectional view of fig. 7AA', including a crack detection signal line as the conductive output 206, an auxiliary metal as the second conductive structure 207, a conductive opening 2031, and a third protective glue 2042 as the first conductive structure 204.
The second protective glue 2043 is a non-conductive protective glue for preventing cracks from occurring at the bending part, and the third protective glue 2042 is a conductive protective glue for guiding out accumulated charges on the film layer near the cover plate. In this embodiment, the accumulated charges are introduced into the conductive medium of the conductive opening 2031 of the touch organic layer 203 through the third protective glue 2042. The auxiliary metal 207 as the second conductive structure introduces the electric charge to the crack detection signal line 206 of the crack detection structure for crack detection, and one end of the crack detection signal line 206 is connected to the ground of the display module.
It should be noted that, the metal mesh pattern layer is not specifically limited in this application, and those skilled in the art should select the auxiliary metal in the first metal mesh pattern layer TMA or the second metal mesh pattern layer TMB, or the auxiliary metal in the first metal mesh pattern layer TMA and the second metal mesh pattern layer TMB according to the actual application requirements.
In the present embodiment, the following charge transfer paths are formed: the electric charges accumulated on the cover plate, the polaroid and the film layers, the third protective adhesive, the conductive openings and the auxiliary metal are led out from the crack detection signal line, so that the electric charges accumulated on the cover plate, the polaroid and the film layers are prevented from entering the driving circuit layer to influence the normal operation of the driving circuit, the display effect of the display module is effectively improved, the user experience is improved, and the display module has a wide application prospect.
In a specific example, the following details are made for the display module:
first, a conductive output portion is formed in a non-display area.
Specifically, a driving circuit layer is formed on the substrate, and the driving circuit layer comprises a source electrode, a drain electrode and a crack detection signal line which is arranged on the same layer as the source electrode and the drain electrode and serves as the conductive output part.
And secondly, forming a second conductive structure in the non-display area.
Specifically, an auxiliary metal which is arranged on the same layer as the metal grid pattern layer and serves as the second conductive structure is formed on the substrate.
Again, conductive openings are formed in the non-display area.
Specifically, a touch organic layer is formed on the substrate, and at the same time, a conductive opening is formed on the touch organic layer corresponding to a bending part of the display module, wherein the bending part is a region for bending a signal line of the display module to a backlight side of the display module, and a through hole which is used as the conductive opening and penetrates through the touch organic layer is formed on the touch organic layer corresponding to the region.
Finally, a first conductive structure is formed in the non-display area.
Specifically, the second protective glue is formed in the central area at the bending part, the third protective glue serving as the first conductive structure is formed in the edge area, the third protective glue is electrically connected with the first open end, the third protective glue is used for preventing cracks from occurring at the bending part, and charges accumulated near the cover plate are led out.
In the present embodiment, the following charge transfer paths are formed: the electric charges accumulated on the cover plate, the polaroid and the film layers, the third protective adhesive, the conductive openings and the auxiliary metal are led out from the crack detection signal line, so that the electric charges accumulated on the cover plate, the polaroid and the film layers are prevented from entering the driving circuit layer to influence the normal operation of the driving circuit, the display effect of the display module is effectively improved, the user experience is improved, and the display module has a wide application prospect.
In a specific embodiment, as shown in fig. 8 and 9, the first conductive structure is located at the bending portion and includes at least a first protective glue 2041; the display area further comprises a metal grid pattern layer arranged on one side of the touch organic layer, which is close to the substrate, the display module further comprises an integrated touch structure, the second conductive structure is arranged at the bending part and is an auxiliary metal 207 arranged on the same layer as the metal grid pattern layer, the conductive output part is arranged at the bending part and is a grounding signal wire 206 of the integrated touch structure arranged on the same layer as the metal grid pattern layer, or the second conductive structure and the conductive output part are arranged at the bending part and is a grounding signal wire 206 of the integrated touch structure arranged on the same layer as the metal grid pattern layer.
In this embodiment, fig. 8 is a top view of the bending portion (not shown in the cover plate), and fig. 9 is a cross-sectional view of BB' in fig. 8, including the ground signal line 207 as the conductive output portion 206 of the integrated touch structure disposed on the same layer as the metal grid pattern layer, the conductive opening 2031, and the first protective glue 2041 as the first conductive structure 204.
