JP2009003734A - Method for attaching ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for attaching an IC tag that can improve the adhesive strength between an IC tag and an adherend. <P>SOLUTION: The method for attaching an IC tag has a process for attaching an IC tag, a process for covering with a cover sheet and a welding process. In the process for attaching an IC tag, an IC tag, having an IC chip, an antenna for transmitting and receiving information stored in the IC chip to and from an external device and a base film on which the IC chip and an antenna are installed, is positioned and installed on the adherend. In the process for covering with a cover sheet, the IC tag positioned and installed on the adherend is covered with a cover sheet from upward. In the welding process, the cover sheet and the base film are welded on the adherend in some areas other than the area in which the IC chip and the antenna are installed. Consequently, the adhesive strength between the IC tag and the adherend can be improved. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for attaching an IC tag to be attached to an adherend.

  In general, an IC tag mainly includes a pair of base films, an IC chip, and an antenna. The IC chip and the antenna are sandwiched between a pair of base films, and an adhesive is applied on the outer surface of one of the base films. The IC tag is adhered to an adherend such as a plastic container by the adhesive.

  The pressure-sensitive adhesive has a pressure-sensitive adhesive strength of about 20 to 30 N / inch even if it is a kind called strong pressure-sensitive adhesive. For this reason, when the IC tag receives a strong impact force or shearing force from the outside, it may cause a failure of the IC chip or detachment from the adherend.

  In Patent Document 1, a waterproof cover member is disposed above and below an IC chip substrate including an IC chip and an antenna, respectively, and the cover member is sealed around the IC chip substrate. A technology for providing waterproof properties to an IC chip is described.

JP-A-2005-316718

  This invention is made | formed in view of said point, and makes it a subject to provide the sticking method of the IC tag which can improve the adhesive strength between an IC tag and a to-be-adhered body.

  In one aspect of the present invention, an IC tag attaching method includes an IC chip, an antenna that transmits and receives information stored in the IC chip with an external device, the IC chip, and a base film on which the antenna is installed. An IC tag installation step for positioning and installing an IC tag on an adherend, and a cover sheet covering step for covering the IC tag positioned and installed on the adherend with a cover sheet from above, A welding step in which the cover sheet and the base film are welded to the adherend in a region other than the region where the IC chip and the antenna are installed.

  The above-described IC tag attaching method includes an IC tag attaching step, a cover sheet covering step, and a welding step. The IC tag affixing step includes an IC tag including an IC chip, an antenna that transmits / receives information stored in the IC chip to / from an external device, and a base film on which the IC chip and the antenna are installed. Position and install on the kimono. In the cover sheet covering step, the IC tag positioned and installed on the adherend is covered with a cover sheet from above. In the welding step, the cover sheet and the base film are welded to the adherend in a region other than the region where the IC chip and the antenna are installed. By doing in this way, the adhesive strength between the said IC tag and the said adherend can be improved rather than the case where the said IC tag is adhere | attached on the said adherend through only the adhesion layer.

  In a preferred embodiment of the present invention, in the method for attaching an IC tag, in the welding step, the cover sheet and the base film are welded to the adherend by welding.

  In another aspect of the method for attaching an IC tag, a through hole is provided in the partial area of the base film. As a result, even if the base film and the adherend are difficult to weld, the cover sheet can be directly welded to the adherend, so the IC tag can be attached only through the adhesive layer. The adhesive strength between the IC tag and the adherend can be improved as compared with the case where the adherend is adhered to the adherend.

