JP2008282584A - Superconducting tape and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a superconducting tape which can prevent corrosion of the superconducting tape body portion and can be manufactured easily. <P>SOLUTION: The superconducting tape 1a is provided with a main body portion 7 of a tape shape, having a superconductor 3, a reinforcing portion 15, which is arranged at an upper surface side 7a and a bottom surface side 7b of the body portion 7 and is made of stainless steel; a tin-containing coating layer 13 for jointing the body portion 7 and the reinforcing portion 15; and a bottom layer 9, which is formed between the reinforcing portion 15 and the coating layer 13 and is made of nickel. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a superconducting tape and a method for producing the same, and more particularly to a superconducting tape having a reinforcing layer and a method for producing the same.

  Conventionally, a tape-shaped superconducting wire (superconducting tape) made of a multi-core wire in which an oxide superconductor having a Bi2223 phase or the like is coated with a sheath portion such as silver can be used at a liquid nitrogen temperature and is relatively high. Since a critical current density can be obtained and lengthening is relatively easy, application to superconducting coils and magnets is expected.

  For example, when manufacturing a superconducting coil, the superconducting tape is wound in a coil shape, and a large bending stress is applied to the superconducting tape. For this reason, the superconducting tape is required to have high mechanical strength and flexibility that can withstand external stress. In the superconducting tape, the sheath portion plays a role of ensuring mechanical strength and a role of imparting flexibility to the superconductor made of ceramic.

  However, since the sheath part also plays a role in improving electrical contact with the superconductor, the material of the sheath part cannot be freely selected, and there is a limit to improving the mechanical strength of the superconducting tape. was there. Therefore, techniques that can further improve the mechanical strength of the superconducting tape include, for example, US Pat. No. 5,801,124 (Patent Document 1) and US Pat. No. 6,649,280 (Patent Document 2). Is disclosed. Patent Documents 1 and 2 disclose a structure in which a thin plate of stainless steel is attached to one or both main surfaces of a superconducting tape and the tape and stainless steel are joined by solder.

Similarly to Patent Documents 1 and 2, for example, Japanese Patent Application Laid-Open No. 4-43510 (Patent Document 3) and Japanese Patent Application Laid-Open No. 2001-236835 disclose techniques for improving mechanical strength by attaching a metal plate to a superconducting tape. It is disclosed also in the gazette (patent document 4). Patent Document 3 discloses a structure in which a reinforcing material layer made of nickel is attached to one side of a superconducting tape, and Patent Document 4 attaches a metal tape made of silver in which an oxide is dispersed to both surfaces of the superconducting tape. The attached structure is disclosed.
US Pat. No. 5,801,124 US Pat. No. 6,649,280 JP-A-4-43510 JP 2001-236835 A

  When superconducting tape and stainless steel are joined, the chromium oxide passivation is formed on the surface of the stainless steel, and the chromium oxide passivation and solder wettability are poor, so the joining should be easy. I could not. For this reason, a superconducting tape could not be easily manufactured. Here, it is also conceivable to remove the passivation of chromium oxide by using solder containing a strongly acidic flux. However, in this case, there is a problem that the main part of the superconducting tape corrodes with time due to the flux remaining after the joining. This flux could not be removed by washing from outside after joining.

  Therefore, an object of the present invention is to provide a superconducting tape that can be easily manufactured while inhibiting corrosion of the main body of the superconducting tape and a method for manufacturing the same.

  The superconducting tape of the present invention joins a tape-shaped main body portion having a superconductor, a tape-shaped reinforcing portion made of stainless steel, disposed on at least one surface side of the main body portion, and the main body portion and the reinforcing portion. A coating layer containing tin, and a base layer made of nickel formed between the reinforcing portion and the coating layer.

  According to the superconducting tape of the present invention, a reinforcing layer is disposed on at least one surface side of the main body by forming a covering layer on the surface of the reinforcing portion and joining the covering layer and the main body using solder. Is done. Since the coating layer has good wettability with the solder, the reinforcing portion can be easily disposed on the main body without using a strong acid flux. As a result, the superconducting tape can be easily manufactured while inhibiting corrosion of the main body. In addition, by forming a base layer made of nickel, the bonding between the reinforcing portion and the coating layer can be further improved.

  A method for manufacturing a superconducting tape according to one aspect of the present invention includes a step of forming a tape-shaped main body having a superconductor, and a step of forming a coating layer containing tin on the surface of a tape-shaped reinforcing portion made of stainless steel. And a step of arranging the reinforcing portion on at least one surface side of the main body portion by joining the covering layer and the main body portion using solder.

