JP2008507807A - Matt switch and information processing system - Google Patents

Abstract

  The mat switch includes a top sheet (FIG. 2:42), a buffer sheet (FIG. 2:60), a switch layer (FIG. 2: 300), a pad layer (FIG. 2: 310), and a back sheet (FIG. 2: 190). ,including. A pad layer (FIG. 2: 310) is formed by sewing the cloth sheet (FIG. 2: 140-150) to the cloth sheet (FIG. 2: 180) so as to cover the pad (FIG. 2: 160-170). The A back sheet (FIG. 2: 190) is provided below the pad layer (FIG. 2: 310). The pad layer (FIG. 2: 310) is provided on the upper layer of the back sheet (FIG. 2: 190). For this reason, the cloth sheet (FIG. 2: 180) to which the cloth sheet (FIG. 2: 140-150) covering the pad (FIG. 2: 160-170) is attached does not directly contact the floor surface. Therefore, it is possible to prevent the mat switch from being damaged as much as possible because the cloth sheet (FIG. 2: 140 to 150) is attached to the cloth sheet (FIG. 2: 180).

Description

  The present invention relates to a mat switch for detecting a stepping action by a human and related technology.

  FIG. 14 is a cross-sectional view of a conventional mat switch described in Japanese Patent Laid-Open No. 9-326216. As shown in FIG. 14, this mat switch has a structure in which eight layers are laminated. A cover sheet 500 is provided on the top layer of the mat switch. Under the cover sheet 500, a buffer sheet 510 is provided. An upper electrode sheet 520 is provided under the buffer sheet 510. Under the upper electrode sheet 520, an insulating spacer 530 in which a large number of holes 531 are formed is provided. A lower electrode sheet 540 is provided under the spacer 530. A back plate 561 is provided under the lower electrode sheet 540. A pocket 560 is formed under the lower electrode sheet 540 by the vinyl sheets 550 and 570. A back plate 561 is inserted into the pocket 560.

  When a person steps on the mat switch with his sole, the upper electrode sheet 520 and the lower electrode sheet 540 come into contact with each other through the hole 531 and the mat switch is turned on.

  The back plate 561 is for preventing the switch region, that is, the region where the upper electrode sheet 520 is formed from being folded. Therefore, the back plate 561 has sufficient strength to resist the switch area from being folded when a normal force is applied to the back plate 561. The back plate 561 is made of foamed polyethylene having a high hardness and a thickness of 1.5 mm. Further, by making the back plate 561 heavier, the mat switch is prevented from slipping or shifting. As a result, the mat switch is stably installed.

  In the conventional mat switch, the pocket 560 is formed by high-frequency welding the vinyl sheet 550 to the vinyl sheet 570. As a result, the welded portion 571 becomes thin, so that the strength is inferior to other portions of the vinyl sheet 570. Moreover, since the vinyl sheet 570 functions as a back sheet that covers the back side of the mat switch, the welded portion 571 directly contacts the floor surface on which the mat switch is installed. For this reason, when such a mat switch is used for a long period of time, the vinyl sheet 570 may be damaged from the vicinity of the welded portion 571 due to a stepping action by a human. As described above, if the back plate 561 is made heavy to prevent the mat switch from slipping or slipping, a larger load is applied to the welded portion 571. As a result, the possibility of breakage of the vinyl sheet 570 is increased compared to the case where the back plate is not designed in this way.

  Therefore, an object of the present invention is to provide a mat switch that is durable even during long-term use and related technology.

  According to the first aspect of the present invention, the mat switch includes a first sheet, a pad layer, a switch layer including a sheet-like switch that detects a stepping operation in the mat switch, and a second sheet. The pad layer and the switch layer are stacked between the first sheet and the second sheet, and the pad layer includes a third sheet, a pad, a fourth sheet, The pad is disposed at a position corresponding to the sheet-like switch, and the fourth sheet is attached to the third sheet so as to cover the pad.

  According to the first aspect of the present invention, since the pad layer is provided between the first sheet and the second sheet, the third sheet to which the fourth sheet covering the pad is attached is the floor surface. There is no direct contact. For this reason, it is possible to prevent the mat switch from being damaged as much as possible due to the fact that the fourth sheet is attached to the third sheet.

  In the mat switch, at least one of the third sheet and the fourth sheet has air permeability.

  As a result, when the mat switch is depressed, air flows out from the space surrounded by the third sheet and the fourth sheet (the space where the pad exists). That is, air flows out from the space to the outside through the third sheet and / or the fourth sheet having air permeability. For this reason, it can suppress that the pressure of the space enclosed by the 3rd sheet | seat and the 4th sheet | seat becomes high by the depression operation of a mat switch. Accordingly, it is possible to prevent the third sheet and / or the fourth sheet from being damaged as much as possible due to an increase in the pressure inside the space.

  In the mat switch, in order to allow air to flow between the space surrounded by the third sheet and the fourth sheet and the space outside thereof, and so as to cover the pad, The fourth sheet is attached to the third sheet.

  As a result, when the mat switch is depressed, air flows out from the space surrounded by the third sheet and the fourth sheet (the space where the pad exists). For this reason, it can suppress that the pressure of the space enclosed by the 3rd sheet | seat and the 4th sheet | seat becomes high by the depression operation of a mat switch. Accordingly, it is possible to prevent the third sheet and / or the fourth sheet from being damaged as much as possible due to an increase in the pressure inside the space.

  In the mat switch, the pad layer is provided above the first sheet, the switch layer is provided above the pad layer, and the second sheet is provided above the switch layer. In the use state of the switch, the first sheet contacts the floor surface.

  According to this structure, a pad layer is provided in the upper layer of the 1st sheet | seat which contacts a floor surface. For this reason, the third sheet to which the fourth sheet covering the pad is not directly in contact with the floor surface. As a result, it is possible to prevent the mat switch from being damaged as much as possible because the fourth sheet is attached to the third sheet.

  In the mat switch, the pad layer is provided above the first sheet, the switch layer is provided above the pad layer, a buffer sheet is provided above the switch layer, and an upper layer of the buffer sheet. The second sheet is provided, and the first sheet contacts the floor surface when the mat switch is in use.

  According to this structure, a pad layer is provided in the upper layer of the 1st sheet | seat which contacts a floor surface. For this reason, the third sheet to which the fourth sheet covering the pad is not directly in contact with the floor surface. As a result, it is possible to prevent the mat switch from being damaged as much as possible because the fourth sheet is attached to the third sheet. Since the buffer sheet is provided under the second sheet that is in direct contact with the sole, the impact caused by the stepping action is reduced. Thereby, damage to the switch layer can be prevented as much as possible.

