JP2008300382A - Method of manufacturing circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board that can suppress peeling between a conductive layer and a resin substrate by maintaining the adhesive strength between the conductive layer and the resin substrate. <P>SOLUTION: The manufacturing method of the circuit board includes stages of: preparing an uncured resin substrate 21 and a depression member 22 having an uneven surface; forming unevenness 23 on one main surface of the resin substrate 21 by pressing a top surface of the depression member 22 against one main surface of the resin substrate 21; curing the resin substrate 21 by heating the resin substrate 21 while pressing the depression member 22 against the resin substrate 21; removing the depression member 22 from the one main surface of the resin substrate 21; and forming a conductive layer 3 along the unevenness 23 formed on the one main surface of the resin substrate 21. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a wiring board having a resin substrate on which a semiconductor element such as an IC (Integrated Circuit) or an LSI (Large Scale Integration) is mounted.

  Conventionally, a wiring board on which a semiconductor element such as an IC or an LSI can be mounted is known. In recent years, for the purpose of reducing the size and weight of electronic components, it is required to make the wiring pattern of the wiring board fine. Such a wiring board includes a resin substrate and a conductive layer formed on one main surface and the other main surface of the resin substrate.

  When the conductive layer as the wiring pattern is made fine, the contact area between the resin substrate and the conductive layer is reduced, the adhesive force between them is reduced, and the conductive layer is easily peeled from the resin substrate. Therefore, in order to make the conductive layer as a wiring pattern fine, for example, a mixed liquid of permanganic acid and sodium carbonate is infiltrated into one main surface and the other main surface of the cured resin substrate, so There is a method in which the main surface and the other main surface are melted to form irregularities, and a conductive layer is formed on the irregularities to maintain the adhesive force between them (see Patent Document 1 below).

In addition, when an unevenness | corrugation is formed by the method of osmosis | permeating the liquid mixture of permanganic acid and sodium carbonate, the maximum height (Rz) of the unevenness | corrugation will be larger than 3.0 micrometers, for example, about 5 micrometers.
JP 2002-124753 A

  However, in the manufacturing method of the wiring board described in Patent Document 1 described above, it is difficult to make the concentration of the mixed solution uniform, and the melting area of one main surface and the other main surface of the resin substrate becomes sparse, and the unevenness is reduced. Regions that are difficult to form may occur. Also, with this manufacturing method, it is difficult to keep the maximum height of the irregularities small. Therefore, when a conductive layer is formed in a region with little unevenness, the adhesive force between the conductive layer and the resin substrate cannot be increased, and the conductive layer easily peels from the resin substrate. Further, even when the conductive layer is formed in a region where the maximum height of the unevenness is large, a gap is easily formed between the conductive layer and the resin substrate, and in this case, the conductive layer is easily peeled off from the resin substrate. And when both occur, there is a problem that the electrical connection of the wiring board becomes unstable.

  The present invention has been made in view of the above-described problems, and manufacturing a wiring board capable of suppressing peeling between the conductive layer and the resin substrate by maintaining the adhesive force between the conductive layer and the resin substrate. It aims to provide a method.

  In order to solve the above-described problems, a method for manufacturing a wiring board according to the present invention includes an uncured resin substrate, a step of preparing a pressing member having an uneven surface, and the pressing member on one main surface of the resin substrate. And pressing the surface of the resin substrate to form irregularities on one main surface of the resin substrate, and in a state where the pressing member is pressed against the resin substrate, heat is applied to the resin substrate to cure the resin substrate. And a step of removing the pressing member from one main surface of the resin substrate, and a step of forming a conductive layer along the unevenness formed on the one main surface of the resin substrate. To do.

  Further, in the method for manufacturing a wiring board according to the present invention, the step of forming irregularities on one principal surface of the resin substrate applies heat to the resin substrate to melt the one principal surface of the resin substrate. One main surface is adhered to the surface of the pressing member.

  In the wiring board manufacturing method of the present invention, the pressing member is etched and removed from one main surface of the resin substrate, and the one main surface of the resin substrate is exposed.

