JP2008270634A - Electromagnetic-wave shield film, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electromagnetic-wave shield film wherein it has an excellent electromagnetic-wave shielding performance and a high transparency, and its mesh pattern has an excellent film-sticking property and reduced generations of winding-habit curls even in the longer continuous roll product thereof, and further, its panel has an excellent grounding property too, and moreover, its development-processing and plating unevennesses generated during its manufacture are improved. <P>SOLUTION: The electromagnetic-wave shield film is the one having continuous conductive mesh portion 1 and picture-frame portion 2 formed on a longer transparent supporting body wherein the conductivity of the picture-frame portion 2 is higher than that of the mesh portion 1, and they are constituted out of a geometric pattern. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electromagnetic wave shielding film that shields electromagnetic waves generated from electronic devices such as mobile phones, microwave ovens, CRTs, and flat panel displays, and a method for manufacturing the same.

  In recent years, there have been increasing opportunities to use electronic devices such as display devices used in mobile phones, personal computers, TVs, etc., but electromagnetic waves are generally emitted from these electronic devices, so that It is known that so-called electromagnetic interference (EMI) occurs, such as malfunction of electrical equipment, failure, or the possibility of harming the human body. Along with this, there is an increasing need to reduce such EMI, and standards or regulations regarding the intensity of electromagnetic wave emission are established mainly in Europe and the United States, and recent electronic devices are required to meet these standards. Yes. In particular, equipment that requires visibility such as a CRT, a flat panel display, or a window glass needs to satisfy both electromagnetic wave shielding performance and transparency.

  These are generally provided with a conductive metal pattern on a transparent resin film. In order to improve the production efficiency, a continuous metal mesh pattern is formed on the transparent resin film of a long roll, and is necessary. It cut | judged to an appropriate size and it uses for an electromagnetic wave shield panel (refer patent documents 1-4).

  It is preferable to provide a conduction part for effectively grounding the current generated by the metal mesh pattern absorbing the electromagnetic wave at the end of the electromagnetic shielding film, and this conduction part is referred to as a frame part in the present invention. The frame portion generally has a strip-like frame to improve conductivity as compared with a mesh portion composed of a fine line and an opening, and is connected to a ground wire.

In the continuous production of the electromagnetic wave shielding film by the long roll, there are problems such as film peeling at the frame part and curling curl easily due to the difference in the pattern of the mesh part and the frame part in the previous period. In particular, when a silver halide photosensitive material is exposed and developed, and a mesh pattern is formed by an intensifying process such as plating, it is cheaper and more productive than conventional sputtering and printing methods. In addition to this, there is a problem that uneven development processing and uneven plating occur.
International Publication No. 01/051276 Pamphlet JP 2004-221564 A International Publication No. 04/007810 Pamphlet International Publication No. 06/088059 Pamphlet

  The present invention has been made in view of the above-mentioned problems, and its purpose is excellent in electromagnetic wave shielding performance and high transparency. Further, even in the production of long continuous rolls, it has excellent mesh pattern coating, An object of the present invention is to provide an electromagnetic wave shielding film which is small in curling and excellent in grounding property of a panel. Furthermore, it is providing the manufacturing method of the electromagnetic wave shield film which improved the development process nonuniformity and plating nonuniformity which generate | occur | produce during electromagnetic wave shield film manufacture.

  The above object of the present invention is achieved by the following configurations.

  1. An electromagnetic wave shielding film having a continuous conductive mesh portion and a frame portion formed on a long transparent support, wherein the frame portion is a geometric pattern having a higher conductivity than the mesh portion. An electromagnetic shielding film characterized by.

  2. 2. The electromagnetic wave shielding film as described in 1 above, wherein the geometric pattern having high conductivity is a frame mesh having an aperture ratio smaller than that of the mesh portion.

  3. 3. The electromagnetic wave shielding film as described in 2 above, wherein the frame mesh having a small opening ratio is a frame mesh having a smaller pitch than the mesh portion.

  4). 4. The electromagnetic wave shielding film as described in 2 or 3 above, wherein the frame mesh having a small opening ratio is a frame mesh having a line width larger than that of the mesh portion.

  5. 5. The electromagnetic wave shielding film according to any one of 1 to 4, wherein the geometric pattern having high conductivity is a frame mesh having a thickness larger than that of the mesh portion.

  6). A silver halide photosensitive material in which a layer comprising at least a photosensitive silver halide and a binder is coated on a long transparent support, and after pattern exposure, development processing and plating are performed, and a continuous conductive mesh portion and In the manufacturing method of the transparent electromagnetic wave shielding film which forms the frame part of a geometric pattern, The manufacturing method of the electromagnetic wave shielding film characterized by having the process which makes the said frame part highly conductive rather than the said mesh part.

  7. 6. The method for producing an electromagnetic wave shielding film as described in 6 above, wherein the step of increasing the conductivity is a step of thickly applying a region corresponding to the frame portion at the time of applying the silver halide emulsion.

  8). 7. The method for producing an electromagnetic wave shielding film as described in 6 above, wherein the step of increasing the conductivity is a step of exposing the pitch of the geometric pattern of the frame portion to be smaller than that of the mesh portion.

  9. 7. The method for producing an electromagnetic wave shielding film as described in 6 above, wherein the step of increasing the conductivity is a step of exposing the line width of the geometric pattern of the frame portion to be thick.

  10. 7. The method for producing an electromagnetic wave shielding film as described in 6 above, wherein the step of increasing the conductivity is a step of accelerating development processing of the frame portion.

  11. 7. The method for producing an electromagnetic wave shielding film as described in 6 above, wherein the step of increasing the conductivity is a step of accelerating the plating of the frame portion.

  12 7. The method for producing an electromagnetic wave shielding film as described in 6 above, wherein the step of increasing the conductivity is a step of gold-plating the frame portion.

  13. 7. The method for producing an electromagnetic wave shielding film as described in 6 above, wherein the step of increasing the conductivity is a step of pressurizing, heating or heating the frame portion after pressurization.

  According to the present invention, it has excellent electromagnetic wave shielding performance and high transparency, and even in production of long continuous rolls, it has excellent mesh pattern coating, less curl curl generation, and good panel grounding. Can also provide an excellent electromagnetic shielding film. Furthermore, the manufacturing method of the electromagnetic wave shielding film which improved the development processing nonuniformity generate | occur | produced during electromagnetic wave shielding film manufacture and plating nonuniformity can be provided.

  As a result of studying the above problems, the present inventors have found that an excellent electromagnetic shielding film and a method for producing the same can be obtained by improving the frame portion of the metal mesh pattern.

  The electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film having a continuous conductive mesh portion and a frame portion formed on a long transparent support, wherein the frame portion is more conductive than the mesh portion. It is characterized by a highly geometric pattern.