The first protective glue 2041 is conductive protective glue, and is used for preventing cracks from occurring at the bending part. In this embodiment, the charges accumulated on the cover plate, the polarizer and the film layers are introduced into the conductive medium of the conductive openings 2031 of the touch organic layer 203 through the first protective glue 2041. The auxiliary metal 207 as the second conductive structure introduces the electric charge to the ground signal line 206 of the integrated touch structure as the conductive output. Alternatively, the second conductive structure and the conductive output portion are both the ground signal line 206 of the integrated touch structure.
It should be noted that, the metal mesh pattern layer is not specifically limited in this application, and those skilled in the art should select the auxiliary metal in the first metal mesh pattern layer TMA or the second metal mesh pattern layer TMB or select the auxiliary metal in the first metal mesh pattern layer TMA and the second metal mesh pattern layer TMB according to the actual application requirements.
In the present embodiment, the following charge transfer paths are formed: the cover plate, the polaroid and the electric charges accumulated on each film layer, the first protective glue, the conductive opening and the auxiliary metal are led out from the grounding signal wire of the integrated touch structure, so that the phenomenon that the electric charges accumulated on the cover plate, the polaroid and each film layer enter the driving circuit layer to influence the normal operation of the driving circuit is avoided, the display effect of the display module is effectively improved, the user experience is improved, and the display module has a wide application prospect.
In a specific example, the following details are made for the display module:
in an alternative example of this, the first and second embodiments,
first, a conductive output portion is formed in a non-display area.
Specifically, a grounding signal line which is arranged on the same layer as the metal grid pattern layer and is used as an integrated touch structure of the conductive output part is formed on the substrate.
And secondly, forming a second conductive structure in the non-display area.
Specifically, an auxiliary metal which is arranged on the same layer as the metal grid pattern layer and is used as the second conductive structure is formed on the substrate, and the auxiliary metal is electrically connected with the conductive output part.
In a further alternative example of this embodiment,
first, a conductive output portion and a second conductive structure are formed in a non-display region.
Specifically, a grounding signal line which is arranged on the same layer as the metal grid pattern layer and is used as the conductive output part and the grounding signal line of the integrated touch structure of the second conductive structure is formed on the substrate.
Again, conductive openings are formed in the non-display area.
Specifically, a touch organic layer is formed on the substrate, and at the same time, a conductive opening is formed on the touch organic layer corresponding to a bending part of the display module, wherein the bending part is a region for bending a signal line of the display module to a backlight side of the display module, and a through hole which is used as the conductive opening and penetrates through the touch organic layer is formed on the touch organic layer corresponding to the region.
Finally, a first conductive structure is formed in the non-display area.
Specifically, a first protective adhesive serving as the first conductive structure is formed at the bending part, meanwhile, the first protective adhesive is used as a conductive medium to fill the conductive opening, and the first protective adhesive is used for preventing cracks from being generated at the bending part and guiding out charges accumulated near the cover plate.
In the present embodiment, the following charge transfer paths are formed: the electric charges accumulated on the cover plate, the polaroid and each film layer, namely the first protective glue, the conductive holes, the auxiliary metal and the grounding signal wire of the integrated touch structure are led out, or the electric charges accumulated on the cover plate, the polaroid and each film layer, namely the first protective glue, the conductive holes and the grounding signal wire of the integrated touch structure serving as the second conductive structure and the conductive output part are led out, so that the electric charges accumulated on the cover plate, the polaroid and each film layer are prevented from entering the driving circuit layer to affect the normal operation of the driving circuit, the display effect of the display module is effectively improved, the user experience is improved, and the display module has wide application prospect.
In a specific embodiment, as shown in fig. 9 and 10, the bending portion includes a central area and an edge area disposed at an edge of the central area and corresponding to the conductive opening, the bending portion includes a second protective glue 2043 disposed at the central area and a third protective glue 2042 disposed at the edge area, and the first conductive structure is located at the bending portion and includes at least the third protective glue 2042; the display area further comprises a metal grid pattern layer arranged on one side of the touch organic layer, which is close to the substrate, the display module further comprises an integrated touch structure, the second conductive structure is arranged at the bending part and is an auxiliary metal 207 arranged on the same layer as the metal grid pattern layer, the conductive output part 206 is arranged at the bending part and is a grounding signal wire of the integrated touch structure arranged on the same layer as the metal grid pattern layer, or the second conductive structure and the conductive output part are arranged at the bending part and is a grounding signal wire of the integrated touch structure arranged on the same layer as the metal grid pattern layer.
