WO2020003384A1

WO2020003384A1 - Flatness acquisition system and mounting machine

Info

Publication number: WO2020003384A1
Application number: PCT/JP2018/024223
Authority: WO
Inventors: 雅史天野; 勇太横井
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2018-06-26
Filing date: 2018-06-26
Publication date: 2020-01-02
Also published as: JPWO2020003384A1; JP7181292B2

Abstract

The present invention is an improvement of a flatness acquisition system, and addresses the problem of satisfactorily acquiring the flatness of an objective part of an object even when a portion of the objective part of the object is outside the depth of field of an imaging device. In this flatness acquisition system, the relative positions of an imaging device and an object holder for retaining the object, in a first direction parallel to an axis line of the imaging device, are changed when a first portion of the objective part of the object is imaged and when a second portion thereof is imaged. For example, when a portion of the objective part of the object is outside the depth of field of the imaging device, the relative positions of the object holder and the imaging device in the first direction can be changed so that the first portion including the portion of the objective part of the object is positioned within the depth of field. As a result, a captured image that is satisfactory even in the first portion can be acquired, and the flatness of the objective part can be satisfactorily acquired.

Description

Flatness acquisition system and mounting machine

The present disclosure relates to a flatness obtaining system for obtaining flatness and a mounting machine.

Patent Literature 1 describes a lift detection device that detects whether or not each of the lead wires of a component includes a component body and a plurality of lead wires that extend side by side from four side surfaces of the component body. Have been. The lift detection device includes a slit light source that irradiates slit light to a plurality of lead wires extending in a line from one side surface of the component held by the component holder, and a plurality of lead wires that are irradiated with the slit light. And a camera for imaging the plurality of lead wires based on the captured image. The component is rotated after detecting the presence or absence of floating of the plurality of lead wires, and detecting the presence or absence of each of the plurality of lead wires extending from another side surface.

JP 2008-288336 A

Problems to be solved by the present disclosure

It is an object of the present disclosure to improve a flatness acquisition system, and to improve the flatness of a target portion of an object even when a part of the target portion of the object is out of the depth of field of the imaging device. Is to get.

Means, actions and effects for solving the problem

In the flatness acquisition system according to the present disclosure, the relative position in the first direction, which is a direction parallel to the axis of the imaging device, between the object holder that holds the object and the imaging device is the first position of the target portion of the object. It is changed between the case where one part is imaged and the case where the second part is imaged. For example, when a part of the target portion of the object is out of the depth of field of the imaging device and the first part including the part is imaged, the first part is located within the depth of field. The relative position in the first direction between the object holder and the imaging device can be changed so as to be located. As a result, the relative position of the object holder and the imaging device in the first direction depends on whether the first part of the target part of the object is imaged or the second part excluding the first part is imaged. Is changed, and a good captured image can be obtained for the first portion, and the flatness of the target portion can be obtained well.

It is a perspective view of the mounting machine concerning this embodiment. FIG. 3 is a diagram showing a component mounting device of the mounting machine. It is a front view of the imaging unit of the above-mentioned mounting machine. It is a top view of the above-mentioned imaging unit. It is a figure which shows notionally the periphery of the control apparatus of the said mounting machine. 4 is a flowchart illustrating a flatness acquisition program stored in a storage unit of the control device. It is a flowchart showing a part of said program. It is a figure showing the state where part B1 of a part is imaged by the above-mentioned imaging unit. It is a figure showing the state where the part B2 of the above-mentioned parts is imaged. It is a figure which shows notionally the some part set to the said component. It is a figure showing the state where part B1 of a part is imaged by the above-mentioned imaging unit. It is a figure showing the state where the part B2 of the above-mentioned parts is imaged. (13A) (13B) It is a figure which shows the said component notionally.

Forms for implementing disclosure

Hereinafter, a mounting machine according to an embodiment of the present disclosure will be described in detail with reference to the drawings. This mounting machine includes a flatness acquisition system.

