JP2008270361A - Wire composite printed-wiring board, its manufacturing method, wire part, manufacturing method for wire part and electronic equipment - Google Patents

Wire composite printed-wiring board, its manufacturing method, wire part, manufacturing method for wire part and electronic equipment Download PDF

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JP2008270361A
JP2008270361A JP2007108472A JP2007108472A JP2008270361A JP 2008270361 A JP2008270361 A JP 2008270361A JP 2007108472 A JP2007108472 A JP 2007108472A JP 2007108472 A JP2007108472 A JP 2007108472A JP 2008270361 A JP2008270361 A JP 2008270361A
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electric wire
conductor
layer pattern
conductor layer
wiring board
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Hitoshi Kashio
仁司 樫尾
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Sharp Corp
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Sharp Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a wire composite printed-wiring board enabling a free configuration and having a high reliability on a connection between a conductor and a first conductor layer, a manufacturing method for the wire composite printed-wiring board, a wire part, a manufacturing method for the wire part and electronic equipment loading such a wire composite printed-wiring board. <P>SOLUTION: A resin sealing section 39 resin-sealing the end section of the wire part 30 with the conductor and a first wiring board are juxtaposed, and a second wiring board with a second insulating base material 21 and a second conductor-layer pattern 22p is laminated on the resin sealing section 39 and the first wiring board. An extended terminal 32 for the conductor with an extended board section 32f for the conductor opposed to first conductor-layer patterns 12p extended from the resin sealing section 39 is connected to a conductor, and the extended board section 32f for the conductor is connected to the first conductor-layer patterns 12p through a conductive hole conductor formed to the interlayer conductive hole of the second insulating base material 21 passing through the connecting hole 32h of the extended board section 32f for the conductor and reaching the first conductor-layer patterns 12p. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、樹脂封止部から延長され配線基板の配線パターンに導通孔導体を介して接続される端子を有する電線部品を備える電線複合プリント配線基板、このような電線複合プリント配線基板を製造する電線複合プリント配線基板製造方法、このような電線複合プリント配線基板に適用する電線部品、このような電線部品を製造する電線部品製造方法、および、このような電線複合プリント配線基板を搭載した電子機器に関する。   The present invention manufactures an electric wire composite printed wiring board including an electric wire component having terminals extended from a resin sealing portion and connected to a wiring pattern of the wiring board via a conduction hole conductor, and such an electric wire composite printed wiring board. Electric wire composite printed wiring board manufacturing method, electric wire component applied to such electric wire composite printed wiring board, electric wire component manufacturing method for manufacturing such electric wire part, and electronic device equipped with such electric wire composite printed wiring board About.

携帯電話などの小型軽量で高周波の無線信号に対応する電子機器では、小型軽量化、高密度実装を進めるためにプリント基板相互間を立体的に配線し、電磁遮蔽および高周波対応が可能な電線部品の適用が増加している。   In electronic devices that support high-frequency wireless signals such as mobile phones, wire components that can be electromagnetically shielded and compatible with high frequency by wiring three-dimensionally between printed circuit boards in order to reduce size and weight and achieve high-density mounting. The application of has increased.

従来、プリント基板とプリント基板との接続には、コネクタ付電線、コネクタ付同軸電線、コネクタ付フレキシブル基板などコネクタを有する電線部品を適用していた。また、コネクタを適用しないものとして、フレキシブル基板とリジッド基板を複合したフレキシブルリジッド多層プリント配線板を用いていた。   Conventionally, an electric wire component having a connector such as an electric wire with a connector, a coaxial electric wire with a connector, or a flexible substrate with a connector has been applied to the connection between the printed board and the printed board. In addition, as a device to which a connector is not applied, a flexible rigid multilayer printed wiring board in which a flexible substrate and a rigid substrate are combined is used.

図21は、従来例1に係るフレキシブルリジッド多層プリント配線板の説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。なお、断面でのハッチングは図面の見易さを考慮して省略する。   FIG. 21 is an explanatory view of a flexible rigid multilayer printed wiring board according to Conventional Example 1, (A) is a plan view, and (B) is an end view showing an end face of a cross section taken along arrows BB of (A). It is. It should be noted that hatching in the cross section is omitted in view of easy viewing of the drawing.

4層構造として製造された従来例1に係るフレキシブルリジッド多層プリント配線板101は、概略次のような工程で製造される。   The flexible rigid multilayer printed wiring board 101 according to Conventional Example 1 manufactured as a four-layer structure is manufactured generally by the following process.

まず、内層基板としての両面フレキシブル基板(第1絶縁基材110および第1導体層115)を準備し内層パターン(第1導体層パターン115p)を形成する。つまり、第1絶縁基材110に第1導体層パターン115pを形成する。なお、第1導体層パターン115pはフレキシブル領域Afでは、フレキシブルリードパターン115pfとして構成される。   First, a double-sided flexible substrate (first insulating base 110 and first conductor layer 115) as an inner layer substrate is prepared, and an inner layer pattern (first conductor layer pattern 115p) is formed. That is, the first conductor layer pattern 115p is formed on the first insulating base 110. The first conductor layer pattern 115p is configured as a flexible lead pattern 115pf in the flexible region Af.

次に、第1導体層パターン115pの表面にフィルムカバーレイを圧着する。つまり、保護絶縁膜(フィルムカバーレイ)130(保護フィルム131および保護接着剤132)を形成する。   Next, a film coverlay is pressure-bonded to the surface of the first conductor layer pattern 115p. That is, the protective insulating film (film cover lay) 130 (the protective film 131 and the protective adhesive 132) is formed.

さらに、外層基板としてフレキシブル領域Afに対応する部分を除去した樹脂付き銅箔を準備し、内層基板と外層基板を積層プレスして積層(接着)する。つまり、第2絶縁基材140、第2導体層141を積層、形成する。   Further, a copper foil with resin from which a portion corresponding to the flexible region Af is removed as an outer layer substrate is prepared, and the inner layer substrate and the outer layer substrate are laminated and laminated (adhered). That is, the second insulating base 140 and the second conductor layer 141 are stacked and formed.

なお、樹脂付き銅箔の代わりに外層基板としてフレキシブル領域Afに対応する部分を除去した片面リジッド基板を準備する場合もある。このときは、片面リジッド基板に対応させた接着部材を準備し、片面リジッド基板、接着部材、両面フレキシブル基板、接着部材、片面リジッド基板の順に重畳して積層プレスして積層する。   In some cases, a single-sided rigid board from which a portion corresponding to the flexible region Af is removed as an outer layer board instead of the resin-coated copper foil may be prepared. At this time, an adhesive member corresponding to the single-sided rigid substrate is prepared, and the single-sided rigid substrate, the adhesive member, the double-sided flexible substrate, the adhesive member, and the single-sided rigid substrate are superposed in order and stacked and stacked.