  According to the method of manufacturing a superconducting tape according to one aspect of the present invention, since the coating layer having good wettability with solder is formed on the reinforcing portion in advance, the reinforcing portion can be easily disposed without using a strong acid flux. can do. As a result, the superconducting tape can be easily manufactured while inhibiting corrosion of the main body.

  A method of manufacturing a superconducting tape according to another aspect of the present invention includes a step of forming a tape-shaped main body having a superconductor, a step of forming a solder layer on the surface of a tape-shaped reinforcing portion made of stainless steel, and a reinforcement A step of arranging a reinforcing portion on at least one main surface side of the main body portion by joining the portion and the main body portion using a solder layer.

  According to the method of manufacturing a superconducting tape according to another aspect of the present invention, the solder layer is formed in the reinforcing portion in advance, and the reinforcing portion and the main body portion are joined using the solder layer, so that a strong acid flux is not used. The reinforcing portion can be easily disposed on the main body portion. As a result, the superconducting tape can be easily manufactured while inhibiting corrosion of the main body.

  In the superconducting tape of the present invention, preferably, the main body portion further has a sheath portion formed on the entire circumference of the superconductor.

  Preferably, in the manufacturing method, the step of forming the main body includes a step of contacting the superconductor and forming a sheath portion around the entire circumference of the superconductor.

  Thus, for example, in a superconducting tape in which a superconductor is covered with a sheath portion, such as a bismuth-based superconducting tape, corrosion inside the superconducting tape can be suppressed.

  Preferably, in the superconducting tape of the present invention, the main body portion further includes a substrate and a stabilization layer, the superconductor is formed on the substrate, and the stabilization layer is formed on the superconductor in contact with the superconductor. .

  Preferably, in the manufacturing method, the step of forming the main body includes a step of forming a superconductor on the substrate and a step of forming a stabilizing layer on the superconductor in contact with the superconductor.

  Thereby, for example, in a superconducting tape in which thin films are laminated like a RE123-based superconducting tape, corrosion inside the superconducting tape can be suppressed.

  In the superconducting tape of the present invention, preferably, the reinforcing portion is also disposed on the other main surface side of the main body portion.

  Preferably, in the above manufacturing method, in the step of arranging the reinforcing portion, the reinforcing portion is also arranged on the other main surface side of the main body portion.

  Thereby, since a main-body part can be reinforced from both main surfaces, the mechanical strength of a superconducting tape can be improved further.

In the superconducting tape of the present invention, the coating layer is preferably formed on the entire circumference of the main body.
Preferably, in the above manufacturing method, in the step of forming the coating layer or the solder layer, the coating layer or the solder layer is formed on the entire periphery of the reinforcing portion.

Thereby, wettability with a solder can be improved over the perimeter of a reinforcement part.
Preferably, in the manufacturing method, in the step of arranging the reinforcing portion, a flux containing pine resin or a water-soluble non-cleaning flux is used.

  Since these fluxes are not strongly acidic, corrosion inside the superconducting tape and adverse effects on the production equipment can be reduced.

  In the present specification, “solder” means a metal containing tin. Further, “stainless steel” means an alloy containing 10.5% or more of chromium in iron, and the stainless steel may further contain nickel.

  According to the superconducting tape and the manufacturing method thereof of the present invention, it can be easily manufactured while inhibiting the corrosion of the main body of the superconducting tape.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a partial cross-sectional perspective view schematically showing the configuration of the superconducting tape according to Embodiment 1 of the present invention. Referring to FIG. 1, superconducting tape 1 a in the present embodiment includes a main body portion 7, a reinforcing portion 15, a base layer 9, and a covering layer 13. The reinforcing portions 15 are respectively disposed on the upper surface 7 a side and the lower surface 7 b side of the main body portion 7, and are disposed along the longitudinal direction of the main body portion 7. The main body portion 7 and each of the reinforcing portions 15 are joined by a coating layer 13 made of solder.

  The main body 7 has a tape shape and includes a plurality of superconductors 3 extending in the longitudinal direction and a sheath portion 5 that covers the entire circumference of the plurality of superconductors 3. The sheath portion 5 is in contact with the superconductor 3. Each of the plurality of superconductors 3 is preferably a bismuth-based superconductor having a composition of, for example, Bi—Pb—Sr—Ca—Cu—O, and in particular, (bismuth and lead): strontium: calcium: copper A material containing the Bi2223 phase represented by an approximate atomic ratio of 2: 2: 2: 3 is optimal. The material of the sheath part 5 is made of, for example, silver or a silver alloy.

