JP2008277580A5 - - Google Patents
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- Publication number
- JP2008277580A5 JP2008277580A5 JP2007120214A JP2007120214A JP2008277580A5 JP 2008277580 A5 JP2008277580 A5 JP 2008277580A5 JP 2007120214 A JP2007120214 A JP 2007120214A JP 2007120214 A JP2007120214 A JP 2007120214A JP 2008277580 A5 JP2008277580 A5 JP 2008277580A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- pattern
- metal thin
- film pattern
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010408 film Substances 0.000 claims 45
- 239000002184 metal Substances 0.000 claims 21
- 229910052751 metal Inorganic materials 0.000 claims 21
- 239000010409 thin film Substances 0.000 claims 21
- 238000000034 method Methods 0.000 claims 13
- 239000000758 substrate Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000000956 alloy Substances 0.000 claims 3
- 229910045601 alloy Inorganic materials 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 238000007772 electroless plating Methods 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007120214A JP2008277580A (ja) | 2007-04-27 | 2007-04-27 | 導電膜パターンの形成方法、デバイスの製造方法、及び液滴吐出ヘッドの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007120214A JP2008277580A (ja) | 2007-04-27 | 2007-04-27 | 導電膜パターンの形成方法、デバイスの製造方法、及び液滴吐出ヘッドの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008277580A JP2008277580A (ja) | 2008-11-13 |
| JP2008277580A5 true JP2008277580A5 (https=) | 2010-06-24 |
Family
ID=40055180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007120214A Withdrawn JP2008277580A (ja) | 2007-04-27 | 2007-04-27 | 導電膜パターンの形成方法、デバイスの製造方法、及び液滴吐出ヘッドの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008277580A (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020213133A1 (ja) * | 2019-04-18 | 2020-10-22 | パナソニック・タワージャズセミコンダクター株式会社 | 半導体装置 |
| JP7184865B2 (ja) * | 2020-12-14 | 2022-12-06 | 日東電工株式会社 | 配線回路基板集合体シート |
-
2007
- 2007-04-27 JP JP2007120214A patent/JP2008277580A/ja not_active Withdrawn
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