JP2008078338A - Method and device for manufacturing electromagnetic wave shielding material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electromagnetic wave shielding layer having a higher quality and a lower cost, as compared to conventional methods, by applying a silver halide photographic material technology and an IJ technology, and to provide the high-quality, low-cost electromagnetic wave shielding material. <P>SOLUTION: The method for manufacturing the electromagnetic wave shielding material, having a predetermined metallic pattern on a support medium, comprises a step of applying including a photosensitive metal salt fine particle on the support medium in a substantially metallic pattern like, applying a light-shielding liquid to the area with the photographic sensitive metal salt fine particles applied so that only the area with the metallic pattern formed is exposed, drying, conducting the exposure to the area with at least the photographic sensitive metal salt fine particles applied, forming the metallic pattern on the support medium by the development process, and enhancing the electrical conductivity of the metallic pattern formed through development with a physical development and/or a plating process. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for manufacturing an electromagnetic wave shielding material, and more specifically, in a method and an apparatus for producing an electromagnetic wave shielding and shielding material used as a front plate for a plasma display (hereinafter, abbreviated as PDP), etc. The present invention relates to a manufacturing method and apparatus that can contribute to reducing manufacturing costs.

  A plasma display panel (hereinafter referred to as “PDP”) that is light and thin but has high luminance and a large screen is already well known. A PDP is a dielectric layer formed on the inner surface of a front glass substrate by forming a large number of cells in the gap between a front glass substrate and a rear glass substrate (hereinafter referred to as a tube) arranged at intervals and enclosing xenon gas in the tube. In addition, a surface discharge is generated on the surface of the protective layer to excite xenon gas molecules, and ultraviolet rays are generated to emit light from the phosphor in the cell. In this type of PDP in which xenon gas is sealed in a tube, near infrared rays and electromagnetic waves are also generated together with ultraviolet rays generated to cause the phosphor to emit light, and a part thereof is emitted outside the tube. Therefore, a filter having near-infrared cut (absorption) performance, electromagnetic wave shielding performance, scratch prevention performance, antireflection performance, and the like has been attached to the front surface of the conventional PDP (Patent Document 1). In this filter, a silver vapor deposition film is generally formed as an electromagnetic wave shielding layer on a polyester film as a base material, and a near infrared absorption layer is formed by coating a near infrared absorber on the silver vapor deposition film. Usually called a functional film.

  As an electromagnetic wave shielding material, in addition to a metal vapor deposition film, a conductive metal pattern, for example, a (linear) antenna element having a frequency selectivity (Patent Document 2), The thing (patent documents 3, 4) etc. which consist of a metal mesh with a high aperture ratio are also proposed.

In the prior art, since the production of the electromagnetic wave shielding layer using such a silver vapor deposition film is performed using a large and expensive facility, the production cost is high and the quality is not stable.
JP 2000-231338 A JP-A-10-169039 JP 2003-46293 A JP 2004-221565 A

  An object of the present invention is to provide a method for producing an electromagnetic wave shielding layer that is better in quality and cheaper than conventional methods by applying silver halide photosensitive material technology and ink jet technology. It is to provide an inexpensive electromagnetic shielding material.

  The above object of the present invention is achieved by the following means.

  1. A method for producing an electromagnetic wave shielding material having a predetermined metal pattern on a support, the step of applying a coating solution containing photosensitive metal salt fine particles on the support in a substantially metal pattern, the photosensitive Step of applying a light-shielding liquid to a region other than the region where the metal pattern is formed, a drying step, and at least photosensitive metal salt particles are applied so that only the region where the metal pattern is formed is exposed. A step of exposing the region, a step of forming a metal pattern on the support by development processing, and a step of increasing the conductivity of the metal pattern formed by development by physical development and / or plating treatment. A method for producing an electromagnetic wave shielding material.

  2. 2. The method for producing an electromagnetic wave shielding material according to 1 above, wherein the step of applying the coating liquid containing photosensitive metal salt fine particles in a substantially metal pattern is performed by an ink jet method.

  3. 3. The method for producing an electromagnetic wave shielding material according to 1 or 2, wherein the step of applying the light shielding liquid is performed by an ink jet method.

  4). 4. The method for producing an electromagnetic wave shielding material according to any one of 1 to 3, further comprising a drying step after the step of applying the coating solution containing the photosensitive metal salt fine particles in a substantially metal pattern. .

5. 5. The electromagnetic wave shielding material according to any one of 1 to 4, wherein the coating amount of the coating solution containing the photosensitive metal salt fine particles is 0.1 to 5 g / m ² in terms of metal. Manufacturing method.

  6). 6. The method for producing an electromagnetic wave shielding material according to any one of 1 to 5, wherein the photosensitive metal salt fine particles are silver halide fine particles.

  7. 7. The method for producing an electromagnetic wave shielding material according to any one of 1 to 6, wherein the coating liquid containing the photosensitive metal salt fine particles contains a binder.

  8). The method for producing an electromagnetic wave shielding material according to any one of 1 to 7, wherein the support is a transparent support having an antihalation layer.

  9. 9. The method for manufacturing an electromagnetic wave shielding material according to any one of 1 to 8, wherein the plating treatment includes an electroless plating treatment and a subsequent electrolytic plating treatment.

  10. An apparatus for manufacturing an electromagnetic wave shielding material having a predetermined metal pattern on a support, wherein a coating liquid containing photosensitive metal salt fine particles is applied on the support in a substantially metal pattern. A light-shielding liquid is applied to a region where the metal pattern is formed so that only a region where the metal pattern is formed is exposed among the coated portion of the photosensitive metal salt fine particle having an inkjet head and the region where the photosensitive metal salt fine particle is coated. An electromagnetic shielding material comprising at least a coating part of a light-shielding liquid having a second inkjet head to be applied, a drying part, an exposure part, a development part, a physical development process and / or a plating part apparatus.

  According to the present invention, in the manufacturing method using the photosensitive metal salt fine particles of the electromagnetic wave shielding material used for the front surface of the plasma display, the quality can be improved and the manufacturing cost can be greatly reduced.

  The best mode for carrying out the present invention will be described in detail below.

  In the present invention, the electromagnetic wave shielding material is composed of a conductive metal pattern. For example, an antenna element having frequency selectivity (linear) antenna elements arranged at a constant interval (Patent Document 2), or an aperture ratio. Including a high metal mesh pattern (Patent Documents 3 and 4).