  In the method for manufacturing a wiring board according to the present invention, a maximum height (Rz) of the unevenness formed on one main surface of the resin substrate is 0.2 μm or more and 3.0 μm or less. .

  Moreover, the manufacturing method of the wiring board according to the present invention is characterized in that a pressure for pressing the pressing member toward the resin substrate is 0.5 MPa or more and 5.0 MPa or less.

  In the method for manufacturing a wiring board according to the present invention, the temperature of heat for curing the resin substrate is 160 ° C. or more and 250 ° C. or less.

  The method for manufacturing a wiring board according to the present invention is characterized in that the temperature of heat for melting one main surface of the resin substrate is 100 ° C. or higher and 150 ° C. or lower.

  The wiring board manufacturing method of the present invention is characterized in that the pressing member is made of zinc oxide and the resin board is made of a thermosetting resin.

  Further, in the method for manufacturing a wiring board according to the present invention, a wiring area where the conductive layer is formed and an exposed area where the unevenness is exposed exist on one main surface of the resin substrate. A step of forming an insulating layer over the exposed region is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the peeling of a conductive layer and a resin substrate can be suppressed, and the manufacturing method of the wiring board which can maintain the electrical connection of a wiring board stably can be provided.

  Embodiments of a wiring board according to the present invention will be described below in detail with reference to the drawings. Such wiring boards are used for electronic devices such as various audiovisual devices, home appliances, communication devices, computer devices or peripheral devices thereof.

  FIG. 1 is a plan view of a wiring board according to the present embodiment, and FIG. 2 is a cross-sectional view of the wiring board according to the present embodiment.

  The wiring board 1 according to this embodiment includes a core substrate 2, a conductive layer 3 formed on one main surface and the other main surface of the core substrate 2, and an insulating layer 4. A semiconductor element 6 such as an IC or LSI is mounted on the wiring board 1 via bumps 5 such as solder.

  The core substrate 2 is made of, for example, a thermosetting resin such as an epoxy resin, a bismaleimide triazine resin, or a cyanate resin on a base material F in which glass fiber, polyparaphenylene benzbisoxazole resin or wholly aromatic polyamide resin is woven vertically and horizontally. It is produced by laminating and solidifying impregnated sheets. Among them, it is desirable to use a lenbenzbisoxazole resin for polyparefé. The polyparaphenylene benzbisoxazole resin has a low coefficient of thermal expansion, and by using such a low thermal expansion resin, the thermal expansion of the core substrate 2 itself can be suppressed.

  Moreover, the core substrate 2 can also be produced from resin without using a base material. As such a resin, an epoxy resin, a bismaleimide triazine resin, a cyanate resin, a polyimide resin, a polyphenylene ether resin, or the like can be used.

  A through hole 7 is formed in the core substrate 2 so as to penetrate the core substrate 2 in the vertical direction. On the inner wall surface of the through hole 7, a through hole conductor 8 made of conductive copper plating or the like is formed. The through hole 7 is filled with an insulator 9 made of an insulating resin in order to improve the flatness of the core substrate 2. The through-hole conductor 8 electrically connects the conductive layers 3 formed on the main surface or the other main surface of the core substrate 2. In addition, by filling the through holes 7 with the insulator 9, via conductors 10 to be described later can be formed immediately above or directly below the through holes 7, which can contribute to downsizing of the wiring board 1.

  Further, irregularities are formed on one main surface and the other main surface of the core substrate 2. Such irregularities can be formed by bonding a substrate having an irregular surface on one main surface, for example, a substrate made of zinc oxide, to one main surface and the other main surface of the core substrate 2 and pressing them. Moreover, it is preferable that the maximum height (Rz) according to JISB0601-2001 is set to 0.2 micrometer or more and 3.0 micrometers or less for the one main surface of the core board | substrate 2, and another main surface.

