JP2008282108A5 - - Google Patents

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Publication number
JP2008282108A5
JP2008282108A5 JP2007123980A JP2007123980A JP2008282108A5 JP 2008282108 A5 JP2008282108 A5 JP 2008282108A5 JP 2007123980 A JP2007123980 A JP 2007123980A JP 2007123980 A JP2007123980 A JP 2007123980A JP 2008282108 A5 JP2008282108 A5 JP 2008282108A5
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JP
Japan
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JP2007123980A
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Japanese (ja)
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JP5024530B2 (ja
JP2008282108A (ja
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Priority to JP2007123980A priority Critical patent/JP5024530B2/ja
Priority claimed from JP2007123980A external-priority patent/JP5024530B2/ja
Publication of JP2008282108A publication Critical patent/JP2008282108A/ja
Publication of JP2008282108A5 publication Critical patent/JP2008282108A5/ja
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Publication of JP5024530B2 publication Critical patent/JP5024530B2/ja
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JP2007123980A 2007-05-08 2007-05-08 三次元集積電気回路の配線構造及びそのレイアウト方法 Active JP5024530B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007123980A JP5024530B2 (ja) 2007-05-08 2007-05-08 三次元集積電気回路の配線構造及びそのレイアウト方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007123980A JP5024530B2 (ja) 2007-05-08 2007-05-08 三次元集積電気回路の配線構造及びそのレイアウト方法

Publications (3)

Publication Number Publication Date
JP2008282108A JP2008282108A (ja) 2008-11-20
JP2008282108A5 true JP2008282108A5 (zh) 2010-06-17
JP5024530B2 JP5024530B2 (ja) 2012-09-12

Family

ID=40142891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007123980A Active JP5024530B2 (ja) 2007-05-08 2007-05-08 三次元集積電気回路の配線構造及びそのレイアウト方法

Country Status (1)

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JP (1) JP5024530B2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8796863B2 (en) 2010-02-09 2014-08-05 Samsung Electronics Co., Ltd. Semiconductor memory devices and semiconductor packages
US9483598B2 (en) * 2015-02-09 2016-11-01 Qualcomm Incorporated Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuits
JP6839395B2 (ja) * 2016-05-30 2021-03-10 国立研究開発法人産業技術総合研究所 半導体演算装置
CN109033510B (zh) * 2018-06-14 2023-10-13 佛山市顺德区中山大学研究院 基于遗传算法的三维集成电路互连线长度优化方法及装置
US20230023133A1 (en) * 2020-04-09 2023-01-26 Sony Semiconductor Solutions Corporation Signal processing device and sensing module

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS613450A (ja) * 1984-06-18 1986-01-09 Hiroshima Daigaku 三次元光結合共有メモリ集積装置

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