(Transparent support)
In the present invention, a normal synthetic resin film can be used as a long transparent support (hereinafter also simply referred to as a support).

  For example, cellulose ester film, polyester film, polycarbonate film, polyarylate film, polysulfone (including polyethersulfone) film, polyethylene terephthalate, polyethylene naphthalate polyester film, polyethylene film, polypropylene film, cellophane, Cellulose diacetate film, cellulose acetate butyrate film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene vinyl alcohol film, syndiotactic polystyrene film, polycarbonate film, norbornene resin film, polymethylpentene film, polyether ketone film, Polyetherketoneimide film, polyamid Film, fluororesin film, a nylon film, a polymethyl methacrylate film or an acrylic film or the like. In addition to these plastic films, quartz glass, soda glass, and the like can be used.

  Of these, cellulose triacetate film, polycarbonate film, polysulfone (including polyethersulfone), polyethylene terephthalate film, and polyethylene naphthalate film are preferably used. In the present invention, it is particularly preferable to use a polyethylene terephthalate film or a polyethylene naphthalate film that is a polyester film as the support from the viewpoints of transparency, isotropic properties, adhesiveness, durability, and the like.

  When the electromagnetic wave shielding film of the present invention is used for a display screen of a display, high transparency is required. Therefore, it is desirable that the support itself has high transparency. The average transmittance in the visible light region of the plastic film or glass plate as the support in this case is preferably 85 to 100%, more preferably 90 to 100%. Moreover, in this invention, what colored the said plastic film or glass plate to the extent which does not interfere with the objective of this invention can also be used as a color tone regulator. The average transmittance in the visible light region is obtained by integrating the transmittances in the visible light region obtained by measuring the transmittance in the visible light region of 400 to 700 nm at least every 5 nm, and obtaining the average value thereof. Define. In measurement, the measurement aperture needs to be sufficiently larger than the mesh pattern described above, and is obtained by measuring at least an area 100 times larger than the mesh area of the mesh.

  The support used in the present invention is 100 m or more, more preferably 500 m or more, still more preferably 1000 m or more and 2000 m or less in order to produce the continuous support as a long roll.

  The width of the support used in the present invention is 1 m or more, preferably 1.5 m or more, and more preferably 2 m or more and 5 m or less because of the demand for a display panel with a larger screen.

  Although there is no restriction | limiting in particular in the thickness of the support body used for this invention, It is preferable that it is 5-200 micrometers from a viewpoint of the maintenance of a transmittance | permeability, and a handleability, and it is further more preferable that it is 30-150 micrometers.

(Mesh part)
The line width of the conductive metal mesh portion formed to shield electromagnetic waves is usually 20 μm or less, preferably 18 μm or less, more preferably 15 μm or less, more preferably 3 μm or more, from the viewpoint of making the mesh inconspicuous. 10 μm or less is most preferable. If it is less than 3 μm, the conductivity is slightly insufficient.

  The line spacing of the mesh part is preferably 150 μm or more, more preferably 180 μm or more, and particularly preferably 200 μm or more. The thickness of the fine mesh wire is preferably 0.1 μm or more and 25 μm or less, more preferably 0.2 or more and 20 μm or less, and particularly preferably 0.5 μm or more and 15 μm or less.

  In the mesh portion of the present invention, the aperture ratio is preferably larger than 80%, more preferably 85% or more, and most preferably 90% or more from the viewpoint of visible light transmittance. The aperture ratio is the ratio of the portion without fine lines forming the mesh to the whole. For example, the aperture ratio of a square lattice mesh having a line width of 10 μm and a pitch of 200 μm is 90%.

  In the present invention, in order to give high translucency and high electromagnetic wave shielding performance, a lattice-like fine line mesh pattern is drawn by exposure, and then a development process or the like is performed to form a conductive mesh pattern. An electromagnetic wave shielding film is preferred.

(Frame part)
The frame portion is a connection portion for grounding a current generated by absorbing electromagnetic waves in the mesh portion, and generally forms a strip-shaped frame in order to improve conductivity. In the present invention, the frame portion is a geometric pattern.

  A geometric pattern is a pattern in which basic figures such as polygons, circles, ellipses, and stars are continuously arranged.

  In the present invention, in order to obtain a geometric pattern in which the conductivity of the frame portion is higher than that of the mesh portion, the aperture ratio is made smaller than that of the mesh portion, the pitch is made smaller than that of the mesh portion, and the line is made more than the mesh portion. For example, the width is increased, and the thickness of the fine line is increased more than the mesh portion.

  In the present invention, an electromagnetic wave shielding film in which the geometric pattern having high conductivity in the frame portion has a smaller aperture ratio than the mesh portion is preferable. As described above, the mesh portion preferably has a high aperture ratio, but the frame mesh portion is preferably 10% or more and 80% or less, more preferably 10% or more and 70% or less. If it is less than 10%, the effect of the present invention is small, and if it is more than 80%, the grounding property is insufficient.

  The geometric pattern having a small aperture ratio can be achieved by reducing the line interval (pitch) of the frame mesh portion smaller than the center portion. The pitch of the frame mesh portion is preferably 130 μm or less, more preferably 100 μm or less, and particularly preferably 10 μm or more and 90 μm or less.

  The geometric pattern having a small aperture ratio can also be achieved by increasing the line width of the frame mesh portion rather than the central portion. The line width of the frame mesh portion is preferably 30 μm or more, more preferably 50 μm or more, and particularly preferably 70 μm or more.

  In the present invention, an electromagnetic wave shielding film in which the geometric pattern having high conductivity of the frame portion has a fine line thickness larger than that of the mesh portion is preferable. When increasing the thickness of the fine line of the frame mesh part to increase the conductivity, it is preferably larger than 25 μm, more preferably 30 μm or more, and particularly preferably 35 μm or more.

(Mesh formation method)
In the electromagnetic wave shielding film of the present invention, a method for forming a conductive mesh having an electromagnetic wave shielding function is a known method, that is, a vapor deposition method, various printing methods (gravure printing, screen printing, ink jet printing, etc.), etching method, photolithographic method. A silver salt photographic method in which a silver halide light-sensitive material is formed by exposure, development processing, and intensification processing as necessary is preferable.

  When the electromagnetic wave shielding film of the present invention is formed using a silver salt photographic method, a silver halide emulsion layer containing a photosensitive silver halide and a binder described later is provided on the support. In addition to this, a hardening agent, a thickening agent, an activator, etc. can be contained.