  By setting the maximum height (Rz) to 0.2 μm or more, the contact area between one main surface and the other main surface of the core substrate 2 and the conductive layer 3 can be sufficiently increased, and the adhesive strength between the two Can be maintained. As a result, it is possible to effectively suppress the conductive layer 3 from peeling from the core substrate 2. On the other hand, when the maximum height (Rz) of the unevenness exceeds 3.0 μm, a gap is easily formed between the conductive layer 3 and the core substrate 2, and the conductive layer 3 is easily peeled off from the core substrate 2. . Therefore, by making the maximum height of the unevenness (Rz) 3.0 μm or less, while suppressing the formation of a gap between the conductive layer 3 and the core substrate 2, increasing the contact area between both, Both adhesive forces can be maintained effectively.

  The conductive layer 3 is a flat signal line 3a having a function of transmitting a predetermined electric signal, and a flat plate having a function of setting a power supply potential connected to the semiconductor element 6 to a common potential, for example, a ground potential. And a ground layer 3b. The signal line 3a is disposed so as to face the ground layer 3b with the insulating layer 4 interposed therebetween. The conductive layer 3 is made of a metal material such as copper, silver, gold, aluminum, nickel, or chromium.

  The insulating layer 4 is formed by vertically laminating a film layer 4a and an adhesive layer 4b. In addition, a via conductor 10 is formed in the insulating layer 4 so as to penetrate the vertical direction. The via conductor 10 is for electrically connecting the conductive layers 3 having different vertical positions. The via conductor 10 has a reverse taper shape that is wide from one main surface side of the core substrate 2 toward one main surface side of the wiring substrate 1 (from the other main surface side of the core substrate 2 to the other main surface side of the wiring substrate 1). For example, it is made of a conductive material such as copper, silver, gold, aluminum, nickel, or chromium.

  The thickness of the film layer 4a is precisely controlled in order to bring the thickness dimension of the insulating layer 4 close to a predetermined value and ensure flatness. The film layer 4a is desirably a material having excellent heat resistance and hardness in order to prevent the thickness dimension of the film layer 4a from being changed by the applied temperature and pressure. As the film layer 4a having such characteristics, for example, at least one of polyparaphenylene benzbisoxazole resin, wholly aromatic polyamide resin, wholly aromatic polyester resin, polyimide resin or liquid crystal polymer resin is used. it can. The film layer 4a is preferably a mixed resin of a polyparaphenylene benzbisoxazole resin and a polyimide resin in order to maintain the strength of the film layer 4a. In addition, the thickness dimension of the film layer 4a is set to be, for example, 1 μm to 10 μm.

  Further, unevenness similar to that of the core substrate 2 is formed on the surface of the film layer 4a on which the conductive layer 3 is formed. The unevenness is preferably set such that the maximum height (Rz) is 0.2 μm or more and 3.0 μm or less for the same reason as the unevenness formed on the core substrate 2.

  The adhesive layer 4b is for fixing the film layer 4a to the core substrate 2 or the conductive layer 3, and an adhesive such as a thermosetting resin or a thermoplastic resin is used. Such an adhesive becomes the adhesive layer 4b after curing. As the thermosetting resin, for example, at least one of polyimide resin, acrylic resin, epoxy resin, urethane resin, cyanate resin, silicon resin, and bismaleimide triazine resin can be used. As the thermoplastic resin, since it is necessary to have heat resistance capable of withstanding heating during solder reflow, it is desirable that the softening temperature of the constituent material is 200 ° C. or higher. Polyether ketone resin, polyethylene terephthalate resin or polyphenylene ether Resin or the like can be used.

  The adhesive is bonded to the core substrate 2 and the conductive layer 3 while being attached to the film layer 4a. Then, after the adhesive is pressurized while being heated using, for example, a hot press device, the adhesive is cured by cooling. The adhesive layer 4b is set so that the thickness dimension is, for example, 1 μm to 10 μm.

  The semiconductor element 6 is made of a material that approximates the coefficient of thermal expansion of the insulating layer 4. For example, silicon, germanium, gallium arsenide, gallium arsenide phosphorus, gallium nitride, or silicon carbide can be used. In addition, the thickness dimension of the semiconductor element 6 can use the thing of 0.1 mm to 1 mm, for example.

