JP2009004455A - Component imaging method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component imaging method in which a cycle time is shortened. <P>SOLUTION: The component imaging method includes an imaging step of imaging parts of components in a column A and a column B irradiated with a laser beam by detecting a beam reflected at an irradiation position of a laser beam emitted toward a head while moving the irradiation position of the laser beam in a Y direction so that the irradiation position of the laser beam passes the components in the column A and column B sucked by the head while arrayed in the Y direction, and a changing steps of changing imaging conditions used for the imaging according to whether the irradiation position is at a component in the column A or a component in the column B. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a component imaging method for imaging a component mounted on a board.

  The component mounter is a device that produces a mounting board by mounting components such as electronic components on the board. Such a component mounting machine includes a head that picks up and moves a supplied component, mounts the component on a substrate, and a camera that images the component sucked by the head (for example, a patent). Reference 1).

  The component mounting machine (electronic component mounting apparatus) of Patent Document 1 moves the head that is picking up the components above the camera (recognition unit). The head has six nozzles arranged in a circle, and these nozzles adsorb components one by one. When the parts sequentially reach the upper part of the camera due to the movement of the head, the camera captures an image of the part located above the part.

  Here, if two nozzles are arranged along the direction (Y direction) perpendicular to the moving direction of the head, the camera simultaneously captures images of the two components sucked by the two nozzles.

  As described above, in the component imaging method using the component mounter disclosed in Patent Document 1, since images of two components are simultaneously captured, it is attempted to improve the mounting efficiency by suppressing the imaging time of each component.

Moreover, in the mounting condition determination method by the component mounting machine of the said patent document 1, two components which can obtain a suitable image even if imaged simultaneously are selected, and the two nozzles arranged along the Y direction are connected to the two nozzles. The mounting conditions are determined so that two parts are adsorbed.
JP 2005-236315 A

  However, the component imaging method and the mounting condition determination method disclosed in Patent Document 1 have a problem in that the tact, which is the time required to produce one mounting board, cannot be sufficiently shortened.

  That is, in order to capture an image of a component, it is necessary to capture the image under imaging conditions suitable for the component. In the component imaging method using the component mounter described in Patent Document 1, one image is captured when images of two components are captured simultaneously. Capture those images under the imaging conditions.

  Therefore, in the component imaging method and the mounting condition determination method disclosed in Patent Document 1, two components having different appropriate imaging conditions cannot be attracted to two nozzles arranged along the Y direction. It may be necessary to postpone mounting one of the components. As a result, the tact time becomes longer.

FIG. 19 is an explanatory diagram for explaining a case where the tact becomes long.
For example, the head includes eight nozzles nz arranged in two columns and four rows, and moves above the camera.

  The columns indicate the arrangement along the head moving direction (X direction), and the rows indicate the arrangement along the direction perpendicular to the X direction (Y direction). For example, the columns include column A and column B, and the rows include row 0, row 1, row 2, and row 3.

  When such a head moves above the camera, the camera is attracted to the two nozzles nz by repeatedly irradiating the laser beam and moving the irradiation position irradiated by the laser beam in the Y direction. Scan the parts simultaneously and try to capture images of these parts simultaneously. In FIG. 19, the dotted arrow indicates the trajectory (line) of the irradiation position irradiated with the laser beam.

  Specifically, the camera simultaneously captures images of the parts pa0 and pb0 adsorbed to the nozzles nz in the A column 0 row and the B column 0 row. At this time, the camera scans the parts pa0 and pb0 by detecting the laser beam reflected by the parts pa0 and pb0 while irradiating the laser beam for each line and moving the irradiation position in the Y direction. To do. Then, when scanning the parts pa0 and pb0, the camera scans using B parameter data indicating imaging conditions suitable for the parts pa0 and pb0. Then, the camera captures images of the parts pa0 and pb0 at the same time based on the scanned result.

  Next, the camera captures an image of the component pb1 adsorbed by the nozzle nz in the B column and the first row. At this time, the camera captures the image of the component pb1 using the B parameter data indicating the imaging conditions suitable for the component pb1, as described above.

  Thereafter, the camera captures an image of the component pb2 adsorbed by the nozzle nz in the B column 2 row. At this time, the camera captures the image of the component pb2 using the D parameter data indicating the imaging condition suitable for the component pb2.

  Thereafter, the camera simultaneously captures images of the components pa3 and pb3 adsorbed by the nozzles nz in the A column 3 rows and the B column 3 rows. At this time, the camera simultaneously captures the images using E parameter data indicating imaging conditions suitable for the parts pa3 and pb3.

  By the way, in the example shown in FIG. 19, six components pa0, pa3, pb0 to pb3 are configured as one task. A task is a series of actions in which the head moves by picking up one or more parts and mounting the picked up one or more parts on the board, or a series of actions per time picks up the head. This is a group of parts.

  Here, in addition to the above-described components pa0, pa3, pb0 to pb3, even when the other two components pa1 and pa2 are to be mounted on the substrate, the two components pa1 and pa2 are connected to the components pa0, pa3 and pa3. It may not be included in the same task as pb0 to pb3.

  For example, the component pb1 sucked by the nozzle nz in the first row B and the component pb2 sucked by the nozzle nz in the second row B are white components, and the components pa1 and pa2 are black components. In some cases, the imaging conditions of the component pb1 and the component pa1 are different from each other, and the imaging conditions of the component pb2 and the component pa2 are also different from each other.

  That is, the imaging of the part pa1 requires A parameter data different from the B parameter data suitable for the part pb1, and the imaging of the part pa2 requires C parameter data different from the D parameter data suitable for the part pb2. is necessary.

  Therefore, in the component imaging method and the mounting condition determination method of Patent Document 1 described above, since images of two components in the same row are simultaneously captured under one imaging condition, a component pa1 that requires A parameter data different from B parameter data is Similarly, the component pa2 that requires C parameter data different from the D parameter data cannot be attracted to the nozzle nz in the A column and the 2nd row.

  As a result, the component mounter cannot include the components pa1 and pa2 in the same task as the components pa0, pa3, pb0 to pb3, and must be included in other tasks and mounted on the board. The number will increase and the tact will become longer.

  Therefore, the present invention has been made in view of such a problem, and an object thereof is to provide a component imaging method in which tact time is shortened.

  In order to achieve the above object, a component imaging method according to the present invention is a component imaging method for imaging a plurality of components adsorbed by a moving head, wherein a beam irradiated toward the head is captured. The irradiation position of the beam is set in the vertical direction so that the irradiation position passes through the first and second parts adsorbed by the head arranged in a direction perpendicular to the moving direction of the head. An imaging step of imaging a portion irradiated with the beam of the first and second parts by detecting a beam reflected at the irradiation position while moving, and the irradiation position is the first part And a switching step of switching an imaging condition used for imaging in the imaging step when the irradiation position is in the second part.

  For example, in the switching step, when the irradiation position moves from the first part to the second part, the imaging condition is changed from the first imaging condition required for imaging the first part to the second part. Switching to the second imaging condition required for imaging of the component, and in the imaging step, when the irradiation position is on the first component, the beam reflected on the first component under the first imaging condition is And when the irradiation position is on the second part, a beam reflected on the second part under the second imaging condition is detected.

  Thereby, when the irradiation position of the beam (laser beam) is moving along the direction (Y direction) perpendicular to the moving direction (X direction) of the head, that is, the first and second parts are Y. Since only one line is scanned along the direction, the imaging condition is switched. Therefore, even if the first and second parts that require different imaging conditions are arranged in the Y direction, the first and second parts These parts can be simultaneously imaged under appropriate imaging conditions. That is, when the first and second parts that require different imaging conditions are attracted to the head, the first and second parts can be arranged not only in the X direction but also in the Y direction. Thus, it is not necessary to divide them into separate tasks, and they can be grouped into the same task, and the tact can be shortened.

  In the imaging step, a detection sub-step for detecting the beams reflected by the first and second components by a plurality of detection means, and for each detection means, based on a result detected by the detection means, One height is calculated from the height calculation sub-step for calculating the height at the irradiation position in the first and second parts, and the plurality of heights at the irradiation position detected by the plurality of detection means. A height determining sub-step to be determined, and an image generating sub-step for generating an image of the first and second parts including the height determined in the height determining sub-step may be included.

