JP2008271525A - Electronic element, irreversible circuit element and fixing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic element, an irreversible circuit element and a fixing method which facilitate fitting work. <P>SOLUTION: The electronic element includes a conductive pattern-lying upper layer substrate, and a hooking lower layer substrate. The conductive pattern-lying upper layer substrate has a conductive pattern on a surface of the conductive pattern-lying upper layer substrate, with the surface being one surface of the conductive pattern-lying upper layer substrate. The hooking lower layer substrate is in contact with the conductive pattern-lying upper layer substrate on a first surface and has hooking portions which are provided substantially in parallel with the surface of the conductive pattern-lying upper layer substrate with both ends of a bottom base portion bent, with the bottom base portion being a portion that touches the conductive pattern-lying lower layer substrate. The height of a hooking portion bottom surface which is opposite to the first surface from the first surface is approximately equal to a height of the surface of the conductive pattern-lying lower layer substrate from the first surface in the bottom base portion. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic element, a non-reciprocal circuit element, and a fixing method that are fixed by being fitted into a recess of a circuit board.

  An electronic element such as a non-reciprocal circuit element used in a microwave circuit is fitted into a recess provided in the microwave circuit board to form a circuit.

FIG. 11 shows a conventional non-reciprocal circuit device. A conventional non-reciprocal circuit element 101 is fitted into a recess provided in a conventional microwave substrate 102 and is fixed using a screw 100 (for example, Patent Document 1).
JP-A-7-283617

  However, the non-reciprocal circuit element includes a permanent magnet, and when the conventional non-reciprocal circuit element 101 is fixed to the conventional microwave substrate 102, the screw 100 is attracted to the permanent magnet, which increases the number of man-hours for attachment work. There was a problem.

  In addition, in order to match the height at which the conventional non-reciprocal circuit element 101 is attached, a spacer may have to be provided inside the recess of the conventional microwave circuit 102, which increases the number of parts and the number of work steps. There was a point.

  The present invention has been made in view of the above problems, and an object thereof is to provide an electronic device, a nonreciprocal circuit device, and a fixing method that can be easily attached.

  In order to achieve this object, the present invention provides a conductor pattern installation upper layer substrate having a conductor pattern on the surface of the conductor pattern installation upper substrate, a first surface in contact with the conductor pattern installation upper layer substrate, and a conductor pattern installation upper layer substrate in contact with the conductor pattern installation upper layer substrate. A hook portion provided by bending both ends of the base portion, which is a portion of the base portion, to be substantially parallel to the surface of the upper substrate on which the conductor pattern is provided, and a bottom portion of the hook portion that is a surface facing the first surface of the hook portion. And a latching lower layer substrate having a height from the first surface of the base portion and a height from the first surface of the base portion of the upper surface of the conductor pattern placement upper layer substrate is substantially the same. .

  According to the present invention, the electronic element or the nonreciprocal circuit element is fixed to the microwave circuit board without using a screw. For this reason, there is an effect that the number of mounting steps can be reduced.

  Further, the height of the surface on which the conductor pattern of the electronic element or the nonreciprocal circuit element is provided is determined regardless of the depth of the concave portion of the microwave circuit. For this reason, there is no need to use a spacer, and the number of parts can be reduced.

  Hereinafter, an electronic device, a nonreciprocal circuit device, and a fixing method according to an embodiment of the present invention will be described in detail with reference to the drawings using a nonreciprocal circuit device such as a circulator or an isolator used in a microwave circuit as an example.

<Outline of this embodiment>
The outline of this embodiment is as follows. The electronic device of this embodiment includes a conductor pattern placement upper layer substrate that is a first substrate and a latching lower layer substrate that is a second substrate. In addition to each of these substrates, a substrate may be provided.

  The conductor pattern installation upper layer substrate includes a conductor pattern on the surface of the conductor pattern installation upper layer substrate which is one surface of the conductor pattern installation upper layer substrate. The latching lower layer substrate is provided in contact with the conductor pattern installation upper layer substrate on the first surface, and bent at both ends of the base portion, which is in contact with the conductor pattern installation upper layer substrate, substantially parallel to the conductor pattern installation upper layer substrate surface. It has a latching part. The latching portion is provided so that the bottom surface of the latching portion, which is the surface facing the first surface of the latching portion, and the height of the base portion of the upper surface of the conductive pattern mounting substrate from the first surface are substantially equal.

