JP2008282768A - Plasma display panel and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a PDP capable of shortening discharge delay, without causing the luminance to degrade and polluting protective layers. <P>SOLUTION: The PDP is a plasma display panel, having a pair of display electrodes extending on a substrate of a front face side in a substrate pair pinching a discharge space in the line direction by the line, and a dielectric layer covering it, and furthermore, having an address electrode in a direction of crossing the display electrodes; and the dielectric layer has a material retaining part between the display electrodes between the neighboring display lines, and a priming particle discharge layer is arranged in the material retaining part. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a plasma display panel (hereinafter referred to as “PDP”) and a method for manufacturing the same.

  FIG. 14 is a perspective view showing a configuration of a conventional PDP. The PDP has a structure in which a front substrate assembly 1 and a back substrate assembly 2 are bonded together. The front-side substrate assembly 1 has a plurality of display electrodes 3 made of transparent electrodes 3a and metal electrodes 3b arranged on a front-side substrate 1a made of a glass substrate, and the two display electrodes 3 forming a pair are arranged between the electrodes. The display lines are arranged with an interval at which surface discharge occurs to form a display line, and an interval (non-discharge region) at which no discharge occurs between adjacent electrodes is provided between each display electrode pair. These display electrodes 3 are covered with a dielectric layer 4. A protective layer 5 made of a magnesium oxide layer having a higher secondary electron emission coefficient is formed on the dielectric layer 4. A plurality of address electrodes 6 are arranged on the back side substrate structure 2 on a back side substrate 2a made of a glass substrate so as to be orthogonal to the display electrodes, and a light emitting region is defined between the address electrodes 6 A partition wall 7 is provided, and red, green, and blue phosphor layers 8 are formed in regions separated by the partition wall 7 on the address electrode 6. A discharge gas made of Ne—Xe gas is sealed in an airtight discharge space formed inside the bonded front-side substrate structure 1 and back-side substrate structure 2. Although not shown, the address electrode 6 is covered with a dielectric layer, and the partition wall 7 and the phosphor layer 8 are provided on the dielectric layer. The address electrode 6 may be disposed in the dielectric layer of the front substrate structure so as to intersect the display electrode.

  In such a PDP, an address discharge is generated by applying a voltage between the address electrode 6 and the display electrode 3 also serving as a scan electrode, and a voltage is applied between the two display electrodes 3 forming a pair. As a result, a reset discharge and a sustain discharge for display are generated.

The PDP is required to be driven at high speed with gradation display and recent high-definition. The PDP display includes a pixel selection period (address period) by address discharge for selecting a light emitting cell. For high-speed driving, variation in time (discharge delay) from when a voltage is applied until discharge is generated. Need to improve. As an improvement measure, in Patent Document 1, a magnesium oxide crystal layer that is excited by electron beam irradiation in a panel and emits cathodoluminescence light having a peak in a wavelength range of 200 to 300 nm is formed on the magnesium oxide protective layer. A method has been proposed.
JP 2006-54158 A

The magnesium oxide crystal layer can be formed, for example, by applying a magnesium oxide crystal dispersed in a dispersion medium on the magnesium oxide protective layer and then removing the dispersion medium. However, in this case, the used dispersion medium and impurities in the dispersion medium may contaminate the surface of the protective layer.
Further, since the magnesium oxide crystal layer does not completely transmit the light from the phosphor, there is a problem that the luminance is lowered by forming the magnesium oxide crystal layer.
The present invention has been made in view of such circumstances, and provides a PDP capable of shortening the discharge delay without lowering the brightness or contaminating the protective layer.

Means for Solving the Problems and Effects of the Invention

  The PDP of the present invention has a pair of display electrodes extending in the line direction for each display line and a dielectric layer covering the display electrodes on the front side substrate in the pair of substrates sandwiching the discharge space, and further intersects the display electrodes. The dielectric layer has a material holding portion between the display electrodes between adjacent display lines, and a priming particle emitting layer is disposed in the material holding portion. It is characterized by being.

In the PDP of the present invention, the priming particle (hereinafter referred to as “P particle”) emission layer is disposed only in the non-discharge region (non-light-emitting region) between the display lines. The discharge delay can be shortened.
In the PDP of the present invention, since the P particle emission layer is disposed in the material holding portion, the P particle emission layer can be made relatively thick. As a result, the amount of the P particle emitting material (meaning a material that emits P particles for starting discharge) to be arranged can be increased, and the discharge delay can be further reliably shortened.
In addition, the PDP of the present invention can be manufactured by a method including a step of applying a flowable material (meaning a material having flowability such as slurry or paste) containing a P particle release material. In addition, since the fluid material does not spread out of the material holding portion, it is possible to prevent contamination of the region other than the material holding portion.
Hereinafter, various embodiments of the present invention will be described.

  The surface in contact with the discharge space of the dielectric layer may be a protective layer made of magnesium oxide, and the protective layer may include the material holding portion. In this case, the dielectric layer is reliably protected.