第2絶縁基材140、第2導体層141を形成した後、第2導体層141と第1導体層パターン115pを導通する導通孔143を開口する。その後、全体に銅メッキして導通孔導体144を形成し、第2導体層141と第1導体層パターン115pを接続する。   After the second insulating substrate 140 and the second conductor layer 141 are formed, a conduction hole 143 that conducts the second conductor layer 141 and the first conductor layer pattern 115p is opened. Thereafter, the whole is plated with copper to form a conductive hole conductor 144, and the second conductor layer 141 and the first conductor layer pattern 115p are connected.

次に、導通孔導体144および第2導体層141をパターニングして外層パターンを形成する。つまり、第2導体層パターン145を形成する。さらに、ソルダーレジスト150を形成し、適宜の表面処理を施す。   Next, the conduction hole conductor 144 and the second conductor layer 141 are patterned to form an outer layer pattern. That is, the second conductor layer pattern 145 is formed. Further, a solder resist 150 is formed and an appropriate surface treatment is performed.

その後、フレキシブル領域Afの外形、およびリジッド領域Arの外形を形成する。   Thereafter, the outer shape of the flexible region Af and the outer shape of the rigid region Ar are formed.

外形を完成したフレキシブルリジッド多層プリント配線板101の検査を実施する。   Inspection of the flexible rigid multilayer printed wiring board 101 whose outer shape is completed is performed.

上述したとおり、従来例1に係るフレキシブルリジッド多層プリント配線板101は、内層基板として全面にフレキシブル基板を適用していた。   As described above, the flexible rigid multilayer printed wiring board 101 according to Conventional Example 1 uses a flexible substrate as the entire inner substrate.

フレキシブルリジッド多層プリント配線板101のリジッド領域Arには、多くの部品が実装される。つまり、回路配線(第2導体層パターン145)、導通孔143などが多く、高い平滑精度(例えば表面凹凸)、高い接続性能(例えば導通孔内壁の荒さ制限。一般的に導通孔内壁の凹凸が小さいほど温度衝撃による導通孔導体の金属疲労が小さく信頼性が高くなる。)などが要求される。また、高い電気性能(例えば導通抵抗、絶縁抵抗)、高い耐熱性能(例えば半田溶融耐熱)なども要求される。   Many components are mounted in the rigid region Ar of the flexible rigid multilayer printed wiring board 101. That is, there are many circuit wirings (second conductor layer pattern 145), conduction holes 143, etc., high smoothing accuracy (for example, surface unevenness), high connection performance (for example, roughness of the inner wall of the conduction hole. The smaller the value, the smaller the metal fatigue of the through hole conductor due to temperature shock and the higher the reliability. Further, high electrical performance (for example, conduction resistance, insulation resistance), high heat resistance (for example, solder melting heat resistance), and the like are also required.

つまり、リジッド領域Arでは、導体は一定の厚さがある材料であり、絶縁体は一定の硬さ、一定の絶縁性がある材料であること、また、均質な材料であることが好ましい。したがって、一般的にはガラス繊維入りエポキシ樹脂が多く使われる。   That is, in the rigid region Ar, the conductor is preferably a material having a certain thickness, and the insulator is preferably a material having a certain hardness and a certain insulating property, and is preferably a homogeneous material. Therefore, in general, an epoxy resin containing glass fiber is often used.

また、フレキシブルリジッド多層プリント配線板101のフレキシブル領域Afは、リード線として機能する回路配線(フレキシブルリードパターン115pf)が多く、高い屈曲性能(例えば組み立て曲げ、開閉屈曲)などが要求される。   Further, the flexible region Af of the flexible rigid multilayer printed wiring board 101 has many circuit wirings (flexible lead patterns 115pf) functioning as lead wires, and high bending performance (for example, assembly bending, open / close bending) is required.

つまり、フレキシブル領域Afでは、導体は一定の薄さに加工することが可能で一定の柔軟性がある材料であること、絶縁体は一定の柔軟性がある材料であることが好ましい。したがって、一般的には可撓性と絶縁性に優れたポリイミド樹脂フィルムが多く使われる。   That is, in the flexible region Af, it is preferable that the conductor is a material that can be processed to a certain thickness and has a certain flexibility, and the insulator is a material that has a certain flexibility. Therefore, in general, a polyimide resin film excellent in flexibility and insulation is often used.

しかしながら、従来例1に係るフレキシブルリジッド多層プリント配線板101は、内層基板として全面にフレキシブル基板を使用することから、リジッド領域Arでは、絶縁体がリジッド絶縁基材(第2絶縁基材140)とフレキシブル絶縁基材(第1絶縁基材110)の複合材料として形成されるので積層加工が難しいという問題がある。   However, since the flexible rigid multilayer printed wiring board 101 according to Conventional Example 1 uses a flexible substrate as an inner layer substrate, the insulator is a rigid insulating base (second insulating base 140) in the rigid region Ar. Since it is formed as a composite material of a flexible insulating base material (first insulating base material 110), there is a problem that lamination processing is difficult.

また、リジッド領域Arが複合材料で形成されることから、導通孔143の開口が難しく、導通孔導体を形成するためのメッキが難しいという問題がある。リジッド領域Arにフレキシブル絶縁基材(例えばポリイミド樹脂フィルム)が含まれることから、吸湿性が高く、耐熱性能が劣るという問題がある。   Further, since the rigid region Ar is formed of a composite material, there is a problem that it is difficult to open the conduction hole 143 and plating for forming the conduction hole conductor is difficult. Since a rigid insulating base (for example, a polyimide resin film) is included in the rigid region Ar, there is a problem that the hygroscopic property is high and the heat resistance performance is inferior.

さらに、リジッド領域Arの導体(第2導体層141)とフレキシブル領域Afの導体(第1導体層115)の厚さの調整が難しく、また、リジッド領域Arの導体とフレキシブル領域Afの導体の材質を最適化することが困難であるという問題がある。   Further, it is difficult to adjust the thickness of the conductor (second conductor layer 141) in the rigid region Ar and the conductor (first conductor layer 115) in the flexible region Af, and the material of the conductor in the rigid region Ar and the conductor in the flexible region Af is difficult. There is a problem that it is difficult to optimize.