  In another aspect of the above-described method of attaching the IC tag, a convex portion is provided in the partial area of the cover sheet, and the cover sheet covering step is positioned and installed on the adherend. Further, when the IC tag is covered with the cover sheet from above, the convex portion is penetrated through the base film. Thereby, even if it is a case where the through-hole is not provided in the said base film, the said cover sheet can be welded directly to the said to-be-adhered body. In addition, even when the base film and the adherend are difficult to weld, the cover sheet can be directly welded to the adherend, so that the IC tag is attached to the adherend only through the adhesive layer. The adhesive strength between the IC tag and the adherend can be improved as compared with the case where the adherend is adhered to the adherend.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]
A first embodiment of the present invention will be described. FIG. 1 is a schematic diagram showing a state when an IC tag is attached to an adherend. As shown in FIG. 1, the IC tag 10 is attached to an adherend 20 such as a container made of PET (Polyethylene Terephthalate).

(Configuration of IC tag)
First, the structure of the IC tag according to the first embodiment will be described with reference to FIG. FIG. 2 is a schematic diagram showing the structure of the IC tag 10 according to the first embodiment. 2A shows a plan view of the IC tag 10, and FIG. 2B shows a cross-sectional view of the IC tag 10 taken along a cutting line AA ′ in FIG. 2A.

  The IC tag 10 mainly includes base films 11 and 12, an IC chip 14, an antenna 13, and an adhesive layer 15.

  The IC chip 14 and the antenna 13 are installed on the surface of the base film 11. In this manner, the IC chip 14 and the antenna 13 installed on the surface of the base film 11 are also called “inlets”. The base film 12 is bonded to the base film 11 so as to cover the IC chip 14 and the antenna 13. That is, the IC tag 10 has a structure in which the IC chip 14 and the antenna 13 are sandwiched between the pair of base films 11 and 12.

  The IC chip 14 stores necessary data. The antenna 13 is made of a conductive metal and is electrically connected to the IC chip 14. The antenna 13 transmits / receives data stored in the IC chip 14 to / from an external device, for example, a reading / writing device (not shown) equipped in customs.

  The adhesive layer 15 is formed by applying an adhesive to the surface of the base film 11 opposite to the surface on which the IC chip 14 and the antenna 13 are installed. The IC tag 10 is bonded to the adherend 20 via the adhesive layer 15. The pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer 15 is about 20 to 30 N / inch even if it is a kind called strong pressure-sensitive adhesive. For this reason, when the IC tag 10 is bonded to the adherend 20 only through the adhesive layer 15, the IC chip 14 may fail or the IC tag 10 may be damaged when subjected to a strong impact force or shear force from the outside. Desorption from the adherend 20 may be caused.

  Therefore, in the method for attaching the IC tag 10 according to the first embodiment, the IC tag 10 is adhered to the adherend 20 via the adhesive layer 15 and then covered with the cover sheet 16, and the cover sheet 16 and the base film 11 are covered. The cover sheet 16 and the base films 11 and 12 are welded to the adherend 20 in the region Pa by performing a welder process on the region Pa in the region 12. Thereby, the adhesive strength between the IC tag 10 and the adherend 20 can be improved. Here, the area Pa is a partial area other than the area where the IC chip 14 and the antenna 13 are installed. In the following, the area Pa is located at both ends of the IC tag 10 as shown in FIG. Suppose that it is provided. In addition, as a material of the base films 11 and 12 and the cover sheet 16, for example, polypropylene, polyethylene, acrylic, PET, or the like is used, and preferably the same material as the material of the adherend 20 is desirable. This is because the base films 11, 12 and the cover sheet 16 can be easily welded to the adherend 20 by making the base films 11, 12 and the cover sheet 16 the same material as the adherend 20. is there.

(IC tag sticking method according to the first embodiment)
Next, a method for attaching an IC tag according to the first embodiment will be specifically described with reference to FIGS. FIG. 3 is a flowchart showing an IC tag attaching method according to the first embodiment. FIG. 4 is a schematic diagram of each step in the IC tag attaching method according to the first embodiment.

  As shown in FIG. 3, the IC tag attaching method according to the first embodiment includes three steps: an IC tag installation step (step P11), a cover sheet covering step (step P12), and a welding step (step P13). Consists of. Each of these steps is performed by being automated by a machine such as a sticking device, for example.