  In the mat switch, the switch layer is provided above the first sheet, the pad layer is provided above the switch layer, and the second sheet is provided above the pad layer. In the use state, the first sheet contacts the floor surface.

  According to this configuration, since the pad layer is provided in the upper layer of the switch layer, the third sheet to which the fourth sheet covering the pad is not directly in contact with the floor surface. For this reason, it is possible to prevent the mat switch from being damaged as much as possible due to the fact that the fourth sheet is attached to the third sheet.

  In the mat switch, a buffer sheet is provided on an upper layer of the first sheet, the switch layer is provided on an upper layer of the buffer sheet, the pad layer is provided on an upper layer of the switch layer, and an upper layer of the pad layer. The second sheet is provided, and the first sheet contacts the floor surface when the mat switch is in use.

  According to this configuration, since the pad layer is provided in the upper layer of the switch layer, the third sheet to which the fourth sheet covering the pad is not directly in contact with the floor surface. For this reason, it is possible to prevent the mat switch from being damaged as much as possible due to the fact that the fourth sheet is attached to the third sheet. Further, a buffer sheet is provided on the first sheet that is in direct contact with the floor surface. For this reason, it is possible to prevent the switch layer from being damaged as much as possible due to the pressing on the floor surface due to the stepping-in operation.

  In the mat switch, the switch layer includes a first electrode sheet in which a conductive region is formed, an insulating spacer, and a second electrode sheet in which a conductive region is formed, and the first electrode sheet The first electrode sheet, the spacer, and the second electrode sheet are laminated so that the conductive region of the second electrode sheet and the conductive region of the second electrode sheet face each other with the spacer interposed therebetween. The conductive region of the first electrode sheet is formed on the surface of the first electrode sheet by forming a conductor in a lattice shape, and the conductor is formed on the surface of the second electrode sheet. The conductive region of the second electrode sheet is formed by forming a grid, and the grid-shaped conductor of the first electrode sheet and the grid-shaped conductor of the second electrode sheet And in the crossing direction It is made.

  According to this configuration, the grid-shaped conductor of the first electrode sheet and the grid-shaped conductor of the second electrode sheet are formed in a crossing direction. For this reason, compared with the case where it forms in the same direction, the conductor of a 1st electrode sheet and the conductor of a 2nd electrode sheet become easy to contact. As a result, the stepping action can be detected with high sensitivity.

  In the mat switch, the conductor formed in a lattice shape on the surface of the first electrode sheet is carbon, and the conductive region of the first electrode sheet intersects the lattice-like carbon. As described above, silver is formed in a linear shape, and the conductor formed in a lattice shape on the surface of the second electrode sheet is carbon, and the conductive region of the second electrode sheet has a lattice shape. Silver is formed in a linear shape so as to intersect the carbon.

  According to this configuration, silver having a conductivity higher than that of carbon is formed in the conductive region. For this reason, it is possible to detect the stepping operation of the mat switch with higher sensitivity as compared with the case where the conductive region is formed of only carbon. Since the conductive region can be formed mainly of carbon cheaper than silver, the amount of expensive silver used can be adjusted in consideration of cost.

  In the mat switch, a plurality of the sheet-like switches are provided in the planar direction. According to this configuration, a plurality of persons can use the same mat switch. In this case, a plurality of people can step on the sheet-like switch at the same time. In addition, one person can step on the sheet-like switch simultaneously or alternately using both feet. Moreover, a different function can be given to each sheet-like switch. As a result, the range of use of the mat switch is widened.

  According to a second aspect of the present invention, an information processing system includes a mat switch and an information processing apparatus that executes information processing according to on / off information from the mat switch, and the mat switch includes a first sheet. And a pad layer, a switch layer including a sheet-like switch for detecting a stepping action, and a second sheet, wherein the pad layer and the switch layer are the first sheet and the second sheet. The pad layer includes a third sheet, a pad, and a fourth sheet, and the pad is disposed at a position corresponding to the sheet-like switch, and the fourth layer The sheet is attached to the third sheet so as to cover the pad.

  According to the second aspect of the present invention, since the pad layer is provided between the first sheet and the second sheet, the third sheet to which the fourth sheet covering the pad is attached is the floor surface. There is no direct contact. For this reason, it is possible to prevent the mat switch constituting the information processing system from being damaged as much as possible due to the fact that the fourth sheet is attached to the third sheet.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and the description thereof is incorporated. Below, a game system is mentioned as an example of an information processing system.

  FIG. 1 is a diagram illustrating an overall configuration of a game system according to an embodiment. As shown in FIG. 1, the game system includes a television monitor 1, an information processing device 20, and a mat switch 40. The television monitor 1 and the information processing apparatus 20 are connected by an AV cable 3. A DC power supply voltage is applied to the information processing apparatus 20 by the AC adapter 5. However, instead of the AC adapter 5, a DC power supply voltage can be applied to the information processing apparatus 20 by a battery (not shown).

  A power switch 24 is provided on the upper surface of the housing of the information processing apparatus 20. The mat switch 40 includes six sheet switches (described later). When the power switch 24 is turned on, the information processing apparatus 20 receives on / off information from the sheet-like switch in response to depression of the mat switch 40. The information processing apparatus 20 performs information processing according to the received on / off information.

  The mat switch 40 has six step areas 46, 48, 52, 54, 50, 56 on the top sheet 42. The top sheet 42 is formed on the uppermost layer of the mat switch 40. The six step areas 46, 48, 52, 54, 50, and 56 correspond to six sheet-like switches. Therefore, the game player can turn on the corresponding sheet-like switch by stepping on the step areas 46, 48, 52, 54, 50, and 56. For example, the step areas 46, 48, 52, 54, 50, and 56 are formed on the top sheet 42 by screen printing.

  FIG. 2 is an exploded perspective view showing the structure of the mat switch 40 of FIG. As shown in FIG. 2, the mat switch 40 includes a back sheet 190, a cloth sheet 180, pads 160, 162, 164, 166, 168, 170, cloth sheets 140, 142, 144, 146, 148, 150, a lower electrode sheet. 110, an insulating spacer 100, an upper electrode sheet 70, a buffer sheet 60, and a surface sheet 42.

