JP2008300701A - Electronic-component mounting device, and device and method for managing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic-component mounting device that notifies a worker of proper maintenance work by narrowing down causes of an abnormality when the abnormality occurs in a component supply unit or in a suction nozzle or the like of the electronic-component mounting device, and to provide a device and method for managing the same. <P>SOLUTION: Abnormality causes are narrowed down on the basis of a plurality of different types of abnormalities in the suction state of an electronic component by a suction nozzle. Maintenance items are determined by a CPU for each abnormality cause on the basis of a relationship between the preset abnormality causes and the maintenance items. The determined maintenance items are displayed on a monitor. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention includes a component supply unit that supplies an electronic component to a component suction position, and picks up an electronic component from the component supply unit by a suction nozzle and mounts the electronic component on a printed circuit board, and the electronic component mounting device The present invention relates to a management apparatus and a management method.

This type of electronic component mounting apparatus is disclosed in, for example, Japanese Patent Application Laid-Open No. H10-228707. For example, a suction nozzle lifting / lowering unit that lifts and lowers a suction nozzle to suck the electronic component from the component supply unit, and suction of the electronic component sucked by the suction nozzle A detection means for detecting an abnormality, a determination means for determining that the component supply unit or the suction nozzle needs maintenance due to the suction abnormality detected by the detection means, and a case where the determination means determines that maintenance is required Display means for displaying that effect.
JP-A-9-83198

  However, in such a conventional electronic component mounting apparatus, when an abnormality occurs, it is only displayed that maintenance is required for the abnormality. Depending on the experience, it is necessary to determine by yourself what kind of maintenance will be performed, and there is a risk of incorrect maintenance work. Further, there is a possibility that maintenance work that is not necessary may be performed, which causes a problem that the maintenance work becomes very complicated.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to narrow down the cause of an abnormality when an abnormality occurs in a component supply unit or a suction nozzle of an electronic component mounting apparatus and notify an operator of appropriate maintenance work.

  For this reason, the first invention narrows down the cause of the abnormality based on a plurality of different types of abnormality in the electronic component mounting apparatus that picks up the electronic component from the component supply unit by the suction nozzle and mounts it on the printed circuit board. It is characterized by comprising determining means for determining maintenance items for each narrowed cause and a display device for displaying the maintenance items determined by the determining means.

  According to a second aspect of the present invention, there is provided an electronic component mounting apparatus that picks up an electronic component from a component supply unit by a suction nozzle and mounts the electronic component on a printed circuit board. And determining means for determining maintenance items for each of the narrowed causes, and a display device for displaying the maintenance items determined by the determining means.

  According to a third aspect of the present invention, there is provided an electronic component mounting apparatus for picking up an electronic component from a component supply unit by a suction nozzle and mounting the electronic component on a printed circuit board. Narrowing down the cause of abnormality based on different types of abnormality, and determining means for determining a maintenance item for each abnormality cause based on a relationship between a preset abnormality cause and a maintenance item, and maintenance determined by this determining means And a display device for displaying items.

  According to a fourth aspect of the present invention, there is provided an electronic component mounting apparatus for picking up an electronic component from a component supply unit by a suction nozzle and mounting the electronic component on a printed circuit board. The present invention is characterized by comprising a determining means for narrowing down causes and determining a maintenance item for each narrowed cause, and a display device for displaying the maintenance items determined by the determining means.

  5th invention narrows down the cause of abnormality corresponding to a plurality of different types of abnormalities in an electronic component mounting apparatus management apparatus that picks up electronic components from a component supply unit by suction nozzles and mounts them on a printed circuit board The apparatus includes a determination unit that determines a maintenance item for each narrowed cause, and a display device that displays the maintenance item determined by the determination unit.

  According to a sixth aspect of the present invention, there is provided a management device for an electronic component mounting apparatus that picks up an electronic component from a component supply unit by a suction nozzle and mounts the electronic component on a printed circuit board. A determination unit that narrows down the cause of an abnormality based on a plurality of different types of abnormality, determines a maintenance item corresponding to the abnormality cause based on a relationship between a preset abnormality cause and a maintenance item, and a maintenance determined by the determination unit And a display device for displaying items.

  According to a seventh aspect of the present invention, there is provided a management method for an electronic component mounting apparatus that picks up an electronic component from a component supply unit using a suction nozzle and mounts the electronic component on a printed circuit board. The maintenance item is determined for each cause, and the determined maintenance item is displayed on a display device.

  According to the present invention, when an abnormality occurs in the component supply unit or the suction nozzle of the electronic component mounting apparatus, the cause of the abnormality can be narrowed down and appropriate maintenance can be notified to the operator.

  Hereinafter, an embodiment of an electronic component mounting apparatus including a component supply unit and an electronic component mounting apparatus main body will be described with reference to the accompanying drawings. This electronic component mounting apparatus is a so-called multifunctional chip mounter, and various electronic components can be mounted on the printed circuit board P.

  1 is a plan view of the electronic component mounting apparatus, FIG. 2 is a front view of a lower main body of the electronic component mounting apparatus 1, and FIG. 3 is a right side view of the electronic component mounting apparatus 1. On the feeder bases 3A, 3B, 3C, and 3D on 2, a plurality of component supply units 3 that supply various electronic components one by one to their component take-out positions (component suction positions) are detachably mounted in a stationary state. It is fixed. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing component supply unit 3 groups. The supply conveyor 4 sequentially conveys the printed circuit board P received from the upstream to the positioning unit 5, and after the electronic components are mounted on the substrate P positioned by the positioning unit 5 by the positioning unit 5, it is conveyed to the discharge conveyor 6. The

  Reference numeral 8 denotes a pair of front and rear beams which are provided in the left and right portions of the mounting apparatus 1 and which are long in the X direction. A slider 11 fixed to each beam 8 along the pair of left and right guides 10 by driving each linear motor 9 By sliding, the printed circuit board P on the positioning unit 5 and the component take-out position above the component supply unit 3 are individually moved in the Y direction. The linear motor 9 includes a pair of upper and lower stators 9A fixed to the base 2 and a mover 9B fixed to lower portions of mounting plates provided at both ends of the beam 8.

  Each beam 8 is provided with a mounting head body 7 that moves along a guide 13 by a linear motor 14 in the longitudinal direction (X direction). As shown in FIG. 3, the linear motor 14 includes a pair of front and rear stators 14A fixed to the beam 8, and a mover 14B provided between the stators 14A and provided on the mounting head body 7. Composed.