In this embodiment, fig. 10 is a top view of a bending portion (not shown in the cover plate), and fig. 9 is a cross-sectional view of BB' in fig. 10, including a ground signal line as an integrated touch structure of the conductive output portion 206, a ground signal line as an auxiliary metal of the second conductive structure 207, or as an integrated touch structure of the conductive output portion 206 and the second conductive structure 207, a conductive opening 2031, and a third protective glue 2042 as the first conductive structure 204.
The second protective glue 2043 is a non-conductive protective glue for preventing cracks from occurring at the bending part, and the third protective glue 2042 is a conductive protective glue for guiding out accumulated charges on the film layer near the cover plate. In this embodiment, the accumulated charges are introduced into the conductive medium of the conductive opening 2031 of the touch organic layer 203 through the third protective glue 2042. The auxiliary metal 207 as the second conductive structure introduces the electric charge to the ground signal line 206 of the integrated touch structure, or the ground signal line 206 of the integrated touch structure as the second conductive structure and the conductive output part.
It should be noted that, the metal mesh pattern layer is not specifically limited in this application, and those skilled in the art should select the auxiliary metal in the first metal mesh pattern layer TMA or the second metal mesh pattern layer TMB, or the auxiliary metal in the first metal mesh pattern layer TMA and the second metal mesh pattern layer TMB according to the actual application requirements.
In the present embodiment, the following charge transfer paths are formed: the electric charges accumulated on the cover plate, the polaroid and the film layers are led out through the third protective adhesive, the conductive holes, the auxiliary metal and the grounding signal wire of the integrated touch structure, or the electric charges accumulated on the cover plate, the polaroid and the film layers are led out through the third protective adhesive, the conductive holes and the grounding signal wire of the integrated touch structure serving as the second conductive structure and the conductive output part, so that the electric charges accumulated on the cover plate, the polaroid and the film layers are prevented from entering the driving circuit layer to affect the normal operation of the driving circuit, the display effect of the display module is effectively improved, the user experience is improved, and the display module has wide application prospect.
In a specific example, the following details are made for the display module:
in an alternative example of this, the first and second embodiments,
first, a conductive output portion is formed in a non-display area.
Specifically, a grounding signal line which is arranged on the same layer as the metal grid pattern layer and is used as an integrated touch structure of the conductive output part is formed on the substrate.
And secondly, forming a second conductive structure in the non-display area.
Specifically, an auxiliary metal which is arranged on the same layer as the metal grid pattern layer and is used as the second conductive structure is formed on the substrate, and the auxiliary metal is electrically connected with the conductive output part.
In a further alternative example of this embodiment,
first, a conductive output portion and a second conductive structure are formed in a non-display region.
Specifically, a grounding signal line which is arranged on the same layer as the metal grid pattern layer and is used as the conductive output part and the grounding signal line of the integrated touch structure of the second conductive structure is formed on the substrate.
Again, conductive openings are formed in the non-display area.
Specifically, a touch organic layer is formed on the substrate, and at the same time, a conductive opening is formed on the touch organic layer corresponding to a bending part of the display module, wherein the bending part is a region for bending a signal line of the display module to a backlight side of the display module, and a through hole which is used as the conductive opening and penetrates through the touch organic layer is formed on the touch organic layer corresponding to the region.
Finally, a first conductive structure is formed in the non-display area.
Specifically, the second protective glue is formed in the central area at the bending part, the third protective glue serving as the first conductive structure is formed in the edge area, the third protective glue is electrically connected with the first open end, the third protective glue is used for preventing cracks from occurring at the bending part, and charges accumulated near the cover plate are led out.
In the present embodiment, the following charge transfer paths are formed: the electric charges accumulated on the cover plate, the polaroid and the film layers are led out through the third protective adhesive, the conductive holes, the auxiliary metal and the grounding signal wire of the integrated touch structure, or the electric charges accumulated on the cover plate, the polaroid and the film layers are led out through the third protective adhesive, the conductive holes and the grounding signal wire of the integrated touch structure serving as the second conductive structure and the conductive output part, so that the electric charges accumulated on the cover plate, the polaroid and the film layers are prevented from entering the driving circuit layer to affect the normal operation of the driving circuit, the display effect of the display module is effectively improved, the user experience is improved, and the display module has wide application prospect.
In an alternative embodiment, the conductive medium is a conductive paste, or Ag/conductive liquid.
In this embodiment, the first conductive structure is a first protective paste, and the first conductive structure is a third protective paste, and Ag/conductive liquid is used.