  The dielectric layer includes a convex portion at each position between a discharge region constituting a display line defined by the display electrode pair and a non-discharge region between the display lines, and the material holding unit includes the non-discharge It is provided between the two convex portions adjacent to each other across the region. In this case, the material holding part can be easily formed.

  The priming particle emitting layer may include a magnesium oxide crystal (hereinafter referred to as “MgO crystal”). In this case, the effect of improving the discharge delay is great.

  The priming particle emitting layer may include an MgO crystal to which 1 to 10,000 ppm of a halogen element is added. In this case, the effect of improving the discharge delay lasts for a long time. The reason why the effect of improving the discharge delay lasts for a long time is not clear, but it is assumed that the added halogen element is replaced with oxygen in the MgO crystal, which becomes an electron trap and the electron emission characteristics are improved. Is done. In addition, since the effect of improving the discharge delay lasts for a long time, the discharge delay when the rest period is long can be effectively suppressed even if the amount is relatively small, leading to cost reduction.

The present invention is the above-described method for manufacturing a plasma display panel, comprising a plurality of display electrode pairs and a material holding portion between the display electrodes that cover the display electrode pairs and are adjacent to each other on the substrate. There is also provided a method of manufacturing a plasma display panel, wherein after forming a dielectric layer, a fluid material containing a priming particle emitting material is applied in the material holding part to form the priming particle emitting layer. In this case, since the flowable material does not spread out of the material holding portion, it is possible to prevent contamination of the region other than the material holding portion.
The various configurations shown here can be combined with each other.

  Hereinafter, various embodiments of the present invention will be described with reference to the drawings. The configurations shown in the drawings and the following description are merely examples, and the scope of the present invention is not limited to those shown in the drawings and the following description. In the following embodiment, a three-electrode surface discharge type PDP will be described as an example.

1. FIG. 1A to FIG. 1C show the structure of a PDP front side substrate structure according to an embodiment of the present invention, and FIG. 1A is a front view. 1 (b) and (c) are cross-sectional views taken along lines II and II-II in FIG. 1 (a), respectively.

  As shown in FIGS. 1A to 1C, the PDP front substrate structure of the present embodiment includes a front substrate 1a, a plurality of display electrode pairs 3P on the substrate 1a, and the display electrode pairs 3P. And a protective layer 5 on the dielectric layer 4. The dielectric layer 4 has a material holding portion 4b in the non-discharge region 11 between the adjacent two display electrode pairs 3P. A P particle release layer 15 is disposed in the material holding portion 4b.

  The display electrode pair 3P is composed of a scan electrode 3Y used for address discharge between two display electrodes 3, that is, an address electrode 6 arranged with a discharge slit 10 for surface discharge therebetween, and a scan electrode 3Y. And a sustain electrode 3X used for a sustain discharge or the like. Between the two adjacent display electrode pairs 3P, a slit (also referred to as a reverse slit) in which no discharge occurs between the adjacent electrodes is formed, and this non-discharge region 11 becomes a non-light-emitting region. Black stripes 13 are arranged in the non-discharge region 11. The black stripe 13 can be omitted. The display electrode 3 includes a transparent electrode 3a and a metal electrode 3b. The transparent electrode 3 a has a base portion extending in parallel to the discharge slit 10 and a T-shaped portion 3 c extending from the base portion toward the discharge slit 10. The T-shaped portion 3c has a wide portion at the tip thereof, and a discharge slit 10 is formed between the wide portions of the pair of T-shaped portions 3c facing each other. The base portion may be omitted and each T-shaped portion 3c may be connected to the metal electrode 3b. The shapes of the transparent electrode 3a and the metal electrode 3b are not limited to those shown here, and may be, for example, a ladder type or a straight type.

The dielectric layer 4 includes protrusions 4a at positions between the display electrode pair 3P formation region and the non-discharge region 11, respectively. Between the two convex portions 4a adjacent to each other across the non-discharge region 11, a material holding portion 4b is formed. The material holding part 4b is a part having a function of preventing the P particle releasing material in the material holding part 4b from flowing out. In the present embodiment, the protrusion 4a prevents the P particle release material from flowing out. In this embodiment, since the P particle emission layer 15 is disposed in the material holding portion 4b, the P particle emission layer 15 can be made relatively thick. In addition, since the material holding portion 4b is provided in the non-discharge region, there is no reduction in luminance due to the P particle emission layer 15 being disposed. In addition, the thickness of the dielectric layer 4 is smaller between the two convex portions 4a adjacent to each other with the display electrode pair 3P interposed therebetween, as compared with the portion where the convex portions 4a are disposed. For this reason, the discharge start voltage such as address discharge is lowered.
Further, instead of providing the convex portion 4a, as shown in FIG. 2, a concave portion may be formed in the non-discharge region 11, and this concave portion may be used as the material holding portion 4b. In this case, outflow of the P-particle releasing material is prevented by the side wall of the recess. In the recess, the thickness of the dielectric layer 4 is reduced, and the discharge between the display electrode 3 and the address electrode is likely to occur, and the address discharge start voltage is lowered.

