JP2008280232A - Joining part forming device of article to be joined and device for joining glass substrate using the same, and joining part forming method of article to be joined and method for joining glass substrate using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a joining part forming device and a joining part forming method of an article to be joined capable of forming a joining part having a high joining property when a joining part consisting of a low melting point metal is formed on the article to be joined, and to provide a device and a method for joining the glass substrate using them. <P>SOLUTION: The device for forming the joining part consisting of the low melting point metal on one surface of the body to be joined is provided with a molten metal pond forming means constituted freely movably to one surface of the body to be joined and forming the molten metal pond by supplying a molten low melting point metal on one surface of the body to be joined and a foreign body removing means whose one end part is inserted on the surface of the molten metal pond and removes the foreign body in the molten metal pond and the foreign body removing means is disposed on the rear of the moving direction of the molten metal pond forming means and moves in synchronism with the molten metal pond forming means. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention is to form a bonding portion made of a low melting point metal such as solder, metal brazing, or the like, which is an alloy of tin, silver, lead, indium or the like, on an object to be bonded such as a glass substrate, a metal substrate, or a ceramic substrate. The present invention relates to a bonding portion forming apparatus and a bonding portion forming method, and a glass substrate bonding apparatus and bonding method using them.

  In vacuum peripherals that constitute double-glazed glass (so-called pair glass) and image display devices, it is necessary to form a highly airtight space by joining glass substrates together, which is highly airtight and low outgassing. It is a typical product that requires extremely high bonding quality from the viewpoint. Hereinafter, although this invention is demonstrated taking the example of joining of a glass substrate, the application object of this invention is not limited.

  In the composite glass and the vacuum peripheral device, the glass substrates are bonded together as follows. (1) Two rectangular glass substrates are prepared. (2) A low melting point metal such as indium or solder melted along the outer peripheral edge is applied to the bonding surface of one or both glass substrates in a frame shape to form a bonding portion. (3) Position the glass substrate so that the bonding surfaces face each other. (4) The glass substrates are overlapped with each other, and two pieces of glass are bonded through the bonding portion.

  A technique related to bonding of glass substrates is described in Patent Document 1. In Patent Document 1, a metal sealing material (low melting point metal in the present invention) that directly or indirectly joins a front substrate and a rear substrate (both are glass substrates) constituting a vacuum peripheral of an image display device. In order to form a joint portion consisting of the above-mentioned front substrate and rear substrate, an apparatus for applying a molten metal sealing material while applying ultrasonic waves to the joint surface is disclosed.

  When ultrasonic waves are applied when the low melting point metal thus melted (hereinafter sometimes referred to as molten metal) is applied to a glass substrate, bubbles and foreign substances present on the surface of the glass substrate are removed by the ultrasonic wave, and the glass There is an advantage that the bonding property of the bonding interface between the substrate and the bonding portion is improved. On the other hand, the foreign matter adhering to the glass substrate, the metal oxide formed by the low-melting point metal and oxygen contained in the low-melting point metal itself constituting the joint, and other foreign matter are not removed from the molten metal. These foreign substances float in the molten metal because they have a specific gravity lighter than that of the molten metal. As a result, the foreign matter is unevenly distributed on the surface of the joint. Further, when ultrasonic waves are applied to the molten metal as described above, the molten metal is stirred very well, so that it is easy to oxidize when in contact with the air as a whole. (Generally referred to as Noro). This slot is also unevenly distributed as foreign matter on the surface of the joint for the same reason as described above.

  When two glass substrates on which a joint portion in which foreign substances are unevenly distributed are formed are overlapped and joined as described above, the joint portion and the other glass are formed when the joint portion is formed only on one glass substrate. When the bonding portion is formed on the bonding interface with the substrate and on both glass substrates, foreign matter is present at the bonding interface between the bonding portions. Such a foreign substance hinders the bondability at the bonding interface and becomes a factor that a sound bonding interface cannot be obtained. That is, when the amount of foreign matter is small, leakage occurs from the existing location, airtightness is impaired, and when the amount of foreign matter is large, joining itself becomes impossible. If this problem is formed in a non-oxidizing atmosphere, for example, in a vacuum or in an inert gas, there is a possibility that generation of noro during the molten metal coating process can be eliminated. However, the structure of the apparatus is complicated and the cost of the product is increased, and it is not a means for solving the problem of foreign matter existing in the molten metal itself.

  Patent Document 2 describes a technique for joining a wide area of two plate-like bodies with a molten brazing material. In Patent Document 2, a coating with a molten brazing material (low melting point metal in the present invention) is formed on the entire area to be brazed on one side of each of the two plate-like bodies, and formed into two plate-like bodies. The edges of the coatings with the respective molten brazing materials are brought into contact with each other, and then the coatings are rubbed together, the coatings with the molten brazing material are brought into contact and cooled, and the brazing material is solidified to be brazed. A method is disclosed.

  According to this brazing method, the coating layer composed of the molten brazing material is rubbed and joined to handle the oxide layer covering the surface of the coating, and a plate shape made of a clean brazing material that does not contain oxide. Since bonding between bodies can be realized, there is an advantage that a sound bonding interface can be obtained under the conditions described in Patent Document 2.

  However, in order to remove the oxide layer by the sliding operation of the coatings with the molten brazing material in such a brazing method, it is necessary that the brazing material itself is melted, and handling is very difficult and practical. Implementation is difficult. In addition, the thickness of the oxide layer formed on the surface of the coating with the molten brazing material is usually not constant, and the thick oxide layer may not be removed by the above-mentioned sliding operation, and the oxide layer may remain. Yes, lacks certainty. Further, for example, when the bonding portion (covered by the molten brazing material referred to in Patent Document 2) is formed in a frame shape on the glass substrate as described above, in order to remove the oxide unevenly distributed on the surface of the bonding portion, It is extremely difficult to apply the brazing method. That is, as shown in FIG. 11 (a), the brazing method disclosed in Patent Document 2 is to join a glass substrate G, which is a plate-like body, with a molten brazing material H arranged in a relatively simple shape such as a rectangular shape. In this case, the oxide layer H111 handled by the rubbing operation does not remain in the clean brazing material portion H. On the other hand, as shown in FIG. 11B, when the molten brazing material H is arranged in a frame shape, the oxide layer H111 squeezed out by the rubbing operation is in a clean brazing material portion H. Although it does not remain, the oxide layer is handled in the product frame. For this reason, for example, it cannot be applied when forming a complicated joint as in the vacuum envelope.

JP 2002-184313 A JP-A-6-114549

  The present invention has been made in view of the above-described problems of the prior art, and in the case where a bonded portion made of a low melting point metal is formed on a bonded body, the bonded body capable of forming a bonded portion with high bonding quality. It is a first object of the present invention to provide a bonding portion forming apparatus and a bonding portion forming method, and a glass substrate bonding apparatus and bonding method using them. It is a second object of the present invention to provide a bonded part forming apparatus and a bonding part forming method for an object to be bonded that can form a bonded part at low cost, and a glass substrate bonding apparatus and bonding method using them.

  1st invention concerning this invention is an apparatus which forms the junction part which consists of a low melting-point metal in one surface of a to-be-joined body, Comprising: While being comprised with respect to the one surface of the said to-be-joined body, the said to-be-joined body is comprised. A molten metal pond forming means for supplying a molten low melting point metal to one surface to form a molten metal pond, and a foreign substance removing means for removing foreign substances in the molten metal pond with one end inserted into the surface of the molten metal pond. And the foreign matter removing means is disposed behind the moving direction of the molten metal pool forming means and moves in synchronization with the molten metal pool forming means.