  A back sheet 190 is provided in the lowermost layer, a cloth sheet 180 is provided in an upper layer of the back sheet 190, pads 160 to 170 are provided in an upper layer of the cloth sheet 180, and upper layers of the pads 160 to 170 are provided. The cloth sheets 140 to 150 are provided, the lower electrode sheet 110 is provided on the upper layer of the cloth sheets 140 to 150, the spacer 100 is provided on the upper layer of the lower electrode sheet 110, and the upper layer of the spacer 100 is provided on the upper layer. The upper electrode sheet 70 is provided, the buffer sheet 60 is provided on the upper layer of the upper electrode sheet 70, and the top sheet 42 is provided on the upper layer of the buffer sheet 60, that is, the uppermost layer of the mat switch 40.

  Conductive regions 112, 114, 116, 118, 120, 122, 124, 126, 128, 130, 132, 134, 136 are formed on the lower electrode sheet 110. In the spacer 100, a plurality of holes 102 are formed in regions corresponding to the conductive regions 112, 114, 116, 118, 120, and 122, respectively. In the upper electrode sheet 70, conductive regions 72, 74, 76, 78, 80, and 82 are formed corresponding to the conductive regions 112, 114, 116, 118, 120, and 122 of the lower electrode sheet 110. Further, conductive regions 84, 86, 88, 90, 92, 94 are formed on the upper electrode sheet 70. The conductive regions 112, 114, 116, 118, 120, and 122 of the lower electrode sheet 110 and the conductive regions 72, 74, 76, 78, 80, and 82 of the upper electrode sheet 70 face each other across the spacer 100. As described above, the lower electrode sheet 110, the spacer 100, and the upper electrode sheet 70 are laminated. Accordingly, the conductive regions 112 to 136 are formed on the upper surface of the lower electrode sheet 110, and the conductive regions 72 to 94 are formed on the lower surface of the upper electrode sheet 70. Since the conductive regions 72 to 94 are formed on the lower surface of the upper electrode sheet 70, they are represented by broken lines in FIG. 2.

  The lower electrode sheet 110, the spacer 100, and the upper electrode sheet 70 constitute a switch layer 300. Further, a sheet-like switch is formed by the conductive region 112 of the lower electrode sheet 110, the conductive region 72 of the upper electrode sheet 70, and the region corresponding to these of the spacer 100. This corresponding region in the spacer 100 includes a plurality of holes 102. A sheet-like switch is formed by the conductive region 114 of the lower electrode sheet 110, the conductive region 74 of the upper electrode sheet 70, and the corresponding region of the spacer 100. This corresponding region in the spacer 100 includes a plurality of holes 102. A sheet-like switch is formed by the conductive region 116 of the lower electrode sheet 110, the conductive region 76 of the upper electrode sheet 70, and the corresponding region of the spacer 100.

  This corresponding region in the spacer 100 includes a plurality of holes 102. A sheet-like switch is formed by the conductive region 118 of the lower electrode sheet 110, the conductive region 78 of the upper electrode sheet 70, and the corresponding region of the spacer 100. This corresponding region in the spacer 100 includes a plurality of holes 102. A sheet-like switch is formed by the conductive region 120 of the lower electrode sheet 110, the conductive region 80 of the upper electrode sheet 70, and the corresponding region of the spacer 100. This corresponding region in the spacer 100 includes a plurality of holes 102. A sheet-like switch is formed by the conductive region 122 of the lower electrode sheet 110, the conductive region 82 of the upper electrode sheet 70, and the corresponding region of the spacer 100. This corresponding region in the spacer 100 includes a plurality of holes 102. For example, the above sheet-like switch is a membrane switch.

  The top sheet 42 and the back sheet 190 are, for example, non-phthalic acid polyvinyl chloride sheets. The buffer sheet 60 and the spacer 100 are, for example, sponge sheets having a thickness of about 4 millimeters. The electrode sheets 70 and 110 are, for example, polypropylene transparent sheets. The cloth sheets 140 to 150 and the cloth sheet 180 are, for example, thin cloth sheets made of cloth. The pads 160 to 170 are, for example, polyurethane pads having a thickness of about 8 millimeters.

  3A is a plan view of the upper electrode sheet 70 in FIG. 2, FIG. 3B is a plan view of the spacer 100 in FIG. 2, and FIG. 3C is a plan view of the lower electrode sheet 110 in FIG. Figure. As shown in FIG. 3A, the conductive regions 72 to 82 are formed by forming a grid-like conductor pattern on the lower surface of the upper electrode sheet 70. From each of the conductive regions 72, 74, 76, 78, 80, 82, the conductive regions 84, 86, 88, 90 are directed upward in FIG. 3A toward the center of the edge of the upper electrode sheet 70. , 94, 92 are extended. The conductive regions 84 to 94 are formed by forming a grid-like conductor pattern (not shown) on the lower surface of the upper electrode sheet 70.

  As shown in FIG. 3C, the conductive regions 112 to 122 are formed by forming a grid-like conductor pattern on the upper surface of the lower electrode sheet 110. The conductive region 112 and the conductive region 114 are connected by the conductive region 126, the conductive region 112 and the conductive region 116 are connected by the conductive region 124, and the conductive region 116 and the conductive region 114 are connected by the conductive region 136. The The conductive region 120 and the conductive region 118 are connected by the conductive region 130, the conductive region 120 and the conductive region 122 are connected by the conductive region 134, and the conductive region 118 and the conductive region 122 are connected by the conductive region 132. The The conductive region 114 and the conductive region 118 are connected by a conductive region 128, and the conductive region 128 extends upward in FIG. 3C and in the center of the edge of the lower electrode sheet 110. The conductive regions 124 to 136 are formed by forming a grid-like conductor pattern (not shown) on the upper surface of the lower electrode sheet 110.

  As can be seen by comparing FIG. 3A and FIG. 3B, the conductor pattern of the upper electrode sheet 70 and the conductor pattern of the lower electrode sheet 110 are formed in a direction in which the former intersects the latter. Has been. As can be seen from FIGS. 3A to 3C, the spacer 100 includes a region corresponding to the conductive regions 112 and 72, a region corresponding to the conductive regions 114 and 74, and a region corresponding to the conductive regions 116 and 76. A plurality of holes 102 are formed in a region corresponding to the conductive regions 118 and 78, a region corresponding to the conductive regions 120 and 80, and a region corresponding to the conductive regions 122 and 82.