  First, a (linear) antenna element having wave number selectivity will be described.

  When a conductor piece is in the air, when a radio wave is incident on this surface, in the linear antenna element, for example, the end is opened, and the length (electric length) of one side extending from the center is shielded. When the electromagnetic wave is made to resonate with the wavelength to be shielded as a quarter wavelength (1/2 wavelength in a single shape) of the radio wave, the electromagnetic wave can be reflected, scattered and attenuated.

  Moreover, what is necessary is just to make it the same as the wavelength of the electromagnetic wave which is going to shield perimeter (electric length), when it is set as the closed annular | circular shape instead of an edge part open shape.

  Considering the electromagnetic field reflection equivalent area (scattering aperture area) or the electromagnetic field reflection equivalent volume (scattering aperture volume) of such a linear antenna element, it is planar or three-dimensional on a non-conductive material in space. By arranging them at predetermined intervals (antenna element pattern), it is possible to attenuate and shield the electromagnetic wave having the resonated frequency. If the thickness of the conducting wire of the linear antenna element is made thin so as not to obstruct the field of view, the conducting wire portion does not cover the entire surface, so that translucency and visibility are not impaired.

  FIG. 1 shows some examples of radio wave reflecting surfaces having antenna element patterns.

  Small linear antenna elements patterned in this way can be shielded from specific frequencies by specifying their length, and as a result, electromagnetic waves of other wavelengths are allowed to pass through. Only specific radio waves can be shielded without shielding the information that needs to be collected.

  In addition, the conductive metal mesh pattern having a large aperture ratio forms a shielding material having translucency and electromagnetic wave shielding properties (no wavelength selectivity). For example, there is a square lattice pattern as shown in FIGS. It is a continuous mesh pattern having both translucency and conductivity, for example, a line width of 10 μm and a pitch of 300 μm.

  The present invention uses a photosensitive metal salt fine particle (for example, a silver halide photosensitive material) on a continuous web made of a non-conductive film substrate such as a polyimide film, a polyester film, or a polyethylene film. The present invention relates to a method for manufacturing an electromagnetic wave shielding material for continuously and efficiently producing a plurality of antenna element patterns or mesh patterns corresponding to different electromagnetic wave shielding conditions such as frequency selectivity and transmittance.

  As the photosensitive metal salt fine particles, any metal can be used as long as it is photosensitive, for example, heavy metal salts such as copper and chromium, but photosensitive silver salt fine particles, particularly silver halide fine particles are preferable, and are used for photographic use. A silver halide emulsion is preferably used.

A schematic process of the method for producing an electromagnetic wave shielding material of the present invention is shown in FIG.
The first step is to first apply the coating liquid containing photosensitive silver salt fine particles to the film base fed out from the original roll to form a metal pattern required as an electromagnetic shielding material. This is a process in which a photosensitive material is formed by coating the upper region. Next, the formed photosensitive material web is continuously, preferably dried, and then a light shielding material is further applied onto the photosensitive material (light shielding material application).

  The light shielding material is applied using a light shielding ink according to a required pattern, for example, by an ink jet method. This masks the region other than the region of the photosensitive material surface on which the conductive metal pattern is to be formed.

  When the light-shielding ink is applied in a pattern, the photosensitive material web is then exposed in an exposure process. The exposure step is a step of recording a metal pattern on a continuous web. In the exposure step, the photosensitive material is continuously exposed to form a conductive metal silver pattern in the region coated with the photosensitive silver salt. The area to be exposed is exposed.

  The development step is a step of converting the pattern recorded on the web into a metallic silver pattern. By the development step, the photosensitive material is continuously developed and the light-shielding ink is simultaneously removed. A conductive metal silver pattern is formed by the metal silver formed on the exposed portion.

  The metallic silver pattern is, for example, a mesh pattern including a metallic silver portion formed by development and an undeveloped portion or an opening portion to which no photosensitive silver salt is applied, and is an antenna element pattern having frequency specificity.

  In order to further impart electrical conductivity to the metallic silver formed by the development treatment, it is preferable to provide physical development and / or plating treatment steps.

  In the present invention, an electromagnetic wave-shielding conductive metal pattern to be formed on a support is formed in the step of forming a photosensitive material by applying a coating solution containing photosensitive silver salt fine particles to a film substrate. The coating liquid containing the photosensitive metal salt fine particles is applied in an approximate pattern larger than the region, for example, having a thick line width of the pattern and including these patterns. This means that the coating is performed in a substantially metal pattern.

  FIG. 3 shows the electromagnetic wave shielding pattern formed after the application of photosensitive silver salt fine particles and the light shielding ink when the conductive metal mesh pattern is formed as the electromagnetic wave shielding layer, and after exposure and development. A schematic diagram of each is shown.

  FIG. 3A shows a case where silver salt fine particles are applied in a substantially metal pattern by offset printing or the like.

  The coating liquid containing the photosensitive silver salt fine particles is formed in an approximate area covering the area where the conductive metal pattern on the support is to be formed (therefore, the line width constituting the mesh is wide). . In this state, the applied photosensitive silver salt pattern is applied in an area at least wider than the metal pattern to be finally formed (FIG. 3A).

  The region to be the conductive metal pattern is defined by the subsequent application of the light shielding ink. That is, of the region coated with the metal salt fine particles, a region that should be a conductive metal pattern in the metal salt fine particle coated region is exposed with a light-shielding ink, and a metal pattern should be formed by covering other regions. A region is defined (FIG. 3B). In addition, since it is not necessary to cover the area where the photosensitive silver salt fine particles are not coated with a light shielding material, it is only necessary to cover at least the area other than the area that should be the conductive metal pattern.

  Thereafter, by exposing and developing, only the exposed metal salt fine particles are developed, and the light-shielding ink and undeveloped silver salt are fixed and removed, whereby a predetermined metal silver pattern is formed on the support. It is formed on the top (FIG. 3C).

  Thus, the silver salt fine particle application region may be at least larger than the region that finally becomes the metal silver pattern. Accordingly, the light-shielding ink is applied so as to include at least the boundary between the silver salt fine particle application region and the non-application region. The line width of the metal silver film constituting the conductive metal pattern (mesh pattern) actually formed after the development processing is small. Accordingly, the accuracy of silver salt fine particle coating may be coarser than that of the light-shielding ink coating by the ink jet method, and the coating and the coating can be performed at a general resolution without necessarily requiring the resolution and accuracy required for the conductive metal pattern. The coating can be performed by a printing method (offset printing) or a coating method such as an inkjet method.