  Below, the manufacturing method of the wiring board 1 mentioned above is demonstrated using FIG. 3 thru | or FIG.

  First, an uncured resin substrate 21 and a pressing member 22 having an uneven surface are prepared. The resin substrate 21 constitutes the core substrate 2 according to the present embodiment.

  The resin substrate 21 is obtained by laminating a plurality of layers in which a base material is impregnated with a thermosetting resin. One main surface and the other main surface of the resin substrate 21 are formed flat. The maximum height (Rz) of the flat surface is, for example, 0.1 μm or less. In this way, by using the resin substrate 21 having a flat one principal surface, the unevenness of the pressing member 22 having a large maximum surface height (Rz) is transferred to one principal surface of the resin substrate 21 as described later. can do.

  The pressing member 22 is a plate body, and has a plated layer 22b having irregularities formed on the surface of the copper foil 22a by using an electroless plating method. The specific manufacturing method of the pressing member 22 first prepares mixed water in which zinc nitrate and pure water are mixed, and adds an additive composed of dimethylaminoborane to the mixed water to prepare an aqueous solution. At this time, the concentration of the aqueous solution is, for example, from 0.03 mol% to 0.05 mol% in terms of zinc concentration, and dimethylaminoborane is added from 0.005 wt% to 0.02 wt%. Next, this aqueous solution is heated to, for example, 65 ° C. to 95 ° C., and the copper foil 22a is immersed, for example, for 15 to 120 minutes, thereby forming a plating layer 22b made of zinc oxide having irregularities on the surface of the copper foil 22a. Can do. The plated layer 22b can form unevenness uniformly on the surface of the copper foil 22a by growing the film over time under the above-described conditions. In this way, the pressing member 22 having an uneven surface can be produced.

  The unevenness has a maximum height (Rz) set to 0.2 μm or more and 3.0 μm or less. As the additive, a reducing agent that reduces zinc nitrate such as sodium hydrogen borate to precipitate a metal can be used instead of dimethylaminoborane.

  The prepared pressing member 22 is preferably of a size that completely covers the resin substrate 21 in order to form the unevenness 23 on the entire surface of the resin substrate 21.

  Next, as illustrated in FIG. 3A, the pressing member 22 is disposed to face the resin substrate 21.

  And as shown in FIG.3 (b), the one main surface of the press member 22 is bonded together to one main surface of the resin substrate 21, and the press member 22 is carried out on the following conditions (temperature conditions, pressure conditions). By pressing toward the resin substrate 21, irregularities are formed on one main surface of the resin substrate 21.

  Specifically, the temperature condition is such that a plating layer 22b that is an uneven side of the pressing member 22 is bonded to one main surface of the resin substrate 21, and the resin substrate 21 and the pressing member 22 are 100 ° C. or higher and 150 ° C. or lower. It is preferable to apply heat. By applying heat of 100 ° C. or more to the resin substrate 21 and the pressing member 22, the surface of the resin substrate 21 can be melted and the resin substrate 21 can be adhered along the unevenness of the pressing member 22. On the other hand, when heat exceeding 150 ° C. is applied to the resin substrate 21 and the pressing member 22, the resin of the resin substrate 21 begins to harden, and thus the pressing member 22 cannot be adhered in a state of being in close contact with the resin pressing member 22. Therefore, by applying heat of 150 ° C. or less to the resin substrate 21 and the pressing member 22, it is possible to prevent the resin pressing member 22 from being cured before the two are bonded in the bonding stage between the resin substrate 21 and the pressing member 22. can do.

  The pressure condition is preferably that the pressing member 22 is pressed toward the resin substrate 21 so that a pressure of 0.5 MPa or more and 5.0 MPa or less is uniformly applied to the entire main surface of the resin substrate 21. . The resin substrate 21 and the pressing member 22 can be brought into close contact with each other by maintaining this condition in a vacuum atmosphere, for example, for 5 to 15 minutes. By setting the pressure condition to 0.5 MPa or more under the above temperature condition, the gap between the resin substrate 21 and the pressing member 22 can be sufficiently reduced and the two can be brought into close contact with each other. Moreover, it can suppress that a part of resin substrate 21 flows out toward the edge part of the resin substrate 21 from between the press member 22 and the resin substrate 21 by making pressure conditions into 5.0 Mpa or less. .