  The electronic element in this embodiment is preferably an electronic element that is attached to a recess provided on the circuit board. Examples of such electronic elements include, but are not limited to, non-reciprocal circuit elements and microwave elements used in microwave modules.

<Details of this embodiment>
FIG. 1 is a diagram showing a non-reciprocal circuit element 10 that is an electronic element of the present embodiment and a microwave circuit board 20 that is a circuit board. FIG. 3 is a cross-sectional view of the nonreciprocal circuit element taken along line XX shown in FIG.

  The nonreciprocal circuit device 10 includes a substantially plate-like ferrite substrate 13 that is a conductive pattern-installed upper layer substrate and a carrier plate 14 that is a latching lower layer substrate. The ferrite substrate 13 includes a permanent magnet 11 and a conductor pattern 12 formed of a conductive material on one surface of the ferrite substrate 13, that is, a ferrite substrate surface 19 that is a conductor pattern installation upper substrate surface. Other components may be installed on the ferrite substrate surface 19.

  The carrier plate 14 is in contact with the ferrite substrate 13 on the first surface. The carrier plate 14 has a latching portion 17 provided by bending both ends of a base portion 15, which is a portion in contact with the ferrite substrate 13, substantially parallel to the ferrite substrate surface 19.

  The microwave circuit board 20 is provided by laminating a ground conductor 21 b and a dielectric substrate 23 on one surface of the ground conductor plate 22. The dielectric substrate 23 is provided with a ground conductor 21 a and a conductor portion 25. The microwave circuit board 20 has a fitting recess 27 for fitting the base portion 15. The nonreciprocal circuit element 10 is placed with the base portion 15 fitted in the fitting recess 27 in the direction of the dashed-dotted arrow.

  FIG. 2 is a diagram showing a state in which the nonreciprocal circuit element 10 is attached to the microwave circuit board 20. Thus, the nonreciprocal circuit element 10 is hooked so that the latching portion 17 is in contact with the edge portion of the fitting recess 27 of the microwave circuit board 20, that is, the ground conductor 21a. The length and width of the base portion 15 are shorter than the length and width of the fitting recess 27. When viewed from the side, the length of the two latching portions 17 and the length of the base portion 15 is the fitting length. It is longer than the length of the recess 27.

  3 is a cross-sectional view of the non-reciprocal circuit device 10 taken along line XX shown in FIG. As shown in FIG. 3, the height from the first surface 16 of the base portion of the latching portion bottom surface 18, which is the surface facing the first surface of the latching portion 17, and the first portion of the base portion of the ferrite substrate surface 19. The latching part 17 is provided so that the height from the surface 16 may be substantially equal.

  Such a configuration is possible by bending the hooking portion 17 in the direction of the ferrite substrate 13 by the thickness h of the ferrite substrate 13. Further, the latching portion bottom surface 18 is bent so as to be substantially parallel to the ferrite substrate surface 19.

  FIG. 4 is a cross-sectional view of the non-reciprocal circuit device 10. 4A is a cross-sectional view of the nonreciprocal circuit device 10 taken along line AA shown in FIG. As shown in FIG. 4A, the nonreciprocal circuit device 10 includes a dielectric substrate 23, a ground conductor 21a provided on the first surface of the dielectric substrate 23, and a fitting recess 27. A base portion is fitted into the fitting recess 27 on the wave circuit board 20, and the hook bottom surface 18 and the ground conductor 21 a are fixed by solder or conductive adhesive.

  In the fixing method, when the solder is cream solder 24, the step of placing the nonreciprocal circuit element 10 on the microwave circuit board 20 and the microwave circuit board 20 on which the nonreciprocal circuit element 10 is placed include: A method of fixing the nonreciprocal circuit element 10 to the microwave circuit board 20 by a step of heating in a reflow furnace can be used.

  As the cream solder, a known one or a commercially available one can be used. If cream solder is applied to the microwave circuit board 20 by printing, it is possible to obtain a low-cost and homogeneous product.