  First, as shown in FIG. 4A, in the IC tag installation process (process P11), the IC tag 10 is positioned and installed on the adherend 20. Specifically, the IC tag 10 is installed by being bonded to the adherend 20 via the adhesive layer 15 after being positioned on the adherend 20. By adhering the IC tag 10 via the adhesive layer 15, the IC tag 10 does not deviate from the position once positioned, and is positioned reliably.

  Next, as shown in FIG. 4B, in the cover sheet covering step (step P12), the IC tag 10 positioned on the adherend 20 is covered with the cover sheet 16 from above. In the welding process (process P13), the cover sheet 16 and the base films 11 and 12 are welded to the adherend 20 in the region Pa. In the first embodiment, the cover sheet 16 and the base films 11 and 12 are welded to the adherend 20 in the region Pa by welding. Specifically, as shown in FIG. 4B, the thermal iron 30 of the welder machine is lowered from above the cover sheet 16, and the lower end portion 31 of the thermal iron 30 is moved to the area Pa of the cover sheet 16. The cover sheet 16 and the base films 11 and 12 are heated while being pressed and welded to the adherend 20. In this manner, as shown in FIG. 4C, the cover sheet 16 and the base films 11 and 12 are welded to the adherend 20 in the region Pa. Here, in FIG.4 (c), the white double-ended arrow has shown having welded. Thereafter, the cover sheet 16 and the base films 11 and 12 are cooled to be integrated with the adherend 20 to complete the attachment of the IC tag 10 to the adherend 20. Thereby, the adhesive strength between the IC tag 10 and the adherend 20 can be improved as compared with the case where the IC tag 10 is bonded only through the adhesive layer 15.

  As can be seen from the above description, in the first embodiment, the cover sheet 16 and the base films 11 and 12 are welded to the adherend in the region Pa, so that the IC tag 10 is interposed only through the adhesive layer 15. Thus, the adhesive strength between the IC tag 10 and the adherend 20 can be improved as compared with the case where it adheres to the adherend 20.

[Second Embodiment]
Next, a second embodiment of the present invention will be described. First, the structure of the IC tag according to the second embodiment will be specifically described with reference to FIG. FIG. 5 is a schematic diagram showing the structure of the IC tag 10a according to the second embodiment. FIG. 5A shows a plan view of the IC tag 10a, and FIG. 5B shows a cross-sectional view of the IC tag 10a along the cutting line BB ′ of FIG. 5A.

  The IC tag 10a according to the second embodiment has almost the same configuration as the IC tag 10 according to the first embodiment. The IC tag 10a according to the second embodiment is greatly different from the IC tag 10 according to the first embodiment in that a through hole 11h is provided in the region Pa of the base film 11. In the second embodiment, the base film 12 has a size that does not cover the region Pa.

(IC tag sticking method according to the second embodiment)
Next, a method of attaching an IC tag according to the second embodiment will be specifically described with reference to FIG. FIG. 6 shows a schematic diagram of each step in the IC tag attaching method according to the second embodiment.

  Similarly to the first embodiment, the IC tag attaching method according to the second embodiment is composed of an IC tag installation process, a cover sheet covering process, and a welding process. Therefore, in the following description, the flowchart shown in FIG. 3 will be used again.

  First, as shown in FIG. 6A, in the IC tag installation step (step P11), the IC tag 10a is positioned and installed on the adherend 20 as in the first embodiment.