  Next, in order to cure the resin substrate 21 and fix the resin substrate 21 and the pressing member 22, it is preferable to apply heat of 160 ° C. or more and 250 ° C. or less to the resin substrate 21 and the pressing member 22. In addition, if the time which applies heat is set to 40 minutes to 90 minutes, for example, both can fully adhere | attach and can be fixed.

  Here, by applying heat of 160 ° C. or more to the resin substrate 21 and the pressing member 22, the resin substrate 21 can be cured and both can be fixed. Further, when heat exceeding 250 ° C. is applied to the resin substrate 21 and the pressing member 22, the difference between the thermal expansion coefficients of the resin substrate 21 and the pressing member 22 is increased, and there is a possibility that both of them are peeled off. Therefore, by applying heat of 250 ° C. or less to the resin substrate 21 and the pressing member 22, it is possible to suppress both from peeling.

  Next, as shown in FIG. 3C, the pressing member 22 is removed from one main surface of the resin substrate 21.

  The fixed pressing member 22 and the resin substrate 21 are immersed in an etching solution for 1 to 5 minutes, for example, to dissolve and remove the pressing member 22 from the resin substrate 21. The pressing member 22 is etched and removed from one main surface of the resin substrate 21, and the one main surface of the resin substrate 21 is exposed. As a result, the one main surface of the bonded pressing member 22 is transferred to one main surface of the resin substrate 21 to form the unevenness 23. Here, the etching solution may be, for example, a strong acid or weak acid aqueous solution such as ferric chloride, copper chloride, hydrochloric acid, sulfuric acid, or nitric acid, and the concentration may be, for example, 5% to 20%.

  Moreover, the unevenness | corrugation 23 can be formed in the other main surface of the resin substrate 21 by obtaining the process mentioned above. The resin substrate 21 has a thickness dimension set to 0.3 mm to 1.5 mm, for example.

  Here, a method for forming the unevenness by dissolving the substrate surface using a mixed liquid containing permanganic acid as a main component will be described and compared with the invention according to the present embodiment.

  A method of melting the substrate surface and forming irregularities will be described. There are areas in the substrate where the materials that make up the substrate are separated into dense and rough areas. When the substrate surface is melted, areas that are difficult to dissolve and areas that are easily melted are generated. Resulting in. Therefore, in the method of melting the substrate surface, irregularities are formed sparsely on the substrate surface, and it is difficult to keep the maximum height of the irregularities small when attempting to form irregularities on the entire surface of the substrate. Therefore, when a conductive layer is formed in a region where the unevenness on the surface of the substrate is small, it is difficult to maintain good adhesion between the two. In addition, when a conductive layer is formed in a region where the substrate surface has large irregularities, a gap is easily formed between the two, and both are easily peeled off. Further, the mixed solution used in the method for dissolving the substrate surface has an alkaline pH (pH) of 13 to 14, for example, and is heated to 70 to 80 ° C., for example. Although the resin is resistant to acidity but weak in alkalinity, although unevenness is formed on the surface of the substrate, the strength of the resin itself constituting the substrate is lowered, and the substrate is easily destroyed. For this reason, even when unevenness is formed on the resin surface and the anchor effect can be expected, the strength of the resin is reduced, so that the convex portion of the resin is destroyed and the anchor effect of bonding the resin and the conductive layer is exhibited. Therefore, the adhesive strength between the two cannot be maintained well.