つまり、フレキシブル領域Afおよびリジッド領域Arそれぞれに要求される積層構造特性(リジッド領域での硬質性、フレキシブル領域での可撓性、積層構造の加工容易性および信頼性、導体層特性、リジッド領域とフレキシブル領域の相互間の結合強度など)を満たすことが困難であるという問題がある。   In other words, the laminated structure characteristics required for each of the flexible region Af and the rigid region Ar (rigidity in the rigid region, flexibility in the flexible region, processability and reliability of the laminated structure, conductor layer properties, rigid region and There is a problem that it is difficult to satisfy the bonding strength between the flexible regions.

なお、リジッド領域とフレキシブル領域に異なる絶縁基材を適用する技術が提案されている(例えば特許文献1参照。)。   In addition, the technique which applies a different insulating base material to a rigid area | region and a flexible area | region is proposed (for example, refer patent document 1).

しかし、特許文献1に記載の技術では、内層パターン(第1層導体パターン)をリジッド領域とフレキシブル領域で個別に形成することから、内層パターンを高精度に位置合わせすることが困難であり微細化、高密度化が困難であるという問題がある。また、フレキシブル基板を利用することから、インピーダンス整合が困難であり、シールド層を設けると基板が硬くなって折り曲げが困難になり、屈曲性能が低下するという問題がある。   However, in the technique described in Patent Document 1, since the inner layer pattern (first layer conductor pattern) is formed separately in the rigid region and the flexible region, it is difficult to align the inner layer pattern with high accuracy and miniaturization. There is a problem that it is difficult to increase the density. In addition, since a flexible substrate is used, impedance matching is difficult, and if a shield layer is provided, there is a problem that the substrate becomes hard and bending becomes difficult, and bending performance is lowered.

次に、図22ないし図24に基づいて従来の電線部品の適用状況を説明する。   Next, the application status of conventional electric wire components will be described with reference to FIGS.

図22は、従来例2に係るプリント基板を説明する説明図であり、(A)は平面図、(B)は(A)の矢符Bでの側面図、(C)は(B)の矢符Rotに従って電線部品を折り曲げた状態での側面図である。   22A and 22B are explanatory diagrams for explaining a printed circuit board according to Conventional Example 2. FIG. 22A is a plan view, FIG. 22B is a side view taken along arrow B in FIG. It is a side view in the state where electric wire parts were bent according to arrow mark Rot.

プリント基板210相互間を電線部品220で接続してプリント基板ユニット(組プリント基板ユニット)としてあり、電線部品220はコネクタ225を備えたコネクタ付電線、コネクタ付同軸電線で構成してある。   The printed circuit boards 210 are connected to each other by an electric wire component 220 to form a printed circuit board unit (assembled printed circuit board unit). The electric wire component 220 includes a connector-equipped electric wire provided with a connector 225 and a connector-equipped coaxial electric wire.

図23は、従来例3に係るプリント基板を説明する説明図であり、(A)は平面図、(B)は(A)の矢符Bでの側面図、(C)は(B)の矢符Rotに従って電線部品を折り曲げた状態での側面図である。   23A and 23B are explanatory diagrams for explaining a printed circuit board according to Conventional Example 3. FIG. 23A is a plan view, FIG. 23B is a side view taken along arrow B in FIG. It is a side view in the state where electric wire parts were bent according to arrow mark Rot.

プリント基板310相互間を電線部品320で接続したプリント基板ユニット(組プリント基板ユニット)としてあり、電線部品320はコネクタ325を備えたコネクタ付フレキシブル基板で構成してある。   A printed circuit board unit (assembled printed circuit board unit) is formed by connecting the printed circuit boards 310 to each other with an electric wire component 320. The electric wire component 320 is constituted by a flexible substrate with a connector provided with a connector 325.

図24は、従来例4に係るプリント基板を説明する説明図であり、(A)は平面図、(B)は(A)の矢符Bでの側面図、(C)は(B)の矢符Rotに従って電線部品を折り曲げた状態での側面図である。   24A and 24B are explanatory diagrams for explaining a printed circuit board according to Conventional Example 4. FIG. 24A is a plan view, FIG. 24B is a side view taken along arrow B in FIG. It is a side view in the state where electric wire parts were bent according to arrow mark Rot.

プリント基板410相互間を電線部品420で接続したプリント基板ユニット(組プリント基板ユニット)としてあり、プリント基板410はリジッドプリント基板(リジッド部)で構成してあり、電線部品420はフレキシブル基板(フレックス部)で構成してある。つまり、プリント基板ユニットは、フレキシブルリジッド多層プリント配線板で構成してある。   A printed circuit board unit (assembled printed circuit board unit) is formed by connecting the printed circuit boards 410 to each other with a wire component 420. The printed circuit board 410 is formed of a rigid printed circuit board (rigid portion). ). That is, the printed circuit board unit is composed of a flexible rigid multilayer printed wiring board.

コネクタ付電線、コネクタ付同軸電線(従来例2)、コネクタ付フレキシブル基板(従来例3)で接続する場合は、電気的な接続をコネクタの接触によって行なうことから、電気的な接続が不安定になるため信頼性に問題があった。また、コネクタを機械的に嵌合して接続することから、接続強度が不安定になるという問題があった。さらに、コネクタをプリント基板上に実装することからプリント基板上に占有面積が必要となるので、プリント基板の表面面積を十分に活用できないという問題があった。   When connecting with a connector-attached cable, a connector-equipped coaxial cable (conventional example 2), or a connector-equipped flexible board (conventional example 3), the electrical connection is made by contact of the connector, so the electrical connection becomes unstable. Therefore, there was a problem in reliability. Further, since the connectors are mechanically fitted and connected, there is a problem that the connection strength becomes unstable. Furthermore, since the connector is mounted on the printed circuit board, an occupied area is required on the printed circuit board, so that the surface area of the printed circuit board cannot be fully utilized.

コネクタ付フレキシブル基板、フレキシブルリジッド多層プリント配線板のフレックス部(従来例4)で接続する場合は、フレキシブル基板を形成するエッチング加工でパターン幅やパターン間隔にばらつきが発生するため、高周波での電気特性が不安定になるという問題があった。また、構造的に信号パターンの全周を遮蔽パターンで囲むことができないことから、不要輻射を遮断できないことから電磁遮蔽性能に問題があった。また、リジッド部の内層構造とフレックス部の構造を一体の導体や絶縁体で形成することから、フレックス部での電気性能や機械性能を最優先することができないという問題があった。さらに、平面状のフレキシブル部材による接続となることから、平行移動による配置や捩り移動による配置ができないという問題があった。   When connecting with a flexible board with a connector or a flex part of a rigid rigid multilayer printed wiring board (conventional example 4), variations in pattern width and pattern spacing occur due to the etching process that forms the flexible board. There was a problem that became unstable. Further, since the entire periphery of the signal pattern cannot be surrounded by the shielding pattern structurally, unnecessary radiation cannot be blocked, and there is a problem in electromagnetic shielding performance. Moreover, since the inner layer structure of the rigid part and the structure of the flex part are formed of an integral conductor or insulator, there is a problem that the electrical performance and mechanical performance at the flex part cannot be given the highest priority. Further, since the connection is made by a planar flexible member, there is a problem that the arrangement by the parallel movement or the arrangement by the torsion movement cannot be performed.