  The reflow furnace is set so as to melt the cream solder and overheat at a temperature at which the nonreciprocal circuit element 10 and the microwave circuit board 20 are not deteriorated.

  4B is a cross-sectional view of the nonreciprocal circuit device 10 taken along the line BB shown in FIG. As shown in FIG. 4B, since the height from the first surface 16 of the base portion of the latching portion bottom surface 18 and the ferrite substrate surface 19 is substantially equal, the conductor pattern 12 is parallel to the ferrite substrate surface 19. Contact the conductor portion 25. For this reason, no stress is generated.

  FIG. 5 is a cross-sectional view of the nonreciprocal circuit element 10 attached to the microwave circuit board 20 with the fitting recess 27 deep. FIG. 5A is a cross-sectional view taken along line AA shown in FIG. 2 of the nonreciprocal circuit element 10 attached to the microwave circuit board 20 in which the fitting recess 27 is deep. As shown in FIG. 5A, a gap 50 is generated between the base portion 15 of the nonreciprocal circuit element 10 and the ground conductor 21 b of the microwave circuit board 20.

  FIG. 5B is a cross-sectional view taken along the line BB shown in FIG. 2 of the nonreciprocal circuit element 10 attached to the microwave circuit board 20 having the deep fitting recess 27. As shown in FIG. 5B, the height of the bottom portion 18 of the latching portion and the base portion of the ferrite substrate surface 19 from the first surface 16 is substantially equal even when the gap 50 is generated. The conductor portion 25 is in contact with the ferrite substrate surface 19 in parallel. For this reason, no stress is generated.

  Even if the gap 50 occurs, it is possible to obtain desired performance by adjusting the electrical design of the nonreciprocal circuit element 10.

  6 is a cross-sectional view of the non-reciprocal circuit device 10 taken along line YY shown in FIG. The shape of the conductor pattern 12 will be described with reference to FIG. As shown in FIG. 6A, the conductor pattern 12 may have a plate shape without bending.

  Furthermore, the conductor pattern 12 may be formed of a flexible material such as copper, and the tip contacting the conductor portion 25 may be bent toward the carrier plate 14. Two examples of this are given below.

  FIG. 6B is a diagram of the conductor pattern 12 having a curved portion. When the nonreciprocal circuit element 10 is attached to the microwave circuit board 20, the front end part 12 b is pushed up in the direction of the arrow and contacts the conductor part 25 in parallel with the ferrite substrate surface 19.

  FIG. 7 is a diagram illustrating the nonreciprocal circuit element 10 and the microwave circuit board 20 including the connection unit 30.

  As shown in FIG. 7, in the nonreciprocal circuit device 10 of the present embodiment, the carrier plate 14 electrically connects the carrier plate 14 and the ground conductor 21b of the microwave circuit board 20 on which the carrier plate 14 is installed. It can comprise so that the part 30 may be provided.

  The connection portion 30 is formed of a conductor such as stainless steel, and is installed on a surface facing the first surface 16 of the base portion of the carrier plate 14.

  FIG. 8 is a view of the connecting portion 30 as seen from the back side. As shown in FIG. 8, the connecting portion 30 can be configured to have an elastic body 31 that electrically connects the carrier plate 14 and the ground conductor 21b of the microwave circuit board 20 on which the carrier plate 14 is installed. .

  The elastic body 31 may be a coil spring having a leaf spring having a bent portion as shown in FIG. Further, the number of elastic bodies 31 is not limited.

  FIG. 9 is a cross-sectional view of the electronic device of the present embodiment at a position corresponding to the CC line of FIG. As shown in FIG. 9, the connecting portion 30 electrically connects the ground conductor 21 b and the carrier plate 14 by the elastic body 31 coming into contact with the ground conductor 21 b and the carrier plate 14. Each of the elastic bodies 31 shown in FIG. 9 extends in the direction of the ground conductor 21 b, the tip thereof is in contact with the ground conductor 21 b, and the bent portion is in contact with the carrier plate 14.