As shown in FIG. 1, the mounting machine 4 mounts an electronic component (hereinafter, abbreviated as a component) on a circuit board S (hereinafter, abbreviated as a board S). , A component supply device 14, a component mounting device 16, an imaging unit 18, and the like.
The substrate transport and support device 12 transports and holds the substrate S. In FIG. 1, x is the transport direction of the substrate S by the substrate transport and support device 12, y is the width direction of the substrate S, and z is the thickness direction of the substrate S. y is the front-back direction of the mounting machine 4, z is the up-down direction, and these x-direction, y-direction, and z-direction are orthogonal to each other.

The component supply device 14 supplies a component to be mounted on the board S to the component mounting device 16 in a state where it can be delivered. In this embodiment, the component supply device 14 includes at least one of a tray type supply device having a tray 20, a tape feeder type supply device having a tape feeder (not shown), and a loose component supply device 21.
As shown in FIG. 13A, the components supplied by the component supply device 14 include a component 30 including a component main body 26 and a plurality of solder balls 28 as electrode portions formed on the component main body 26. As shown in FIG. 13B, the SOJ is a lead component 36 including a component main body 32 and a plurality of lead wires 34 extending from the side surface of the component main body 32 and serving as electrode portions bent in a J-shape. (Small Out Line J Lead).

The component mounting device 16 picks up and holds the component supplied by the component supply device 14, and mounts the component on the substrate S transported and supported by the substrate transport and support device 12. As shown in FIG. 2, the component mounting device 16 includes two

heads

40 and 41, a head moving device 42 that moves the two

heads

40 and 41, and the like. The head moving device 42 includes an x-direction moving device 50 for simultaneously moving the two

heads

40 and 41 in the x-direction, a y-direction moving device 52 for moving in the y-direction, and a z-direction moving device 53 for individually moving in the z-direction. 54 and the like. The y direction moving device 52 includes a y slider 55, a y motor 56 which is a linear motor, and the like. The x-direction moving device 50 is provided on the y-slider 55, and includes an x-slider 60, an x-motor 62 as a driving source, a motion converting mechanism 64 for converting the rotation of the x-motor 62 into a linear movement and transmitting the linear movement to the x-slider 60. . The z-

direction moving devices

53 and 54 are provided on the x-slider 60, and convert z-

sliders

68 and 69, z-

motors

70 and 71 as driving sources, and z-

motors

70 and 71 into linear motion, respectively, to convert the z-sliders 68 into linear motions. , 69, and a motion conversion mechanism (not shown).

ヘッド The head 40 of the two

heads

40 and 41 has one component holder 80. The component holder 80 can be, for example, a suction nozzle that suctions and holds components by negative pressure, or a chuck that holds components by a pair of claws.

The imaging unit 18 is for acquiring the three-dimensional shape of the component held by the component holder 80 positioned above, and as shown in FIGS. 3 and 4, two

projectors

90 and 91 and an imaging device as an imaging device. It includes a camera 92 and a three-dimensional shape acquiring unit 94 which mainly controls a computer, and controls the

projectors

90 and 91 and the camera 92 and acquires a three-dimensional shape of a target portion of an object.
The camera 92 is an imaging device having an imaging element such as a charge coupled device (CCD) and a complementary metal oxide semiconductor (CMOS). The camera 92 is provided so that the axis Lz extends in the z direction, and the

projectors

90 and 91 are provided at positions separated by 90 ° around the axis Lz. The

projectors

90 and 91 respectively irradiate a pattern that spreads in a plane in which the intensity changes sinusoidally in one direction in a direction inclined with respect to the z direction, the x direction, and the y direction. Further, an imaging region Rc which is an area where an image can be captured by the camera 92 is included in an irradiation area Rp which is an area where a pattern is irradiated by the

projectors

90 and 91.

In the imaging unit 18, a part of the component irradiated with the pattern by the

projectors

90 and 91 is imaged by the camera 92, and is positioned inside the imaging region Rc by the three-dimensional shape acquisition unit 94 based on the acquired image. The three-dimensional shape of the part (part) of the part is obtained by the phase shift method.