  The reinforcing portion 15 is covered with a covering layer 13 on the entire circumference, and a base layer 9 made of nickel is formed between the reinforcing portion 15 and the covering layer 13.

  Each of the reinforcing portions 15 is tape-shaped and is made of stainless steel. Thereby, the reinforcement part 15 has played the role which improves the mechanical strength of a superconducting tape. In particular, the mechanical strength of the superconducting tape is further improved by arranging the reinforcing portions 15 on the upper surface 7a side and the lower surface 7b side of the main body portion 7, respectively.

  In the above description, the case where the main body portion 7 has a structure (multi-core wire) having a plurality of superconductors 3 has been described. However, the main body portion has a structure (only a single superconductor). Core wire). Moreover, although the case where the base layer 9 and the covering layer 13 are formed on the entire circumference of the main body portion 7 is shown, when the reinforcing portion 15 is disposed on the upper surface 7a side and the lower surface 7b side of the main body portion 7, The coating layer 11 should just be formed in the part which faces the reinforcement part 15 in the upper surface 7a and the lower surface 7b at least.

  Here, as an example of specific dimensions of the superconducting tape 1a, the thickness (length in the vertical direction in the figure) of the reinforcing portion 15 is 0.02 mm, and the width (length in the horizontal direction in the figure) is 4. .2 mm. The thickness of the main body is 0.22 mm, and the width is 4.2 mm. The thickness of the underlayer 9 is 0.3 to 0.8 μm, and the thickness of the coating layer 11 is 1.0 to 2.0 μm.

  Then, the manufacturing method of the superconducting tape in this Embodiment is demonstrated using FIGS.

  First, referring to FIG. 2, the main body portion 7 is formed. Specifically, raw material powder of oxide or carbonate is mixed so that Bi, Pb, Sr, Ca and Cu have a predetermined composition ratio. By repeating the heat treatment and pulverization of this mixed powder, a precursor powder composed of a Bi2223 phase, a Bi2212 phase, and a non-superconducting phase is produced. Next, the precursor powder is filled into a metal tube. Thereafter, wire drawing is performed on the metal powder filled with the precursor powder. In this case, the wire drawing process and the intermediate softening process are repeated to obtain a clad wire covered with a metal tube using the precursor filament as a core material. Next, a plurality of clad wires are bundled and fitted again into the metal tube. Thereby, for example, a multi-core wire having 55 cores is produced. Next, the multifilamentary wire is drawn. As a result, a wire having a form in which the precursor powder of the oxide superconductor containing the Bi2223 phase is covered with the sheath portion 5 is produced. Thereafter, a plurality of rolling processes and heat treatments are repeated for the multifilamentary wire. This heat treatment is performed in an oxygen atmosphere, and the oxygen partial pressure in the atmosphere is set to 0.01 MPa or less. As a result, the precursor powder changes and becomes a superconductor 3. Moreover, a wire becomes tape-like by rolling. Through the above steps, a tape-shaped main body portion 7 having the superconductor 3 and the sheath portion 5 covering the entire circumference of the superconductor 3 is formed.

  Next, with reference to FIG. 3, the two reinforcement parts 15 which consist of stainless steel are prepared. Then, the base layer 9 is formed on the entire periphery of the reinforcing portion 15, and the covering layer 19 is formed on the entire periphery of the reinforcing portion 15 from above the base layer 9. The underlayer 9 is made of nickel. Also. The covering layer 19 is made of a metal containing at least tin, for example, solder. The underlayer 9 and the covering layer 19 are formed by, for example, a plating method or a vapor deposition method.

  Next, referring to FIG. 4, solder (not shown) is attached to the surface of each of the reinforcing portions 15 facing the main body portion 7, and each of the coating layers 19 is bonded to the main body portion 7. Thereby, the reinforcement part 15 is arrange | positioned at the upper surface 7a side and the lower surface 7b side of the main-body part 7. FIG. At this time, since the coating layer 19 is made of a metal containing tin, the coating layer 19 in a portion to which the solder is attached is melted with the solder to form one coating layer 13 (FIG. 1). Thus, since the coating layer 19 and the solder have good wettability, each of the coating layer 19 and the main body portion 7 can be easily joined.