  Each mounting head body 7 includes a mounting head 16 having a suction nozzle 15 that is biased downward by twelve springs 12. Each mounting head 16 of each mounting head body 7 is provided with a substrate recognition camera 19 for imaging a positioning mark attached to the positioned printed circuit board P.

  Hereinafter, the lifting device of the mounting head 16 and the mounting head 16 will be described in detail with reference to FIGS. 5 and 6. Reference numeral 20 denotes a base of the mounting head body 7 that moves along the guide 13, and 21 denotes a beam-side base fixed to the base 20. Reference numeral 22 denotes a mounting head side base fixed to the upper and lower portions of the mounting head 16, and a head lifting device 23 is provided between the mounting head side base 22 and the beam side base 21.

  The head lifting / lowering device 23 includes a guide 24 for guiding the mounting head 16 when the mounting head 16 is moved up and down, a ball screw 25 attached to the beam-side base 21, a head lifting / lowering motor 26 that drives the ball screw 25 to rotate and lifts the mounting head 16, A lifting nut 27 screwed with the ball screw 25 and a head lifting motor 26 are mounted and a support 28 that rotatably supports the upper portion of the ball screw 25. The lifting nut 27 is fixed to the head-side base 22 and the like. Yes. For this reason, as the ball screw 25 is rotated by the rotation of the head lifting / lowering motor 26, the lifting nut 27 is lifted / lowered. As a result, the mounting head 16 is guided by the guide 24 and is lifted / lowered.

  The slip ring 30 is provided for communication between the mounting apparatus main body and the mounting head 16 and for supplying power to the rotary motor of the nozzle support section. Reference numeral 31 denotes a nozzle support that supports the suction nozzles 15 arranged on the circumference at a predetermined angle below the mounting head 16 so that the suction nozzles 15 can move up and down, 32 denotes an outer cylinder at the bottom of the mounting head 16, and 33. Is a nozzle rotation motor for θ rotation of the suction nozzle 15 provided between the outer cylinder 32 and the nozzle support 31. The rotor 34 of the nozzle rotation motor 33 is provided on the outer peripheral surface of the nozzle support 31 and is provided so as to be rotatable in the θ direction together with the nozzle support 31 inside a stator 35 provided on the outer cylinder 32.

  37 is a detection means for detecting the presence / absence of components and a suction posture (suction state) provided protruding downward from the center of the head support 31; a detection means for detecting the thickness of the electronic component D; A line sensor unit as a nozzle diameter detecting means), and a light emitting element 42 such as an LED is provided at the upper end of a cylindrical light emitting unit mounting body 41 provided at the lower end of a support 38 provided substantially at the center of each mounting head 16. A light emitting unit 45 having a lens 43 disposed below and a reflector 44 having a conical reflecting surface 44a disposed below the lens 43 and a bottom surface of the outer cylindrical body 32 are fixed. The light receiving unit 46 includes a CCD element, which is a plurality of light receiving elements that receive light from the light emitting element 42 via the reflector 44.

  For example, when the component provided on the mounting head 16 performs suction, the suction operation of the electronic component D by the selected suction nozzle 15 ends, and the height of the lower end surface of the electronic component D every time the nozzle support 31 rotates. By detecting the position as the boundary position where the light receiving state of each CCD element changes from light shielding to light receiving, the part is normally sucked as shown in FIG. And the case of the oblique adsorption state are detected separately. That is, the suction nozzle 15 descends and picks up and picks up the electronic component D from the component supply unit 3. After the lift, the nozzle support 31 is rotated by driving the nozzle rotation motor 33 to suck and hold the electronic component D. 15, the electronic component D attracted by the suction nozzle 15 during the turning is located between the reflector 44 and the light receiving unit 46, so that the height position of the lower end surface of the electronic component D at a plurality of positions. By detecting this, it is possible to detect the presence / absence of a component, to detect a suction posture, to detect the thickness of a component sucked and held by the suction nozzle 15, and the like.

  Further, the presence or absence of the suction nozzle 15 can be detected while the suction nozzle 15 is turned. The detection is performed when the nozzle support 31 moves while rotating. However, when the electronic component D is positioned between the reflector 44 and the light receiving unit 46, the rotation is stopped and detected. It may be.

  When the suction nozzle 15 does not suck the electronic component D, light to be shielded (by the sucked electronic component) out of the light from the light emitting element 42 is received by the light receiving unit 46. Therefore, the absence of the electronic component D is detected, and the suction nozzle 15 communicates with the vacuum source 47 by the operation of a solenoid valve 82 which is a vacuum valve on / off operation body (described later) provided on the side of each nozzle shaft 64. The flow path is cut off, the vacuum passage from the vacuum source 47 is cut off to stop the vacuum suction operation to prevent leakage, and the surface that should not be sucked is sucked and is so-called standing or sucked diagonally If the suction nozzle 15 is detected, the electronic component D is dropped by moving the suction nozzle 15 above the collection box 79.

  Next, the nozzle raising / lowering device 50 provided in the mounting head 16 will be described. Reference numeral 51 denotes a nozzle lifting / lowering motor attached to the head-side base 22; 52, a ball screw which is rotated by the nozzle lifting / lowering motor 51 by a rotation shaft 511 of the nozzle lifting / lowering motor 51 being connected by a connecting member 59; Lifting body which is screwed to 52 and moves up and down by the rotation of the ball screw 52, 55 is a guide attached to the head side base 22 to guide the lifting and lowering body 53, 56 is a roller which is rotatably attached to the lower end of the lifting body 53 It is.

  Further, 57 is a first cylinder body in which the central axis 60 of the mounting head 16 penetrates the center, and an annular flange 58 formed in the first cylinder body 57 is positioned on the roller 56, and the first cylinder The body 57 is supported by the roller 56. Here, the first cylindrical body 57 is composed of, for example, a ball spline, and is biased downward by a spring 61 whose lower end is in contact with the upper surface of the collar portion 58 and rotates θ with the rotation of the pulley described later. The roller 56 moves up and down as the lifting body 53 moves up and down. Reference numeral 62 denotes a nozzle support member that is fixed to the lower portion of the first cylindrical body 57 and rotates θ together with the first cylindrical body 57. An elevating support piece 63 that extends horizontally in the circumferential direction is formed at the lower end of the nozzle support member 62. Has been. The elevating support piece 63 moves up and down as the first cylindrical body 57 moves up and down, and a predetermined suction nozzle 15 among the plurality of suction nozzles 15 is lowered by the lowering of the lift support piece 63.