  The protective layer 5 is made of a metal (more specifically, divalent metal) oxide such as magnesium oxide, calcium oxide, strontium oxide, or barium oxide, and is preferably made of magnesium oxide. The protective layer 5 is formed by vapor deposition, sputtering, coating, or the like. In this embodiment, the protective layer 5 is formed on the entire surface of the dielectric layer 4, and the P particle emission layer 15 is disposed on the material holding portion 4b via the protective layer 5. For example, as shown in FIG. In addition, a protective layer 5 having an opening at a portion corresponding to the material holding portion 4b is formed, and the P particle emission layer 15 is formed on the material holding portion 4b without passing through the protective layer 5 (that is, directly on the dielectric layer 4). You may arrange.

  The P particle release layer 15 is a layer containing a P particle release material. The P particle emission layer 15 may contain components other than the P particle emission material, may contain the P particle emission material as a main component, and may consist of only the P particle emission material. The P particle emitting material is a material that is excited by a past discharge and emits P particles (charged particles such as electrons) for starting discharge, and the type thereof is not particularly limited. The P particle releasing material is, for example, a metal (more specifically, a divalent metal) oxide crystal (for example, MgO crystal, calcium oxide crystal, strontium oxide crystal) formed by a vapor phase method shown below. Or a crystal obtained by adding a halogen element to such a crystal. Since the metal oxide crystal is similar in structure to the MgO crystal, the same effect is considered to be obtained.

  In the following, description will be given by taking as an example a case where the P particle emitting material is made of a MgO crystal added with a halogen element (hereinafter referred to as “halogen-added MgO crystal”). In addition, the MgO crystal in the following description can be used as a P particle emitting material even without being added.

  The kind of halogen element added to the halogen-added MgO crystal is not particularly limited. The halogen element is composed of one or more of fluorine, chlorine, bromine and iodine, for example. Although it has been confirmed that the effect of improving the discharge delay lasts for a long time in the case of fluorine, it is considered that the same effect can be obtained when halogen other than fluorine is added due to the similarity of the electronic state.

The addition amount of the halogen element is not particularly limited. The addition amount of the halogen element is, for example, 1 to 10000 ppm. As used herein, “ppm” is a weight concentration.
In the reference experimental example, it has been confirmed that even if the addition amount of the halogen element is changed in the range of 24 to 440 ppm, the same effect can be obtained. Therefore, the addition amount of the halogen element gives an effect of improving the discharge delay. It is considered that the influence is not great, and if the addition amount is in the range of about 1 to 10,000 ppm, the effect of improving the discharge delay is considered to last for a long time. The added amount of the halogen element is, for example, 1, 5, 10, 15, 20, 30, 40, 50, 60, 70, 80, 90, 100, 120, 140, 160, 180, 200, 250, 300, 350. , 400, 450, 500, 600, 700, 800, 900, 1000, 1500, 2000, 3000, 4000, 5000, 6000, 7000, 8000, 9000 or 10,000 ppm. The addition amount of the halogen element may be within a range between any two numerical values exemplified here. The addition amount of the halogen element can be measured by combustion-ion chromatography analysis.

  The method for producing the halogen-added MgO crystal is not particularly limited. In one example, the halogen-added MgO crystal can be produced by mixing and firing an MgO crystal and a halogen-containing substance, followed by crushing. The MgO crystal will be described later. Examples of the halogen-containing substance include magnesium halides (magnesium fluoride and the like) and Al, Li, Mn, Zn, Ca, Ce halides. Firing is preferably performed at 1000 to 1700 ° C. The firing temperature is, for example, 1000, 1100, 1200, 1300, 1400, 1500, 1600 or 1700 ° C. The firing temperature may be within a range between any two values exemplified here. The method for crushing the fired product is not particularly limited, and examples thereof include a method of putting the fired product in a mortar and grinding it with a pestle to form a powder.

  The halogen-added MgO crystal is preferably in the form of powder, and the size and shape are not particularly limited, but the average particle size is preferably 0.05 to 20 μm. This is because the halogen-added MgO crystal has a small effect of improving the discharge delay if the average particle size is too small, and the P particle emitting layer 15 is difficult to be formed uniformly if the average particle size is too large.

The average particle diameter of the halogen-added MgO crystal can be determined according to the following formula.
Formula: Average particle size = a / (S × ρ)
(Where a is a shape factor of 6, S is a BET specific surface area determined by a nitrogen adsorption method, and ρ is a true density of the halogen-added MgO crystal.)
Specifically, the average particle diameter of the halogen-added MgO crystal is, for example, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20 μm. The range of the average particle diameter of the halogen-added MgO crystal may be between any two of the numerical values exemplified as the specific average particle diameter.