  FIG. 4 is a detailed explanatory view of the conductive regions 112, 124, and 126 in FIG. As shown in FIG. 4, the conductive regions 112, 124, and 126 are formed by forming the conductive pattern 115 and the lattice-shaped conductive pattern 113 on the upper surface of the lower electrode sheet 110. For example, the conductive regions 112, 124, and 126 are formed by screen-printing the conductive pattern 115 and the lattice-shaped conductive pattern 113 on the upper surface of the lower electrode sheet 110.

  The conductor pattern 115 is a coarse pattern compared to the conductor pattern 113. Therefore, for example, silver having higher conductivity than carbon but expensive can be used as the conductor pattern 115, and carbon cheaper than silver can be used as the conductor pattern 113, for example. Similarly, the other conductive regions 114 to 136 and the conductive regions 72 to 94 are formed of the conductor pattern 115 and the lattice-like conductor pattern 113. With reference to FIG. 3A and FIG. 3C, as described above, the grid-like conductor pattern 113 of the lower electrode sheet 110 and the grid-like conductor pattern 113 of the upper electrode sheet 70 are: It is formed in the intersecting direction.

  Returning to the description of FIG. The cloth sheets 140 to 150 are sewn to the cloth sheet 180 so as to cover the corresponding pads 160 to 170. In this case, the pads 160 to 170 are arranged so as to be positioned below the corresponding stepping regions 46 to 56. In this manner, the pad layer 310 is formed by fixing the pads 160 to 170 between the cloth sheets 140 to 150 and the cloth sheet 180.

  FIG. 5 is an explanatory diagram of the pad layer 310 of FIG. As shown in FIG. 5, the cloth sheet 140 is sewn to the cloth sheet 180 with a thread 312 so as to cover the pad 160. Similarly, the other pads 162 to 170 are arranged and fixed so as to be located below the corresponding stepping areas 48 to 56.

  6 is a cross-sectional view of the mat switch of FIG. 1 taken along line AA. As shown in FIG. 6, the pad layer 310 (the sheet 180, the pad 160, and the sheet 140) is formed on the upper layer of the lowermost back sheet 190. Further, the switch layer 300 (the lower electrode sheet 110, the spacer 100, and the upper electrode sheet 70) is formed on the pad layer 310. Further, the buffer sheet 60 is provided on the upper layer of the switch layer 300. Further, a top sheet 42 is provided in the upper layer of the buffer sheet 60, that is, the uppermost layer of the mat switch 40.

  Referring to FIG. 1, back sheet 190, pad layer 310, switch layer 300, buffer sheet 60, and top sheet 42 laminated as described above are framed by cloth tape 30 and sewn with thread 44. It is done. In this way, the mat switch 40 is configured. The cloth tape 30 is, for example, a bias tape.

  As described above, the cloth sheet 140 is sewn to the cloth sheet 180 with the thread 312 so as to cover the pad 160. As described above, the conductive region 112 formed on the upper surface of the lower electrode sheet 110 and the conductive region 72 formed on the lower surface of the upper electrode sheet 70 face each other with the spacer 100 interposed therebetween. Therefore, when the game player steps on the top sheet 42, the spacer 100 contracts, so that the conductive region 112 of the lower electrode sheet 110 and the conductive region 72 of the upper electrode sheet 70 come into contact with each other through the hole 102. As a result, the mat switch 40 is turned on.

  7 is a cross-sectional view of the mat switch 40 and the information processing apparatus 20 of FIG. As shown in FIG. 7, the edge of the mat switch 40 is sandwiched between the cover 22 and the base 23 of the information processing apparatus 20. In order to sandwich the mat switch 40, the boss 25 of the cover 22 is inserted into the boss 26 of the base 23. The boss 25 protrudes downward from the inner surface of the cover 22. The boss 26 protrudes upward from the inner surface of the base 23. The cover 22 and the base 23 are joined by screwing the screw 29 into the boss 25 from the inside of the boss 26. Further, the screw 28 is passed through the mat switch 40 and screwed into the boss 27 of the base 23. The boss 27 protrudes upward on the inner surface of the base 23. In this way, the mat switch 40 is attached to the information processing apparatus 20. The mat switch 40 is sandwiched between the cover 22 and the base 23, and this also serves to fix the mat switch 40 to the information processing apparatus 20. Further, the cover 22 and the base 23 constitute a housing of the information processing apparatus 20. The cover 22 and the base 23 are made of, for example, ABS (acrylonitrile butadiene styrene) resin.

  FIG. 8 is a rear view of the mat switch 40 of FIG. As shown in FIG. 8, anti-slip 51, 53, 55, and 57 are attached to the surface of the back sheet 190. The slip stoppers 57, 55, 53 and 51 are attached at positions corresponding to the step areas 46, 48, 52 and 54. The slip stoppers 57, 55, 53, 51 are made of synthetic rubber, for example.

  FIG. 9 is a diagram showing an electrical configuration of the information processing apparatus 20 of FIG. As illustrated in FIG. 9, the information processing apparatus 20 includes a high-speed processor 200, a ROM (read only memory) 256, a bus 254, a connector 257, a video signal output terminal 250, and an audio signal output terminal 252.

  A bus 254 is connected to the high speed processor 200. A ROM 256 is connected to the bus 254. Accordingly, since the high speed processor 200 can access the ROM 256 via the bus 254, the game program stored in the ROM 256 can be read and executed. Further, the high speed processor 200 reads and processes the image data and audio data stored in the ROM 256, generates a video signal and an audio signal, and outputs them to the video signal output terminal 250 and the audio signal output terminal 252. it can.

  The conductive region 128 of the mat switch 40 is connected to one end of the resistance element 258 via the connector 257. The other end of resistance element 258 is connected to one end of power supply Vcc and capacitor 271. The other end of the capacitor 271 is grounded.

  On the other hand, the conductive region 84 of the mat switch 40 is connected to one end of the resistance element 259 via the connector 257. The other end (node N1) of resistance element 259 is connected to input / output port IO1 of high speed processor 200 and one end of capacitor 270. The other end of the capacitor 270 is grounded. The conductive region 88 of the mat switch 40 is connected to one end of the resistance element 260 via the connector 257. The other end (node N2) of resistance element 260 is connected to input / output port IO2 of high speed processor 200 and one end of capacitor 269. The other end of the capacitor 269 is grounded. The conductive region 86 of the mat switch 40 is connected to one end of the resistance element 261 via the connector 257. The other end (node N3) of resistance element 261 is connected to input / output port IO3 of high speed processor 200 and one end of capacitor 268. The other end of the capacitor 268 is grounded.