  On the other hand, according to the invention according to the present embodiment, the unevenness 23 of the resin substrate 21 is a transfer of the unevenness grown on the pressing member 22, so that the resin substrate 21 has a surface roughness that is higher than that of the method of melting the substrate surface. Irregularities 23 can be formed uniformly on one main surface and the other main surface. Therefore, according to the invention according to the present embodiment, it is possible to reduce the occurrence of regions where unevenness is difficult to be formed. Further, according to the invention according to the present embodiment, since the unevenness 23 of the resin substrate 21 is transferred, the unevenness 23 is formed without being influenced by the easily soluble region and the hardly soluble region of the substrate. Therefore, the maximum height of the unevenness can be kept small. Therefore, when the conductive layer 3 is formed on one main surface of the resin substrate 21 according to the present embodiment, the unevenness 23 is formed on the entire main surface of the resin substrate 21, and thus the resin substrate 21 and the conductive layer 3. It is possible to maintain the adhesive strength with. Moreover, since the maximum height of the unevenness | corrugation 23 can be restrained small, it is hard to form a clearance gap between both, and it can suppress effectively that both peel. The etching solution used in the present embodiment has a pH (pH) of, for example, 2 to 4, and is heated to, for example, 20 ° C. to 30 ° C. Therefore, since the etching solution is acidic, there is no problem that the strength of the resin substrate is reduced and the resin substrate is destroyed. For this reason, even when unevenness is formed on the resin surface, the resin strength does not decrease and the resin protrusions are not easily destroyed. The force can be maintained well.

  Next, as shown in FIG. 3D, through holes 7 penetrating in the vertical direction are formed in the resin substrate 21 by a conventionally known drilling process or the like. Then, as shown in FIG. 3 (e), the material constituting the conductive layer 3 is deposited on the surface of the resin substrate 21 by electroless plating or the like to form the plating 3 ′ and the inner wall surface of the through hole 7. A through-hole conductor 8 is formed on the substrate. A plurality of through holes 7 are formed in the resin substrate 21, and the diameter is set to 0.1 mm to 1 mm, for example.

  Thereafter, as shown in FIG. 4A, the through-hole 7 is filled with a resin such as polyimide to form an insulator 9. Further, as shown in FIG. 4B, the material constituting the conductive layer 3 is deposited on the insulator 9 by a conventionally known vapor deposition method, CVD method, sputtering method or the like, and the plating 3 ′ is formed. Adhere. And after apply | coating a resist to the surface and performing exposure development, it etches and then, as shown in FIG.4 (c), next to the unevenness | corrugation 23 formed in the one main surface of the resin board | substrate 21 A conductive layer 3 is formed along the line. Therefore, on one main surface of the resin substrate 21, there are a wiring region A where the conductive layer 3 is formed and an exposed region B where the unevenness 23 is exposed.

  Next, the film layer 4a to which the adhesive is applied is prepared. The adhesive is made of, for example, a polyimide resin, and can be deposited on the film layer 4a by a conventionally known spin coating method or the like.

  Next, as shown in FIG. 4D, the film layer 4a is bonded to the wiring region A and the exposed region B through an adhesive. Further, in a state where the film layer 4 is bonded to the conductive layer 3, for example, by applying heat to the adhesive with a heating press device, the adhesive is cured and the film layer 4 a is fixed to the conductive layer 3. Further, the adhesive layer 4b can be formed by curing the adhesive. Then, the insulating layer 4 including the film layer 4a and the adhesive layer 4b is formed over the wiring area A and the exposed area B.

  Since the insulating layer 4 is formed by adhering to the exposed region B, the adhesive layer 4b is fixed along the unevenness 23 of the exposed region B. Therefore, by increasing the contact area between the insulating layer 4 and the exposed region B, it is possible to maintain a good adhesive force between them, and to suppress the peeling of the insulating layer 4 from the resin substrate 21.

  Next, as shown in FIG. 4E, the unevenness 23 is formed on one main surface of the insulating layer 4 by a method similar to the method of forming the unevenness on the resin substrate 21 described above.

Next, as shown in FIG. 5A, via holes 24 are formed in the insulating layer 4 using, for example, a YAG laser device or a CO ₂ laser device. The via hole 24 is formed by irradiating laser light toward one main surface of the insulating layer 4 from a direction perpendicular to one main surface of the insulating layer 4. Further, as shown in FIG. 5B, the via hole 24 is subjected to, for example, a conventionally known plating process and filled with a conductive material, thereby forming the via conductor 10.