  That is, a roller 65 is rotatably attached to the upper end of each nozzle shaft 64 extending upward from each suction nozzle 15, and the upper end of the nozzle shaft 64 of one suction nozzle 15 selected by a nozzle selection device described later. While the roller 65 is on the upper surface of the lifting support piece 63, the roller 65 moves up and down by the lowering of the nozzle support member 62 and the lifting support piece 63 as the first cylindrical body 57 is lowered. That is, when the elevating support piece 63 and the roller 65 are lowered to, for example, the positions indicated by the elevating support piece 63A and the roller 65A, the predetermined suction nozzle 15 is also lowered along with the lowering. Further, the suction nozzle 15 is lowered by a predetermined stroke by controlling the rotation amount of the nozzle lifting / lowering motor 51 and adjusting the stop height when the lifting / lowering body 53 is lowered.

  Reference numeral 66 denotes a third cylindrical body which is provided under the nozzle support member 62 and can be rotated by θ. The upper portion of the third cylindrical body 66 has the same height as the elevation support piece 63 of the nozzle support member 62 before being lowered. A substantially disc-shaped fixed support piece 67 is formed at this position. As shown in FIG. 7, the fixed support piece 67 is formed with a notch 68 corresponding to the lift support piece 63, and each roller 65 at the upper end of the nozzle shaft 64 of the nozzle 15 excluding the descending nozzle 15 is fixed. It is supported by a support piece 67. That is, the fixed support piece 67 is formed with a notch 68 at a position of approximately 30 °, which is an angle divided by 12 equal to a fraction of the nozzle 15 in the circumferential direction. The elevating support piece 63 is located.

  70 is a nozzle selection device provided in the mounting head 16, 71 is a nozzle selection motor for selecting a descending nozzle, 72 is a first pulley fixed to a rotation shaft 73 of the nozzle selection motor 71, and 74 is a central shaft 60. A second pulley 75 rotatably supported on the belt, 75 is a belt passed between the first pulley 72 and the second pulley 74, and 76 is located outside the central shaft 60 and is the center of the second pulley 74. The spring 61 is provided between the second pulley 74 and the flange portion 58 of the first cylinder 57.

  The first cylinder 57 is positioned outside the outer peripheral surface of the lower part of the rotating body 76, and the first cylinder 57 rotates as the second pulley 74 rotates due to the action of the first cylinder 57 as a ball spline. When the body 76 rotates with the rotation of the body 76 and the lifting / lowering body 53 is lifted / lowered, the body 76 descends along with the lifting / lowering 76.

  In other words, when the nozzle selection motor 71 rotates when the electronic component D is picked up and mounted, the first cylinder 57 rotates via the first pulley 72 belt 75, the second pulley 74, and the rotating body 76 when the nozzle selection motor 71 rotates. Further, the nozzle support member 62 connected to the first cylinder 57 rotates together with the third cylinder 66, and the lifting support piece 63 of the nozzle support member 62 is below the nozzle shaft 64 extending from the selected nozzle 15. To position. In such a state, when the nozzle lifting / lowering motor 51 rotates and the lifting / lowering body 53 descends according to the thickness of the electronic component to be sucked and mounted, the first cylinder 57 and the nozzle support member 62 are lowered accordingly. Only the nozzle 15 selected by the lowering of the support piece 63 is lowered by a predetermined stroke according to the thickness of the electronic component.

  Reference numeral 80 denotes an air switching valve, which is provided at an equiangular interval corresponding to each nozzle 15 at a position on the outer side in the circumferential direction from each nozzle 15 and can individually switch between air suction and blowing. The air switching valve 80 includes a case 81 provided in the upper part, and a solenoid valve 82 in which the upper part is located in the case 81 and the energization is controlled by a signal from the CPU 90. The solenoid valve 82 is an annular electromagnet 83 provided on the inner surface of the case 81, and moves up and down in the case 81 by energizing and de-energizing the electromagnet 83, and a cylindrical permanent magnet 84 corresponding to the electromagnet 83 at the upper part. It is comprised from the channel | path switching body 85 etc. in which this was provided. An air blow passage 86, a nozzle communication passage 87, and a evacuation passage 88 are formed in this order from the top to the bottom between the passage switching body 85 and the cylinder portion 81A below the case 81. Further, the nozzle shaft 64 is formed with a nozzle shaft passage 100 communicating with the internal passage of the nozzle 15 and the nozzle communication passage 87, and the nozzle passage 100 and the evacuation passage through the nozzle communication passage 87 when the passage switching body 85 is raised and lowered. 88 or communication with the air blow passage 86 is switched.

  That is, when the passage switching body 85 is raised by energization of the electromagnet 83 of the solenoid valve 82, the evacuation passage 88 and the nozzle communication passage 87 communicate with each other, and the nozzle communication passage 87 and the air blow passage 86 communicate with each other. The suction nozzle 15 is closed, and the internal passage of the suction nozzle 15 communicates with the vacuum source 47 via the nozzle shaft passage 100, the nozzle communication passage 87, and the evacuation passage 88, and the suction nozzle 15 maintains vacuum suction of the electronic components. Further, when the electromagnet 83 is de-energized and the passage switching body 85 is lowered, the evacuation passage 88 and the nozzle communication passage 87 communicated with the vacuum source 47 are blocked, and the nozzle communication passage 87 and the air blower are used. The passage 86 communicates to stop the vacuum suction of the electronic component D by the suction nozzle 15, and air from the air supply source 48 enters the internal passage of the suction nozzle 15, the air blow passage 86, the nozzle communication passage 87, and the nozzle shaft passage 100. Is blown through.

  49A is a switching valve whose one end communicates with the air switching valve 80, and switches the other end between communicating with the vacuum source 47 and sucking the suction nozzle 15 or communicating with the air supply source 48 and blowing out the suction nozzle 15. It is a valve. 49B is an open / close valve having one end communicating with the air switching valve 80 and the other end communicating with the air supply source 48. When the electronic component is mounted by the suction nozzle 15, the air switching valve 80 switches from air suction to air blowing. The vacuum is broken when the air switching valve 80 is switched to the air blowing when the suction nozzle 15 starts sucking and sucking the electronic component by opening the air supply source 48 before the air is turned on. It is a valve to do.

