JP2008285358A - Forming die for forming optical device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a forming die for forming an optical device in which fine ruggedness does not occur on the surface of a coating film formed on a forming surface and a method of manufacturing the same. <P>SOLUTION: The method of manufacturing the forming die for forming the optical device is carried out by heating a base material 2 having the forming surface 2a by a coil heater 102 and depositing the coating film comprising a material of a target 103 on the forming surface 2a by sputtering and is provided with a step for forming the forming surface 2a by processing the base material 2, a step for blocking a space between the coil heater 102 and the target 103 and a sputtering step for heating the base material 2 by the coil heater 102 and sputtering. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical element molding die in which a film is formed by sputtering and a method for manufacturing the same.

Conventionally, in a manufacturing method of a mold used for molding an optical element, a base material is heated with a heater or the like to form an intermediate layer having excellent adhesion on the molding surface of the base material, and further heat resistance is provided thereon. There is known a method (for example, refer to Patent Document 1) of obtaining a mold having a long life and hardly releasing the release film by forming an excellent release film. In addition, after forming a release film on the molding surface of the base material, polishing is performed on the release film with a polisher to eliminate the step of the grain boundary on the surface of the release film, thereby reducing the surface roughness. A method for obtaining a mold (see, for example, Patent Document 2) is also known.
JP-A-8-133762 JP 2003-277077 A

  However, in the method disclosed in Patent Document 1, since the base material is heated by a heater or the like, the temperature change of the heater and its peripheral members is remarkable, and the thin film adhering to the heater and its peripheral members is thermally expanded and contracted. Easily peels off. For this reason, there exists a problem that these thin films will mix in a molding surface as a scattered material.

  Moreover, in the method disclosed in Patent Document 2, the roughness (convex portion) of the coating film surface is removed by polishing after film formation. However, if polishing is performed in the presence of projections caused by the inclusion of the above-mentioned scattered matter or impurities, these projections peel off after polishing because the adhesion is weak, and the traces are minute dents. It becomes. This dent cannot be removed by polishing.

  These minute irregularities formed due to flying objects and impurities are transferred to the surface of the optical element at the time of molding, so in the production of optical elements that require high appearance accuracy, defective products are generated. It is the cause. In particular, in the manufacture of an optical element having a small diameter such that the optical effective diameter φ of the optical functional surface is 10 millimeters or less, even if one minute unevenness is occupied, the area ratio occupied in the optical functional surface is large, resulting in a defective product. It is easy to become.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an optical element molding die in which minute irregularities are unlikely to occur on the surface of a coating film formed on a molding surface, and a method for manufacturing the same. .

  The present invention is a method for manufacturing an optical element molding die in which a base material having a molding surface is heated by a heating mechanism, and a coating film made of a target material is formed on the molding surface by sputtering, and the base material is processed A step of forming the molding surface, a step of blocking between the heating mechanism and the target by a blocking member, and a sputtering step of performing sputtering by heating the base material by the heating mechanism. Features.

  According to the method for manufacturing an optical element molding die of the present invention, a film made of the target material is formed on the molding surface and the surface of the blocking member, and no film is formed on the surface of the heating mechanism. Therefore, the generation of scattered matter from the surface of the heating mechanism is suppressed.

  The method for manufacturing an optical element molding die of the present invention may further include a step of cleaning the blocking member after the sputtering step. In this case, even if the scattered matter adheres to the blocking member, the accumulation thereof is suppressed, so that the scattered matter is suppressed from adhering to the molding surface no matter how many times the sputtering process is repeated. In the sputtering step, the base material may be rotated by a rotation mechanism. In this case, the uneven thickness of the coating formed on the molding surface is alleviated and the film thickness becomes uniform.

  The optical element molding die may be used for manufacturing an optical element having an optical effective diameter φ of 10 millimeters or less. In this case, a mold suitable for molding a small-diameter optical element can be manufactured.

  The base material may be made of tungsten carbide (WC) or an alloy containing WC. In this case, the releasability from the molding surface of the glass material as the material of the optical element can be improved.

  The optical element molding die of the present invention is manufactured by the method for manufacturing an optical element molding die of the present invention.

  According to the mold for molding an optical element of the present invention, micro unevenness is hardly generated on the surface of the coating film formed on the molding surface. Therefore, when the optical element is molded, the micro unevenness is transferred to the surface. It is suppressed.

  According to the method for manufacturing an optical element molding die of the present invention, it is possible to manufacture an optical element molding die in which minute irregularities are hardly generated on the surface of the coating formed on the molding surface. In particular, an optical element molding die suitable for molding a small-diameter optical element or an optical element requiring high accuracy can be manufactured.