  In addition, the solder used for joining may be made of the same material as the coating layer 19 or may be made of a different material. Moreover, you may use a flux with solder in the case of joining. Furthermore, solder may be attached to the main body portion 7 so that each of the coating layers 19 and the main body portion 7 are joined. In the case of using a flux, the flux preferably contains a non-strongly acidic flux such as a pine resin-containing flux or a water-soluble non-cleaning flux for the purpose of not adversely affecting the sheath portion 5 and manufacturing equipment. Through the above steps, the superconducting tape 1a shown in FIG. 1 is obtained.

  The superconducting tape 1a in the present embodiment includes a tape-like main body portion 7 having a superconductor 3, and tape-like reinforcing portions 15 which are disposed on the upper surface 7a side and the lower surface 7b side of the main body portion 7 and are made of stainless steel. And a covering layer 13 containing tin that joins the main body 7 and the reinforcing portion 15, and a base layer 9 made of nickel formed between the reinforcing portion 15 and the covering layer 13.

  The manufacturing method of the superconducting tape 1a in the present embodiment includes a step of forming the tape-shaped main body portion 7 having the superconductor 3, and a coating layer 19 containing tin on the surface of the tape-shaped reinforcing portion 15 made of stainless steel. And forming the reinforcing portion 15 on the upper surface 7a side and the lower surface 7b side of the main body portion 7 by joining the covering layer 19 and the main body portion 7 using solder.

  According to the superconducting tape 1a and the manufacturing method thereof in the present embodiment, since the coating layer 13 having good wettability with solder is formed on the reinforcing portion 15 in advance, the reinforcing portion 15 is formed without using a strong acid flux. It can be easily arranged. As a result, it can be easily manufactured while inhibiting the corrosion of the main body portion 7 of the superconducting tape. In addition, by forming the base layer 9 made of nickel, the bonding between the reinforcing portion 15 and the covering layer 13 can be further improved.

  Further, since the covering layer 11 is formed on the entire circumference of the main body portion 7, the wettability with the solder can be improved over the entire circumference of the reinforcing portion 15.

  Moreover, since the main body part 7 further has a sheath part 5 formed on the entire circumference of the superconductor 3, for example, a superconducting tape in which the superconductor is covered with the sheath part like a bismuth-based superconducting tape. The corrosion inside the superconducting tape can be suppressed.

  Moreover, since the base layer 9 made of nickel is further formed between the coating layer 11 and the main body 7, the resistance to the flux can be further improved.

  Moreover, the mechanical strength of the superconducting tape 1a can be further improved by arranging the reinforcing portions 15 on the upper surface 7a side and the lower surface 7b side of the main body portion 7.

(Embodiment 2)
FIG. 5 is a partial cross-sectional perspective view schematically showing the configuration of the superconducting tape according to Embodiment 2 of the present invention. Referring to FIG. 5, in superconducting tape 1 b of the present embodiment, base layer 9 (FIG. 1) is not formed, and solder layer 13 is formed in contact with reinforcing portion 15. The solder layer 13 does not cover the entire circumference of the main body portion 7 and is formed only between the reinforcing portion 15 and the main body portion 7. Further, the reinforcing portion 15 is disposed only on the upper surface 7 a side of the main body portion 7.

  Then, the manufacturing method of the superconducting tape in this Embodiment is demonstrated using FIG. 6 and FIG.

  First, the main body portion 7 shown in FIG. 2 is prepared by the same method as in the first embodiment. Next, referring to FIG. 6, the reinforcing portion 15 is prepared, and the solder layer 13 is directly formed on the surface of the reinforcing portion 15 without forming the base layer. The solder layer 13 is formed by, for example, a plating method or a vapor deposition method.

  Next, referring to FIG. 7, the reinforcing portion 15 and the main body portion 7 are joined using the solder layer 13. Thereby, the reinforcement part 15 is arrange | positioned at the upper surface 7a side of the main-body part 7. FIG. At this time, since the solder layer 13 is formed in advance on the surface of the reinforcing portion 15 having poor wettability, the reinforcing portion 15 and the main body portion 7 can be easily joined.

  Since the configuration and manufacturing method of the superconducting tape other than this are the same as the configuration and manufacturing method of the superconducting tape in the first embodiment, the same members are denoted by the same reference numerals, and the description thereof will not be repeated.