  According to the joined portion forming apparatus (to be abbreviated as the joined portion forming apparatus hereinafter) of the joined body of the first invention, the following effects are produced. The molten metal pond forming means forms a molten metal pond by moving on one surface of the joined body according to a predetermined path and supplying a molten low melting point metal to one surface of the joined body. The foreign matter removing means removes the foreign matter that is unevenly distributed near the surface of the molten metal pond by one end thereof inserted into the surface of the molten metal pond formed by the molten metal pond forming means. And since the foreign material removing means is arranged so as to be movable in synchronization with the molten metal pond forming means behind the moving direction of the molten metal pond forming means, the foreign materials unevenly distributed near the surface of the molten metal pond are It is removed by the foreign matter removing means. As a result, it is possible to form a bonded portion on the surface serving as the bonding interface, in which there is almost no foreign matter that hinders bonding properties.

  In the joining portion forming apparatus of this aspect, the molten metal pond forming means supplies a molten metal supply portion that supplies a molten low melting point metal to one surface of the object to be joined, and an ultrasonic wave that applies ultrasonic waves to the molten metal supply portion. This is a preferred mode when it is constituted by a molten metal supply means provided with a generating part. This is because when an ultrasonic wave is applied to the molten metal in order to remove bubbles and foreign matters on the glass substrate, a new oxide is easily generated in the molten metal pond as described above.

  A second invention according to the present invention is an apparatus for forming a joint made of a low melting point metal on one surface of a member to be joined, and is configured to be movable with respect to one surface of the member to be joined. A molten metal pond forming means for heating a low melting point metal disposed on one surface to form a molten metal pond, and a foreign matter removing means for removing a foreign substance in the molten metal pond with one end inserted on the surface of the molten metal pond The foreign matter removing means is disposed rearward with respect to the moving direction of the molten metal pond forming means, and moves in synchronization with the molten metal pond forming means. . The difference between the joint forming apparatus of the second invention and the joint forming apparatus of the first invention is that the molten metal pond forming means forms a molten metal pond by heating the low melting point metal. The relationship between the foreign matter removing means, the molten metal pool forming means, and the foreign matter removing means is the same as that of the joining portion forming apparatus of the first invention.

  According to the joining part forming apparatus of the second invention, the molten metal pond forming means forms the molten metal pond by heating the low melting point metal previously arranged on one surface of the joined object. About the effect | action after that, it is the same as the junction-part formation apparatus of the said 1st invention.

  In the joining part forming apparatus of the second invention, the molten metal pond forming means preferably has a heating part for locally heating the low melting point metal. For example, in the aerobic atmosphere, rather than heating the low melting point metal placed on the object to be joined entirely to form the molten metal pond, the low melting point metal is locally heated and the molten metal pond is locally provided. This is because the chance of the molten metal being oxidized is reduced and the formation of a new oxide in the molten metal pond can be suppressed. The heating unit is preferably composed of a device capable of generating a high energy beam such as a laser capable of precise control of a heating range and a heating temperature.

  In the joining part forming apparatus, the distance between the edge of one end of the foreign matter removing means inserted into the molten metal pond and the top of the surface of the molten metal pond is less than 70% of the height of the molten metal pond. Is desirable. Moreover, when it becomes 70% or more, the shape of the molten metal pond cannot be maintained. That is, the shape of the molten metal pond is held by a thin oxide film formed on the surface thereof, and when it reaches 70% or more, the oxide film is broken and the molten metal in the molten metal pond leaks out. The shape of the pond cannot be maintained. This oxide film is also a kind of foreign matter, but the oxide film existing within the above range is removed by the foreign matter removing means, and a clean new surface is exposed, so that the bonding property of the joint portion is not hindered.

  It is desirable that the edge of the one end portion of the foreign matter removing means has a shape substantially corresponding to the shape of the surface of the molten metal pond. This is because foreign matters can be removed without impairing the shape of the molten metal pond.

  The foreign matter removing means includes a foreign matter removing portion that removes foreign matter from the molten metal pond while one end is inserted into the molten metal pond and rotates, and a foreign matter that is disposed above the molten metal pond and adheres to the outer peripheral surface of the foreign matter removed portion. It is desirable to have a foreign matter collection part to collect. By providing this foreign matter removing means, foreign matter can be removed continuously, which is particularly advantageous for automation of the apparatus.

  It is preferable that at least a portion of the foreign matter removing portion that is in contact with the molten metal pond is made of a material that does not contaminate the molten metal pond in order not to impair the bondability of the bonded portion due to the mixing of impurities. In particular, it is suitable if it is made of carbon or ceramics.

  It is desirable to form a trapping surface for trapping foreign matter so that the foreign matter can be easily removed. From the viewpoint of foreign matter trapping properties, it is preferable that the adhesion surface has an irregular shape. Furthermore, a substantially mesh shape is preferable because the trapping property is the highest.

  The junction forming apparatus is effective when the foreign matter described above contains a metal oxide mainly composed of a low melting point metal, that is, when a metal oxide is formed in the process of forming the junction.

  The joining part forming apparatus is effective when the joined body is a glass substrate and the low melting point metal is Sn—Ag—Al solder. This is because it is desirable to form the bonding portion in an aerobic atmosphere in order for the bonding portion made of Sn—Ag—Al solder to be bonded to the glass substrate.

  3rd invention concerning this invention is a joining apparatus of the glass substrate which joins a pair of glass substrate which has the said junction part formation apparatus. According to this joining apparatus, the glass substrate in which the joined part with few foreign substances in the surface formed by the said joined part formation apparatus was formed is manufactured. Then, by bonding the glass substrates to each other and bonding them, a bonding interface having high bonding quality can be realized between the bonding portion and the glass substrate or the bonding portion. With this bonding apparatus, it is possible to provide a highly airtight multilayer glass, a vacuum envelope of an image display apparatus, or the like.

  A fourth invention according to the present invention is embodied by the joint forming apparatus of the first invention. That is, a method of forming a joint made of a low melting point metal on one surface of a joined body, supplying a molten low melting point metal to one surface of the joined body to form a molten metal pond and foreign matter in the molten metal pond This is a method for forming a bonded portion of a body to be bonded. Here, if a low melting point metal is supplied while applying an ultrasonic wave, bubbles and foreign substances existing at the interface between the molten metal pond and the object to be bonded are removed, and the bondability at the interface is enhanced. And the foreign material produced by the stirring of the molten metal by an ultrasonic wave is removed.

  The fifth invention according to the present invention is embodied by the joint forming apparatus of the second invention. That is, a method of forming a joint made of a low melting point metal on one surface of a joined body, wherein the low melting point metal disposed on one surface of the joined body is heated to form a molten metal pond and in the molten metal pond This is a method for forming a bonded portion of a bonded body for removing foreign matter. Here, it is desirable to form the molten metal pool by locally heating the low melting point metal. This is because the opportunity for oxidation of the molten metal is reduced, and formation of new oxides in the molten metal pond can be suppressed.

  In the method for forming a bonded portion of the bonded body according to the above aspect (hereinafter, sometimes abbreviated as a bonding portion forming method), it is desirable to remove foreign matters in the surface layer portion of the molten metal pond. This is because it is sufficient to remove the foreign matter existing in the surface layer portion in order to ensure the bonding property at the bonding interface, and the shape of the molten metal pond can be maintained without breaking.

  The junction forming method is effective when the above-described foreign matter includes a metal oxide mainly composed of a low melting point metal, that is, when a metal oxide is formed in the process of forming the junction.

  The bonding part forming method is effective in the case where the bonded object is a glass substrate and the low melting point metal is Sn—Ag—Al solder. This is because it is necessary to form the joint in an aerobic atmosphere in order for the joint made of Sn—Ag—Al solder to be joined to the glass substrate.

  A sixth invention according to the present invention is embodied by the joining device of the third invention. That is, a bonding portion forming step of forming a bonding portion made of Sn-Ag-Al solder on each surface of a pair of glass substrates, and a bonding step of bonding glass substrates to each other by overlapping the surfaces on which the bonding portions are formed. It is the bonding method of the glass substrate containing.