(Photosensitive silver halide)
In the present invention, the content of photosensitive silver halide in terms of silver in 0.05 g / m ² or more, preferably less than 3 g / m ^2, particularly preferably in terms of silver 0.3 g / m ² or more, It is less than 1 g / m ² . When the photosensitive silver halide content is less than 0.05 g / m ² , it is difficult to obtain sufficient electromagnetic wave shielding performance. This is presumed to be because the amount of developed silver nuclei serving as a catalyst for physical development or metal plating treatment described later becomes insufficient and it becomes difficult to form an effective conductive mesh. In addition, when the photosensitive silver halide content is 3 g / m ² or more, the amount of silver halide relative to the binder is relatively large, so that the coating tends to become brittle and maintain sufficient coating strength. It becomes difficult.

  When the amount of the binder is increased to maintain the physical properties of the film, the distance between the grains of the photosensitive silver halide increases, so that it becomes difficult to form a developed silver network, it is difficult to form an effective conductive mesh, and the temperature Further, the durability against humidity change becomes insufficient, and the effect of the present invention is hardly obtained.

In the present invention, the binder amount of the silver halide light-sensitive material is particularly preferably 10 mg / m ² or more and 0.2 g / m ² or less from the viewpoint of achieving both conductivity and film properties. When the amount of the binder is less than 10 mg / m ^2, the amount of silver halide relative to the binder is relatively large, so that the coating tends to become brittle and it is difficult to maintain sufficient coating strength. In addition, when the amount of the binder is more than 0.1 g / m ² , the distance between the photosensitive silver halide grains is increased, so that it is difficult to form a developed silver network, and it is difficult to form an effective conductive mesh. In addition, the durability against changes in temperature and humidity becomes insufficient, and the effects of the present invention cannot be obtained.

  The composition of the silver halide grains used in the present invention has an arbitrary halogen composition such as silver chloride, silver bromide, silver chlorobromide, silver iodobromide, silver chloroiodobromide and silver chloroiodide. However, in order to obtain metallic silver having good conductivity, fine grains having high sensitivity are preferable, and silver iodobromide grains are preferably used. When a large amount of iodine is contained, the sensitivity is high and the particles can be made fine.

  In order to reduce the surface specific resistance after silver halide grains are developed to become metallic silver grains and effectively shield electromagnetic waves, the contact area between developed silver grains needs to be as large as possible. For this purpose, a smaller silver halide grain size is better to increase the surface area ratio, but too small grains tend to agglomerate into large agglomerates, in which case the contact area will be reduced, so there is an optimum grain size. To do. In the present invention, the average grain size of the silver halide grains is preferably 0.01 to 0.5 μm, more preferably 0.03 to 0.3 μm, in terms of a sphere equivalent diameter. In addition, the sphere equivalent diameter of silver halide grains represents the diameter of grains having the same volume and having a spherical shape. The average grain size of silver halide grains is the temperature at the time of preparation of silver halide grains, pAg, pH, addition rate of silver ion solution and halogen solution, grain size control agent (for example, 1-phenyl-5-mercaptotetrazole, 2-mercaptobenzimidazole, benztriazole, tetrazaindene compounds, nucleic acid derivatives, thioether compounds, etc.) can be appropriately combined and controlled.

In the present invention, the value obtained by dividing the coating silver amount (g / m ² ) by the particle size (μm) is preferably 6 to 25. When a large amount of photosensitive silver halide having a relatively small particle size is used, this value tends to be larger than 25. In this case, the silver halide grains slip off from the coating at the edge when the film is cut. It tends to be easier. Further, when a small amount of photosensitive silver halide having a relatively large particle diameter is used, this value tends to be smaller than 6, and in this case, the number of photosensitive silver halide grains in a unit area is reduced, so that This is because it tends to decrease.

  In the present invention, the shape of the silver halide grains is not particularly limited, and for example, spherical, cubic, flat plate (hexagonal flat plate, triangular flat plate, tetragonal flat plate, etc.), octahedron, tetrahedron It can be in various shapes such as shapes. In order to increase the sensitivity, tabular grains having an aspect ratio of 2 or more, 4 or more, and further 8 to 16 can be preferably used. The particle size distribution is not particularly limited, but a narrow distribution is preferable from the viewpoint of enhancing the transparency while sharply reproducing the outline of the pattern and maintaining high conductivity during pattern formation by exposure. The particle size distribution of the silver halide grains used in the silver halide photosensitive material according to the present invention is preferably monodispersed silver halide grains having a coefficient of variation of 0.22 or less, more preferably 0.15 or less. Here, the variation coefficient is a coefficient representing the breadth of the particle size distribution, and is defined by the following equation.

Coefficient of variation = S / R
(In the formula, S represents the standard deviation of the particle size distribution, and R represents the average particle size.)
The silver halide grains used in the present invention may further contain other elements. For example, in a photographic emulsion, it is also useful to dope metal ions used to obtain a high-contrast emulsion. In particular, Group 8-10 metal ions such as iron ion, rhodium ion, ruthenium ion and iridium ion are preferably used because the difference between the exposed portion and the unexposed portion tends to be clearly generated when the metal silver image is generated.

  These metal ions can be added to the silver halide emulsion in the form of a salt or a complex salt. Transition metal ions represented by rhodium ions and iridium ions can also be compounds having various ligands. Examples of such a ligand include cyanide ions, halogen ions, thiocyanate ions, nitrosyl ions, water, hydroxide ions, and the like. Specific examples of the compound include potassium bromide rhodate and potassium iridate.

In the present invention, the content of the metal ion compound contained in the silver halide is preferably 10 ⁻¹⁰ to 10 ⁻² mol / mol Ag per mol of silver halide, and is preferably 10 ⁻⁹ to 10 ^−. More preferably, it is ³ mol / mol Ag.

  In order for silver halide grains to contain the above-described metal ions, the metal compound is subjected to physical ripening before formation of silver halide grains, during formation of silver halide grains, after formation of silver halide grains, etc. What is necessary is just to add in the arbitrary places in a process. Moreover, in addition, the solution of a heavy metal compound can be continuously performed over the whole or a part of particle formation process.

  In the present invention, in order to further improve the sensitivity, chemical sensitization performed with a photographic emulsion or spectral sensitization can be performed.

(binder)
In the silver halide light-sensitive layer according to the present invention (a layer comprising at least light-sensitive silver halide and a binder), silver halide grains are uniformly dispersed, and the silver halide grains are supported on a support, and halogenated. A binder is used for the purpose of ensuring the adhesiveness between the silver photosensitive layer and other layers or the support. The binder that can be used in the present invention is not particularly limited, and any of a water-insoluble polymer and a water-soluble polymer can be used. From the viewpoint of improving developability, it is preferable to use a water-soluble polymer.

  In the silver halide light-sensitive material according to the present invention, it is advantageous to use gelatin as a binder, but if necessary, gelatin derivatives, graft polymers of gelatin and other polymers, proteins other than gelatin, sugar derivatives, cellulose Hydrophilic colloids such as synthetic hydrophilic polymer materials such as derivatives, mono- or copolymers can also be used.

