JP2008274150A - Rosin-modified phenolic resin and rosin-modified phenolic resin for offset printing - Google Patents
Rosin-modified phenolic resin and rosin-modified phenolic resin for offset printing Download PDFInfo
- Publication number
- JP2008274150A JP2008274150A JP2007120444A JP2007120444A JP2008274150A JP 2008274150 A JP2008274150 A JP 2008274150A JP 2007120444 A JP2007120444 A JP 2007120444A JP 2007120444 A JP2007120444 A JP 2007120444A JP 2008274150 A JP2008274150 A JP 2008274150A
- Authority
- JP
- Japan
- Prior art keywords
- rosin
- phenolic resin
- modified phenolic
- resin
- ppm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 238000007645 offset printing Methods 0.000 title claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000002184 metal Substances 0.000 claims abstract description 41
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 150000002989 phenols Chemical class 0.000 claims abstract description 26
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 229920005862 polyol Polymers 0.000 claims abstract description 11
- 150000003077 polyols Chemical class 0.000 claims abstract description 10
- 239000004593 Epoxy Substances 0.000 claims abstract description 6
- 150000007519 polyprotic acids Polymers 0.000 claims abstract description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 39
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 39
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 39
- 239000005011 phenolic resin Substances 0.000 claims description 34
- 239000003054 catalyst Substances 0.000 claims description 27
- -1 formaldehyde, polyols Chemical class 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 238000004821 distillation Methods 0.000 claims description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 24
- 239000011347 resin Substances 0.000 abstract description 24
- 238000007639 printing Methods 0.000 abstract description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 abstract description 5
- 230000002123 temporal effect Effects 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 43
- 239000002904 solvent Substances 0.000 description 42
- 238000004519 manufacturing process Methods 0.000 description 34
- 239000002253 acid Substances 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 20
- 239000002966 varnish Substances 0.000 description 14
- 239000000944 linseed oil Substances 0.000 description 13
- 235000021388 linseed oil Nutrition 0.000 description 13
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 12
- 238000003756 stirring Methods 0.000 description 12
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000008096 xylene Substances 0.000 description 10
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 9
- 239000002585 base Substances 0.000 description 9
- 235000014113 dietary fatty acids Nutrition 0.000 description 9
- 239000000194 fatty acid Substances 0.000 description 9
- 229930195729 fatty acid Natural products 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 239000011575 calcium Substances 0.000 description 8
- 239000003921 oil Substances 0.000 description 8
- 235000019198 oils Nutrition 0.000 description 8
- 239000011134 resol-type phenolic resin Substances 0.000 description 8
- 229920003987 resole Polymers 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000003549 soybean oil Substances 0.000 description 8
- 235000012424 soybean oil Nutrition 0.000 description 8
- 235000015112 vegetable and seed oil Nutrition 0.000 description 7
- 239000008158 vegetable oil Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 238000004945 emulsification Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920001568 phenolic resin Polymers 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 229910052728 basic metal Inorganic materials 0.000 description 5
- 150000003818 basic metals Chemical class 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000006837 decompression Effects 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229930040373 Paraformaldehyde Natural products 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 229920002866 paraformaldehyde Polymers 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 239000003349 gelling agent Substances 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 238000000518 rheometry Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- CYEJMVLDXAUOPN-UHFFFAOYSA-N 2-dodecylphenol Chemical compound CCCCCCCCCCCCC1=CC=CC=C1O CYEJMVLDXAUOPN-UHFFFAOYSA-N 0.000 description 1
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- MEEKGULDSDXFCN-UHFFFAOYSA-N 2-pentylphenol Chemical compound CCCCCC1=CC=CC=C1O MEEKGULDSDXFCN-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HTJDQJBWANPRPF-UHFFFAOYSA-N Cyclopropylamine Chemical compound NC1CC1 HTJDQJBWANPRPF-UHFFFAOYSA-N 0.000 description 1
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 description 1
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- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
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- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
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- 239000002202 Polyethylene glycol Substances 0.000 description 1
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- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
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- 150000007513 acids Chemical class 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- MQQXUGFEQSCYIA-OAWHIZORSA-M aluminum;(z)-4-ethoxy-4-oxobut-2-en-2-olate;propan-2-olate Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CCOC(=O)\C=C(\C)[O-] MQQXUGFEQSCYIA-OAWHIZORSA-M 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
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- 238000000354 decomposition reaction Methods 0.000 description 1
- VAROLYSFQDGFMV-UHFFFAOYSA-K di(octanoyloxy)alumanyl octanoate Chemical compound [Al+3].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O VAROLYSFQDGFMV-UHFFFAOYSA-K 0.000 description 1
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- 239000000539 dimer Substances 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
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- 238000009472 formulation Methods 0.000 description 1
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- 238000005227 gel permeation chromatography Methods 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 229940097275 indigo Drugs 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- JACMPVXHEARCBO-UHFFFAOYSA-N n-pentylpentan-1-amine Chemical compound CCCCCNCCCCC JACMPVXHEARCBO-UHFFFAOYSA-N 0.000 description 1
- DYUWTXWIYMHBQS-UHFFFAOYSA-N n-prop-2-enylprop-2-en-1-amine Chemical compound C=CCNCC=C DYUWTXWIYMHBQS-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- FJDUDHYHRVPMJZ-UHFFFAOYSA-N nonan-1-amine Chemical compound CCCCCCCCCN FJDUDHYHRVPMJZ-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 150000004885 piperazines Chemical class 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 239000008165 rice bran oil Substances 0.000 description 1
- 235000005713 safflower oil Nutrition 0.000 description 1
- 239000003813 safflower oil Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- VPYJNCGUESNPMV-UHFFFAOYSA-N triallylamine Chemical compound C=CCN(CC=C)CC=C VPYJNCGUESNPMV-UHFFFAOYSA-N 0.000 description 1
- MYWQGROTKMBNKN-UHFFFAOYSA-N tributoxyalumane Chemical compound [Al+3].CCCC[O-].CCCC[O-].CCCC[O-] MYWQGROTKMBNKN-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Description
本発明は、ロジン変性フェノール樹脂およびオフセット印刷用ロジン変性フェノール樹脂に関する。 The present invention relates to a rosin-modified phenol resin and a rosin-modified phenol resin for offset printing.
ロジン変性フェノール樹脂は、ロジン類とフェノール樹脂、ポリオール等を反応させて得られる樹脂であり、高分子量、高軟化点、高粘度、インキ用溶剤に対する高溶解性などの諸性能を有し、印刷適性に優れることから、印刷インキ用樹脂、特にオフセット印刷用樹脂として広く用いられている。 Rosin-modified phenolic resin is a resin obtained by reacting rosins with phenolic resins, polyols, etc., and has various properties such as high molecular weight, high softening point, high viscosity, high solubility in ink solvents, and printing. Since it is excellent in aptitude, it is widely used as a resin for printing ink, particularly as a resin for offset printing.
オフセット印刷は湿し水とインキの反発を利用し、画線部と非画線部を形成して印刷される方式であるため、湿し水とインキの乳化状態が印刷物の品質に大きな影響を与える。乳化に関するトラブルとしては、版の非画線部が感脂化されてインキが付着し、印刷物に汚れが生じる「版汚れ」といった現象がある。 Since offset printing uses a repulsion between dampening water and ink and prints by forming image areas and non-image areas, the emulsified state of dampening water and ink greatly affects the quality of printed matter. give. As a trouble related to emulsification, there is a phenomenon such as “plate stain” in which a non-image area of a plate is sensitized and ink adheres to the print to cause stains.
「版汚れ」を改善する手段としては、ロジン変性フェノール樹脂を用いずにα−オレフィン重合体を用いる印刷インキ組成物(例えば、特許文献1参照)を用いる方法や、特定の製法にて製造したロジン変性フェノール樹脂を用いた印刷インキワニス(例えば、特許文献2参照)などが提案されている。 As a means for improving “plate stain”, a printing ink composition using an α-olefin polymer without using a rosin-modified phenol resin (for example, see Patent Document 1) or a specific production method was used. A printing ink varnish using a rosin-modified phenolic resin (for example, see Patent Document 2) has been proposed.