  In addition, according to the optical element molding die of the present invention, when the optical element is molded, it is possible to suppress the transfer of minute irregularities on the surface thereof. Therefore, even an optical element having a small diameter or an optical element requiring high appearance accuracy can be molded with high accuracy.

A first embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, an optical element molding die (hereinafter referred to as “mold”) 1 according to the present embodiment is formed on a molding surface 2 a of a base material 2 made of WC or an alloy containing WC. A coating 3 made of (Cr) is formed.
The mold 1 is used for molding a small-diameter optical element that requires high accuracy, for example, an optical effective diameter φ of about 10 to 5 millimeters.

  FIG. 2 is a diagram showing a sputtering apparatus used in the mold manufacturing method of the present embodiment. The base material 2 is fixed to the jig 101 with the molding surface 2a facing downward. The jig 101 is provided with a rotation mechanism (not shown) including a known mechanism such as a motor, and is configured to be able to rotate the fixed base material 2. A coil heater (heating mechanism) 102 for heating the base material 2 is disposed so as to surround the upper side and the side of the base material 2.

  The target 103 made of chromium is fixed to an installation base 104 provided below the base material 2 and is disposed to face the molding surface 2a. A plate (blocking member) 105 made of stainless steel is disposed between the target 103 and the coil heater 102 so as to block between the target 103 and the coil heater 102.

  The plate 105 may be always disposed between the target 103 and the coil heater 102, or may be disposed in a retractable state at times other than the sputtering process. In addition, the plate 105 is preferably disposed so as to be detachable from the sputtering apparatus for a cleaning operation described later.

  FIG. 3 is a flowchart showing a method for manufacturing the mold 1. The manufacturing method of the metal mold 1 includes a step of processing the base material 2, a step of blocking between the coil heater 102 and the target 103, and a sputtering step of forming the coating 3 on the molding surface 2a by sputtering. . Hereinafter, each step will be described.

First, in step S1, the base material 2 is processed into a desired shape, and a part of the surface is formed as a molding surface 2a having a predetermined diameter, curvature, and the like.
Next, in step S <b> 2, the plate 105 is disposed between the coil heater 102 and the target 103, and the coil heater 102 and the target 103 are disconnected from each other.

In step S3, while rotating the jig 101 and the base material 2 by the rotation mechanism, the base material 2 is heated by the radiant heat from the coil heater 102, and a film made of chromium is formed on the molding surface 2a by the DC sputtering method. (Sputtering process). At this time, the coating is formed only on the molding surface 2 a and the surface of the plate 105, and not on the surface of the coil heater 102.
Through the above steps, the mold 1 of this embodiment is obtained.

  When the surface appearance of the coating 3 on the molding surface 2a was observed with respect to the mold 1 produced, many minute irregularities were confirmed in the mold created by the conventional method (hereinafter referred to as the conventional mold). However, in the mold 1 of the present embodiment, the coating 3 having no minute irregularities could be obtained.

  When the plate 105 is removed from the sputtering apparatus, the film formed on the plate 105 is washed and removed, and the film formation by sputtering is repeated, no film is formed on the coil heater 102 and its surroundings, and the film formation operation is repeated. As a result, a molding surface 2a having no minute irregularities was secured.

  In addition, when a conventional mold was used to mold the optical element, the fine irregularities on the coating surface of the conventional mold were transferred to the surface of the molded optical element, resulting in an optical element with a poor appearance. Fine irregularities were not observed on the surface of the optical element molded using the mold 1 manufactured by the method of the form, and a good product level was ensured.

  According to the mold manufacturing method of the present embodiment, no coating is formed around the coil heater 102 and the periphery thereof, so that the generation of scattered matter mixed into the molding surface 2a can be suppressed. Therefore, it is possible to manufacture a mold in which minute unevenness is hardly generated on the surface of the coating.

  Moreover, since the preform | base_material 2 is formed from the alloy containing WC or WC, the mold release property with respect to glass is favorable. Therefore, it is possible to manufacture a mold suitable for molding an optical element that requires high accuracy.

  Furthermore, since the coating is formed on the molding surface while the base material 2 is rotated by the rotation mechanism, the uneven thickness of the coating can be alleviated and a uniform coating can be formed.

  In addition, since the mold according to the present embodiment has no minute unevenness on the molding surface, an optical element having no minute unevenness on the surface can be formed by transfer.

Next, a second embodiment of the present invention will be described with reference to FIGS. The differences between the present embodiment and the first embodiment described above are the material of the coating, the heating mechanism, the mode of the blocking part, and the contents of the sputtering process. In addition, about the component similar to the above-mentioned 1st Embodiment, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.
FIG. 4 is a view showing a mold 11 manufactured by the mold manufacturing method of the present embodiment. As shown in FIG. 4, the mold 11 of the present embodiment is configured by forming a coating 13 made of a platinum-iridium (Pt—Ir) alloy on the molding surface 2 a of the base material 2.

