JP2008299161A - Electro-optical device, manufacturing method therefor, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IPS (in-plane switching) electro-optical device capable of removing surely an electrostatic charge to the outside, without enlarging an outline dimension. <P>SOLUTION: A liquid crystal device, that is one example of electro-optical device, is the IPS type, wherein a liquid crystal is sandwiched between a pair of the first and second substrates. A conductive layer is formed on an outer face of the first substrate; and a conductive part not covered with a polarizing plate arranged on an outer face of the conductive layer is electrically connected to a grounding terminal formed in a projected area on the first substrate by a conductive member arranged in an aperture of a covering member. The charge is thereby removed to the outside through the conductive part, the conductive member and the grounding terminal, when the charge is charged on the outer face of the polarizing plate by static electricity. The conductive member is exactly arranged only in a necessary area by arranging the conductive member in the aperture of the covering member in a manufacturing process, and an arranging area thereof can be narrowed. Resultingly, a dimension of the conductive layer not covered with the polarizing plate gets small, so as to reduce the outline dimension of the liquid crystal device. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electro-optical device suitable for displaying various information.

  In recent years, as an example of an electro-optical device, a horizontal electric field type liquid crystal device has attracted attention. This method is a method in which the direction of the electric field applied to the liquid crystal is substantially parallel to the substrate, and has an advantage that visual characteristics can be improved as compared with a TN (Twisted Nematic) method or the like. As such a horizontal electric field type liquid crystal device, a liquid crystal device such as an IPS (In-Plane Switching) type or an FFS (Fringe Field Switching) type is known. A liquid crystal is sandwiched between a pair of substrates disposed opposite to each other, and a comb-shaped pixel electrode and a common electrode for generating an electric field between the pixel electrode are provided on the same substrate. Composed.

  However, in such a horizontal electric field type liquid crystal device, when electric charges are charged in a substrate having no electrode due to external static electricity or the like, an unnecessary electric field is generated between the substrate having an electrode and the substrate having no electrode. May occur and appropriate display may not be possible.

  An example of a lateral electric field type liquid crystal display device capable of improving such a problem is described in Patent Document 1.

  The liquid crystal display device described in Patent Document 1 has a configuration in which an adhesive layer in which conductive fine particles are interspersed is interposed between a transparent substrate and a polarizing plate in the upper substrate. This adhesive layer is supposed to function as a conductive film that shields against static charges such as external static electricity. Accordingly, in this liquid crystal display device, high static electricity is generated from the outside of the surface of the liquid crystal display panel. Even when a potential is applied, the occurrence of display abnormality can be prevented.

Japanese Patent No. 2758864

  In the above-mentioned Patent Document 1, several examples that can improve the above-described problem are listed, but in one of the examples, the lower substrate is formed by using a cable. The ground terminal provided on the substrate and the conductive layer provided on the liquid crystal layer side of the polarizing plate of the upper substrate are grounded.

  In the case of this aspect, in order to connect the cable and the conductive layer, it is necessary to secure a region of the conductive layer corresponding to the connection portion. In particular, when a conductive paste is used to connect the cable and the conductive layer, the conductive paste has fluidity, so there is a possibility that the conductive paste applied on the conductive layer and the polarizing plate come into contact with each other. .

  Therefore, in such an aspect, it is necessary to enlarge the region of the conductive layer corresponding to the connection portion in consideration of the fluidity of the conductive paste. Then, in this aspect, in order to secure the area, the dimension of the upper substrate (“dimension”: the length corresponding to the cable drawing direction, the same applies hereinafter) must be increased, and the lower substrate is accordingly changed. There is a possibility that the size of the liquid crystal display device becomes larger as compared with a TN (Twisted Nematic) type or VA (Virtical Alignment) type liquid crystal device. Then, there is a problem in that the degree of mounting of the liquid crystal display device on the electronic device or the like is reduced due to the size limitation of the electronic device or the like on which the liquid crystal display device is mounted.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above points. A lateral electric field type electro-optical device capable of reliably discharging static electricity to the outside without increasing the external dimension, a manufacturing method thereof, and the electro-optical device thereof An object is to provide an electronic device using the device.

  In one aspect of the present invention, an electro-optical device is sandwiched between a first substrate, a second substrate disposed opposite to the first substrate, and the first substrate and the second substrate. The electro-optic material formed, the common electrode and the pixel electrode formed on the surface of the first substrate on the electro-optic material side, and an overhang projecting outward from one side of the second substrate of the first substrate A grounding terminal formed on a surface of the region on the second substrate side, a conductive layer formed on a surface of the second substrate opposite to the electro-optic material, and the one side of the second substrate A conductive portion electrically connected to the grounding terminal in at least a part of an end portion of the conductive layer on the side, and formed on the conductive layer of the second substrate except at least the conductive portion. An optical member and the conductive of the second substrate from the overhanging region of the first substrate. A covering member that covers at least a part of the region over which the region is formed, and the covering member has an opening in a region that overlaps the grounding terminal and the conducting portion, and the electrical connection with the grounding terminal The parts are electrically connected through a conductive member disposed in the opening of the covering member.

  The electro-optical device includes a first substrate, a second substrate disposed opposite to the first substrate, an electro-optical material sandwiched between the first substrate and the second substrate, and a first substrate A common electrode and a pixel electrode made of a transparent conductive member such as ITO, and a second extended region of the first substrate extending outward from one side of the second substrate. A grounding terminal formed on the surface of the substrate and electrically grounded; a conductive layer formed on a surface opposite to the electro-optical material of the second substrate and made of a transparent conductive member such as ITO; A conductive portion electrically connected to the grounding terminal at least at a part of the end portion of the conductive layer on the one side of the second substrate, and formed on the conductive layer of the second substrate except at least the conductive portion. , For example, an optical member such as a polarizing plate and the conductivity of the second substrate from the overhanging region of the first substrate. Comprising a covering member covering at least a part of the region spanning the region but is formed, the. In a preferred example, the electro-optical device may be a lateral electric field type electro-optical device that generates an electric field between the pixel electrode and the common electrode. The conductive member is preferably a conductive paste or a conductive tape.

  In particular, in this electro-optical device, the covering member has an opening in a region overlapping the grounding terminal and the conducting portion, and the grounding terminal and the conducting portion are electrically connected through the conductive member disposed in the opening of the covering member. It is connected to the.