ところで、ロジン変性フェノール樹脂は、通常、ロジン類とフェノール樹脂、ポリオール等を反応させて得られるが、フェノール樹脂の製造時には、ナトリウム、カリウム、カルシウムなどを含有するレゾール化触媒を用い、また、ロジン類と、フェノール樹脂、ポリオールを反応させる際には、マグネシウム、カルシウム、亜鉛などを含有するエステル化触媒を用いるため、得られるロジン変性フェノール樹脂には金属塩等が多く含まれている。 By the way, rosin-modified phenolic resins are usually obtained by reacting rosins with phenolic resins, polyols, etc., but at the time of producing phenolic resins, resorching catalysts containing sodium, potassium, calcium, etc. are used. Since the esterification catalyst containing magnesium, calcium, zinc or the like is used when reacting the phenol with the phenol resin or polyol, the resulting rosin-modified phenol resin contains a lot of metal salts and the like.
そこで、この金属の含有量に着目し、残存金属量の少ないロジン変性フェノール樹脂中として、アルカリおよび/またはアルカリ土類金属の含有量が200ppm以下であるロジン変性フェノール樹脂を用いることで乳化速度等を向上させる方法が提案されている(例えば、特許文献3参照)が、当該方法においても、版汚れを完全に解消できるものではなく、当該特許文献3では、具体的によりアルカリおよび/またはアルカリ土類金属の含有量を著しく減じたロジン変性フェノール樹脂およびその手段については開示されていなかった。 Therefore, paying attention to the content of this metal, emulsification speed and the like by using a rosin-modified phenol resin having an alkali and / or alkaline earth metal content of 200 ppm or less as the rosin-modified phenol resin with a small amount of residual metal. Has been proposed (for example, see Patent Document 3). However, in this method as well, plate stains cannot be completely eliminated, and in Patent Document 3, specifically, alkali and / or alkaline earth is more specifically described. No rosin-modified phenolic resin having a significantly reduced metal content and its means have been disclosed.
また、印刷インキは経時変化することが知られており、これにより印刷性に影響を及ぼすといった問題がある。そのため、色素酸の4級アンモニウム塩造塩物からなる添加剤を配合することにより改善させる方法(例えば、特許文献4参照)、ロジン変性フェノール樹脂、米ぬか油、脂肪酸モノエステルを主成分とした印刷インキを用いることにより自動酸化を抑制する方法(例えば、特許文献5参照)などが提案されている。経時変化の原因の一つとしては印刷インキワニスの増粘等が原因の一つとして考えられている。 In addition, printing ink is known to change over time, which has the problem of affecting printability. Therefore, a method for improving by adding an additive comprising a quaternary ammonium salt salt of a pigment acid (see, for example, Patent Document 4), printing based on rosin-modified phenolic resin, rice bran oil, fatty acid monoester A method for suppressing auto-oxidation by using ink (for example, see Patent Document 5) has been proposed. One of the causes of the change over time is considered to be a thickening of the printing ink varnish.
本発明は、版汚れを改善し、経時安定性に優れたロジン変性フェノール樹脂および当該樹脂を用いて得られるオフセット印刷用ロジン変性フェノール樹脂を提供することを目的とする。 An object of the present invention is to provide a rosin-modified phenolic resin that improves plate stains and is excellent in stability over time, and a rosin-modified phenolic resin for offset printing obtained using the resin.
本発明者は、版汚れおよび経時安定性を改善すべく鋭意検討した結果、版汚れは、ロジン変性フェノール樹脂中に含まれる、イオン結合した金属塩類が湿し水に溶解することにより起こること、経時変化は該金属が酸化触媒として作用していることにより起こることを見出し、金属化合物を除去した原料を用い、かつエステル化触媒やレゾール化触媒に金属化合物を使用せずに調製または、金属化合物を用いた場合であってもこれらの金属成分を除去し、金属含有量を著しく減じたロジン変性フェノール樹脂を用いることで、上記課題を解決しうることを見出し、本発明は完成された。 As a result of intensive studies to improve the plate stain and stability over time, the present inventors have found that plate stain is caused by dissolution of ion-bonded metal salts contained in the rosin-modified phenolic resin in the fountain solution. It is found that the change with time is caused by the fact that the metal acts as an oxidation catalyst, and it is prepared using a raw material from which the metal compound has been removed, and without using a metal compound as an esterification catalyst or a resolation catalyst, or a metal compound It was found that the above problems could be solved by removing these metal components and using a rosin-modified phenolic resin with a significantly reduced metal content even when using the above.
すなわち、本発明は、精製ロジン類(a)、フェノール類とホルムアルデヒドの縮合物(b)およびポリオール(c)を反応させてなる、金属分含有量が10ppm以下のロジン変性フェノール樹脂;精製ロジン類(a)、フェノール類とホルムアルデヒドの縮合物(b)、ポリオール(c)ならびに多塩基酸(d)、エポキシ化合物(e)および多官能アクリレート(f)からなる群より選ばれる少なくとも1種を反応させてなる金属分含有量が10ppm以下のロジン変性フェノール樹脂;前記ロジン変性フェノール樹脂を含有するオフセット印刷用ロジン変性フェノール樹脂に関する。 That is, the present invention provides a rosin-modified phenolic resin having a metal content of 10 ppm or less obtained by reacting a purified rosin (a), a phenol-formaldehyde condensate (b) and a polyol (c); (A) Reaction of at least one selected from the group consisting of phenols and formaldehyde condensates (b), polyols (c), polybasic acids (d), epoxy compounds (e) and polyfunctional acrylates (f) The present invention relates to a rosin-modified phenol resin having a metal content of 10 ppm or less, and a rosin-modified phenol resin for offset printing containing the rosin-modified phenol resin.
本発明のロジン変性フェノール樹脂を用いることにより、版汚れおよび経時安定性を改善できるオフセット印刷用バインダーを得ることができる。また、本発明のロジン変性フェノール樹脂を用いた印刷インキは、特にオフセット枚葉インキ(枚葉インキ)、オフセット輪転インキ(オフ輪インキ)、水なしオフセットインキ等のオフセット印刷インキとして賞用されるほか、新聞インキ、凸版印刷インキ、グラビア印刷インキにも好適に使用される。 By using the rosin-modified phenolic resin of the present invention, it is possible to obtain a binder for offset printing that can improve plate stain and stability over time. In addition, printing inks using the rosin-modified phenolic resin of the present invention are used as offset printing inks such as offset sheet-fed ink (sheet-fed ink), offset rotary ink (off-wheel ink), waterless offset ink and the like. In addition, it is also suitably used for newspaper ink, letterpress printing ink, and gravure printing ink.
本発明のロジン変性フェノール樹脂は、精製ロジン類(a)(以下、成分(a)という)、フェノール類とホルムアルデヒドの縮合物(b)(以下、成分(b)という)、ポリオール(c)(以下、成分(c)という)、必要に応じて多塩基酸(d)(以下、成分(d)という)やエポキシ化合物(e)(以下、成分(e)という)、多官能アクリレート(f)(以下、成分(f)という)を反応させてなるものである。 The rosin-modified phenolic resin of the present invention comprises a purified rosin (a) (hereinafter referred to as component (a)), a phenol / formaldehyde condensate (b) (hereinafter referred to as component (b)), polyol (c) ( Hereinafter referred to as component (c)), if necessary, polybasic acid (d) (hereinafter referred to as component (d)), epoxy compound (e) (hereinafter referred to as component (e)), polyfunctional acrylate (f) (Hereinafter referred to as component (f)) is reacted.
成分(a)としては、含有する金属分を10ppm以下とした精製ロジン類であれば特に限定されず公知のものを用いることができる。具体的には、例えば、精製ガムロジン、精製ウッドロジン、精製トール油ロジンなどの精製ロジン;該精製ロジンから誘導される重合ロジン;該精製ロジンや重合ロジンを不均化または水素添加して得られる安定化ロジン;該精製ロジンや重合ロジンに、マレイン酸、無水マレイン酸、フマル酸、イタコン酸、クロトン酸、ケイ皮酸、アクリル酸、メタクリル酸などの不飽和カルボン酸類を付加して得られる不飽和酸変性ロジンなどを用いることができる。これらは1種を単独で用いても2種以上を混合して用いてもよい。なお、ここで精製とは、出発原料である未精製ロジンに含まれていた金属分を除去することを意味する。具体的には蒸留、抽出などの操作のうち少なくとも1つを行なえばよく、金属分の完全除去という観点から、蒸留を行なうことが好ましい。蒸留は、通常、温度200〜300℃、圧力130〜6000Paの範囲から蒸留時間を考慮して適宜選択すればよい。抽出は、ロジンを有機溶剤と水に溶解し、硫酸や塩酸などの酸で処理した後、金属分が10ppm以下になるまで水洗すればよい。 The component (a) is not particularly limited as long as it is a purified rosin having a metal content of 10 ppm or less, and known components can be used. Specifically, for example, purified rosin such as purified gum rosin, purified wood rosin, purified tall oil rosin; polymerized rosin derived from the purified rosin; stable obtained by disproportionating or hydrogenating the purified rosin or polymerized rosin Unsaturation obtained by adding unsaturated carboxylic acids such as maleic acid, maleic anhydride, fumaric acid, itaconic acid, crotonic acid, cinnamic acid, acrylic acid, methacrylic acid to the purified rosin or polymerized rosin An acid-modified rosin can be used. These may be used alone or in combination of two or more. Here, purification means removing the metal contained in the unpurified rosin as a starting material. Specifically, at least one of operations such as distillation and extraction may be performed, and distillation is preferably performed from the viewpoint of complete removal of metal. Distillation may be appropriately selected from the range of a temperature of 200 to 300 ° C. and a pressure of 130 to 6000 Pa in consideration of the distillation time. For extraction, rosin is dissolved in an organic solvent and water, treated with an acid such as sulfuric acid or hydrochloric acid, and then washed with water until the metal content is 10 ppm or less.