  FIG. 5 is a diagram showing a configuration of a sputtering apparatus used in the mold manufacturing method of the present embodiment. In this apparatus, two base materials 2 are fixed to the jig 101 with the molding surface 2a facing downward. A sheath heater (heating mechanism) 106 is arranged on the side of the base material 2 instead of the coil heater 102 of the sputtering apparatus of the first embodiment. A plate (blocking member) 107 made of quartz glass is disposed on the surface of the sheath heater 106 facing the base material 2, and the space between the sheath heater 106 and the target 108 made of a Pt—Ir alloy is blocked.

The mold manufacturing method of the present embodiment using the sputtering apparatus configured as described above is basically the same as the manufacturing method of the first embodiment described above. First, in step S1 shown in FIG. 3, the base material 2 is processed into a desired shape, and processing for forming the molding surface 2a is performed.
In step S <b> 2, the sheath heater 106 and the target 108 are blocked from each other, but are blocked by the plate 107 in the apparatus of this embodiment.

  In step S <b> 3, the plate 107 is heated by the sheath heater 106, and the base material 2 is heated by the radiant heat transmitted from the plate 107. Then, a film made of a Pt—Ir alloy is formed on the molding surface 2a by DC sputtering. At this time, the coating film is formed only on the molding surface 2 a and the plate 107, and not on the surface of the sheath heater 106. Thus, the mold 11 of the present invention is obtained.

  When the surface appearance of the coating 13 on the molding surface 2a was observed for the manufactured mold 11, a large number of minute irregularities were confirmed in the conventional mold, but the mold 11 of this embodiment has no minute irregularities. A coating 13 could be obtained.

  When the plate 107 was removed, the film formed on the plate 107 was washed and removed, and film formation by sputtering was repeated, no film was formed on the sheath heater 106 and its periphery, and even when the film formation operation was repeated, minute irregularities A molding surface 2a having no surface was ensured.

  In addition, when the optical element was molded using a conventional mold, the micro unevenness on the surface of the coating was transferred to the surface of the molded optical element, and an optical element with a poor appearance was generated. Fine irregularities were not observed on the surface of the optical element molded using the manufactured mold 11, and a non-defective product level was secured.

Although the embodiments of the present invention have been described above, the technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. .
For example, in each of the embodiments described above, DC sputtering is used as the sputtering method. However, any sputtering method may be used as long as it uses a target, and other sputtering methods such as RF sputtering, magnetron sputtering, and ion beam sputtering can be used. is there.

  Further, in each of the above-described embodiments, the blocking member is cleaned for each film forming operation. However, the blocking member is not necessarily cleaned. For example, the blocking member may be replaced with a new one. In addition, even when the blocking member is not cleaned or replaced, the scattered matter adhering to the surface of the blocking member hardly scatters in the sputtering process. Is secured.

It is a figure which shows the optical element shaping die of 1st Embodiment of this invention. It is a figure which shows the structure of the sputtering device used for the manufacturing method of the optical element shaping die of the embodiment. It is a flowchart which shows the manufacturing method. It is a figure which shows the optical element shaping die of 2nd Embodiment of this invention. It is a figure which shows the structure of the sputtering device used for the manufacturing method of the optical element shaping die of the embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,11 Optical element shaping die 2 Base material 2a Molding surface 3, 13 Coating 102 Coil heater (heating mechanism)
103, 108 Target 105, 107 Plate (blocking member)
106 Sheath heater (heating mechanism)

Claims (6)

A method of manufacturing an optical element molding die, wherein a base material having a molding surface is heated by a heating mechanism, and a film made of a target material is formed on the molding surface by sputtering,
Processing the base material to form the molding surface;
A step of blocking between the heating mechanism and the target by a blocking member;
A sputtering step of performing sputtering by heating the base material by the heating mechanism;
A method for producing a mold for molding an optical element, comprising:   The method for manufacturing an optical element molding die according to claim 1, further comprising a step of cleaning the blocking member after the sputtering step.   3. The method for manufacturing an optical element molding die according to claim 1, wherein in the sputtering step, the base material is rotated by a rotation mechanism.   The optical element according to any one of claims 1 to 3, wherein the optical element molding die is for manufacturing an optical element having an optical effective diameter φ of 10 millimeters or less. A method for manufacturing a molding die.   5. The method for manufacturing an optical element molding die according to claim 1, wherein the base material is made of tungsten carbide or an alloy containing tungsten carbide. 6.   An optical element molding die manufactured by the method for manufacturing an optical element molding die according to any one of claims 1 to 5.

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