  According to the above electro-optical device, even when a charge is charged on the surface of the optical member from the outside, the charged charge is released to the outside through the conducting portion, the conductive member, and the grounding terminal that is electrically grounded. . Therefore, an unnecessary electric field can be prevented from being generated between the first substrate and the second substrate due to the static electricity, and appropriate display can be performed. Further, in the manufacturing process of the electro-optical device, when the conductive portion (at least a part of the end portion of the conductive layer) and the grounding terminal are electrically connected using the conductive member, the opening of the covering member is It functions as a guide for preventing the conductive member from diffusing or flowing to an unnecessary region at the end of the conductive layer, particularly to the optical member side. As a result, the conductive member can be accurately disposed (or coated) only in the necessary region (the region covering the conductive portion and the ground terminal), and the conductive member disposed region (or coated region) can be narrowed. At the same time, the amount of conductive member used can be reduced. Therefore, if the dimension of the portion of the covering member that covers the conductive layer (the length corresponding to the direction orthogonal to the one side of the second substrate) is as small as possible, the conductive portion that is not covered by the optical member is used. The dimension (the length corresponding to the direction orthogonal to the one side of the second substrate) of (at least a part of the end portion of the conductive layer) can be made as small as possible. In a preferred example, the dimension of the conductive portion (at least a part of the end portion of the conductive layer) not covered by the optical member is set to be less than 1 mm. Thereby, it is possible to prevent the dimension of the second substrate (the length corresponding to the direction perpendicular to the one side of the second substrate) from increasing, and accordingly the dimension of the first substrate (the second substrate). (Length corresponding to the direction perpendicular to the one side) can be prevented from becoming large. Therefore, it is possible to prevent the outer dimension of the electro-optical device (the length corresponding to the direction orthogonal to the one side of the second substrate) from increasing, and to narrow the frame. As a result, it is difficult to receive restrictions on the external dimensions of the electro-optical device required for mounting on an electronic device or the like, and the degree of mounting the electro-optical device on the electronic device or the like can be increased.

  In one aspect of the above electro-optical device, the covering member is formed with a step so as to be along the protruding region of the first substrate and the conductive layer of the second substrate. Thereby, a coating | coated member can be reliably and stably attached with respect to a 1st board | substrate and a 2nd board | substrate.

  In another aspect of the electro-optical device, the covering member does not overlap the optical member. This can prevent adverse effects on the optical characteristics of the optical member.

  In another aspect of the above electro-optical device, the height of the outer surface (surface opposite to the electro-optical material side) of the covering member disposed in the region overlapping the conductive layer (the electro-optical material of the first substrate) The height in the normal direction of the first substrate relative to the inner surface on the side is the height of the outer surface of the optical member (the surface opposite to the electro-optic material side) (the electro-optic of the first substrate). The height in the normal direction of the first substrate with respect to the inner surface on the material side is lower. Thereby, it can prevent that the coating | coated member arrange | positioned in the area | region which overlaps with a conductive layer protrudes outside the outer surface of an optical member. Therefore, when the electro-optical device is mounted on an electronic device or the like, it is possible to prevent the covering member disposed in the region overlapping with the conductive layer from interfering with or obstructing the electronic device. As a result, the degree of mounting of the electro-optical device with respect to an electronic device or the like can be further increased.

  In another aspect of the electro-optical device, the member is formed of an insulating material or a rigid material. In this electro-optical device, if a member made of a material having rigidity, for example, a material made of metal, is used, it can contribute to improvement of the strength of the electro-optical device. On the other hand, if an insulating member such as rubber or resin is used in this electro-optical device, noise is applied to various wirings existing at positions covered by the member in the overhanging region due to the shielding function of the member. It becomes difficult.

  In another aspect of the present invention, an electronic apparatus including the electro-optical device as a display unit can be configured.

  In still another aspect of the invention, the method of manufacturing an electro-optical device includes a first substrate having a common electrode, a pixel electrode, and a grounding terminal on one surface, and a second substrate. To the second substrate, and the grounding terminal is pasted so as to be disposed in an overhanging region projecting outward from one side of the second substrate, and the first substrate and the second substrate An electro-optical panel manufacturing process for manufacturing an electro-optical panel that sandwiches an electro-optical material therebetween, and a conductive layer forming process for forming a conductive layer on a surface of the second substrate opposite to the electro-optical material; An optical member forming step of forming an optical member on the conductive layer of the second substrate except at least a conductive portion electrically connected to the grounding terminal in at least a part of the end portion on the one side; The overhang area of the first substrate A covering member disposing step of disposing a covering member so as to cover at least a part of the region over the region where the conductive layer of the second substrate is formed; and the grounding terminal and the conducting portion of the covering member A conductive member disposing step of disposing a conductive member in an opening formed in the overlapping region and electrically connecting the grounding terminal and the conducting portion.

  According to the above method for manufacturing an electro-optical device, first, the electro-optical panel manufacturing process includes a first substrate having a common electrode, a pixel electrode, and a grounding terminal on one surface, and a second substrate. The one surface is opposed to the second substrate, and the grounding terminal is bonded so as to be disposed in the projecting region of the first substrate projecting outward from one side of the second substrate. An electro-optic panel is manufactured by sandwiching an electro-optic material between the two substrates. In a preferred example, the electro-optical panel may be a lateral electric field type that generates an electric field between the pixel electrode and the common electrode.

  Next, in the conductive layer forming step, a conductive layer is formed on the surface of the second substrate opposite to the electro-optical material. Next, in the optical member forming step, the optical member is formed on the conductive layer of the second substrate except for at least a conductive portion electrically connected to the grounding terminal in at least a part of the end portion on the one side. . Next, in the covering member arranging step, the covering member is arranged so as to cover at least a part of a region extending from the projecting region of the first substrate to the region where the conductive layer of the second substrate is formed. Next, in the conductive member arranging step, the conductive member is arranged in an opening formed in a region overlapping with the grounding terminal and the conducting portion of the covering member, and the grounding terminal and the conducting portion are electrically connected.

