JP2008526062A - 全体的に分離したカラーゾーンを有するイメージセンサー - Google Patents

全体的に分離したカラーゾーンを有するイメージセンサー Download PDF

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Publication number
JP2008526062A
JP2008526062A JP2007547434A JP2007547434A JP2008526062A JP 2008526062 A JP2008526062 A JP 2008526062A JP 2007547434 A JP2007547434 A JP 2007547434A JP 2007547434 A JP2007547434 A JP 2007547434A JP 2008526062 A JP2008526062 A JP 2008526062A
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JP
Japan
Prior art keywords
matrix
image
matrices
optical
image sensor
Prior art date
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Pending
Application number
JP2007547434A
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English (en)
Japanese (ja)
Inventor
リュー、ブリソ
Original Assignee
ウードゥヴェ セミコンダクターズ
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Application filed by ウードゥヴェ セミコンダクターズ filed Critical ウードゥヴェ セミコンダクターズ
Publication of JP2008526062A publication Critical patent/JP2008526062A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1464—Back illuminated imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Color Television Image Signal Generators (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2007547434A 2004-12-24 2005-12-01 全体的に分離したカラーゾーンを有するイメージセンサー Pending JP2008526062A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0413961A FR2880194B1 (fr) 2004-12-24 2004-12-24 Capteur d'image a zones de couleur globalement separees
PCT/EP2005/056376 WO2006069886A1 (fr) 2004-12-24 2005-12-01 Capteur d'image a zones de couleur globalement separees

Publications (1)

Publication Number Publication Date
JP2008526062A true JP2008526062A (ja) 2008-07-17

Family

ID=34955061

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007547434A Pending JP2008526062A (ja) 2004-12-24 2005-12-01 全体的に分離したカラーゾーンを有するイメージセンサー

Country Status (6)

Country Link
EP (1) EP1829109A1 (fr)
JP (1) JP2008526062A (fr)
CN (1) CN101088163A (fr)
CA (1) CA2590667A1 (fr)
FR (1) FR2880194B1 (fr)
WO (1) WO2006069886A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101990098A (zh) * 2009-07-31 2011-03-23 索尼公司 图像处理设备和方法
JP2012235137A (ja) * 2006-12-22 2012-11-29 Intellectual Venturesii Llc フローティングベース読み取り概念を有するｃｍｏｓイメージセンサ
US9055181B2 (en) 2011-07-15 2015-06-09 Kabushiki Kaisha Toshiba Solid-state imaging device, image processing apparatus, and a camera module having an image synthesizer configured to synthesize color information

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201400917VA (en) * 2011-10-06 2014-07-30 Heptagon Micro Optics Pte Ltd Method for wafer-level manufacturing of objects and corresponding semi-finished products

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4777496B2 (ja) * 2000-02-10 2011-09-21 富士フイルム株式会社 固体撮像素子
JP4518616B2 (ja) * 2000-04-13 2010-08-04 ソニー株式会社 固体撮像装置およびその駆動方法並びにカメラシステム
FR2817106B1 (fr) * 2000-11-17 2003-03-07 Trixell Sas Dispositif photosensible et procede de commande du dispositif photosensible
FR2819941B1 (fr) * 2001-01-25 2003-06-20 Get Int Element photoelectrique a tres grande dynamique de fonctionnement
FR2829289B1 (fr) * 2001-08-31 2004-11-19 Atmel Grenoble Sa Capteur d'image couleur a colorimetrie amelioree et procede de fabrication

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012235137A (ja) * 2006-12-22 2012-11-29 Intellectual Venturesii Llc フローティングベース読み取り概念を有するｃｍｏｓイメージセンサ
US8723990B2 (en) 2006-12-22 2014-05-13 Intellectual Ventures Ii Llc Image pixel employing floating base readout concept, and image sensor and image sensor array including the image pixel
CN101990098A (zh) * 2009-07-31 2011-03-23 索尼公司 图像处理设备和方法
US9055181B2 (en) 2011-07-15 2015-06-09 Kabushiki Kaisha Toshiba Solid-state imaging device, image processing apparatus, and a camera module having an image synthesizer configured to synthesize color information

Also Published As

Publication number Publication date
WO2006069886A1 (fr) 2006-07-06
CN101088163A (zh) 2007-12-12
EP1829109A1 (fr) 2007-09-05
CA2590667A1 (fr) 2006-07-06
FR2880194B1 (fr) 2007-06-01
FR2880194A1 (fr) 2006-06-30

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