  As a result, images of the first and second components including the height are generated. For example, when the first and second components require high mounting accuracy, the three-dimensional of these components is required. The shape can be appropriately confirmed using the image, and those components can be mounted with high accuracy based on the confirmation result.

  For example, the imaging condition indicates a lower limit value of the light amount of the beam. In the height calculation substep, if the light amount of the beam detected by the detection unit is smaller than the lower limit value indicated by the imaging condition, the detection is performed. The calculation of the height based on the result detected by the means is prohibited. Alternatively, the imaging condition indicates an allowable value of a plurality of height shifts at the irradiation position calculated in the height calculation sub-step, and the height determination sub-step calculates in the height calculation sub-step When a plurality of height shifts at the irradiated position is larger than an allowable value indicated by the imaging condition, it is prohibited to determine one height from the plurality of heights. Alternatively, the imaging condition indicates the height around the component, and in the image generation step, an image indicating the height indicated by the imaging condition is generated as the height around the first and second components.

Thereby, the image of the 1st and 2nd components can be generated appropriately.
Further, the mounting condition determining method according to the present application is a mounting condition determining method for determining a mounting condition for mounting a plurality of components on a substrate, which is attracted to a moving head and perpendicular to the moving direction of the head. Whether or not the component imaging device can capture the plurality of components with different imaging conditions for each component when a plurality of components arranged along different directions are captured by the component imaging device When the determination step and the determination step determine that it is impossible, the components that require different imaging conditions are adsorbed to the head so that they are arranged along the vertical direction and are not adsorbed to the head. When it is determined in the first determining step that determines a component group to be mounted as a mounting condition and in the determining step, components that require different imaging conditions are arranged in the vertical direction. As it may be adsorbed to the head by arranging I, characterized in that it comprises a second determining step of determining a component group that is attracted to the head as mounting conditions.

  For example, in the first determination step, a component group to be attracted to the head is determined so that a plurality of components that require the same imaging condition are arranged along the vertical direction and attracted to the head. . Alternatively, a plurality of nozzles for picking up components are arranged along the vertical direction in the head, and in the first determination step, only one of the plurality of nozzles picks up the components. Next, a part group to be attracted to the head is determined.

  Accordingly, if the component imaging device (3D imaging unit) can capture a plurality of components arranged in the Y direction with different imaging conditions for each component, a component that requires different imaging conditions can be obtained. A component group (task) attracted to the head is determined as a mounting condition so that it may be arranged along the Y direction and attracted to the head. That is, the task to be attracted to the head is determined without being restricted by the fact that the imaging conditions of a plurality of parts arranged along the Y direction must be the same.

  As a result, since the first and second parts that require different imaging conditions may be arranged along the Y direction, there is no need to divide them into separate tasks as in the conventional example, and the same task. The tact can be shortened.

  In addition, the present invention can be realized not only as such a part imaging method, but also by mounting a part using the part imaging method, an apparatus and a program for imaging the part, a storage medium storing the program, and the part imaging method. It can also be realized as a component mounting method for mounting and a component mounter for mounting components by the component mounting method. Further, the present invention can be realized not only as such a mounting condition determination method, but also by using an apparatus and a program for determining the mounting condition by the method, a storage medium for storing the program, and the mounting condition determination method. It can also be realized as a component mounting method for mounting components and a component mounter for mounting components by the component mounting method.

  The component imaging method of the present invention has the effect of shortening tact time.

  Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an external view of a component mounting system according to an embodiment of the present invention.
A component mounting system 1000 according to the present embodiment includes a component mounting machine 100 and a mounting condition determining device 200.

  The component mounter 100 receives a circuit board (hereinafter simply referred to as a board) 20 from the upstream side, mounts the component on the board 20, and sends the board 20 on which the component is mounted to the downstream side. In addition, the board | substrate 20 with which components were mounted by the component mounting machine 100 is hereafter called a mounting board.

  Specifically, the component mounter 100 includes two component supply units 115a and 115b that supply a plurality of types of components, and transports the board 20 inserted from the carry-in port 130 into the component mounter 100 and stops. Let Then, the component mounting machine 100 sequentially takes out the components supplied from the component supply units 115a and 115b, and mounts the extracted components on the stopped substrate 20. In addition, the component mounter 100 recognizes the shape of the component by imaging the component before mounting the component supplied from the component supply units 115 a and 115 b on the substrate 20.

The mounting condition determining apparatus 200 determines a mounting condition for components by the component mounting machine 100.
FIG. 2 is a diagram illustrating a main configuration inside the component mounter 100.

  The component mounter 100 includes a head 112, an X-axis robot 121, two board transfer rails 122, a Y-axis robot 140, component supply units 115a and 115b, a 3D imaging unit 116a, and a 2D imaging unit 116b. I have.

  Each of the component supply units 115a and 115b includes an array of a plurality of component cassettes (feeders) 114 that store component tapes. The component tape is, for example, a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound on a reel or the like. The parts arranged on the part tape are, for example, chip parts, specifically, 0402 chip parts and 1005 chip parts.

  The two board transfer rails 122 are arranged in parallel and separated from each other by a distance corresponding to the width of the board 20, and the board 20 inserted from the carry-in port 130 of the component mounter 100 is transferred into the component mounter 100. The substrate 20 is guided so as to be carried out to the outside.

  In the present embodiment, the transport direction of the substrate 20 transported along the substrate transport rail 122 is the X direction, and the direction perpendicular to the X direction on the horizontal plane is the Y direction.

  The X-axis robot 121 moves the head 112 in the X direction, and the Y-axis robot 140 moves the head 112 in the Y direction.

  The head 112 is a head called a multi-mounting head including, for example, eight nozzles nz that suck one component each.

  The head 112 moves the nozzles nz up and down simultaneously or independently, thereby sucking the components supplied from the feeders 114 of the component supply units 115a and 115b to the nozzles nz. Further, the head 112 moves the nozzles nz up and down simultaneously or independently, thereby mounting the components adsorbed by the nozzles nz on the substrate 20. Therefore, the head 112 can pick up and mount a maximum of eight components from the component supply units 115 a and 115 b on the substrate 20.

  The 2D imaging unit 116b includes, for example, a CCD (Charge Coupled Devices), and two-dimensionally images the components adsorbed by the head 112 that moves above the 2D imaging unit 116b.

  The 3D imaging unit 116a three-dimensionally images a component adsorbed by the head 112 that moves above the 3D imaging unit 116a. That is, the 3D imaging unit 116a irradiates the component with the laser beam, and detects the laser beam reflected by the component while moving the position irradiated with the laser beam (irradiation position) in the Y direction. Thus, an image of the part including information such as the height and thickness of the part is captured. Further, such a 3D imaging unit 116a is detachably provided on the component mounter 100.

  That is, when the head 112 sucks the components supplied from the component supply units 115a and 115b, the component mounter 100 moves the head 112 above the 2D imaging unit 116b or the 3D imaging unit 116a. For example, the component mounting machine 100 moves the head 112 above the 2D imaging unit 116b when the component attracted by the head 112 is a relatively large component and high mounting accuracy is not required. Then, the 2D imaging unit 116b is caused to image the component. Conversely, the component mounting machine 100 moves the head 112 above the 3D imaging unit 116a when the component adsorbed by the head 112 is a relatively small component and high mounting accuracy is required. The 3D imaging unit 116a is caused to image the part.

  These imaging results are used for recognizing the shape and suction state of the parts sucked by the head 112.

  When the 3D imaging unit 116a and the 2D imaging unit 116b are collectively referred to without distinction, these are hereinafter referred to as the imaging unit 116.

FIG. 3 is a schematic diagram showing the positional relationship between the head 112 and the component cassette 114.
For example, in the head 112, eight nozzles nz are arranged in two rows. In each row, four nozzles nz are arranged at equal intervals along the X direction. Further, one column and the other column are separated by a predetermined interval in the Y direction.