成分(b)としては、フェノール類(P)とホルムアルデヒド(F)とをF/P(モル比)が通常1〜3程度となる範囲内で塩基性触媒の存在下において付加・縮合反応させた縮合物(レゾール型フェノール樹脂)や、フェノール類(P)とホルムアルデヒド(F)とをF/P(モル比)が通常0.5〜2程度となる範囲内でシュウ酸、硫酸、塩酸、パラトルエンスルホン酸などの酸触媒の存在下において付加・縮合反応させた縮合物(ノボラック型フェノール樹脂)であって金属分の含有量を10ppm以下としたものを用いることができる。成分(b)の調製の際に用いるフェノール類(P)としては、例えば、石炭酸、クレゾール、アミルフェノール、ビスフェノールA、ブチルフェノール、オクチルフェノール、ノニルフェノール、ドデシルフェノールなどがあげられる。これらは1種を単独で用いても2種以上を混合して用いてもよい。また、ホルムアルデヒド(F)としては、例えば、ホルマリン、パラホルムアルデヒド等を使用すればよい。塩基性触媒としては、水酸化ナトリウム、水酸化カリウム、水酸化カルシウム等の金属成分を含有する塩基性触媒や、揮発性塩基触媒等公知のものを用いることができるが、金属成分を含有する塩基性触媒を用いる場合には、成分(b)中の金属分を10ppm以下にするまで洗浄を行なう必要があるため、揮発性塩基性触媒を用いることが好ましい。揮発性塩基触媒としては、通常220℃程度以下の沸点または分解温度を有するものが特に好ましい。具体的にはアンモニア水溶液、ヘキサメチレンテトラミンなどのアンモニア発生物質;メチルアミン、エチルアミン、プロピルアミン、ブチルアミン、アミルアミン、ヘキシルアミン、へプチルアミン、オクチルアミン、ノニルアミン、デシルアミンなどの脂肪族第一級アミン;ジメチルアミン、ジエチルアミン、ジプロピルアミン、ジブチルアミン、ジアミルアミンなどの脂肪族第二級アミン;トリメチルアミン、トリエチルアミンなどの脂肪族第三級アミン、アリルアミン、ジアリルアミン、トリアリルアミンなどの脂肪族不飽和アミン;シクロプロピルアミン、シクロブチルアミン、シクロヘキシルアミンなどの脂環族アミン;ベンジルアミン、フェニルアミンなどの芳香族アミン;その他にピリジン類、ピペラジン類、ピペリジン類、ピラジン類、アニリン類などをあげることができる。これらは1種を単独で用いても2種以上を混合して用いてもよい。これらの中でも、触媒活性、沸点、安全性、取り扱い性の観点から、ジエチルアミン、トリメチルアミン、トリエチルアミンなどが好ましい。 As component (b), phenols (P) and formaldehyde (F) were subjected to an addition / condensation reaction in the presence of a basic catalyst within a range where the F / P (molar ratio) was usually about 1 to 3. Condensates (resol-type phenol resins), phenols (P) and formaldehyde (F) within a range where the F / P (molar ratio) is usually about 0.5 to 2, oxalic acid, sulfuric acid, hydrochloric acid, para A condensate (novolak-type phenol resin) obtained by addition / condensation reaction in the presence of an acid catalyst such as toluenesulfonic acid and having a metal content of 10 ppm or less can be used. Examples of the phenols (P) used in the preparation of the component (b) include carboxylic acid, cresol, amylphenol, bisphenol A, butylphenol, octylphenol, nonylphenol, and dodecylphenol. These may be used alone or in combination of two or more. Moreover, as formaldehyde (F), formalin, paraformaldehyde, etc. may be used, for example. As the basic catalyst, a basic catalyst containing a metal component such as sodium hydroxide, potassium hydroxide or calcium hydroxide, or a known catalyst such as a volatile base catalyst can be used, but a base containing a metal component can be used. When a volatile catalyst is used, since it is necessary to perform washing until the metal content in the component (b) is 10 ppm or less, it is preferable to use a volatile basic catalyst. As the volatile base catalyst, those having a boiling point or decomposition temperature of usually about 220 ° C. or lower are particularly preferred. Specifically, ammonia generating substances such as aqueous ammonia and hexamethylenetetramine; aliphatic primary amines such as methylamine, ethylamine, propylamine, butylamine, amylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine; dimethyl Aliphatic secondary amines such as amine, diethylamine, dipropylamine, dibutylamine and diamylamine; Aliphatic tertiary amines such as trimethylamine and triethylamine; Aliphatic unsaturated amines such as allylamine, diallylamine and triallylamine; cyclopropylamine , Cyclobutylamine, cyclohexylamine, and other alicyclic amines; benzylamine, phenylamine, and other aromatic amines; other pyridines, piperazines, piperidines Pyrazines, and the like aniline. These may be used alone or in combination of two or more. Among these, diethylamine, trimethylamine, triethylamine and the like are preferable from the viewpoints of catalyst activity, boiling point, safety, and handleability.
(b)成分としてはロジン変性フェノール樹脂を高分子量化できる観点から、レゾール型フェノール樹脂が好ましい。該レゾール型フェノール樹脂の製造条件としては、特に限定されないが、レゾール化温度は80〜200℃程度とするのが好ましい。80℃未満の場合にはレゾール化反応速度が著しく遅く、また200℃を超える場合はレゾール化反応の制御が困難となる。前記温度領域でレゾール化反応させる場合は、ホルムアルデヒドが気化し、反応生成水が沸騰する為、使用する反応容器としては、耐圧仕様のものが好ましい。 As the component (b), a resol-type phenol resin is preferable from the viewpoint of increasing the molecular weight of the rosin-modified phenol resin. Although it does not specifically limit as manufacturing conditions of this resol type phenol resin, It is preferable that the resolumination temperature shall be about 80-200 degreeC. When it is less than 80 ° C., the resolation reaction rate is extremely slow, and when it exceeds 200 ° C., it is difficult to control the resolation reaction. When the resolation reaction is carried out in the above temperature range, formaldehyde is vaporized and the reaction product water boils, so that the reaction vessel used preferably has a pressure resistant specification.
成分(c)としては、1分子中に2以上の水酸基を含有するものであれば特に限定されず公知のものを用いることができる。具体的には、例えば、2官能のアルコール類としては、エチレングリコール、ジエチレングリコール、ポリエチレングリコール、プロピレングリコール、ポリプロピレングリコール、ネオペンチルグリコール、シクロヘキサンジメタノールなど、3官能のアルコール類としては、グリセリン、トリメチロールプロパン、トリメチロールエタンなど、4官能以上のアルコール類としては、ペンタエリスリトール、ジグリセリン、ジペンタエリスリトール、ジトリメチロールプロパン、ジトリメチロールエタンなどをあげることができる。これらは1種を単独で用いても2種以上を混合して用いてもよい。成分(c)としては、1分子中に少なくとも3つの水酸基を有する化合物を用いることにより、ロジン変性フェノール樹脂が網目構造を有し、高分子量化することができるため好ましい。 As a component (c), if it contains two or more hydroxyl groups in 1 molecule, it will not specifically limit, A well-known thing can be used. Specifically, for example, the bifunctional alcohols include ethylene glycol, diethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, neopentyl glycol, cyclohexane dimethanol, and the trifunctional alcohols include glycerin and trimethylol. Examples of the tetrafunctional or higher functional alcohols such as propane and trimethylolethane include pentaerythritol, diglycerin, dipentaerythritol, ditrimethylolpropane, and ditrimethylolethane. These may be used alone or in combination of two or more. As the component (c), a compound having at least three hydroxyl groups in one molecule is preferable because the rosin-modified phenolic resin has a network structure and can have a high molecular weight.