  For example, after a coating solution containing metal salt fine particles is printed by a method with a slightly rough accuracy, for example, by screen printing, the light-shielding ink may be applied by using a printing method with higher accuracy such as an inkjet method.

  FIG. 4 shows an example of producing a metal mesh pattern having a pitch of 300 μm and a width of 10 μm.

  For example, a coating solution containing photosensitive silver salt fine particles is applied in a mesh pattern shown in FIG. The mesh pattern pitch is 300 μm vertically and horizontally, the size of the opening is 200 μm × 200 μm, and the line width between the openings is 100 μm. In order to obtain desired translucency, the line width needs to be about 10 μm. Therefore, as shown in FIG. 4B, the light-shielding ink is applied so that the exposed portion of the silver salt fine particle application portion has a line width of about 10 μm so as to straddle the boundary between the photosensitive silver salt fine particle application region and the non-application region. To do. The shaded area is a light-shielding ink application part. Since the light-shielding ink does not need to be applied to the area where the silver salt fine particles are applied and does not need to be applied to the areas where the light shielding is not necessary, at least the boundary between the area where the silver salt fine particles are applied and the area where the silver salt fine particles are not applied. A light-shielding ink is applied so as to include it. In this way, the light-shielding ink is applied so that only the metal pattern forming portion of the silver salt fine particle application region is exposed.

  FIG. 4B shows the relationship between the photosensitive silver salt coating layer and the light-shielding ink coating layer covering the same, showing a cross-sectional view along A-A ′.

  As described above, when the photosensitive silver salt is applied in a mesh pattern with a line width of 100 μm and a pitch of 300 μm, and the line width of the conductive mesh is 10 μm, the silver salt fine particle coating liquid is applied to the entire surface. In comparison, 50 to 70% of the coating liquid (thus metallic silver) can be saved. Similarly, the light-shielding ink can save 50 to 60%.

  How much light-shielding ink should be used with respect to the coating area of the first silver salt fine particles in forming the conductive mesh of the present invention can be adjusted optimally depending on the metal salt used, the size of the mesh pattern, etc. However, if expressed in terms of line width, the line width in the initial silver salt fine particle coating is 2 to 20 times the line width of the metal pattern that is finally formed when viewed from the line width of the conductive mesh or antenna element. It is preferable to set the degree. More preferably, it is 4 to 10 times. In the example shown in FIG.

  According to the method of the present invention, there is no need to apply a coating solution containing metal salt fine particles to the entire surface of the film substrate (the metal salt fine particles other than the region where the metal pattern is formed even if applied are collected by fixing). In addition to minimizing the waste of photosensitive metal salt resources and light-shielding ink, the cost of fixing and cleaning to remove it from the light transmission area of the electromagnetic shielding material Can be greatly reduced, and the cost improvement effect is great.

  As described above, the application of the silver salt fine particle-containing coating solution and the application of the light shielding material have been described. After the photosensitive metal salt fine particle pattern and the light shielding ink pattern are sequentially formed on the support in this manner, a drying process is performed. Then, at least an area where the photosensitive metal salt fine particles are applied is exposed, and subsequently to the exposure step, the silver salt fine particles are converted into a silver metal image by silver halide development, and a metal pattern is formed on the support.

  In the exposure step, light irradiation may be performed on a portion where the photosensitive silver salt is exposed. However, when the exposure step is performed on a continuous web, it is preferable to uniformly expose the entire web.

  Thereafter, it is preferable to further provide a step of increasing the conductivity of the developed metallic silver image by physical development and / or plating.

  Thereafter, the electromagnetic wave shielding material (film) can be continuously formed in a web shape by providing additional steps such as filter layer coating or reflection layer coating, for example, to form a PDP front plate. In the formed electromagnetic wave shielding material, for example, an infrared absorption layer, an adhesive layer, or an antireflection layer or the like may be formed on the outermost surface in an additional step.

  Hereinafter, embodiments of the present invention will be described in more detail.

  In FIG. 5, a light-shielding material is applied to a photosensitive material coated with a photosensitive silver salt to produce a light-shielding ink pattern, which is then exposed and developed to form a conductive metal pattern with silver on the film. An example of the specific aspect of the formation process of the electromagnetic wave shielding material until it does is shown.

  As a support film to be a film base, various transparent materials such as polyester films such as PET (polyethylene terephthalate) and PC (polycarbonate), polycarbonate films, cellulose ester films such as triacetyl cellulose, and PMMA (polymethyl methacrylate). A roll of a resin film (having a thickness of about 25 to 250 μm, for example) can be used.

  These film base materials may have a known hydrophilic undercoat layer for coating a photosensitive silver salt (silver halide emulsion) layer.

  These support films are usually continuously formed in a roll form, and the subbing treatment and the like are continuously performed in a roll form.

  The present invention manufactures an electromagnetic wave shielding material by continuously applying photosensitive silver salt fine particles to a base film, and exposing and developing to form a metal (silver) pattern on the base film. is there.

  In FIG. 5, the film base fed out from the film roll serving as the base is coated with the photosensitive silver salt fine particles on the base film (for example, polyester film) by the silver salt fine particle coating step, and the photosensitive material. It is a silver salt application process.

  In the coating process of the photosensitive silver salt fine particles, a coating method capable of printing on a pattern such as offset printing or an inkjet method is used, and an inkjet method is particularly preferable. In FIG. 5, the first ink jet head 10 continuously applies a coating solution containing silver salt fine particles in a substantially pattern shape including a region to be an electromagnetic wave shielding metal pattern on a substrate.

  Preferably, since the following silver halide emulsion is used for coating, the inkjet head is 30 ° C. or higher, preferably 35 ° C. or higher, in which gelatin (protective colloid), which is the main component in the binder of the silver halide emulsion, does not gel. It is necessary to set the temperature of.

Further, the silver equivalent coating amount of silver halide which is the metal salt of the coated portion is preferably in the range of 0.1 to 5 g / m ² in order to obtain sufficient conductivity after development. A range of 0.3 to 1 g / m ² is more preferable.

(Photosensitive silver salt)
Examples of the photosensitive silver salt used in the present invention include inorganic silver salts such as silver halide and organic silver salts such as silver acetate, but it is preferable to use silver halide having excellent characteristics as an optical sensor.