  Such a head 112 can simultaneously pick up components from each of up to four component cassettes 114 (in a single up-and-down motion), and further move up in the Y direction to further up to four component cassettes. Parts can be picked up simultaneously from each of 114 (in one up-and-down motion). Therefore, the head 112 can suck up to eight parts at the same time in two vertical movements.

FIG. 4 is a diagram illustrating an example of a component tape and a reel that contain components.
Components such as chip-type electronic components are stored in a storage recess 424a formed continuously at a predetermined interval on a carrier tape 424 shown in FIG. The carrier tape 424 to which the cover tape 425 is thus attached is supplied to the user in a taping form wound around the reel 426 by a predetermined quantity. The carrier tape 424 and the cover tape 425 constitute a component tape. The configuration of the component tape may be other than the configuration shown in FIG.

  In such a component mounting machine 100, the head 112 is moved to the component supply unit 115a or the component supply unit 115b, and the components supplied from the component supply units 115a and 115b are attracted to the head 112. Then, the component mounting machine 100 moves the head 112 onto the image pickup unit 116 at a constant speed, causes the image pickup unit 116 to capture images of all the components picked up by the head 112, and accurately determines the shape and pick-up position of the component. To recognize. Further, the component mounting machine 100 moves the head 112 to the substrate 20 and sequentially mounts all the sucked components on the mounting points of the substrate 20. The component mounter 100 mounts all predetermined components on the substrate 20 by repeatedly executing a series of operations such as suction, movement, and mounting by the head 112.

  Note that a group of components that are attracted to the head 112 by the above-described series of operations by the head 112 or a series of operations per one time is hereinafter referred to as a task.

  FIG. 5 is an explanatory diagram for explaining a state in which a part is imaged by the 3D imaging unit 116a. 5A shows the arrangement of the head 112 and the 3D imaging unit 116a, and FIG. 5B shows the head 112 viewed from the 3D imaging unit 116a.

  As shown in FIG. 5A, the head 112 moves along the X direction above the 3D imaging unit 116a. At this time, for example, each nozzle nz of the head 112 sucks the component p.

  Each nozzle nz of the head 112 has a reflector plate re that reflects light output from the imaging unit 116, a laser beam, or the like.

  As shown in FIG. 5A, the 3D imaging unit 116a irradiates the laser beam La from, for example, a slit-shaped light transmitting unit 61, and moves the irradiation position of the laser beam La in one direction in the Y direction. Repeat that. Then, the 3D imaging unit 116 a detects the laser beam La reflected by the component p via the light transmitting unit 61.

  Here, the eight nozzles nz of the head 112 are arranged in two columns and four rows as shown in FIG. The column indicates the arrangement along the head moving direction (X direction), and the row indicates the arrangement along the direction perpendicular to the X direction (Y direction). The columns include A column and B column, and the rows include 0 row, 1 row, 2 rows, and 3 rows. In each of the A column and the B column, four nozzles nz are arranged along the X direction, and in each row such as the zero row and the one row, two nozzles nz are arranged along the Y direction.

  Therefore, when the 3D imaging unit 116a moves the irradiation position of the laser beam La in one direction in the Y direction, the laser beam La is moved in the Y direction as shown by the dotted arrow in FIG. One line is drawn on two parts p belonging to the same row (for example, 0 row) arranged. For example, the 3D imaging unit 116a moves the irradiation position of the laser beam La in one direction in the Y direction during about 250 μs. The 3D imaging unit 116a repeats such movement of the irradiation position of the laser beam La every time the head 112 slightly moves in the X direction, and each of the two parts p belonging to the A column and the B column in the same row. Based on the detection result of the reflected laser beam La, images of those parts p are simultaneously captured. That is, when the head 112 moves above the 3D image pickup unit 116a, the 3D image pickup unit 116a divides each of the two parts p adsorbed by the two nozzles nz arranged in the Y direction of the head 112 into those parts p. Are simultaneously scanned to capture these images simultaneously.

  That is, the 3D imaging unit 116a first captures images of these components p by simultaneously scanning the two components p adsorbed by the two nozzles nz belonging to the 0th row with the laser beam La. Next, the 3D imaging unit 116a simultaneously captures images of these components p by simultaneously scanning the two components p adsorbed by the two nozzles nz belonging to one row with the laser beam La. In this way, the 3D imaging unit 116a sequentially captures the images of the two components p adsorbed by the two nozzles nz belonging to the same row at the same time, so that all (eight) components p adsorbed by the head 112 are obtained. That is, the image of the part p for one task is captured.

FIG. 6 is a diagram illustrating an internal mechanical configuration of the 3D imaging unit 116a.
The 3D imaging unit 116 a includes a semiconductor laser 62, a polygon mirror 63, two semiconductor position detection elements (Position Sensitive Detectors) 64, compound lenses 65 a and 65 b, and a synchronization signal detection unit 66.

  The semiconductor laser 62 is a light source of the laser beam La, and outputs the laser beam La toward the compound lens 65b by using so-called recombination light emission of the semiconductor.

  The compound lens 65 b includes a plurality of lenses, transmits and reflects the laser beam La output from the semiconductor laser 62, and directs the laser beam La toward the polygon mirror 63.

  When receiving the laser beam La from the composite lens 65b, the polygon mirror 63 reflects the laser beam La toward the composite lens 65a. Further, the polygon mirror 63 tilts the laser beam La applied to the compound lens 65a in one direction in the Y direction by rotating on the XY plane.

  Furthermore, the polygon mirror 63 rotates on the XY plane, and reflects the laser beam La toward the synchronization signal detection unit 66 at a timing synchronized with the change in the direction of the laser beam La. That is, the polygon mirror 63 tilts the reflected laser beam La in one direction in the Y direction and reflects the laser beam La toward the synchronization signal detection unit 66 when returning the direction again.

  The compound lens 65a includes a plurality of lenses, transmits the laser beam La reflected by the polygon mirror 63, and outputs the laser beam La to the outside of the 3D imaging unit 116a.

  The two semiconductor position detecting elements 64 receive the laser beam La reflected by the component p via the light transmitting portion 61 and output a detection signal corresponding to the light reception result. This detection signal indicates the height, thickness, and the like of the part of the component p that has been irradiated with the laser beam La.

  When the synchronization signal detection unit 66 detects the laser beam La reflected from the polygon mirror 63 toward the synchronization signal detection unit 66, the synchronization signal detection unit 66 outputs a synchronization signal corresponding to the detection result. This synchronization signal is used to specify the position of the part p corresponding to the height of the part p indicated by the detection signal.

FIG. 7 is a diagram illustrating a functional configuration of the component mounter 100 according to the present embodiment.
The component mounter 100 includes a mechanism unit M, a main control unit 160, the above-described 3D imaging unit 116a and 2D imaging unit 116b, a communication unit 161, a specification data storage unit 162, a parameter storage unit 163, and acquired data. A storage unit 164.

  The mechanism unit M includes a plurality of mechanisms that mechanically operate in accordance with control by the main control unit 160, and includes the head 112, the X-axis robot 121, the Y-axis robot 140, and the like described above.

  The specification data storage unit 162 stores imaging specification data 162a indicating the specifications of the 3D imaging unit provided in the component mounter 100.

  The parameter storage unit 163 stores a plurality of parameter data such as A parameter data, B parameter data, C parameter data, and D parameter data.

  Each of the plurality of parameter data indicates appropriate imaging conditions for a component that can be mounted by the component mounter 100. Specifically, the parameter data indicates a light amount lower limit value, a height deviation allowable value, a clipping level, and the like, which will be described later, as imaging conditions.

  The communication unit 161 communicates with the mounting condition determination device 200 and outputs, for example, the imaging specification data 162a stored in the specification data storage unit 162 to the mounting condition determination device 200. In addition, the communication unit 161 acquires the mounting condition data 164a, the NC data 164b, and the component library 164c from the mounting condition determination device 200 and stores them in the acquired data storage unit 164.