  The MgO crystal has a characteristic of performing cathodoluminescence emission having a peak in a wavelength range of 200 to 300 nm by irradiation with an electron beam. The MgO crystal is preferably in a powder form, and the size and shape are not particularly limited, but the average particle diameter is preferably 0.05 to 20 μm. This is because, if the average particle size is too small, the effect of improving the discharge delay is small, and if the average particle size is too large, the P particle emission layer 15 is difficult to be formed uniformly.

The average particle diameter of the MgO crystal can be determined according to Equation 1.
Formula 1: Average particle diameter = a / (S × ρ)
(Where a is a shape factor of 6, S is a BET specific surface area determined by a nitrogen adsorption method, and ρ is a true density of magnesium oxide.)
Specifically, the average particle diameter of the MgO crystal is, for example, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7,. 8, 0.9, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20 μm. The range of the average particle diameter of the MgO crystal may be between any two of the numerical values exemplified as the specific average particle diameter.

  The production method of the MgO crystal is not particularly limited, but is preferably produced by a gas phase method in which magnesium vapor and oxygen are reacted. For example, the method described in JP-A No. 2004-182521, “Material” It can be produced by the method described in “Synthesis and properties of magnesia powder by vapor phase method” on pages 1157 to 1161 of the November 1987 issue, Vol. 36, No. 410. The MgO crystal may be purchased from Ube Materials Corporation. The production by the vapor phase method is preferable because a single crystal having high purity can be obtained when the MgO crystal is produced by the vapor phase method.

2. Method for Manufacturing PDP Front Side Substrate Assembly Next, a method for manufacturing the PDP front side substrate assembly will be described. The front-side substrate assembly for PDP can be manufactured by various methods illustrated below, and may be manufactured by a method other than the method described below.

2-1. 1st Embodiment The manufacturing method of the front side board | substrate structure for PDP of 1st Embodiment of this invention is demonstrated using Fig.4 (a)-(d). FIGS. 4A to 4D are cross-sectional views corresponding to FIG. 1B showing the manufacturing process of the PDP front side substrate structure of the present embodiment.

The manufacturing method of the PDP front-side substrate structure of this embodiment is made of a plurality of display electrode pairs 3P on the substrate 1a and a material for the non-discharge region 11 that covers the display electrode pairs 3P and is between the two adjacent display electrode pairs 3P. The dielectric layer 4 having the holding portion 4b is formed, and a flowable material 17 containing a P particle emitting material is applied in the material holding portion 4b.
Hereinafter, processes related to the method for manufacturing the front-side substrate structure for PDP according to the present embodiment will be described in detail.

2-1-1. Display Electrode Pair and Black Stripe Formation Step First, as shown in FIG. 4A, a plurality of display electrode pairs 3P and black stripes 13 are formed on a substrate 1a.

  The substrate 1a is not particularly limited, and any substrate known in the art can be used. Specifically, transparent substrates, such as a glass substrate and a plastic substrate, are mentioned.

The display electrode pair 3P is a pair of display electrodes 3 composed of a transparent electrode 3a and a metal electrode 3b. Transparent electrodes 3a, for example, ITO, to form a transparent electrode material film such as SnO _2, formed by patterning the transparent electrode material layer in the shape of the transparent electrode 3a indicated by the reference numeral 3a in FIGS. 1 (a) Can do. For the metal electrode 3b, a metal film made of, for example, Ag, Au, Al, Cu, Cr or a laminate thereof (for example, a laminated structure of Cr / Cu / Cr) or the like is formed, and this film is formed as shown in FIG. It can be formed by patterning into the shape of the metal electrode 3b indicated by reference numeral 3b in a).

  The black stripe 13 can be formed by applying a black or dark light-shielding material such as cobalt oxide, manganese dioxide, chromium oxide, or a mixture thereof to the non-discharge region 11 between two adjacent display electrode pairs 3P. .

2-1-2. Next, as shown in FIG. 4B, the material holding portion 4b is provided in the non-discharge region 11 that covers the display electrode pair 3P and the black stripe 13 and is adjacent to the two display electrode pairs 3P. The dielectric layer 4 is formed.
Specifically, the dielectric layer 4 first forms a flat dielectric layer 4c so as to cover the display electrode pair 3P and the black stripe 13, and each of the display electrode pair 3P is formed on the flat dielectric layer 4c. And the non-discharge region 11 can be formed by a method including a step of forming the convex portion 4a at each position.

  For the flat dielectric layer 4c, for example, a low-melting glass paste obtained by adding a binder and a solvent to a low-melting glass frit is applied on the substrate after the display electrode pair 3P and the black stripe 13 are formed by a screen printing method and baked. Can be formed.

  The convex portion 4a can be formed by applying a low-melting glass paste at a position where the convex portion 4a on the flat dielectric layer 4c is to be formed by a screen printing method and baking it. The flat dielectric layer 4c and the convex portion 4a may be fired individually or simultaneously. The flat dielectric layer 4c forming material and the convex portion 4a forming material may be the same or different. The flat dielectric layer 4c can also be formed using a glass sheet material containing a binder in a low melting glass frit.

