JP2008303368A - Epoxy resin composition for sealing semiconductor and semiconductor device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which can enhance the yield and quality of a semiconductor device on compression molding, when the semiconductor element is sealed by a compression molding method to manufacture a semiconductor device. <P>SOLUTION: The present invention relates to the granular epoxy resin composition for sealing a semiconductor, used for sealing a semiconductor element by a compression molding method, to produce the semiconductor device, characterized by having a compacted bulk density of ≥0.8 g/cm<SP>3</SP>and ≤1.1 g/cm<SP>3</SP>, as measured with a measurement container having an inner diameter of 50.46 mm, a depth of 50 mm and a volume of 100 cm<SP>3</SP>. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  TECHNICAL FIELD The present invention relates to a granular semiconductor sealing epoxy resin composition and a semiconductor device using the same, and particularly to a granular semiconductor sealing epoxy resin suitable for sealing a semiconductor element by compression molding. The present invention relates to a composition and a semiconductor device using the composition.

  As a technique related to a semiconductor device in which a semiconductor element is sealed by compression molding, a method of performing resin molding by compression molding while reducing the pressure inside a mold (see, for example, Patent Document 1) and a molding material for sealing A method using a pellet or sheet having a thickness of 3.0 mm or less (for example, see Patent Document 2) is disclosed.

JP2000-021908 JP 2006-216899 A

  The present invention provides an epoxy resin composition for semiconductor encapsulation that can increase the yield during compression molding and the quality in the semiconductor device when a semiconductor device is obtained by sealing a semiconductor element by compression molding. .

Such an object is achieved by the present invention described in the following [1] to [3].
[1] An epoxy resin composition for encapsulating a semiconductor used for a semiconductor device in which a semiconductor element is encapsulated by compression molding, and measured using a measuring container having an inner diameter of 50.46 mm, a depth of 50 mm, and a volume of 100 cm ³ . A granular epoxy resin composition for encapsulating semiconductors, wherein the bulk density is 0.8 g / cm ³ or more and 1.1 g / cm ³ or less.
[2] The ratio of coarse particles of 2 mm or more is 3% by weight or less, and the proportion of fine powders of less than 106 μm is 7% by weight or less, for sealing a granular semiconductor according to item [1] Epoxy resin composition.
[3] A semiconductor device obtained by sealing a semiconductor element using the granular epoxy resin composition for sealing a semiconductor according to [1] or [2].

  According to the present invention, when a semiconductor device is obtained by encapsulating a semiconductor element by compression molding, an epoxy resin composition for semiconductor encapsulation that can increase the yield during compression molding and the quality of the semiconductor device can be obtained. .

The present invention is an epoxy resin composition for semiconductor encapsulation used in a semiconductor device in which a semiconductor element is encapsulated by compression molding, and is measured using a measurement container having an inner diameter of 50.46 mm, a depth of 50 mm, and a volume of 100 cm ^3. It is a granular epoxy resin composition for encapsulating a semiconductor having a bulk density of 0.8 g / cm ³ or more and 1.1 g / cm ³ or less.
In the case of obtaining a semiconductor device by sealing a semiconductor element by compression molding using a powdered epoxy resin composition, in order to improve the yield at the time of compression molding and quality in the semiconductor device, a powdered epoxy resin It is important that the composition is uniformly charged into the cavity of the compression mold and the weighing accuracy of the powdered epoxy resin composition charged into the cavity of the compression mold. In addition, when the preparation and weighing of the epoxy resin composition are performed by a conveying device such as a vibration feeder, the powder of the epoxy resin composition is homogeneously sent out by vibration (hereinafter referred to as “conveyability”). is important.
When the granular epoxy resin composition for encapsulating a semiconductor of the present invention is used to obtain a semiconductor device by encapsulating a semiconductor element by compression molding, the epoxy resin composition for semiconductor encapsulation is compressed into a cavity of a compression mold. As a result, the weighing accuracy and the transportability when it is put into the wafer are improved, and the yield at the time of compression molding and the quality of the semiconductor device can be improved.
Hereinafter, the present invention will be described in detail.