  In the present invention, silver halide is used in order to function as an optical sensor, but the technology relating to silver halide used in silver salt photographic film, photographic paper, film for printing plate making, emulsion mask for photomask, etc. Can be used as is.

  The halogen element contained in the silver halide may be any of chlorine, bromine, iodine and fluorine, or a combination thereof. For example, silver halide mainly composed of AgCl, AgBr, and AgI is preferably used, and silver halide mainly composed of AgBr is preferably used.

  Here, “silver halide mainly composed of AgBr (silver bromide)” refers to silver halide in which the molar fraction of bromide ions in the silver halide composition is 50% or more. The silver halide grains mainly composed of AgBr may contain iodide ions and chloride ions in addition to bromide ions.

  Since silver halide is in the form of solid grains, from the viewpoint of the quality of the mesh-patterned metallic silver layer formed after exposure and development processing, the average grain size of silver halide is 0.1 to 1000 nm in terms of sphere equivalent diameter. (1 μm) is preferable, 1 nm to 100 nm is more preferable, and 10 nm to 100 nm is even more preferable. Incidentally, the sphere equivalent diameter of silver halide grains is the diameter of grains having the same volume and a spherical shape.

  The shape of the silver halide grains is not particularly limited, and may be various shapes such as a spherical shape, a cubic shape, a flat plate shape (hexagonal flat plate shape, triangular flat plate shape, tetragonal flat plate shape, etc.), octahedron shape, and tetrahedron shape. Can be.

The silver halide may further contain other elements. For example, in a photographic emulsion, it is useful to dope metal ions used for obtaining a high-contrast emulsion. In particular, transition metal ions such as rhodium ions and iridium ions are preferably used because a difference between an exposed portion and an unexposed portion tends to occur clearly when a metallic silver image is generated. Transition metal ions represented by rhodium ions and iridium ions can also be compounds having various ligands. Examples of such a ligand include cyanide ions, halogen ions, thiocyanate ions, nitrosyl ions, water, hydroxide ions, and the like. Specific examples of the compound include K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ .

In the present invention, the content of the rhodium compound and / or iridium compound contained in the silver halide is preferably 10 ⁻¹⁰ to 10 ⁻² mol / mol Ag with respect to the number of moles of silver in the silver halide. And more preferably 10 ⁻⁹ to 10 ⁻³ mol / mol Ag.

  In addition, silver halides containing Pd (II) ions and / or Pd metals can also be preferably used. Such silver halide grains can be prepared by adding Pd in the process of forming silver halide grains. It is also preferred that Pd (II) ions be present on the surface of the silver halide by a method such as addition at the time of post-ripening.

  Pd is well known as an electroless plating catalyst, and the inclusion of this Pd increases the speed of physical development and electroless plating, increases the production efficiency of a desired electromagnetic shielding material, and reduces the production cost. Contribute.

The content of Pd ion and / or Pd metal contained in the silver halide is preferably from 10 ^-8 to 10 ^-4 mol / mol Ag with respect to the number of moles of silver halide, ^10-6 ~ More preferably, it is 10 ⁻⁵ mol / mol Ag.

Further, in order to suppress the binding with gelatin and coordinate more efficiently to AgX, it is preferably added as a Pd (SCN) ₂ complex or palladium glycinate.

Examples of the Pd compound include PdCl ₄ and Na ₂ PdCl ₄ .

  The silver halide can be subjected to chemical sensitization performed in a silver halide photographic emulsion in order to further improve the sensitivity as an optical sensor. As chemical sensitization, for example, noble metal sensitization such as gold sensitization, chalcogen sensitization such as sulfur sensitization, reduction sensitization or the like can be used.

  Examples of emulsions that can be used in the present invention include color negatives described in Examples of JP-A-11-305396, JP-A-2000-321698, JP-A-13-281815, and JP-A-2002-72429. A film emulsion, a color reversal film emulsion described in JP-A No. 2002-214731, a color photographic paper emulsion described in JP-A No. 2002-107865, and the like can be suitably used.

(binder)
In the silver salt fine particle (containing) layer of the present invention, the binder can be used for the purpose of uniformly dispersing the silver salt particles and assisting the adhesion between the silver salt-containing layer and the support. Either a water-insoluble polymer or a water-soluble polymer can be used as a binder, but a water-soluble polymer is preferably used.

  Examples of the binder include gelatin, polyvinyl alcohol (PVA), polyvinyl pyrrolidone (PVP), polysaccharides such as starch, cellulose and derivatives thereof. Gelatin is particularly preferred.

  Content of the binder contained in the silver salt fine particle content layer of this invention is not specifically limited, It can determine suitably in the range which can exhibit a dispersibility and adhesiveness. The content of the binder in the silver salt-containing layer is preferably 1/4 to 100 in terms of Ag / binder volume ratio, more preferably 1/3 to 10, and more preferably 1/2 to 2. Further preferred. Most preferably, it is 1 / 1-2. If the silver salt-containing layer contains a binder in an Ag / binder volume ratio of 1/4 or more, the metal particles can easily come into contact with each other in the physical development and / or plating process, and high conductivity can be obtained. Therefore, it is preferable.

  Further, the silver salt fine particle-containing layer of the present invention may contain various additives such as an activator and a hardener in addition to the photosensitive silver salt fine particles.

  The solvent used in the silver salt fine particle layer of the present invention is not particularly limited. For example, water, organic solvents (for example, alcohols such as methanol, ketones such as acetone, amides such as formamide, dimethyl, etc. Sulfoxides such as sulfoxide, esters such as ethyl acetate, ethers and the like), ionic liquids, and mixed solvents thereof. In order to use a silver halide gelatin emulsion, it is preferable to mainly use water.

  The above-mentioned silver salt fine particle layer may be applied by applying an aqueous coating solution of, for example, a silver halide emulsion containing each of the above components onto a substrate film by, for example, offset printing or an inkjet head.

  The ink jet head may be an on-demand system or a continuous system. In addition, as a discharge method, an electro-mechanical conversion method (for example, a single cavity type, a double cavity type, a bender type, a piston type, a shear mode type, a shared wall type, etc.), an electro-thermal conversion method (for example, thermal ink jet) Any ejection method such as a mold, a bubble jet (registered trademark) mold, or the like may be used.

  In FIG. 5, the coating process is performed on the base film that passes over the backup roll, for example, with a coating liquid supplied from the first inkjet head 10 facing the backup roll. The inkjet head itself is maintained at a temperature of, for example, about 40 ° C. at which gelatin in the binder of the silver halide emulsion does not gel. Further, the backup roll temperature is preferably maintained at a temperature of 15 ° C. or less, preferably 10 ° C. or less, at which gelatinization becomes easy.