  In the present invention, the silver / binder mass ratio of the silver halide photosensitive layer is preferably from 0.5 to 20. This is to increase the contact area between the developed silver particles described above, more preferably 1.0 to 10, and even more preferably 3.0 to 8.0.

(Layer structure of silver halide photosensitive material)
The layer structure of the silver halide photosensitive material used for forming the electromagnetic wave shielding film of the present invention basically comprises a support and a silver halide photosensitive layer. Furthermore, it is preferable to provide various layers in consideration of not only high functionality, processing characteristics and durability as an electromagnetic wave shielding film but also the production efficiency and production stability of the silver halide photosensitive material.

  For example, a non-photosensitive intermediate layer is provided between the support and the silver halide photosensitive layer, a backing layer is provided on the opposite side of the transparent support from the silver halide photosensitive layer, or the silver halide is provided. It is preferable to provide a protective layer on the photosensitive layer. These layers may be composed of a plurality of layers.

  In the present invention, it is also preferable to provide a silver halide photosensitive layer on both sides of the support and to form a conductive pattern on each. In this case, it is preferable that the silver halide emulsion coated on each surface has sensitivity at different wavelengths by spectral sensitization or the like. By giving sensitivity to different wavelengths on the front and back surfaces, it becomes possible to create different conductive patterns on each surface, for example, to selectively shield against electromagnetic waves of different frequencies on the front and back surfaces. It is also possible to form a conductive pattern.

(Method for producing electromagnetic shielding film)
In the method for producing an electromagnetic wave shielding film of the present invention, a silver halide photosensitive material in which a layer comprising at least a photosensitive silver halide and a binder is coated on a long transparent support is subjected to patterning exposure, development and plating. In this way, a continuous conductive mesh portion and a frame portion of the geometric pattern are formed.

  Therefore, basically, (1) a step of forming a silver halide photosensitive material by coating a silver halide emulsion on a transparent support, (2) a step of pattern exposure on the silver halide photosensitive material, (3) It comprises a step of developing the exposed silver halide photosensitive material, and (4) a step of plating the developed silver halide photosensitive material, but the pretreatment of the transparent support before coating the silver halide emulsion And undercoating process, drying and aging process of the coated silver halide photosensitive material, physical development process before plating the developed silver halide photosensitive material, stabilization process such as pressure heating after plating process You may provide the process to do.

  Each of these steps may be batch-processed independently, but it is preferable that each step is linked to a continuous web from the feeding of the support. Finally, the formed electromagnetic shielding film may be obtained as a long roll, or may be cut into a required size and accumulated in a sheet form.

(Coating process)
A coating process is a process of apply | coating the said structural layer on a support body. Examples of the coating method include dip coating, spray coating, air knife coating, curtain coating, roller coating, wire bar coating, gravure coating, inkjet coating, or US Pat. No. 2,681,294. Examples include an extrusion coating method using the hopper described in the specification. If necessary, U.S. Pat. Nos. 2,761,791, 3,508,947, 2,941,898 and 3,526,528, Yuji Harasaki, “ The method of simultaneously applying two or more layers described in “Coating Engineering” on page 253 (published by Asakura Shoten in 1973) can also be preferably used.

  In the present invention, in order to make the frame portion more conductive than the mesh portion, a frame mesh portion having a large thickness is formed by thickly applying a region corresponding to the frame portion at the time of silver halide emulsion coating. Can do.

(Exposure process)
In the present invention, the silver halide photosensitive material is exposed to form a conductive pattern by performing at least one selected from development processing, physical development, and plating processing described later. Examples of the light source used for exposure include light such as ultraviolet rays, visible rays, and infrared rays, and radiation such as electron beams and X-rays. Visible rays are used in terms of utilizing the characteristics of silver halide. Is preferred. In particular, it is preferable to use a light source having a narrow wavelength distribution because the formation of the electromagnetic shielding film can be efficiently controlled and can be stably produced.

  In the present invention, it is particularly preferable to perform exposure using a laser beam. Among various laser beams, a blue laser is preferable because of the photosensitive characteristics of silver halide. The emission wavelength is preferably 370 to 450 nm, particularly 415 to 440 nm.

Specifically, a helium-cadmium laser (about 442 nm), a blue semiconductor laser using an InGaN-based material with an oscillation wavelength of 400 to 430 nm, a GaAlAs-based (laser wavelength 850 nm) semiconductor laser, an MgO: LiNbO ₃ SHG crystal. However, a blue semiconductor laser is preferable from the viewpoints of compactness, low power consumption, stability, long life, and the like. In particular, a blue semiconductor laser announced by Nichia Chemical Co., Ltd. at the 48th Applied Physics Related Conference in March 2001 is preferred.

  In the present invention, in order to make the frame portion more conductive than the mesh portion, when exposing the region corresponding to the frame portion of the silver halide photosensitive material, the geometric pattern pitch is exposed to be smaller than that of the mesh portion. The frame mesh portion can be formed by exposing the line width of the geometric pattern to be thick.

(Development processing)
In the present invention, after the silver halide photosensitive material is exposed, development processing is performed. The development process is preferably a so-called black-and-white development process that does not contain a color developing agent.

  As the developing solution, in addition to hydroquinones such as hydroquinone, sodium hydroquinonesulfonate, chlorohydroquinone and the like as developing agents, 1-phenyl-3-pyrazolidone, 1-phenyl-4,4-dimethyl-3-pyrazolidone, 1- Use in combination with pyrazolidones such as phenyl-4-methyl-4-hydroxymethyl-3-pyrazolidone, 1-phenyl-4-methyl-3-pyrazolidone and superadditive developing agents such as N-methylparaaminophenol sulfate. Can do. Further, it is preferable to use a reductone compound such as ascorbic acid or isoascorbic acid in combination with the superadditive developing agent without using hydroquinone.

  In addition, sodium sulfite or potassium sulfite as a preservative, sodium carbonate or potassium carbonate as a buffer, diethanolamine, triethanolamine, diethylaminopropanediol or the like as a development accelerator can be appropriately used in the developing solution.

  The development processing solution used in the development processing can contain an image quality improver for the purpose of improving the image quality. Examples of the image quality improver include nitrogen-containing heterocyclic compounds such as 1-phenyl-5-mercaptotetrazole and 5-methylbenzotriazole.

  In the present invention, it is preferable that the development processing performed after exposure includes physical development before fixing. The term “physical development before fixing” as used herein refers to a process in which silver ions are supplied from outside the silver halide grains having a latent image by exposure to reinforce developed silver before performing a fixing process described later. As a specific method for supplying silver ions from the developing solution, for example, a method of dissolving silver nitrate or the like in advance in a developing solution and dissolving silver ions, or sodium thiosulfate in the developing solution, Examples include a method in which a silver halide solvent such as ammonium thiocyanate is dissolved, unexposed silver halide is dissolved during development, and development of silver halide grains having a latent image is supplemented.