  The manufacturing method of superconducting tape 1b in the present embodiment includes a step of forming tape-like main body portion 7 having superconductor 3 and a step of forming solder layer 13 on the surface of tape-like reinforcing portion 15 made of stainless steel. And a step of arranging the reinforcing portion 15 on the upper surface 7 a side of the main body portion 7 by joining the reinforcing portion 15 and the main body portion 7 using the solder layer 13.

  According to the method of manufacturing the superconducting tape 1b in the present embodiment, the solder layer 13 is formed in advance in the reinforcing portion 15, and the reinforcing portion 15 and the main body portion 7 are joined using the solder layer 13. The reinforcing portion 15 can be easily disposed on the main body portion 7 without using a flux. As a result, it can be easily manufactured while inhibiting corrosion of the main body 7.

  In the first and second embodiments, the case where the reinforcing portion 15 and the main body portion 7 have the same width is shown. However, in the present invention, like the superconducting tape 1c shown in FIG. 8, the width of the reinforcing portion 15 (the length in the horizontal direction in the figure) may be smaller than the width of the main body portion 7, or the width of the reinforcing portion. May be larger than the width of the main body. Further, the solder layer 13 may be formed on the entire circumference of the reinforcing portion 15. Further, as in the superconducting tape 1d shown in FIG. 9, each of the reinforcing portions 15 may be arranged on each of the upper surface 7a side and the lower surface 7b side of the main body portion 7. Furthermore, an underlayer 9 made of nickel may be further formed between the reinforcing portion 15 and the solder layer 13 as in the superconducting tape 1e shown in FIG.

  In other words, in the superconducting tape of the present invention, it is sufficient that the reinforcing portion is disposed on at least one surface side of the main body portion, and the base layer may not be formed.

(Embodiment 3)
In the first and second embodiments, the case where a bismuth-based superconductor is used as the superconductor 3 of the main body portion 7 has been described. However, the superconductor in the present invention is not particularly limited, and any superconductive material can be used. In this embodiment, a case where the RE123 system is used as a superconductor will be described.

The RE123-based superconductor, the _{RE x Ba y Cu z O 7} -d, is 0.7 ≦ x ≦ 1.3,1.7 ≦ y ≦ 2.3,2.7 ≦ z ≦ 3.3 Means that. The RE of the RE123-based superconductor means a material containing at least one of a rare earth element and an yttrium element. Examples of rare earth elements include neodymium (Nd), gadolinium (Gd), holmium (Ho), and samarium (Sm). The RE123-based superconducting wire has the advantage that the critical current density at the liquid nitrogen temperature (77.3 K) is higher than that of the bismuth-based superconducting wire. Moreover, it has the advantage that the critical current value is high under low temperature and constant magnetic field. On the other hand, since the RE123-based superconductor cannot be covered with the sheath portion unlike the bismuth-based superconductor, the superconductor (superconducting thin film material) is formed on the oriented metal substrate only by the vapor phase method or the liquid phase method. It is manufactured by the method.

  FIG. 11 is a cross-sectional view schematically showing the configuration of the main body portion in the third embodiment of the present invention. Referring to FIG. 11, main body portion 29 of the present embodiment has substrate 23, superconductor 25, and stabilization layer 27. A superconductor 25 is formed on the main surface 23 a of the substrate 23 in contact with the substrate 23, and a stabilization layer 27 is formed on the superconductor 25 in contact with the superconductor 25.

  The substrate 23 is made of a metal such as stainless steel, nickel alloy (for example, Hastelloy), or silver alloy. The superconductor 25 is made of, for example, an RE123-based superconductor. The stabilization layer 27 is a layer provided for protecting the surface of the superconductor 25, and is made of, for example, silver or copper. An intermediate layer as a diffusion preventing layer may be further formed between the substrate 23 and the superconductor 25.

  The main body 29 of the present embodiment is manufactured by forming the superconductor 25 on the substrate 23 and forming the stabilization layer 27 on the superconductor 25 in contact with the superconductor 25.

  By replacing the main body portion 29 in the present embodiment with the main body portion 7 shown in FIG. 1, FIG. 5, or FIGS. 8 to 10, the same effects as in the first and second embodiments can be obtained. That is, even in a superconducting tape including a thin film superconductor, corrosion inside the superconducting tape can be suppressed.

  The embodiment disclosed above should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above embodiments but by the scope of claims, and is intended to include all modifications and variations within the scope and meaning equivalent to the scope of claims.