  As shown in FIG. 3, reference numeral 89 denotes a component recognition camera, which is provided on the mounting plate 99 of the base body 2 in correspondence with each of the mounting heads 16. In order to recognize the position with respect to the XY direction and the rotation angle, all the electronic components D sucked and held by the plurality of suction nozzles 15 are collectively imaged and the suction nozzles 15 It can also be confirmed whether or not the part D is sucked and held.

  Next, a description will be given below based on a control block diagram of the electronic component mounting apparatus 1 of FIG. Reference numeral 90 denotes a CPU (Central Processing Unit) as a control unit that performs overall control of the mounting apparatus 1, and the CPU 90 is connected to a RAM (Random Access Memory) 92 and a ROM (Read. Only memory) 93 is connected. Based on the data stored in the RAM 92, the CPU 90 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 in accordance with the program stored in the ROM 93. That is, the CPU 90 receives the linear motors 9 and 14, the head lifting / lowering motor 26, the nozzle rotation motor 33, the nozzle lifting / lowering motor 51, the nozzle selection motor 71, the solenoid valve 82, and each mounting head 16 via the interface 94 and the drive circuit 95. The driving of the opening / closing valve 49B, the switching valve 49A and the like provided in the control is controlled.

  The RAM 92 stores mounting data related to component mounting. For each mounting order (step number), the X direction (indicated by X), the Y direction (indicated by Y), and the angle within the printed circuit board. Information (indicated by Z), arrangement number information of each component supply unit 3, and the like are stored. The RAM 92 stores component arrangement data, which stores the types of electronic components (component IDs) and the arrangement coordinates of the supply units 3 corresponding to the arrangement numbers of the component supply units 3. Has been.

  Further, the RAM 92 stores a plurality of types of abnormality items that occur in the electronic component mounting apparatus shown in FIG. 10 for the component supply unit (hereinafter referred to as a feeder) and a plurality of types of abnormalities that are set in advance as the causes of the abnormalities. Correspondence table with causes, correspondence table between a plurality of types of abnormality items occurring with respect to the suction nozzle 15 shown in FIG. 11 and a plurality of causes of abnormalities set in advance as the cause of those abnormalities, and the example shown in FIG. A correspondence table indicating maintenance work (maintenance items) for each different cause of abnormality such as feeder abnormality is stored.

  Further, the RAM 92 stores management data such as the number of occurrences of abnormalities described later.

  A recognition processing device 91 is connected to the CPU 90 via an interface 94, and recognizes an image captured by the component recognition camera 89 and recognizes an image captured by the board recognition camera 19. Processing is performed by the component recognition processing device 91.

  The images taken by the component recognition camera 89 and the board recognition camera 19 are displayed on a monitor 96 as a display device. The monitor 96 is provided with various touch panel switches 97, and when the operator operates the touch panel switch 97, various settings including settings for teaching designation can be performed.

  The light receiving unit 46 of the line sensor unit 37 is connected to the CPU 112 of the detection controller 111 via the interface 110. The CPU 112 is connected to a RAM (Random Access Memory) 113 and a ROM (Reset) via the bus line. -De-only memory) 114 is connected. The CPU 112 is connected to the CPU 90 via an interface 115 and a serial line 116.

  Here, the presence / absence detection of the electronic component D sucked and held by the suction nozzle 15 is detected, the suction posture (suction state) is detected, and the thickness of the electronic component D sucked and held by the suction nozzle 15 is detected. In order to detect the presence of the suction nozzle 15, the suction nozzle 15 that sucks and holds the electronic component D out of the 12 suction nozzles 15, or any suction nozzle 15 for which the type of the suction nozzle 15 is desired to be identified as the light emitting unit 45. In order to be positioned between the light receiving unit 46, the light emitting unit 45 constituting the line sensor unit 37 is rotated together with the nozzle support 31 by the nozzle rotating motor 33.

  The CPU 90 is connected to an external management personal computer 120 via an interface 94, and management data, which will be described later, stored in the RAM 92 is sent to the management personal computer 120 every predetermined time. The management personal computer 120 includes a RAM 121 that stores management data and the like, a CPU 122, and a monitor 123 that displays management data and the like.

  The RAM 121 stores a plurality of types of abnormality items that occur in the electronic component mounting apparatus for the component supply unit (hereinafter referred to as a feeder) shown in FIG. Correspondence table with causes, correspondence table between a plurality of types of abnormality items occurring with respect to the suction nozzle 15 shown in FIG. 11 and a plurality of causes of abnormalities set in advance as the cause of those abnormalities, and the example shown in FIG. A correspondence table indicating maintenance work (maintenance items) for each different cause of abnormality such as feeder abnormality is stored.

  With the configuration as described above, the operation of sucking and mounting the electronic component D by the electronic component mounting apparatus 1 will be described in detail below. First, the printed circuit board P is carried into the positioning unit 5 from the upstream device via the supply conveyor 4, and the positioning operation is started by the positioning mechanism.

  Next, the CPU 90 executes an electronic component D suction operation according to the mounting data stored in the RAM 92. That is, the suction nozzle 15 corresponding to the component type of the electronic component is mounted according to the mounting data in which the XY coordinate position where the printed circuit board P is to be mounted, the rotation angle position around the vertical axis, the arrangement number, and the like are specified. The electronic component to be removed is sucked out from the predetermined component supply unit 3.

  At this time, the linear motors 9 and 14 are controlled by the CPU 90 so that the suction nozzle 15 of each mounting head 16 of each mounting head body 7 is located above the top electronic component of each component supply unit 3 that stores the electronic component to be mounted. In the Y direction, the linear motor 9 is driven by the drive circuit 95 to move each beam 8 along the pair of guides 10. In the X direction, the linear motor 14 is also driven by the drive circuit 95. Each mounting head body 7 moves along the guide 13.

  Since each predetermined supply unit 3 has already been driven and components can be taken out at the component suction position, the head lifting motor 26 is based on signals output from the CPU 90 via the interface 94 and the drive circuit 95. Rotates, and the mounting head 16 moves down along the guide 24 to a predetermined height. Next, a suction nozzle (hereinafter referred to as “first suction nozzle”) 15 that first sucks an electronic component is a suction position, that is, a suction position shown in FIG. If it is deviated from 101), the CPU 90 outputs a signal for moving the suction nozzle 15 to the suction position 101 shown in FIG. The nozzle support 31 of the mounting head 16 is rotated about the central axis 60 by θ.