(4) A pattern whose intensity changes sinusoidally in one direction is emitted a plurality of times by shifting the phase by the

projectors

90 and 91, respectively. In addition, every time the pattern is irradiated, the camera 92 obtains a captured image that is an image in the imaging region Rc. In each of the captured images, the three-dimensional shape obtaining unit 94 obtains the luminance of each of the pixels constituting the captured image, and obtains the phase of the pixel based on the luminance value of the same pixel in the plurality of captured images. Is done. Then, by connecting pixels having the same phase, an equal phase line is obtained. On the other hand, the irradiation angle of the phase light (one line forming the pattern), the position of the pixel on the image sensor of the camera 92, the optical or geometric parameters of the image pickup unit 18 (the optical center coordinates of the

projectors

90 and 91, The distance between the image sensor of the camera 92 and the point on the component corresponding to each of the pixels connected by the equiphase lines is acquired based on the optical center coordinates of the camera 92, the focal length, and the like. Then, the three-dimensional shape of the target portion of the component is obtained based on the distance between the plurality of points on the component and the image sensor of the camera 92.

The method of acquiring the three-dimensional shape and the pattern irradiated by the

projectors

90 and 91 are not limited. For example, a three-dimensional shape can be obtained not only by the phase shift method but also widely by a pattern projection method, or a three-dimensional shape can be obtained by a stereo image method, a contour method, or the like. In the present embodiment, the three-dimensional shape of the component located in the predetermined two-dimensionally (planarly) set area may be obtained. For example, in the case of using the stereo image method, a projector is unnecessary, and a three-dimensional shape of a component located in the imaging region Rc is obtained based on images captured by a plurality of cameras.

The control device 100 mainly includes a computer, and includes an execution unit 110, a storage unit 112, an input / output unit 114, and the like, as shown in FIG. The shape acquisition unit 94 is connected, and the substrate transport support device 12, the component supply device 14, the component mounting device 16, and the like are connected via the drive circuit 120.

The operation of the mounting machine 4 configured as described above will be described.
In the mounting machine 4, the component holder 80 is moved above the imaging unit 18, and the three-dimensional shape of the target part of the component held by the component holder 80 is acquired by the imaging unit 18. The target part of the component refers to a portion of the component opposite to the surface facing the component holder 80, in other words, a portion of the component mounted on the substrate S.

For example, a part of the solder ball 28 may be missing or the lead wire 34 may be bent due to a manufacturing defect or a trouble during transportation. As described above, when the component 30 in which a part of the solder ball 28 is missing or the component 36 in which the lead wire 34 is bent is mounted on the substrate S, a problem such as the occurrence of poor current supply to the

components

30 and 36 occurs. . Therefore, in the present embodiment, the flatness of the target portion of the

components

30 and 36 is acquired, and the

components

30 and 36 are checked.

In the present embodiment, for example, in the component 30 shown in FIG. 13A, a portion including the plurality of solder balls 28 and the like is set as the target portion Ta, and based on the three-dimensional shape of the target portion Ta, the tip of the plurality of solder balls 28 The flatness of the virtual plane Pa formed by the set of (points) is obtained. In the component 36 shown in FIG. 13B, a portion including a portion of the plurality of lead wires 34 located below the component body 32 and the like is defined as the target portion Tb, and the lead wire is formed based on the three-dimensional shape of the target portion Tb. The flatness of an imaginary plane Pb formed by a set of predetermined points on the lower side surface of the part located below the component main body 32 of 34 is acquired.