  In particular, in this method of manufacturing an electro-optical device, in the conductive member arranging step, the conductive portion (at least part of the end portion of the conductive layer) and the grounding terminal are electrically connected using the conductive member. The opening of the member functions as a guide for preventing the conductive member from diffusing or flowing to an unnecessary region at the end of the conductive layer, particularly to the optical member side. As a result, the conductive member can be accurately disposed (or coated) only in the necessary region (the region covering the conductive portion and the ground terminal), and the conductive member disposed region (or coated region) can be narrowed. At the same time, the amount of conductive member used can be reduced. Therefore, if the dimension of the portion of the covering member that covers the conductive layer (the length corresponding to the direction orthogonal to the one side of the second substrate) is as small as possible, the conductive portion that is not covered by the optical member is used. The dimension (the length corresponding to the direction orthogonal to the one side of the second substrate) of (at least a part of the end portion of the conductive layer) can be made as small as possible. In a preferred example, the dimension of the conductive portion (at least a part of the end portion of the conductive layer) not covered by the optical member is set to be less than 1 mm. Thereby, it is possible to prevent the dimension of the second substrate (the length corresponding to the direction perpendicular to the one side of the second substrate) from increasing, and accordingly the dimension of the first substrate (the second substrate). (Length corresponding to the direction perpendicular to the one side) can be prevented from becoming large. Therefore, it is possible to prevent the outer dimension of the electro-optical device (the length corresponding to the direction orthogonal to the one side of the second substrate) from increasing, and to narrow the frame. As a result, it is difficult to receive restrictions on the external dimensions of the electro-optical device required for mounting on an electronic device or the like, and the degree of mounting the electro-optical device on the electronic device or the like can be increased.

  In one aspect of the method of manufacturing the electro-optical device, a covering member removing step of removing the covering member from the first substrate and the second substrate is further provided as a next step of the conductive member arranging step. Thereby, the electro-optical device from which the covering member is removed is manufactured. In performing the covering member removing step, if the conductive member is fluid (for example, a conductive paste), the first substrate and the second substrate are completely cured after the conductive member is completely cured. The covering member is preferably removed from the substrate. In the electro-optical device thus manufactured, the weight of the electro-optical device can be reduced by the amount that the covering member is removed. Therefore, if the electro-optical device from which the covering member is removed is mounted on an electronic device or the like, it can contribute to weight reduction of the electronic device or the like.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the present invention is applied to a liquid crystal device as an example of an electro-optical device.

[Configuration of liquid crystal device]
FIG. 1 is a cross-sectional view of a liquid crystal device 100 according to the present embodiment. FIG. 2 is a plan view of the liquid crystal device 100 according to the present embodiment. FIG. 1 is a cross-sectional view taken along the cutting line AA ′ of the liquid crystal device 100 of FIG.

  The liquid crystal device 100 mainly includes a lighting device 10 and a liquid crystal display panel 20. The illumination device 10 is mainly composed of a light guide plate 11 and a light source unit 15. The liquid crystal display panel 20 as an example of the electro-optical panel is disposed to face the upper surface side of the light guide plate 11. The lighting device 10 includes a reflection sheet 14 on the lower surface side of the light guide plate 11.

  The light source unit 15 is disposed on the end face of the light guide plate 11 and includes a plurality of LEDs 16 that are point light sources. The light L emitted from each LED 16 enters the light guide plate 11 from the end face of the light guide plate 11. In the light guide plate 11, the light L changes its direction by repeating reflection between the upper and lower surfaces of the light guide plate 11 and is emitted toward the liquid crystal display panel 20.

  The liquid crystal display panel 20 has a display area substantially the same as the light emission area of the light guide plate 11. The liquid crystal display panel 20 includes a pair of light-transmitting first substrate 1 and second substrate 2 bonded together via a frame-shaped sealing material 3, and a liquid crystal layer 4 is enclosed therein. Configured. Here, as shown in FIGS. 1 and 2, the first substrate 1 has an overhang region 30 that projects outward from the one side 2 a side of the second substrate 2.

  A polarizing plate 12b is disposed on the outer surface of the first substrate 1 opposite to the liquid crystal layer 4 side. On the other hand, a polarizing plate 12a is disposed on the outer surface of the second substrate 2 opposite to the liquid crystal layer 4 side. As will be described in detail later, a conductive layer 13 made of a transparent conductive member such as ITO (Indium-tin-oxide) is formed on the outer surface of the second substrate 2 opposite to the liquid crystal layer 4 side. The conductive portion (at least a part of the end portion 13a of the conductive layer 13) and the ground wiring GND of the FPC (Flexible Printed Circuit) 22 are the surface 1a on the second substrate 2 side of the overhang region 30 of the first substrate 1. It is electrically connected through a conductive member 26 and a grounding terminal 27 (see FIG. 2) provided above.

  Between the illuminating device 10 and the liquid crystal display panel 20, as a not-shown optical sheet, for example, a diffusion sheet, a prism sheet, or the like is provided. The diffusion sheet has a role of diffusing the light L emitted from the light guide plate 11 in all directions. The prism sheet has a role of condensing the light L toward the liquid crystal display panel 20.

  Here, the internal structure of the liquid crystal display panel 20 will be described. FIG. 3A shows an enlarged cross-sectional view of the liquid crystal display panel 20 corresponding to one subpixel which is a minimum unit of display. In FIG. 3A, for the sake of convenience, only the minimum elements necessary for explanation are shown.

  The liquid crystal display panel 20 according to the present embodiment is an FFS type liquid crystal display panel as an example of a horizontal electric field type, but is not limited to this, and the present invention is one of a pair of substrates facing each other. The present invention can also be applied to various lateral electric field type liquid crystal devices including an IPS type having a structure in which a common electrode 5 and pixel electrodes 8 described later are formed on a substrate. That is, in the present invention, the liquid crystal display panel 20 may be a lateral electric field type, and the specific configuration is not limited.