A conventionally used epoxy resin composition for semiconductor molding for compression molding is prepared by premixing each raw material component with a mixer, followed by heating and kneading with a kneader such as a roll, kneader or extruder, followed by cooling and pulverization steps. It is a pulverized product and measured with a measuring container having an inner diameter of 50.46 mm, a depth of 50 mm, and a volume of 100 cm ³ , and has a solid bulk density of 1.2 g / cm ³ or more and 1.4 g / cm ³ or less. It was a thing.
The granular epoxy resin composition for semiconductor encapsulation obtained according to the present invention has an inside diameter of 50.46 mm, a depth of 50 mm, a volume density of 100 g ³ measured using a measuring container of 0.8 cm / cm ³ or more, It is preferably 1.1 g / cm ³ or less, and more preferably 0.8 g / cm ³ or more and 1.0 g / cm ³ or less. The bulk density is determined by gently putting a sample of the epoxy resin composition on the top of a measuring container with a known capacity and then tapping 180 times, then removing the upper cylinder and measuring container. This can be obtained by grinding the sample deposited on the top with a blade and measuring the weight of the sample filled in the measurement container. The compacted bulk density is an index representing the compaction state of the powder in the transport path in a transport device such as a vibration feeder. The larger the value, the lower the porosity of the powder layer. It is likely to be in a closed state, causing a conveyance failure. On the other hand, when this value is too small, coarse particles having a relatively large particle size occupy the majority, so that the porosity is high, and the weighing accuracy is lowered.
In order to obtain a granular epoxy resin composition for encapsulating a semiconductor having a solid bulk density within the above range, it can be obtained by a production method described in detail below.

Moreover, the epoxy resin composition for semiconductor encapsulation obtained by the present invention is a granular epoxy resin composition for semiconductor encapsulation, but 2 mm or more in order to obtain stable transportability and good weighing accuracy in compression molding. The ratio of the coarse particles is preferably 3% by weight or less, and more preferably 1% by weight or less. This is because the larger the particle size, the larger the weight of the particle, so the larger the proportion of coarse particles of 2 mm or more, the lower the weighing accuracy at the time of weighing, which contributes to the quality deterioration in the semiconductor device after molding. It is to become.
In addition, in the granular epoxy resin composition of the present invention, the proportion of fine powder of less than 106 μm is preferably 7% by weight or less, and more preferably 3% by weight or less in order to obtain stable weighing accuracy. This is because fine powder of less than 106 μm causes solidification of the fine powder on the conveyance path and adhesion to the conveyance device, which causes conveyance failure.
In order to obtain a granular epoxy resin composition for semiconductor encapsulation having a small proportion of coarse particles of 2 mm or more and fine powders of less than 106 μm, it can be obtained by a production method described in detail below.

  The granular epoxy resin composition for semiconductor encapsulation of the present invention comprises an epoxy resin, a curing agent, an inorganic filler, a curing accelerator, and, if necessary, a colorant, a release agent, a low stress component, and an antioxidant. It contains additives such as agents.

  The epoxy resin used in the epoxy resin composition of the present invention is a monomer, oligomer, or polymer in general having two or more epoxy groups in one molecule, and its molecular weight and molecular structure are not particularly limited. Crystalline epoxy resins such as biphenyl type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, stilbene type epoxy resin, hydroquinone type epoxy resin; cresol novolac type epoxy resin, phenol novolac type epoxy resin, naphthol novolak type epoxy resin Phenolic epoxy resins such as phenylene skeleton-containing phenol aralkyl epoxy resins, biphenylene skeleton-containing phenol aralkyl epoxy resins, phenylene skeleton-containing naphthol aralkyl epoxy resins, etc. Luaralkyl type epoxy resin; Trifunctional epoxide resin such as triphenolmethane type epoxy resin and alkyl modified triphenolmethane type epoxy resin; Modified phenol type epoxy such as dicyclopentadiene modified phenol type epoxy resin and terpene modified phenol type epoxy resin Resins; heterocyclic ring-containing epoxy resins such as triazine nucleus-containing epoxy resins, and the like may be used, and these may be used alone or in combination of two or more.