However, when the target part Ta of the component held by the component holder 80 (for example, the case where the component 30 is held) is wider than the imaging region Rc of the imaging unit 18, as shown in FIG. However, a captured image including the entire target portion Ta of the component 30 cannot be obtained.
On the other hand, in the present embodiment, as shown in FIGS. 8 and 9, the component holder 80 is moved in the horizontal direction by the x-direction moving device 50 and the y-direction moving device 52. Thereby, the portion of the target portion Ta of the component 30 located in the imaging region Rc is moved, and the portion located in the imaging region Rc is changed. Each time a portion located in the imaging region Rc is changed, an image is taken by the camera 92 to obtain a three-dimensional shape. For example, as shown in FIG. 10, a plurality of portions B1 to B9 are set in advance in the target portion Ta of the component 30, and the order of imaging and the like are determined. The component holder 80 is moved by the x-direction moving device 50 and the y-direction moving device 52 so that the portions B1 to B9 are sequentially positioned within the imaging region Rc. Note that the portions B1 to B9 have an overlapping portion Bs. FIG. 10 is a diagram illustrating a state in which the component 30 is viewed from the target portion Ta. Black arrows indicate the moving directions of the portions B1 to B9 located in the imaging region Rc.

On the other hand, errors in manufacturing and assembling the component mounting device 16, errors in manufacturing and mounting the imaging unit 18, deviations in the holding position of the component 30 of the component holder 80, errors in manufacturing the component 30, and the like. Then, as shown in FIGS. 11 and 12, the target portion Ta of the component 30 held by the component holder 80 is perpendicular to the axis Lz of the camera 92 (in many cases, extends in the horizontal direction). May be inclined. In this case, as shown by the broken line in FIG. 12, when the part located in the imaging region Rc is changed from the part B1 to the part B2 by moving the component holder 80 in the horizontal direction, the part A part Bx of B2 deviates from the depth of field C of the camera 92. The depth of field C refers to a range in which a clear image can be obtained as a captured image before and after a focused object in the camera 92, and is determined by the characteristics of the camera 92. For a part Bx that deviates from the depth of field C, the captured image becomes unclear, and it is difficult to accurately obtain a three-dimensional shape.

Therefore, in the present embodiment, the heights h1 and h2 of the two points Q1 and Q2 obtained when the three-dimensional shape of the portion B1 of the target portion Ta of the component 30 is obtained from the imaging device of the camera 92, respectively. Based on the horizontal distance w between the two points Q1 and Q2, the inclination k1 of the part B1 is obtained.
k1 = (h2-h1) / w
In this case, as shown in FIG. 10, the two points Q1 and Q2 are two points separated in the direction indicated by the arrow F1, that is, in the direction of the relative movement between the component holder 80 and the camera 92. , Q2 is the distance in the direction parallel to the arrow F1, and the slope k is the slope of the portion B1 in the direction parallel to the arrow F1.

Also, (a) the slope k1, (b) the height h2 of the point Q2 closer to the portion B2 of the two points Q1 and Q2, and (c) the end of the point Q2 and the portion B2 farther from the portion B1. The height h2 * of the end E2 of the part B2 when the component holder 80 is moved in the horizontal direction so that the part B2 is located in the imaging region Rc based on the distance x1 to the part E2. To get.
h2 * = h2 + k1 × x1
Then, when the height h2 * of the end E2 of the portion B2 is within the depth of field C of the camera 92, in other words, when it is between the height hc1 and the height hc2 in FIG. 12 (hc1 <h2). In * <hc2), it is determined that there is a high possibility that the entire part B2 is located within the depth of field C. In this case, the component holder 80 is moved in the horizontal direction without being moved up and down, and the portion B2 is positioned in the imaging region Rc. On the other hand, when the height h2 * of the end E2 of the part B2 deviates from the depth of field C (h2 *> hc2, h2 * <hc1), at least a part of the part B2 may deviate from the depth of field. Is determined to be high. In this case, as shown in FIG. 12, the component holder 80 is moved up and down while being moved in the horizontal direction so that the entire portion B2 is located within the depth of field C. Thereafter, the three-dimensional shape of the portion B2 is obtained.