  The liquid crystal display panel 20 is configured by sandwiching liquid crystal between a pair of first substrate 1 and second substrate 2. On the inner surface of the first substrate 1 on the liquid crystal layer 4 side, a common electrode 5 is formed of a transparent conductive member such as ITO at a position overlapping with a pixel electrode 8 to be described later. On the inner surface of the common electrode 5 on the liquid crystal layer 4 side, an insulating layer 7 made of a translucent insulating material such as acrylic resin is formed over the entire surface. A pixel electrode 8 made of a transparent conductive member such as ITO is formed on the inner surface of the insulating layer 7 on the liquid crystal layer 4 side. An alignment film (not shown) is formed on the inner surface of the pixel electrode 8 or the like on the liquid crystal layer 4 side. On the other hand, a colored layer 6 made of any one of R (red), G (green), and B (blue) is formed on the inner surface of the second substrate 2 on the liquid crystal layer 4 side. An overcoat layer 9 is formed on the inner surface of the colored layer 6 on the liquid crystal layer 4 side. An alignment film (not shown) is formed on the inner surface of the overcoat layer 9 on the liquid crystal layer 4 side.

  FIG. 3B is a plan view of the sub-pixel along the cutting line B-B ′ in FIG. In FIG. 3B, for the sake of convenience, only the minimum elements necessary for explanation are shown. As shown in FIG. 3B, the pixel electrode 8 has a comb-like planar shape, and includes linear comb-tooth portions 8a arranged at regular intervals. In the present invention, although not shown, the pixel electrode 8 is electrically connected to a TFT (Thin Film Transistor) element as an example of a switching element at a predetermined position. The liquid crystal display panel 20 has an electric field (substantially parallel to the surface of the first substrate 1 and intersects the comb-tooth portion 8a) between each comb-tooth portion 8a of the pixel electrode 8 and the common electrode 5. Fringe field) E generated in the direction of In the present invention, it is not essential to provide a switching element.

  1 and 2, the description will be continued. On the surface 1a on the liquid crystal layer 4 side of the overhang region 30 of the first substrate 1, using a technique such as COG (Chip On Glass), the liquid crystal driving A driver IC 21 is mounted. An FPC (Flexible Printed Circuit) 22 as an example of a flexible substrate is disposed at the end of the liquid crystal display panel 20 on the projecting region 30 side. Further, a metal film is formed or formed on the surface 1a of the overhanging region 30 of the first substrate 1 using, for example, a metal material constituting a switching element in the display region, and the metal film is photoetched. The wirings 23, 24, 25 and the grounding terminal 27 are formed by patterning by a method or the like. The wiring 23 is, for example, a gate line (not shown) or a source line (not shown), and is electrically connected to a terminal (not shown) on the output side of the driver IC 21. The wiring 24 is electrically connected to an input side terminal (not shown) of the driver IC 21 and an output side terminal (not shown) of the FPC 22. The wiring 25 is electrically connected to the common electrode 5 and a common potential terminal (COM terminal) on the output side of the driver IC 21. The grounding terminal 27 has a wiring 27 a, and the wiring 27 a is electrically connected to the ground wiring GND of the FPC 22. For this reason, the grounding terminal 27 is electrically grounded.

  In the horizontal electric field type liquid crystal display panel 20, by controlling the magnitude of the electric field E, the alignment state of the liquid crystal molecules in the liquid crystal layer 4 is changed, and the gradation on the display screen is changed.

  In general, in a horizontal electric field type liquid crystal display panel, electrodes such as a pixel electrode 8 and a common electrode 5 are formed only on the inner surface of the first substrate 1 on the liquid crystal layer 4 side, and the liquid crystal layer of the second substrate 2 is formed. No electrode is formed on the inner surface on the 4 side. Therefore, for example, if the surface of the polarizing plate 12a installed on the outer surface of the second substrate 2 opposite to the liquid crystal layer 4 side is charged due to external static electricity or the like, the first substrate An unnecessary electric field is generated between the first substrate 2 and the second substrate 2, and the liquid crystal molecules of the liquid crystal layer 4 are affected by the electric field. As a result, the liquid crystal display panel 20 cannot perform an appropriate display.

  Therefore, in order to improve such a problem, in the liquid crystal device 100 according to the present embodiment, as described above, the conductive layer 13 is formed on the outer surface of the second substrate 2 opposite to the liquid crystal layer 4 side. Then, the conductive portion which is at least a part of the end portion 13a of the conductive layer 13 and the ground terminal 27 which is electrically grounded are electrically connected. Thereby, even when a charge is charged on the surface of the polarizing plate 12a due to static electricity from the outside, the charged charge is transferred to the conductive portion, the conductive member 26, the grounding terminal 27, the wiring 27a of the grounding terminal 27, and the FPC22. Through the ground wiring GND. Therefore, it is possible to prevent an unnecessary electric field from being generated between the first substrate 1 and the second substrate 2 due to the static electricity, and appropriate display can be performed.

  In addition to this, in the liquid crystal device 100 according to the present embodiment, the conductive layer 13 and the grounding terminal using the conductive member 26 are used to prevent the outer dimensions of the liquid crystal device 100 from increasing as described above. 27 devices are devised.

  Hereinafter, with reference to FIG. 2, FIG. 4, and FIG. 5, the characteristic point of this invention regarding this point compared with a comparative example is explained in full detail. FIG. 4A is a cross-sectional view of a main part of the liquid crystal device 100 taken along a cutting line C-C ′ in FIG. FIG. 4B is a main-portion cross-sectional view of the liquid crystal device 100 taken along a cutting line D-D 'in FIG. FIG. 5 is a cross-sectional view of a main part of a liquid crystal device according to a comparative example corresponding to FIG.

  First, the configuration of the liquid crystal device according to the comparative example and its problems will be described. In the following, the same elements as those in the present embodiment are denoted by the same reference numerals, and the description thereof is omitted as appropriate.

  In the comparative example, an electrically grounded terminal 27 is formed on the surface 1a of the overhang region 30 of the first substrate 1, and the second substrate 2 on the side opposite to the liquid crystal layer 4 side. A conductive layer 13 is formed on the outer surface, and a polarizing plate 12a is disposed on the outer surface of the conductive layer 13 opposite to the second substrate 2 side. And the edge part 13a of the conductive layer 13 located in the overhang | projection area | region 30 side is exposed from the polarizing plate 12a, and the edge part 13a of the conductive layer 13 and the grounding terminal 27 are electrically conductive with fluidity, such as a conductive paste. It is electrically connected using the member 26x.

  In the comparative example having such a configuration, an unnecessary electric field caused by the static electricity is generated between the first substrate 1 and the second substrate 2 on the basis of the same principle as that of the above-described embodiment. It is possible to prevent and to display appropriately.