FIG. 8 is a diagram illustrating an example of the NC data 164b.
The NC data 164b indicates information related to mounting points of all components to be mounted on the board 20. One mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, control data φi, and a mounting angle θi. Here, the component type corresponds to the component name in the component library 164c (see FIG. 9), the X coordinate and the Y coordinate are the coordinates of the mounting point (coordinates indicating a specific position on the board 20), and the control data is , The restriction information related to the mounting of the component, for example, the type of nozzle nz that can be used, the maximum movement acceleration of the head 112, and the like. The mounting angle indicates an angle at which the nozzle nz that sucks the component of the component type ci should rotate.

FIG. 9 is a diagram illustrating an example of the component library 164c.
The component library 164c is a library that collects unique information about each of all component types that can be handled by the component mounter 100. As shown in FIG. 9, the component library 164c includes, for each component type (component name), a parameter data type indicating an imaging condition appropriate for a component of the component type, a component size of the component type, and a component type. It consists of tact and constraint information.

  The tact shown in the component library 164c is a time specific to the component type required to mount the component on the substrate 20 under a certain condition, and the constraint information includes, for example, the types of usable nozzles nz (SX and , SA, etc.), a recognition method (reflection, etc.) by the 2D imaging unit 116b, the maximum acceleration ratio of the head 112, and the like. FIG. 9 also shows the appearances of the components of each component type for reference. In addition, the component library 164c may include information such as the color and shape of the component.

  The mounting condition data 164a indicates the mounting conditions by the component mounting machine 100. For example, the mounting condition data 164a indicates the mounting order and tact of the components, and any of the eight nozzles nz in which the components belonging to the tact are arranged in the head 112. Indicates whether the nozzle nz should be adsorbed.

  Based on the NC data 164b, the mounting condition data 164a, and the component library 164c stored in the acquired data storage unit 164, the main control unit 160 properly mounts a plurality of predetermined components on the board 20. , The mechanism unit M, the 3D imaging unit 116a, the 2D imaging unit 116b, and the communication unit 161 are controlled.

  Further, when the 3D imaging unit is attached to the component mounter 100, the main control unit 160 specifies the specification of the 3D imaging unit by communicating with the 3D imaging unit, and the above-described imaging specification indicating the specification and the like Data 162 a is generated and stored in the specification data storage unit 162.

  Further, the main control unit 160 refers to the component library 164c to identify the type of parameter data necessary for imaging all components belonging to the task for each task indicated by the mounting condition data 164a. Then, the main control unit 160 reads out the specified type of parameter data from the parameter storage unit 163 and outputs the parameter data to the 3D imaging unit 116a for each task.

  Here, when the main control unit 160 outputs the parameter data to the 3D imaging unit 116a, the main control unit 160 refers to the mounting condition data 164a, and the column to which the nozzle nz that picks up the component imaged using the parameter data belongs. Outputs a row (hereinafter referred to as the target matrix).

  For example, the target matrix A [1] is attached to the A parameter data. Here, A in A [1] indicates that the column to which the nozzle nz that picks up the component imaged using the A parameter data belongs is the A column, and [1] in A [1] indicates the A parameter. This indicates that the row to which the nozzle nz that picks up the component imaged using the data belongs is one row.

FIG. 10 is a diagram illustrating a functional configuration of the 3D imaging unit 116a.
The 3D imaging unit 116a includes a third memory 67, a 3D imaging control unit 68, a laser driver 62a, a semiconductor laser 62, a polygon mirror 63, a motor control unit 63a, a semiconductor position detection element 64, and an amplifier 64a. , An A / D converter 64b, a synchronization signal detector 66, and an FPGA 69.

  The third memory 67 stores a plurality of parameter data output from the main control unit 160 and acquired. That is, the plurality of parameter data indicate appropriate imaging conditions for all parts belonging to one task.

  For example, the third memory 67 stores A parameter data, B parameter data, C parameter data, D parameter data, and E parameter data.

  The 3D imaging control unit 68 extracts the parameter data stored in the third memory 67 according to the target matrix attached to each of the parameter data, and outputs the parameter data to the FPGA 69.

  In other words, when the two components p in the 0th row of the head 112 reach the upper part of the light transmitting unit 61, the 3D imaging control unit 68 first sets the parameter data to which the target matrices A [0] and B [0] are attached. Is output to the FPGA 69. Next, when the two components p in one row of the head 112 reach above the translucent unit 61, the 3D imaging control unit 68 obtains parameter data with the target matrices A [1] and B [1] attached thereto. Output to the FPGA 69. Further, when the two parts p in the two rows of the head 112 reach the upper part of the translucent unit 61, the 3D imaging control unit 68 transmits the parameter data with the target matrices A [2] and B [2] to the FPGA 69. Output to.

  As described above, the 3D imaging control unit 68 outputs necessary parameter data to the FPGA 69 every time two components p belonging to the same row of the head 112 reach the upper part of the light transmitting unit 61.

  Further, the 3D imaging control unit 68 controls the laser driver 62a and the motor control unit 63a so that the component p sucked by the nozzle nz of the head 112 is scanned with the laser beam La.

  That is, the 3D imaging control unit 68 instructs the laser driver 62a to output the laser beam La and the motor control unit 63a when the component p adsorbed by the nozzle nz reaches the upper part of the translucent unit 61. Is instructed to rotate the polygon mirror 63.

  Upon receiving an output instruction from the 3D imaging control unit 68, the laser driver 62 a supplies power to the semiconductor laser 62 and causes the semiconductor laser 62 to output a laser beam La.

  Upon receiving an output instruction from the 3D imaging control unit 68, the motor control unit 63a rotates the polygon mirror 63 to change the direction of the laser beam La.

  Upon receiving the detection signal Sd from the semiconductor position detection element 64, the amplifier 64a amplifies the detection signal Sd and outputs it to the A / D conversion unit 64b.

  Upon receiving the detection signal Sd amplified by the A / D conversion unit 64b, the A / D conversion unit 64b converts the detection signal Sd from an analog signal to a digital signal, and outputs the detection signal Sd of the digital signal to the FPGA 69. .

  In FIG. 10, only one set of the semiconductor position detection element 64, the amplifier 64a, and the A / D conversion unit 64b is shown, but the 3D imaging unit 116a includes two sets of these.

  The FPGA 69 is configured as a Field Programmable Gate Array. Upon receiving the detection signal Sd from the A / D conversion unit 64b, the FPGA 69 generates an image of the component p including height information based on the detection signal Sd. The generated image is output to the main control unit 160.

  Such an FPGA 69 includes a height calculation unit 71, a counter unit 72, a switching unit 73, a first memory 74, and a second memory 75.

The counter unit 72 includes an X counter and a Y counter.
Each time the X counter receives the synchronization signal Sy from the synchronization signal detector 66, the X counter increments the count number Xct by one. That is, the count number Xct indicates the irradiation position of the laser beam La in the X direction in the head 112.

  Whenever the height calculator 71 calculates the height of the component p per pixel, the Y counter increments the count number Yct by one and receives the synchronization signal Sy from the synchronization signal detector 66. The count number Yct is reset to 0, for example. That is, the count number Yct indicates the irradiation position of the laser beam La in the Y direction on the head 112.

  For example, when the irradiation position of the laser beam La is moved from the A row to the B row of the head 112 by the rotation of the polygon mirror 63, when 0 <count number Yct <CNT, the count number Yct is equal to the laser beam La. Indicates that it corresponds to the part p in the A row. Further, when CNT <count number Yct <Ymx, the count number Yct indicates that the laser beam La hits the B-row component p. When the count number Yct = CTN, the count number Yct indicates that the irradiation position of the laser beam La is between the part p in the A row and the part p in the B row.

  Ymx is an integer greater than 0, and CNT is an integer corresponding to 1 / Ymx, for example.

  The first memory 74 and the second memory 75 perform 3D imaging control of appropriate parameter data for one or two parts p that are simultaneously imaged, that is, one or two parts p that belong to the same row of the head 112. Received from the unit 68 and stored.

  The first memory 74 stores parameter data that is optimal for the parts attracted to the nozzles nz in the A column of the head 112, that is, parameter data with A [n] added as a target matrix. In addition, n shows the arbitrary integer of 0-3. The second memory 75 stores parameter data appropriate for the parts sucked by the nozzles nz in the B row of the head 112, that is, parameter data with B [n] added as a target matrix. Accordingly, the first memory 74 stores the parameter data for the A column, and the second memory 75 stores the parameter data for the B column.