  Next, as shown in FIG. 6B, in the cover sheet covering step (step P12), the IC tag 10a positioned on the adherend 20 is covered with the cover sheet 16 from above. In the welding process (process P13), the cover sheet 16 and the base film 11 are welded to the adherend 20 in the region Pa. In the second embodiment, as in the first embodiment, the cover sheet 16 and the base film 11 are welded to the adherend 20 in the region Pa by a welder process. Specifically, as shown in FIG. 6B, the thermal iron 30 of the welder machine is lowered from above the cover sheet 16, and the lower end 31 of the thermal iron 30 is moved to the area Pa of the cover sheet 16. The cover sheet 16 and the base film 11 are heated while being pressed and welded to the adherend 20. The cover sheet 16 and the base film 11 are welded to the adherend 20 in the region Pa. At this time, in the second embodiment, the cover sheet 16 penetrates into the through hole 11h of the base film 11, so that the both ends of the white portion in FIG. As shown by the arrow, the cover sheet 16 is directly welded to the adherend 20. Therefore, for example, even if the base film 11 is difficult to weld to the adherend 20 due to the difference between the material of the base film 11 and the adherend 20, the cover sheet penetrates into the through hole 11 h. 16 is directly welded to the adherend 20, so that the adhesive strength between the IC tag 10a and the adherend 20 is higher than when the IC tag 10a is adhered to the adherend 20 only through the adhesive layer 15. Can be improved.

  Thereafter, the cover sheet 16 and the base films 11 and 12 are cooled to be integrated with the adherend 20 and the attachment of the IC tag 10a to the adherend 20 is completed.

  As can be seen from the above description, in the second embodiment, even if the base film 11 is difficult to weld to the adherend 20, the through hole 11 h is provided in the region Pa of the base film 11. Since the cover sheet 16 can be directly welded to the adherend 20, the IC tag 10 a and the adherend 20 can be bonded to each other rather than the case where the IC tag 10 a is adhered to the adherend 20 only through the adhesive layer 15. The adhesive strength between them can be improved.

[Third Embodiment]
Next, a third embodiment of the present invention will be described. The IC tag according to the third embodiment is the same as the IC tag 10 according to the first embodiment. In 3rd Embodiment, the point from which the convex part is provided in area | region Pa of the cover sheet 16 is a point different from 1st Embodiment so that it may describe below.

(IC tag sticking method according to the third embodiment)
Next, a method for attaching an IC tag according to the third embodiment will be described with reference to FIGS. FIG. 7 and FIG. 8 show schematic views of respective steps in the IC tag attaching method according to the third embodiment.

  The IC tag attaching method according to the third embodiment is composed of three steps, an IC tag installation step, a cover sheet covering step, and a welding step, as in the first embodiment. Therefore, in the following description, the flowchart shown in FIG. 3 will be used again.

  First, as shown in FIG. 7A, in the IC tag installation step (step P11), the IC tag 10a and the adherend 20 are positioned and installed as in the first embodiment.

  Next, as shown in FIG. 7B, in the cover sheet covering step (step P12), the IC tag 10 positioned on the adherend 20 is covered with the cover sheet 16 from above. At this time, in 3rd Embodiment, the convex part 16a of the cover sheet 16 is penetrated by the base films 11 and 12 and the adhesion layer 15. FIG. Thereby, the convex part 16 a of the cover sheet 16 comes into contact with the adherend 20. Here, the shape of the convex portion 16a of the cover sheet 16 may be any shape that can penetrate the base films 11 and 12 and the adhesive layer 15, such as an acute angle shape.

  Next, as shown in FIG. 8A, in the welding step (step P13), the cover sheet 16 and the base films 11 and 12 are welded to the adherend 20 in the region Pa. In the third embodiment, similarly to the first embodiment, the cover sheet 16 and the base films 11 and 12 are welded to the adherend 20 in the region Pa by a welder process. Thus, the cover sheet 16 and the base film 11 are welded to the adherend 20 in the region Pa. At this time, in the third embodiment, the cover sheet 16 is attached to the adherend as shown by the white double-headed arrows in FIG. 8B at the portion where the convex portion 16a of the cover sheet 16 and the adherend 20 contact. 20 and welded directly. Therefore, as in the second embodiment, for example, even if the base film 11 and the adherend 20 are different in material, it is difficult to weld the base film 11 to the adherend 20. Since the sheet 16 is directly welded to the adherend 20, the adhesive strength between the IC tag 10 a and the adherend 20 is greater than when the IC tag 10 is adhered to the adherend 20 only through the adhesive layer 15. Can be improved.