Specific examples of the silver halide emulsion used in the present invention include, for example, a halogen containing fine AgBrI (I = 2 mol%) grains having a spherical equivalent diameter (average grain diameter) of 0.05 μm containing 3 g of gelatin per 38 g of silver. The silver halide emulsion may be coated on a PET film (100 μm thick) that has been subtracted after silver sensitization and a gelatin hardener so that the silver amount is about 2 g / m ² .

  Further, when the silver halide emulsion layer is formed on the film substrate, an antihalation layer may be provided on the back surface of the support. The antihalation layer is a layer that suppresses reflection of light transmitted through the silver halide fine particle layer and transmitted through the film base material, and can suppress the bleeding of light due to exposure and increase the sharpness of the formed metal silver pattern. For example, a light-absorbing material such as carbon black dispersed in water or an alkali-soluble binder is applied to the back side of the substrate.

  After the photosensitive silver salt fine grain emulsion is applied in a substantially metal pattern, it is preferably passed through a drying step (omitted in the figure), and the dried photosensitive material is then subjected to a light shielding material coating step. It becomes. Here, the photosensitive material web continuously conveyed is continuously supplied with the light-shielding ink from the second ink jet head 100 by the ink jet method, and the photosensitive silver salt formed in the above-mentioned substantially pattern shape. A light-shielding ink pattern is formed on the photosensitive material so that only the region where the metal pattern is formed is exposed in the region where the fine particles are applied. Further, the light-shielding ink does not need to be applied to the non-coated area of the photosensitive silver salt fine grain emulsion.

  After the photosensitive silver salt fine particle layer is coated, the light shielding material may be applied without drying, but the photosensitive silver salt fine particle layer and the ink layer may be mixed with each other and the light shielding performance may be insufficient. Therefore, in this case, since it depends on the composition of the photosensitive silver salt layer, the ink composition, etc., whether or not there is such a problem, a careful judgment is made.

  The light-shielding ink is applied by an inkjet (IJ) method, except for a region where silver salt fine particles are not applied, in a portion other than a region where a silver pattern necessary as an electromagnetic wave shielding layer is formed.

  Thereafter, exposure and development are performed to fix the silver particles and peel off (dissolve) the ink, thereby forming a necessary metallic silver pattern.

(Light-shielding ink)
In the present invention, the light-shielding ink is preferably water-soluble, and the light-shielding ink is printed such that the average transmittance at a wavelength of 370 to 780 nm of the ink layer is 30% or less when applied (printed). . As the light-shielding ink, a water-based ink in which a dispersant and a light-shielding pigment are contained in a water-soluble polymer can be used.

  Examples of the light-shielding ink layer pigment include carbon black, aluminum powder (Pigment Metal 1), bronze powder, copper powder (Pigment Metal 2), tin powder (Pigment Metal 5), lead powder (Pigment Metal 4), and zinc. Metal powder such as powder metal (Pigment Metal 6) can also be used.

  The water-soluble polymer constituting the ink includes natural water-soluble polymer compounds such as alginic acid, dextran, dextrin, guar gum, gum arabic, pectin, casein, agar, and xanthan gum, and synthetic polymer compounds such as polyvinyl alcohol and polyvinyl pyrrolidone. There may be.

  Further, the light-shielding pigment is not necessarily required to be black as long as it has a property of absorbing the exposure wavelength, but carbon black is preferable because it absorbs the entire visible light.

  For example, a small amount of Olfin e1010 (manufactured by Nisshin Chemical Co., Ltd.) in which about 3.5 to 5% by mass of carbon black as a light-shielding pigment is dispersed in an aqueous solution of about 3.5% by mass polyvinyl alcohol as a water-soluble polymer ) Used as a light-shielding ink and sprayed from the inkjet head 100 and applied.

  The second ink jet head used for applying the light shielding material may be an on-demand system or a continuous system. In addition, as a discharge method, an electro-mechanical conversion method (for example, a single cavity type, a double cavity type, a bender type, a piston type, a shear mode type, a shared wall type, etc.), an electro-thermal conversion method (for example, thermal ink jet) Any ejection method such as a mold, a bubble jet (registered trademark) mold, or the like may be used.

  Among these, it is preferable to perform pattern printing of light-shielding ink on the photosensitive material with a piezo ink jet recording head having a nozzle diameter of 30 μm or less. Since printing of the light-shielding ink requires accuracy, it is preferable to print at a printing speed of 20 ppm or more using a piezo-type ink jet recording head having a nozzle diameter of 30 μm or less.

  As a printing method of the inkjet printer, printing may be performed using a line head type recording head with respect to a shuttle head type recording head.

  The exposure process is a process in which the photosensitive material on which the light-shielding ink pattern is formed is exposed to at least a region where the light-shielding ink is applied in the exposure zone. The exposure may be performed on the entire surface from the light-shielding ink pattern side, and can be continuously performed along with the conveyance of the photosensitive material web. The exposure intensity is adjusted according to the sensitivity of the photosensitive material and the conveying speed of the photosensitive material so that the photosensitive material web can be exposed uniformly and continuously with a sufficient exposure amount determined by the sensitivity of the photosensitive material. Further, a method of intermittently exposing only a region where the light-shielding ink pattern is formed, that is, discontinuous whole surface exposure for a predetermined area having the light-shielding ink pattern may be used.

  Various light sources such as a tungsten lamp, a fluorescent lamp, and a mercury lamp are used as the light source. A surface light source may be used. The exposure is not necessarily white, and a light source that matches the spectral sensitivity of the photosensitive material may be used.

  In the case of producing an electromagnetic shielding material from a photosensitive material using photosensitive silver salt fine particles, conventionally, patterning by exposure is performed using a masking member or the like, but in the roll-to-roll manufacturing method, the masking member is exposed one by one. According to the present invention, this is easy and preferable because of uniform front exposure.

  The method using a masking member has to reduce the production speed in roll-to-roll, which is slightly inferior, and the production cost is also somewhat bad. The method of forming a light-shielding ink pattern by the ink jet method according to the present invention can continuously form a light-shielding pattern and continuously perform development processing. Also, the photosensitive metal salt used, the light-shielding ink, etc. This material is advantageous in terms of manufacturing cost.

