JP2008277123A - Processing method for coaxial wire and coaxial wire - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a processing method for a coaxial wire and a coaxial wire capable of obtaining a flat end face. <P>SOLUTION: In the processing method for a coaxial wire 1 having a signal wire 2, an insulating layer 3 arranged on the periphery of the signal wire 2, and a shield wire 4 arranged on the periphery of the insulating layer 3, the processing method for a coaxial wire 1 comprises a cutting process for cutting the coaxial wire 1, an adhesive penetration process for making a liquid adhesive 6 penetrate an end including a cut plane of the coaxial wire 1 formed in the cutting process, a fixing process for fixing the signal wire 2 and shield wire 4 by drying and hardening the adhesive 6, and a polishing process for obtaining a flat end face 1a by polishing the cut plane of the hardened end. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a coaxial wire processing method and a coaxial wire.

  Conventionally, a coaxial line is used in which a signal line is covered with an insulator, a shield line is disposed outside the signal line, and the outside is further covered with an insulating cover. When connecting such a coaxial signal line to, for example, a substrate on which a conductor circuit pattern is formed, the shield line and the insulator are removed by a mechanical cutting tool such as a stripper or a nipper or a melting device such as a laser. To expose the signal line. In general, a signal line is placed on the electrode on the substrate and the connection is made by soldering.

In recent years, the signal line of the ultra-thin coaxial line used is soft and has a small diameter. Therefore, the side surface of the signal line may be damaged or disconnected during the signal line exposure operation as described above. These are the causes of defective products and are problematic.
The terminal joint portion of the coaxial cable and the wire cable is required to be further miniaturized and miniaturized as the equipment is miniaturized, and the joining operation is expected to become more complicated in the future.

In order to solve this problem, Patent Document 1 discloses that an adhesive fixing medium is applied to a cut surface of a coaxial wire, a solder wire or a solder ball is fixed to the application surface, and then melted with a heater to obtain gravity or surface tension. Has proposed a processing method for providing a spherical connection terminal.
JP 2003-149265 A

  In order to form a stable connection terminal by the method of Patent Document 1, it is necessary to form the cut surface on a flat end surface. However, in the case of mechanical cutting with a nipper or the like, there is a problem that it is difficult to flatten the cut surface and it is difficult to form a stable connection terminal.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a coaxial wire processing method and a coaxial wire capable of obtaining a flat end face.

  The present invention relates to a method of processing a coaxial line having a signal line, an insulating layer provided around the signal line, and a shield layer provided around the insulating layer, and cutting the coaxial line A cutting step, an adhesive penetrating step for penetrating the adhesive into an end portion including the cut surface of the coaxial line formed in the cutting step, and drying and curing the adhesive to form the signal line and the shield layer. It comprises a fixing step for fixing, and a polishing step for polishing the cut surface of the hardened end portion to obtain a flat end surface.

  According to the processing method of the coaxial line of the present invention, since the signal line and the shield line are fixed inside the coaxial line by the adhesive that penetrates into the end portion and hardens, it can move when the cut surface is polished. Absent.

  The method of processing a coaxial line according to the present invention further includes a resin material deposition step of hardening at least the periphery of the coaxial wire with a resin material, and in the polishing step, the cut surface of the end portion is the resin material. It may be polished together. The diameter of the signal line may be 0.1 mm or less.

  According to the method of processing a coaxial line of the present invention, even if the diameter of the coaxial line is small, polishing is performed with a resin material that has hardened the periphery of the end portion, so that the cut surface can be reliably secured without bending the coaxial line Can be polished.

  Further, the coaxial line of the present invention is processed by the coaxial line processing method of the present invention, and the end face is made of a conductor and has a diameter larger than the diameter of the signal line and smaller than the diameter of the insulating layer. A bump is provided.

  According to the coaxial line of the present invention, a connection bump having a diameter larger than that of the signal line can be stably formed on the flat end surface without being electrically connected to the shield line.

According to the coaxial line processing method of the present invention, a coaxial line having a flat end face can be obtained.
In addition, according to the coaxial line of the present invention, it is possible to configure a coaxial line that is easier to connect.