Further, for example, when the part located in the imaging region Rc is changed from the part B3 shown in FIG. 10 to the part B4 due to the horizontal movement of the component holder 80, the direction indicated by the arrow F4 in the part B3 The inclination k3 in the direction of the arrow F4 is obtained based on the heights h5 and h6 of the two points Q5 and Q6 separated from each other and the distance w3 in the direction parallel to the arrow F4 between the points Q5 and Q6. . Further, the height h4 * of the end E4 is obtained based on the inclination k3 and the distance x3 in a direction parallel to the arrow F4 between the point Q6 and the end E4 of the part B4 on the far side from the part B3. , Is located within the depth of field C. According to the determination result, the component holder 80 is moved in the horizontal direction, or is moved in the horizontal direction and the vertical direction.

三 Thus, a three-dimensional shape is obtained for each of the portions B1 to B9, and the obtained three-dimensional shapes are combined to obtain a three-dimensional shape of the entire target portion.

For example, the three-dimensional shapes acquired for each of a plurality of parts can be combined based on the elevation amount ΔH of the component holder 80. For example, when the component holder 80 is moved up and down by ΔH when the part B2 is imaged, the three-dimensional shape acquired for the part B1 and the three-dimensional shape acquired for the part B2 are shifted by an amount of elevation ΔH. It combines the three-dimensional shape.

In addition, the three-dimensional shape obtained for the portion B1 and the three-dimensional shape obtained for the portion B2 are acquired such that the three-dimensional shape of the overlapping portion Bs1 of the portion B1 matches the three-dimensional shape of the overlapping portion Bs1 of the portion B2. Can be combined with the three-dimensional shape. For example, the heights of one or more points included in the overlapping portion Bs1 are obtained based on the captured image including the portion B1 (hd1), and are obtained based on the captured image including the portion B2 (hd2). The three-dimensional shape acquired in the portion B2 is shifted so that the heights hd1 and hd2 match. The relationship of the formula (hd1 = hd2 + ΔH) should be established between the heights hd1 and hd2, but may include other errors. Therefore, by correcting the value to be shifted based on the difference between the heights hd1 and hd2 of these overlapping portions, the three-dimensional shape of the target portion Ta can be acquired more accurately.

The flatness acquisition program in that case will be described with reference to the flowchart of FIG. This program is executed by the control device 100, and every time the component holder 80 is moved in the horizontal direction, a three-dimensional shape acquisition command is output to the three-dimensional shape acquisition unit 94. In the imaging unit 18, a pattern is emitted by the

projectors

90 and 91 under the control of the three-dimensional shape acquisition unit 94, and a captured image is acquired by the camera 92. Then, a three-dimensional shape is acquired based on the captured image and supplied to the control device 100.

In step 1 (hereinafter abbreviated as S1; the same applies to other steps), a count value n of a counter that counts the number of portions where the three-dimensional shape has been acquired is initialized (set to 0), and S2 is performed. In, the component holder 80 is moved to a predetermined three-dimensional shape acquisition start position above the imaging unit 18. For example, for the component 30, the position of the component holder 80 where the portion B1 in FIG. 10 is located within the imaging region Rc can be set as the three-dimensional shape acquisition start position. In S3, a three-dimensional shape acquisition command is output to the imaging unit 18. Thereby, the three-dimensional shape of the portion B1 is obtained, supplied to the control device 100, and stored. Next, in S4, the count value of the counter for counting the number of parts is increased by one, and in S5, it is determined whether the count value is equal to or more than the set value Ns. The set value Ns is the number of the parts B1 to B9 set in the target part Ta of the component 30, and is 9, for example, for the component 30 shown in FIG.