なお、電線部品としての同軸ケーブルを配線基板に組み込んだ技術が提案されている(例えば、特許文献2、特許文献3参照。)が、配線基板相互間を電線で接続するものではなく、上述した問題を解決するものではない。
特開2006−140213号公報 特開2003−273496号公報 特開2004−63725号公報
In addition, although the technique which incorporated the coaxial cable as an electric wire component in a wiring board is proposed (for example, refer patent document 2, patent document 3), it does not connect between wiring boards with an electric wire, but mentioned above. It does not solve the problem.
JP 2006-140213 A Japanese Patent Laid-Open No. 2003-27396 Japanese Patent Laid-Open No. 2004-63725

本発明はこのような状況に鑑みてなされたものであり、導線を有する電線部品の端部を樹脂封止した樹脂封止部と第1配線基板とを並置し、第2絶縁基材および第2導体層パターンを有する第2配線基板を樹脂封止部と第1配線基板とに積層し、樹脂封止部から延長され第1導体層パターンに対向する導線用延長板部を有する導線用延長端子と導線とを接続し、導線用延長板部が有する接続孔を通過して第1導体層パターンに至る第2絶縁基材の層間導通孔に形成された導通孔導体を介して導線用延長板部を第1導体層パターンに接続することにより、導線(電線部品)と第1層導体層パターン(第1配線基板)とを容易かつ強固に接続して、自由な立体配置が可能で、信号伝送を確実に行なえ、電線部品と第1導体層パターンとの接続の信頼性が高い電線複合プリント配線基板、電線複合プリント配線基板製造方法を提供することを目的とする。   This invention is made | formed in view of such a condition, the resin sealing part which carried out resin sealing of the edge part of the electric wire component which has conducting wire, and the 1st wiring board are juxtaposed, and a 2nd insulation base material and 1st A second wiring board having a two-conductor layer pattern is laminated on the resin sealing portion and the first wiring board, and a conductor extension having a conductor extension plate extending from the resin sealing portion and facing the first conductor layer pattern. The terminal and the conductor are connected, and the conductor extension is made through a conduction hole conductor formed in the interlayer conduction hole of the second insulating base material that passes through the connection hole of the conductor extension plate and reaches the first conductor layer pattern. By connecting the plate part to the first conductor layer pattern, the conductor (electric wire component) and the first layer conductor layer pattern (first wiring board) can be easily and firmly connected, and free three-dimensional arrangement is possible. Signal transmission is ensured, and the connection between the wire component and the first conductor layer pattern Sex high wire composite printed wiring board, and an object thereof is to provide a wire composite printed wiring board manufacturing method.

また、本発明は、本発明に係る電線複合プリント配線基板、電線複合プリント配線基板製造方法に適用される電線部品、電線部品製造方法であって、樹脂封止部から延長され第1導体層パターンに対向する導線用延長板部を有する導線用延長端子と導線とを接続し、第2絶縁基材の層間導通孔に形成された導通孔導体を介して導線用延長板部の接続孔を第1導体層パターンに接続することにより、電線複合プリント配線基板に適用でき、第1層導体層パターン(第1配線基板)に対する導線の接続を容易かつ強固に行なう電線部品、電線部品製造方法を提供することを他の目的とする。   Moreover, this invention is an electric wire component applied to the electric wire composite printed wiring board which concerns on this invention, the electric wire composite printed wiring board manufacturing method, and an electric wire component manufacturing method, Comprising: It extends from the resin sealing part and is 1st conductor layer pattern The conductor extension terminal having the conductor extension plate portion facing the conductor is connected to the conductor, and the connection hole of the conductor extension plate portion is connected via the conduction hole conductor formed in the interlayer conduction hole of the second insulating substrate. An electric wire component that can be applied to an electric wire composite printed wiring board by connecting to a single conductor layer pattern, and that facilitates and strongly connects a conductive wire to the first layer conductive layer pattern (first wiring substrate), and an electric wire component manufacturing method To do other purposes.

また、本発明は、本発明に係る電線複合プリント配線基板を搭載することにより、導線(電線部品)と第1層導体層パターン(第1配線基板)との結合が強固であり、自由な立体配置が可能で、筐体形状を小型化、薄型化して所望の形状とすることができ、接続の信頼性が高い電子機器を提供することを他の目的とする。   In addition, the present invention mounts the electric wire composite printed wiring board according to the present invention, so that the connection between the conducting wire (electric wire component) and the first layer conductor layer pattern (first wiring board) is strong, and free three-dimensional Another object is to provide an electronic device that can be arranged and can be reduced in size and thickness to a desired shape and has high connection reliability.

本発明に係る電線複合プリント配線基板は、第1絶縁基材および第1導体層パターンを有する第1配線基板と、導線を有する電線および該電線の端部を樹脂封止して前記第1配線基板に並置された樹脂封止部を有する電線部品と、前記第1配線基板と前記樹脂封止部とに積層された第2絶縁基材および第2導体層パターンを有する第2配線基板とを備えた電線複合プリント配線基板であって、前記導線は、前記樹脂封止部から延長され前記第1導体層パターンに対向する導線用延長板部を有する導線用延長端子と接続され、前記導線用延長板部は、前記導線用延長板部が有する接続孔を通過して前記第1導体層パターンに至る前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続してあることを特徴とする。   An electric wire composite printed wiring board according to the present invention includes a first wiring board having a first insulating base material and a first conductor layer pattern, an electric wire having a conductive wire, and an end portion of the electric wire by resin sealing. An electric wire component having a resin sealing portion juxtaposed on a substrate, and a second wiring substrate having a second insulating base material and a second conductor layer pattern laminated on the first wiring substrate and the resin sealing portion. An electric wire composite printed wiring board provided, wherein the conductive wire is connected to a conductive wire extension terminal having a conductive wire extension plate portion that extends from the resin sealing portion and faces the first conductive layer pattern. The extension plate portion passes through the connection hole of the lead wire extension plate portion and reaches the first conductor layer pattern through the conduction hole conductor formed in the interlayer conduction hole of the second insulating substrate. It is connected to the conductor layer pattern To.