成分(d)は高分子量化が必要な場合に用いればよく、成分(a)以外の1分子中に2以上のカルボキシル基を有する化合物であれば特に限定されず公知のものを使用することができる。成分(d)としては、例えば、無水フタル酸、イソフタル酸、テレフタル酸、トリメリット酸等の芳香族系多塩基酸、アルケニル無水コハク酸、アジピン酸、セバシン酸、ダイマー酸等の脂肪族系多塩基酸などをあげることができる。これらは1種を単独で用いても2種以上を混合して用いてもよい。 The component (d) may be used when a high molecular weight is necessary, and any known compound may be used as long as it is a compound having two or more carboxyl groups in one molecule other than the component (a). it can. Examples of the component (d) include aromatic polybasic acids such as phthalic anhydride, isophthalic acid, terephthalic acid and trimellitic acid, and aliphatic polybasic acids such as alkenyl succinic anhydride, adipic acid, sebacic acid and dimer acid. Examples include basic acids. These may be used alone or in combination of two or more.
成分(e)も高分子量化が必要な場合に用いればよく、1分子中に2以上のエポキシ基を有する化合物であれば特に限定されず公知のものを使用することができる。例えば、ネオペンチルグリコールジグリシジルエーテル、グリセロールポリグリシジルエーテル、トリメチロールプロパンポリグリシジルエーテル、ペンタエリスリトールポリグリシジルエーテル、レゾルシノールジグリシジルエーテル、フタル酸ジグリシジル、エポキシ化アマニ油、エポキシ化大豆油などをあげることができる。これらは1種を単独で用いても2種以上を混合して用いてもよい。 The component (e) may be used when a high molecular weight is necessary, and any known compound may be used as long as it is a compound having two or more epoxy groups in one molecule. For example, neopentyl glycol diglycidyl ether, glycerol polyglycidyl ether, trimethylolpropane polyglycidyl ether, pentaerythritol polyglycidyl ether, resorcinol diglycidyl ether, diglycidyl phthalate, epoxidized linseed oil, epoxidized soybean oil, etc. it can. These may be used alone or in combination of two or more.
成分(f)も高分子量化が必要な場合に用いればよく、公知のものを特に限定されず用いることができる。具体的には、例えば、トリプロピレングリコールジアクリレート、テトラエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、ジトリメチロールプロパンテトラアクリレート、ビスフェノールAテトラエチレングリコールジアクリレート、ヘキサメチレングリコールジアクリレート、1,9−ノナンジオールジアクリレート、ペンタエリスリトールテトラアクリレート、ジペンタエリスリトールヘキサアクリレートなど、各種公知の多官能アクリルモノマーをあげることができる。これらは1種を単独で用いても2種以上を混合して用いてもよい。 The component (f) may also be used when a high molecular weight is necessary, and any known component can be used without any particular limitation. Specifically, for example, tripropylene glycol diacrylate, tetraethylene glycol diacrylate, trimethylolpropane triacrylate, ditrimethylolpropane tetraacrylate, bisphenol A tetraethylene glycol diacrylate, hexamethylene glycol diacrylate, 1,9-nonane. Various known polyfunctional acrylic monomers such as diol diacrylate, pentaerythritol tetraacrylate, and dipentaerythritol hexaacrylate can be given. These may be used alone or in combination of two or more.
本発明のロジン変性フェノール樹脂を構成する成分(a)、成分(b)、成分(c)の各使用割合は特に限定されず、用途に応じてそれぞれ適宜に決定すればよいが、通常、成分(a)の使用割合は41〜89重量%程度、好ましくは46〜73重量%程度であり、成分(b)の使用割合は9〜50重量%程度、好ましくは22〜46重量%程度であり、成分(c)の使用割合は、2〜9重量%程度、好ましくは3〜8重量%程度である。 The ratio of each of the component (a), component (b), and component (c) constituting the rosin-modified phenolic resin of the present invention is not particularly limited and may be appropriately determined depending on the use. The use ratio of (a) is about 41 to 89% by weight, preferably about 46 to 73% by weight, and the use ratio of component (b) is about 9 to 50% by weight, preferably about 22 to 46% by weight. The proportion of component (c) used is about 2 to 9% by weight, preferably about 3 to 8% by weight.
成分(d)を使用する場合の使用量は特に限定されないが、前記成分(a)〜(c)の合計使用量を100重量部とした場合、0.5〜20重量部程度である。また、成分(e)を使用する場合の使用量は、特に限定されないが、前記成分(a)〜(c)の合計使用量を100重量部とした場合、0.5〜10重量部程度である。さらに成分(f)を使用する場合の使用量は、特に限定されないが、前記成分(a)〜(c)の合計使用量を100重量部とした場合、0.5〜20重量部程度である。 Although the usage-amount in the case of using a component (d) is not specifically limited, When the total usage-amount of the said component (a)-(c) is 100 weight part, it is about 0.5-20 weight part. Moreover, the usage-amount in the case of using a component (e) is although it does not specifically limit, When the total usage-amount of the said component (a)-(c) is 100 weight part, it is about 0.5-10 weight part. is there. Further, the amount of use in the case of using the component (f) is not particularly limited, but is about 0.5 to 20 parts by weight when the total use amount of the components (a) to (c) is 100 parts by weight. .
次に本発明のロジン変性フェノール樹脂は、例えば、成分(a)、成分(b)および成分(c)を所定量ずつ反応装置に仕込み、150〜300℃程度の温度範囲にて1〜20時間程度反応させる。成分(d)〜成分(f)を用いる場合に、添加する時期は特に限定されないが、通常、反応開始時または反応途中で添加すればよい。反応時には、必要に応じて各種公知の有機酸性触媒を用いてもよく、例えば、メタンスルホン酸、パラトルエンスルホン酸、ドデシルベンゼンスルホン酸などのスルホン酸、リン酸などのリン化合物を使用することができる。 Next, for example, the rosin-modified phenolic resin of the present invention is charged with a predetermined amount of component (a), component (b) and component (c) in a reactor, and the temperature range of about 150 to 300 ° C. for 1 to 20 hours. React to a certain extent. When component (d) to component (f) are used, the timing of addition is not particularly limited, but it may be usually added at the start of the reaction or during the reaction. During the reaction, various known organic acidic catalysts may be used as necessary. For example, sulfonic acids such as methanesulfonic acid, paratoluenesulfonic acid, dodecylbenzenesulfonic acid, and phosphorus compounds such as phosphoric acid may be used. it can.
前記反応方法によって金属分含有量を10ppm以下とした本発明のロジン変性フェノール樹脂の軟化点は、120〜200℃程度が好ましく、更に好ましくは140〜200℃である。これは軟化点を120℃以上とすることによって印刷物の乾燥性、セット性を良好に保つことができるためであり、またインキ用溶剤への溶解性を考慮すると200℃以下が適当であるからである。また本発明のロジン変性フェノール樹脂の重量平均分子量は、10,000〜400,000程度が好ましく、更に好ましくは20,000〜200,000の範囲である。10,000より小さい場合では所望の粘度が得られにくく、400,000より大きい場合ではインキ用溶媒への不溶物が発生しやすくなる。本発明のロジン変性フェノール樹脂の溶解性は良好であり、芳香族成分を含まないインキ用溶剤にも十分な溶解性を有している。
The softening point of the rosin-modified phenolic resin of the present invention having a metal content of 10 ppm or less by the reaction method is preferably about 120 to 200 ° C, more preferably 140 to 200 ° C. This is because when the softening point is 120 ° C. or higher, it is possible to maintain good drying and setting properties of the printed matter, and 200 ° C. or lower is appropriate considering the solubility in the ink solvent. is there. The weight average molecular weight of the rosin-modified phenolic resin of the present invention is preferably about 10,000 to 400,000, more preferably 20,000 to 200,000. When it is less than 10,000, it is difficult to obtain a desired viscosity, and when it is more than 400,000, insoluble matter in the ink solvent tends to be generated. The solubility of the rosin-modified phenolic resin of the present invention is good, and it has sufficient solubility in an ink solvent that does not contain an aromatic component.