  The conductive region 90 of the mat switch 40 is connected to one end of the resistance element 262 via the connector 257. The other end (node N4) of resistance element 262 is connected to input / output port IO4 of high speed processor 200 and one end of capacitor 267. The other end of the capacitor 267 is grounded. The conductive region 92 of the mat switch 40 is connected to one end of the resistance element 263 via the connector 257. The other end (node N5) of resistance element 263 is connected to input / output port IO5 of high speed processor 200 and one end of capacitor 266. The other end of the capacitor 266 is grounded. The conductive region 94 of the mat switch 40 is connected to one end of the resistance element 264 via the connector 257. The other end (node N6) of resistance element 264 is connected to input / output port IO6 of high speed processor 200 and one end of capacitor 265. The other end of the capacitor 265 is grounded.

  The line connected to each of the nodes N1 to N6 is pulled down inside the high speed processor 200.

  As described above, the power supply voltage is applied to the conductive regions 112 to 122 of the lower electrode sheet 110 of the mat switch 40 through the resistance element 258. The conductive regions 72 to 82 of the upper electrode sheet 70 are pulled down via the nodes N1 to N6. Therefore, when the stepping region 46 is stepped on by the game player, the conductive region 112 and the conductive region 72 come into contact with each other, and a current flows. This means that the sheet-like switch corresponding to the step region 46 is turned on. Similarly, when the stepping areas 48 to 56 are stepped on by the game player, the corresponding sheet-like switch is turned on.

  As described above, when the sheet-like switches corresponding to the step regions 46 to 56 are turned on, that is, when the step switches are stepped on, the corresponding nodes N1 to N6 become a high level. On the other hand, when the sheet-like switches corresponding to the step areas 46 to 56 are off, that is, in a state where they are not stepped on, the corresponding nodes N1 to N6 are at a low level.

  The high speed processor 200 executes a game program stored in the ROM 256, generates a video signal, and outputs the video signal to the video signal output terminal 250. As a result, the game screen is displayed on the television monitor 1. The high speed processor 200 executes a game program stored in the ROM 256, generates an audio signal such as music or sound effects, and outputs the audio signal to the audio signal output terminal 252. Thereby, music, sound effects, and the like are output from a speaker (not shown) of the television monitor 1.

  When the game player depresses the mat switch 40 in accordance with the game screen displayed on the television monitor 1, the sheet-like switches corresponding to the depressed areas 46 to 56 are turned on. The high speed processor 200 receives on / off information of each sheet-like switch of the mat switch 40, executes information processing instructed by the game program, and advances the game.

  FIG. 10 is a block diagram of the high speed processor 200 of FIG. As shown in FIG. 10, the high-speed processor 200 includes a central processing unit (CPU) 201, a graphic processor 202, a sound processor 203, a DMA (direct memory access) controller 204, a first bus arbitration circuit 205, Second bus arbitration circuit 206, internal memory 207, A / D converter (ADC: analog to digital converter) 208, input / output control circuit 209, timer circuit 210, DRAM (dynamic random access memory) refresh control circuit 211, external memory interface Circuit 212, clock driver 213, PLL (phase-locked loop) circuit 214, low voltage detection A circuit 215, a first bus 218, and a second bus 219 are included.

  The CPU 201 performs various operations and controls the entire system according to a program stored in a memory (the internal memory 207 or the ROM 256). The CPU 201 is a bus master of the first bus 218 and the second bus 219, and can access resources connected to the respective buses.

  The graphic processor 202 is a bus master of the first bus 218 and the second bus 219, generates a video signal based on data stored in the internal memory 207 or the ROM 256, and outputs the video signal to the video signal output terminal 250. The graphic processor 202 is controlled by the CPU 201 through the first bus 218. The graphic processor 202 has a function of generating an interrupt request signal 220 to the CPU 201.

  The sound processor 203 is a bus master of the first bus 218 and the second bus 219, generates an audio signal based on the data stored in the internal memory 207 or the ROM 256, and outputs the audio signal to the audio signal output terminal 252. The sound processor 203 is controlled by the CPU 201 through the first bus 218. Further, the sound processor 203 has a function of generating an interrupt request signal 220 to the CPU 201.

  The DMA controller 204 manages data transfer from the ROM 256 to the internal memory 207. The DMA controller 204 has a function of generating an interrupt request signal 220 to the CPU 201 in order to notify the completion of data transfer. The DMA controller 204 is a bus master for the first bus 218 and the second bus 219. The DMA controller 204 is controlled by the CPU 201 through the first bus 218.

  The first bus arbitration circuit 205 receives a first bus use request signal from each bus master of the first bus 218, performs arbitration, and issues a first bus use permission signal to each bus master. Each bus master is permitted to access the first bus 218 by receiving the first bus use permission signal. The first bus use request signal and the first bus use permission signal are shown as a first bus arbitration signal 222 in FIG.

  The second bus arbitration circuit 206 receives a second bus use request signal from each bus master of the second bus 219, performs arbitration, and issues a second bus use permission signal to each bus master. Each bus master is permitted to access the second bus 219 by receiving the second bus use permission signal. The second bus use request signal and the second bus use permission signal are shown as a second bus arbitration signal 223 in FIG.

  The internal memory 207 includes necessary ones among a mask ROM, an SRAM (static random access memory), and a DRAM. When it is necessary to hold SRAM data by a battery, the battery 217 is required. When a DRAM is installed, an operation for holding stored contents called refresh is required periodically.

  The ADC 208 converts the analog input signal into a digital signal. This digital signal is read by the CPU 201 via the first bus 218. Further, the ADC 208 has a function of generating an interrupt request signal 220 to the CPU 201.

  The input / output control circuit 209 communicates with an external input / output device or an external semiconductor element through an input / output signal. Input / output signals are read / written from the CPU 201 via the first bus 218. The input / output control circuit 209 has a function of generating an interrupt request signal 220 to the CPU 201. The input / output signals are input / output via, for example, programmable input / output ports IO0 to IO15.

  The input / output control circuit 209 receives an on / off signal from the mat switch 40 via the input / output ports IO1 to IO6.

  The timer circuit 210 has a function of generating an interrupt request signal 220 for the CPU 201 based on a set time interval. The time interval and the like are set by the CPU 201 via the first bus 218.

  The DRAM refresh control circuit 211 unconditionally acquires the right to use the first bus 218 at regular intervals and performs a DRAM refresh operation. Needless to say, the DRAM refresh control circuit 211 is provided when the internal memory 207 includes a DRAM.