  In the present invention, it is preferable to use a formulation in which a silver halide solvent is preliminarily dissolved in a developer because a reduction in the transmittance of the film due to fogging in unexposed areas can be suppressed.

  In the present invention, in order to make the frame portion more conductive than the mesh portion, it is possible to accelerate the development processing reaction in the region corresponding to the frame portion during the development processing of the silver halide photosensitive material. Specifically, this is achieved by increasing the liquid temperature in the vicinity of the frame portion equivalent region or increasing the liquid agitation in the vicinity of the frame portion equivalent region in the developing solution. Needless to say, in the portion where the development processing reaction is promoted, the silver development rate is increased and more developed silver is formed than in the mesh portion, and a frame mesh having a large line width and thickness can be formed.

  In the development processing according to the present invention, after the development of the exposed silver halide grains, fixing processing is performed for the purpose of removing and stabilizing the unexposed silver halide grains. For the fixing treatment in the present invention, a fixer formulation used for photographic films, photographic papers and the like using silver halide grains can be used. The fixing solution used in the fixing process may use sodium thiosulfate, potassium thiosulfate, ammonium thiosulfate, or the like as a fixing agent. Aluminum sulfate, chromium sulfate, or the like can be used as a hardener for fixing. As the fixing agent preservative, sodium sulfite, potassium sulfite, ascorbic acid, erythorbic acid and the like described in the developing solution can be used, and citric acid, oxalic acid, and the like can be used.

  The washing water used in the present invention includes N-methyl-isothiazol-3-one, N-methyl-isothiazol-5-chloro-3-one, and N-methyl-isothiazole-4,5 as antifungal agents. -Dichloro-3-one, 2-nitro-2-bromo-3-hydroxypropanol, 2-methyl-4-chlorophenol, hydrogen peroxide and the like can be used.

(Reinforcement processing)
In the present invention, in order to assist the contact between the developed silvers formed by the above-described development process and to increase the conductivity, it is preferable to perform a reinforcement process. In the present invention, the intensifying process refers to a process in which a conductive substance source not contained in the silver halide photosensitive material is supplied from the outside during the development process or after the process to increase the conductivity. Examples of such a method include physical development or plating treatment.

(Physical development processing)
Physical development can be performed by immersing a silver halide photosensitive material having a latent image in a processing solution containing silver ions or silver complex ions and a reducing agent.

  In the present invention, physical development is defined not only when the development start point of physical development is the latent image nucleus but also when developed silver is the physical development start point, and this can be preferably used.

(Plating treatment)
In the present invention, various conventionally known plating methods can be used for the plating treatment. For example, electrolytic plating and electroless plating can be carried out alone or in combination. Among them, electrolytic plating excellent in selectivity of plating metal, adjustment of plating speed, and plating strength can be preferably used in the present invention. In the case of electroless plating, there is an advantage that uneven plating due to uneven current distribution does not occur. As a metal that can be used for plating, for example, copper, nickel, cobalt, tin, silver, gold, platinum, and other various alloys can be used. It is particularly preferable to use copper electrolytic plating from the viewpoint that the plating treatment is relatively easy and high conductivity is easily obtained.

  The above processing can be performed during development, at any timing after development, before fixing, and after fixing processing. However, from the viewpoint of maintaining high transparency of the film, it is preferably performed after the fixing processing.

  In the present invention, an aspect in which the amount of metal applied by physical development or metal plating is 10 to 100 times in terms of mass relative to developed silver obtained by exposing and developing a silver halide photosensitive material. preferable. This value can be determined by quantifying the metal contained in the silver halide photosensitive material by, for example, fluorescent X-ray analysis before and after physical development or metal plating. When the amount of metal applied by physical development or metal plating is less than 10 times in terms of mass relative to developed silver obtained by exposing and developing a silver halide photosensitive material, the conductivity is slightly reduced. If the ratio is larger than 100 times, the transmittance tends to decrease due to metal deposition on unnecessary portions other than the conductive mesh pattern portion. In the present invention, it is preferable to perform both physical development and metal plating.

  In the present invention, in order to make the frame portion more conductive than the mesh portion, the plating treatment reaction in the frame portion equivalent region can be promoted during the plating treatment. Specifically, in the plating solution, increase the liquid temperature in the vicinity of the frame portion equivalent area, increase the liquid stirring in the vicinity of the frame portion equivalent area, or increase the current by bringing the electrode closer to the frame equivalent area. Achieved by etc. Needless to say, in the portion where the plating treatment reaction is promoted, the plating reaction rate is increased, so that plating is formed more than the mesh portion, and a frame mesh having a large line width and thickness can be formed.

  Furthermore, in the present invention, the frame portion corresponding region can be gold-plated in order to make the frame portion more conductive than the mesh portion. Gold plating can be applied to the gold plating solution even after the development process, after the development silver after development and physical development is formed, and even after copper plating is applied on the development silver. Only the part can be immersed and gold-plated.

  Furthermore, in the present invention, in order to make the frame portion more conductive than the mesh portion, the frame portion equivalent region can be pressurized, heated, or heated after pressurization.

  The pressure is 1 kPa to 100 MPa, preferably 10 kPa to 10 MPa, and more preferably 50 kPa to 5 MPa. If the pressure is less than 1 kP, the effect of improving the conductivity is small, and if it is greater than 100 MPa, it is difficult to keep the surface smooth, and haze increases.

  The heating is 40 to 300 ° C, preferably 50 to 200 ° C, more preferably 60 to 200 ° C. If it is less than 40 ° C., the effect of improving conductivity is small, and if it is higher than 300 ° C., it is difficult to keep the surface smooth.

(Oxidation treatment)
In the present invention, it is preferable to carry out an oxidation treatment after the development treatment, physical development or plating treatment. By the oxidation treatment, unnecessary metal components can be ionized and dissolved and removed, and the transmittance of the film can be further increased.

  As the treatment liquid used for the oxidation treatment, for example, a treatment method using an aqueous solution containing Fe (III) ions, or hydrogen peroxide, persulfate, perborate, perphosphate, percarbonate, perhalogenate. A treatment solution containing a conventionally known oxidant such as a method of treating with an aqueous solution containing a peroxide such as a hypohalite, a halogenate, or an organic peroxide can be used. The oxidation treatment is preferably performed after completion of the development treatment and before the plating treatment because the transmittance can be efficiently improved in a short time treatment, and particularly preferably after completion of the physical development.