こうして得られた金属分含有量を10ppm以下のロジン変性フェノール樹脂に、必要に応じて、植物油類、インキ用溶剤などを加えて混合し、樹脂ワニスを製造することができる。 A resin varnish can be produced by adding a vegetable oil, a solvent for ink, and the like to a rosin-modified phenolic resin having a metal content of 10 ppm or less, if necessary, and mixing them.
当該樹脂ワニスに用いられる植物油類としては、各種公知のものを限定なく使用できる。具体的には、例えば、アマニ油、桐油、サフラワー油、脱水ヒマシ油、大豆油等の植物油の他、アマニ油脂肪酸メチル、大豆油脂肪酸メチル、アマニ油脂肪酸エチル、大豆油脂肪酸エチル、アマニ油脂肪酸プロピル、大豆油脂肪酸プロピル、アマニ油脂肪酸ブチル、大豆油脂肪酸ブチルなどといった前記植物油のモノエステルなどがあげられる。これらは単独で用いても2種以上を適宜に併用しても良い。これらの中では、印刷物の乾燥性の点から分子中に不飽和結合を有する植物油が好ましく、環境に対する負荷が小さい点から大豆油が特に好ましい。なお、当該植物油類も蒸留等により、金属成分を除去しておくことが好ましい。 As vegetable oils used for the resin varnish, various known oils can be used without limitation. Specifically, for example, flaxseed oil, tung oil, safflower oil, dehydrated castor oil, soybean oil and other vegetable oils, flaxseed oil fatty acid methyl, soybean oil fatty acid methyl, flaxseed oil fatty acid ethyl, soybean oil fatty acid ethyl, flaxseed oil Examples thereof include monoesters of the vegetable oils such as fatty acid propyl, soybean oil fatty acid propyl, linseed oil fatty acid butyl, soybean oil fatty acid butyl and the like. These may be used alone or in combination of two or more. In these, the vegetable oil which has an unsaturated bond in a molecule | numerator from the point of the drying property of printed matter is preferable, and soybean oil is especially preferable from the point with a small load with respect to an environment. In addition, it is preferable to remove the metal component from the vegetable oils by distillation or the like.
当該樹脂ワニスに用いられるインキ用溶剤としては、従来公知のインキ用溶剤を特に限定なく使用することができる。具体的には、例えば、新日本石油(株)製の石油系溶剤である0号ソルベント、4号ソルベント、5号ソルベント、6号ソルベント、7号ソルベント、AFソルベント4号、AFソルベント5号、AFソルベント6号、AFソルベント7号などがあげられる。これらは単独で用いても2種以上を適宜に併用しても良い。特に環境対策面から沸点が200℃以上で芳香族炭化水素の含有率が1重量%以下であるAFソルベントを使用することが好ましい。なお、環境負荷を低減した印刷インキが必要な場合には、インキ用溶剤を用いず植物油類のみを用いればよい。なお、当該インキ溶剤も蒸留等により、金属成分を除去しておくことが好ましい。 As the ink solvent used in the resin varnish, a conventionally known ink solvent can be used without any particular limitation. Specifically, for example, No. 0 Solvent, No. 4, Solvent No. 5, No. 5 Solvent, No. 6 Solvent, No. 7 Solvent, AF Solvent No. 4, AF Solvent No. 5, which are petroleum solvents manufactured by Nippon Oil Corporation, Examples include AF solvent 6 and AF solvent 7. These may be used alone or in combination of two or more. In particular, it is preferable to use an AF solvent having a boiling point of 200 ° C. or more and an aromatic hydrocarbon content of 1% by weight or less from the viewpoint of environmental measures. When printing ink with reduced environmental load is required, only vegetable oils may be used without using ink solvents. In addition, it is preferable to remove the metal component from the ink solvent by distillation or the like.
当該樹脂ワニスは、上記各成分を混合、攪拌して製造することができるが、混合攪拌の際には、これらを100〜240℃程度に加熱して各成分を溶解させて混合し、必要に応じて添加剤を使用して得られる。添加剤としては、弾性を付与するためのゲル化剤の他、酸化防止剤などがあげられる。 The resin varnish can be manufactured by mixing and stirring the above components, but when mixing and stirring, these components are heated to about 100 to 240 ° C. to dissolve and mix the components. Depending on the use of additives. Examples of the additive include an antioxidant as well as a gelling agent for imparting elasticity.
前記ゲル化剤としては、例えば、オクチル酸アルミニウム、ステアリン酸アルミニウム、アルミニウムトリイソプロポキシド、アルミニウムトリブトキシド、アルミニウムジプロポキシドモノアセチルアセテート、アルミニウムジブトキシドモノアセチルアセテート、アルミニウムトリアセチルアセテート、テトライソプロポキシチタン、テトラブトキシチタン、ジプロポキシビス(アセチルアセトナト)チタン、テトラブトキシジルコニウム、成分(e)のエポキシ化合物、トリレンジイソシアネート、ジフェニルジイソシアネート、ヘキサメチレンジイソシアネート、キシリレンジイソシアネート、イソホロンジイソシアネートなど各種公知のものを特に限定無く使用できる。これらは1種を単独で用いても2種以上を混合して用いてもよい。版汚れ改善の点から、樹脂ワニス製造後にイオン結合を形成しない化合物が好ましく、具体的には前記アルミニウム化合物、エポキシ化合物、イソシアネートを使用することが好ましい。 Examples of the gelling agent include aluminum octylate, aluminum stearate, aluminum triisopropoxide, aluminum tributoxide, aluminum dipropoxide monoacetyl acetate, aluminum dibutoxide monoacetyl acetate, aluminum triacetyl acetate, tetraisopropoxy. Various known materials such as titanium, tetrabutoxytitanium, dipropoxybis (acetylacetonato) titanium, tetrabutoxyzirconium, epoxy compound of component (e), tolylene diisocyanate, diphenyl diisocyanate, hexamethylene diisocyanate, xylylene diisocyanate, isophorone diisocyanate Can be used without any particular limitation. These may be used alone or in combination of two or more. From the viewpoint of improving plate stains, a compound that does not form an ionic bond after the production of the resin varnish is preferable. Specifically, it is preferable to use the aluminum compound, epoxy compound, or isocyanate.
印刷インキは、顔料(黄色、紅色、藍色または黒色など)、前記樹脂ワニスを含有し、必要に応じて各種公知の添加剤を使用して、ロールミル、ボールミル、アトライター、サンドミルといった公知のインキ製造装置を用いて適切なインキ恒数となるよう、練肉・調製することにより得られる。添加剤としては、インキ流動性やインキ表面被膜を改善するための界面活性剤、ワックスなどがあげられる。 The printing ink contains pigments (yellow, red, indigo or black), the resin varnish, and various known additives, if necessary, known inks such as a roll mill, ball mill, attritor, and sand mill. It is obtained by kneading and preparing the ink so as to obtain an appropriate ink constant using a production apparatus. Examples of the additives include surfactants for improving ink fluidity and ink surface coating, and waxes.
以下、製造例、実施例をあげて本発明を更に具体的に説明するが、本発明を限定するものではない。なお、以下「部」とは重量部を示す。 Hereinafter, the present invention will be described more specifically with reference to production examples and examples, but the present invention is not limited thereto. Hereinafter, “parts” means parts by weight.
製造例1:(精製ロジンの製造)
攪拌機、温度計および減圧装置を備えた反応容器に、未精製の中国ガムロジン(残存金属量22ppm(Al)、7ppm(Ca)、13ppm(Fe)、酸価170.0、軟化点78℃)1,000部を仕込み、窒素雰囲気下に攪拌しながら190℃まで昇温した。その後、400Paの減圧下で蒸留、280℃まで昇温し、210〜280℃の留分を精製ロジンとした。得られた精製ロジンの金属分含有量は0ppm、酸価は178.4、軟化点は88℃であった。ここに、金属分含有量測定には、原子吸光分析装置5100型(パーキンエルマー社製)を用いた(以下、金属分含有量は同様の方法で測定した値である)。また、酸価とは、JIS K5601に準拠する(以下、酸価は同様の方法で測定した値である)。また、軟化点とは、JIS K5903に準拠する(以下、軟化点は同様の方法で測定した値である)。
Production Example 1: (Production of purified rosin)
In a reaction vessel equipped with a stirrer, a thermometer, and a decompressor, unpurified Chinese gum rosin (residual metal amount 22 ppm (Al), 7 ppm (Ca), 13 ppm (Fe), acid value 170.0, softening point 78 ° C.) 1 1,000 parts were charged and the temperature was raised to 190 ° C. with stirring in a nitrogen atmosphere. Thereafter, distillation was performed under reduced pressure of 400 Pa, the temperature was raised to 280 ° C., and a fraction at 210 to 280 ° C. was used as a purified rosin. The purified rosin obtained had a metal content of 0 ppm, an acid value of 178.4, and a softening point of 88 ° C. Here, atomic absorption analyzer type 5100 (manufactured by Perkin Elmer) was used for measuring the metal content (hereinafter, the metal content is a value measured by the same method). The acid value is based on JIS K5601 (hereinafter, the acid value is a value measured by the same method). The softening point is based on JIS K5903 (hereinafter, the softening point is a value measured by the same method).
