JP2008523599A5 - - Google Patents

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JP2008523599A5
JP2008523599A5 JP2007544912A JP2007544912A JP2008523599A5 JP 2008523599 A5 JP2008523599 A5 JP 2008523599A5 JP 2007544912 A JP2007544912 A JP 2007544912A JP 2007544912 A JP2007544912 A JP 2007544912A JP 2008523599 A5 JP2008523599 A5 JP 2008523599A5
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cooling
cooling loop
loop
coolant
subsystem
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JP4511601B2 (ja
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  1. 少なくとも1つの電子ドロワー・サブシステムの冷却システム電子ラックであって、
    第1熱交換器と、第1冷却ループと、少なくとも1つの第2冷却ループとを含む冷却液分配ユニットであって、前記第1冷却ループは設備冷却液を受け取り、少なくともその一部を前記第1熱交換器を通して通過させ、前記少なくとも1つの第2冷却ループは、システム冷却液を少なくとも1つの電子ドロワー・サブシステムに供給し、かつ、前記第1熱交換器において前記少なくとも1つのドロワー・機器サブシステムからの熱を前記第1冷却ループの前記設備冷却液に放出する、冷却液分配ユニットと、
    第2熱交換器と、前記少なくとも1つの第2冷却ループのうちの第2冷却ループと、第3冷却ループとを各々が含む、前記少なくとも1つの電子ドロワー・サブシステムと関連付けられた少なくとも1つの放熱ユニットであって、前記第2冷却ループは前記システム冷却液を前記第2熱交換器に供給し、前記第3冷却ループは、前記少なくとも1つの電子ドロワー・サブシステム内で調整冷却液を循環させ、かつ、前記第2熱交換器において前記少なくとも1つの電子ドロワー・サブシステムからの熱を前記第2冷却ループの前記システム冷却液に放出する、少なくとも1つの放熱ユニットと、
    を含み、
    前記放熱ユニットの各々の前記第3冷却ループは、前記少なくとも1つの電子ドロワー・サブシステム内に配置された、分離された閉ループ流路を含む、
    冷却システム電子ラック。
  2. 前記第3冷却ループの前記調整冷却液と、前記第2冷却ループの前記システム冷却液とは、冷却液の清浄度、冷却液の圧力、冷却液の流量、冷却液の相変化温度及び冷却液の化学的性質の少なくとも1つを含む少なくとも1つの特徴により異なるものである、請求項1に記載の冷却電子ラック・システム。
  3. 前記第2冷却ループの前記システム冷却液と、前記第1冷却ループの前記設備冷却液とは、冷却液の清浄度、冷却液の圧力、冷却液の流量、冷却液の相変化温度及び冷却液の化学的性質の少なくとも1つを含む少なくとも1つの特徴により異なるものである、請求項2に記載の冷却電子ラック・システム。
  4. 前記放熱ユニットの各々は、少なくとも1つの微小冷却構造体と、前記第2熱交換器と前記微小冷却構造体との間の前記第3冷却ループの前記閉ループ流路を通して前記調整冷却液を移動させるためのポンプとをさらに含む、請求項3に記載の冷却電子ラック・システム。
  5. 前記微小冷却構造体は、前記少なくとも1つの電子機器サブシステムからの熱を前記第3冷却ループの前記閉ループ流路内の前記調整冷却液に放出するのを容易にするために、前記少なくとも1つの電子機器サブシステムの少なくとも1つの熱発生コンポーネントに結合される、請求項4に記載の冷却電子ラック・システム。
  6. 前記放熱ユニットの各々は現場で交換可能なユニットを含み、前記微小冷却構造体は、電子機器モジュールを含む前記熱発生コンポーネントに機械的に結合される、請求項6に記載の冷却電子ラック・システム。
  7. 前記少なくとも1つの熱発生コンポーネントは少なくとも1つの集積回路チップを含み、前記第3冷却ループ内の前記調整冷却液は、前記少なくとも1つの電子機器サブシステムの前記少なくとも1つの集積回路チップに直接接触する、請求項5又は請求項6に記載の冷却電子システム。
  8. 前記調整冷却液は、誘電性流体又は浄化水を含む、請求項1乃至請求項7のいずれか1項に記載の冷却電子ラック・システム。
  9. 前記少なくとも1つの熱発生コンポーネントは少なくとも1つの集積回路チップを含み、前記放熱ユニットの各々は、前記第3冷却ループの前記調整冷却液を前記少なくとも1つの集積回路チップから分離する熱伝導性流体障壁をさらに含む、請求項5、請求項6又は請求項7に記載の冷却電子ラック・システム。
  10. 少なくとも1つの電子ドロワー・サブシステムを冷却する方法であって、
    第1熱交換器と、第1冷却ループと、少なくとも1つの第2冷却ループとを含む冷却液分配ユニットであって、前記第1冷却ループは設備冷却液を受け取り、少なくともその一部を前記第1熱交換器を通して通過させ、前記少なくとも1つの第2冷却ループは、システム冷却液を少なくとも1つの電子ドロワー・サブシステムに供給し、かつ、前記第1熱交換器において前記少なくとも1つの電子ドロワー・サブシステムからの熱を前記第1冷却ループの前記設備冷却液に放出する、冷却液分配ユニットを提供するステップと、
    第2熱交換器と、前記少なくとも1つの第2冷却ループのうちの第2冷却ループと、第3冷却ループとを各々が含む、前記少なくとも1つの電子ドロワー・サブシステムと関連付けられた少なくとも1つの放熱ユニットであって、前記第2冷却ループは前記システム冷却液を前記第2熱交換器に供給し、前記第3冷却ループは、前記少なくとも1つの電子ドロワー・サブシステム内で調整冷却液を循環させ、かつ、前記第2熱交換器において前記少なくとも1つの電子ドロワー・サブシステムからの熱を前記第2冷却ループの前記システム冷却液に放出する、少なくとも1つの放熱ユニットを提供するステップと、
    を含み、
    前記放熱ユニットの各々の前記第3冷却ループは、前記少なくとも1つの電子ドロワー・サブシステム内に配置された、分離された閉ループ流路を含む、
    冷却方法。
JP2007544912A 2004-12-09 2005-12-07 冷却システム及び方法 Active JP4511601B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/008,711 US6973801B1 (en) 2004-12-09 2004-12-09 Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
PCT/EP2005/056581 WO2006061404A1 (en) 2004-12-09 2005-12-07 Cooling system and method

Publications (3)

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JP2008523599A JP2008523599A (ja) 2008-07-03
JP2008523599A5 true JP2008523599A5 (ja) 2008-10-23
JP4511601B2 JP4511601B2 (ja) 2010-07-28

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US (1) US6973801B1 (ja)
EP (1) EP1829441B1 (ja)
JP (1) JP4511601B2 (ja)
CN (1) CN100556260C (ja)
AT (1) ATE391406T1 (ja)
DE (1) DE602005005859T2 (ja)
WO (1) WO2006061404A1 (ja)

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