  The switching unit 73 switches between the first memory 74 and the second memory 75 based on the count number Yct indicated by the Y counter of the counter unit 72 and connects to the height calculation unit 71. For example, when 0 ≦ count number Yct <CNT, the switching unit 73 connects the first memory 74 to the height calculation unit 71, and when CNT ≦ count number Yct ≦ Ymx, the switching unit 73 sets the second memory 75 to the height calculation unit. Connect to 71. That is, the switching unit 73 switches the connection destination of the height calculation unit 71 from the first memory 74 to the second memory 75 when the count number Yct = CNT.

  In the present embodiment, the switching unit 73, the first memory 74, the second memory 75, and the counter unit 72 are configured as a switching unit, and other components included in the 3D imaging unit 116a are used as the imaging unit. It is composed.

  The height calculation unit 71 obtains the detection signal Sd from the A / D conversion unit 64b, and based on the detection signal Sd, the height (thickness) at the position of the part p hit by the laser beam La is in units of one pixel. calculate. Therefore, when the entire part p is scanned with the laser beam La, the height calculation unit 71 generates an image of the entire part p including the height of the part p and outputs the image to the main control unit 160. . Further, when the two parts p in the A column and the B column belonging to the same row are scanned with the laser beam La, the height calculation unit 71 simultaneously generates an image including the heights of the two parts p and outputs the image. Is output to the main controller 160.

  As described above, in the present embodiment, by storing the parameter data for the A column and the parameter data for the B column in the first memory 74 and the second memory 75 of the FPGA 69, the irradiation position of the laser beam La can be determined. The parameter data for the A column and the parameter data for the B column can be switched within a few μs between the A column and the B column.

Here, imaging conditions indicated by the parameter data will be described.
The parameter data indicates the light amount lower limit value, the height deviation allowable value, the clipping level, and the like as the imaging conditions.

  FIG. 11 is an explanatory diagram for explaining the light intensity lower limit value and the allowable height deviation value indicated by the parameter data.

  As described above, the laser beam La is output from the semiconductor laser 62, reflected by the component p, and detected by the two semiconductor position detecting elements 64, respectively. Each of the two semiconductor position detection elements 64 outputs a detection signal Sd corresponding to the detection result to the height calculation unit 71 via the amplifier 64a and the A / D conversion unit 64b.

  Here, the two semiconductor position detecting elements 64 are arranged so as to be line symmetric with respect to the laser beam La irradiated toward the component p as a central axis. Therefore, normally, the laser beams La reflected by the component p are detected equally by the two semiconductor position detecting elements 64, respectively. However, depending on the surface shape of the component p to which the laser beam La is applied, there is a case where the laser beam La is detected biased to one of the semiconductor position detection elements 64. In this case, the reliability of the detection signal Sd output from the other semiconductor position detection element 64 is low.

  Therefore, the height calculation unit 71 determines whether each detection signal Sd is reliable using the light amount lower limit value. If the height calculation unit 71 determines that the detection signal Sd is not reliable, the height calculation unit 71 determines whether the detection signal Sd is determined to be unreliable. Stop calculating the height based on.

  That is, the light quantity lower limit value indicates a threshold value of the output level of the detection signal Sd output from the semiconductor position detection element 64 via the amplifier 64a and the A / D conversion unit 64b.

  Therefore, if the output level of the detection signal Sd output from the semiconductor position detection element 64 is smaller than the light amount lower limit value, the height calculation unit 71 determines that the detection signal Sd is not reliable, and the detection signal Sd The height is not calculated based on. As a result, of the detection signals Sd output from the two semiconductor position detection elements 64, the output level of one of the detection signals Sd is smaller than the light amount lower limit value, and the output level of the other detection signal Sd is the light amount lower limit value. If so, the height calculator 71 calculates the height based only on the other detection signal Sd.

  In the present embodiment, the 3D imaging unit 116a includes a detection sub-step for detecting the laser beams La reflected by the components in the A and B rows by the two semiconductor position detecting elements 64, and each semiconductor position detecting element 64. Further, based on the result detected by the semiconductor position detection element 64, a height calculation sub-step for calculating the height at the irradiation position in the parts of the A row and the B row and detection by the two semiconductor position detection elements 64 The height determination substep for determining one height from the two heights at the irradiated position, and the images of the parts in the A and B columns including the heights determined in the height determination substep The image generation sub-step to be generated is executed. In the 3D imaging unit 116a according to the present embodiment, the light amount (output level) of the laser beam La detected by the semiconductor position detection element 64 is smaller than the light amount lower limit value indicated by the parameter data in the height calculation substep. In this case, the height calculation based on the result detected by the semiconductor position detection element 64 is prohibited.

  Further, as described above, normally, the laser beams La reflected by the component p are detected equally by the two semiconductor position detecting elements 64, so that the detections output from the two semiconductor position detecting elements 64 are detected. The two heights calculated on the basis of the signal Sd should be equal. Therefore, if there is a deviation of a predetermined amount or more in these heights, the heights are not reliable.

  In other words, the height deviation allowable value indicates the two height deviation allowable values calculated by the detection signals Sd output from the two semiconductor position detection elements 64.

  Therefore, when the height calculation unit 71 calculates two heights based on the detection signals Sd output from the two semiconductor position detection elements 64, the difference between the two calculated heights is the height deviation tolerance. It is determined whether or not the value is below the value. When the height calculation unit 71 determines that the heights are within the range, the height calculation unit 71 determines that the heights are reliable. For example, by calculating an average value of the two heights, the laser beam La is applied. The height at the position of the given part p is determined. On the other hand, if the height calculation unit 71 determines that the difference between the two heights is not less than or equal to the height deviation allowable value, the height calculation unit 71 determines that the heights are not reliable and deletes the heights. .

  That is, in the present embodiment, the 3D imaging unit 116a has a case where the height deviation of 2 at the irradiation position calculated in the height calculation sub-step is larger than the height deviation allowable value indicated by the parameter data. It is prohibited to determine one height from the two heights.

  FIG. 12 is an explanatory diagram for explaining the clipping level indicated by the parameter data.

The clipping level indicates the height around the part p.
That is, when the height calculation unit 71 sequentially calculates the height in accordance with the detection signal Sd, the height calculation unit 71 may calculate a highly fluctuating height in an extremely low part around the part p. At this time, the height calculation unit 71 sets the height around the part p to the clipping level. For example, as shown in FIG. 12, the height calculation unit 71 sets the height around the component p to clipping level 1 or clipping level 2.

  As a result, the height calculation unit 71 generates an image of the component p including the periphery set to the clipping level and outputs it to the main control unit 160.

  FIG. 13 is a diagram illustrating a relationship among the synchronization signal Sy, the count number Yct, and the parameter data.

  For example, when the synchronization signal Sy is output at time t1, the Y counter of the counter unit 72 resets the count number Yct to zero. At this time, the switching unit 73 connects the first memory 74 for the A column to the height calculation unit 71.

  As a result, the height calculation unit 71 uses the parameter data stored in the first memory 74 for the A column after the time t1, and calculates the height of the component p in the A column of the head 112 for each pixel. Are sequentially calculated along the Y direction. Furthermore, the Y counter repeats counting up every time the height of the component p for one pixel is calculated after time t1.

  Next, when the count number of the Y counter becomes Yct = CNT at time t2, the switching unit 73 switches the connection destination of the height calculation unit 71 from the first memory 74 to the second memory 75 for the B column.

  As a result, the height calculation unit 71 uses the parameter data stored in the second memory 75 for the B column after time t2, and sets the height of the component p in the B column of the head 112 for each pixel. Are sequentially calculated along the Y direction. Further, the Y counter continues counting after time t2 and repeats counting up every time the height of the component p for one pixel is calculated.

  Then, when the synchronization signal Sy is output at time t3, the Y counter of the counter unit 72 resets the count number Yct to 0 again. At this time, the switching unit 73 switches the connection destination of the height calculation unit 71 from the second memory 75 to the first memory 74 for the A column.