この構成により、導線(電線部品)と第1層導体層パターン(第1配線基板)とを容易かつ強固に接続して、自由な立体配置が可能で、信号伝送を確実に行なえ、電線部品と第1導体層パターンとの接続の信頼性が高い電線複合プリント配線基板とすることが可能となる。   With this configuration, the conductive wire (electric wire component) and the first layer conductor layer pattern (first wiring board) can be connected easily and firmly, enabling free three-dimensional arrangement, ensuring signal transmission, It becomes possible to make an electric wire composite printed wiring board with high reliability of connection with the first conductor layer pattern.

また、本発明に係る電線複合プリント配線基板では、前記電線部品は、導線を被覆する被覆部を有し、該被覆部は、前記樹脂封止部から延長され前記第1導体層パターンに対向する被覆部用延長板部を有する被覆部用延長端子と結合され、前記被覆部用延長板部は、前記被覆部用延長板部が有する接続孔を通過して前記第1導体層パターンに至る前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続され、前記被覆部用延長板部は、前記導線用延長板部の両側に並置してあることを特徴とする。   Moreover, in the electric wire composite printed wiring board according to the present invention, the electric wire component has a covering portion that covers the conductive wire, and the covering portion extends from the resin sealing portion and faces the first conductor layer pattern. It is combined with a covering portion extension terminal having a covering portion extension plate portion, and the covering portion extension plate portion passes through a connection hole of the covering portion extension plate portion and reaches the first conductor layer pattern. It is connected to the first conductor layer pattern via a conduction hole conductor formed in an interlayer conduction hole of the second insulating base, and the covering extension plate portion is juxtaposed on both sides of the conducting wire extension plate portion. It is characterized by being.

この構成により、電線から互いに反対方向で離れた位置にある第1導体層パターンそれぞれを被覆部用延長端子によって電線と交差させて接続することが可能となることから、導線用延長端子の周囲に配置された第1導体層パターンの配線自由度を向上させることが可能となる。   With this configuration, each of the first conductor layer patterns at positions away from the electric wires in opposite directions can be connected to the electric wires by the covering extension terminals, so that the conductor extension terminals can be connected around the electric wire extension terminals. It becomes possible to improve the degree of freedom of wiring of the arranged first conductor layer pattern.

また、本発明に係る電線複合プリント配線基板では、前記被覆部用延長板部は、前記導通孔導体を介して前記第2導体層パターンに接続してあることを特徴とする。   Moreover, the electric wire composite printed wiring board according to the present invention is characterized in that the extension plate portion for the covering portion is connected to the second conductor layer pattern through the conductive hole conductor.

この構成により、電線から互いに反対方向で離れた位置にある第2導体層パターンそれぞれを被覆部用延長端子によって電線と交差させて接続することが可能となることから、導線用延長端子の周囲に配置された第2導体層パターンの配線自由度を向上させることが可能となる。   With this configuration, it is possible to connect each of the second conductor layer patterns located away from the electric wires in opposite directions to each other by crossing the electric wires with the extension terminals for the covering portion. It becomes possible to improve the wiring flexibility of the arranged second conductor layer pattern.

また、本発明に係る電線複合プリント配線基板では、前記電線部品は、前記被覆部の外周に配設された外側導線を有し、該外側導線は、前記樹脂封止部から延長され前記第1導体層パターンに対向する外側導線用延長板部を有する外側導線用延長端子と接続され、前記外側導線用延長板部は、前記外側導線用延長板部が有する接続孔を通過して前記第1導体層パターンに至る前記第2絶縁基材の層間導通孔に形成された前記導通孔導体を介して前記第1導体層パターンに接続してあることを特徴とする。   Moreover, in the electric wire composite printed wiring board according to the present invention, the electric wire component has an outer conductive wire disposed on an outer periphery of the covering portion, and the outer conductive wire is extended from the resin sealing portion, and An outer conductor extension terminal having an outer conductor extension plate facing the conductor layer pattern is connected to the outer conductor extension plate through the connection hole of the outer conductor extension plate. The conductive layer pattern is connected to the first conductive layer pattern via the conductive hole conductor formed in the interlayer conductive hole of the second insulating base material reaching the conductive layer pattern.

この構成により、外側導線(電線部品)と第1層導体層パターン(第1配線基板)とを容易かつ強固に接続して、自由な立体配置が可能で、外側導線による信号伝送を確実に行なえ、電線部品と第1導体層パターンとの接続の信頼性が高い電線複合プリント配線基板とすることが可能となる。   With this configuration, the outer conductor (electric wire component) and the first layer conductor layer pattern (first wiring board) can be easily and firmly connected to each other so that free three-dimensional arrangement is possible and signal transmission by the outer conductor can be reliably performed. In addition, it is possible to provide an electric wire composite printed wiring board with high reliability of connection between the electric wire component and the first conductor layer pattern.

また、本発明に係る電線複合プリント配線基板では、前記外側導線用延長板部は、前記導線用延長板部の両側に並置してあることを特徴とする。   Moreover, the electric wire composite printed wiring board according to the present invention is characterized in that the outer conductive wire extension plate is juxtaposed on both sides of the conductive wire extension plate.

この構成により、電線から互いに反対方向で離れた位置にある第1導体層パターンそれぞれを外側導線用延長端子によって電線と交差させて接続することから、導線用延長板部の外側に配設された外側導線用延長板部によって導線用延長端子を囲むことが可能となり、例えば導線用延長端子に対する外部からの電気的影響(電磁ノイズ)を排除することができる。   With this configuration, each of the first conductor layer patterns located at positions away from each other in the opposite direction from the electric wire is connected to the electric wire by intersecting with the electric wire by the outer conductive wire extension terminal, and thus is disposed outside the conductive wire extension plate portion. It becomes possible to surround the extension terminal for conducting wires with the extension board portion for outside conducting wire, and for example, it is possible to eliminate an electrical influence (electromagnetic noise) from the outside on the extension terminal for conducting wire.

また、本発明に係る電線複合プリント配線基板では、前記外側導線用延長板部が有する前記接続孔は、前記外側導線用延長板部の延長方向に沿って複数形成してあることを特徴とする。   Moreover, in the electric wire composite printed wiring board according to the present invention, a plurality of the connection holes included in the outer conductive wire extension plate are formed along the extending direction of the outer conductive wire extension plate. .