It should be noted that the conductive medium is not particularly limited in this application, and those skilled in the art should select a suitable conductive material according to practical application, which is not described herein.
Corresponding to the display module provided in the foregoing embodiments, an embodiment of the present application further provides a manufacturing method for manufacturing the display module, and since the manufacturing method provided in the embodiment of the present application corresponds to the display module provided in the foregoing embodiments, the foregoing embodiment is also applicable to the manufacturing method provided in the embodiment, and will not be described in detail in the embodiment.
As shown in fig. 11, an embodiment of the present application further provides a method for manufacturing the display module, including: the display module comprises a display area and a non-display area, and specifically comprises:
including forming drive circuit layer and apron on the substrate stacks gradually, its characterized in that, display module assembly includes display area and non-display area, still includes:
forming a conductive output portion in the non-display region;
forming a second conductive structure in the non-display area;
forming a conductive opening in the non-display area, and filling the conductive opening with a conductive medium;
and forming a first conductive structure in the non-display area, wherein the first conductive structure guides charges on one side of the cover plate far away from the substrate to the conductive opening, guides the charges into the second conductive structure through the conductive opening, and guides the charges into the conductive output part through the second conductive structure so as to prevent the charges from entering the driving circuit layer.
In this embodiment, the conductive output portion, the second conductive structure, the conductive opening and the first conductive structure are formed in the non-display area respectively, so that charges near the cover plate are led out from the first conductive structure, the conductive opening, the second conductive structure and the conductive output portion, so that charges on the cover plate are prevented from entering the driving circuit layer to affect the normal operation of the driving circuit, the display effect of the display module is effectively improved, the user experience is improved, and the display module has a wide application prospect.
Another embodiment of the present invention provides a display device, including the above display module, and the display device is an electroluminescent diode display device. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame or a navigator.
Aiming at the existing problems at present, the invention designs a display module, a display device and a manufacturing method, and leads the accumulated charges on the cover plate led out from the first conductive structure into the second conductive structure through the arranged conductive opening, and leads the accumulated charges into the conductive output part through the second conductive structure to prevent the accumulated charges from entering the driving circuit layer, thereby ensuring the normal operation of the driving circuit and having wide application prospect.
It should be understood that the foregoing examples of the present invention are provided merely for clearly illustrating the present invention and are not intended to limit the embodiments of the present invention, and that various other changes and modifications may be made therein by one skilled in the art without departing from the spirit and scope of the present invention as defined by the appended claims.
Claims (4)
1. The utility model provides a display module assembly, includes the substrate, stacks gradually and sets up drive circuit layer and apron on the substrate, its characterized in that, the display module assembly includes display area and non-display area, non-display area includes electrically conductive trompil, first electrically conductive structure, second electrically conductive structure and electrically conductive output, wherein
The conductive opening is filled with a conductive medium, and is used for guiding charges of one side, away from the substrate, of the cover plate, which is led out from the first conductive structure, into the second conductive structure and guiding the charges into the conductive output part through the second conductive structure so as to prevent the charges from entering the driving circuit layer;
the display module comprises a touch control organic layer arranged on one side of the driving circuit layer, which is close to the cover plate, and the non-display area comprises a bending part for bending a signal line of the display module to the backlight side of the display module;
the conductive opening is a through hole penetrating through the touch control organic layer of the bending part;
the first conductive structure is positioned at the bending part and at least comprises first protective glue;
the display area further comprises a metal grid pattern layer arranged on one side of the touch organic layer close to the substrate, and the second conductive structure is positioned at the bending part and is auxiliary metal arranged on the same layer as the metal grid pattern layer;
the conductive output part is positioned at the bending part and is a crack detection signal line arranged on the same layer as the source-drain layer of the driving circuit layer;
or alternatively
The bending part comprises a central area and an edge area which is arranged at the edge of the central area and corresponds to the conductive opening, the bending part comprises a second protective adhesive arranged at the central area and a third protective adhesive arranged at the edge area, and the first conductive structure is positioned at the bending part and at least comprises the third protective adhesive;
the display area further comprises a metal grid pattern layer arranged on one side of the touch organic layer close to the substrate, and the second conductive structure is positioned at the bending part and is auxiliary metal arranged on the same layer as the metal grid pattern layer;