  However, the following problems remain in the comparative example.

  That is, in the manufacturing process of the liquid crystal device according to the comparative example, when the end portion 13a of the conductive layer 13 and the ground terminal 27 are electrically connected using the conductive member 26x having fluidity, the conductive member 26x. Diffuses or flows to an unnecessary region of the end portion 13a of the conductive layer 13, for example, the polarizing plate 12a opposite to the one side 2a side of the second substrate 2, and the conductive member 26x becomes the polarizing plate 12a. There is a risk of contact. If it does so, there exists a possibility of having a bad influence on the optical characteristic of the polarizing plate 12a from this. Therefore, in order to prevent the occurrence of such a problem, in the comparative example, the dimension of the conductive layer 13 exposed to the outside from the polarizing plate 12a (length corresponding to the direction orthogonal to the side 2a of the second substrate 2) d4. Is increased so that the conductive member 26x is prevented from diffusing or flowing to the polarizing plate 12a side when the end portion 13a of the conductive layer 13 and the grounding terminal 27 are connected using the conductive member 26x. I have to. Here, the dimension d4 of the conductive layer 13 exposed to the outside from the polarizing plate 12a is set to at least 1 mm or more. For this reason, in the comparative example, in order to increase the dimension d4, the dimension of the second substrate 2 (the length corresponding to the dimension d2 in FIG. 2) must be increased, and the first substrate 1 accordingly. 2 (the length corresponding to the dimension d3 in FIG. 2) is also increased. As a result, the external dimensions of the liquid crystal device (in FIG. 2) are compared with those of a TN (Twisted Nematic) method or a VA (Virtical Alignment) method. The length corresponding to the dimension d3) may become large. Then, in the comparative example, there is a problem that the degree of mounting of the liquid crystal display device on the electronic device or the like is reduced due to the restriction on the external dimension of the liquid crystal device required for mounting on the electronic device or the like.

  Therefore, in the liquid crystal device 100 according to the present embodiment, in order to prevent such a problem from occurring, the connection method between the conductive layer 13 and the grounding terminal 27 using the conductive member 26 is devised.

  First, the configuration of the covering member 50 that is a characteristic component of the liquid crystal device 100 of the present embodiment will be described.

  As shown in FIGS. 2 and 4B, the covering member 50 includes a conductive portion (at least a part of the end portion 13a of the conductive layer 13) and the grounding terminal 27 in a state where the conductive member 26 is not applied. It has an opening (or through hole) 50a provided in an overlapping region or a region exposed to the outside (for example, in the atmosphere). 4A, the covering member 50 includes at least a part of the surface 1a of the overhanging region 30 of the first substrate 1 and the end portion 13a of the conductive layer 13 of the second second substrate 2. And has a cross-sectional shape corresponding to the step. That is, the covering member 50 is formed with steps so as to follow the overhanging region 30 of the first substrate 1 and the conductive layer 13 of the second substrate 2. The thickness d10 of the portion of the covering member 50 disposed in the region overlapping the conductive layer 13 is smaller than the thickness d11 of the polarizing plate 12a, and the portion of the covering member 50 disposed in the region overlapping the conductive layer 13 D15 is the height of the outer surface of the polarizing plate 12a (first height with respect to the inner surface of the first substrate 1 on the liquid crystal layer 4 side). The height in the normal direction of the first substrate 1 with respect to the inner surface of the substrate 1 on the liquid crystal layer 4 side is lower (smaller) d16. In a preferred example, the covering member 50 is preferably formed of an insulating material such as rubber or resin having a buffering property, or a material having rigidity such as a metal. The covering member 50 according to the present embodiment has a substantially rectangular planar shape, but the planar shape is not limited, and the size (for example, area) is not limited.

  In the present embodiment, the coating member 50 having such a configuration is used to electrically connect the conductive layer 13 and the grounding terminal 27 via the conductive member 26, thereby increasing the external dimensions of the liquid crystal device 100. I try to prevent it.

  Specifically, in the liquid crystal device 100, the first substrate 1, the second substrate 2 disposed to face the first substrate 1, and the first substrate 1 and the second substrate 2 are sandwiched. The liquid crystal layer 4, the common electrode 5 and the pixel electrode 8 formed on the liquid crystal layer 4 side surface of the first substrate 1, and the one side 2a of the second substrate 2 of the first substrate 1 are extended outward. A grounding terminal 27 that is formed on the surface 1a on the second substrate 2 side of the protruding region 30 and is electrically grounded to the ground wiring GND of the FPC 22 through the wiring 27a, and a liquid crystal layer of the second substrate 2 The conductive layer 13 formed on the surface opposite to the fourth side and the continuity electrically connected to the grounding terminal 27 in at least a part of the end portion 13a of the conductive layer 13 on the side 2a side of the second substrate 2 Part (at least a part of the end 13a of the conductive layer 13) and the conductive layer 13 of the second substrate 2 A polarizing plate 12a formed excluding at least the conducting portion, and a covering member that covers at least a part of a region extending from the projecting region 30 of the first substrate 1 to the region where the conductive layer 13 of the second substrate 2 is formed. The covering member 50 has an opening 50a in a region overlapping the grounding terminal 27 and the conducting portion, and the grounding terminal 27 and the conducting portion are disposed in the opening 50a of the covering member 50 (or It is electrically connected through the applied conductive member 26. Here, the conductive member 26 is preferably a conductive paste or a conductive tape. Note that the conductive paste is a conductive paste-like or paste-like soft material, and is formed, for example, by dissolving an appropriate conductive material in a solvent.