  FIG. 10 is a diagram illustrating an example of the elastic body 31 extending in different directions. As shown in FIG. 10, when there is a gap between the connection portion 30 and the carrier plate 14, the connection has an elastic body 31a extending in the direction of the carrier plate 14 and an elastic body 31b extending in the direction of the ground conductor 21b. Part 30 is used. Thereby, the carrier plate 14 and the ground conductor 21b are reliably electrically connected.

  Since the connection part 30 has the elastic body 31, it becomes possible to electrically connect the carrier plate 14 and the ground conductor 21b also in the electronic element in which the depth of the fitting recessed part 27 differs.

<Effect of this embodiment>
As described above, in the electronic device and the nonreciprocal circuit device 10 according to the present embodiment, both ends of the substrate included in the electronic device or the nonreciprocal circuit device 10 are bent in a direction opposite to the surface to which the microwave circuit is attached. A latching portion for hanging on the substrate was provided. Furthermore, the height of the surface on which the hooking portion is bonded to the microwave circuit board and the surface on which the conductor pattern for connecting the nonreciprocal circuit element of the nonreciprocal circuit element and the circuit board is provided is made substantially equal.

  For this reason, there exists an effect that an attachment man-hour can be reduced. Further, there is no need to use a spacer, and there is an effect that the number of parts can be reduced.

  Also, according to the conventional method of using a solder paste for soldering and heating the circuit board on which the nonreciprocal circuit element 10 is mounted in a reflow furnace to fix the nonreciprocal circuit element 10 to the circuit board, a conventional conductor is used. The operation of manually soldering the pattern 12 and screwing the pattern 12 can be replaced with one operation of heating by a reflow furnace. For this reason, there is an effect that productivity can be improved.

  Furthermore, the carrier plate 14 can be configured to include a connection portion 30 that electrically connects the carrier plate 14 and the ground conductor 21b of the circuit board on which the carrier plate is installed.

  For this reason, the RF characteristics of the electronic element of the present embodiment and the RF characteristics of the conventional electronic element are substantially equal, and the design of the conventional electronic element can be used for the design of the electronic element of the present embodiment. There is.

<Possibility in the embodiment of the present invention>
Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

It is a figure showing the nonreciprocal circuit element which is an electronic element, and a microwave circuit board. It is a figure showing a mode that the nonreciprocal circuit element was attached to the microwave circuit board. It is sectional drawing in the XX line shown in FIG. 1 of a nonreciprocal circuit device. 1 is a cross-sectional view of a nonreciprocal circuit device 10. It is sectional drawing of the nonreciprocal circuit element attached to the circuit board with a deep fitting recessed part. It is sectional drawing in the YY line | wire shown in FIG. 1 of a nonreciprocal circuit device. FIG. 2 is a diagram illustrating a nonreciprocal circuit device 10 including a connection unit 30 and a microwave circuit board 20. It is the figure which looked at the connection part 30 from the back surface. It is sectional drawing in the position equivalent to CC line of FIG. 8 of the electronic device of this embodiment. It is the figure which showed the example of the elastic body 31 extended in a different direction. It is the figure which showed the conventional nonreciprocal circuit device.

Explanation of symbols

10: Non-reciprocal circuit element,
11: Permanent magnet,
12: Conductor pattern
13: Ferrite substrate,
14: Carrier plate
20: Microwave circuit board,
21a, 21b: Ground conductor,
22: Ground conductor plate,
23: dielectric substrate,
25: conductor part,
27: Fitting recess.

Claims (12)