(Blackening treatment)
In the present invention, it is preferable to perform blackening treatment on the surface of the metal mesh from the viewpoint of preventing external light reflection on the surface of the electromagnetic wave shielding film. When the transparent electromagnetic wave shielding film subjected to such blackening treatment is used for a display such as a plasma display panel (PDP), for example, it is possible to reduce a decrease in contrast due to reflection of external light and to adjust the color tone of the screen when not in use. It is preferable because it can be kept black and high quality. The blackening treatment method is not particularly limited, and known methods can be used alone or in combination as appropriate. For example, when the outermost surface of the conductive pattern is made of metallic copper, a method of oxidizing by immersing in an aqueous solution containing sodium chlorite, sodium hydroxide, or trisodium phosphate, or copper pyrophosphate, potassium pyrophosphate, A method of blackening by immersion in an aqueous solution containing ammonia and electrolytic plating can be preferably used. If the outermost layer of the conductive pattern is made of a nickel-phosphorus alloy coating, immerse it in an acidic blackening solution containing copper (II) chloride or copper (II) sulfate, nickel chloride or nickel sulfate, and hydrochloric acid. The method to do can be used preferably.

  In addition to the above-described method, the blackening treatment can be performed by a method of finely roughening the surface. However, from the viewpoint of maintaining high conductivity, oxidation is more effective than finer roughening of the surface. A blackening treatment method is preferred.

(Near-infrared absorbing layer)
When the electromagnetic wave shielding film of the present invention is used in combination with, for example, an optical filter for PDP, a near infrared absorbing layer which is a layer containing a near infrared absorbing dye may be provided under the silver halide photosensitive layer. preferable. In some cases, the near-infrared absorbing layer may be provided on the opposite side of the support to the silver halide emulsion layer side, or may be provided on both the silver halide emulsion layer side and the opposite side. A near infrared absorption layer can be provided between the silver halide emulsion layer containing silver halide and the support, or a near infrared absorption layer can be provided on the opposite side of the support as viewed from the silver halide emulsion layer. The former is preferred because it can be applied simultaneously with one side of the support.

  Specific examples of near-infrared absorbing dyes include polymethine, phthalocyanine, naphthalocyanine, metal complex, aminium, imonium, diimonium, anthraquinone, dithiol metal complex, naphthoquinone, indolephenol, azo And triallylmethane-based compounds. The PDP optical filter is required to have near-infrared absorptivity mainly for absorption of heat rays and noise prevention of electronic devices. For this purpose, a dye having a near-infrared absorbing ability having a maximum absorption wavelength of 750 to 1100 nm is preferable, and a metal complex, aminium, phthalocyanine, naphthalocyanine, diimonium, and squalium compound are particularly preferable.

  As the near-infrared absorbing dye, the diimonium compound is IRG-022, IRG-040 (above, manufactured by Nippon Kayaku Co., Ltd.), and the nickel dithiol complex compound is SIR-128, SIR-130, SIR-132, SIR-159. , SIR-152, SIR-162 (manufactured by Mitsui Chemicals, Inc.), and phthalocyanine compounds may be commercially available products such as IR-10, IR-12 (manufactured by Nippon Shokubai Co., Ltd.).

  When the electromagnetic wave shielding film of the present invention is used in combination with, for example, an optical filter for PDP, a dye that absorbs light near 595 nm is used to prevent a decrease in color reproducibility due to emission lines of neon gas used in PDP. It is preferable to contain. Specific examples of the dye that absorbs such a specific wavelength include, for example, azo, condensed azo, phthalocyanine, anthraquinone, indigo, perinone, perylene, dioxazine, quinacridone, methine, Well-known organic pigments and organic dyes such as isoindolinone-based, quinophthalone-based, pyrrole-based, thioindigo-based, and metal complex-based materials, and inorganic pigments may be mentioned. Among these, phthalocyanine-based and anthraquinone-based dyes are particularly preferably used because of good weather resistance.

(UV absorbing layer)
In the present invention, in order to avoid deterioration of the electromagnetic wave shielding film due to ultraviolet rays, it is preferable to use an ultraviolet absorber having a maximum absorption wavelength of less than 350 nm.

  As the ultraviolet absorber, known ultraviolet absorbers such as salicylic acid compounds, benzophenone compounds, benzotriazole compounds, S-triazine compounds, cyclic imino ester compounds and the like can be preferably used. Of these, benzophenone compounds, benzotriazole compounds, and cyclic imino ester compounds are preferred. As what is blended with the polyester, a cyclic imino ester compound is particularly preferable. There are no particular restrictions on the layer added to these ultraviolet absorbers, but from the viewpoint of preventing the binder used in the silver halide photosensitive layer (mesh pattern layer) from being deteriorated by ultraviolet rays, it is added to the silver halide photosensitive layer. Alternatively, it is preferably provided on the light source side of the layer.

  Preferred ultraviolet absorbers include benzotriazoles, for example, compounds represented by general formula [III-3] described in JP-A-1-250944, and general formula [III] described in JP-A 64-66646. A compound represented by general formula [I] described in JP-A No. 63-187240, UV-1L to UV-27L described in JP-A No. 63-187240, JP-A No. 4-1633, and JP-A No. 5-165144 The compounds represented by the general formulas (I) and (II) are preferably used.

  These ultraviolet absorbers are used in, for example, high-boiling organic solvents represented by phthalates such as dioctyl phthalate, di-i-decyl phthalate, and dibutyl phthalate, and phosphate esters such as tricresyl phosphate and trioctyl phosphate. It is preferable to add in a dispersed manner. Moreover, it is also preferably used to add these ultraviolet absorbers directly to the support. In this case, for example, the embodiment described in JP-T-2004-531611 can also be preferably used.

(Antireflection layer)
When the electromagnetic wave shielding film of the present invention is used for the purpose of protecting a display screen or the like, it is preferable to provide an antireflection layer.

  The antireflection layer is preferably composed of a plurality of light transmissive layers having different refractive indexes, and more preferably composed of a high refractive index layer, a medium refractive index layer, and a low refractive index layer containing inorganic fine particles. The layers having different refractive indexes are adjusted according to the kind of inorganic fine particles contained therein, the particle diameter, the added amount, the kind of resin binder, and the like. The refractive index of the high refractive index layer is preferably 1.55 to 2.30, and more preferably 1.57 to 2.20. The refractive index of the medium refractive index layer is adjusted so as to be an intermediate value between the refractive index of the base film and the refractive index of the high refractive index layer. The refractive index of the middle refractive index layer is preferably 1.55 to 1.80. The refractive index of the low refractive index layer is preferably 1.46 or less, and particularly preferably 1.3 to 1.45.

  As the antireflection layer, inorganic materials such as metal oxides, fluorides, silicides, borides, carbides, nitrides, sulfides, etc., can be used by vacuum deposition, sputtering, ion plating, ion beam assist, etc. A method of laminating a thin film in a layer or a multilayer, a method of laminating a resin having a different refractive index such as an acrylic resin or a fluororesin into a single layer or a multilayer can be used.