  On the other hand, even if exposure is performed continuously with a laser, it is thought that a speed that is not so different can be obtained, but the method of continuous scanning exposure with laser is expensive in terms of manufacturing equipment costs such as exposure apparatus control and maintenance. It will take.

  Subsequent to the exposure step, a development step (development process) is carried out, whereby silver development, fixing of the silver image, and removal of the light-shielding ink are carried out to form a metal silver pattern.

(Development processing)
In the present invention, development processing is performed after the silver salt fine particle-containing layer is exposed. The development processing can be performed by a normal development processing technique used for silver salt photographic film, photographic paper, printing plate-making film, photomask emulsion mask, and the like. The developer is not particularly limited, but PQ developer, MQ developer, MAA developer and the like can also be used. For example, C-41, E-6, RA-4, D-19, manufactured by KODAK, A developer such as D-72, or a developer included in a kit thereof, or a lith developer such as D-85 can be used.

  In the present invention, by performing the above exposure and development treatment, a metallic silver portion, preferably a patterned metallic silver portion is formed, and a light transmissive portion described later is formed.

  The development processing in the present invention can include a fixing processing performed for the purpose of removing and stabilizing the unexposed and undeveloped silver salt. For the fixing process in the present invention, a fixing process technique used for a silver salt photographic film, photographic paper, a printing plate-making film, a photomask emulsion mask or the like can be used.

  The developer used in the development process can contain an image quality improver for the purpose of improving the image quality. Examples of the image quality improver include nitrogen-containing heterocyclic compounds such as benzotriazole. In addition, it is also preferable to use polyethylene glycol, particularly when a lith developer is used.

  The mass of metallic silver contained in the exposed portion (developed portion) after the development treatment is preferably 50% by mass or more based on the mass of silver contained before the exposure, and is 80% by mass. More preferably, it is the above. If the mass of silver contained in the exposed portion is 50% by mass or more based on the mass of silver contained in the exposed portion before exposure, it is preferable because high conductivity can be obtained.

  The gradation after development processing in the present invention is not particularly limited, but is preferably more than 4.0. When the gradation after the development processing exceeds 4.0, the conductivity of the conductive metal portion can be increased while keeping the transparency of the light transmissive portion high. Examples of means for setting the gradation to 4.0 or higher include the aforementioned doping of rhodium ions and iridium ions.

  Further, the silver halide that has not been converted into a metal image is removed by a photographic fixing process included in the development process.

  For example, the developer is developed with a CDH-100 developer at 25 ° C. (manufactured by Konica Minolta) for 60 seconds, then treated with a CFL871 fixer (manufactured by Konica Minolta) for 3 minutes, and then washed with warm pure water at 40 ° C. for 5 minutes. Development processing can be performed.

  Further, during these development processing steps, the water-soluble light-shielding ink is removed by dissolution, peeling or the like by a developer, a fixing solution, water washing or the like. It is preferable that water-soluble ink exudes into the developer and most of the ink is removed. However, it is not necessary to remove all of the ink in the developer, and at least a part of the ink is removed in the developer. It is preferable to remove all during the development process.

  After these development treatments, the film web is further dried to obtain the electromagnetic wave shielding material according to the present invention having a developed silver pattern on the substrate film.

  Through the above steps, the silver salt fine particle coating, masking, exposure, and development processing steps can be performed by continuous conveyance. Production of roll-to-roll of electromagnetic shielding material becomes possible.

  In the method for producing an electromagnetic wave shielding material of the present invention, a conductivity imparting step for increasing the conductivity of metallic silver is further provided after the development step. Specifically, the conductivity imparting step includes physical development and / or plating, whereby the conductive metal particles are supported on the metal silver portion.

(Conductivity imparted)
In the present invention, physical development and / or plating treatment is performed on the metal silver portion for the purpose of supporting the conductive metal particles on the metal silver portion formed by the exposure and development processing and further imparting conductivity. In the present invention, it is possible to support the conductive metal particles on the metallic part only by physical development or plating treatment, but it is also possible to support the conductive metal particles on the metallic silver part by combining physical development and plating treatment. it can.

  In the present invention, “physical development” means that metal ions such as silver ions are reduced with a reducing agent on metal or metal compound nuclei to deposit metal particles. This physical phenomenon is used for instant B & W film, instant slide film, printing plate manufacturing, and the like, and the technology can be used in the present invention.

  Further, the physical development may be performed simultaneously with the development processing after exposure or separately after the development processing.

  In the present invention, the plating treatment can be performed using electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or both electroless plating and electrolytic plating.

  For the electroless plating in the present invention, a known electroless plating technique can be used. For example, an electroless plating technique used for a printed wiring board can be used, and the electroless plating is an electroless copper plating. Preferably there is.

  Chemical species contained in the electroless copper plating solution include copper sulfate and copper chloride, formalin and glyoxylic acid as the reducing agent, EDTA and triethanolamine as the copper ligand, and other bath stabilization and plating film Examples of the additive for improving the smoothness include polyethylene glycol, yellow blood salt, and bipyridine. Examples of the electrolytic copper plating bath include a copper sulfate bath and a copper pyrophosphate bath.

  The plating speed at the time of plating in the present invention can be performed under moderate conditions, and high-speed plating of 5 μm / hr or more is also possible. In the plating treatment, various additives such as a ligand such as EDTA can be used from the viewpoint of improving the stability of the plating solution.

  For example, as a plating solution, copper sulfate 0.06 mol / L, formalin 0.22 mol / L, triethanolamine 0.12 mol / L, and polyethylene glycol 100 ppm, yellow blood salt 50 ppm, α, α′-bipyridine 20 ppm As an example, an electroless Cu plating solution having a pH of 12.5 and containing, for example, after performing an electroless copper plating process at 45 ° C. using the plating solution, about 10 ppm of Fe ( III) Oxidation is performed with an aqueous solution containing ions.

  As the conductive metal particles supported on the metal part, in addition to the above-described silver (in the case of physical development), copper, aluminum, nickel, iron, gold, cobalt, tin, stainless steel, tungsten, chromium, titanium, palladium, platinum And particles of metals such as manganese, zinc, rhodium, or alloys obtained by combining these metals. From the viewpoint of conductivity, cost, etc., the conductive metal particles are preferably copper, aluminum or nickel particles. Moreover, when providing magnetic field shielding properties, it is preferable to use paramagnetic metal particles as the conductive metal particles.