  As the material for forming the convex portion 4a, it is preferable to use a softening point firing type material in order to suppress flow during firing. The softening point firing type means a low melting point glass material that is fired at a temperature near the softening point of the low melting point glass frit. Moreover, you may add fillers, such as a silicon oxide and aluminum oxide, to the convex part 4a formation material. Thereby, the flow at the time of baking can be suppressed.

2-1-3. Next, a protective layer 5 is formed on the dielectric layer 4. The protective layer 5 may be formed on the entire surface of the dielectric layer 4. For example, as shown in FIG. 3, the protective layer 5 may be formed to have an opening at a position corresponding to the material holding portion 4b.

2-1-4. Next, a fluid material 17 containing a P particle releasing material is applied in the material holding portion 4b. The fluid material 17 can be produced, for example, by dispersing the P particle releasing material in a dispersion medium such as alcohol. In this embodiment, since the fluid material 17 is applied in the material holding portion 4b, the fluid material 17 is prevented from spreading outside the material holding portion 4b, and the display electrode pair is located in a light emitting region (discharge region). Contamination of the protective film 5 with the fluid material 17 can be prevented. In addition, the fluid material 17 is normally held in the material holding part 4b by at least one action of gravity, surface tension, capillary action, and the like.

  The method for applying the flowable material 17 is not particularly limited. Application of the fluid material 17 can be performed using a fluid material ejector 19 such as a dispenser or an ink jet apparatus. Further, the fluid material 17 is applied, for example, by using the squeegee 27 with the screen mask 20 having an opening corresponding to the material holding portion 4b as shown in FIG. You may carry out by apply | coating in 4b. Further, the flowable material 17 may be applied by spraying the flowable material 17 in a state where a mask having an opening corresponding to the material holding portion 4b is disposed.

  After the flowable material 17 is applied, the P particle release layer 15 is formed by removing the dispersion medium by a method such as decompression, heating, or natural drying, and the manufacture of the front-side substrate structure for PDP of this embodiment is completed. .

2-2. Second Embodiment A method for manufacturing a front-side substrate structure for PDP according to a second embodiment of the present invention will be described with reference to FIGS. 6A to 6C correspond to the process of FIG. 4B.

  The method of the present embodiment is similar to the first embodiment, but the method of forming the convex portion 4a is different. Therefore, here, the method for forming the convex portion 4a will be mainly described.

  First, as shown in FIG. 6A, a flat dielectric layer 4c is formed so as to cover the display electrode pair 3P and the black stripe 13, and the entire surface of the flat dielectric layer 4c has photosensitivity. The convex portion forming material layer 21 is formed using the portion forming material. As the convex forming material having photosensitivity, for example, a material obtained by adding a binder made of a photosensitive resin and a solvent to a low melting point glass frit can be used.

  Next, as shown in FIG. 6B, the projection forming material layer 21 is irradiated with the exposure light 25 through the mask 23, and then developed, as shown in FIG. Protrusions 4a are formed on the dielectric layer 4c.

The flat dielectric layer 4c may be formed by the same method as in the first embodiment, or may be formed by using the same material as the convex forming material. In this case, the dielectric layer 4c is sufficiently exposed to light before forming the convex portion forming material layer 21, so that the dielectric layer 4c can withstand the development when the convex portion 4a is formed. it can.
The flat dielectric layer 4c and the convex portion 4a may be fired individually or simultaneously.

2-3. Third Embodiment Next, a method for manufacturing a PDP front substrate assembly according to a third embodiment of the present invention will be described.
The method of the present embodiment is similar to the first embodiment, but the method of forming the dielectric layer 4 is different.

  In the present embodiment, the dielectric layer 4 is formed using a transfer method. Specifically, for example, the dielectric layer 4 is filled with a dielectric layer forming material in a concave portion of an intaglio having irregularities corresponding to the shape of the dielectric layer 4, and the display electrode pair 3P and the black stripe 13 are formed. It can be formed by transferring the dielectric layer forming material in the recesses onto the substrate and then firing it. In this case, the dielectric layer 4 having the material holding portion 4b between two adjacent convex portions 4a can be formed in a single step.

  Alternatively, the flat dielectric layer 4c may be formed in advance by the same method as in the first embodiment, and the convex portion 4a may be formed on the dielectric layer 4c by a transfer method. The flat dielectric layer 4c and the convex portion 4a may be fired individually or simultaneously. Since it is preferable from the viewpoint of transfer efficiency that the flat dielectric layer 4c has a certain degree of adhesiveness when transferring the convex portions 4a, it is better to perform the baking at the same time.

2-4. Fourth Embodiment Next, a method for manufacturing a PDP front-side substrate structure according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 7 corresponds to the process of FIG.

  The method of the present embodiment is similar to the first embodiment, but the method of forming the dielectric layer 4 is different.