  In the bonding part forming step, the thickness of the bonding part formed on one glass substrate is formed thinner than the bonding part formed on the other glass substrate, and the surface of the glass substrate with respect to the direction in which gravity acts in the bonding process It is desirable to place the other glass substrate on the lower side while arranging them vertically. When joining glass substrates, it is necessary to melt the joints formed on both glass substrates and to superimpose the melted joints, but at that time the shape of the joints of the glass substrate placed above will collapse It is because it can prevent.

  Furthermore, it is desirable that the bonding portion forming step be performed in an aerobic atmosphere and the bonding step be performed in a low oxygen atmosphere. In order for the bonding portion made of Sn—Ag—Al solder to be bonded to the glass substrate, it is desirable to form the bonding portion in an aerobic atmosphere. And it can suppress the production | generation of the oxide layer in the surface of a junction part by making a joining process into a low oxygen atmosphere, and can ensure the bondability in a joining interface. Note that the bonding step is more preferably performed in a substantially oxygen-free atmosphere, and a vacuum atmosphere or a reducing atmosphere is preferable.

  In addition, in order to remove bubbles in the joint after the joint formation process or before the joint process, the melt is maintained by placing the joint in a melted state by maintaining a molten state or by reheating in a vacuum atmosphere. It is preferable to provide a step (defoaming step) for removing air bubbles from the joint portion in the state because the airtightness of the joint portion can be improved.

In the joining part forming apparatus or joining part forming method, the joining part can be formed by appropriately treating the molten metal pond after the foreign matter is removed. For example, the molten metal pond can be cooled to form a solid joint. Moreover, a liquid joining part can be formed by heating a molten metal pond via a to-be-joined body and maintaining the molten state.
When forming joints in an aerobic atmosphere, supply inert gas (argon, nitrogen, etc.) around the molten metal pond to suppress the formation of metal oxides on the surface of the molten metal pond. Thus, a low oxygen atmosphere or an oxygen-free atmosphere can be obtained. In addition, after the foreign matter is removed from the molten metal pool, an inert gas (argon, nitrogen, etc.) is supplied to the vicinity of the joint to prevent the formation of metal oxide on the surface of the joint. A low oxygen atmosphere or an oxygen-free atmosphere can be obtained.

  As is apparent from the description of the first to sixth inventions related to the present invention, since it is configured as described above according to the present invention, in the case of forming a bonded portion made of a low melting point metal in the bonded object, A joining portion forming apparatus and joining portion forming method for a joined body that can extremely reduce the amount of foreign matter existing on the surface of the joining portion that becomes a joining interface and can form a joining portion having high joining quality. The used glass substrate bonding apparatus and bonding method can be provided. Further, according to the present invention, it is not necessary to form a joint in an oxygen-free atmosphere in order to prevent the generation of a metal oxide composed of a low melting point metal and oxygen, and the joined body can form the joint at a low cost. The bonding part forming apparatus and the bonding part forming method, and the glass substrate bonding apparatus and bonding method using them can be provided.

  Hereinafter, the present invention will be described based on the embodiments. In addition, this invention is not limited to the following embodiment, Moreover, the component in each embodiment can be combined arbitrarily.

(First embodiment)
A bonding portion forming apparatus and a bonding portion forming method according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a diagram for explaining the basic gist of the present invention, and is a schematic configuration diagram of a joining portion forming apparatus according to a first aspect. FIG. 2 is a partially enlarged view of FIG. 1 and a side view thereof. In addition, since the junction part formation apparatus of the embodiment concerning this invention including other embodiments explained below joins rectangular glass substrates G1 and G2 shown in Drawing 10 (b) (d), it is a glass substrate. Joining portions H1 and H2 made of Sn-Ag-Al solder (hereinafter referred to as solder) are formed in a frame shape along the outer peripheral edge of G1 and G2. This solder is inexpensive because it does not contain In, is environmentally friendly because it does not contain lead, and is excellent in bondability and hermetic sealing with an object to be joined including an oxide such as a glass substrate, It is suitable for bonding and sealing of glass substrates.

  The joint forming apparatus 10 of the first embodiment is used in the air, that is, in an aerobic atmosphere, and is configured as follows. Reference numeral 11 is a molten metal pond forming means, and reference numeral 113 is a storage container for storing molten solder H as a base material for forming a solder layer. The storage container 113 closes a substantially circular outer shell 119 having a container heating element 117 that maintains the molten state of the molten solder H, and a connection port to which an upper opening of the outer shell 119 is closed and a pressure control unit 14 described later is connected. And a lid 114 having 115. Here, the container heating element 117 is connected to the heating control unit 15 to control the amount of heat generation. The container heating element 117 can be used not only for maintaining the molten state of the molten solder H but also for melting solid phase solder as a raw material.

  Reference numeral 111 denotes a substantially circular nozzle (supply unit) that supplies the molten solder H that is connected to the lower opening (downstream side) of the outer shell 119 and stored in the storage container 113 to the surface of the glass substrate G. . Around the nozzle 111, a coil-shaped nozzle heating element 116 is provided so that the molten solder H flowing therethrough does not solidify. The nozzle heating element 116 is connected to the heating control unit 15, and the amount of heat generation is appropriately controlled. In addition, as a preferable aspect, the front-end | tip part 112 of the nozzle 111 of a 1st embodiment is formed with the recessed part which is not shown in figure so that the molten metal pond H1 consisting of the supplied molten solder may be formed. By forming the molten metal pond H1 having an appropriate size, it is possible to always secure molten solder necessary for forming the joint H2, and to form the joint H2 without breaks or rubbing.

  Reference numeral 14 denotes a pressure control unit connected to the connection port 115 via a pipe line 118. Specifically, the pressure control unit 14 controls the pressure and flow rate of the gas g that pressurizes and decompresses the molten solder H stored in the storage container 11, and basically discharges the molten solder H from the distal end portion 112. The ON / OFF control of the operation and the flow rate and discharge pressure of the molten solder H supplied from the nozzle 111 are adjusted so as to be a desired amount. By setting it as such a structure, the magnitude | size of the molten metal pond H1 can always be made constant. The gas g for pressurizing the molten solder H stored in the storage container is desirably an inert gas such as argon gas or nitrogen gas in order to prevent excessive oxidation of the molten solder H. The method for discharging the molten solder H is not limited to the above. For example, a rod that can move in close contact with the inner wall of the outer shell 119 is provided in the upper opening of the outer shell 119, and the molten solder is pushed and pulled. It is good also as a structure which discharges H from the nozzle 111. FIG.

  The molten metal pond forming means 11 is incorporated in a moving means (not shown), and the upper side of the glass substrate G is a horizontal axis (X axis), a vertical axis (Y axis) and the surface of the glass substrate G. On the other hand, it is configured to be freely movable on a vertical axis (Z axis). Accordingly, the supply means 11 can apply the molten solder H in an arbitrary pattern on the glass substrate G while maintaining the gap between the tip 112 of the nozzle 111 and the surface of the glass substrate G at an appropriate size. It is possible, and the junction part H2 of a desired shape can be formed on the surface of the glass substrate G.

  Reference numeral 13 denotes a flat plate-like heating element that is disposed below the glass substrate G and heats the glass substrate G to about 200 to 350 ° C., which is the same temperature as the molten solder H. According to this heating element 13, by heating the glass substrate G to the same level as the temperature of the molten solder H, it is possible to prevent the molten metal pond H1 caused by the molten solder supplied to the glass substrate G from solidifying. preferable.