  Then, when the roller 65 rides on the lifting support piece 63, the CPU 90 is based on the rotation angle of the nozzle support 31 and the angle of the side edge of the lifting support piece 63 (position shifted by 15 ° from the center of the lifting support piece). Then, a signal is output to the nozzle lifting / lowering motor 51 via the interface 94 and the drive circuit 95. Then, based on this signal, the nozzle raising / lowering motor 51 rotates in a direction to lower the first suction nozzle 15, and the lifting body 53 and the lifting support piece 63 are lowered by the rotation of the ball screw 52, so that the first suction nozzle 15 is predetermined. , I.e., a height suitable for adsorbing electronic components from the preset supply unit 3. That is, by the θ rotation of the nozzle support 31 and the descending of the lifting support piece 63, the first suction nozzle 15 turns and descends, the roller 65 reaches the center of the lifting support piece 63, and the first suction nozzle 15 sucks. The position 101 is reached and lowered to a height suitable for sucking the electronic component.

  When the first suction nozzle 15 reaches the suction position 101 and descends to a height suitable for sucking electronic components, the solenoid valve 82 corresponding to the first suction nozzle 15 is energized based on a signal from the CPU 90. As a result, the passage switching body 85 rises so that the evacuation passage 88 and the nozzle communication passage 87 communicate with each other, the nozzle communication passage 87 and the air blow passage 86 are shut off, and the internal passage of the suction nozzle 15 is the nozzle shaft passage 100. The suction nozzle 15 maintains the vacuum suction of the electronic components by communicating with the vacuum source 47 through the nozzle communication passage 87, the vacuuming passage 88, and the switching valve 49A switched to the suction side.

  As described above, when the electronic component suction operation by the first suction nozzle 15 is completed, the CPU 90 outputs a signal to the nozzle lifting motor 51, and the nozzle lifting motor 51 lifts the first suction nozzle 15 based on this signal. The elevating body 53 is raised to a predetermined height, that is, the height before being lowered, by the rotation of the ball screw 52.

  And when electronic components can be chain-sucked by the mounting head 16, as in the case of the first suction nozzle, among the 12 suction nozzles 15 provided on the nozzle support 31 as described above, that is, the second suction nozzle The remaining selected suction nozzles of No. 12 to No. 12 are also subjected to multi-chain suction (as many electronic components D as possible are continuously sucked). That is, electronic components are supplied from the component supply unit 3 to the remaining suction nozzles 15, and the nozzle support 32 rotates intermittently by the rotation of the nozzle rotation motor 33, and each suction nozzle 15 is stopped when the nozzle support 32 is stopped. 15 moves up and down and sucks and holds the electronic components.

  Then, presence / absence detection of the electronic component, detection of the suction posture, and detection of the thickness of the electronic component sucked and held by the suction nozzle 15 are performed by the line sensor unit 37 accompanying the suction operation of the electronic component by each suction nozzle 15. That is, the light receiving unit 46 of the line sensor unit 37 is provided at a position shifted by, for example, 45 ° from the suction position 101 shown in FIG. 8, and sucks electronic components as the nozzle support 32 is intermittently rotated in the arrow direction. When the suction nozzle 15 passes through the detection position 102 shown in FIG. 8, as described above, the line sensor unit 37 detects the presence / absence of all electronic components at the lower end of the suction nozzle 15, the detection of the suction posture, and the thickness of the components. The height is detected by rotating the mounting head 16 once.

  In this case, the light emitted from the light emitting element 42 of the light emitting unit 45 is reflected by the reflecting surface 44a of the reflector 44 and received by the light receiving unit 46, and the detection value is sent to the detection controller 111, and the detection from the detection controller 111 is performed. Based on the information, the CPU 112 can reliably detect the presence / absence of the electronic component, the suction posture, and the thickness of the component according to the lower end level of the electronic component D.

  Therefore, when the CPU 112 determines that there is no electronic component based on the detection information from the detection controller 111, it performs a take-out operation from the component supply unit 3 again, or a surface that should not be picked up is picked up. If it is determined that the electronic component has detected an abnormal posture state when it is sucked or sucked diagonally, the mounting head 16 and the suction nozzle 15 are removed from the collection box before the electronic component is recognized and mounted. 79 The individual disposal (collection) operation of moving upward and dropping the electronic component D is performed for each electronic component.

  Then, after all the individual disposal operations are performed, the component recognition operation such as the imaging of the electronic component by the component recognition camera 89 and the recognition processing of the recognition processing device 91 is performed, or the component recognition operation is performed when there is no abnormal posture of the electronic component. To perform the mounting operation on the printed circuit board P.

  That is, the CPU 90 controls the linear motors 9 and 14 so that the suction nozzle 15 moves to the mounting coordinate position on the printed circuit board P positioned by the positioning unit 5 in consideration of the recognition processing result from the recognition processing device 91. In the Y direction, the linear motor 9 is driven by the drive circuit 95 to move each beam 8 along the pair of guides 10. In the X direction, the linear motor 14 is also driven by the drive circuit 95 along the guide 13. Each mounting head body 7 moves and controls the nozzle rotation motor 33, the head lifting / lowering motor 26 and the nozzle lifting / lowering motor 51 to mount electronic components on the printed circuit board P.

  Then, as described above, the suction operation of the electronic component by the suction nozzle 15 and the mounting operation of the electronic component held by suction on the printed circuit board P are repeated, and the mounting of the electronic component on one printed circuit board P is completed. .

  Further, it occurs from the electronic component suction operation to the printed circuit board P to the end of the mounting operation, and the suction nozzle 15 picks up the component based on detection by the line sensor unit 37 or imaging of the electronic component by the component recognition camera 89. When the CPU 90 determines that the absence state or the standing state of the component has occurred, the CPU 90 counts such a state, that is, whenever an abnormality occurs. The counted number is stored in the RAM 92 as management data.

  Next, as described above, when the mounting operation of the electronic component to the printed circuit board P is performed, for example, the abnormality cause extraction processing performed every predetermined time and the maintenance item determination operation based on the abnormality cause, This will be described with reference to the flowcharts of FIGS.