  The superconducting tape of the present invention is particularly suitable as a technique related to a superconducting tape containing a bismuth-based superconducting material.

It is a fragmentary sectional perspective view which shows roughly the structure of the superconducting tape in Embodiment 1 of this invention. It is sectional drawing which shows the 1st process of the manufacturing method of the superconducting tape in Embodiment 1 of this invention. It is sectional drawing which shows the 2nd process of the manufacturing method of the superconducting tape in Embodiment 1 of this invention. It is sectional drawing which shows the 3rd process of the manufacturing method of the superconducting tape in Embodiment 1 of this invention. It is a fragmentary sectional perspective view which shows roughly the structure of the superconducting tape in Embodiment 2 of this invention. It is sectional drawing which shows the 1st process of the manufacturing method of the superconducting tape in Embodiment 2 of this invention. It is sectional drawing which shows the 2nd process of the manufacturing method of the superconducting tape in Embodiment 2 of this invention. It is a fragmentary sectional perspective view which shows schematically the other structure of the superconducting tape in Embodiment 2 of this invention. It is a fragmentary sectional perspective view which shows schematically the other structure of the superconducting tape in Embodiment 2 of this invention. It is a fragmentary sectional perspective view which shows schematically the other structure of the superconducting tape in Embodiment 2 of this invention. It is sectional drawing which shows schematically the structure of the main-body part in Embodiment 3 of this invention.

Explanation of symbols

  1a to 1e Superconducting tape, 3,25 superconductor, 5 sheath part, 7,29 body part, 7a body part upper surface, 7b body part lower surface, 9 base layer, 11, 21 coating layer, 13 coating layer (solder layer), 15 reinforcement part, 19 coating layer, 23 substrate, 23a substrate main surface, 27 stabilization layer.

Claims (13)

A tape-shaped main body having a superconductor;
A tape-shaped reinforcing portion disposed on at least one surface side of the main body portion and made of stainless steel;
A coating layer containing tin that joins the main body portion and the reinforcing portion;
A superconducting tape comprising a base layer made of nickel formed between the reinforcing portion and the covering layer.   The superconducting tape according to claim 1, wherein the main body portion further includes a sheath portion formed around the entire circumference of the superconductor.   The main body further includes a substrate and a stabilization layer, wherein the superconductor is formed on the substrate, and the stabilization layer is formed on the superconductor in contact with the superconductor. 1. The superconducting tape according to 1.   The superconducting tape according to claim 1, wherein the reinforcing portion is also disposed on the other main surface side of the main body portion.   The superconducting tape according to claim 1, wherein the covering layer is formed on the entire circumference of the reinforcing portion. Forming a tape-like main body having a superconductor;
Forming a coating layer containing tin on the surface of the tape-shaped reinforcing portion made of stainless steel;
A method of manufacturing a superconducting tape comprising: a step of arranging the reinforcing portion on at least one surface side of the main body by bonding the covering layer and the main body using solder. Forming a tape-like main body having a superconductor;
Forming a solder layer on the surface of the tape-shaped reinforcing portion made of stainless steel;
A method of manufacturing a superconducting tape comprising: a step of arranging the reinforcing portion on at least one main surface side of the main body portion by joining the reinforcing portion and the main body portion using the solder layer.   The manufacturing method of the superconducting tape of Claim 6 or 7 further equipped with the process of forming the base layer which consists of nickel between the said reinforcement part and the said coating layer.   The method for producing a superconducting tape according to any one of claims 6 to 8, wherein the step of forming the main body includes a step of forming a sheath portion around the entire circumference of the superconductor in contact with the superconductor.   The step of forming the main body includes a step of forming the superconductor on a substrate and a step of forming a stabilization layer in contact with the superconductor on the superconductor. A method for producing the superconducting tape according to claim 1.   The method of manufacturing a superconducting tape according to any one of claims 6 to 10, wherein, in the step of arranging the reinforcing portion, the reinforcing portion is also arranged on the other main surface side of the main body portion.   The method of manufacturing a superconducting tape according to any one of claims 6 to 11, wherein, in the step of forming the covering layer or the solder layer, the covering layer or the solder layer is formed on the entire circumference of the reinforcing portion.   The method of manufacturing a superconducting tape according to any one of claims 6 to 12, wherein a flux containing rosin or a water-soluble non-cleaning flux is used in the step of arranging the reinforcing portion.

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