  In the conductive metal part, from the viewpoint of increasing the contrast and preventing the conductive metal part from being oxidized and discolored over time, the conductive metal part contained in the conductive metal part is a copper particle. It is preferable.

(Oxidation treatment)
In the present invention, oxidation treatment is preferably performed on the metallic silver portion after the development treatment and the conductive metal portion formed after the physical development and / or plating treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light transmissive portion, the metal can be removed and the light transmissive portion can be made almost 100% transparent.

  Examples of the oxidation treatment include known methods using various oxidizing agents such as Fe (III) ion treatment. The oxidation treatment can be performed after exposure and development processing of the silver salt-containing layer, or after physical development or plating treatment, and may be performed after development processing and after physical development or plating treatment.

  In the present invention, the metallic silver portion after the exposure and development treatment can be further treated with a solution containing Pd. Pd may be a divalent palladium ion or metallic palladium. This treatment can accelerate electroless plating or physical development speed.

  The conductive metal part preferably contains 50% by mass or more, and more preferably 60% by mass or more of silver with respect to the total mass of the metal contained in the conductive metal part. When silver is contained in an amount of 50% by mass or more, the time required for physical development and / or plating can be shortened, productivity can be improved, and cost can be reduced.

  Furthermore, when copper and palladium are used as the conductive metal particles forming the conductive metal part, the total mass of silver, copper and palladium is 80% by mass or more based on the total mass of the metal contained in the conductive metal part. It is preferable that it is 90 mass% or more.

Since the conductive metal portion in the present invention carries conductive metal particles, good conductivity can be obtained. For this reason, the surface resistance value of the translucent electromagnetic wave shielding film (conductive metal portion) of the present invention is preferably 10 ³ Ω / sq or less, more preferably 10 ² Ω / sq or less,
More preferably, it is 10 Ω / sq or less, and most preferably 0.1 Ω / sq or less.

  When the conductive metal portion of the present invention is used as a light-transmitting electromagnetic wave shielding material, a triangle such as an equilateral triangle, an isosceles triangle, a right triangle, a square, a rectangle, a rhombus, a parallelogram, a quadrangle such as a trapezoid, More preferably, it is a mesh shape composed of geometric figures combining (positive) hexagons, (positive) n-gons such as (positive) octagons, circles, ellipses, and stars. From the viewpoint of EMI shielding properties, the triangular shape is the most effective, but from the viewpoint of visible light transmittance, if the same line width is used, the larger the (positive) n-gonal n number, the higher the aperture ratio and the visible light transmittance. This is advantageous because it becomes larger.

  In the use of the translucent electromagnetic wave shielding material, the conductive metal portion preferably has a line width of 20 μm or less and a line interval of 50 μm or more. The conductive metal portion may have a portion whose line width is wider than 20 μm for the purpose of ground connection or the like. Further, from the viewpoint of making the image inconspicuous, the line width of the conductive metal part is preferably less than 18 μm, more preferably less than 15 μm, further preferably less than 14 μm, and less than 10 μm. Is most preferred.

  The conductive metal portion in the present invention has an aperture ratio of preferably 85% or more, more preferably 90% or more, and most preferably 95% or more from the viewpoint of visible light transmittance. The aperture ratio is the ratio of the portion without fine lines forming the mesh to the whole. For example, the aperture ratio of a square lattice mesh with a line width of 10 μm and a pitch of 300 μm is 93%.

(Light transmissive part)
The “light transmitting part” in the present invention means a part having transparency other than the conductive metal part in the light transmitting electromagnetic wave shielding film. As described above, the transmittance of the light-transmitting portion is 90% or more, preferably 95, as shown by the minimum transmittance in the wavelength range of 380 to 780 nm excluding the contribution of light absorption and reflection of the support. % Or more, more preferably 97% or more, even more preferably 98% or more, and most preferably 99% or more.

(Layer structure of electromagnetic shielding material)
The thickness of the support in the electromagnetic wave shielding material of the present invention is preferably 5 to 200 μm, and more preferably 30 to 150 μm. If it is the range of 5-200 micrometers, the transmittance | permeability of a desired visible light will be obtained and handling will also be easy.

  The thickness of the metallic silver portion provided on the support before physical development and / or plating can be appropriately determined according to the coating thickness of the photosensitive silver salt layer coating applied on the support. The thickness of the metallic silver part is preferably 30 μm or less, more preferably 20 μm or less, further preferably 0.01 to 9 μm, and most preferably 0.05 to 5 μm. Moreover, it is preferable that a metal silver part is pattern shape.

  The thickness of the conductive metal portion is preferable for use as an electromagnetic shielding material for a display because the viewing angle of the display is increased as the thickness is reduced. Furthermore, as a use of the conductive wiring material, a thin film is required because of a demand for high density. From such a viewpoint, the thickness of the layer made of the conductive metal carried on the conductive metal part is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and more preferably 0.1 μm or more. More preferably, it is less than 3 μm.

  In the method for producing an electromagnetic wave shielding material of the present invention, an additional step may be provided after the physical development treatment and / or plating treatment, and a near-infrared absorbing layer, an adhesive layer, an antireflection layer, and the like may be provided.

  These layers can also be provided by applying a coating solution for forming these layers on the web in succession following development, plating and the like.

  For coating, the same coater as that used in the photosensitive material can be used. Also, a method such as ink jet or printing may be used.

  The near-infrared shielding layer is, for example, various organic or complex compounds having absorption in the range of 850 to 1250 nm in order to obtain the ability to sufficiently absorb near infrared rays in a wide wavelength range of near infrared such as 850 to 1250 nm. Examples thereof include a coating layer having a thickness of 0.5 to 30 μm in which a system dye is dissolved in a resin (for example, a polyester resin, an acrylic resin, an ethylene-vinyl acetate copolymer resin, or the like).

  Further, an adhesive layer can be further formed on the outermost surface for use as a front plate for PDP. As the pressure-sensitive adhesive (pressure sensitive adhesive), a thermoplastic elastomer such as acrylic, SBS, SEBS or the like is preferably used. To these pressure-sensitive adhesives, tackifiers, ultraviolet absorbers, colored pigments, colored dyes, anti-aging agents, adhesion-imparting agents, and the like can be appropriately added. The thickness of the pressure-sensitive adhesive layer 8 is preferably about 10 to 1000 μm. Further, an appropriate release paper (film) can be attached to the adhesive layer 8.