  Accordingly, the height calculation unit 71 uses the parameter data stored in the first memory 74 for the A column after time t3 to set the height of the component p in the A column of the head 112 for each pixel. Are sequentially calculated along the Y direction. Further, the Y counter continues counting after time t3 and repeats counting up every time the height of the component p for one pixel is calculated.

  As described above, the height calculation unit 71 in the present embodiment uses the first and second memories 74, 74 based on the count number Yct while the irradiation position of the laser beam La is moving along the Y direction. The parameter data stored in 75 is switched and used. Therefore, even if the parameter data suitable for the part p of the A column and the part p of the B column belonging to the same row of the head 112 are different, the height calculation unit 71 is in the process of moving the irradiation position of the laser beam La. By switching the parameter data quickly, these parts p can be imaged simultaneously.

FIG. 14 is a diagram illustrating a state of each component sucked by the head 112.
For example, the components pa0, pb0, and pb1 that require B parameter data for imaging are adsorbed to the nozzles nz in the A column 0 row, the B column 0 row, and the B column 1 row of the head 112. Further, the part pa1 that requires A parameter data for imaging is adsorbed to the nozzle nz in the first column of column A of the head 112, and the C parameter data is required for imaging of the nozzle nz in the second column of column A of the head 112. The part pa2 is sucked and the part pb2 that requires D parameter data for picking up is picked up by the nozzle nz in the B column and the second row of the head 112. Further, the parts pa3 and b3 that require E parameter data for imaging are adsorbed to the nozzles nz in the A column 3 rows and the B column 3 rows of the head 112.

Note that the dotted arrow in FIG. 14 indicates the trajectory of the irradiation position of the laser beam La.
When such a head 112 moves and a component adsorbed by the nozzle nz in the 0th row of the head 112 enters the imaging range, the 3D imaging unit 116a is stored in the first and second memories 74 and 75. By using the B parameter data, the images of the component pa0 and the component pb0 adsorbed by the nozzle nz in the A column 0 row and the B column 0 row are captured simultaneously.

  Further, when the head 112 moves and the component adsorbed by the nozzle nz in the 0th row of the head 112 goes out of the imaging range, the 3D imaging unit 116a uses the B parameter data stored in the first memory 74. Replace with A parameter data. Then, when the head 112 moves and the parts adsorbed by the nozzles nz in one row of the head 112 enter the imaging range, the 3D imaging unit 116a is stored in the first and second memories 74 and 75. By switching between the A parameter data and the B parameter data, the images of the component pa1 and the component pb1 adsorbed by the nozzles nz in the A column 1 row and the B column 1 row are simultaneously captured.

  Then, when the head 112 moves and a component adsorbed by the nozzle nz in one row of the head 112 goes out of the imaging range, the 3D imaging unit 116a uses the A parameter data stored in the first memory 74. The B parameter data stored in the second memory 75 is replaced with the D parameter data. Then, when the head 112 moves and the components adsorbed by the nozzles nz in the two rows of the head 112 enter the imaging range, the 3D imaging unit 116a is stored in the first and second memories 74 and 75. By switching between the C parameter data and the D parameter data, the images of the component pa2 and the component pb2 adsorbed by the nozzles nz in the A column 2 rows and the B column 2 rows are simultaneously captured.

  Further, when the head 112 moves and the parts adsorbed by the nozzles nz in the two rows of the head 112 come out of the imaging range, the 3D imaging unit 116a stores the C parameter data stored in the first memory 74. The D parameter data stored in the second memory 75 is replaced with the E parameter data. When the head 112 moves and the parts adsorbed by the nozzles nz in the three rows of the head 112 enter the imaging range, the 3D imaging unit 116a is stored in the first and second memories 74 and 75. By using the E parameter data, the images of the part pa3 and the part pb3 adsorbed by the nozzle nz in the A column 3 row and the B column 3 row are simultaneously captured.

  Therefore, since the 3D imaging unit 116a according to the present embodiment can simultaneously capture images of two parts having different appropriate parameter data, as shown in FIG. 19, conventionally, the same task as the part pa0 can be performed. The part pa1 and the part pa2 which have not been made can be made the same task. As a result, the tact can be shortened.

FIG. 15 is a flowchart showing the operation of the 3D imaging unit 116a.
First, the 3D imaging unit 116a sets the parameter data for the A column stored in the first memory 74 by connecting the first memory 74 to the height calculation unit 71 (step S10).

  Next, the 3D imaging unit 116a starts scanning only one line with the laser beam La (step S12). At the start of this scanning, the count number Yct of the Y counter is Yct = 0.

  Then, the 3D imaging unit 116a determines whether or not the count number Yct is Yct = CNT, that is, whether or not the irradiation position of the laser beam La is between the A column and the B column of the head 112 ( Step S14). Here, if the 3D imaging unit 116a determines that the irradiation position is between the A row and the B row (Y in step S14), the first memory 74 connected to the height calculation unit 71 is stored in the second memory. By switching to 75, the parameter data for the A column is changed to the parameter data for the B column (step S16).

  That is, in the 3D imaging unit 116a according to the present embodiment, in step S16 (switching step), when the irradiation position of the laser beam La is in the A-row component and when the irradiation position is in the B-row component. The imaging conditions used for imaging are switched.

  Next, the 3D imaging unit 116a determines whether or not scanning of one line is completed, that is, whether or not the count number Yct of the Y counter is Yct = Ymx (step S18).

  That is, in the 3D imaging unit 116a according to the present embodiment, the irradiation positions of the laser beam La emitted toward the head 112 are arranged along the Y direction in steps S12 to S18 (imaging step). By detecting the laser beam La reflected at the irradiation position while moving the irradiation position of the laser beam La in the Y direction so as to pass through the sucked parts of the A row and the B row, the A row and the B row are detected. The part irradiated with the laser beam La of the parts in the row is imaged.

  If the 3D imaging unit 116a determines that Yct = Ymx is not satisfied (N in step S18), the 3D imaging unit 116a repeatedly performs the operation from step S14. On the other hand, when the 3D imaging unit 116a determines that Yct = Ymx (Y in step S18), the 3D imaging unit 116a further determines whether or not the scanning of the entire row of the heads 112 is completed (step S20).

  Here, if it is determined that the 3D imaging unit 116a is not completed (N in Step S20), the operation from Step S10 is repeatedly executed. If it is determined that the operation is completed (Y in Step S20), the 3D imaging unit 116a It is determined whether or not imaging has been completed for all rows (step S22). When scanning of the entire row of the head 112 is completed, if two components are attracted to the two nozzles nz belonging to the row, images of the two components are generated simultaneously.

  When the 3D imaging unit 116a determines that scanning of all the rows of the head 112 has not been completed (N in Step S22), the 3D imaging unit 116a repeatedly performs the operation from Step S10 and determines that the scanning has been completed (Step S22). (Y of S22) The imaging process of the component in one task is terminated.

  FIG. 16 is a flowchart showing in detail the parameter data changing operation of the 3D imaging unit 116a.

  First, the 3D imaging control unit 68 of the 3D imaging unit 116a performs initial setting (step S100). That is, the 3D imaging control unit 68 sets the count number Xct of the X counter of the counter unit 72 to Xct = 0, sets the count number Yct of the Y counter to Yct = 0, and sets the variable n indicating the row of the head 112. Set n = 0.

  Next, the 3D imaging control unit 68 stores appropriate parameter data (parameter data of the target matrix A [0]) in the first memory 74 for the component p attracted to the nozzle nz in the A column 0 row. , Appropriate parameter data (parameter data of the target matrix B [0]) is stored in the second memory 75 for the component p attracted to the nozzle nz in the B column 0 row (step S102).

  And the counter part 72 discriminate | determines whether the synchronous signal Sy was received (step S104). If it is determined that the synchronization signal Sy has been received (Y in step S104), the counter unit 72 increments the count number Xct of the X counter by one, and if the count number Yct of the Y counter is not 0, The count number Yct is reset to 0 (step S106).