  The curing agent used in the epoxy resin composition of the present invention is not particularly limited as long as it is cured by reacting with an epoxy resin. For example, carbon such as ethylenediamine, trimethylenediamine, tetramethylenediamine, hexamethylenediamine, etc. 2-20 linear aliphatic diamine, metaphenylenediamine, paraphenylenediamine, paraxylenediamine, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylpropane, 4,4′-diaminodiphenyl ether, 4, 4′-diaminodiphenylsulfone, 4,4′-diaminodicyclohexane, bis (4-aminophenyl) phenylmethane, 1,5-diaminonaphthalene, metaxylenediamine, paraxylenediamine, 1,1-bis (4-amino) Phenyl) cyclohexane Aminos such as dicyanodiamide; resol type phenol resins such as aniline-modified resole resin and dimethyl ether resole resin; Examples of such polyoxystyrenes include phenol resins such as phenol aralkyl resins and acid anhydrides, but are not limited thereto. Of these, the curing agent used for the semiconductor encapsulating material is preferably a compound having at least two phenolic hydroxyl groups in one molecule from the viewpoint of moisture resistance, reliability, etc., and a phenol novolac resin and cresol novolac. Examples thereof include novolak-type phenol resins such as resins, tert-butylphenol novolak resins, and nonylphenol novolak resins; resol-type phenol resins; polyoxystyrenes such as polyparaoxystyrene; and phenolaralkyl resins.

  The inorganic filler used in the epoxy resin composition of the present invention is not particularly limited as long as it is generally used for a semiconductor sealing material, and is a fused crushed silica powder, a fused spherical silica powder, a crystalline silica powder, Silica powder such as secondary agglomerated silica powder; alumina, titanium white, aluminum hydroxide, talc, clay, mica, glass fiber and the like. Among these, fused spherical silica powder is particularly preferable. Further, the shape is preferably infinitely spherical, and the amount of filling can be increased by mixing particles having different particle sizes.

  As a hardening accelerator used for the epoxy resin composition of this invention, what accelerates | stimulates the hardening reaction of an epoxy group and a phenolic hydroxyl group should just be used, and what is generally used for a sealing material can be used. For example, diazabicycloalkenes such as 1,8-diazabicyclo (5,4,0) undecene-7 and derivatives thereof; amine compounds such as tributylamine and benzyldimethylamine; imidazole compounds such as 2-methylimidazole; triphenyl Organic phosphines such as phosphine and methyldiphenylphosphine; tetraphenylphosphonium / tetraphenylborate, tetraphenylphosphonium / tetrabenzoic acid borate, tetraphenylphosphonium / tetranaphthoic acid borate, tetraphenylphosphonium / tetranaphthoyloxyborate, tetraphenyl Tetra-substituted phosphonium / tetra-substituted borate such as phosphonium / tetranaphthyloxyborate; triphenylphosphine adducted with benzoquinone Is, they may be used in combination of two or more be used one kind alone.

  In addition to the above components, the epoxy resin composition of the present invention includes a coupling agent such as γ-glycidoxypropyltrimethoxysilane; a colorant such as carbon black; Release agents such as fat or metal salts thereof, paraffin, etc .; low stress components such as silicone oil and silicone rubber; various additives such as antioxidants can be blended.

  The method for obtaining the granular epoxy resin composition for semiconductor encapsulation of the present invention is not particularly limited. For example, a rotor composed of a cylindrical outer peripheral portion having a plurality of small holes and a disc-shaped bottom surface is provided. A method (hereinafter referred to as “centrifugal milling method”) in which a melt-kneaded epoxy resin composition is supplied inside and the epoxy resin composition is obtained by passing through the small holes by centrifugal force obtained by rotating the rotor. "). In the centrifugal milling method, as a means for supplying the melt-kneaded epoxy resin composition to the inside of the rotor, it is preferably supplied to the inside of the rotor through a double-pipe cylindrical body cooled with a refrigerant. Thereby, it can prevent that the melt-kneaded epoxy resin composition adheres to the inner wall of the cylindrical body which passes. In the centrifugal milling method, it is preferable that the cylindrical outer peripheral portion having a plurality of small holes can be adjusted in temperature by direct or indirect heating means. Thereby, the melt viscosity of the epoxy resin composition passing through the small holes can be adjusted, and resin adhesion to the cylindrical outer peripheral portion and clogging of the small holes can be prevented.