この構成により、第1導体層パターン(および第2導体層パターン)の配置状態に応じた自由度の高い接続が可能となる。   With this configuration, connection with a high degree of freedom according to the arrangement state of the first conductor layer pattern (and the second conductor layer pattern) becomes possible.

また、本発明に係る電線複合プリント配線基板では、前記電線部品は、前記被覆部の外周に配設された外側導線を有し、該外側導線は、前記電線と交差して前記樹脂封止部の表面に配設された外側導線用交差端部を有する外側導線用交差端子と接続され、前記外側導線用交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続してあることを特徴とする。   Moreover, in the electric wire composite printed wiring board according to the present invention, the electric wire component has an outer conductive wire disposed on an outer periphery of the covering portion, and the outer conductive wire intersects with the electric wire and the resin sealing portion. The outer conductor crossing terminal having the outer conductor crossing end disposed on the surface of the outer conductor is connected to the outer conductor crossing terminal, and the outer conductor crossing end is formed in the conduction hole conductor formed in the interlayer conduction hole of the second insulating substrate. It is connected to the second conductor layer pattern via a pin.

この構成により、両面配線構造とされた第1配線基板の各面にそれぞれ積層された第2導体層パターンを相互に接続できることから、多層(4層)構造とされた電線複合プリント配線基板での第2導体層パターンの配線自由度を向上させることが可能となる。   With this configuration, the second conductor layer patterns laminated on the respective surfaces of the first wiring board having the double-sided wiring structure can be connected to each other. Therefore, in the electric wire composite printed wiring board having a multilayer (four-layer) structure It becomes possible to improve the degree of freedom of wiring of the second conductor layer pattern.

また、本発明に係る電線複合プリント配線基板では、前記外側導線用交差端部に接続された前記第2導体層パターンは、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続してあることを特徴とする。   Moreover, in the electric wire composite printed wiring board according to the present invention, the second conductor layer pattern connected to the outer conductor crossing end portion is a conduction hole conductor formed in an interlayer conduction hole of the second insulating substrate. It is connected to the first conductor layer pattern via.

この構成により、電線から互いに反対方向で離れた位置にある第1導体層パターンそれぞれを第2導体層パターンおよび外側導線用交差端子によって電線と交差させて接続できることから、第1導体層パターンおよび第2導体層パターンの配線自由度を向上させることが可能となる。また、導線用延長板部の外側に配置された第2導体層パターンによって導線用延長端子を囲むことが可能となり、導線用延長端子に対する外部からの電気的影響(電磁ノイズ)を排除することができる。   With this configuration, each of the first conductor layer patterns at positions separated from each other in the opposite direction from the electric wire can be connected to the electric wire by intersecting with the second conductor layer pattern and the outer conductor crossing terminal. It is possible to improve the degree of freedom of wiring of the two conductor layer pattern. Moreover, it becomes possible to surround the extension terminal for conducting wires by the 2nd conductor layer pattern arrange | positioned on the outer side of the extension board part for conducting wires, and the electrical influence (electromagnetic noise) from the outside with respect to the extension terminal for conducting wires can be excluded. it can.

また、本発明に係る電線複合プリント配線基板では、前記外側導線用交差端部に接続された前記第2導体層パターンは、前記導線用延長端子を覆うパターン形状としてあることを特徴とする。   Moreover, in the electric wire composite printed wiring board according to the present invention, the second conductor layer pattern connected to the outer conductive wire intersection end portion has a pattern shape covering the conductive wire extension terminal.

この構成により、外側導線(外側導線用交差端部)に接続された第2導体層パターンを導線(導線用延長端子)に対する遮蔽部として確実に作用させることが可能となる。   With this configuration, the second conductor layer pattern connected to the outer conductor (intersection for outer conductor) can be reliably acted as a shield for the conductor (conductor extension terminal).

また、本発明に係る電線複合プリント配線基板では、前記電線部品は、前記被覆部の外周に配設された外側導線を有し、該外側導線は、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側導線用延長交差端部を有する外側導線用延長交差端子と接続され、前記外側導線用延長交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続してあることを特徴とする。   Moreover, in the electric wire composite printed wiring board according to the present invention, the electric wire component has an outer conductive wire disposed on an outer periphery of the covering portion, and the outer conductive wire is extended in a direction intersecting with the electric wire and the resin. An outer conductor extended cross terminal having an outer conductor extended cross end disposed on the surface of the sealing portion is connected, and the outer conductor extended cross end is connected to an interlayer conduction hole of the second insulating substrate. It is connected to the second conductor layer pattern through a formed conduction hole conductor.

この構成により、電線から互いに反対方向で離れた位置にある第2導体層パターンそれぞれを外側導線用延長交差端子によって電線と交差させて接続することから、導線用延長板部の外側に配置された第2導体層パターンの配線自由度を向上させることが可能となる。   With this configuration, each of the second conductor layer patterns located at positions away from each other in the opposite direction from the electric wire is connected to the electric wire so as to cross the electric wire by the outer conductive wire extension crossing terminal, and thus is disposed outside the conductive wire extension plate portion. It becomes possible to improve the degree of freedom of wiring of the second conductor layer pattern.

また、本発明に係る電線複合プリント配線基板では、前記外側導線用延長交差端部に接続された前記第2導体層パターンは、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続してあることを特徴とする。   Moreover, in the electric wire composite printed wiring board according to the present invention, the second conductor layer pattern connected to the extended intersection end portion for the outer conductor is a conduction hole conductor formed in an interlayer conduction hole of the second insulating base material. It is connected to the first conductor layer pattern via a pin.

この構成により、電線から互いに反対方向で離れた位置にある第1導体層パターンそれぞれを第2導体層パターンおよび外側導線用延長交差端子によって電線と交差させて接続することから、第1導体層パターンおよび第2導体層パターンの配線自由度を向上させることが可能となる。また、導線用延長板部の外側に配置された第2導体層パターンによって導線用延長端子を囲むことが可能となり、導線用延長端子に対する外部からの電気的影響(電磁ノイズ)を排除することができる。   With this configuration, each of the first conductor layer patterns located at positions away from each other in the opposite direction from the electric wire is connected to the electric wire so as to intersect with the second conductor layer pattern and the outer conductor extended crossing terminal. In addition, the degree of freedom of wiring of the second conductor layer pattern can be improved. Moreover, it becomes possible to surround the extension terminal for conducting wires by the 2nd conductor layer pattern arrange | positioned on the outer side of the extension board part for conducting wires, and the electrical influence (electromagnetic noise) from the outside with respect to the extension terminal for conducting wires can be excluded. it can.