  First, the CPU 122 of the management personal computer 120 determines whether or not it is an abnormal data acquisition time such as no parts (step ST1 in FIG. 13). When a predetermined time (for example, 3 minutes) elapses from the previous data acquisition time and the data acquisition time is reached, the CPU 122 operates to output a management data request signal from the management personal computer 120 to the electronic component mounting apparatus 1. . The electronic component mounting apparatus 1 having received the request signal outputs management data to the management personal computer 120 via the interface 94, and the management personal computer 120 receives the management data (step ST2 shown in FIG. 13).

  The management personal computer 120 reads the received management data (step ST3) and stores it in the RAM 121.

  Next, the management personal computer 120 performs feeder abnormality cause extraction processing (step ST4). Hereinafter, the operation of the feeder abnormality cause extraction processing will be described based on the flowchart of FIG.

  That is, among the feeders 3 on the feeder bases 3A, 3B, 3C, and 3D, first, for example, for the number 1 feeder disposed on the feeder base 3A, the CPU 122 has an abnormality rate, that is, a ratio of the number of abnormalities to the number of parts picked up. It is determined whether or not a predetermined criterion, that is, a warning value is exceeded (step ST5). Here, when the warning value is not exceeded, it is determined whether or not the determined feeder is the final feeder (step ST6), and when it is not the final feeder, the process returns to step ST5 to determine the abnormality rate for the next feeder. Is called.

  Further, in step ST5, when the abnormality rate for the feeder exceeds the warning value, the number of detections of component standing by the line sensor unit 37 (C), the number of occurrences of component recognition abnormality (D), and the component thickness abnormality Occurrence frequency (E), the number of times of component suction displacement detection (F) based on the imaging result of the component recognition camera 89, and the number of times of component posture abnormality detection (G) based on the imaging result of the component recognition camera 89. The added value (hereinafter referred to as the first total value) is the number of detections without parts (A) by the line sensor unit 37 and the number of detections without parts (B) based on the imaging result by the part recognition camera 89. It is determined whether it is less than the added value (hereinafter referred to as a reference value) (step ST7). Here, the number of detections without parts (A) by the line sensor unit 37 and the number of detections without parts (B) based on the imaging result by the parts recognition camera 89 are more frequently generated than abnormalities such as no other parts. , And the number of times of adding each as a reference value.

  Then, when the first total value is less than or equal to the reference value, that is, when the reference value is larger than the first total value, an abnormality in the feeder that can be inferred from the cause items shown in FIG. : A, Feeder supply position (position at which the feeder supplies electronic parts): b, Parts library data error: c, Feeder type error: d, Feeder part error: e The cause is stored in the RAM 121 (step 8).

  If the first total value is greater than or equal to the reference value, it is next determined whether or not the number of parts standing (C) detected by the line sensor unit 37 is greater than the reference value (step ST9). When there are many items, b, c and the line sensor unit 37 that can be estimated as the cause of the component standing in the cause item shown in FIG. Addition, that is, input (step ST10). When the number of detected parts standing (C) is equal to or less than the reference value, it is determined whether the number of occurrences of component recognition abnormality (D), which is the next determination, is greater than the reference value (step ST11).

  When there are many items, items b and c that can be estimated as the cause of the component recognition abnormality in the cause item shown in FIG. 10 are added to the cause list (step ST12). When the number of occurrences of component recognition abnormality (D) is equal to or less than the reference value, it is determined whether the number of occurrences of component thickness abnormality (E), which is the next determination, is greater than the reference value (step ST13). When there are many items, items c and f that can be estimated as the cause of the component thickness abnormality in the cause item shown in FIG. 10 are added to the cause list (step ST14). Also, when the number of occurrences of component thickness abnormality (E) is less than or equal to the reference value, the number of occurrences of suction position deviation (F), which is the next determination, and the component posture abnormality, that is, the electronic component sucked by the suction nozzle are turned over. It is determined whether or not the total number of occurrences of the abnormality (G) such as when the error occurred is greater than the reference value (step ST15). When there are many items, the items b and c that can be estimated as the cause of the deviation of the suction position and the component posture abnormality in the cause item shown in FIG. 10 are added to the cause list (step ST16). Further, when the total number of occurrences of suction position deviation (F) and part orientation abnormality occurrences (G) is less than or equal to a reference value, cause list counts, that is, cause items such as a, b. It is determined whether or not the data is 0 (none) (step ST17).

  If it is determined in step ST17 that the cause item is not in the cause list, the cause items a, b, c, d, and e are added to the cause list, that is, the cause item is entered (step ST7). Further, if it is determined that there is even one cause item, an integration process (step ST18) is performed in which duplicate items among the cause items on the cause list are combined into one. At this time, for example, when the cause items b, c and f appear in the cause list in step ST9, and then the cause items b and c are added in step ST11, b and c appear in the cause list in duplicate. However, the cause items b and c are collected one by one by the integration process described above.

  In step ST6, it is determined whether or not the final feeder among the feeders 3 on the feeder bases 3A, 3B, 3C, and 3D of the electronic component mounting apparatus 1 is not the final feeder. It is determined whether or not the abnormality rate exceeds a reference for a feeder that is not broken, and when the abnormality rate exceeds, the abnormality cause extraction process from step ST6 to step 18 described above for the feeder is similarly repeated.

  The feeder abnormality cause extraction processing is sequentially performed on a plurality of feeders fixed in parallel on the feeder bases 3A, 3B, 3C, and 3D of the electronic component mounting apparatus 1. Then, abnormality cause extraction processing is performed up to the final feeder, and when it is determined in step ST6 that the feeder is the final feeder, the abnormality cause extraction processing of the feeder is finished, and then abnormality cause extraction processing for the nozzle is performed. (Step 19 in FIG. 13).

  Hereinafter, the operation of the abnormality cause extraction process for the nozzle will be described based on the flowchart of FIG. The nozzle abnormality cause extraction processing is performed for each nozzle of each mounting head body 7.

  That is, first, it is determined whether or not the abnormality rate exceeds the reference for the first nozzle of the first mounting head body 7 (step ST20). Here, when the warning value is not exceeded, it is determined whether or not the determined nozzle is the final nozzle (step ST21), and when it is not the final nozzle, the process returns to step ST19 to determine the abnormality rate for the next nozzle. Is called.

