JP2008270531A5 - - Google Patents

Download PDF

Info

Publication number
JP2008270531A5
JP2008270531A5 JP2007111642A JP2007111642A JP2008270531A5 JP 2008270531 A5 JP2008270531 A5 JP 2008270531A5 JP 2007111642 A JP2007111642 A JP 2007111642A JP 2007111642 A JP2007111642 A JP 2007111642A JP 2008270531 A5 JP2008270531 A5 JP 2008270531A5
Authority
JP
Japan
Prior art keywords
via pad
pad
forming
wiring board
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007111642A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008270531A (ja
JP5005416B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007111642A priority Critical patent/JP5005416B2/ja
Priority claimed from JP2007111642A external-priority patent/JP5005416B2/ja
Publication of JP2008270531A publication Critical patent/JP2008270531A/ja
Publication of JP2008270531A5 publication Critical patent/JP2008270531A5/ja
Application granted granted Critical
Publication of JP5005416B2 publication Critical patent/JP5005416B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007111642A 2007-04-20 2007-04-20 多層配線基板及びその製造方法 Active JP5005416B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007111642A JP5005416B2 (ja) 2007-04-20 2007-04-20 多層配線基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007111642A JP5005416B2 (ja) 2007-04-20 2007-04-20 多層配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2008270531A JP2008270531A (ja) 2008-11-06
JP2008270531A5 true JP2008270531A5 (sr) 2010-03-04
JP5005416B2 JP5005416B2 (ja) 2012-08-22

Family

ID=40049643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007111642A Active JP5005416B2 (ja) 2007-04-20 2007-04-20 多層配線基板及びその製造方法

Country Status (1)

Country Link
JP (1) JP5005416B2 (sr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5383348B2 (ja) * 2009-06-29 2014-01-08 京セラ株式会社 電気配線基板および光モジュール
KR20110036149A (ko) * 2009-10-01 2011-04-07 삼성전기주식회사 다층 세라믹 기판 및 그 제조 방법
KR101412225B1 (ko) 2012-08-10 2014-06-25 이비덴 가부시키가이샤 배선판 및 그 제조 방법
JP6020645B2 (ja) * 2015-04-22 2016-11-02 Tdk株式会社 電子部品
KR102671972B1 (ko) 2018-12-04 2024-06-05 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR20200067453A (ko) 2018-12-04 2020-06-12 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP7449660B2 (ja) * 2019-09-06 2024-03-14 株式会社村田製作所 インダクタ部品
JP7112438B2 (ja) * 2020-02-07 2022-08-03 積水化学工業株式会社 硬化体、ｂステージフィルム及び多層プリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3854160B2 (ja) * 2002-01-23 2006-12-06 京セラ株式会社 多層配線基板
JP2005101377A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 多層配線基板
JP4445777B2 (ja) * 2004-02-27 2010-04-07 日本特殊陶業株式会社 配線基板、及び配線基板の製造方法
WO2006101134A1 (ja) * 2005-03-24 2006-09-28 Ibiden Co., Ltd. 多層プリント配線板

Similar Documents

Publication Publication Date Title
JP2008270531A5 (sr)
JP2012146793A5 (sr)
TWI521618B (zh) 配線基板及其製造方法
JP2009164481A5 (sr)
JP2010165855A5 (sr)
JP2013004881A5 (sr)
JP2009267310A5 (sr)
JP2011071315A5 (sr)
JP2012019080A5 (sr)
WO2008087578A3 (en) A system-in-package with through substrate via holes
JP2013219191A5 (sr)
JP2015191968A5 (ja) 配線基板及びその製造方法
JP2014056925A5 (sr)
JP2008277742A5 (sr)
JP2013062474A5 (ja) 配線基板及び配線基板の製造方法と半導体装置及び半導体装置の製造方法
JP2011258772A5 (sr)
JP2010141204A5 (sr)
JP2009070965A5 (sr)
JP2009194322A5 (sr)
JP5005416B2 (ja) 多層配線基板及びその製造方法
JP2014154800A5 (sr)
JP2013026625A5 (sr)
JP2008028361A5 (sr)
JP2013118255A5 (sr)
JP2015070007A5 (sr)