また、本発明に係る電線複合プリント配線基板では、前記外側導線用延長交差端部に接続された前記第2導体層パターンは、前記導線用延長端子を覆うパターン形状としてあることを特徴とする。   Moreover, in the electric wire composite printed wiring board according to the present invention, the second conductor layer pattern connected to the outer conductor extended extension intersection has a pattern shape covering the conductor extended terminal.

この構成により、外側導線(外側導線用延長交差端部)に接続された第2導体層パターンを導線(導線用延長端子)に対する遮蔽部として確実に作用させることが可能となる。   With this configuration, the second conductor layer pattern connected to the outer conductor (outer conductor extension crossing end) can be reliably acted as a shield for the conductor (conductor extension terminal).

また、本発明に係る電線複合プリント配線基板では、前記電線部品は、前記外側導線を被覆する外側被覆部を有し、該外側被覆部は、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側被覆部用延長交差端部を有する外側被覆部用延長交差端子と当接され、前記外側被覆部用延長交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続してあることを特徴とする。   Further, in the electric wire composite printed wiring board according to the present invention, the electric wire component has an outer covering portion that covers the outer conductive wire, and the outer covering portion is extended in a direction intersecting the electric wire and is sealed with the resin. An outer covering portion extending crossing terminal having an outer covering portion extending intersection end disposed on the surface of the outer covering portion, and the outer covering portion extending intersection end is connected to the interlayer insulation of the second insulating substrate. It is connected to the second conductor layer pattern through a conduction hole conductor formed in the hole.

この構成により、電線から互いに反対方向で離れた位置にある第2導体層パターンそれぞれを外側被覆部用延長交差端子によって電線と交差させて接続することが可能となることから、導線用延長端子の周囲に配置された第2導体層パターンの配線自由度を向上させることが可能となる。   With this configuration, each of the second conductor layer patterns at positions separated from each other in the opposite direction from the electric wire can be connected to be crossed with the electric wire by the outer covering extension extended intersection terminal. It becomes possible to improve the degree of freedom of wiring of the second conductor layer pattern arranged around.

また、本発明に係る電線複合プリント配線基板では、前記外側被覆部用延長交差端部に接続された前記第2導体層パターンは、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続してあることを特徴とする。   Moreover, in the electric wire composite printed wiring board according to the present invention, the second conductor layer pattern connected to the outer covering extension extended intersection is a conduction hole formed in an interlayer conduction hole of the second insulating base. It is connected to the first conductor layer pattern through a conductor.

この構成により、電線から互いに反対方向で離れた位置にある第1導体層パターンそれぞれを外側被覆部用延長交差端子によって電線と交差させて接続することが可能となることから、導線用延長端子の周囲に配置された第1導体層パターンの配線自由度を向上させ、また、導線用延長端子32の周囲を囲む第1導体層パターン12pとすることが可能となる。   With this configuration, each of the first conductor layer patterns located at positions away from each other in the opposite direction from the electric wire can be connected to be crossed with the electric wire by the outer covering extension extended terminal. It is possible to improve the degree of freedom of wiring of the first conductor layer pattern disposed in the periphery, and to form the first conductor layer pattern 12p surrounding the conductor extension terminal 32.

また、本発明に係る電線複合プリント配線基板では、前記層間導通孔の内径は前記接続孔の内径より大きくしてあることを特徴とする。   In the electric wire composite printed wiring board according to the present invention, the inner diameter of the interlayer conduction hole is larger than the inner diameter of the connection hole.

この構成により、層間導通孔を容易かつ確実に接続孔に位置合わせして、確実な導通が可能な導通孔導体を形成することが可能となる。   With this configuration, it is possible to easily and reliably align the interlayer conduction hole with the connection hole and form a conduction hole conductor capable of reliable conduction.

また、本発明に係る電線複合プリント配線基板では、前記第1導体層パターンは、前記第1配線基板の両面に形成され、前記第2配線基板は、前記第1配線基板の両面にそれぞれ積層してあり、前記電線部品は、前記第2配線基板の積層方向で第1導体層パターンまたは第2導体層パターンに対称的に接続される構成としてあることを特徴とする。   In the electric wire composite printed wiring board according to the present invention, the first conductor layer pattern is formed on both surfaces of the first wiring substrate, and the second wiring substrate is laminated on both surfaces of the first wiring substrate. The electric wire component is configured to be symmetrically connected to the first conductor layer pattern or the second conductor layer pattern in the stacking direction of the second wiring board.

この構成により、多層(4層)構造の配線基板の各導体層パターンに対して両面で対称的に接続された電線部品を有する電線複合プリント配線基板とすることが可能となる。   With this configuration, it is possible to obtain an electric wire composite printed wiring board having electric wire components that are symmetrically connected on both sides to each conductor layer pattern of a wiring board having a multilayer (four layers) structure.

また、本発明に係る電線複合プリント配線基板製造方法は、第1絶縁基材および第1導体層パターンを有する第1配線基板と、導線を有する電線および該電線の端部を樹脂封止して前記第1配線基板に並置された樹脂封止部を有する電線部品と、前記第1配線基板と前記樹脂封止部とに積層された第2絶縁基材および第2導体層パターンを有する第2配線基板とを備える電線複合プリント配線基板を製造する電線複合プリント配線基板製造方法であって、前記樹脂封止部から延長され前記第1導体層パターンに対向する導線用延長板部を有する導線用延長端子と前記導線とを接続した前記電線部品を準備する電線部品準備工程と、前記第1導体層パターンを形成した前記第1配線基板と前記電線部品とを並置して前記導線用延長板部が有する接続孔を前記第1導体層パターンに位置合わせする導線用延長板部位置合わせ工程と、前記導線用延長板部位置合わせ工程の後、前記第2導体層パターンを形成するための第2導体層と前記第2絶縁基材とを積層した前記第2配線基板を前記樹脂封止部および前記第1配線基板に積層する第2配線基板積層工程と、前記導線用延長板部が有する接続孔を通過して前記第1導体層パターンに至る層間導通孔を前記第2絶縁基材に形成する導通孔形成工程と、前記導通孔形成工程で形成した層間導通孔に導通孔導体を形成する導通孔導体形成工程と、前記第2導体層をパターニングして前記第2導体層パターンを形成する第2導体層パターン形成工程と、前記第1配線基板および前記第2配線基板の外形を形成する外形形成工程とを備えることを特徴とする。   In addition, the method for manufacturing an electric wire composite printed wiring board according to the present invention includes resin-sealing a first wiring board having a first insulating base material and a first conductor layer pattern, an electric wire having a conductive wire, and an end portion of the electric wire. An electric wire component having a resin sealing portion juxtaposed on the first wiring substrate, a second insulating base material and a second conductor layer pattern laminated on the first wiring substrate and the resin sealing portion. An electric wire composite printed wiring board manufacturing method for manufacturing an electric wire composite printed wiring board comprising a wiring board, wherein the electric wire composite printed wiring board manufacturing method includes a conductive wire extension plate extending from the resin sealing portion and facing the first conductor layer pattern. An electric wire component preparing step for preparing the electric wire component in which an extension terminal and the conductive wire are connected, and the first wiring board on which the first conductor layer pattern is formed and the electric wire component are juxtaposed to form the extension plate portion for the conductive wire. Have A conductive wire extension plate portion alignment step for aligning the through hole with the first conductive layer pattern, and a conductive wire extension plate portion alignment step, and then a second conductive layer for forming the second conductive layer pattern And a second wiring board laminating step of laminating the second wiring board on which the second insulating base material is laminated on the resin sealing portion and the first wiring board, and a connection hole provided in the conductive wire extension plate part. A conduction hole forming step for forming an interlayer conduction hole passing through and reaching the first conductor layer pattern in the second insulating base, and a conduction hole for forming a conduction hole conductor in the interlayer conduction hole formed in the conduction hole formation step A conductor forming step, a second conductor layer pattern forming step of forming the second conductor layer pattern by patterning the second conductor layer, and an outer shape forming for forming the outer shapes of the first wiring substrate and the second wiring substrate. With the process And butterflies.