  If it is determined in step ST19 that the abnormality rate for the nozzle exceeds the warning value, the number of detections of component standing by the line sensor unit 37 (C) and the number of occurrences of component recognition abnormality (D) The number of occurrences of component thickness abnormality (E), the number of detections of component suction displacement (F) based on the imaging result of the component recognition camera 89, and the number of detections of component posture abnormality based on the imaging result of the component recognition camera 89 ( The first total value obtained by adding G) is a reference obtained by adding the number of detections without parts (A) by the line sensor unit 37 and the number of detections without parts (B) based on the imaging result by the parts recognition camera 89. It is determined whether it is less than the value (step ST22).

  When the reference value is larger than the first total value, the suction nozzle contamination that is estimated as the cause of no parts in the cause item shown in FIG. 11 in the cause list stored in the RAM 121: a, the suction nozzle C, clogging of vacuum filter: c, vacuum switching valve error: d, level error when suction nozzle picks up electronic components, nozzle level difference: e, feeder error: f and line Sensor contamination: Enter g (see FIG. 11) (step 23).

  Further, when the first total value is equal to or larger than the reference value, it is determined whether or not the number of parts standing (C) detected by the line sensor unit 37 is larger than the reference value (step ST24). When there are many items, items of e and g that can be estimated as the cause of the components in the cause items shown in FIG. When the number of detected parts standing (C) is less than or equal to the reference value, it is determined whether or not the number of occurrences of component recognition abnormality (D), which is the next determination, is greater than the reference value (step ST26).

  When there are many items, items of e, which can be estimated as the cause of the component recognition abnormality in the cause item shown in FIG. 11 in the cause list, feeder offset abnormality: j, component library data abnormality: k, and component mistake: i It is added (step ST27). When the number of occurrences of component recognition abnormality (D) is equal to or less than the reference value, it is determined whether the number of occurrences of component thickness abnormality (E), which is the next determination, is greater than the reference value (step ST28). When there are many items, items of g and j that can be estimated as the cause of the component thickness abnormality in the cause item shown in FIG. 11 are added to the cause list (step ST29). When the number of occurrences of component thickness abnormality (E) is equal to or less than the reference value, the total number of occurrences of suction position deviation (F) and the number of occurrences of component orientation abnormality (G), which is the next determination, is It is determined whether or not it is greater than the reference value (step ST30). When there are many items, items of e, j, k, and i that can be presumed as causes of the deviation of the suction position and the component posture in the cause item shown in FIG. 11 are added to the cause list (step ST31). When the total number of occurrences of suction position deviation (F) and part orientation abnormality occurrences (G) is less than or equal to a reference value, whether the cause item data in the cause list is 0 (none) or not. Determination is made (step ST32).

  If it is determined in step ST32 that the cause item does not exist in the cause list, the cause items a, b, c, d, e, f, and g are added to the cause list, that is, are inserted (step ST23). If it is determined that there is at least one cause item, an integration process (step ST33) is performed in which duplicate items among the cause items on the cause list are combined into one. Here, for example, when e and g are duplicated in the cause list, the cause items e and g are collected one by one by the integration process described above (step ST33).

  In step ST20, it is determined whether or not the final nozzle is the last nozzle among the nozzles 3 of the mounting head bodies 7 of the electronic component mounting apparatus 1. If the nozzle is not the final nozzle, the abnormality cause extraction process is not performed. Then, it is determined whether or not the abnormality rate exceeds the reference. When the abnormality rate exceeds, the abnormality cause extraction process from step ST21 to step 33 described above is similarly repeated for the nozzle.

  The nozzle abnormality cause extraction processing is sequentially performed for each nozzle provided in a plurality in each mounting head 7 of the electronic component mounting apparatus 1. Then, abnormality cause extraction processing is performed up to the last nozzle, and if it is determined in step ST20 that it is the last nozzle, it is determined whether or not an abnormality has occurred in two or more nozzles (step ST34). . When an abnormality has occurred in two or more nozzles, the line sensor scratch: h is added to the cause list (step ST35). Also, when no abnormality has occurred in two or more nozzles, the abnormality cause extraction process for the nozzles ends.

  Next, the creation and display of maintenance items after the feeder abnormality cause extraction processing and nozzle abnormality cause extraction processing are completed will be described based on the flowchart of FIG.

  When the feeder abnormality cause extraction processing and the nozzle abnormality cause extraction processing are completed, it is determined whether or not the cause list count is 0 (step ST36 in FIG. 13). And then. When the count of the cause list is 0 and the cause item is not listed, it is determined whether or not it is an abnormal data acquisition time such as no parts in step ST1.

  When the cause list count is not 0, a maintenance item is created from the extracted cause items (step ST37). That is, as described above, the RAM 121 stores a correspondence table indicating maintenance work (maintenance items) for each different cause of abnormality such as a feeder or nozzle abnormality as shown in FIG. For example, when the cause items listed in the cause list for the feeder are a, b, c, d, and e, first, “feeder abnormality” shown in FIG. Occasionally, a maintenance item “Remove feeder No.XXX and check if there is any abnormality on the tape. If there is an abnormality, remove the parts and set them again.” Is a maintenance item corresponding to other b, c, d and e, for example, if the cause item is mistaken for a part, "Please make sure components and parts feeder No.XXX is correct. If you were wrong, please replace the parts." The maintenance item is created that.

  Also, for the suction nozzle, maintenance items are created based on the comparison table corresponding to the cause items listed in the cause list, similarly to the feeder.

  When the maintenance item is created, the CPU 122 operates and a maintenance information button is displayed on the monitor 123 (step ST38). FIG. 16 is an example of a display screen on the monitor 123. The monitor 123 includes a touch panel switch, and when a plurality of electronic component mounting apparatuses are installed in the factory and are connected to form a mounting line for electronic components on the board, the mounting line is configured on the monitor 123. Each electronic component mounting apparatus ABC-1, ABC-2, and ABC-3 is divided and displayed. A maintenance information button 124 is displayed on the display unit 130 of the electronic component mounting apparatus ABC-1 for which an abnormality has occurred and a maintenance item has been created.

  As described above, when an abnormality occurs and the abnormality rate of the suction nozzle 15 or the feeder 3 of the electronic component mounting apparatus increases, the cause of the abnormality is determined and determined from a plurality of abnormality items, and the cause is narrowed down by the operator. You can avoid troublesome work. Also, when determining and determining the cause of an abnormality from a plurality of abnormality items, the number of occurrences of a certain abnormality among different types of abnormality, in the example, the number of occurrences of abnormalities with no parts with a large number of occurrences of abnormality Compared with this standard value and the number of occurrences of each other type of abnormality, and the cause of the abnormality is determined and determined based on the comparison result, the cause for the type of abnormality is narrowed down as much as possible. be able to.