  In addition to the above-mentioned centrifugal milling method, the method for obtaining the granular epoxy resin composition for encapsulating a semiconductor of the present invention is, for example, premixing each raw material component with a mixer and then kneading with a roll, a kneader, an extruder, or the like. A method of obtaining a pulverized product after heating and kneading by a machine, followed by cooling and pulverizing steps, by removing coarse particles and fine powder using a sieve (hereinafter referred to as “pulverized product sieving method”), After each raw material component is premixed with a mixer, it is heated and kneaded using an extruder equipped with a die having a plurality of small diameters arranged at the tip of the screw, and extruded from a small hole arranged in the die. It can also be obtained by a method (hereinafter referred to as “hot cut method”) obtained by cutting the molten resin with a cutter that slides and rotates substantially parallel to the die surface. Among these production methods, the use of a granular semiconductor sealing epoxy resin composition obtained by centrifugal milling method provides the best weighing accuracy and transportability in compression molding, yield in compression molding and in semiconductor devices. Since quality can be improved most, it is more preferable.

  Next, the centrifugal milling method, which is an example of the production method for obtaining the granular epoxy resin composition for semiconductor encapsulation of the present invention, will be described in detail with reference to the drawings. FIG. 1 is a schematic view of an embodiment from melt kneading to granule collection of a resin composition for obtaining granules of an epoxy resin composition for semiconductor encapsulation, and FIG. 2 shows a rotor and a cylindrical outer peripheral portion of the rotor. FIG. 3 shows a cross-sectional view of an embodiment of an exciting coil for heating, and FIG. 3 shows a cross-sectional view of an embodiment of a double-pipe cylinder that supplies a melted and kneaded resin composition to a rotor.

  The epoxy resin composition melt-kneaded by the twin-screw extruder 9 is supplied to the inside of the rotor 1 through a double-pipe cylindrical body 5 cooled by passing a refrigerant between the inner wall and the outer wall. At this time, the double-pipe cylinder 5 is preferably cooled using a refrigerant so that the melt-kneaded epoxy resin composition does not adhere to the wall of the double-pipe cylinder 5. By supplying the epoxy resin composition to the rotor 1 through the double-pipe cylindrical body 5, the rotor 1 rotates at a high speed even when the epoxy resin composition is supplied in a continuous thread form. Due to the influence, the epoxy resin composition can be stably supplied without jumping out of the rotor 1.

  The rotor 1 is connected to a motor 10 and can be rotated at an arbitrary number of rotations. A cylindrical outer peripheral portion 2 formed of a magnetic material 3 having a plurality of small holes installed on the outer periphery of the rotor 1 has an AC power source generated by an AC power generator 6 in an excitation coil 4 provided in the vicinity thereof. Is heated by the eddy current loss and hysteresis loss accompanying the passage of the alternating magnetic flux generated by energizing. In addition, as this magnetic material 3, an iron material, silicon steel, etc. are mentioned, for example, One type or two or more types of magnetic materials 3 can be combined and used. The cylindrical outer peripheral portion 2 having a plurality of small holes is not limited to the magnetic material 3, and is formed of, for example, a nonmagnetic material having high thermal conductivity, and is heated by providing the magnetic material 3 above and below it. The cylindrical outer peripheral portion 2 can be heated by heat conduction using the magnetic material 3 as a heat source. Examples of the nonmagnetic material include copper and aluminum, and one type or two or more types of nonmagnetic materials can be used in combination. After the epoxy resin composition is supplied to the inside of the rotor 1, the epoxy resin composition flies to the heated cylindrical outer peripheral portion 2 by centrifugal force obtained by rotating the rotor 1 by the motor 10.

  The epoxy resin composition in contact with the heated cylindrical outer peripheral portion 2 having a plurality of small holes easily passes through the small holes of the cylindrical outer peripheral portion 2 and is discharged without increasing the melt viscosity. The heating temperature can be arbitrarily set depending on the characteristics of the epoxy resin composition to be applied. In general, if the heating temperature is raised too much, the epoxy resin composition is hardened and may deteriorate in characteristics or clog the small holes in the cylindrical outer peripheral portion 2. However, under appropriate temperature conditions, the resin composition Since the contact time between the object and the cylindrical outer peripheral portion 2 is extremely short, the influence on the characteristics is extremely small. Further, since the cylindrical outer peripheral portion 2 having a plurality of small holes is heated uniformly, there is very little local change in characteristics. Further, the plurality of small holes in the cylindrical outer peripheral portion 2 can arbitrarily adjust the hole diameter in accordance with the properties of the resin composition to be used and the particle size distribution of the granules.

