JP2008503095A5 - - Google Patents

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Publication number
JP2008503095A5
JP2008503095A5 JP2007516730A JP2007516730A JP2008503095A5 JP 2008503095 A5 JP2008503095 A5 JP 2008503095A5 JP 2007516730 A JP2007516730 A JP 2007516730A JP 2007516730 A JP2007516730 A JP 2007516730A JP 2008503095 A5 JP2008503095 A5 JP 2008503095A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2007516730A
Other versions
JP2008503095A (ja
Filing date
Publication date
Priority claimed from US11/152,130 external-priority patent/US20050284915A1/en
Application filed filed Critical
Publication of JP2008503095A publication Critical patent/JP2008503095A/ja
Publication of JP2008503095A5 publication Critical patent/JP2008503095A5/ja
Withdrawn legal-status Critical Current

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JP2007516730A 2004-06-15 2005-06-15 基板およびリードフレームをインデキシングする機器および方法 Withdrawn JP2008503095A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US57980604P 2004-06-15 2004-06-15
US11/152,130 US20050284915A1 (en) 2004-06-15 2005-06-14 Apparatus and method for indexing of substrates and lead frames
PCT/US2005/021278 WO2005124830A2 (en) 2004-06-15 2005-06-15 Apparatus and method for indexing of substrates and lead frames

Publications (2)

Publication Number Publication Date
JP2008503095A JP2008503095A (ja) 2008-01-31
JP2008503095A5 true JP2008503095A5 (ja) 2009-03-12

Family

ID=35504528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007516730A Withdrawn JP2008503095A (ja) 2004-06-15 2005-06-15 基板およびリードフレームをインデキシングする機器および方法

Country Status (3)

Country Link
US (1) US20050284915A1 (ja)
JP (1) JP2008503095A (ja)
WO (1) WO2005124830A2 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060144899A1 (en) * 2004-12-30 2006-07-06 Hu Xiao P Jam detection apparatus and method for indexing of substrates and lead frames
JP4989349B2 (ja) * 2007-08-02 2012-08-01 株式会社日立ハイテクインスツルメンツ 部品実装装置
KR20120138114A (ko) * 2011-06-14 2012-12-24 삼성전자주식회사 기판 처리 장치 및 방법
JP5701465B2 (ja) * 2012-12-21 2015-04-15 株式会社新川 フリップチップボンダ及びボンディングステージの平坦度並びに変形量補正方法
DE102015101759B3 (de) * 2015-02-06 2016-07-07 Asm Assembly Systems Gmbh & Co. Kg Bestückmaschine und Verfahren zum Bestücken eines Trägers mit ungehäusten Chips
JP6956695B2 (ja) * 2018-08-28 2021-11-02 京セラ株式会社 液体供給デバイス
CN113437008B (zh) * 2021-06-23 2023-11-17 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 键合机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3679861A (en) * 1971-08-13 1972-07-25 Western Electric Co Methods of assembling and testing electrical components
US4301958A (en) * 1978-08-24 1981-11-24 Fujitsu Limited Arrangement for automatically fabricating and bonding semiconductor devices
US5203443A (en) * 1989-11-13 1993-04-20 Kabushiki Kaisha Shinkawa Conveying apparatus used in assembling semicondutors
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
US5238174A (en) * 1991-11-15 1993-08-24 Kulicke And Soffa Investments, Inc. Smart indexing head for universal lead frame work station
US7108470B2 (en) * 2003-04-29 2006-09-19 Asm Technology Singapore Pte Ltd Buffer device for semiconductor processing apparatus

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