  In the present embodiment, as shown in FIG. 7, a flat dielectric layer 4c is formed by the same method as in the first embodiment, and then a concave portion that becomes a material holding portion 4b is formed in the non-discharge region 11 of the dielectric layer 4c. By forming it by etching or the like, the dielectric layer 4 having the material holding portion 4b can be formed. The dielectric layer 4 having the shape shown in FIG. 7 may be formed by a transfer method.

3. Structure of PDP FIGS. 8A to 8C show the structure of a PDP according to an embodiment of the present invention, FIG. 8A is a front view, and FIGS. 8B and 8C are FIG. 9 is a cross-sectional view taken along lines II and II-II in FIG.

  As shown in FIGS. 8A to 8C, the PDP according to the present embodiment includes a front side substrate assembly 1 and a back side substrate assembly 2 which are disposed to face each other. The front side substrate structure 1 and the back side substrate structure 2 are bonded to each other with a sealing material, and a discharge gas (in the airtight discharge space between the front side substrate structure 1 and the back side substrate structure 2 is formed. For example, neon mixed with several percent of xenon) is enclosed.

  The front substrate structure 1 is the same as that shown in FIGS. The back side substrate structure 2 includes an address electrode 6 that intersects (preferably orthogonally) the display electrode 3 on the back side substrate 1b, a dielectric layer 9 that covers the address electrode 6, a partition wall 7 and a phosphor on the dielectric layer 9. It has a layer 8.

The substrate 2a on the back side is not particularly limited, and any substrate known in the art can be used. Specifically, transparent substrates, such as a glass substrate and a plastic substrate, are mentioned.
The address electrode 6 can be composed of, for example, Ag, Au, Al, Cu, Cr, and a laminated body thereof (for example, a laminated structure of Cr / Cu / Cr).
The dielectric layer 9 can be formed by the same material and method as the dielectric layer 4.

The partition wall 7 can be formed by forming a partition material layer such as a low-melting glass paste on the dielectric layer 9, patterning the partition material layer by sandblasting or the like, and baking it. The partition wall 7 may be formed by other methods. In the present embodiment, the partition wall 7 has a ladder shape, and connects the first wall portion 7a provided at a position facing the convex portion 4a and two first wall portions 7a adjacent to each other with the display electrode pair 3P interposed therebetween. And the second wall portion 7b provided to do so. The second wall portion 7b is provided between a pair of two T-shaped portions 3c adjacent to each other in the direction in which the display electrode pair 3P extends. The pair of T-shaped portions 3c is composed of two T-shaped portions 3c that face each other with the discharge slit 10 interposed therebetween. Since one T-shaped portion 3c pair corresponds to one display cell, each display cell is surrounded by the first wall portion 7a and the second wall portion 7b.
As shown in FIG. 8B, at the position of the convex portion 4a, the first wall portion 7a is in contact with the protective layer 5, but normally, the upper portion of the first wall portion 7a is at the time of firing. Since it is somewhat wavy due to deformation or the like, there is some gap between the first wall 7 a and the protective layer 5. P particles from the P particle emission layer 15 move to the region where the display electrode pair 3P is located (that is, the light emitting region) through this gap, and contribute to the start of discharge. The shape of the partition wall 7 is not particularly limited, and may be, for example, a stripe shape, a meander shape, or a lattice shape.

  The phosphor layer 8 is, for example, coated with a phosphor paste containing phosphor powder and a binder in the display cell by screen printing or a method using a dispenser, and this is applied to each color (R, G, B). After repeating, it can be formed by firing.

  Various features shown in the above embodiments can be combined with each other. When a plurality of features are included in one embodiment, one or a plurality of features can be appropriately extracted and used in the present invention alone or in combination.

4). Reference Experimental Example Showing Discharge Delay Improvement Effect by Halogen-Doped MgO Crystal Hereinafter, a reference experiment example showing discharge delay improving effect by the halogen-added MgO crystal is shown.
In the following experimental examples, the effect of improving the discharge delay by arranging the MgO crystal added with fluorine (hereinafter referred to as “F-added MgO crystal”) so as to be exposed to the discharge space was examined. Moreover, it compared with the case where it arrange | positions so that the normal MgO crystal body to which fluorine is not added may be exposed to discharge space.

4-1. Production Method of F-added MgO Crystals Five types of F-added MgO crystals (referred to as samples A to E) having different F addition amounts were produced by the following method.

First, MgO crystals (product name: high-purity ultrafine magnesia (2000A) manufactured by Ube Materials Co., Ltd.) and MgF ₂ (manufactured by Furuuchi Chemical Co., Ltd., purity: 99.99%) and mortar Using a pestle, it was pulverized into powder.
Next, the aggregated and crushed MgO crystal and MgF ₂ were weighed so as to have the mixing amount shown in Table 1, and mixed with a tumbler mixer.
Next, the mixture was fired in the atmosphere at 1450 ° C. for 1 hour.
Next, the fired powder was agglomerated and pulverized to obtain powder, and F-added MgO crystals of Samples A to E were obtained.