A coaxial line processing method and a coaxial line according to an embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a front view showing an end face 1a of a coaxial line 1 formed by the processing method of the present embodiment. The coaxial line 1 is provided around the signal line 2, the insulating layer 3 provided around the signal line 2, a shield line (shield layer) 4 provided around the insulating layer 3, and the shield line 4. And an insulating coating 5. Adhesive 6 has entered and hardened between the signal line 2 and the insulating layer 3 and in the minute gaps around the shield line 4, and the signal line 2 and the shield line 4 are fixed.
The diameter of the signal line 2 is, for example, 0.04 millimeters, and the entire outer diameter of the coaxial line 1 including the insulating coating 5 is, for example, 0.23 millimeters.

  A method for processing the coaxial wire 1 having the above-described configuration will be described below with reference to FIGS. The processing method of the present embodiment includes a cutting step for cutting the coaxial line before processing, a step of immersing the cut end portion in an adhesive (adhesive penetration step), and a step of lifting the dipped end portion and drying ( A fixing step), a step of hardening the periphery of the dried end portion with a resin material (resin material applying step), and a polishing step of polishing the cut surface of the dried end portion flatly.

  FIG. 2 is a flowchart showing the flow of this processing method. First, in step S1, as shown in FIG. 3, the material coaxial line 100, which is the material of the coaxial line 1, is cut into a desired length with scissors or the like to form the cut surface 101 at the end portion 100a.

  In step S2, as shown in FIG. 4, the end 100a of the material coaxial line 100 is immersed in the liquid adhesive 6 in the container 102 from the cut surface 101 side at a predetermined depth, for example, about 2 millimeters at room temperature. . At this time, the adhesive 6 penetrates and penetrates into the minute gaps around the signal line 2, the insulating layer 3, the shield line 4, and the insulating coating 5 on the cut surface 101 by capillary action.

  In step S3, the end 100a is pulled up from the adhesive 6, and the adhesive 6 is dried and cured. As a result, the penetrated adhesive 6 is cured, and the signal line 2 and the shield line 4 are fixed inside the insulating coating 5 and the insulating layer 3. At this time, the surface of the cut surface 101 is also covered with the adhesive 6.

  Next, in step S4, as shown in FIG. 5, the material coaxial line 100 is fixed vertically using the fixture 103 with the cut surface 101 facing downward and placed in the sample cup 104. Then, a liquid resin material 105 is poured into the sample cup 104. The resin material 105 is cured with time at room temperature, and the periphery of the material coaxial line 100 is hardened and reinforced by the resin material 105. As will be described later, the fixture 103 and the sample cup 104 are polished together with the material coaxial line 100 in the next step, and thus are preferably formed of a resin or the like.

In step S5, as shown in FIG. 6, the material coaxial line 100 is set in the polishing machine 106 together with the fixture 103, the sample cup 104, and the resin material 105, and the cut surface 101 is polished.
First, the adhesive on the cut surface 101 is removed by polishing with No. 320 water-resistant abrasive paper until the signal line 2 is visible on the cut surface 101. Next, as an intermediate finish, polishing is performed with 9 micron agglomerated paper. After further polishing with a 3 micron grained paper, the final finishing is performed with a 0.05 micron grained paper.

  After the polishing process is completed, the fixture 103, the sample cup 104, and the resin material 105 are removed, whereby the coaxial line 1 having the flat end surface 1a can be obtained. This removal operation is performed, for example, by removing most of the film by cutting, and then peeling off the film slightly remaining around the material coaxial line 100 with a nail or the like.

  Alternatively, as shown in FIG. 7, after the polishing step, the coaxial line 1 before removing the fixture 103, the sample cup 104, and the resin material 105 is fixed to the installation tool 107 with the end face 1a facing upward. Thereafter, when the conductive material 7 such as solder or nano paste is applied to the end face 1a from above using the dropping device 108, the end face 1a has an area larger than the cross-sectional area of the signal line 2 as shown in FIG. Connection bumps 8 can be formed. At this time, the dropping position and the dropping amount of the conductive material 7 are adjusted so that the dropped conductive material 7 does not touch the shield wire 4. Thereafter, the resin material 105 and the like are removed from the coaxial line 1 on which the connection bumps 8 are formed by the same method as described above.

  According to the coaxial line processing method of the present embodiment, the coaxial line internal structure such as the signal line 2 and the shield 4 line is fixed by the adhesive 6 that has entered the surrounding gap, so that pressing and rotation are performed in the above polishing process. Even if an external force is applied, the coaxial line internal structure does not move. Therefore, the flat end face 1a can be formed by the polishing process.