  Reference numeral 12 denotes a flat foreign matter removing means in the first embodiment. As shown in FIGS. 2A and 2B, the foreign matter removing means 12 is configured with a width W that can include the molten metal pond H1 in the width direction, and a lower end (one end) 125 of the molten metal pond H1. A predetermined depth h1 is arranged on the surface so that it can be inserted. Further, the foreign matter removing means 12 is a fixing member (not shown) extending from the molten metal pond forming means 11 and has a predetermined rear side of the molten metal pond forming means 11 with respect to the traveling direction of the molten metal pond forming means 11 indicated by the symbol A in the figure. It is fixed to be in a positional relationship. That is, the foreign matter removing means 12 is configured to be able to move in synchronization with the movement of the molten metal pond forming means 11.

  Here, it is desirable that the insertion depth h1 from the top of the molten metal pond H1 at the lower end of the foreign matter removing means 12 is set to less than 70% with respect to the height h of the molten metal pond. When the insertion depth h1 is 70% or more, the metal oxide layer that is formed very thin on the surface of the molten metal pond H11 and maintains the shape of the molten metal pond H1 is removed, and the shape of the molten metal pond H1 is There is a possibility that the joint H2 having a desired shape cannot be formed. The metal oxide layer that is thinly formed on the surface of the molten metal pond H1 is also a foreign matter that hinders the bondability of the joint H2, but there is no problem because it is removed from the surface of the joint H2 by the foreign matter removing means 12. . In order to surely remove the foreign matter H11, it is more desirable that the insertion depth h1 of the foreign matter removing means 12 is 30% or more.

  The foreign matter removing means 12 of this embodiment is plate-shaped and is arranged such that the angle θ formed by the capturing surface 121 which is the front surface in the traveling direction A and the surface of the molten metal pond H1 is 90 ° or less. Here, the shape of the lower end portion 125 of the foreign matter removing means 12 is the shape shown in FIGS. 2C and 2D in addition to the shape having the linear edge as shown in FIGS. be able to. That is, the lower end portion 125b of the foreign matter removing means 12b shown in FIGS. 2 (c) and 2 (d) is formed with a concave edge so as to substantially correspond to the convex shape having the curvature of the surface of the molten metal pool H1. . By forming the lower end portion of the foreign matter removing means 12b in such a shape, the joint portion H2 can be formed without impairing the shape of the molten metal pool H1. In the case of the foreign matter removing means 12b as described above, the insertion depth h1 with respect to the molten metal pond H1 is in the same range as described above.

  As shown in FIG. 3, it is desirable that the foreign matter removing means 82 be disposed in a state in which the capture surface 821 intersects the surface of the metal molten pool H1 at an angle θ greater than 90 °, and the capture surface 821 is substantially the same. If it is arranged in a state of intersecting at an angle θ larger than 135 ° so as to be close to the horizontal, it is desirable because the trapping efficiency of the foreign matter H11 can be increased. By arranging the foreign matter removing means in this way, the foreign matter H11 once captured by the foreign matter removing means 82 does not fall again into the molten metal pond H1, and the foreign matter H11 can be reliably removed from the molten metal pond H1. . That is, the foreign matter H11 scraped off by the foreign matter removing means 82 rides on the inclined catching surface 821, is placed on the catching surface 821, and does not fall again on the molten metal pond H1. Further, even if the foreign matter H11 is generated on the entire surface of the molten metal pond H1, the foreign matter H11 once placed on the catching surface 821 has traveled on the catching surface 821 by the movement of the foreign matter removing means 82. Further, it is pushed up by the subsequent foreign matter H11 and moves upward on the capturing surface 821, but the state where it is still placed on the capturing surface 821 can be maintained. Accordingly, even when the long joint portion H2 is formed, the captured foreign matter H11 does not fall into the molten metal pond H1. Further, as shown in FIG. 3, in order to collect the scraped foreign matter H11 from the foreign matter removing means 82, a foreign matter removing tank 824 is disposed below the upper end of the foreign matter removing means 82, so that the foreign matter removing means 82 is mischievous. The foreign matter H11 can be removed from the molten metal pond H1 without increasing the length.

  The foreign matter removing means 12 can be made of various materials, but is preferably made of a material that does not elute into the molten solder and does not contaminate the molten metal pond H1. For that purpose, it is necessary to have a melting point higher than that of the molten solder and not to be eroded by the molten solder. Any material that satisfies these conditions can be used as the material constituting the foreign matter removing means 12, and for example, a metal material such as iron or aluminum, or a non-metal material such as ceramic or carbon can be selected. In particular, ceramics and carbon are suitable as materials that do not contaminate the molten metal pond H1. In addition, the whole foreign material removal means 12 does not need to be comprised with the said material, and only the lower end part 125 which contacts the molten metal pond H11 directly may be comprised with the said material.

  Furthermore, it is preferable that the foreign matter removing means 12 includes a capturing surface that can easily capture the foreign matter H111. The specific configuration of the capture surface will be described in detail in the joint forming apparatus of the second embodiment described below.

  The operation when the molten solder H is applied using the joint forming apparatus 10 having the above-described configuration will be described with reference to FIG. After the solid solder lump is stored in the storage container 113 and the upper opening of the outer shell 119 is sealed with the lid 114, the inside of the storage container 113 is depressurized by the pressurization / decompression controller 14 and the container heating element 117 is heated. The solder lump stored in the storage container 113 is melted to maintain the molten state of the molten solder H. At the same time, the nozzle heating element 116 is heated to preheat the nozzle 111 to a predetermined temperature.

  Next, the molten metal pool forming means 11 is moved in the Z-axis direction by a moving means (not shown) to a position where a predetermined gap (gap) is formed between the nozzle tip 112 and the surface of the glass substrate G. At this time, the foreign matter removing means 12 is arranged such that its lower end 125 can be inserted into the molten metal basin H1 by a depth h1 set from the top of the molten metal basin H1.

  When a gas g having a predetermined pressure and flow rate is supplied from the pressurization / decompression control unit 14 to the storage container 113, a predetermined amount of molten solder H is discharged from the nozzle tip 112. Here, since the nozzle 111 is heated by the nozzle heating element 116, the molten solder H is smoothly supplied to the surface of the glass substrate G without solidifying the clogged molten solder H in the passage. A molten metal pond H1 is formed.

  Almost simultaneously with supplying the molten solder H to the glass substrate G, the molten metal pool forming means 11 is moved horizontally in the direction of arrow A along the X and Y axes by a moving means (not shown). The molten metal pond H1 is continuously formed by the supply position of the molten solder H supplied from the nozzle 111 moving in the A direction. In addition, the foreign substance removing means 12 configured to move in synchronization with the molten metal pond forming means 11 moves in the A direction as the molten metal pond forming means 11 moves. Here, since the lower end portion 125 of the foreign matter removing means 12 is disposed so as to be insertable into the surface of the molten metal pond H1, as shown in FIGS. 2 (a) and 2 (c), the surface of the molten metal pond H1. The foreign matter H11 containing the metal oxide or the like present in the metal is removed by scraping while moving. And the junction part H2 is formed of the molten metal pond H1 from which the foreign material H11 was removed. The state of the formed joint portion H2 is not particularly limited. For example, in the case of the bonding portion forming apparatus 10 in FIG. 1, the bonding portion H <b> 2 is in a molten state because it is heated by the heating element 13. It can be joined to the other glass substrate while maintaining this molten state. Moreover, it can be set as the solidification state by cooling the formed junction part H2.

  When the molten metal pool forming means 11 is moved along the edge of the inside of the outer periphery of the glass substrate G, a frame-shaped joint H2 is formed on the surface of the glass substrate G. And since the foreign material H11 which exists in the surface of the molten metal pond H1 is removed by the said foreign material removal means 12, it will be in the state in which the foreign material H11 which inhibits bondability does not exist in the surface of this frame-shaped junction part H2. ing. When the foreign matter removing means 12 of this aspect is used, the scraped foreign matter H11 is accumulated at the lower end portion 125 thereof. The accumulated foreign matter H11 may be removed at an appropriate time.