  Furthermore, when the reference value is greater than the total sum of the number of occurrences of each of the other different types of abnormality, all causes that can be estimated as the cause of the abnormality with no parts are determined as the cause of the abnormality. Can be avoided.

  In addition, when there are types of abnormalities that occur more frequently than the reference value, the cause that can be guessed as the cause of the type of abnormalities is added to the cause list, so the types of abnormalities other than missing parts are the main types of abnormalities. Even if there is, leakage of the cause of the abnormality can be avoided.

  When the operator presses the maintenance information button 124, the created maintenance item 131 corresponding to the type of abnormality is displayed on the monitor 123 as shown in FIG. When there are a plurality of maintenance items, they are sequentially displayed by pressing the feed or return arrow portion 132 displayed on the monitor 123. A plurality of maintenance items may be displayed on the monitor 123 simultaneously.

  Further, it is determined whether or not the operator has pressed the end button 125 displayed on the monitor 123 (step ST38). When the operator presses the end button 125, the abnormality management and maintenance display operations of the electronic component mounting apparatus such as the acquisition of abnormality data by the management personal computer 120 and the extraction process of the abnormality cause are finished, and the maintenance display on the monitor 123 is completed. The display of the button 124 and the maintenance item ends.

  As described above, when the abnormality rate exceeds the reference, it is possible to determine and determine the cause of a different abnormality without leaking as much as possible, and an appropriate maintenance item corresponding to the determined cause is displayed on the monitor 123. As a result, the maintenance work by the operator when an abnormality occurs can be simplified as much as possible.

  The created maintenance items may be displayed on the monitor 96 provided in the electronic component mounting apparatus 1 in which an abnormality has occurred, for example, as with the monitor 123, or provided in the electronic component mounting apparatus 1. Similarly to the management personal computer 120, the control unit may operate as shown in the flowcharts of FIGS. 13, 14, and 15 so that the created maintenance items are displayed on the monitor 96. The same operational effects can be obtained.

  The electronic component mounting apparatus has been described by taking a so-called modular chip mounter as an example. However, the electronic component mounting apparatus is not limited to this and may be applied to a high-speed chip mounter such as a rotary table type.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of an electronic component mounting apparatus. It is a front view of an electronic component mounting apparatus. It is a right view of an electronic component mounting apparatus. It is a control block diagram of an electronic component mounting apparatus. It is a vertical front view of a mounting head body. It is a vertical side view of a mounting head body. It is a top view which shows a fixed support piece and a raising / lowering support piece. It is a schematic bottom view of a mounting head. It is an enlarged vertical front view of the lower part of a mounting head. It is a table | surface of abnormality and cause of a component supply unit (feeder). It is a table | surface of abnormality and cause of a suction nozzle. It is a comparison table of an abnormality cause of a feeder and a suction nozzle and maintenance work (maintenance item). It is a flowchart which shows the management method of an electronic component mounting apparatus. It is a flowchart which shows the extraction process of the abnormality cause of a feeder. It is a flowchart which shows the extraction process of the abnormality cause of a suction nozzle. It is a figure of the display screen of a monitor.

Explanation of symbols

1 Component mounting device 3 Component supply unit (feeder)
7 Mounting head body 15 Suction nozzle 16 Mounting head 90 CPU
92 RAM
96 monitor 123 monitor

Claims (7)

  In the electronic component mounting device that picks up electronic components from the component supply unit by the suction nozzle and mounts them on the printed circuit board, the cause of the abnormality is narrowed down based on a plurality of different types of abnormalities, and the maintenance items for each of the narrowed causes An electronic component mounting apparatus, comprising: a determining unit that determines a maintenance item; and a display device that displays a maintenance item determined by the determining unit.   In the electronic component mounting apparatus that picks up an electronic component from the component supply unit by the suction nozzle and mounts it on the printed circuit board, the cause of the abnormality is narrowed down based on a plurality of different types of abnormalities, and the suction nozzle is narrowed down An electronic component mounting apparatus comprising: a determination unit that determines a maintenance item for each cause; and a display device that displays the maintenance item determined by the determination unit.   In an electronic component mounting apparatus that picks up an electronic component from a component supply unit by a suction nozzle and mounts the electronic component on a printed circuit board, the suction nozzle has a plurality of different types of abnormalities in the suction state of the electronic component by the suction nozzle. Based on the relationship between a preset cause of abnormality and a maintenance item, a determination unit that determines a maintenance item for each abnormality cause, and a display device that displays the maintenance item determined by the determination unit An electronic component mounting apparatus comprising:   In an electronic component mounting apparatus that picks up electronic components from a component supply unit by a suction nozzle and mounts them on a printed circuit board, the cause of the abnormality is narrowed down based on a plurality of different types of abnormalities in the component supply unit. An electronic component mounting apparatus comprising: a determination unit that determines a maintenance item for each cause; and a display device that displays the maintenance item determined by the determination unit.   In the management device of the electronic component mounting apparatus that picks up electronic components from the component supply unit by the suction nozzle and mounts them on the printed circuit board, the cause of the abnormality corresponding to a plurality of different types of abnormalities is narrowed down, and each of the narrowed causes An electronic component mounting apparatus management apparatus comprising: a determination unit that determines a maintenance item; and a display device that displays the maintenance item determined by the determination unit.   In a management apparatus for an electronic component mounting apparatus that picks up an electronic component from a component supply unit by a suction nozzle and mounts it on a printed circuit board, a plurality of different types of abnormalities with respect to the same suction nozzle or the same component supply unit And determining means for determining a maintenance item corresponding to the abnormality cause based on a relationship between a preset abnormality cause and a maintenance item, and a display device for displaying the maintenance item determined by the determination means And a management apparatus for an electronic component mounting apparatus.   In the management method of the electronic component mounting device that picks up electronic components from the component supply unit by the suction nozzle and mounts them on the printed circuit board, narrow down the causes of abnormalities corresponding to different types of abnormalities and perform maintenance for each of the narrowed down causes A method for managing an electronic component mounting apparatus, comprising: determining an item; and displaying the determined maintenance item on a display device.