  Next, the material constituting the conductive layer 3 is deposited on one main surface of the film layer 4a by a conventionally known vapor deposition method, CVD method, sputtering method or the like. And after apply | coating a resist to the surface and performing exposure development, it etches and forms the conductive layer 3 as shown in FIG.5 (c). Moreover, since the unevenness is formed on one main surface of the insulating layer 4, the contact area between the insulating layer 4 and the conductive layer 3 is increased, and the adhesive strength between the two is maintained, so that the both can be separated. Can be suppressed.

  In this way, the wiring board 1 can be manufactured. A mounting structure can be manufactured by mounting the semiconductor element 6 on the wiring board 1 via the bumps 5.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  In the said embodiment, although the press member was made into the plate body, if the surface is an uneven | corrugated member, a spherical or polygonal thing may be sufficient.

It is a top view of the wiring board concerning the embodiment of the present invention. It is sectional drawing of the wiring board which concerns on embodiment of this invention. It is sectional drawing explaining the manufacturing process of the wiring board which concerns on embodiment of this invention. It is sectional drawing explaining the manufacturing process of the wiring board which concerns on embodiment of this invention. It is sectional drawing explaining the manufacturing process of the wiring board which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring board 2 Core board 3 Conductive layer 3a Signal line 3b Ground layer 4 Insulating layer 4a Film layer 4b Adhesive layer 5 Bump 6 Semiconductor element 7 Through hole 8 Through hole conductor 9 Insulator 10 Via conductor 21 Resin substrate 22 Press member 23 Concavity and convexity 24 Via hole A Wiring area B Exposed area

Claims (9)

A step of preparing an uncured resin substrate and a pressing member having an uneven surface;
Pressing the surface of the pressing member on one main surface of the resin substrate and forming irregularities on the one main surface of the resin substrate;
In a state where the pressing member is pressed against the resin substrate, heat is applied to the resin substrate to cure the resin substrate;
Removing the pressing member from one main surface of the resin substrate;
Forming a conductive layer along the irregularities formed on one main surface of the resin substrate;
A method of manufacturing a wiring board, comprising: In the manufacturing method of the wiring board of Claim 1,
In the step of forming irregularities on one main surface of the resin substrate, heat is applied to the resin substrate, the one main surface of the resin substrate is melted, and the one main surface of the resin substrate is adhered to the surface of the pressing member. A method for manufacturing a wiring board. In the manufacturing method of the wiring board according to claim 1 or 2,
The method of manufacturing a wiring board, wherein the pressing member is etched and removed from one main surface of the resin substrate, and the one main surface of the resin substrate is exposed. In the manufacturing method of the wiring board in any one of Claims 1 thru | or 3,
The method for manufacturing a wiring board, wherein the maximum height (Rz) of the unevenness formed on one main surface of the resin substrate is 0.2 μm or more and 3.0 μm or less. In the manufacturing method of the wiring board in any one of Claim 1 thru | or 4,
A method for manufacturing a wiring board, wherein the pressure for pressing the pressing member toward the resin substrate is 0.5 MPa or more and 5.0 MPa or less. In the manufacturing method of the wiring board in any one of Claims 1 thru | or 5,
The method of manufacturing a wiring board, wherein a temperature of heat for curing the resin substrate is 160 ° C. or higher and 250 ° C. or lower. In the manufacturing method of the wiring board of Claim 2,
The method of manufacturing a wiring board, wherein a temperature of heat for melting one main surface of the resin board is 100 ° C. or higher and 150 ° C. or lower. In the manufacturing method of the wiring board in any one of Claim 1 thru | or 7,
The pressing member is made of zinc oxide, and the resin substrate is made of a thermosetting resin. In the manufacturing method of the wiring board in any one of Claims 1 thru | or 8,
On one main surface of the resin substrate, there is a wiring region where the conductive layer is formed and an exposed region where the unevenness is exposed,
Furthermore, the manufacturing method of the wiring board characterized by including the process of forming an insulating layer over the said wiring area | region and the said exposed area | region.

Images