If the determination in S5 is NO, in S6, the inclination k is obtained as described above based on the three-dimensional shape of the portion B1, and in S7, the end of the portion B2 from which the next three-dimensional shape is obtained. The height h2 * of E2 is obtained. Then, in S8, it is determined whether there is a high possibility that the entire part B2 is located within the depth of field. If the determination is YES, in S9, the component holder 80 is moved in the horizontal direction so that the part B2 is positioned within the imaging region Rc, and the steps from S3 are similarly performed. The part B2 is located in the imaging region Rc, and a three-dimensional shape is obtained for the part B2.
On the other hand, if the determination in S8 is NO, in S10, the component holder 80 is moved in the horizontal direction and moved up and down. The elevating amount is determined such that the height h2 * of the end E2 of the portion B2 is within the depth of field C. After that, S3 and subsequent steps are similarly executed, and S3 to S11 are repeatedly executed. Meanwhile, if the number of the portions where the three-dimensional shape is obtained becomes equal to or more than Ns, the determination in S5 becomes YES, and in S12, the flatness of the component is obtained.

The execution of S12 will be described with reference to the flowchart of FIG.
In S21, when the portion located in the imaging region Rc is changed, the elevation amount ΔH when the component holder 80 is moved up and down is read, and in S22, each overlapping portion Bs1 of the portions B1 to B9 is read. The height of at least one point of each of .about.Bs9 is read. In S23, the three-dimensional shapes of the portions B1 to B9 are combined based on the elevation amount ΔH of the head 40 and the height of at least one point of each of the overlapping portions Bs1 to Bs9. Then, in S24, the flatness of the virtual plane Pa is obtained based on the combined three-dimensional shape.

As described above, in the present embodiment, even when the target part Ta of the component 30 is wider than the imaging region Rc and the target part Ta is inclined with respect to a plane orthogonal to the axis Lz of the camera 92. Then, the component holder 80 is moved up and down to position the portion located in the imaging region Rc within the depth of field. This makes it possible to accurately acquire the three-dimensional shape of the target portion Ta of the component 30, and to accurately acquire the flatness.

In the mounting machine configured as described above, the object corresponds to the

components

30 and 36, and the object holder corresponds to the component holder 80. The first direction corresponds to the vertical direction, and the second direction corresponds to the horizontal direction. The second direction may be the direction of relative movement between the component holder 80 (head 40) and the camera 92. The functional portion corresponds to the electrode portion, the first portion corresponds to the portion B1, and the second portion corresponds to the portion B2.
Further, the distance acquisition unit and the height acquisition unit are configured by a part that acquires the three-dimensional shape of the target part of the three-dimensional shape acquisition unit 94, and the like. The flatness acquisition unit is configured by a portion that stores and executes S12 of the flatness acquisition program of the control device 100, and the first direction relative position change unit and the portion that the relative height control unit stores S11 execute. The second direction relative position changing unit is constituted by a part for storing and executing S9 and S10, and the like. The second direction relative position changing unit includes the first direction relative position changing unit and the second direction relative position changing unit. A position changing unit is configured. The x-direction moving device 50 and the y-direction moving device 52 constitute a horizontal moving device, and the z-direction moving device 53 constitutes a vertical moving device. Further, the distance acquisition unit control unit and the height acquisition control unit are configured by a part that stores and executes S3, the inclination acquisition unit is configured by a part that stores S6 and an execution unit, and the determination unit is performed by S8. And a part to execute. It should be noted that a flatness acquisition system is configured by the imaging unit 18, the portion of the control device 100 that stores and executes the flatness acquisition program represented by the flowchart in FIG. 6, and the like.

In the above embodiment, the height h2 * of the end E2 of the portion B2 is acquired based on the inclination k1 of the portion B1, and when the height h2 * is out of the depth of field, the component holding is performed. Although the tool 80 is moved in the horizontal direction and in the vertical direction, it is not essential to acquire the height h2 * of the end E2. For example, the component holder 80 is horizontally moved without acquiring the height k2 * of the end E2, while acquiring the inclination k1 of the portion B1. When at least a part of the part B2 is out of the depth of field as a result of imaging the part B2 with the camera 92, the height h2 * of the end E2 of the part B2 is determined based on the inclination k1 of the part B1. The component holder 80 can be raised and lowered so that the height h2 * of the end E2 is located within the depth of field. Also, it is not essential to acquire the inclination k1 of the portion B1. For example, as a result of moving the component holder 80 in the horizontal direction so that the portion located in the imaging region Rc is changed from the portion B1 to the portion B2 and imaging the portion B2 with the camera 92, at least a portion of the portion B2 is obtained. When it is out of the depth of field, the component holder 80 can be moved up and down as appropriate to position the portion B2 within the depth of field.