(Second embodiment)
A joining portion forming apparatus and joining portion forming method according to a second embodiment of the present invention will be described with reference to FIGS. 4, 7, and 8. FIG. 4 is a schematic configuration diagram of the joining portion forming apparatus of the second aspect, and FIGS. 7 and 7 are an enlarged front view and an enlarged side view of FIG. 4, illustrating the foreign substance removing means constituting the joining portion forming apparatus. FIG. 4, 6, and 7, the same components as those in the first embodiment of the joint forming apparatus 10 are denoted by the same reference numerals, and detailed description thereof is omitted (the same applies to other embodiments below). .)

  The configuration of the bonding portion forming apparatus 20 of the second aspect is basically the same as that of the bonding portion forming apparatus 10 of the first aspect, and only the configuration of the foreign matter removing means 22a is different. That is, the joining part forming apparatus 20 includes the molten metal pond forming means 11 and the foreign matter removing means 22a.

  In the foreign matter removing means 22a, reference numeral 221a is a foreign matter removing portion. As shown in FIG. 7A, the foreign matter removing portion 221a is an endless belt stretched by a rotatable support roller 222, and its lower end portion 2211a has a predetermined depth on the surface of the molten metal pond H1. It is arranged so that it can only be inserted. And the foreign material removal part 221a is comprised so that it may rotate along the arrow B in FIG. 4 with the support roller 222 rotated by the rotation drive means which is not shown in figure.

  Reference numeral 223 is a foreign substance removal scraper disposed above the molten metal pond H1 so as to contact the outer peripheral surface of the foreign substance removal part 221a, and reference numeral 224 is a foreign substance recovery tank disposed on the downstream side of the scraper. . The foreign matter removing scraper 223 and the foreign matter collecting tank 224 constitute a foreign matter collecting unit 226.

  According to the foreign matter removing means 22a configured as described above, the foreign matter H11 present on the surface of the molten metal pool H1 adheres to the lower end portion 2211a of the foreign matter removing portion 221a. The foreign matter H11 adhering to the lower end portion 2211a moves toward the foreign matter removal scraper 223 when the foreign matter removal portion 221a rotates in the direction of arrow B. The foreign matter removing scraper 223 continuously removes the foreign matter H11 adhering to the surface of the foreign matter removing portion 221a and stores the foreign matter H11 in a foreign matter collecting tank 224 disposed on the downstream side. Accordingly, the foreign matter removing means 22a can continuously remove the foreign matter H11 generated on the surface of the molten metal pool H1 that is continuously formed. The configuration of the foreign matter removing unit is not limited to the foreign matter removing scraper 223 and the foreign matter removing tank 224. For example, a configuration in which the foreign matter H11 is sucked and removed from the surface of the foreign matter removing unit 221a, a configuration in which air is blown away, and the like are applied. can do.

  The foreign matter removing portion 221a of the foreign matter removing means 22a has a foreign matter H11, and in particular, a foreign matter as a preferred configuration that can more reliably remove metal oxides that have a certain area on the surface of the molten metal pool H11 and deteriorate the bonding quality. A mesh-like capturing surface 227a for capturing H11 is formed. By adding the mesh-like capturing surface 227a to the foreign matter removing portion 221a, the foreign matter H11 can be more reliably captured by the wire constituting the mesh. Note that the capture surface 227a can be configured by appropriately processing, for example, a band made of a metal or carbon wire mesh. The size of the mesh (mesh size) can be appropriately set according to the generated foreign matter H11. For example, the mesh size may be made dense like a capturing surface 227b of the foreign matter removing unit 221b shown in FIG. Further, the foreign substance removing unit 221a itself can be formed in a mesh shape. In this way, when the foreign material removal part 221a moves in the molten metal pond H11, the molten solder in the molten metal pond H11 flows smoothly through the mesh, so the foreign material H11 does not impair the shape of the molten metal pond H11. There is an advantage that can be removed.

  FIGS. 7C and 7D show another form of the capture surface. A foreign matter removing portion 221c shown in FIG. 7C is formed with a capturing surface 227c composed of a concave 2271c and a convex 2272c. According to the capturing surface 227c, the foreign matter H11 can be more reliably captured by the protrusion 2272c. A trapping surface 227d made of a rough surface is formed in the foreign substance removing portion 221d shown in FIG. According to the capturing surface 227d, the foreign material H11 can be captured more reliably by the rough surface.

  FIG. 8 shows a foreign matter removing unit 22e configured in a form corresponding to the foreign matter removing unit 12b described in FIGS. 2C and 2D in the second mode. That is, the foreign matter removing unit 221e of the foreign matter removing unit 22e is formed of an endless belt, and the concave portion 2221e of the support roller 222e that stretches the foreign matter removing unit 221e is provided with the concave concave portion 2222e. The lower end 2211e of 221e is made to follow the shape of the concave 2222e, and its edge is formed in a concave shape so as to substantially correspond to the convex shape having the curvature of the surface of the molten metal pond H1. By forming the lower end portion 2211e of the foreign matter removing portion 221e in such a shape, the foreign matter H11 is continuously removed without impairing the shape of the molten metal pool H1, and the joined portion having no foreign matter H11 on the surface serving as a joining interface. H2 can be formed.

(Third embodiment)
A joining portion forming apparatus and joining portion forming method according to a third embodiment of the present invention will be described with reference to FIG.

  The joining part forming apparatus 30 of the third aspect is an example in which the molten metal pond forming means 11 of the joining part forming apparatus 20 of the second aspect is replaced with another aspect, and the configuration of the foreign matter removing means 22a is the joining part forming apparatus. 20 is the same.

  The molten metal pool forming means 31 of the joint forming apparatus 30 is configured as follows. Reference numeral 311 denotes a heating unit that heats and melts the solder H, and a molten metal pond H1 is formed by the solder heated and melted by the heating unit 311. Reference numeral 312 denotes an ultrasonic wave generation unit in which a vibrator for generating an ultrasonic wave to be applied to the heating unit 311 is incorporated. The ultrasonic wave applied from the ultrasonic wave generation unit 312 acts on the molten metal pond H1 through the heating unit 311 to remove foreign matters and bubbles present at the interface between the molten metal pond H1 and the glass substrate G. Reference numeral 313 denotes a control unit that controls the intensity of ultrasonic waves generated by the ultrasonic wave generation unit 312.

  Reference numeral 33 denotes solder supply means for supplying the thread-shaped solid solder H to the heating unit 311 of the molten metal pond forming means 31. Reference numeral 322 is a guide portion that has a supply passage through which the solid solder H can be inserted and guides the solid solder H so as to come into contact with the heating portion 311. Reference numeral 311 stores the solid solder H in a wound state. At the same time, it is a storage section for sending out the solid solder H stored in the supply passage of the guide section 322. The storage unit 311 includes a solid solder delivery unit (not shown), and can send out the solid solder H at a speed corresponding to the consumption of the solid solder H.

  Both the molten metal pond forming means 31 and the solid solder supplying means 33 are incorporated in a moving means (not shown), and the glass substrate G has a horizontal axis (X axis), a vertical axis (Y axis) and a vertical axis on the paper surface. It is configured to be freely movable on an axis (Z axis) perpendicular to the surface of the glass substrate G.

  The operation of the joint forming device 30 of this aspect is basically the same as that of the joint forming devices 10 and 20. That is, the heating part 311 of the molten metal pond forming means 31 is positioned with respect to the glass substrate G. When the filamentous solid solder H supplied from the solid solder supply means 33 comes into contact with the heating unit 311, the solid solder H is melted to form a molten metal pond H1. At this time, since ultrasonic waves act on the molten metal pond H1 via the heating unit 311, bubbles and foreign substances existing at the interface between the molten metal pond H1 and the glass substrate G are removed by the cavitation effect, and the molten solder Are in good contact with the glass substrate G and their interfacial reaction proceeds. As a result, the bondability at the interface between the bonding portion H2 and the glass substrate G can be improved.