  Next, F addition amounts of Samples A and C were measured by combustion ion chromatographic analysis. The results are shown in Table 1. Moreover, the estimated value of F addition amount of sample B, D, E estimated from the measured value of F addition amount of sample A and C was calculated | required according to the graph of FIG. In Table 1, the estimated value of the amount of F added is displayed in parentheses.

4-2. Next, the PDP having the structure shown in FIGS. 10A to 10C having the P particle release layer 15 made of the F-added MgO crystal of sample A, B, C, D or E is processed as follows. Manufactured with. FIGS. 10A to 10C are cross-sectional views showing the structure of the PDP of the reference experiment example, FIG. 10A is a plan view, and FIGS. 10B and 10C are respectively shown in FIGS. It is II sectional drawing and II-II sectional drawing in Fig.10 (a).
In addition, in order to use in a comparative example of a discharge delay test described later, a PDP is formed in the same manner using a MgO crystal (manufacturer, product name is the same as above) in which F is not added instead of the F-added MgO crystal. Manufactured under conditions.

4-2-1. Outline As shown in FIGS. 10A to 10C, the front-side substrate assembly 1 is manufactured by forming the display electrode 3, the dielectric layer 4, the protective layer 5, and the P particle emission layer 15 on the glass substrate 1a. . Further, the back-side substrate assembly 2 was fabricated by forming the address electrode 6, the dielectric layer 9, the partition wall 7, and the phosphor layer 8 on the glass substrate 2a. Next, the front side substrate structure 1 and the back side substrate structure 2 were overlapped and the peripheral edge portion was sealed with a sealing material to produce a panel having an airtight discharge space inside. Next, after exhausting the inside of the discharge space, a discharge gas was enclosed to complete the PDP.

4-2-2. Method for Forming P Particle Release Layer The P particle release layer 15 was formed in detail by the following method.
First, the F-added MgO crystal was mixed at a ratio of 2 g to 1 L of IPA (manufactured by Kanto Chemical Co., Inc., for electronic industry), dispersed with an ultrasonic disperser, and agglomerated and crushed to prepare a slurry.
Next, the P particle release layer 15 was formed by repeating the process of spraying the slurry on the protective layer 5 using a spray gun for coating and then drying by spraying dry air several times. The P particle release layer 15 was formed so that the weight of the F-added MgO crystal was ² g per m ² .

4-2-3. Other Other conditions are as follows.

Front side substrate structure 1:
Display electrode 3a width: 270 μm
Metal electrode 3b width: 95 μm
Discharge gap width: 100 μm
Dielectric layer 4: formed by coating and baking low melting point glass paste, thickness: 30 μm
Protective layer 5: MgO layer by electron beam evaporation, thickness: 7500 mm

Back side substrate structure 2:
Address electrode 6 width: 70 μm
Dielectric layer 9: formed by coating and firing a low melting glass paste, thickness: 10 μm
Thickness of the phosphor layer 8 directly above the address electrode 6: 20 μm
Material of phosphor layer 8: Zn ₂ SiO ₄ : Mn (green phosphor)
Partition 7 height: 140 μm Top width: 50 μm
The pitch of the partition walls 7 (dimension A in FIG. 10A): 360 μm
Discharge gas: Ne96% -Xe4%, 500 Torr

4-3. Next, a discharge delay test was performed on each manufactured PDP. The discharge delay test was performed using the voltage waveform for measurement shown in FIG. In the reset discharge period, a reset discharge is caused between the sustain electrode 3X and the scan electrode 3Y to reset the charge state of the dielectric layer, thereby removing the influence of the previous discharge. In the preliminary discharge period, after a specific cell was selected, a discharge was caused between the sustain electrode 3X and the scan electrode 3Y to excite the P particle emitting material. Thereafter, after a pause period of 10 μs to 50 ms, a voltage was applied to the address electrode 6 during the address discharge period, and the time from when this voltage was applied until when the discharge was actually started was measured. The time until the start of discharge was measured 1000 times, and the time when the cumulative discharge probability was 90% was defined as the discharge delay.

  The results thus obtained are shown in Table 2, FIG. 12 and FIG. FIG. 12 is a graph showing the relationship between the rest period and the discharge delay for a PDP manufactured using Sample C and a PDP manufactured using an additive-free MgO crystal. FIG. 13 is a plot of Table 2.

  As can be seen from FIG. 12, the PDP manufactured using the sample C has a shorter discharge delay even when the rest period is longer than the PDP manufactured using the additive-free MgO crystal. This means that the F-added MgO crystal, such as Sample C, lasts longer in the effect of suppressing the discharge delay than the additive-free MgO crystal. The reason why the effect of improving the discharge delay in the F-added MgO crystal persists for a long time is not necessarily clear, but the added halogen element is replaced with oxygen in the MgO crystal, which becomes an electron trap, and the electron emission characteristics are This is presumed to improve.