  The granular resin composition discharged through the small holes in the cylindrical outer peripheral portion 2 is collected, for example, in an outer tub 8 installed around the rotor 1. The outer tub 8 flies through a small hole in the cylindrical outer peripheral portion 2 in order to prevent the granular epoxy resin composition from adhering to the inner wall and preventing the fusion between the granular epoxy resin compositions. It is preferable that the collision surface with which the granular epoxy resin composition collides is installed with an inclination of 10 to 80 degrees, preferably 25 to 65 degrees with respect to the flight direction of the granular epoxy resin composition. When the inclination of the collision surface with respect to the flight direction of the epoxy resin composition is not more than the above upper limit value, the collision energy of the granular epoxy resin composition can be sufficiently dispersed, and there is little possibility of causing adhesion to the wall surface. Moreover, since the flight speed of a granular epoxy resin composition can fully be reduced when the inclination of the collision surface with respect to the flight direction of an epoxy resin composition is more than the said lower limit, secondary collision with the outer tank wall surface is possible. Even if it does, there is little fear of adhering to the exterior wall surface.

  In addition, when the temperature of the collision surface on which the granular epoxy resin composition collides increases, the granular epoxy resin composition tends to adhere, so a cooling jacket 7 is provided on the outer periphery of the collision surface to cool the collision surface. It is preferable to do. The inner diameter of the outer tub 8 is such that the granular epoxy resin composition is sufficiently cooled so that adhesion of the granular epoxy resin composition to the inner wall and fusion between the granular epoxy resin compositions do not occur. The size is desirable. In general, an air flow is generated by the rotation of the rotor 1 and a cooling effect is obtained, but cold air may be introduced as necessary. Although the size of the outer tub 8 depends on the amount of resin to be processed, for example, when the diameter of the rotor 1 is 20 cm, adhesion and fusion can be prevented if the inner diameter of the outer tub 8 is about 100 cm.

The present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.
<Formulation of epoxy resin composition for semiconductor encapsulation (parts by weight)>
-Cresol novolac type epoxy resin 8.0 parts by weight-Brominated epoxy resin 2.0 parts by weight-Phenol novolac resin 4.0 parts by weight-Curing agent (2-methylimidazole) 0.3 part by weight-Inorganic filler (silica ) 84.0 parts by weight, carnauba wax 0.1 part by weight, low molecular weight polyethylene 0.1 part by weight, carbon black 0.3 part by weight, coupling agent 0.2 part by weight, antimony trioxide 1.0 part by weight Preparation of melt-kneaded epoxy resin composition>
The raw material of the epoxy resin composition for semiconductor encapsulation having the above composition is pulverized and mixed for 5 minutes by a super mixer, and then the mixed raw material is screwed in a co-rotating twin screw extruder 9 having a cylinder inner diameter of 65 mm shown in FIG. A melt-kneaded epoxy resin composition was prepared by melt-kneading at a rotation speed of 30 RPM and a resin temperature of 110 ° C.

<Manufacture of epoxy resin composition for semiconductor encapsulation>
Example 1
As a material for the cylindrical outer peripheral portion 2 shown in FIG. 1, an iron punched wire net having a small hole with a hole diameter of 2.5 mm was used. The punched wire mesh having a height of 25 mm and a thickness of 1.5 mm was attached to the outer periphery of the rotor 1 having a diameter of 20 cm to form a cylindrical outer peripheral portion 2. The rotor 1 was rotated at 3000 RPM, and the cylindrical outer peripheral portion 2 was heated to 115 ° C. with an exciting coil. After the rotational speed of the rotor 1 and the temperature of the cylindrical outer peripheral portion 2 are in a steady state, an epoxy resin composition melt-kneaded from above the rotor 1 is supplied at a rate of 2 kg / hr, Granular epoxy resin composition for semiconductor encapsulation was obtained by passing through the plurality of small holes in the cylindrical outer peripheral portion 2 by centrifugal force obtained by rotating the rotor 1.

Comparative Example 1
The melt-kneaded epoxy resin composition was cooled with a cooling belt and then coarsely pulverized with a hammer mill to obtain a coarsely pulverized product having an average particle size of 800 μm and a particle size distribution of 40 μm to 10 mm. This was further pulverized with a pulverizer at 4000 rpm to obtain an epoxy resin composition for semiconductor encapsulation.