  Next, the molten metal pool forming means 31 and the solid solder supply means 33 are both moved in the direction of arrow A by a moving means (not shown). Since the solid solder H is supplied to the heating unit 311 according to the consumption due to melting, the molten metal pond H1 is continuously formed by the movement of the molten metal pond forming means 31 in the A direction. Here, since ultrasonic waves are acting on the molten metal pond H1, new metal oxide is generated by excessive stirring of the molten solder. However, since the foreign matter removing means 22a is configured as described above, the foreign matter containing the metal oxide newly formed while moving in synchronization with the molten metal pool forming means 31 and floating on the surface of the molten metal pool H1. H11 can be continuously removed, and a joint portion H2 that does not include the foreign matter H11 can be formed on the surface that becomes the joint interface.

  In addition, if it comprises so that an ultrasonic wave may be applied to the nozzle 111 of the molten metal pond formation means 10 * 20 of a 1st, 2nd aspect, there can exist an effect | action and effect similar to the above.

(Fourth embodiment)
The joining part formation apparatus and joining part formation method of the 4th embodiment concerning the present invention are explained based on Drawing 6 which is the schematic structure figure.

  Unlike the joining part forming apparatuses 10 to 30 described so far, the joining part forming apparatus 40 of the fourth aspect is configured to melt the solder H arranged on the surface of the glass substrate G to form the molten metal pond H1. is there. That is, the joining portion forming apparatus 40 includes a molten metal pond forming means 41 for melting the solder H arranged on the surface of the glass substrate G to form a molten metal pond H1, and a foreign matter removing means 22a configured in the same manner as described above. And.

  The molten metal pond forming means 41 is incorporated in a moving means (not shown), and is vertically above the glass substrate G with respect to the horizontal axis (X axis), the vertical axis (Y axis) and the surface of the glass substrate G. It is configured so as to be freely movable on a central axis (Z axis). Further, the molten metal pond forming means 41 is configured to be able to irradiate a high energy beam (for example, laser or plasma) 42 to the area including the solder H arranged on the glass substrate G from the lower end thereof.

  The junction forming apparatus 40 operates as follows. First, a glass substrate G in which solder H is arranged in a frame shape along the edge on the inner side of the outer periphery is prepared. As the form of the solder H, various types such as powder, bar, or paste can be used. For example, the solder H is pre-shaped into a desired shape, such as a solid solder formed in a frame shape. If this is the case, it is preferable that the solder H is not required to be arranged.

  The molten metal pond forming means 41 is positioned with respect to the glass substrate G. Then, the high energy beam 42 is irradiated to the solder H, and the solder H contained in the area is melted to form a molten metal pond H1.

  The molten metal pond forming means 41 is moved in the direction of arrow A. As the molten metal pool forming means 41 moves in the A direction, the molten metal pool H1 is continuously formed. Since the foreign matter removing means 22a is configured as described above, the foreign matter H11 on the surface of the molten metal pond H1 is continuously removed while moving in synchronization with the molten metal pond forming means 41, so that the surface becomes a bonding interface. A joint H2 that does not include the foreign matter H11 can be formed.

(Fifth embodiment)
A glass substrate bonding apparatus and method according to a fifth embodiment of the present invention will be described with reference to FIGS. FIG. 9 is a schematic configuration diagram of the glass substrate bonding apparatus according to the fifth aspect, and FIG. 10 is a diagram illustrating the operation of the glass substrate bonding apparatus according to the fifth aspect.

  As shown in FIGS. 10B and 10C, the glass substrate bonding apparatus (hereinafter referred to as a bonding apparatus) 50 according to the fifth aspect has a frame shape inside the outer peripheries of the two glass substrates G1 and G2. The joining portions H21 and H22 are formed, and the joining portions H21 and H22 are overlapped and joined together to join the glass substrates G1 and G2 to form a joined body.

  As shown in FIG. 9, the bonding apparatus 50 includes a first bonding portion forming section 51 that forms a bonding section H21 on the glass substrate G1 and a bonding section forming apparatus 30 that forms the bonding section H22 on the glass substrate G2. The second bonding portion forming portion 52 and a glass substrate bonding portion 53 that is arranged via a conveyance portion that conveys the glass substrates G1 and G2 on which the bonding portions H21 and H22 are formed, and which joins the glass substrates G1 and G2. ing. Hereinafter, although the 1st junction part formation part 51, the 2nd junction part formation part 52, and the glass substrate junction part 53 are demonstrated, since the 1st junction part formation part 51 and the 2nd junction part formation part 52 are the same structures, it is 1st. A description of the two-junction forming part 52 is omitted.

  In the 1st junction part formation part 51 shown to Fig.10 (a), the code | symbol 511 is the junction part formation apparatus 30 (FIG. 5) of the said 3rd aspect. The joint forming device 511 is configured in the same manner as described above. That is, the joining part forming device 511 includes a molten metal pond forming means 31 constituted by a heating part 311, an ultrasonic wave generating part 312 and a control part 313, and a solder supply means 33 constituted by a guide part 322 and a storage part 311. The molten metal pond forming means 31 and the solder supply means 33 are both composed of a moving means (not shown) that freely moves on the glass substrate G1, a foreign matter removing part 221a, and a foreign matter collecting part 226, and synchronized with the molten metal pond forming means 31. The foreign substance removing means 22a that moves in this manner and the heating element 13 that heats the glass substrate G1 to a predetermined temperature. In addition, any of the junction part formation apparatuses 10-40 of the 1st-4th aspect may be sufficient as the junction part formation apparatus incorporated in the 1st junction part formation part 51. FIG.

  Reference numeral 512 denotes an airtight container that houses the joint forming device 511. Reference numeral 513 is an oxygen concentration control means connected to the hermetic container 512 via a pipe, and is configured so that the oxygen concentration in the hermetic container 512 can be controlled to a constant concentration.

The oxygen concentration in the airtight container 512 is controlled to a constant concentration for the following reason.
Al added to the Sn—Ag—Al solder is an element having a high oxygen affinity along with Zn, Ti, Si, Cr and rare earth. The reason why Sn—Ag—Al solder containing Al can be bonded to an oxide such as a glass substrate is considered to be because Al having high oxygen affinity is bonded to oxygen present on the surface of the glass substrate. Therefore, in order to join the junction H21 formed of Sn—Ag—Al solder to the glass substrate G, it is desirable to form the junction H21 in an oxygen-containing atmosphere with a constant oxygen concentration. On the other hand, when the oxygen concentration is excessive, excessive oxygen and Al are combined to generate an excessive oxide, thereby impairing the bonding property between the bonding portion H21 and the glass substrate G1, or the bonding portions H21 and H22. There is a possibility that a metal oxide is generated on the surface of the metal and the bonding property between the bonding portions H21 and H22 is impaired. Therefore, when forming the junction H21, it is necessary to manage the oxygen concentration in the hermetic vessel 512 within a certain range so that the molten metal pool H1 and the junction H21 are placed in a certain oxygen concentration. .

  In the glass substrate bonding portion 53, the reference numeral 531 is a mounting table for the glass substrate G1 on which the bonding portion H21 is formed in the first bonding portion forming portion 51. The reference numeral 532 is configured to hold the glass substrate G2 on which the joint portion H22 is formed in the second joint portion forming portion 52 in a horizontal posture and to be movable in a plane direction and a vertical direction with respect to the glass substrate G1. This is a superposition means for positioning the glass substrate G2 so that the part H22 corresponds to the joint part H21 and superimposing the joint part H21 and the joint part 22. Reference numeral 533 is a flat plate-like weight placed on the glass substrate G2 superimposed on the glass substrate G1. Reference numeral 534 is an airtight container that can contain the mounting table 531, the superposition means 532, the weight 533, and the glass substrates G1 and G2. A vacuum pump 535 and a heating means 536 are connected to the hermetic container 534 via a pipe so that the atmosphere and temperature inside the hermetic container 533 can be controlled.