  Further, as apparent from Table 2 and FIG. 13, it can be seen that the change in the discharge delay is small when the F addition amount is in the range of 24 to 440 ppm. This indicates that the addition amount of the F element does not significantly affect the discharge delay improvement effect. If the addition amount is in the range of about 1 to 10,000 ppm, the discharge delay improvement effect lasts for a long time. This is thought to suggest.

(A)-(c) shows the structure of the front side board | substrate structure for PDP of one Embodiment of this invention, (a) is a front view, (b) and (c) are respectively (a It is II and II-II sectional drawing in the inside. It is sectional drawing corresponding to FIG.1 (b) which shows the structure of the front side board | substrate structure for PDP of another embodiment of this invention. It is sectional drawing corresponding to FIG.1 (b) which shows the structure of the front side board | substrate structure for PDP of another embodiment of this invention. (A)-(d) is sectional drawing corresponding to FIG.1 (b) which shows the manufacturing process of the front side board | substrate structure for PDP of 1st Embodiment of this invention. It is sectional drawing corresponding to FIG.1 (b) which shows another embodiment of the process of FIG.4 (d). (A)-(c) is sectional drawing corresponding to FIG.1 (b) which shows the manufacturing process of the front side board | substrate structure for PDP of 2nd Embodiment of this invention. It is sectional drawing corresponding to FIG.1 (b) which shows the manufacturing process of the front side board | substrate structure for PDP of 4th Embodiment of this invention. (A)-(c) shows the structure of PDP of one Embodiment of this invention, (a) is a front view, (b) and (c) are respectively I- in (a). It is I and II-II sectional drawing. In a reference experiment example, it is a graph for calculating | requiring the estimated value of F addition amount of Example sample B, D, E. (A)-(c) is sectional drawing which shows the structure of PDP of a reference experiment example, (a) is a top view, (b) and (c) are respectively I in (a). It is -I sectional drawing and II-II sectional drawing. The voltage waveform used for the measurement of the discharge delay of a reference experiment example is shown. It is a graph which shows the relationship between a rest period and a discharge delay about PDP manufactured using the sample C and PDP manufactured using the additive-free MgO crystal. It is a graph which shows the relationship between the measured value or estimated value of F addition amount, and discharge delay concerning a reference experiment example. It is a perspective view which shows the structure of the conventional PDP.

Explanation of symbols

1: Front side substrate structure 1a: Front side substrate 2: Back side substrate structure 2a: Back side substrate 3P: Display electrode pair 3: Display electrode 3a: Transparent electrode 3b: Metal electrode 3X: Sustain electrode 3Y: Scan electrode 4: Dielectric Body layer 4a: Convex part of dielectric layer 4b: Material holding part 4c: Flat dielectric layer 5: Protective layer 6: Address electrode 7: Partition 7a: First wall part 7b: Second wall part 8: Phosphor layer 9: Dielectric layer 10: Discharge slit 11: Non-discharge region (non-light-emitting region) 13: Black stripe 15: Priming particle emission layer 17: Fluid material 19: Fluid material ejector 20: Screen mask 21: Convex portion formation Material layer 23: Mask 25: Exposure light 27: Squeegee

Claims (8)

Each pair of substrates sandwiching the discharge space has a pair of display electrodes extending in the line direction for each display line, a dielectric layer covering the display electrodes, and an address electrode in a direction crossing the display electrodes. A plasma display panel,
The dielectric layer has a material holding portion between the display electrodes between the adjacent display lines,
A plasma display panel, wherein a priming particle emitting layer is disposed in the material holding portion. The plasma display panel according to claim 1, wherein a surface of the dielectric layer in contact with the discharge space is a protective layer made of magnesium oxide, and the protective layer has the material holding portion. The dielectric layer includes a convex portion at each position between a discharge region constituting a display line defined by the display electrode pair and a non-discharge region between the display lines, and the material holding unit includes the non-discharge The plasma display panel according to claim 1, wherein the plasma display panel is provided between two convex portions adjacent to each other with a region interposed therebetween. The plasma display panel according to claim 1, wherein the priming particle emitting layer includes a magnesium oxide crystal. The plasma display panel according to claim 1, wherein the priming particle emitting layer includes a magnesium oxide crystal to which 1 to 10,000 ppm of a halogen element is added. The plasma display panel according to claim 5, wherein the halogen element is fluorine. The plasma display panel according to claim 6, wherein the amount of fluorine added is 5 to 1000 ppm. It is a manufacturing method of the plasma display panel of Claim 1, Comprising:
After forming a dielectric layer having a material holding portion between the plurality of display electrode pairs and the display electrodes between the adjacent display lines on the substrate,
A method for manufacturing a plasma display panel, comprising: applying a flowable material containing a priming particle emitting material into the material holding portion in order to form the priming particle emitting layer.

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