  The PLL circuit 214 generates a high frequency clock signal obtained by multiplying the sine wave signal obtained from the crystal resonator 216. The clock driver 213 amplifies the high frequency clock signal received from the PLL circuit 214 to a sufficient signal strength, and supplies the amplified signal as a clock 225 to each block.

  The low voltage detection circuit 215 monitors the power supply voltage Vcc, and issues a reset signal 226 of the PLL circuit 214 and other system-wide reset signals 227 when the power supply voltage Vcc is equal to or lower than a certain voltage. Further, when the internal memory 207 is composed of SRAM and data retention by the SRAM battery 217 is required, the battery backup control signal 224 is issued when the power supply voltage Vcc is equal to or lower than a predetermined voltage. .

  The external memory interface circuit 212 controls the bus cycle length of the second bus 219 by issuing a function for connecting the second bus 219 to the external bus 254 and a cycle end signal 228 of the second bus 219. It has a function.

  Next, another configuration example of the mat switch 40 in FIG. 1 will be described.

  FIG. 11 is an exploded perspective view of another configuration of the mat switch 40 of FIG. In the mat switch 40 of FIG. 2, the pad layer 310 is provided above the back sheet 190, the switch layer 300 is provided above the pad layer 310, the buffer sheet 60 is provided above the switch layer 300, and the buffer sheet 60 is provided above. In contrast to the provision of the top sheet 42, in the mat switch 40 of FIG. 11, the buffer sheet 60 is provided above the back sheet 190, the switch layer 300 is provided above the buffer sheet 60, and the pad is provided above the switch layer 300. The layer 310 is provided, and the topsheet 42 is provided on the pad layer 310.

  Next, another configuration example of the pad layer 310 in FIG. 2 will be described. In this example, in FIGS. 2 and 11, instead of the cloth sheet 180, a non-phthalic acid-based polyvinyl chloride sheet having the same shape is used, and instead of the cloth sheets 140 to 150, these are used. A sheet made of non-phthalic acid-based polyvinyl chloride having the same shape as in FIG. Therefore, both are joined by welding. This point will be described with a specific example.

  12A is a front view of another configuration example of the pad layer 310, and FIG. 12B is a rear view thereof. As shown in FIGS. 12A and 12B, a non-phthalic acid-based polyvinyl chloride sheet 400 is welded to a non-phthalic acid-based polyvinyl chloride sheet 410 so as to cover the pad 160. The In this way, the pad 160 is fixed at a position corresponding to the stepping region 46. In order to fix the pad 160, the sheets 400 and 410 are welded so that the welded portions 402 and the non-welded portions 404 are alternately formed. The welding is, for example, ultrasonic welding. The other pads 162 to 170 are similarly fixed to the sheet 410.

  Next, still another configuration example of the pad layer 310 in FIG. 2 will be described. In this example, in FIGS. 2 and 11, instead of the cloth sheet 180, a non-phthalic acid-based polyvinyl chloride sheet having the same shape is used, and instead of the cloth sheets 140 to 150, these are used. A sheet made of non-phthalic acid-based polyvinyl chloride having the same shape as in FIG. Therefore, both are joined by welding. However, holes are formed in each sheet instead of the cloth sheets 140 to 150. This point will be described with a specific example.

  FIG. 13A is a front view of still another configuration example of the pad layer 310, and FIG. 13B is a rear view thereof. As shown in FIGS. 13A and 13B, a non-phthalic acid-based polyvinyl chloride sheet 420 is welded to a non-phthalic acid-based polyvinyl chloride sheet 410 so as to cover the pad 160. The In this way, the pad 160 is fixed at a position corresponding to the stepping region 46. The sheets 420 and 410 for fixing the pad 160 are welded without forming a non-welded portion. As a result, unlike FIG. 12, a welded portion 406 without a gap is formed. However, a plurality of holes 408 are formed in the sheet 420. The welding is, for example, ultrasonic welding. The other pads 162 to 170 are similarly fixed to the sheet 410.

  Instead of forming the holes 408 in the sheet 420, holes may be formed in the sheet 410. In this case, the hole is formed in the region where the pad 160 is disposed in the sheet 410. A hole may be formed in both the sheet 410 and the sheet 420.

  Next, a usage example of the mat switch 40 will be described. In this case, the step areas 46 to 56 and the sheet-like switches corresponding to them are used synonymously. When the stepping area is depressed, the corresponding sheet-like switch is turned on.

  For example, when playing a game by one person, the player uses one of the step areas 46, 48, and 50 or the step areas 52, 54, and 56. For example, when two people play a game, the first player can use the step areas 46, 48, and 50, and the second player can use the step areas 52, 54, and 56. Therefore, the information processing apparatus 20 can recognize the on / off information of the step areas 46, 48, 50 as the operation information of the first player, and the on / off information of the step areas 52, 54, 56 is the second information. It can be recognized as player operation information. Of course, the reverse is also possible.

  For example, the step regions 46, 48, and 50 can be used for the left foot, and the step regions 52, 54, and 56 can be used for the right foot. For example, the step region 46 can be depressed when the cursor is moved to the left, the step region 48 can be depressed when the cursor is moved to the right, and the step region 50 can be used as a determination button. That is, the information processing apparatus 20 moves the cursor displayed on the television monitor 1 to the left when the stepping area 46 is depressed, and is displayed on the television monitor 1 when the stepping area 48 is depressed. When the step area 50 is depressed by moving the cursor to the right, execution of a predetermined process can be started.

  For example, the information processing apparatus 20 associates each step area 46 to 56 with an object displayed on the television monitor 1, and changes the corresponding object when the step area 46 to 56 is depressed. it can. For example, the information processing apparatus 20 can change the object displayed on the television monitor 1 when a predetermined combination of the step areas 46 to 56 is depressed. For example, the information processing apparatus 20 changes the object displayed on the television monitor 1 when a foot is released from a predetermined combination of the step areas 46 to 56 (for example, when the player jumps). Can be made.

  For example, the information processing apparatus 20 counts the number of times that a predetermined step region (single or plural) among the step regions 46 to 56 is stepped on per predetermined time, and responds to the count value. Thus, the object displayed on the television monitor 1 can be changed. For example, the information processing apparatus 20 can set a state in which the step areas 46 to 56 are not stepped on as a waiting state for processing. Therefore, in this case, the information processing apparatus 20 executes a predetermined process when the step areas 46 to 56 are stepped on. For example, the information processing apparatus 20 can set the state in which the step areas 46 to 56 are stepped on as a waiting state for processing. Therefore, in this case, the information processing apparatus 20 executes a predetermined process when the foot is separated from the stepping areas 46 to 56.