A conductor pattern installation upper layer substrate comprising a conductor pattern on the conductor pattern installation upper layer surface;
A latch provided in such a manner that a first surface is in contact with the conductor pattern installation upper layer substrate, and both ends of a base portion which is a portion in contact with the conductor pattern installation upper layer substrate are bent substantially parallel to the surface of the conductor pattern installation upper layer substrate. And the height of the bottom surface of the latching portion, which is the surface facing the first surface of the latching portion, from the first surface of the base portion, and A latching lower layer substrate having substantially the same height from the first surface;
An electronic device comprising:   2. The electron according to claim 1, wherein the latching lower layer substrate includes a connection portion that electrically connects the latching lower layer substrate and a ground conductor of a circuit board on which the latching lower layer substrate is installed. element. A circuit board comprising a fitting recess that is a recess into which the base portion of the latching lower layer substrate according to claim 1 is fitted,
The base portion is fitted into the fitting recess,
The bottom surface of the latching portion and the circuit board are fixed by solder or conductive adhesive,
The electronic device according to claim 1, wherein the electronic device is an electronic device. The solder is cream solder;
A step of placing the electronic element on the circuit board;
The circuit board on which the electronic element is placed is heated in a reflow furnace;
The electronic device according to claim 3, wherein the electronic device is fixed to the circuit board. A conductor pattern installation upper layer substrate comprising a conductor pattern on the conductor pattern installation upper layer surface;
A latch provided in such a manner that a first surface is in contact with the conductor pattern installation upper layer substrate, and both ends of a base portion which is a portion in contact with the conductor pattern installation upper layer substrate are bent substantially parallel to the surface of the conductor pattern installation upper layer substrate And the height of the bottom surface of the latching portion, which is the surface facing the first surface of the latching portion, from the first surface of the base portion and the base portion of the upper surface of the conductor pattern installation upper substrate. A circuit coated with cream solder, wherein the electronic element including a latching lower layer substrate having a substantially equal height from the first surface has a fitting recess that is a recess for fitting the base portion of the latching lower layer substrate. A step of placing on the substrate;
The circuit board on which the electronic element is placed is heated in a reflow furnace;
The electronic device is fixed to the circuit board by the method. A ferrite substrate comprising a permanent magnet and a conductor pattern on the ferrite substrate surface;
A hook portion that is in contact with the ferrite substrate at a first surface and is bent at both ends of a base portion that is in contact with the ferrite substrate substantially parallel to the ferrite substrate surface; The carrier from which the height from the first surface of the base portion of the bottom surface of the latching portion, which is the surface opposite to the first surface, is substantially equal to the height from the first surface of the base portion of the ferrite substrate surface Plates,
A non-reciprocal circuit device comprising:   The nonreciprocal circuit device according to claim 6, wherein the carrier plate includes a connection portion that electrically connects the carrier plate and a ground conductor of a circuit board on which the carrier plate is installed. A circuit board comprising: a dielectric substrate; a ground conductor provided on the first surface of the dielectric substrate; and a fitting recess that is a recess into which a base portion of the nonreciprocal circuit element is fitted.
The base portion is fitted into the fitting recess,
The nonreciprocal circuit device according to claim 6, wherein the bottom surface of the latching portion and the ground conductor are fixed by solder or a conductive adhesive. The solder is cream solder;
The nonreciprocal circuit element is placed on the circuit board;
The circuit board on which the nonreciprocal circuit element is mounted is heated in a reflow furnace;
The nonreciprocal circuit device according to claim 8, wherein the nonreciprocal circuit device is fixed to the circuit board. A ferrite substrate having a permanent magnet and a conductor pattern on the surface of the ferrite substrate; and a first surface of the ferrite substrate that is in contact with the ferrite substrate; both ends of a base portion that is in contact with the ferrite substrate are substantially parallel to the surface of the ferrite substrate A hooking portion provided by bending, and a height of the bottom surface of the hooking portion, which is a surface facing the first surface of the hooking portion, from the first surface of the base portion and the surface of the ferrite substrate A nonreciprocal circuit device including a carrier plate having substantially the same height from the first surface of the base portion, a dielectric substrate, a ground conductor provided on the first surface of the dielectric substrate, and the nonreciprocal A step of mounting on a circuit board coated with cream solder, and a fitting recess that is a recess into which a base portion of a circuit element is fitted;
The circuit board on which the nonreciprocal circuit element is mounted is heated in a reflow furnace;
The non-reciprocal circuit device is fixed by fixing the electronic device to the circuit board.   The electronic device according to claim 2, wherein the connection portion includes an elastic body that electrically connects the latching lower layer substrate and a ground conductor of a circuit board on which the latching lower layer substrate is installed.   The nonreciprocal circuit device according to claim 7, wherein the connection portion includes an elastic body that electrically connects the carrier plate and a ground conductor of a circuit board on which the carrier plate is installed.

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