  In the transparent electromagnetic wave shielding film of the present invention, when the antireflection layer is formed on the opposite side of the layer having the conductive pattern with the support of the electromagnetic wave shielding film sandwiched, after the antireflection layer is first formed, It is preferable to bond a protective film and then form a conductive pattern layer. When the antireflection layer is formed after the conductive pattern is formed first, the efficiency of the plasma treatment and corona treatment performed to improve the adhesion between the antireflection layer and the support tends to be reduced. It is preferred to form the layer first. In addition, when the antireflection layer is formed first, it is preferable to form a conductive pattern layer after pasting a protective film in advance from the viewpoint of preventing the layer from being deteriorated by development, plating treatment or the like. .

  As the protective film used in the present invention, a commercially available protective film can be used. From the viewpoint of facilitating coating of a photosensitive silver halide emulsion layer for forming a conductive pattern, the film is used. Is preferably 10 to 100 μm, particularly preferably 20 to 60 μm. If the thickness is less than 10 μm, the rigidity of the film is remarkably reduced, so that the work efficiency of the protection film is likely to be lowered. If the thickness is more than 100 μm, a failure such as a winding reel tends to occur when the film is wound. is there.

  Although there is no restriction | limiting in particular in the kind of adhesive used for a protective film, The thing which does not damage an antireflection film at the time of peeling, without altering an antireflection film is used preferably. From such a viewpoint, an acrylic or silicone adhesive is preferably used. Moreover, as the adhesive force, what is 0.08-0.6N / 25mm is used preferably.

  EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated concretely, this invention is not limited to these. In addition, although the display of "part" or "%" is used in an Example, unless otherwise indicated, "part by mass" or "mass%" is represented.

Examples (Preparation of silver halide emulsion)
A silver chlorobromide emulsion (10 mol% silver bromide, 90 mol% silver chloride) was prepared by adding and mixing an aqueous silver nitrate solution and an aqueous potassium bromide and sodium chloride solution while controlling the solution to an aqueous gelatin solution at 35 ° C. did. In this emulsion, potassium rhodium bromide and potassium chloroiridate were added to a concentration of 1.0 × 10 ⁻⁷ (mol / mol silver), and Rh ions and Ir ions were doped. The silver / gelatin mass ratio was 4/1 (silver / gelatin volume ratio was about 0.5), and an alkali-treated low molecular weight gelatin having an average molecular weight of 40,000 was used as the gelatin species. The average particle size was 0.04 μm, and the variation coefficient of the particle size distribution was 0.13.

  Thereafter, 2.0 mg of sodium thiosulfate per mol of silver halide was used for chemical sensitization at 40 ° C. for 80 minutes, and after completion of chemical sensitization, 4-hydroxy-6-methyl-1,3,3a, 7- The photosensitive silver halide emulsion was obtained by adding 500 mg of tetrazaindene per mole of silver halide and further adding 500 mg of the following sensitizing dye SD-1 per mole of silver halide.

(Support)
A butyl acrylate: styrene: glycidyl acrylate (40:20:40 mass%) latex is applied to one side of a transparent polyethylene terephthalate film support having a thickness of 120 μm, a width of 60 cm, and a length of 120 m, which has been subjected to plasma discharge treatment on both sides. An undercoat layer was provided by applying 0.40 g / m ² of hexamethylene-1,6-bis (ethylene urea) to 0.01 g / m ² . On one side, 0.20 g / m ^{2 of} gelatin was applied as a non-photosensitive intermediate layer.

Further, 0.20 g / m ^{2 of} gelatin was coated on the other side as a non-photosensitive intermediate layer.

(Coating of silver halide photosensitive layer)
To the above silver halide emulsion, a surfactant (disulfo oxalate, 2-ethylhexyl, sodium) is added as a coating aid to adjust the surface tension, and a hardener (tetrakis, vinylsulfonylmethyl, methane). Is added at a rate of 20 m so that the silver coating amount is 0.60 g / m ² and the gelatin coating amount is 0.15 g / m ^2. The coating was carried out at a rate of / min and dried to prepare six roll-shaped silver halide photosensitive materials.

(exposure)
The silver halide photosensitive material thus obtained was subjected to pattern exposure shown in FIGS. The mesh portion has a lattice shape with a line width of 10 μm and a line interval of 240 μm, and the lattice lines are formed at an angle of 45 degrees with respect to the longitudinal direction of the roll.

  FIG. 1 is a comparative example having only a mesh portion and no frame portion. FIG. 2 shows a comparative example in which strip-shaped frame portions having a width of 2 cm are continuously provided in the longitudinal direction at both ends of the width. FIG. 3 shows an example of the present invention having a frame mesh in which the line width of the frame mesh is increased to 50 μm. FIG. 4 shows an example of the present invention in which a rectangular geometric pattern is added to both ends of the width, and the geometric pattern is arranged so that stress is not easily applied to the bending direction in winding the roll. FIG. 5 is an example of the present invention in which the average aperture ratio is lowered by covering a part of the mesh portion at both ends of the width, and is arranged so that stress is not easily applied to the geometric pattern with respect to the bending direction in winding the roll. Has been. FIG. 6 shows an example of the present invention in which the line spacing of the mesh portions at both ends of the width is reduced to 80 μm.

  These electromagnetic wave shielding mesh patterns were exposed using a laser beam having an oscillation wavelength of 440 nm (blue semiconductor laser diode manufactured by Nichia Corporation) while continuously conveying the silver halide photosensitive material.

(Development processing)
The exposed sample is developed for 60 seconds at 25 ° C. using the following developer using an automatic development / physical development / plating integrated machine of a leader belt conveyance system with a width of 60 cm as shown in FIG. Thereafter, using the following fixing solution, a fixing treatment was performed at 25 ° C. for 120 seconds, followed by a water washing treatment. Furthermore, after performing physical development at 25 ° C. for 5 minutes using the following physical developer, followed by washing with water, electrolytic plating at 25 ° C. for 5 minutes at 2.5 A / cm ² with the following copper plating solution. Went and washed with water. Finally, it dried with 60 degreeC warm air, and produced the elongate roll-shaped electromagnetic wave shield film samples 101-106.

(Developer)
500 ml of pure water
Metol 2g
80 g of anhydrous sodium sulfite
Hydroquinone 4g
4g borax
Sodium thiosulfate 10g
Potassium bromide 0.5g
Add water to bring the total volume to 1 liter (fixing solution)
750 ml of pure water
Sodium thiosulfate 250g
Anhydrous sodium sulfite 15g
Glacial acetic acid 15ml
Potash alum 15g
Add water to make 1 liter (physical developer)
800ml of pure water
Citric acid 5g
Hydroquinone 7g
Silver nitrate 3g
Add water to bring the total volume to 1 liter (copper plating solution)
125 g of copper sulfate
85 g of sulfuric acid
Polyethylene glycol 0.1g
1mol / L hydrochloric acid 2.0ml
Add water to bring the total volume to 1 liter.