  The 3D imaging control unit 68 determines whether or not the count number Xct indicates a corresponding position Line (n) between the nth row and the (n + 1) th row of the head 112 (step S108). Note that the position Line (0) indicates a position corresponding to between the 0th and 1st lines of the head 112, and the position Line (1) indicates a position corresponding to between the 1st and 2nd lines of the head 112. Show.

  Here, if the 3D imaging control unit 68 determines that the count number Xct indicates the position Line (n) (Y in step S108), the 3D imaging control unit 68 determines whether or not the variable n is equal to the last row (Last_n) of the head 112. (Step S110). For example, the last row (Last_n) of the head 112 is 3.

  If the 3D imaging control unit 68 determines that the variable n is equal to the last row (Last_n) of the head 112 (Y in step S110), the 3D imaging control unit 68 determines that images of all the parts p for one task have been captured, and the laser The output of the laser beam La is stopped with respect to the driver 62a. On the other hand, when the 3D imaging control unit 68 determines that the variable n is different from the last row (Last_n) of the head 112 (N in step S110), the 3D imaging control unit 68 increments the variable n. Then, the 3D imaging control unit 68 uses the incremented variable n to set appropriate parameter data (parameter data of the target matrix A [n] for the component p attracted to the nozzle nz in the A column and the n row. ) And appropriate parameter data (parameter data of the target matrix B [n]) for the component p attracted to the nozzle nz in the B column and the n row are acquired from the third memory 67. Further, the 3D imaging control unit 68 replaces the parameter data stored in the first memory 74 with the parameter data of the target matrix A [n] acquired from the third memory 67, and is stored in the second memory 75. Is replaced with the parameter data of the target matrix B [n] acquired from the third memory 67 (step S112).

  Next, when it is determined in step S104 that the synchronization signal Sy is not received (N in step S104), it is determined in step S108 that the count number Xct does not indicate the position Line (n) (in step S108). N) Or, when the parameter data is replaced in step S112, the switching unit 73 determines whether or not the count number Yct of the Y counter of the counter unit 72 is greater than or equal to CNT (step S114).

  Here, when the switching unit 73 determines that the count number Yct is smaller than CNT (N in Step S114), the first memory 74 is connected to the height calculation unit 71 and stored in the first memory 74. The height calculation unit 71 is caused to calculate the height per pixel of the component p based on the parameter data for the A column (step S116). On the other hand, when the switching unit 73 determines that the count number Yct is equal to or greater than CNT (Y in step S114), the second memory 75 is connected to the height calculation unit 71, and the B column stored in the second memory 75 is stored. The height calculation unit 71 is caused to calculate the height per pixel of the component p based on the parameter data for use (step S118).

  Thereafter, the 3D imaging control unit 68 increments the count number Yct of the Y counter of the counter unit 72 by 1 (step S120), and the counter unit 72 repeatedly executes the processing from step S104.

FIG. 17 is a diagram showing a functional configuration of the mounting condition determining apparatus 200 in the present embodiment.
The mounting condition determination apparatus 200 includes an input unit 201, a display unit 202, an optimization unit 203, a communication unit 204, a first storage unit 205, and a second storage unit 206.

  The first storage unit 205 stores NC data 164b and a part library 164c. The second storage unit 206 stores the mounting condition data 164a generated by the optimization unit 203.

  The input unit 201 includes, for example, a keyboard and a mouse, receives an operation from an operator, and notifies the optimization unit 203 of the operation result.

  The display unit 202 is configured by, for example, a liquid crystal display, and displays an operation state of the optimization unit 203 or the like, or displays data stored in the first storage unit 205, the second storage unit 206, or the like. To do.

  The communication unit 204 communicates with the component mounter 100. For example, the communication unit 204 transmits the NC data 164 b and the component library 164 c stored in the first storage unit 205 and the mounting condition data 164 a stored in the second storage unit 206 to the component mounting machine 100. Thus, the component mounter 100 is caused to execute component mounting and imaging according to the data. In addition, the communication unit 204 acquires the imaging specification data 162 a from the component mounting machine 100 and outputs the imaging specification data 162 a to the optimization unit 203.

  Based on the NC data 164b and the component library 164c stored in the first storage unit 205 and the imaging specification data 162a acquired from the component mounting machine 100 via the communication unit 204, the optimization unit 203 100 mounting conditions are optimized. For example, the optimization unit 203 determines mounting conditions that minimize the tact. As described above, the mounting condition indicates the mounting order, tact, and the like of a plurality of components to be mounted on the substrate 20. Then, the optimization unit 203 generates mounting condition data 164 a indicating the mounting conditions and stores the mounting condition data 164 a in the second storage unit 206.

  Here, the imaging specification data 162a indicates the specifications of the 3D imaging unit and the like as described above. That is, the imaging specification data 162a indicates whether or not the 3D imaging unit provided in the component mounter 100 is the 3D imaging unit 116a in the present embodiment, in other words, parameter data in the row of the head 112. Indicates whether switching is possible.

  Therefore, when the imaging specification data 162a indicates that switching cannot be performed, the optimization unit 203 sucks two components p to be imaged using different parameter data in each task by the nozzles nz belonging to the same row of the head 112. In order not to be performed, all tasks are determined by attaching restrictions based on parameter data to the suction mode of the component p by the head 112.

  On the other hand, when the imaging specification data 162a indicates that switching is possible, that is, when the 3D imaging unit 116a in the present embodiment is provided in the component mounter 100, the optimization unit 203 is based on the above-described parameter-based restrictions. All tasks are decided without adding. Therefore, the optimization unit 203 performs all tasks so that, in each task, two parts p to be imaged using mutually different parameter data may be attracted to the nozzles nz belonging to the same row of the head 112. decide.

  FIG. 18 is a flowchart showing the operation of the mounting condition determining apparatus 200 in the present embodiment.

  First, the optimization unit 203 of the mounting condition determination apparatus 200 acquires the imaging specification data 162a from the component mounting machine 100 via the communication unit 204 (step S200). Then, the optimization unit 203 determines whether or not the imaging specification data 162a indicates that switching is possible (step S202).

  That is, in step S202 (determination step), the mounting condition determining apparatus 200 according to the present embodiment captures two components picked up by the moving head 112 and arranged along the Y direction by the 3D imaging unit. In this case, the 3D imaging unit determines whether it is possible to capture the two parts by changing the parameter data for each part.

  Here, if the optimization unit 203 determines that switching is possible (Y in step S202), the optimization unit 203 determines the mounting condition based on the NC data 207a and the component library 207b without being restricted by the parameter data ( Step S204). For example, the optimization unit 203 determines a task as illustrated in FIG. 14 as the mounting condition.

  In other words, the mounting condition determining apparatus 200 according to the present embodiment may arrange components requiring different parameter data in the Y direction and be attracted to the head 112 in step S204 (second determining step). In addition, a task (part group) attracted to the head 112 is determined as a mounting condition.

  On the other hand, if the optimization unit 203 determines that switching is not possible (N in step S202), the optimization unit 203 determines a mounting condition under the restriction of parameter data (step S206). For example, the optimization unit 203 determines a task as illustrated in FIG. 19 as an implementation condition.

  That is, the mounting condition determining apparatus 200 according to the present embodiment is configured so that in step S206 (first determining step), the heads 112 are arranged so that components requiring different parameter data are arranged along the Y direction and are not attracted to the head 112. The task (part group) attracted by 112 is determined as a mounting condition.

  At this time, as illustrated in FIG. 19, the optimization unit 203 performs a task that is attracted to the head 112 so that two parts that require the same parameter data are arranged along the Y direction and are attracted to the head 112. To decide. Alternatively, the optimization unit 203 determines a task to be picked up by the head 112 so that only one of the two nozzles nz picks up the component.

  Then, the optimization unit 203 generates mounting condition data 164a indicating the mounting conditions determined in step S204 or step S206, stores the mounting condition data 164a in the second storage unit 206, and also via the communication unit 204. It transmits to the component mounting machine 100 (step S208).

  As mentioned above, although the mounting condition determination method and the mounting condition determination apparatus according to the present invention have been described using the above embodiment, the present invention is not limited to this.