It is not essential that the imaging unit 18 acquire the three-dimensional shape of the target portion of the component, but only the height of a plurality of points of the portion from the imaging device of the camera 92 may be acquired. For example, based on the height of the tip (point) of the solder ball 28 of the component 30 from the image sensor of the camera 92, the flatness of the virtual plane Pa can be obtained.

Furthermore, when a plurality of portions are set in the target portion, it is not essential that the portions have overlapping portions. Further, it is not essential to apply the flatness acquisition system to the mounting machine 4, and the flatness acquisition system may be executed in a single system. The present invention can be implemented in a mode in which various changes are made based on the above.

4: Mounting machine $ 10: Control device $ 18: Imaging unit $ 40: Head $ 42: Head moving device $ 50: X direction moving device $ 52: Y direction moving device $ 54: Z direction moving device $ 80: Component holder $ 90, 91: Projector $ 92: Camera # 94: Three-dimensional shape acquisition unit # 100: Control unit # 110: Execution unit # 112: Storage unit

Claims

An imaging unit including an imaging device that acquires an image of a predetermined imaging region,
Each of a plurality of points of a portion located in the imaging region of the target portion on the opposite side of the object held by the object holding device from the side facing the object holding device and each of the plurality of points between the imaging device. A distance obtaining unit that obtains a distance based on an image captured by the imaging device,
A plurality of the portions are set in the target portion of the object, and based on a distance between each of the plurality of points acquired by the distance acquisition unit in each of the plurality of the portions and the imaging device, A flatness acquisition unit for acquiring the flatness of the target portion,
In the case where the portion located in the imaging region is the first portion of the target portion of the object and in the case where the first portion is a second portion different from the first portion, the object holder and the imaging device A relative position change unit including a first direction relative position change unit that changes a relative position in a first direction that is a direction parallel to the axis of the imaging device.
The first direction relative position change unit, such that the first portion is located within the depth of field of the imaging device, and the second portion is located within the depth of field of the imaging device, 2. The relative position of the object holder and the imaging device in the first direction is changed by moving the object holder and the imaging device closer and farther in the first direction. 3. Flatness acquisition system.
The relative position changing unit changes a relative position of the object holder and the imaging device in a second direction orthogonal to the first direction, thereby changing a part of the object located in the imaging region. Including a second direction relative position changing unit,
The flatness acquisition system, each time the portion located in the imaging region is changed by the second direction relative position change unit, each of the plurality of points of the changed portion and the imaging device The flatness acquisition system according to claim 1, further comprising a distance acquisition unit control unit that causes the distance acquisition unit to acquire each distance between the two.
The relative position change unit, based on the distance between each of at least two of the plurality of points of the portion acquired by the distance acquisition unit and the imaging device, the object holder and 4. The apparatus according to claim 1, wherein a relative position in the second direction with respect to the imaging device is changed, and a relative position in the first direction between the object holder and the imaging device is changed. 5. 4. The flatness acquisition system according to 1.
The relative position change unit, (a) based on each distance between each of the at least two points of the portion acquired by the distance acquisition unit and the imaging device, the portion of the target portion of the portion A tilt obtaining unit that obtains a tilt with respect to a second direction, and (b) changing a relative position of the object holder and the imaging device in the second direction based on the tilt obtained by the tilt obtaining unit. A determination unit that determines whether there is a high possibility that at least part of the portion of the target portion next located in the imaging region is out of the depth of field. If it is determined that there is a high possibility that at least a part of the portion deviates from the depth of field, the relative position of the object holder and the imaging device in the second direction is changed and the second position is changed. Relative position in one direction And if it is determined that the possibility that at least a part of the next portion deviates from the depth of field is low, the relative position of the object holder and the imaging device in the first direction The flatness acquisition system according to claim 4, wherein the relative position in the second direction is changed without changing the position.