(Evaluation)
Thus, the following evaluation was performed with respect to the electromagnetic wave shield film samples 101-106 which have the electroconductive metal mesh part obtained.

<Development unevenness>
At the stage where the fixing process and subsequent water washing are completed, the sample being transported is exposed to the atmosphere, and the occurrence of pattern unevenness near the border between the frame and mesh of each sample is detected with a high-definition CCD camera. A plurality of positions were photographed and displayed on a 40-inch monitor screen at an enlargement magnification of 200 times, visually observed, and evaluated according to the following criteria.

○: No variation in mesh line width is observed. Δ: A slight variation in mesh line width is observed. ×: Line width is less than 1/2 or disconnection is observed.
After the plating treatment and drying, the pattern unevenness in the vicinity of the border between the frame part and the mesh part of the sample was photographed at several points with a high-definition CCD camera and magnified 200 times on a 40-inch monitor screen. And visually observed and evaluated according to the following criteria.

○: No variation in the line width of the mesh is observed. Δ: A slight variation in the line width of the mesh is observed. ×: A portion where the line width is 1/2 or less or a disconnection portion is observed. <Membrane Adhesiveness>
After the plating treatment, each dried sample is wound around a winding core having a diameter of 10 cm with the mesh portion inside, left in a 23 ° C. and 55% RH atmosphere for 24 hours, and then wound again in the same manner with the mesh portion outside. After being allowed to stand in an atmosphere of 23 ° C. and 55% RH for 24 hours, film adhesion was evaluated according to the cross-cut adhesion test method of JIS-K5400.

  A cross-shaped cut line was drawn for each sample, and cellophane tape No. 1 manufactured by Nitto Denko Corporation was used. 29 was affixed, the tape was peeled off, and the peeling state of the squares of the film was examined. When the film remaining rate is F and the number of cross-cut cells is n1, F = n1 / n × 100 (%).

<curl>
Each sample was wound around a winding core having a diameter of 10 cm with a tension of 19.6 N / cm ² with the mesh portion forming surface inside, and left for 1 week in an atmosphere of 35 ° C. and 55% humidity. After completion, 1 m close to the core of each sample was cut out, suspended so that the end portion of the sample was down, and left for 1 day in an atmosphere of 23 ° C. and 55% humidity, and extended length Lc ( Fig. 8) was measured. The larger the value, the closer to 1 m, the smaller the curl and the better. The smaller the numerical value, the larger the curl, which indicates that there is a possibility that inconvenience may occur in processing in the subsequent process.

<Grounding>
Adhering the frame part of the electromagnetic shielding film and a tin-plated annealed copper conductor with the same width as the frame part and having a thickness of 50 μm with a heat sealer (160 ° C., 40 N / cm ² , 3 seconds) , Measured at a width of 15 mm and evaluated according to the following criteria.

○: 5Ω or less △: Greater than 5Ω and 20Ω or less ×: Greater than 20Ω

  From Table 1, it can be seen that even in the production of long continuous rolls, the present invention is a transparent electromagnetic wave shielding film that is excellent in attaching a mesh pattern film, having little curl curl generation, and having excellent panel grounding properties. Furthermore, it turns out that the manufacturing method of this invention is a manufacturing method of the transparent electromagnetic wave shielding film which improved the development processing nonuniformity and plating nonuniformity which generate | occur | produce during electromagnetic wave shielding film manufacture.

It is a figure which shows the exposure pattern of a comparative example. It is a figure which shows another example of the exposure pattern of a comparative example. It is a figure which shows the exposure pattern of this invention. It is a figure which shows another example of the exposure pattern of this invention. It is a figure which shows another example of the exposure pattern of this invention. It is a figure which shows another example of the exposure pattern of this invention. It is the schematic which shows the process of the automatic image development processing / physical development / plating integrated machine used for this invention. It is a figure which shows the extension length of a curl measurement.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mesh part 2 Frame part 11 Development 12 Fixing 13 Washing with water 14 Physical development 15 Plating 16 Drying Lc Extension length

Claims (13)

An electromagnetic wave shielding film having a continuous conductive mesh portion and a frame portion formed on a long transparent support, wherein the frame portion is a geometric pattern having a higher conductivity than the mesh portion. An electromagnetic shielding film characterized by. The electromagnetic wave shielding film according to claim 1, wherein the geometric pattern having high conductivity is a frame mesh having an aperture ratio smaller than that of the mesh portion. The electromagnetic wave shielding film according to claim 2, wherein the frame mesh having a small opening ratio is a frame mesh having a pitch smaller than that of the mesh portion. The electromagnetic wave shielding film according to claim 2 or 3, wherein the frame mesh having a small opening ratio is a frame mesh having a line width larger than that of the mesh portion. The electromagnetic shielding film according to claim 1, wherein the geometric pattern having high conductivity is a frame mesh having a thickness larger than that of the mesh portion. A silver halide photosensitive material in which a layer comprising at least a photosensitive silver halide and a binder is coated on a long transparent support, and after pattern exposure, development processing and plating are performed, and a continuous conductive mesh portion and In the manufacturing method of the transparent electromagnetic wave shielding film which forms the frame part of a geometric pattern, The manufacturing method of the electromagnetic wave shielding film characterized by having the process which makes the said frame part highly conductive rather than the said mesh part. 7. The method for producing an electromagnetic wave shielding film according to claim 6, wherein the step of increasing the conductivity is a step of thickly applying a region corresponding to the frame portion at the time of applying the silver halide emulsion. The method for producing an electromagnetic wave shielding film according to claim 6, wherein the step of increasing the conductivity is a step of exposing the geometric pattern pitch of the frame portion to be smaller than that of the mesh portion. The method for producing an electromagnetic wave shielding film according to claim 6, wherein the step of increasing the conductivity is a step of exposing the line width of the geometric pattern of the frame portion to be thick. The method for producing an electromagnetic wave shielding film according to claim 6, wherein the step of increasing the conductivity is a step of accelerating a developing process of the frame portion. The method for producing an electromagnetic wave shielding film according to claim 6, wherein the step of increasing the conductivity is a step of promoting plating of a frame portion. The method for producing an electromagnetic wave shielding film according to claim 6, wherein the step of increasing the conductivity is a step of gold-plating a frame portion. The method for producing an electromagnetic wave shielding film according to claim 6, wherein the step of increasing the conductivity is a step of pressurizing, heating, or heating the frame portion after pressurization.

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