  For example, the information processing apparatus 20 displays the object displayed on the television monitor 1 according to the time during which a predetermined step region (single or plural) of the step regions 46 to 56 is depressed. Can be changed. For example, the information processing apparatus 20 selects an object displayed on the television monitor 1 according to a time when a predetermined step area (single or plural) of the step areas 46 to 56 is not depressed. Can be changed.

  For example, the information processing apparatus 20 can cause an object to appear on the television monitor 1 when a predetermined step region (single or plural) of the step regions 46 to 56 is stepped on. For example, the information processing apparatus 20 can cause an object to appear on the television monitor 1 when a predetermined step area (single or plural) of the step areas 46 to 56 is not depressed. .

  The change in the object displayed on the television monitor 1 includes, for example, a change in the position of the object, a change in the form, a change in color, or a combination thereof.

  For example, the information processing apparatus 20 can start predetermined information processing when the step areas 46 to 56 are depressed. For example, the information processing apparatus 20 can start predetermined information processing when the foot is released from the stepping areas 46 to 56.

  The predetermined information processing includes, for example, various information processing such as recording, reproduction, processing, generation of sound (for example, music, sound effect, etc.), processing, game processing, and the like of an image displayed on the television monitor 1. Is included.

  As described above, in the present embodiment, pad layer 310 is provided in the upper layer of back sheet 190. For this reason, the cloth sheet 180 (or the sheet 410) to which the cloth sheets 140 to 150 (or the sheets 400 and 420), which are sheets covering the pad, are not directly in contact with the floor surface. Therefore, it is possible to prevent the mat switch 40 from being damaged as much as possible because the cloth sheets 140 to 150 (or the sheets 400 and 420) are attached to the cloth sheet 180 (or the sheet 410).

  With reference to FIG. 5, in this Embodiment, since sheet | seats 140-150,180 are cloth-made, they have air permeability. For this reason, when the step regions 46 to 56 are stepped on, the air in the space surrounded by the sheets 140 to 150 and the sheet 180 (the space where the pads 160 to 170 exist) can flow out. That is, air can flow out from the space through the sheets 140 to 150 and 180. Therefore, it is possible to suppress an increase in pressure in the space surrounded by the sheets 140 to 150 and the sheet 180 due to the stepping operation of the mat switch 40. As a result, it is possible to prevent the sheets 140 to 150 and 180 from being damaged as much as possible due to an increase in internal pressure.

  Referring to FIG. 13, in the present embodiment, sheet 420 has air permeability because hole 408 is formed. For this reason, when the step regions 46 to 56 are stepped on, the air in the space surrounded by the sheet 420 and the sheet 410 (the space where the pads 160 to 170 exist) can flow out. That is, air can flow out of the space through the hole 408 of the sheet 420. Therefore, it is possible to suppress an increase in the pressure in the space surrounded by the sheet 420 and the sheet 410 due to the stepping operation of the mat switch 40. As a result, it is possible to prevent the sheets 410 and 420 from being damaged as much as possible due to the increased internal pressure.

  Referring to FIG. 12, in the present embodiment, pads 160 to 170 are provided so that air can flow between a space surrounded by sheet 400 and sheet 410 and a space outside thereof. The sheet 400 is attached to the sheet 410 so as to cover it. That is, as shown in FIG. 12, the sheet 400 is welded to the sheet 410 so that the welded portions 402 and the non-welded portions 404 are alternately formed. For this reason, when the stepping regions 46 to 56 are stepped on, the air in the space surrounded by the sheet 400 and the sheet 410 (the space where the pad exists) can flow out. That is, air can flow out from the space via the non-welded portion 404. Accordingly, it is possible to suppress an increase in pressure in the space surrounded by the sheet 400 and the sheet 410 due to the stepping operation of the mat switch 40. As a result, the sheets 400 and 410 can be prevented from being damaged as much as possible due to the increase in internal pressure.

  With reference to FIG. 2, in this Embodiment, the buffer sheet 60 is provided under the surface sheet 42 which contacts the sole of a game player directly. For this reason, the impact due to the stepping-in operation is mitigated, and damage to the switch layer 300 can be prevented as much as possible.

  With reference to FIG. 11, in this Embodiment, the buffer sheet 60 is provided on the back surface sheet 190 which contacts a floor surface directly. For this reason, it is possible to prevent damage to the switch layer 300 due to pressing on the floor surface by the stepping operation as much as possible.

  Referring to FIG. 3, in the present embodiment, grid-like conductor pattern 113 of upper electrode sheet 70 and grid-like conductor pattern 113 of lower electrode sheet 110 are formed in a crossing direction. For this reason, compared with the case where it forms in the same direction, the conductor pattern 113 of the upper electrode sheet 70 and the conductor pattern 113 of the lower electrode sheet 110 become easy to contact. Therefore, the depression operation of the mat switch 40 can be detected with high sensitivity.

  Referring to FIG. 4, in the present embodiment, silver having a conductivity higher than that of carbon is formed in conductive regions 80 to 92 and 112 to 136. For this reason, it is possible to detect the depression operation of the mat switch 40 with higher sensitivity as compared with the case where the conductive regions 80 to 92 and 112 to 136 are formed using only carbon. On the other hand, the conductive region is formed mainly of carbon cheaper than silver. For this reason, the amount of expensive silver used can be adjusted in consideration of cost.

  Referring to FIG. 3, in the present embodiment, a plurality of sheet-like switches are provided in the planar direction. For this reason, a plurality of persons can use the same mat switch 40. In this case, a plurality of people can step on the sheet-like switch at the same time. In addition, one person can step on the sheet-like switch simultaneously or alternately using both feet. Each sheet-like switch can have a different function. As a result, the range of use of the mat switch 40 is expanded.

  The present invention is not limited to the above-described embodiment, and can be implemented in various modes without departing from the gist thereof. For example, the following modifications are possible.

  (1) In the above description, the number of sheet-like switches is six. However, the number of sheet-like switches is not limited to this. There may be one sheet-like switch, or a plurality of switches other than six. Further, the arrangement of the sheet-like switches is not limited to the above, and can be arbitrarily arranged.

  (2) In the above description, the conductor pattern 113 has a lattice shape, but the present invention is not limited to this, and any pattern can be adopted. The conductor pattern 115 is not limited to the above, and any pattern can be adopted.