  According to such a configuration, when the liquid crystal device 100 is manufactured, the conductive portion (at least a part of the end portion 13 a of the conductive layer 13) and the ground terminal 27 are electrically connected using the conductive member 26. In addition, the opening 50 a of the covering member 50 functions as a guide for preventing the conductive member 26 from diffusing or flowing to an unnecessary region of the end 13 a of the conductive layer 13, particularly to the polarizing plate 12 a side. Accordingly, the conductive member 26 can be accurately disposed (or coated) only in a necessary region (a region covering the conductive portion and the grounding terminal 27), and the disposed region (or coated region) of the conductive member 26 is narrowed. At the same time, the amount of the conductive member 26 used can be reduced. Therefore, if the dimension of the portion of the covering member 50 covering the conductive layer 13 (the length corresponding to the direction orthogonal to the side 2a of the second substrate 2) is as small as possible is exposed from the polarizing plate 12a. Or the dimension (length corresponding to the direction orthogonal to the one side 2a of the 2nd board | substrate 2) d1 of the conduction | electrical_connection part (at least one part of the edge part 13a of the conductive layer 13) d1 which is not covered with the polarizing plate 12a is made as small as possible. be able to. In a preferred example, the dimension d1 of the conducting portion is set to be less than 1 mm. Thereby, in FIG. 2, it can prevent that the dimension (length corresponding to the direction orthogonal to the one side 2a of the 2nd board | substrate 2) d2 of the 2nd board | substrate 2 becomes large, and according to this, the 1st board | substrate. It is possible to prevent the dimension 1 (length corresponding to the direction orthogonal to the side 2a of the second substrate 2) d3 from becoming large. Therefore, in FIG. 2, it is possible to prevent the external dimension (length corresponding to the direction perpendicular to the side 2a of the second substrate 2) d3 of the liquid crystal device 100 from increasing, and to narrow the frame of the liquid crystal device 100. Can do. As a result, it is difficult to receive restrictions on the external dimensions of the liquid crystal device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type liquid crystal device 100 on the electronic device or the like can be increased.

  In the liquid crystal device 100, the covering member 50 is formed with steps so as to extend along the overhanging region 30 of the first substrate 1 and the conductive layer 13 of the second substrate 2. Thereby, the covering member 50 can be reliably and stably attached to the first substrate 1 and the second substrate 2.

  In the liquid crystal device 100, the covering member 50 does not overlap the polarizing plate 12a. Thereby, it can prevent having a bad influence on the optical characteristic of the polarizing plate 12a.

  Further, in the liquid crystal device 100, the thickness d10 of the portion of the covering member 50 disposed in the region overlapping the conductive layer 13 is smaller than the thickness d11 of the polarizing plate 12a, and further disposed in the region overlapping the conductive layer 13. The height of the outer surface (surface opposite to the liquid crystal layer 4 side) of the covered member 50 (the normal direction of the first substrate 1 with respect to the inner surface of the first substrate 1 on the liquid crystal layer 4 side) The height d15 is a method of the first substrate 1 based on the height of the outer surface of the polarizing plate 12a (the surface opposite to the liquid crystal layer 4 side) (the inner surface of the first substrate 1 on the liquid crystal layer 4 side). The height in the line direction is lower (smaller) than d16. Thereby, it can prevent that the part of the said covering member 50 protrudes outside from on the outer surface on the opposite side to the conductive layer 13 side of the polarizing plate 12a. Therefore, when the liquid crystal device 100 is mounted on an electronic device or the like, it is possible to prevent the portion of the covering member 50 disposed in the region overlapping with the conductive layer 13 from interfering with or obstructing the electronic device. As a result, the degree of mounting of the lateral electric field type liquid crystal device 100 on an electronic device or the like can be further increased.

  Further, in this liquid crystal device 100, if the covering member 50 formed of a material made of metal is used, it can contribute to the improvement of the strength of the liquid crystal device 100. In particular, in this liquid crystal device 100, the strength of the liquid crystal device 100 can be further improved by using a covering member 50 made of metal having a size that covers substantially the entire end portion 13 a of the conductive layer 13 and substantially the entire overhang region 30. Can be achieved. Further, in this liquid crystal device 100, the strength of the liquid crystal device 100 can be further improved by using a covering member 50 made of metal having a size that covers substantially the entire periphery of the conductive layer 13 and the substantially entire overhang region 30. Further, as shown in FIG. 11, it has a planar shape that covers the periphery of the polarizing plate 12 a and substantially the entire overhang region 30 except for the region of the polarizing plate 12 a, and covers at least the side surface of the liquid crystal display panel 20 from the observation side. The strength of the liquid crystal device 100x may be further improved by using a frame-shaped covering member (bezel) 50x formed of a material having a shape (not shown) and having an insulating property or rigidity including metal. Here, FIG. 11 is a plan view of the liquid crystal device 100x including the covering member 50x corresponding to FIG. Further, if the covering member 50, the conducting portion (at least a part of the end portion 13a of the conductive layer 13), and the grounding terminal 27 are electrically connected to each other through the conducting member 26 in the opening 50a, the shield of the liquid crystal device 100 can be obtained. Can also be improved.

  Further, in this liquid crystal device 100, if a covering member 50 having an insulating property having a size covering substantially the entire end portion 13 a of the conductive layer 13 and substantially the entire overhang region 30 is used, the shielding function of the covering member 50 is used. This makes it difficult for noise to be applied to the driver IC 21, the wirings 23, 24, 25 and the like. Furthermore, in this liquid crystal device 100, if the insulating covering member 50 having a size covering substantially the entire periphery of the conductive layer 13 and the substantially entire overhang region 30 is used, the strength and noise resistance of the liquid crystal device 100 can be increased. Further improvement.

  In the present invention, various modifications can be made without departing from the spirit of the present invention.

[Method of manufacturing liquid crystal device]
Next, with reference to FIGS. 1-4 and FIGS. 6-10, the manufacturing method of the horizontal electric field type liquid crystal device 100 or 100x which concerns on this embodiment mentioned above is demonstrated. In the following, only the characteristic manufacturing method of the present invention will be described.

  FIG. 6 is a flowchart showing a method of manufacturing the horizontal electric field type liquid crystal device 100 or 100x according to the present embodiment. 7 to 10 are plan views showing manufacturing steps of the horizontal electric field type liquid crystal device 100 or 100x according to the present embodiment.