  In addition, since the polishing process is performed in a state where the periphery of the material coaxial line 100 is solidified by the resin material 105, the material coaxial line 100 is not bent at the time of polishing even if the material coaxial line 100 has a small diameter, and the polishing operation is performed in a stable state It can be carried out.

  Further, according to the coaxial line 1 of the present embodiment, since the end face 1a is processed flat, the connection bump 8 can be easily formed on the end face 1a using the conductive material (conductive material) 7 or the like. it can. Therefore, a contact larger than the cross-sectional area of the signal line can be formed on the end face to make the coaxial line easier to connect.

  In the present embodiment, the example in which the cut surface 101 of the material coaxial line 100 is immersed in the adhesive 6 in the container 102 in step S2 has been described, but instead of this, as in the modification shown in FIG. The coaxial line 100 may be fixed with the cut surface 101 facing upward, and the adhesive 6 filled in the syringe 109 may be dropped from above to infiltrate the adhesive 6 from the cut surface 101. If it does in this way, when drying adhesive 6, the process of pulling up from container 102 can be omitted.

Although the embodiments of the present invention have been described above, the technical scope of the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.
For example, in the above-described embodiment, the example in which the periphery of the material coaxial line 100 is solidified with the resin material 105 over almost the entire length in the resin material deposition step has been described. May be reinforced by a resin material. If it does in this way, the usage-amount of a resin material can be saved and manufacturing cost can be reduced. Further, instead of using the fixture 103, the material coaxial line may be fixed from above with a jig or the like, and the resin material may be poured.
Furthermore, in the present invention, the resin material deposition step is not essential, and when the material coaxial line has a relatively large diameter, the polishing step may be performed immediately without performing the resin material deposition step. In this case, the movement of the material coaxial line in the polishing process may be restricted by pinching with a finger or using an appropriate jig.

  In the above-described embodiment, an example in which one material coaxial line is processed has been described. Instead, a plurality of material coaxial lines are bundled and processed by the processing method of the present invention. By leaving the resin material 105 around the coaxial line, a coaxial line terminal portion with a plurality of signal lines exposed on the end face may be formed.

  Furthermore, it is also possible to form a connection bump on the cross section of each signal line of the coaxial line end portion to form a coaxial line end portion having a plurality of contacts that can be easily connected.

It is a figure which shows the end surface of the coaxial line of one Embodiment of this invention. It is a flowchart which shows the processing method of the coaxial line which forms the coaxial line of the embodiment. It is a figure which shows the process of cut | disconnecting a raw material coaxial line. It is a figure which shows the process of infiltrating an adhesive agent into the cut surface of a raw material coaxial line. It is a figure which shows the pre-process of the grinding | polishing process of a raw material coaxial line. It is a figure which shows the grinding | polishing process of a raw material coaxial line. It is a figure which shows the process of forming a connection bump in the end surface of the coaxial line of the embodiment. It is a figure which shows the end surface of the coaxial line of the same embodiment provided with the connection bump. It is a figure which shows the adhesive agent penetration process in the modification of the processing method of the coaxial line of the embodiment.

Explanation of symbols

1 Coaxial line 2 Signal line 3 Insulating layer 4 Shielded wire (shield layer)
6 Adhesive 7 Conductive material (conductive material)
8 Connection bump 100 Material coaxial line (coaxial line)
105 Resin material

Claims (4)

A coaxial line processing method comprising: a signal line; an insulating layer provided around the signal line; and a shield layer provided around the insulating layer,
A cutting step of cutting the coaxial line;
An adhesive infiltration step for infiltrating a liquid adhesive into an end including the cut surface of the coaxial line formed in the cutting step;
A fixing step of drying and curing the adhesive to fix the signal line and the shield layer;
A polishing step of polishing the cut surface of the end portion to obtain a flat end surface;
A method for processing a coaxial wire, comprising: A resin material adhering step of hardening the periphery of at least the end of the coaxial line with a resin material;
The method of processing a coaxial line according to claim 1, wherein, in the polishing step, the cut surface of the end portion is polished together with the resin material.   The coaxial wire processing method according to claim 1 or 2, wherein the diameter of the signal wire is 0.1 millimeter or less. It is processed by the processing method of the coaxial line according to any one of claims 1 to 3,
A coaxial line, characterized in that a connection bump made of a conductive material and having a diameter larger than the diameter of the signal line and smaller than the diameter of the insulating layer is provided on the end face.

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