  (3) In the above description, the conductive regions 72 to 92 and 112 to 136 are formed by the conductive pattern 113 and the conductive pattern 115. However, the conductive regions can be formed only by the conductive pattern 113, or the conductive pattern. It can also be formed by 115 alone.

  (4) Although the buffer sheet 60 is provided in the above, it is not always necessary to provide it. In addition to each layer constituting the mat switch 40, an arbitrary layer can be further added.

  (5) In the above description, the sheet-like switch is configured by the conductive regions 72 to 82, the spacer 100, and the conductive regions 112 to 122, but the configuration of the sheet-like switch is not limited to this. For example, a structure corresponding to the spacer 100 may be attached to either the upper electrode sheet 70 or the lower electrode sheet 110.

  (6) In the above description, the information processing apparatus 20 is attached to the mat switch 40. However, the information processing apparatus 20 is not necessarily attached and may be separated.

  (7) In the above description, the game system is given as an example of the information processing system. However, the application of the present invention is not limited to this. For example, the present invention can be applied to a training system, a simulated experience system, and the like.

  (8) In the pad layer 310 of FIGS. 2 and 11, the pads 160 to 170 are placed on the cloth sheet 180, and the cloth sheets 140 to 150 are placed on the pads 160 to 170. However, the pad layer 310 may be formed by placing the pads 160 to 170 on the cloth sheets 140 to 150 and placing the cloth sheet 180 on the pads 160 to 170.

  (9) Although any type of processor can be used as the high-speed processor 200 of FIG. 9, it is preferable to use a high-speed processor that has already been applied for a patent. This high speed processor is disclosed in detail, for example, in Japanese Patent Laid-Open No. 10-307790 and US Pat. No. 6,070,205 corresponding thereto.

FIG. 1 is a diagram showing an overall configuration of a game system according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the mat switch shown in FIG. FIG. 3A is a plan view of the upper electrode sheet of FIG. FIG. 3B is a plan view of the spacer of FIG. FIG. 3C is a plan view of the lower electrode sheet of FIG. FIG. 4 is an enlarged view of a conductive region formed on the lower electrode sheet of FIG. FIG. 5 is an explanatory diagram of the pad layer of FIG. FIG. 6 is a cross-sectional view of the mat switch taken along line AA. FIG. 7 is a cross-sectional view of the mat switch taken along line BB. FIG. 8 is a rear view of the mat switch of FIG. FIG. 9 is a diagram showing an electrical configuration of the information processing apparatus of FIG. FIG. 10 is a block diagram of the high speed processor of FIG. FIG. 11 is another exemplary view of the mat switch of FIG. FIG. 12A is a surface view of another configuration example of the pad layer of FIG. FIG. 12B is a rear view thereof. FIG. 13A is a surface view of still another configuration example of the pad layer of FIG. FIG. 13B is a rear view thereof. FIG. 14 is an explanatory diagram of a conventional mat switch.

Claims (11)

Mat switch,
A first sheet;
A pad layer,
A switch layer including a sheet-like switch for detecting a stepping motion in the mat switch;
A second sheet,
The pad layer and the switch layer are laminated between the first sheet and the second sheet,
The pad layer is
A third sheet;
Pad,
A fourth sheet,
The pad is disposed at a position corresponding to the sheet-like switch,
The mat switch, wherein the fourth sheet is attached to the third sheet so as to cover the pad.   The mat switch according to claim 1, wherein at least one of the third sheet and the fourth sheet has air permeability.   The fourth sheet so that air can flow between the space surrounded by the third sheet and the fourth sheet and the space outside thereof, and so as to cover the pad. The mat switch according to claim 1, wherein the mat switch is attached to the third sheet.   The pad layer is provided above the first sheet, the switch layer is provided above the pad layer, the second sheet is provided above the switch layer, and the mat switch is used. The mat switch according to claim 1, wherein the first sheet is in contact with a floor surface.   The pad layer is provided above the first sheet, the switch layer is provided above the pad layer, a buffer sheet is provided above the switch layer, and the second layer is provided above the buffer sheet. The mat switch according to claim 1, wherein a sheet is provided, and the first sheet is in contact with a floor surface when the mat switch is in use.   The switch layer is provided above the first sheet, the pad layer is provided above the switch layer, the second sheet is provided above the pad layer, and the mat switch is used. The mat switch according to claim 1, wherein the first sheet contacts a floor surface.   A buffer sheet is provided above the first sheet, the switch layer is provided above the buffer sheet, the pad layer is provided above the switch layer, and the second layer is provided above the pad layer. The mat switch according to claim 1, wherein a sheet is provided, and the first sheet is in contact with a floor surface when the mat switch is in use. The switch layer is
A first electrode sheet on which a conductive region is formed;
An insulating spacer;
A conductive region is formed and includes a second electrode sheet,
The first electrode sheet, the spacer, and the second electrode so that the conductive region of the first electrode sheet and the conductive region of the second electrode sheet face each other with the spacer interposed therebetween. Of electrode sheets,
On the surface of the first electrode sheet, by forming a conductor in a lattice shape, the conductive region of the first electrode sheet is formed,
On the surface of the second electrode sheet, by forming a conductor in a lattice shape, the conductive region of the second electrode sheet is formed,
2. The mat switch according to claim 1, wherein the grid-shaped conductors of the first electrode sheet and the grid-shaped conductors of the second electrode sheet are formed in an intersecting direction. The conductor formed in a lattice shape on the surface of the first electrode sheet is carbon,
In the conductive region of the first electrode sheet, silver is formed in a linear shape so as to intersect the lattice-like carbon,
The conductor formed in a lattice pattern on the surface of the second electrode sheet is carbon,
The mat switch according to claim 8, wherein silver is formed in a linear shape in the conductive region of the second electrode sheet so as to intersect the lattice-like carbon.   The mat switch according to claim 1, wherein a plurality of the sheet-like switches are provided in a planar direction. An information processing system,
Mat switch,
An information processing device that performs information processing according to on / off information from the mat switch,
The mat switch is
A first sheet;
A pad layer,
A switch layer including a sheet-like switch for detecting a stepping motion in the mat switch;
A second sheet,
The pad layer and the switch layer are laminated between the first sheet and the second sheet,
The pad layer is
A third sheet;
Pad,
A fourth sheet,
The pad is disposed at a position corresponding to the sheet-like switch,
The information processing system, wherein the fourth sheet is attached to the third sheet so as to cover the pad.

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