  Here, when joining the joining part H21 and the joining part H22, it is preferable to set it as a low-oxygen atmosphere or an oxygen-free atmosphere in order to prevent that a metal oxide arises on the surface of joining part H21 * H22. Therefore, in the glass substrate bonding portion 53, the inside of the airtight container 534 is evacuated by the vacuum pump 535, and a substantially oxygen-free atmosphere is created. Note that the air in the hermetic container 534 may be replaced with an inert gas such as argon or nitrogen so that a low oxygen atmosphere or an oxygen-free atmosphere is obtained.

  Moreover, when joining the junction parts H21 and H22, the interface between the junction part H21 and the junction part H22 needs to be in a molten state. Therefore, in order to remelt the solder when the joints H21 and H22 before superposition are in a solidified state, and to maintain the molten state in the molten state, the temperature inside the hermetic container 534 is set to the melting temperature of the solder. Set to above. After the joining portions H21 and H22 are joined, the temperature inside the airtight container 534 is lowered in order to solidify the joining portions H21 and H22. In addition, it can also be set as the structure which controls the temperature of junction part H21 * H22 via glass substrate G1 * G2 by incorporating a heat generating body in the mounting base 531 or the weight 533. FIG.

  The operation of the joining device 50 will be described. In addition, since the structure of the 1st junction part formation part 51 and the 2nd junction part formation part 52 is the same as above, description of operation | movement of the 2nd junction part formation part 52 is abbreviate | omitted, and the junction part H22 in the glass substrate G2 Will be described below on the premise that the second bonding portion forming portion 52 is simultaneously formed in the same manner as the bonding portion 21 of the glass substrate G1.

  The glass substrate G1 is set in the joint forming device 511 of the first joint forming part 51. Thereafter, the hermetic container 512 is sealed, and the oxygen concentration control means 513 operates so that the oxygen in the hermetic container 512 has a desired concentration.

  Thereafter, the joint forming device 511 forms the joint H21 by the same operation as the joint forming device 30 described above. That is, the heating part 311 of the molten metal pond forming means 31 is positioned with respect to the glass substrate G. When the filamentous solid solder H supplied from the solid solder supply means 33 comes into contact with the heating unit 311, the solid solder H is melted to form a molten metal pond H1.

  Next, the molten metal pool forming means 31 and the solid solder supply means 33 are both moved in the direction of arrow A by a moving means (not shown). These movement paths are set so that the molten metal pond H1 is formed along the periphery of the inner periphery of the glass substrate G1. Since the solid solder H is supplied to the heating unit 311 in accordance with the consumption due to melting, the molten metal pond H1 is continuously formed as the molten metal pond forming means 31 moves in the A direction. The foreign matter removing means 22a continuously removes the foreign matter H11 containing the metal oxide on the surface of the molten metal pool H1 while moving in synchronization with the molten metal pool forming means 31. As a result, a frame-shaped joint H21 that does not include the foreign matter H11 is formed on the surface that becomes the joint interface with the joint 22. Thereafter, the temperature of the junction H21 is lowered by the heating element 13, and the junction H21 is brought into a solidified state.

  After the joining portions H21 and H22 are formed, the transport portion transports the glass substrates G1 and G2 from the first joining portion forming portion 51 and the second joining portion forming portion 52 to the glass substrate joining portion 53.

  Next, one glass substrate G1 is set with the surface on which the bonding portion H21 is formed at a predetermined position of the mounting table 531 of the glass substrate bonding portion 53 facing upward, and the surface on which the bonding portion H22 is formed is directed downward. The other glass substrate G2 is held horizontally by the polymerization means 532. Thereafter, the airtight container 534 is sealed.

  The vacuum pump 535 places the inside of the sealed airtight container 534 in a vacuum state. In parallel with this, the heating means 536 heats the inside of the airtight container 534 to remelt the solidified joint portions H21 and H22. The remelting of the joints H21 and H22 may be performed after the joining of the joints H21 and H22 described below.

  The superimposing means 532 aligns the position of the glass substrate G2 in the horizontal direction so that the bonding portion H22 corresponds to the bonding portion H21, and then moves the glass substrate G2 to the predetermined position in the vertical direction, whereby the surface of the bonding portion H21 ( The upper surface) and the surface (lower surface) of the joint H22 are overlapped. Thereafter, the weight 534 is set on the upper surface of the glass substrate G2. When the temperature of the inside of the airtight container 534 is lowered to the solidification temperature of the solder by the heating means 536, the joining portions H21 and H22 are joined at the interface.

  In addition, when the surface which becomes the joining interface of joining part H21 * H22 is arrange | positioned perpendicular | vertical with respect to the direction where gravity acts (namely, the surface of glass substrate G1 * G2 arrange | positions perpendicular | vertical with respect to the direction where gravity acts In this case, it is desirable that the thickness of the joint portion H21 is thicker than that of the joint portion H22. When bonding the glass substrates G1 and G2, it is necessary to melt the bonding portions H21 formed on both the glass substrates G1 and G2 and to superimpose the molten bonding portions H21. It is because it can prevent that the shape of the junction part H21 of G1 collapses.

  Further, in the above, the joined portions H21 and H22 are formed together with the glass substrates G1 and G2, and the joined portions H21 and H22 are joined to obtain the joined body of the glass substrates G1 and G2. However, only the one glass substrate G1 is joined. The part H21 may be formed, and the joined part H21 may be directly joined to the other glass substrate G2 to obtain a joined body of the glass substrates G1 and G2.

  Hereinafter, experimental examples according to the present invention will be described. In the following experimental examples, the joint forming apparatus 30 (FIG. 5) of the third aspect in which the foreign matter removing means 12 (FIG. 1) was incorporated instead of the foreign matter removing means 22 a was used. In addition, the ultrasonic soldering apparatus (model: USM-3) made from (Kuroda Techno Co., Ltd.) was used for the molten metal pond formation means 31 of the junction part formation apparatus 30. FIG. The frequency of the applied ultrasonic wave was 59.5 KHz, and the ultrasonic wave transmission output was 15 W.

(Experimental example 1)
Two glass substrates G having a length of 50 mm, a width of 50 mm, and a thickness of 3 mm were joined using solder made of Ag 3.5%, Al 0.3%, the remaining Sn and inevitable impurities. A joining portion H2 having a width of 3 mm and a thickness of 1 mm was formed in a frame shape on the glass substrate G so that the center of the width is 1.5 mm inside the outer periphery of the glass substrate G in the air. The insertion depth h1 of the foreign matter removing means 12 at this time was set to 0.3 mm, which is 30% of the height of the molten metal pool H1. While maintaining the molten state of the joint H2, the two glass substrates G were superposed on the heating plate, and then the heating plate was cooled to obtain a joined body of the glass substrates G.

(Experimental example 2)
The joining of the glass substrate G was tried on the same conditions as Experimental example 1 except the insertion depth of the foreign material removal means 12 being 0.65 mm which is 65% of the height of the molten metal pond H1. The glass substrate G was bonded satisfactorily.

(Experimental example 3)
The joining of the glass substrate G was tried on the same conditions as Experimental example 1 except the insertion depth of the foreign material removal means 12 being 0.75 mm which is 75% of the height of the molten metal pond H1. The shape of the molten metal pond H1 collapsed and the desired joint H2 could not be formed.

(Experimental example 4)
With respect to the experimental example 1, the glass substrate G was tried to be joined under the same conditions except that the foreign matter removing means 12 was removed from the joint forming device 30. Due to the foreign matter H11, the joint portions H2 could not be joined together, and a joined body could not be obtained.