  Thereafter, the cover sheet 16 and the base films 11 and 12 are cooled to be integrated with the adherend 20 to complete the attachment of the IC tag 10 to the adherend 20.

  As can be seen from the above description, in the third embodiment, the base film 11, 12 is formed by providing the convex portion 16 a in the region Pa of the cover sheet 16 and penetrating the convex portion 16 a through the base films 11, 12. Even when the through hole is not provided, the cover sheet 16 can be directly welded to the adherend 20. Similarly to the second embodiment, even when the base film 11 is difficult to weld to the adherend 20, the cover sheet 16 can be directly welded to the adherend 20, so that the IC tag 10a is attached to the adhesive layer. The adhesive strength between the IC tag 10 and the adherend 20 can be improved as compared with the case where the adherend 20 is adhered via only 15.

[Modification]
Next, modified examples of the above-described embodiments will be described.

  In each of the above-described embodiments, as shown in FIGS. 2 and 5, the area Pa is provided at both ends of the IC tags 10 and 10 a, but the position and range of the area Pa are not limited thereto. Needless to say. For example, the area Pa may be provided so as to surround the area where the IC chip 14 and the antenna 13 are installed. By doing in this way, adhesive strength can be improved more.

  In each of the above-described embodiments, the adhesive layer 15 is provided on the base film 11. However, in the above-described embodiments, this is provided to ensure the positioning of the IC tags 10 and 10a. It is what. Therefore, the adhesive layer 15 may not be provided on the base film 11.

  Furthermore, in each of the above-described embodiments, the base film 12 that covers the IC chip 14 and the antenna 13 installed on the base film 11 is provided, but instead of providing the base film 12, an inlet, That is, the IC chip 14 and the antenna 13 installed on the base film 11 may be covered.

It is a schematic diagram which shows a mode when an IC tag is affixed on a to-be-adhered body. It is a schematic diagram which shows the structure of the IC tag which concerns on 1st Embodiment. It is a flowchart which shows the sticking method of an IC tag. It is a schematic diagram of each process in the sticking method of the IC tag which concerns on 1st Embodiment. It is a schematic diagram which shows the structure of the IC tag which concerns on 2nd Embodiment. It is a schematic diagram of each process in the sticking method of the IC tag which concerns on 2nd Embodiment. It is a schematic diagram of each process in the sticking method of the IC tag which concerns on 3rd Embodiment. It is a schematic diagram of each process in the sticking method of the IC tag which concerns on 3rd Embodiment.

Explanation of symbols

  10 IC tag, 11, 12 Base film, 13 Antenna, 14 IC chip, 15 Adhesive layer, 16 Cover sheet, 20 Substrate

Claims (4)

An IC tag having an IC chip, an antenna that transmits / receives information stored in the IC chip to / from an external device, and a base film on which the IC chip and the antenna are installed is positioned and installed on an adherend. IC tag installation process,
A cover sheet covering step of covering the IC tag positioned and installed on the adherend with a cover sheet from above;
Affixing an IC tag, comprising: a step of welding the cover sheet and the base film to the adherend in a region other than a region where the IC chip and the antenna are installed. Method.   2. The IC tag attaching method according to claim 1, wherein, in the welding step, the cover sheet and the base film are welded to the adherend by welding.   The method for attaching an IC tag according to claim 1, wherein a through hole is provided in the partial region of the base film.   A convex portion is provided in the partial region of the cover sheet, and in the cover sheet covering step, the IC tag positioned and installed on the adherend is covered with the cover sheet from above. The method for attaching an IC tag according to claim 1, wherein the convex portion is penetrated through the base film.

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