the conductive output part is positioned at the bending part and is a crack detection signal line arranged on the same layer as the source-drain layer of the driving circuit layer;
or alternatively
The first conductive structure is positioned at the bending part and at least comprises first protective glue;
the display area also comprises a metal grid pattern layer arranged on one side of the touch control organic layer close to the substrate, the display module also comprises an integrated touch control structure,
the second conductive structure is positioned at the bending part and is an auxiliary metal arranged at the same layer as the metal grid pattern layer, the conductive output part is positioned at the bending part and is a grounding signal wire of the integrated touch structure arranged at the same layer as the metal grid pattern layer,
or alternatively
The second conductive structure and the conductive output part are positioned at the bending part and are grounding signal lines of the integrated touch structure, wherein the grounding signal lines and the metal grid pattern layer are arranged on the same layer;
or the bending part comprises a central area and an edge area which is arranged at the edge of the central area and corresponds to the conductive opening, the bending part comprises a second protective adhesive arranged at the central area and a third protective adhesive arranged at the edge area, and the first conductive structure is positioned at the bending part and at least comprises the third protective adhesive;
the display area also comprises a metal grid pattern layer arranged on one side of the touch control organic layer close to the substrate, the display module also comprises an integrated touch control structure,
the second conductive structure is positioned at the bending part and is an auxiliary metal arranged at the same layer as the metal grid pattern layer, the conductive output part is positioned at the bending part and is a grounding signal wire of the integrated touch structure arranged at the same layer as the metal grid pattern layer,
or alternatively
The second conductive structure and the conductive output part are positioned at the bending part and are grounding signal wires of the integrated touch structure, wherein the grounding signal wires and the metal grid pattern layer are arranged on the same layer.
2. The display module of claim 1, wherein the conductive medium is a conductive protective paste or Ag/conductive liquid.
3. A display device comprising a display module according to any one of claims 1-2.
4. A method for manufacturing the display module according to any one of claims 1 to 2, comprising sequentially laminating a driving circuit layer and a cover plate on a substrate, wherein the display module comprises a display area and a non-display area, and further comprising:
forming a conductive output portion in the non-display region;
forming a second conductive structure in the non-display area;
forming a conductive opening in the non-display area, and filling the conductive opening with a conductive medium;
forming a first conductive structure in the non-display region, wherein the first conductive structure guides charges on one side of the cover plate far away from the substrate to the conductive opening, guides the charges into the second conductive structure through the conductive opening, and guides the charges into the conductive output part through the second conductive structure so as to prevent the charges from entering the driving circuit layer;
the display module comprises a touch control organic layer arranged on one side of the driving circuit layer, which is close to the cover plate, the display area also comprises a metal grid pattern layer arranged on one side of the touch control organic layer, which is close to the substrate, and the non-display area comprises a bending part for bending a signal wire of the display module to a backlight side of the display module;
the forming of the conductive output portion in the non-display area further includes: a conductive output portion is formed on the substrate of the bent portion,
the conductive output part is a crack detection signal line which is arranged on the same layer as the source-drain layer of the driving circuit layer;
or alternatively
The conductive output part is a grounding signal line of the integrated touch structure, and the grounding signal line and the metal grid pattern layer are arranged on the same layer;
the forming the second conductive structure in the non-display region further includes: forming a second conductive structure on the substrate of the bending part, wherein the second conductive structure is auxiliary metal arranged on the same layer as the metal grid pattern layer;
or alternatively
The forming a conductive output in the non-display region and forming a second conductive structure in the non-display region further comprises:
forming a conductive output part and a second conductive structure on the substrate of the bending part, wherein the conductive output part and the second conductive structure are grounding signal lines of the integrated touch structure, which are arranged on the same layer as the metal grid pattern layer;
the forming a conductive opening in the non-display region further comprises:
forming a through hole penetrating through the touch control organic layer of the bending part;
the forming the first conductive structure in the non-display region further includes:
forming first protective glue at the bending part, wherein the first protective glue fills the conductive opening; or alternatively
The bending part comprises a central area and an edge area which is arranged at the edge of the central area and corresponds to the conductive opening, a second protective adhesive arranged in the central area and a third protective adhesive arranged in the edge area are formed on the wrapping surface of the bending part, and the third protective adhesive fills the conductive opening.
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| JP2009008971A (en) * | 2007-06-29 | 2009-01-15 | Epson Imaging Devices Corp | Electro-optical device and method for manufacturing the same, and electronic equipment |
| CN105096764A (en) * | 2015-07-29 | 2015-11-25 | 江西好帮手电子科技有限公司 | Liquid crystal display screen electrostatic protection device and manufacturing method thereof |
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