  First, the liquid crystal display panel 20 is manufactured (liquid crystal display panel manufacturing process P1). Specifically, in this liquid crystal display panel manufacturing process P1, as shown in FIGS. 1, 3, and 7, in particular, the common electrode 5 and the insulating layer 7 formed on the common electrode 5 are formed on one surface. Are connected to a pixel electrode 8 that is formed on the insulating layer 7 and generates an electric field E between the common electrode 5, wirings 23, 24, and 25, and a ground wiring GND of the FPC 22 described later. The first substrate 1 and the second substrate 2 having a grounding terminal 27 including a wiring 27a to be grounded are prepared, the one surface is opposed to the second substrate 2, and the grounding terminal is provided. 27 is bonded via a frame-shaped sealing material 3 so as to be arranged on the surface 1a of the extended region 30 of the first substrate 1 protruding outward from the one side 2a side of the second substrate 2. So that the liquid crystal layer 4 is sandwiched between the substrate 1 and the second substrate 2, Fabricating a liquid crystal display panel 20 as described above by inwardly shaped for the sealing material 3 enclosing the liquid crystal layer 4.

  Next, the conductive layer 13 is formed (conductive layer forming step P2). Specifically, in this conductive layer forming step P2, as shown in FIGS. 1 and 8, the conductive layer made of a transparent conductive member such as ITO on the outer surface of the second substrate 2 opposite to the liquid crystal layer 4 side. Layer 13 is formed.

  Next, the polarizing plates 12a and 12b are attached (polarizing plate attachment step P3). Specifically, as shown in FIG. 1 and FIG. 9, the grounding is performed on the conductive layer 13 of the second substrate 2 on the end 13 a of the conductive layer 13 located on the side 2 a side of the second substrate 2. At least a part of the end portion 13a of the conductive layer 13 located on the side of the overhanging region 30 of the first substrate 1 except at least the conductive portion electrically connected to the terminal 27 is externally (ie, the polarizing plate 12a). And a polarizing plate 12a as an example of an optical member is attached on the outer surface of the conductive layer 13 opposite to the second substrate 2 side so as to be exposed, and the liquid crystal layer 4 side of the first substrate 1 is A polarizing plate 12b is attached on the outer surface on the opposite side. Here, the dimension d1 of the conductive layer 13 exposed to the outside from the polarizing plate 12a is set to be less than 1 mm.

  Next, the covering member 50 or 50x having the above-described configuration is attached (covering member attaching step P4). Specifically, as shown in FIGS. 2 and 4, the conductive portion of the second substrate 2 (at least a part of the end portion 13 a of the conductive layer 13) and the surface 1 a of the overhang region 30 of the first substrate 1 A covering member 50 or a frame-like covering member 50x having a cross-sectional shape corresponding to the step of the substrate and having an opening 50a is prepared, and the conductive layer 13 of the second substrate 2 is formed from the overhanging region 30 of the first substrate 1. By disposing the covering member 50 or the frame-shaped covering member 50 so as to cover at least a part of the region over the formed region, the covering member 50 or the frame-shaped covering member 50 is attached to the first substrate 1 and the second substrate 2. It is attached to the substrate 2. 2 and 4 show a state in which the covering member 50 is attached, and FIG. 11 shows a state in which a frame-like covering member 50x is attached to the first substrate 1 and the second substrate 2, respectively.

  Next, the conductive member 26 is arranged (or applied) (conductive member arrangement step P5). Specifically, the conductive member 26 is disposed (or applied) in the opening 50a of the covering member 50 formed in a region overlapping the grounding terminal 27 and the conductive portion (at least a part of the end portion 13a of the conductive layer 13). Then, the conductive portion (at least a part of the end portion 13 a of the conductive layer 13) and the ground terminal 27 are electrically connected through the conductive member 26. In a preferred example, the conductive member 26 is preferably the above-described conductive paste or conductive tape.

  Through the above manufacturing steps, the liquid crystal device 100 or 100x shown in FIGS. 1 to 4 is manufactured.

  According to this manufacturing method, when electrically connecting the conductive portion (at least a part of the end portion 13a of the conductive layer 13) and the grounding terminal 27 using the conductive member 26 in the conductive member arranging step P5, The opening 50a of the covering member 50 or 50x functions as a guide for preventing the conductive member 26 from diffusing or flowing to an unnecessary region of the end portion 13a of the conductive layer 13, particularly to the polarizing plate 12a side. Accordingly, the conductive member 26 can be accurately disposed (or coated) only in a necessary region (a region covering the conductive portion and the grounding terminal 27), and the disposed region (or coated region) of the conductive member 26 is narrowed. At the same time, the amount of the conductive member 26 used can be reduced. Therefore, if the covering member 50 or 50x covering the conductive layer 13 is formed so that the dimension (the length corresponding to the direction perpendicular to the side 2a of the second substrate 2) is as small as possible, the polarizing plate 12a The dimension (length corresponding to the direction orthogonal to the side 2a of the second substrate 2) d1 of the conducting part (at least a part of the end part 13a of the conductive layer 13) that is not covered with can be made as small as possible. In a preferred example, the dimension d1 of the conductive portion (at least a part of the end portion 13a of the conductive layer 13) not covered by the polarizing plate 12a is set to be less than 1 mm. Thereby, in FIG. 2 or FIG. 11, it can prevent that the dimension (length corresponding to the direction orthogonal to the one side 2a of the 2nd board | substrate 2) d2 of the 2nd board | substrate 2 becomes large, and according to this, the 1st It is possible to prevent the dimension (length corresponding to the direction perpendicular to the side 2a of the second substrate 2) d3 of the first substrate 1 from increasing. Therefore, in FIG. 2 or FIG. 11, it is possible to prevent the liquid crystal device 100 or 100x from having an outer dimension (length corresponding to a direction orthogonal to the side 2a of the second substrate 2) d3. It is possible to narrow the frame. As a result, it is difficult to receive restrictions on the external dimensions of the liquid crystal device required for mounting on an electronic device or the like, and the degree of mounting of the lateral electric field type liquid crystal device 100 or 100x on the electronic device or the like can be increased. When the covering member 50 is not removed as described above, the covering member 50 or 50x is preferably fixed with an adhesive member such as a double-sided tape.

  In the method for manufacturing the liquid crystal device 100 or 100x of the present invention, as shown in FIG. 6, the covering member 50 or 50x is formed from the first substrate 1 and the second substrate 2 as the next step of the conductive member arranging step P. You may further provide the coating | coated member removal process P6 to remove. Thereby, the liquid crystal device 100 or 100x from which the covering member 50 or 50x is removed is manufactured. In performing the covering member removing step P6, if the conductive member 26 is fluid (for example, a conductive paste), after the conductive member 26 is completely cured, the first substrate 1 and The covering member 50 or 50x is preferably removed from the second substrate 2. Here, FIG. 10 shows the liquid crystal device 100 or 100x with the covering member 50 or 50x removed. In the liquid crystal device 100 or 100x manufactured in this way, the weight of the liquid crystal device 100 or 100x can be reduced by the amount by which the covering member 50 or 50x is removed. Therefore, if the liquid crystal device 100 or 100x with the covering member 50 removed is mounted on an electronic device or the like, it can contribute to weight reduction of the electronic device or the like.