The flatness acquisition system according to any one of claims 1 to 5, wherein the plurality of portions include overlapping portions.
The flatness acquisition unit, in each of the plurality of portions, the distance between each of the plurality of points acquired by the distance acquisition unit and the imaging device, and the first direction relative position change unit The flatness of the target portion of the object is acquired based on the changed amount of the relative position of the object holder and the imaging device in the first direction that has been changed. A flatness acquisition system according to any one of the preceding claims.
The object includes a main body, and a plurality of functional units provided in the main body,
The target unit includes at least a part of the plurality of functional units,
The flatness acquisition unit according to any one of claims 1 to 7, wherein the flatness acquisition unit acquires flatness of a virtual plane, which is a set of predetermined points of at least some of the plurality of functional units. Flatness acquisition system.
An imaging unit including an imaging device that acquires an image of a predetermined imaging region,
Each of a plurality of points of a portion located in the imaging region of the target portion on the opposite side of the object held by the object holding device from the side facing the object holding device and each of the plurality of points between the imaging device. A distance obtaining unit that obtains the distance based on the captured image of the portion captured by the imaging device,
A relative position changing unit that changes a relative position between the object holder and the imaging device by moving the object holder,
Due to the relative position changing unit moving the object holder in a second direction orthogonal to a first direction that is a direction parallel to an axis of the imaging device, the object holding tool moves in the imaging area of the target unit. A distance that causes the distance obtaining unit to obtain each distance between each of the plurality of points of the part located in the changed imaging area and the imaging device each time the located part is changed. An acquisition control unit;
A plurality of the portions are set in the target portion of the object, based on a distance between each of the plurality of points acquired by the distance acquisition unit and the imaging device in each of the plurality of the portions. A flatness acquisition unit for acquiring the flatness of the target portion,
The relative position change unit, based on a distance between each of at least two points of the plurality of points of the portion acquired by the distance acquisition unit and the imaging device, the object holding tool, By moving the object in the second direction and moving the object in the first direction, a portion of the object held by the object holder, which is located within the imaging region, is located within the depth of field of the imaging device. Flatness acquisition system.
A mounting machine for mounting electronic components on a circuit board,
A component holder for holding the electronic component,
A horizontal moving device for moving the component holder in the horizontal direction, and a holder moving device including a vertical moving device for moving the component holder in the vertical direction,
At least, an imaging unit having an axis extending in the vertical direction, including an imaging device that acquires an image of a predetermined imaging region, and an imaging unit located below the component holder,
The height of each of a plurality of points of a portion located in the imaging region on the bottom of the electronic component held by the component holder on the side mounted on the circuit board is obtained from the imaging device. A height acquisition unit,
By controlling the holder moving device, a relative position controller that controls a relative position between the component holder and the imaging device, and by controlling the horizontal moving device by the relative position controller, the component holder and Each time a portion of the bottom surface located in the imaging region is changed by a change in the relative position in the horizontal direction with the imaging device, the height acquisition unit informs the height acquisition unit of each of a plurality of points of the portion. A height acquisition control unit for acquiring the height,
A plurality of the portions are set on the bottom of the electronic component, and the flatness of the bottom is obtained based on the height of each of the plurality of points obtained by the height obtaining unit in each of the plurality of portions. And a flatness acquisition unit that performs
The relative position control unit, based on the height acquired by the height acquisition unit of each of at least two of the plurality of points of the portion, by controlling the holder moving device, By moving the component holder in the horizontal direction and moving the component holder in the vertical direction, the portion of the electronic component held by the component holder, which is located in the imaging region on the bottom, is moved to the field of view of the imaging device. A mounting machine including a relative height control unit located within the depth.