The antireflection layer is preferably on the outermost surface, and in the case of the electromagnetic wave shielding material of the present invention, it is preferably coated on the side opposite to the side having the conductive silver pattern.
(1) A single layer of a transparent film having a lower refractive index than the constituent material of the panel to which the electromagnetic wave shielding light-transmitting laminated film is attached. (2) Total of one high refractive index transparent film and one low refractive index transparent film. Laminated in two layers (3) Laminated high-refractive-index transparent film and low-refractive-index transparent film alternately in total 4 layers (4) Medium refractive index transparent film / High refractive index transparent film / Low refractive index 1 layer in the order of the transparent film, laminated in a total of 3 layers (5) 3 layers alternately in the order of high refractive index transparent film / low refractive index transparent film, 6 layers in total, etc. Can be mentioned.

  For example, an antireflection layer in which, for example, a low refractive index silicon oxide layer is coated on a hard coat layer formed from a hard coat composition containing dipentaerythritol hexaacrylate or the like can be mentioned.

  FIG. 6 schematically shows a cross-sectional view of an example of a PDP-like front plate using an electromagnetic wave shielding material according to the manufacturing method of the present invention. A metallic silver pattern layer 2, a near-infrared shielding layer 3, an adhesive layer 4, and a release paper 5 are bonded onto the base film 1, and an antireflection layer 6 is formed on the back surface.

  The antireflection layer, near-infrared shielding layer, and the like are separately coated on a film substrate, and the antireflection film or filter is bonded to the electromagnetic wave shielding material according to the present invention as a multilayer film. For example, you may use for the front plate for PDP. In this case, on the transparent base film (thickness is about 25 to 250 μm, for example), an antireflection layer comprising the following single layer film (1), a laminated film of a high refractive index transparent film and a low refractive index transparent film, What is necessary is just to apply and use the layer containing the material which has the said near-infrared absorptivity. Also about these base film, a transparent film is preferable and resin films, such as PET (polyethylene terephthalate), PC (polycarbonate), a cellulose ester (triacetylcellulose), PMMA (polymethylmethacrylate), are mentioned.

  Moreover, when laminating a film, the adhesive resin is preferably a transparent and elastic material, for example, one that is usually used as an adhesive for laminated glass. Specifically, the thickness of an ethylene-vinyl acetate copolymer, an ethylene-methyl acrylate copolymer, or the like is preferably about 10 to 1000 μm, for example.

  The manufacturing method of the electromagnetic wave shielding material according to the present invention necessary for the plasma display panel (PDP) has been described above. After the silver salt is applied on the film in a pattern, the pattern is formed so that the conductive pattern is exposed. By applying a light-shielding ink by inkjet and further developing, an electromagnetic wave shielding material having a developed silver pattern on a substrate film can be produced on a roll-to-roll basis. Thus, an electromagnetic wave shielding PDP front plate can be easily obtained. Although only the production of the electromagnetic wave shielding mesh pattern has been described, the frequency selective electromagnetic wave shielding material can be similarly obtained by similarly printing the antenna element pattern with the light shielding ink.

It is a figure which shows some examples of the electromagnetic wave reflective surface which has an antenna element pattern. It is a figure which shows the outline process of the manufacturing method of the electromagnetic wave shielding material of this invention. It is a figure which shows the schematic diagram of application | coating of photosensitive silver salt fine particle, application | coating of light-shielding ink, and the electromagnetic wave shielding pattern formed. It is a figure which shows the preparation example of a metal mesh pattern. It is a figure which shows an example of the specific aspect of the formation process of electromagnetic wave shielding material. It is a figure which shows typically an example of the PDP-like front board using the electromagnetic wave shielding material by the manufacturing method of this invention with sectional drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base film 2 Metal silver pattern layer 3 Near-infrared shielding layer 4 Adhesive layer 5 Release paper 6 Antireflection layer 10 1st inkjet head 100 2nd inkjet head

Claims (10)

A method for producing an electromagnetic wave shielding material having a predetermined metal pattern on a support, the step of applying a coating solution containing photosensitive metal salt fine particles on the support in a substantially metal pattern, the photosensitive Step of applying a light-shielding liquid to a region other than the region where the metal pattern is formed, a drying step, and at least photosensitive metal salt particles are applied so that only the region where the metal pattern is formed is exposed. A step of exposing the region, a step of forming a metal pattern on the support by development processing, and a step of increasing the conductivity of the metal pattern formed by development by physical development and / or plating treatment. A method for producing an electromagnetic wave shielding material. The method for producing an electromagnetic wave shielding material according to claim 1, wherein the step of applying the coating liquid containing photosensitive metal salt fine particles in a substantially metal pattern is performed by an ink jet method. The method for producing an electromagnetic wave shielding material according to claim 1, wherein the step of applying the light shielding liquid is performed by an ink jet method. 4. The production of the electromagnetic wave shielding material according to claim 1, further comprising a drying step after the step of applying the coating liquid containing the photosensitive metal salt fine particles in a substantially metal pattern. 5. Method. The electromagnetic wave shielding according to any one of claims 1 to 4, wherein the coating amount of the coating liquid containing the photosensitive metal salt fine particles is 0.1 to 5 g / m ² in terms of metal. Material manufacturing method. The method for producing an electromagnetic wave shielding material according to claim 1, wherein the photosensitive metal salt fine particles are silver halide fine particles. The method for producing an electromagnetic wave shielding material according to any one of claims 1 to 6, wherein the coating liquid containing the photosensitive metal salt fine particles contains a binder. The said support body is a transparent support body which has an antihalation layer, The manufacturing method of the electromagnetic wave shielding material of any one of Claims 1-7 characterized by the above-mentioned. The method for producing an electromagnetic wave shielding material according to any one of claims 1 to 8, wherein the plating treatment includes an electroless plating treatment and a subsequent electrolytic plating treatment. An apparatus for manufacturing an electromagnetic wave shielding material having a predetermined metal pattern on a support, wherein a coating liquid containing photosensitive metal salt fine particles is applied on the support in a substantially metal pattern. A light-shielding liquid is applied to a region where the metal pattern is formed so that only a region where the metal pattern is formed is exposed among the coated portion of the photosensitive metal salt fine particle having an inkjet head and the region where the photosensitive metal salt fine particle is coated. An electromagnetic shielding material comprising at least a coating part of a light-shielding liquid having a second inkjet head to be applied, a drying part, an exposure part, a development part, a physical development process and / or a plating part apparatus.

Images