[Electronics]
Next, specific examples of electronic devices to which the liquid crystal device 100 or 100x according to the embodiment of the present invention can be applied will be described with reference to FIG.

  First, an example in which the liquid crystal device 100 or 100x of the present invention is applied to a display unit of a portable personal computer (so-called notebook personal computer) will be described. FIG. 12A is a perspective view showing the configuration of this personal computer. As shown in the figure, the personal computer 710 includes a main body 712 having a keyboard 711 and a display 713 to which the liquid crystal device 100 or 100x of the present invention is applied as a panel.

  Next, an example in which the liquid crystal device 100 or 100x of the present invention is applied to a display unit of a mobile phone will be described. FIG. 12B is a perspective view showing the configuration of this mobile phone. As shown in the figure, a cellular phone 720 includes a plurality of operation buttons 721, a receiving mouth 722, a mouthpiece 723, and a display unit 724 to which the liquid crystal device 100 or 100x of the present invention is applied.

  Note that, as an electronic device to which the liquid crystal device 100 or 100x according to the embodiment of the present invention can be applied, in addition to the personal computer shown in FIG. 12A and the mobile phone shown in FIG. TV, viewfinder type / monitor direct view type video tape recorder, car navigation device, pager, electronic notebook, calculator, word processor, workstation, videophone, POS terminal, digital still camera, etc.

1 is a cross-sectional view of a liquid crystal device according to an embodiment of the present invention. 1 is a plan view of a liquid crystal device according to an embodiment. FIG. 6 is a cross-sectional view and a plan view corresponding to sub-pixels of the liquid crystal device according to the embodiment. FIG. 3 is a cross-sectional view showing a connection structure between a conductive layer and a grounding terminal of the liquid crystal device according to the embodiment. Sectional drawing which shows the connection structure of the conductive layer and grounding terminal of the liquid crystal device which concerns on a comparative example. 6 is a flowchart showing a method for manufacturing the liquid crystal device according to the embodiment. FIG. 6 is a plan view showing a manufacturing process of the liquid crystal device according to the embodiment. FIG. 6 is a plan view showing a manufacturing process of the liquid crystal device according to the embodiment. FIG. 6 is a plan view showing a manufacturing process of the liquid crystal device according to the embodiment. FIG. 6 is a plan view showing a manufacturing process of the liquid crystal device according to the embodiment. The top view of a liquid crystal device provided with the frame-shaped coating | coated member which concerns on the other example of this invention. FIG. 14 is a perspective view of an electronic apparatus to which the liquid crystal device of the invention is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 1st board | substrate, 2 2nd board | substrate, 2a One side, 4 Liquid crystal layer, 5 Common electrode, 8 Pixel electrode, 12a, 12b Polarizing plate, 13 Conductive layer, 13a End part, 20 Liquid crystal display panel, 21 Driver IC, 22 FPC, 26 conductive member, 27 grounding terminal, 27a wiring, 30 overhang area, 50, 50x covering member, 50a opening, 100, 100x liquid crystal device

Claims (9)

A first substrate;
A second substrate disposed opposite the first substrate;
An electro-optic material sandwiched between the first substrate and the second substrate;
A common electrode and a pixel electrode formed on the surface of the first substrate on the electro-optic material side;
A grounding terminal formed on the surface of the first substrate on the second substrate side of an overhanging region extending outward from one side of the second substrate;
A conductive layer formed on a surface of the second substrate opposite to the electro-optic material;
A conductive portion electrically connected to the grounding terminal in at least a part of the end portion of the conductive layer on the one side of the second substrate;
An optical member formed on the conductive layer of the second substrate excluding at least the conductive portion;
A covering member that covers at least a part of a region extending from the projecting region of the first substrate to a region where the conductive layer of the second substrate is formed,
The covering member has an opening in a region overlapping with the grounding terminal and the conducting portion,
The electro-optical device, wherein the grounding terminal and the conducting portion are electrically connected through a conductive member disposed in the opening of the covering member.   2. The electro-optical device according to claim 1, wherein the covering member is formed with a step so as to extend along the projecting region of the first substrate and the conductive layer of the second substrate. .   The electro-optical device according to claim 1, wherein the covering member does not overlap the optical member.   4. The electro-optical device according to claim 1, wherein a height of the outer surface of the covering member disposed in a region overlapping with the conductive layer is lower than a height of the outer surface of the optical member. apparatus.   The electro-optical device according to claim 1, wherein the covering member is made of an insulating material or a rigid material.   The electro-optical device according to claim 1, wherein the conductive member is a conductive paste or a conductive tape.   An electronic apparatus comprising the electro-optical device according to claim 1 as a display unit. A first substrate having a common electrode, a pixel electrode, and a grounding terminal on one surface, and a second substrate, the one surface facing the second substrate, and the grounding terminal An electro-optical panel is manufactured by sandwiching an electro-optical material between the first substrate and the second substrate, and being bonded so as to be disposed in an extended region extending outward from one side of the second substrate. Electro-optic panel manufacturing process,
A conductive layer forming step of forming a conductive layer on the surface of the second substrate opposite to the electro-optical material;
An optical member forming step of forming an optical member on the conductive layer of the second substrate except at least a conductive portion electrically connected to the grounding terminal at an end on the one side;
A covering member disposing step of disposing a covering member so as to cover at least a part of a region extending from the projecting region of the first substrate to the region where the conductive layer of the second substrate is formed;
A conductive member disposing step of disposing a conductive member in an opening formed in a region overlapping the grounding terminal and the conductive portion of the covering member, and electrically connecting the grounding terminal and the conductive portion; A method for manufacturing an electro-optical device.   9. The method of manufacturing an electro-optical device according to claim 8, further comprising a covering member removing step of removing the covering member as a next step of the conductive member arranging step.

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