  For example, in the above embodiment, the mounting condition determining apparatus 200 determines the task as shown in FIG. 19 when the imaging specification data 162a indicates that switching is not possible, but the task as shown in FIG. You may decide. In this case, the mounting condition determining apparatus 200 instructs the component mounting machine 100 to move the head 112 twice (two reciprocations) in the X direction on the 3D imaging unit 116a. That is, the 3D imaging unit 116a captures only the components in the A column of the head 112 during the first movement, and captures only the components in the B column of the head 112 during the second movement.

  In the above embodiment, the parameter data indicates the light intensity lower limit value, the height deviation allowable value, and the clipping level as the imaging conditions. However, the parameter data may indicate other contents. For example, the parameter data may indicate the output (laser output) of the laser beam La output from the semiconductor laser 62 that is required for imaging of the component. In this case, the output of the laser beam La output from the semiconductor laser 62 is adjusted according to the parameter data of the component to be imaged. The parameter data may indicate special imaging conditions for recognizing a component called CCGA (Ceramic Column Grid Array).

  In the above embodiment, a method for imaging a maximum of eight parts sucked by the head 112 having eight nozzles nz and a method for determining a task including a maximum of eight parts have been described. A task including nine or more parts may be determined and those parts may be imaged. Further, in the present embodiment, the plurality of nozzles nz of the head 112 are arranged in two rows, but may be arranged in three or more rows.

  Moreover, in the said embodiment, although the component mounting machine 100 shown in FIG. 2 was used as a component mounting machine, you may use component mounting machines other than such a component mounting machine 100. FIG. For example, the component mounter may be a so-called alternating component mounter that alternately mounts components on a single board with a plurality of heads.

  In the above embodiment, the 3D imaging unit 116a includes two sets of the semiconductor position detection element 64, the amplifier 64a, and the A / D conversion unit 64b, but may include three or more sets.

  Moreover, in the said embodiment, although the component mounting machine 100 and the mounting condition determination apparatus 200 were each arrange | positioned independently, the component mounting machine 100 may be provided with the mounting condition determination apparatus 200. FIG.

  The component imaging method of the present invention has an effect that the tact can be shortened, and can be applied to, for example, a camera that images a plurality of components sucked by a head in a component mounter.

1 is an external view of a component mounting system in an embodiment of the present invention. It is a figure which shows the main structures inside a component mounting machine same as the above. It is a schematic diagram which shows the positional relationship of a head same as the above and a component cassette. It is a figure which shows the example of the component tape and the reel which accommodated the components same as the above. It is explanatory drawing for demonstrating the state by which components are imaged by 3D imaging part same as the above. It is a figure which shows the machine structure inside a 3D imaging part same as the above. It is a figure which shows the function structure of a component mounting machine same as the above. It is a figure which shows an example of NC data same as the above. It is a figure which shows an example of a component library same as the above. It is a figure which shows the function structure of a 3D imaging part same as the above. It is explanatory drawing for demonstrating the light quantity lower limit and height deviation allowable value which parameter data same as the above show. It is explanatory drawing for demonstrating the clipping level which parameter data same as the above shows. It is a figure which shows the relationship between a synchronizing signal same as the above, a count number, and parameter data. It is a figure which shows the state of each component adsorbed | sucked to the head same as the above. It is a flowchart which shows operation | movement of a 3D imaging part same as the above. It is a flowchart which shows the change operation | movement of the parameter data of a 3D imaging part same as the above in detail. It is a figure which shows the function structure of the mounting condition determination apparatus same as the above. It is a flowchart which shows operation | movement of the mounting condition determination apparatus same as the above. It is explanatory drawing for demonstrating the case where the conventional tact will become long.

Explanation of symbols

62 Semiconductor Laser 62a Laser Driver 63 Polygon Mirror 63a Motor Control Unit 64 Semiconductor Position Detection Element 64a Amplifier 64b A / D Conversion Unit 66 Synchronization Signal Detection Unit 67 Third Memory 68 3D Imaging Control Unit 69 FPGA
71 Height calculation unit 72 Counter unit 73 Switching unit 74 First memory 75 Second memory 100 Component mounter 112 Head 116a 3D imaging unit 116b 2D imaging unit 160 Main control unit 200 Mounting condition determining device 201 Input unit 202 Display unit 203 Optimal Conversion unit 204 communication unit 205 first storage unit 206 second storage unit nz nozzle

Claims (10)

A component imaging method for imaging a plurality of components adsorbed by a moving head,
The irradiation position of the beam irradiated toward the head passes through the first and second parts adsorbed on the head arranged in a direction perpendicular to the moving direction of the head. An imaging step of imaging a portion irradiated with the beam of the first and second parts by detecting the beam reflected at the irradiation position while moving the irradiation position of the beam in the vertical direction; ,
A switching step of switching an imaging condition used for imaging in the imaging step between when the irradiation position is in the first part and when the irradiation position is in the second part. A component imaging method characterized by In the switching step,
When the irradiation position moves from the first component to the second component, the imaging condition is changed from the first imaging condition required for imaging the first component to the second required for imaging the second component. Switch to the imaging conditions
In the imaging step,
When the irradiation position is on the first part, a beam reflected by the first part under the first imaging condition is detected, and when the irradiation position is on the second part, the second part is detected. The component imaging method according to claim 1, further comprising: detecting a beam reflected by the second component under the imaging condition of (2). In the imaging step,
A detection sub-step for detecting a beam reflected by the first and second parts with a plurality of detection means;
For each detection means, a height calculation substep for calculating the height at the irradiation position in the first and second components based on the result detected by the detection means;
A height determining sub-step for determining one height from a plurality of heights at the irradiation position detected by the plurality of detecting means;
The component imaging method according to claim 1, further comprising: an image generation sub-step for generating images of the first and second components including the height determined in the height determination sub-step. The imaging condition indicates a lower limit value of the light amount of the beam,
In the height calculation sub-step,
The height calculation based on the result detected by the detection means is prohibited when the light amount of the beam detected by the detection means is smaller than a lower limit value indicated by the imaging condition. The component imaging method described. The imaging condition indicates an allowable value of a plurality of height deviations at the irradiation position calculated in the height calculation sub-step,
In the height determination sub-step,
When a plurality of height shifts at the irradiation position calculated in the height calculation sub-step are larger than an allowable value indicated by the imaging condition, one height is determined from the plurality of heights. The component imaging method according to claim 3, wherein the method is prohibited. The imaging condition indicates the height around the part,
In the image generation step,
The component imaging method according to claim 3, wherein an image indicating a height indicated by the imaging condition is generated as a height around the first and second components. A component imaging device for imaging a plurality of components adsorbed by a moving head,
The irradiation position of the beam irradiated toward the head passes through the first and second parts adsorbed on the head arranged in a direction perpendicular to the moving direction of the head. Imaging means for imaging the portion irradiated with the beam of the first and second parts by detecting the beam reflected at the irradiation position while moving the irradiation position of the beam in the vertical direction; ,
Switching means for switching an imaging condition used for imaging by the imaging means between when the irradiation position is in the first part and when the irradiation position is in the second part. A component imaging device characterized by A component mounting method for mounting a plurality of components on a board,
A component imaging step of imaging a plurality of components adsorbed by a moving head by the component imaging method according to claim 1;
A mounting step of mounting a plurality of components imaged in the component imaging step on a substrate. A component mounter for mounting a plurality of components on a board,
The component imaging device according to claim 7;
And a mounting means for mounting a plurality of components imaged by the component imaging device on a substrate. A program for imaging a plurality of parts adsorbed by a moving head,
The irradiation position of the beam irradiated toward the head passes through the first and second parts adsorbed on the head arranged in a direction perpendicular to the moving direction of the head. An imaging step of imaging a portion irradiated with the beam of the first and second parts by detecting the beam reflected at the irradiation position while moving the irradiation position of the beam in the vertical direction; ,
A switching step of switching an imaging condition used for imaging in the imaging step between when the irradiation position is on the first component and when the irradiation position is on the second component; A program characterized by being executed.

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