製造例2:(揮発性塩基触媒を用いた70%レゾール型p−ノニルフェノールキシレン溶液の製造)
攪拌機、内圧計および温度計を備えた1.5MPaの耐圧反応容器に、p−ノニルフェノール1,000部およびパラホルムアルデヒド300部を仕込み、密閉加圧下に80℃まで昇温させながら溶解させた後、トリエチルアミン40部を添加した。ついで、125℃まで昇温し、30分間保温後、90℃まで冷却した。圧抜き後にキシレン300部を仕込み、内容物を冷却してレゾール型p−ノニルフェノールの70%キシレン溶液(固形分70%)を得た。なお、金属分含有量は0ppmであった。
Production Example 2: (Production of 70% resol-type p-nonylphenol xylene solution using a volatile base catalyst)
After charging 1,000 parts of p-nonylphenol and 300 parts of paraformaldehyde into a 1.5 MPa pressure-resistant reaction vessel equipped with a stirrer, an internal pressure gauge, and a thermometer, and dissolving them while raising the temperature to 80 ° C. under hermetically pressurized, 40 parts of triethylamine was added. Next, the temperature was raised to 125 ° C., kept for 30 minutes, and then cooled to 90 ° C. After depressurization, 300 parts of xylene was charged, and the contents were cooled to obtain a 70% xylene solution (solid content: 70%) of resol-type p-nonylphenol. The metal content was 0 ppm.
製造例3:(塩基性金属触媒を用いた70%レゾール型p−ノニルフェノールキシレン溶液の製造)
攪拌機、還流冷却管および温度計を備えた反応容器に、p−ノニルフェノール1,000部、パラホルムアルデヒド476部、キシレン600部および水500部を仕込み、攪拌下に50℃まで昇温した。そして50℃において水酸化カルシウム10部を仕込み、冷却しながら90℃まで徐々に昇温した後、2.5時間保温し、塩酸を滴下してpHを6付近に調整した。その後、ホルムアルデヒドなどを含んだ水層部を除去し、内容物を冷却してレゾール型p−ノニルフェノールの70%キシレン溶液(固形分70%)を得た。なお、金属分含有量は31ppm(Ca)であった。
Production Example 3: (Production of 70% resol-type p-nonylphenol xylene solution using a basic metal catalyst)
A reaction vessel equipped with a stirrer, a reflux condenser and a thermometer was charged with 1,000 parts of p-nonylphenol, 476 parts of paraformaldehyde, 600 parts of xylene and 500 parts of water, and the temperature was raised to 50 ° C. with stirring. Then, 10 parts of calcium hydroxide was added at 50 ° C., and the temperature was gradually raised to 90 ° C. while cooling. Then, the mixture was kept warm for 2.5 hours, and hydrochloric acid was added dropwise to adjust the pH to around 6. Thereafter, the aqueous layer containing formaldehyde and the like was removed, and the contents were cooled to obtain a 70% xylene solution (solid content 70%) of resol-type p-nonylphenol. The metal content was 31 ppm (Ca).
実施例1:(精製ロジンと揮発性塩基触媒を用いたレゾール型フェノール樹脂を原料としたロジン変性フェノール樹脂の製造)
攪拌機、分水器付き還流冷却管および温度計を備えた反応容器に、製造例1で得た精製ロジン552部を仕込み、これを窒素雰囲気下に攪拌しながら200℃まで昇温して溶融した。ついで、ペンタエリスリトール52部を添加し、攪拌下に280℃まで昇温、酸価が25以下となるまで反応させた。さらに230℃まで冷却した後、製造例2で得たレゾール型p−ノニルフェノールの70%キシレン溶液394部(固形分276部)を230〜250℃の温度範囲内で5時間かけて系内へ滴下した。滴下終了後、33重量%アマニ油粘度が5.0Pa・sとなるよう調整し、0.02MPaで10分間減圧後、内容物を取出してロジン変性フェノール樹脂を得た。なお、当該樹脂の金属分含有量は0ppm、芳香族炭化水素系溶剤(商品名 0号ソルベントH、新日本石油(株)製)溶液のトレランスは3.2g/g、酸価は17.2、軟化点は147℃、重量平均分子量は39,000であった。ここに、33%アマニ油粘度とは、樹脂とアマニ油を1対2重量比で加熱混合したものを日本レオロジー機器(株)製コーン&プレート型粘度計を用いて25℃で測定した粘度をいう(以下、33%アマニ油粘度は同様の方法で測定した値である)。また、トレランス(溶解性の指標)とは、樹脂と0号ソルベントHを1対1の重量比で加熱混合したものに25℃でさらに0号ソルベントHを加えて白濁するまでに要した総溶剤重量に対する樹脂重量から算出した値である(以下、トレランスは同様の方法で測定した値である)。また、重量平均分子量測定には、東ソー(株)製ゲルパーメーションクロマトグラフィー(商品名 HLC−8020)および東ソー(株)製カラム(商品名 TSK−GEL)を用いた(以下、重量平均分子量は同様の方法で測定した値である)。
Example 1: (Production of rosin-modified phenolic resin from resol-type phenolic resin using purified rosin and volatile base catalyst)
Into a reaction vessel equipped with a stirrer, a reflux condenser with a water separator and a thermometer, 552 parts of the purified rosin obtained in Production Example 1 was charged, and the mixture was heated to 200 ° C. with stirring in a nitrogen atmosphere and melted. . Next, 52 parts of pentaerythritol was added, the temperature was raised to 280 ° C. with stirring, and the reaction was continued until the acid value was 25 or less. After further cooling to 230 ° C., 394 parts of a 70% xylene solution of resole-type p-nonylphenol obtained in Production Example 2 (276 parts of solid content) was dropped into the system over 5 hours within a temperature range of 230 to 250 ° C. did. After completion of dropping, the viscosity of 33% by weight linseed oil was adjusted to 5.0 Pa · s, and after decompression at 0.02 MPa for 10 minutes, the contents were taken out to obtain a rosin-modified phenolic resin. The metal content of the resin is 0 ppm, the tolerance of the aromatic hydrocarbon solvent (trade name: 0 Solvent H, manufactured by Nippon Oil Corporation) is 3.2 g / g, and the acid value is 17.2. The softening point was 147 ° C. and the weight average molecular weight was 39,000. Here, the 33% linseed oil viscosity is the viscosity measured at 25 ° C. using a cone and plate viscometer made by Nippon Rheology Equipment Co., Ltd. with a mixture of resin and linseed oil heated in a 1 to 2 weight ratio. (Hereinafter, 33% linseed oil viscosity is a value measured by the same method). The tolerance (solubility index) is the total solvent required until the solution and No. 0 solvent H are heated and mixed at a 1 to 1 weight ratio and further added to No. 0 solvent H at 25 ° C to become cloudy. It is a value calculated from the resin weight relative to the weight (hereinafter, tolerance is a value measured by the same method). Moreover, the gel permeation chromatography (trade name HLC-8020) manufactured by Tosoh Corporation and the column (trade name TSK-GEL) manufactured by Tosoh Corporation were used for the weight average molecular weight measurement (hereinafter, the weight average molecular weight is It is a value measured by the same method).