  The epoxy resin fat compositions for semiconductor encapsulation in Examples and Comparative Examples were evaluated by the following methods, and the evaluation results are shown in Tables 1 and 2.

Evaluation method Fine powder amount of less than 106 μm and coarse particle amount of 2 mm or more It was determined using JIS standard sieves with openings of 2.00 mm and 0.106 mm provided in a low tap vibrator. While shaking these sieves for 20 minutes, 40 g of the sample was passed through the sieve and classified, and the weight of the granules and granules remaining on each sieve was measured. Based on the weight measured in this way, the weight ratio of the amount of fine powder having a particle size of less than 106 μm and the amount of coarse particles having a particle size of 2 mm or more was calculated based on the weight of the sample before classification.

After the sample of the epoxy resin composition was gently put into a solid vessel with a powder tester (manufactured by Hosokawa Micron Co., Ltd.) and a cylinder attached to the top of a measuring container having an inner diameter of 50.46 mm, a depth of 50 mm, and a volume of 100 cm ³ Then, tapping was performed 180 times, and then the upper cylinder was removed, the sample deposited on the upper part of the measurement container was ground with a blade, and the weight of the sample filled in the measurement container was measured.

Consolidation / adhesion on the transport path After supplying 100 g of the epoxy resin composition sample to the hopper of the vibration feeder (450 mm length × 55 mm width), adjust the strength of vibration so that the transport amount is 18 g / min, After conveying 10 g, the stop was repeated for 3 minutes, and 100 g of the entire amount was conveyed. After transportation, the samples were consolidated and observed for adhesion to the vibration feeder to determine the presence or absence.
Weighing accuracy After supplying 100 g of the epoxy resin composition sample to the hopper of the vibration feeder (450 mm length × 55 mm width), adjusting the strength of vibration so that the conveyance amount becomes 18 g / min and conveying 10 g, 3 The time required to transport each 10 g when 100 g of the total amount was repeatedly transported was measured, and the average value and standard deviation were obtained.

  As is clear from the above table, in the embodiment of the present invention, the hardness density is in an appropriate range, so the variation in the required time when a predetermined amount is transported is small, and the consolidation on the transport path is It has been found that it exhibits good transportability without causing adhesion. That is, since the amount of fine powder that causes caking and adhesion is small, it is possible to carry the material without causing caking or adhesion on the conveyance path. In addition, since there are few coarse particles with large weight, the variation in the conveyance amount is small, and the hardness density is also in an appropriate range, so that it is difficult to be blocked by consolidation or bridge during conveyance, and stable conveyance is possible. It was confirmed.

  Since the granular epoxy resin composition for semiconductor encapsulation of the present invention can improve the yield at the time of compression molding and the quality of the semiconductor device, it is suitably used for a semiconductor device in which a semiconductor element is sealed by compression molding. be able to.

The schematic of one Example from the melt-kneading of a resin composition to granule collection for obtaining the granular epoxy resin composition for semiconductor sealing of this invention is shown. Sectional drawing of one Example of the exciting coil for heating the rotor used for this invention and the cylindrical outer peripheral part of a rotor is shown. Sectional drawing of one Example of the double tube | pipe cylindrical body which supplies the resin composition melt-kneaded to a rotor is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Rotor 2 Cylindrical outer peripheral part 3 Magnetic material 4 Excitation coil 5 Double pipe | tube type cylindrical body 6 AC power supply device 7 Cooling jacket 8 Outer tank 9 Twin screw extruder 10 Motor

Claims (3)

An epoxy resin composition for semiconductor sealing used in a semiconductor device formed by sealing a semiconductor element by compression molding,
Inner diameter 50.46Mm, depth 50 mm, was measured using a measurement reservoir volume 100 cm ^3, compacted bulk density of 0.8 g / cm ³ or more, granular, characterized in that it is 1.1 g / cm ³ or less Epoxy resin composition for semiconductor encapsulation.   2. The granular epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the proportion of coarse particles of 2 mm or more is 3% by weight or less and the proportion of fine powder of less than 106 μm is 7% by weight or less.   A semiconductor device comprising a semiconductor element sealed using the granular epoxy resin composition for sealing a semiconductor according to claim 1.

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