(Experimental example 5)
With respect to the experimental example 1, the bonding of the glass substrate G was tried under the same conditions except that the bonding portion H2 was formed in a vacuum. The bonding portion H2 was bonded to the glass substrate G itself, but the bonding strength was not sufficient, and the bonding portion H2 was peeled off during transport.

(Experimental example 6)
Compared to the experimental example 1, the joint H2 is cooled to a solid phase, and then the joints H2 of the two glass substrates G are overlapped, a weight is placed on one glass substrate G, and heated in a vacuum. The glass substrate G was bonded under the same conditions except that the bonding portion H2 was melted and bonded, and then the bonding portion H2 was cooled and solidified. The glass substrate G was bonded satisfactorily.

(Experimental example 7)
The bonding of the glass substrate G was tried under the same conditions as in Experimental Example 1 except that the bonding portion H2 having a thickness of 2 mm was formed only on one glass substrate G. The glass substrate G was bonded satisfactorily.

It is a schematic block diagram of the junction part formation apparatus of the 1st aspect which concerns on this invention. It is the elements on larger scale of FIG. 1, and its side view. It is a figure which shows another form of the foreign material removal means of FIG. It is a schematic block diagram of the junction formation apparatus of the 2nd mode concerning the present invention, It is a schematic block diagram of the junction part formation apparatus of the 3rd aspect which concerns on this invention. It is a schematic block diagram of the junction part formation apparatus of the 4th aspect which concerns on this invention. FIG. 5 is an enlarged front view and an enlarged side view of FIG. 4. It is a figure which shows another form of the foreign material removal means of FIG. It is a schematic block diagram of the joining apparatus which concerns on this invention. It is a figure explaining operation | movement of the joining apparatus of FIG. It is a figure explaining the joining method of the conventional glass substrate.

Explanation of symbols

10 (20, 30, 40) Joining portion forming device 11 (31, 41) Molten metal pool forming means 12 (22) Foreign matter removing means 13 Heating element 50 Joining device 51 First joining portion forming portion 52 Second joining portion forming portion 53 Glass substrate joint G (G1, G2) Glass substrate H Solder H1 Molten metal pond H2 (H21, H22) Joint H11 Foreign matter

Claims (25)

An apparatus for forming a bonding portion made of a low melting point metal on one surface of an object to be bonded, which is configured to be movable with respect to one surface of the object to be bonded and which has a molten low melting point metal on the one surface of the object to be bonded A molten metal pond forming means for supplying and forming a molten metal pond; and a foreign matter removing means for removing a foreign substance in the molten metal pond having one end inserted into the surface of the molten metal pond, An apparatus for forming a joined portion of an object to be joined which is disposed rearward with respect to the moving direction of the molten metal pond forming means and moves in synchronization with the molten metal pond forming means. The molten metal pond forming unit includes a molten metal supply unit that supplies a molten low melting point metal to one surface of the object to be joined, and an ultrasonic wave generation unit that applies ultrasonic waves to the molten metal supply unit. The bonded part forming apparatus for bonded objects according to claim 1, comprising: An apparatus for forming a joint made of a low-melting-point metal on one surface of an object to be joined, which is configured to be movable with respect to one surface of the object-to-be-joined and disposed on the one surface of the object to be joined A molten metal pond forming means for forming a molten metal pond, and a foreign matter removing means for removing a foreign substance in the molten metal pond having one end inserted into the surface of the molten metal pond, An apparatus for forming a joined portion of an object to be joined which is disposed rearward with respect to the moving direction of the molten metal pond forming means and moves in synchronization with the molten metal pond forming means. The said molten metal pond formation means is a junction part formation apparatus of the to-be-joined body of Claim 2 which has a heating part which can heat the said low melting metal locally. The distance between the edge of one end of the foreign matter removing means inserted into the molten metal pond and the top of the surface of the molten metal pond is less than 70% of the height of the molten metal pond. The joining part formation apparatus of the to-be-joined body in any one. 6. The apparatus for forming a joined portion of a molten joined body according to any one of claims 1 to 5, wherein an edge of one end of the foreign matter removing means has a shape substantially corresponding to a shape of a surface of the molten metal pond. . The foreign matter removing means includes a foreign matter removing portion for removing foreign matter from the molten metal pond while one end is inserted into the molten metal pond and rotating, and an outer peripheral surface of the foreign matter removing portion disposed above the molten metal pond. The joined part forming apparatus for joined bodies according to any one of claims 1 to 6, further comprising a foreign matter collecting part that collects foreign matter adhering to the surface. The joining part forming apparatus for joined bodies according to any one of claims 1 to 7, wherein at least a part of the foreign matter removing part that is in contact with the molten metal pond is made of a material that does not contaminate the molten metal pond. The joining part forming apparatus for joining objects according to any one of claims 1 to 8, wherein at least a part of the foreign matter removing part that is in contact with the molten metal pond is made of carbon or ceramics. The joined portion forming apparatus for joined bodies according to any one of claims 1 to 9, wherein the foreign matter removing means has a catching surface for catching the foreign matter. The joined portion forming apparatus for joined bodies according to claim 10, wherein the capturing surface has an uneven shape. The joined portion forming apparatus for joined bodies according to claim 10, wherein the capture surface has a substantially mesh shape. The joined portion forming apparatus for joined bodies according to claim 1, wherein the foreign matter includes a metal oxide mainly composed of the low melting point metal. 14. The bonded portion forming apparatus according to claim 1, wherein the bonded body is a glass substrate, and the low-melting-point metal is Sn—Ag—Al-based solder. A glass substrate bonding apparatus for bonding a pair of glass substrates having the bonded portion forming apparatus according to claim 14. A method of forming a joint made of a low melting point metal on one side of a joined body, supplying a molten low melting point metal to one side of the joined body to form a molten metal pond and removing foreign matter in the molten metal pond A method for forming a bonded portion of a bonded body. 17. The method for forming a bonded portion of a bonded body according to claim 16, wherein the molten low melting point metal is applied while applying ultrasonic waves. A method of forming a joint made of a low melting point metal on one surface of a joined body, wherein the low melting point metal disposed on one surface of the joined body is heated to form a molten metal pond and foreign matter in the molten metal pond is removed. A method for forming a bonded portion of an object to be bonded. 19. The method for forming a bonded portion of an object to be bonded according to claim 18, wherein the low melting point metal is locally heated to form a molten metal pond. 20. The method for forming a joined portion of an object to be joined according to claim 16, wherein foreign matter is removed from a surface portion of the molten metal pond. 21. The method for forming a bonded portion of an object to be bonded according to any one of claims 16 to 20, wherein the foreign matter includes a metal oxide mainly composed of the low melting point metal. 23. A method for forming a bonded portion according to any one of claims 16 to 22, wherein a bonded portion made of Sn-Ag-Al solder, which is a low melting point metal, is formed on a glass substrate, which is a bonded member. Part formation method. 24. A method of forming a bonded portion according to claim 23, wherein a bonding portion forming step of forming a bonded portion made of Sn-Ag-Al solder on each surface of a pair of glass substrates, and the bonded portion are formed. A glass substrate bonding method comprising: a bonding step of bonding glass substrates together by overlapping surfaces. In the joining part forming step, the thickness of the joining part formed on one glass substrate is formed thinner than the joining part formed on the other glass substrate, and the surface of the glass substrate with respect to the direction in which gravity acts in the joining process The glass substrate bonding method according to claim 24, wherein the glass substrate is placed vertically and the other glass substrate is placed below. The glass substrate bonding method according to claim 24 or 25, wherein the bonding portion forming step is performed in an aerobic atmosphere, and the bonding step is performed in a substantially oxygen-free atmosphere.

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