実施例2:(精製ロジンと揮発性塩基触媒を用いたレゾール型フェノール樹脂を原料としたロジン変性フェノール樹脂の製造)
実施例1と同様の反応容器に、製造例1で得た精製ロジン552部を仕込み、これを窒素雰囲気下に攪拌しながら200℃まで昇温して溶融した。ついで、グリセリン51部を添加し、攪拌下に250℃まで昇温した。250℃でイソフタル酸2部添加し、280℃まで昇温、酸価が25以下となるまで反応した。さらに230℃まで冷却した後、製造例2で得たレゾール型p−ノニルフェノールの70%キシレン溶液394部(固形分276部)を230〜250℃の温度範囲内で5時間かけて系内へ滴下した。滴下終了後、33重量%アマニ油粘度が5.0Pa・sとなるよう調整し、0.02MPaで10分間減圧後、内容物を取出してロジン変性フェノール樹脂を得た。なお、当該樹脂の金属分含有量は0ppm、芳香族炭化水素系溶剤(商品名 0号ソルベントH、新日本石油(株)製)溶液のトレランスは2.5g/g、酸価は16.8、軟化点は147℃、重量平均分子量は42,000であった。
Example 2: (Production of rosin-modified phenolic resin from resol-type phenolic resin using purified rosin and volatile base catalyst)
In a reaction vessel similar to that in Example 1, 552 parts of the purified rosin obtained in Production Example 1 was charged, and this was heated to 200 ° C. with stirring in a nitrogen atmosphere and melted. Next, 51 parts of glycerin was added, and the temperature was raised to 250 ° C. with stirring. 2 parts of isophthalic acid was added at 250 ° C., the temperature was raised to 280 ° C., and the reaction was continued until the acid value became 25 or less. After further cooling to 230 ° C., 394 parts of a 70% xylene solution of resole-type p-nonylphenol obtained in Production Example 2 (276 parts of solid content) was dropped into the system over 5 hours within a temperature range of 230 to 250 ° C. did. After completion of dropping, the viscosity of 33% by weight linseed oil was adjusted to 5.0 Pa · s, and after decompression at 0.02 MPa for 10 minutes, the contents were taken out to obtain a rosin-modified phenolic resin. The resin has a metal content of 0 ppm, an aromatic hydrocarbon solvent (trade name: 0 Solvent H, manufactured by Nippon Oil Corporation) has a tolerance of 2.5 g / g, and an acid value of 16.8. The softening point was 147 ° C. and the weight average molecular weight was 42,000.
実施例3:(精製ロジンと揮発性塩基触媒を用いたレゾール型フェノール樹脂を原料としたロジン変性フェノール樹脂の製造)
実施例1と同様の反応容器に、製造例1で得た精製ロジン552部を仕込み、これを窒素雰囲気下に攪拌しながら200℃まで昇温して溶融した。ついで、グリセリン48部およびトリメチロールプロパンポリグリシジルエーテル4部を添加し、攪拌下に280℃まで昇温、酸価が25以下となるまで反応した。さらに230℃まで冷却した後、製造例2で得たレゾール型p−ノニルフェノールの70%キシレン溶液394部(固形分276部)を230〜250℃の温度範囲内で5時間かけて系内へ滴下した。滴下終了後、33重量%アマニ油粘度が5.0Pa・sとなるよう調整し、0.02MPaで10分間減圧後、内容物を取出してロジン変性フェノール樹脂を得た。なお、当該樹脂の金属分含有量は0ppm、芳香族炭化水素系溶剤(商品名 0号ソルベントH、新日本石油(株)製)溶液のトレランスは2.7g/g、酸価は16.5、軟化点は144℃、重量平均分子量は48,000であった。
Example 3: (Production of rosin-modified phenolic resin from resol-type phenolic resin using purified rosin and volatile base catalyst)
In a reaction vessel similar to that in Example 1, 552 parts of the purified rosin obtained in Production Example 1 was charged, and this was heated to 200 ° C. with stirring in a nitrogen atmosphere and melted. Next, 48 parts of glycerin and 4 parts of trimethylolpropane polyglycidyl ether were added, the temperature was raised to 280 ° C. with stirring, and the reaction was continued until the acid value became 25 or less. After further cooling to 230 ° C., 394 parts of a 70% xylene solution of resole-type p-nonylphenol obtained in Production Example 2 (276 parts of solid content) was dropped into the system over 5 hours within a temperature range of 230 to 250 ° C. did. After completion of dropping, the viscosity of 33% by weight linseed oil was adjusted to 5.0 Pa · s, and after decompression at 0.02 MPa for 10 minutes, the contents were taken out to obtain a rosin-modified phenolic resin. The resin has a metal content of 0 ppm, and an aromatic hydrocarbon solvent (trade name: 0 Solvent H, manufactured by Nippon Oil Corporation) has a tolerance of 2.7 g / g and an acid value of 16.5. The softening point was 144 ° C. and the weight average molecular weight was 48,000.
実施例4:(精製ロジンと揮発性塩基触媒を用いたレゾール型フェノール樹脂を原料としたロジン変性フェノール樹脂の製造)
実施例1と同様の反応容器に、製造例1で得た精製ロジン552部を仕込み、これを窒素雰囲気下に攪拌しながら200℃まで昇温して溶融した。ついで、ペンタエリスリトール52部を添加し、攪拌下に280℃まで昇温、酸価が25以下となるまで反応させた。さらに230℃まで冷却した後、トリメチロールプロパントリアクリレート1部を添加し、製造例2で得たレゾール型p−ノニルフェノールの70%キシレン溶液394部(固形分276部)を230〜250℃の温度範囲内で5時間かけて系内へ滴下した。滴下終了後、33重量%アマニ油粘度が5.0Pa・sとなるよう調整し、0.02MPaで10分間減圧後、内容物を取出してロジン変性フェノール樹脂を得た。なお、当該樹脂の金属分含有量は0ppm、芳香族炭化水素系溶剤(商品名 0号ソルベントH、新日本石油(株)製)溶液のトレランスは2.5g/g、酸価は17.8、軟化点は149℃、重量平均分子量は47,000であった。
Example 4: (Production of rosin-modified phenolic resin from resol-type phenolic resin using purified rosin and volatile base catalyst)
In a reaction vessel similar to that in Example 1, 552 parts of the purified rosin obtained in Production Example 1 was charged, and this was heated to 200 ° C. with stirring in a nitrogen atmosphere and melted. Next, 52 parts of pentaerythritol was added, the temperature was raised to 280 ° C. with stirring, and the reaction was continued until the acid value was 25 or less. After further cooling to 230 ° C., 1 part of trimethylolpropane triacrylate was added, and 394 parts of a 70% xylene solution of resole-type p-nonylphenol obtained in Production Example 2 (276 parts of solid content) was heated to 230 to 250 ° C. It dripped in the system over 5 hours within the range. After completion of dropping, the viscosity of 33% by weight linseed oil was adjusted to 5.0 Pa · s, and after decompression at 0.02 MPa for 10 minutes, the contents were taken out to obtain a rosin-modified phenolic resin. The resin had a metal content of 0 ppm, and an aromatic hydrocarbon solvent (trade name: 0 Solvent H, manufactured by Nippon Oil Corporation) had a tolerance of 2.5 g / g and an acid value of 17.8. The softening point was 149 ° C. and the weight average molecular weight was 47,000.
実施例5:(精製ロジンと塩基性金属触媒および塩基性金属触媒を用いたレゾール型フェノール樹脂を原料としたロジン変性フェノール樹脂の製造)
実施例1において、製造例2で得たレゾール型フェノール樹脂の代わりに、製造例2で得たレゾール型フェノール樹脂197部(固形分138部)および製造例3で得たレゾール型フェノール樹脂197部(固形分138部)を使用すること以外は同様にして、ロジン変性フェノール樹脂を製造した。なお、当該樹脂の金属分含有量は8ppm(Ca)、芳香族炭化水素系溶剤(商品名 0号ソルベントH、新日本石油(株)製)溶液のトレランスは3.1g/g、酸価は16.9、軟化点は146℃、重量平均分子量は38,000であった。
Example 5: (Production of rosin-modified phenolic resin from resol-type phenolic resin using purified rosin, basic metal catalyst and basic metal catalyst)
In Example 1, instead of the resol type phenol resin obtained in Production Example 2, 197 parts of the resol type phenol resin obtained in Production Example 2 (solid part: 138 parts) and 197 parts of the resol type phenol resin obtained in Production Example 3 A rosin-modified phenolic resin was produced in the same manner except that (solid content of 138 parts) was used. In addition, the metal content of the resin is 8 ppm (Ca), the tolerance of the aromatic hydrocarbon solvent (trade name: 0 Solvent H, manufactured by Shin Nippon Oil Co., Ltd.) is 3.1 g / g, and the acid value is The softening point was 146 ° C., and the weight average molecular weight was 38,000.
比較例1:(未精製ロジンと塩基性金属触媒を用いたレゾール型フェノール樹脂を原料としたロジン変性フェノール樹脂の製造)
実施例1において、精製ロジンおよび製造例2で得たレゾール型フェノール樹脂の代わりに、未精製の中国ガムロジンおよび製造例3で得たレゾール型フェノール樹脂を使用すること以外は同様にして、ロジン変性フェノール樹脂を製造した。なお、当該樹脂の金属分含有量は15ppm(Al)、21ppm(Ca)、10ppm(Fe)、芳香族炭化水素系溶剤(商品名 0号ソルベントH、新日本石油(株)製)溶液のトレランスは3.0g/g、酸価は16.9、軟化点は141℃、重量平均分子量は38,000であった。
Comparative Example 1: (Production of rosin-modified phenolic resin from resol-type phenolic resin using raw rosin and basic metal catalyst)
In Example 1, in place of the purified rosin and the resol type phenol resin obtained in Production Example 2, an unpurified Chinese gum rosin and the resol type phenol resin obtained in Production Example 3 were used in the same manner. A phenolic resin was produced. The metal content of the resin is 15 ppm (Al), 21 ppm (Ca), 10 ppm (Fe), tolerance of an aromatic hydrocarbon solvent (trade name: 0 Solvent H, manufactured by Nippon Oil Corporation). Was 3.0 g / g, the acid value was 16.9, the softening point was 141 ° C., and the weight average molecular weight was 38,000.
比較例2:(未精製ロジンと揮発性塩基触媒を用いたレゾール型フェノール樹脂を原料としたロジン変性フェノール樹脂の製造)
実施例1において、精製ロジンの代わりに、未精製の中国ガムロジンを使用すること以外は同様にして、ロジン変性フェノール樹脂を製造した。なお、当該樹脂の金属分含有量は14ppm(Al)、5ppm(Ca)、9ppm(Fe)、芳香族炭化水素系溶剤(商品名 0号ソルベントH、新日本石油(株)製)溶液のトレランスは3.3g/g、酸価は17.1、軟化点は141℃、重量平均分子量は40,000であった。
Comparative Example 2: (Production of rosin-modified phenolic resin from resol-type phenolic resin using raw rosin and volatile base catalyst)
In Example 1, a rosin-modified phenolic resin was produced in the same manner except that unpurified Chinese gum rosin was used instead of purified rosin. The metal content of the resin is 14 ppm (Al), 5 ppm (Ca), 9 ppm (Fe), tolerance of an aromatic hydrocarbon solvent (trade name: 0 Solvent H, manufactured by Nippon Oil Corporation). Was 3.3 g / g, the acid value was 17.1, the softening point was 141 ° C., and the weight average molecular weight was 40,000.
比較例3:(精製ロジンと塩基性金属触媒を用いたレゾール型フェノール樹脂を原料としたロジン変性フェノール樹脂の製造)
実施例1において、製造例2で得たレゾール型フェノール樹脂の代わりに、製造例3で得たレゾール型フェノール樹脂を使用すること以外は同様にして、ロジン変性フェノール樹脂を製造した。なお、当該樹脂の金属分含有量は14ppm(Ca)、芳香族炭化水素系溶剤(商品名 0号ソルベントH、新日本石油(株)製)溶液のトレランスは3.0g/g、酸価は17.0、軟化点は146℃、重量平均分子量は38,000であった。
Comparative Example 3: (Production of rosin-modified phenolic resin using resol-type phenolic resin as raw material using purified rosin and basic metal catalyst)
In Example 1, a rosin-modified phenol resin was produced in the same manner except that the resol type phenol resin obtained in Production Example 3 was used instead of the resol type phenol resin obtained in Production Example 2. In addition, the metal content of the resin is 14 ppm (Ca), the tolerance of the aromatic hydrocarbon solvent (trade name: No. 0 Solvent H, manufactured by Shin Nippon Oil Co., Ltd.) is 3.0 g / g, and the acid value is 17.0, the softening point was 146 ° C., and the weight average molecular weight was 38,000.
(ワニスの調製)
各実施例および比較例で得られた樹脂を48部、大豆油10部、及びAFソルベント7号(新日本石油(株)製、非芳香族石油系溶剤)40部を180℃で30分間混合溶解した。次にこれを80℃まで冷却した後、アルミキレート(商品名ALCH、川研ファインケミカル(株)製)2部を加え190℃まで加熱して1時間ゲル化反応させ、ゲルワニスを得た。
(Preparation of varnish)
48 parts of the resin obtained in each example and comparative example, 10 parts of soybean oil, and 40 parts of AF Solvent No. 7 (manufactured by Shin Nippon Oil Co., Ltd., non-aromatic petroleum solvent) are mixed at 180 ° C. for 30 minutes. Dissolved. Next, after cooling to 80 ° C., 2 parts of aluminum chelate (trade name ALCH, manufactured by Kawaken Fine Chemical Co., Ltd.) was added and heated to 190 ° C. for 1 hour to obtain a gel varnish.
(ワニスの安定性試験)
粘度:調製後および室温で3ヶ月放置後のゲルワニスを日本レオロジー機器(株)製コーン&プレート型粘度計を用いて25℃で測定した。粘度変化が少ない程、良好である。結果を表1に示した。
(Varnish stability test)
Viscosity: The gel varnish after preparation and after standing at room temperature for 3 months was measured at 25 ° C. using a cone and plate viscometer manufactured by Nippon Rheology Equipment Co., Ltd. The smaller the change in viscosity, the better. The results are shown in Table 1.
(印刷インキの調製)
前記実施例および比較例のゲルワニスを用い、次の配合割合で3本ロールミルにより練肉して印刷インキを調製した。
カーボンブラック 18重量部
前記ゲルワニス 65〜73重量部
日石AFソルベント7号 9〜17重量部
上記配合に基づいて30℃、400rpmにおけるインコメーターのタック値が9.5±0.5、25℃におけるスプレッドメーターのフロー値が20.0±1.0となるよう適宜調整した。
(Preparation of printing ink)
Using the gel varnishes of the examples and comparative examples, printing ink was prepared by kneading with a three roll mill at the following blending ratio.
Carbon black 18 parts by weight Gel varnish 65-73 parts by weight Nisseki AF Solvent No. 7 9-17 parts by weight Based on the above formulation, the incometer tack value at 30 ° C. and 400 rpm is 9.5 ± 0.5 at 25 ° C. The flow meter was adjusted as appropriate so that the flow value of the spread meter was 20.0 ± 1.0.
(インキの性能試験)
乳化率:インキ25gをリソトロニック乳化試験機(NOVOCONTROL社製)を用いて飽和状態まで乳化した。その後、銅版上で乳化インキ中の余剰水をヘラで切り、カールフィッシャー水分計(京都電子工業(株)製)で乳化率を測定した。乳化率は数値が小さいほど良好であることを表し、結果を表1に示した。
版汚れ性:インキ0.4mlをRIテスター(石川島産業機械(株)製)の全面ロールに塗布した後、PS版に展色した。その後、湿し水供給装置にて水を供給した。60rpmで30秒回転した後に、PS版の非画線部の汚れ具合を目視で評価した。全く汚れない◎、極僅かに汚れる○、若干汚れる△、汚れる×で表し、結果を表1に示した。
(Ink performance test)
Emulsification rate: 25 g of ink was emulsified to a saturated state using a lithotronic emulsification tester (manufactured by NOVOCONTROL). Thereafter, excess water in the emulsified ink was cut with a spatula on the copper plate, and the emulsification rate was measured with a Karl Fischer moisture meter (manufactured by Kyoto Electronics Industry Co., Ltd.). The smaller the numerical value, the better the emulsification rate, and the results are shown in Table 1.
Plate stain resistance: 0.4 ml of ink was applied to the entire roll of an RI tester (manufactured by Ishikawajima Industrial Machinery Co., Ltd.) and then developed on the PS plate. Then, water was supplied with the dampening water supply apparatus. After rotating at 60 rpm for 30 seconds, the degree of contamination of the non-image area of the PS plate was visually evaluated. The results are shown in Table 1. The results are shown in Table 1.
本発明に係るロジン変性フェノール樹脂を用いた印刷インキ(実施例1〜5)は、樹脂中の残存金属量が10ppmより多い樹脂を用いたインキ(比較例1〜3)と比較して、耐版汚れ性、経時安定性を向上させることができる。 The printing inks (Examples 1 to 5) using the rosin-modified phenolic resin according to the present invention are more resistant than the inks (Comparative Examples 1 to 3) using a resin having a residual metal amount in the resin of more than 10 ppm. Plate stain resistance and stability over time can be improved.
Claims (7)
A rosin-modified phenol resin for offset printing, comprising the rosin-modified phenol resin according to claim 1.
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