この構成により、導線(電線部品)と第1層導体層パターン(第1配線基板)とを容易かつ強固に接続して、自由な立体配置が可能で、信号伝送を確実に行なえ、電線部品と第1導体層パターンとの接続の信頼性が高い電線複合プリント配線基板を生産性良く製造することが可能となる。   With this configuration, the conductive wire (electric wire component) and the first layer conductor layer pattern (first wiring board) can be connected easily and firmly, enabling free three-dimensional arrangement, ensuring signal transmission, An electric wire composite printed wiring board with high reliability of connection with the first conductor layer pattern can be manufactured with high productivity.

また、本発明に係る電線複合プリント配線基板製造方法では、前記電線部品準備工程で、前記樹脂封止部から延長され前記導線用延長板部に並置されて前記第1導体層パターンに対向する被覆部用延長板部を有する被覆部用延長端子と前記導線を絶縁して被覆する被覆部とを結合した前記電線部品を準備し、前記導線用延長板部位置合わせ工程で、前記被覆部用延長板部が有する接続孔を前記第1導体層パターンに位置合わせし、前記導通孔形成工程で、前記被覆部用延長板部が有する接続孔を通過して前記第1導体層パターンに至る層間導通孔を前記第2絶縁基材に形成することを特徴とする。   Moreover, in the electric wire composite printed wiring board manufacturing method according to the present invention, in the electric wire component preparation step, a coating that extends from the resin sealing portion and is juxtaposed on the conductive wire extension plate portion and faces the first conductor layer pattern. The wire part is prepared by combining the extension terminal for the covering part having the extension plate part for the part and the covering part for insulating and covering the conductor, and the extension for the covering part is performed in the conductor extension plate part alignment step. The connection hole which a board part has is aligned with the said 1st conductor layer pattern, and the interlayer conduction | electrical_connection which passes through the connection hole which the said extension board part for coating | coated parts passes to the said 1st conductor layer pattern in the said conduction hole formation process A hole is formed in the second insulating base material.

この構成により、電線から互いに反対方向で離れた位置にある第1導体層パターンそれぞれを被覆部用延長端子によって電線と交差させて容易かつ強固に接続することが可能となることから、導線用延長端子の周囲に配置された第1導体層パターンの配線自由度を向上させた電線複合プリント配線基板を生産性良く製造することが可能となる。   With this configuration, it is possible to easily and firmly connect each of the first conductor layer patterns located away from the electric wires in opposite directions to the electric wires by means of the covering extension terminals. An electric wire composite printed wiring board in which the wiring flexibility of the first conductor layer pattern arranged around the terminal is improved can be manufactured with high productivity.

また、本発明に係る電線複合プリント配線基板製造方法では、前記電線部品準備工程で、前記樹脂封止部から延長され前記導線用延長板部に並置されて前記第1導体層パターンに対向する外側導線用延長板部を有する外側導線用延長端子と前記被覆部の外周に配設された外側導線とを接続した前記電線部品を準備し、前記導線用延長板部位置合わせ工程で、前記外側導線用延長板部が有する接続孔を前記第1導体層パターンに位置合わせし、前記導通孔形成工程で、前記外側導線用延長板部が有する接続孔を通過して前記第1導体層パターンに至る層間導通孔を前記第2絶縁基材に形成することを特徴とする。   Moreover, in the electric wire composite printed wiring board manufacturing method according to the present invention, in the electric wire component preparation step, an outer side that extends from the resin sealing portion and is juxtaposed to the conductive wire extension plate portion and faces the first conductor layer pattern. The electric wire component is prepared by connecting an outer conductive wire extension terminal having a conductive wire extension plate portion and an outer conductive wire disposed on the outer periphery of the covering portion, and in the conductive wire extension plate portion alignment step, the outer conductive wire is prepared. The connection hole of the extension plate portion for use is aligned with the first conductor layer pattern, and the connection hole formation step passes through the connection hole of the extension plate portion for the outer conductor to reach the first conductor layer pattern. An interlayer conduction hole is formed in the second insulating base material.

この構成により、外側導線(電線部品)と第1層導体層パターン(第1配線基板)とを容易かつ強固に接続して、自由な立体配置が可能で、外側導線による信号伝送を確実に行なえ、電線部品と第1導体層パターンとの接続の信頼性が高い電線複合プリント配線基板を生産性良く製造することが可能となる。   With this configuration, the outer conductor (electric wire component) and the first layer conductor layer pattern (first wiring board) can be easily and firmly connected to each other so that free three-dimensional arrangement is possible and signal transmission by the outer conductor can be reliably performed. In addition, it is possible to manufacture an electric wire composite printed wiring board with high reliability in connection between the electric wire component and the first conductor layer pattern with high productivity.

また、本発明に係る電線複合プリント配線基板製造方法では、前記電線部品準備工程で、前記電線と交差して前記樹脂封止部の表面に配設された外側導線用交差端部を有する外側導線用交差端子と前記被覆部の外周に配設された外側導線とを接続した前記電線部品を準備し、前記導通孔形成工程で、前記外側導線用交差端部に至る層間導通孔を前記第2絶縁基材に形成することを特徴とする。   Moreover, in the electric wire composite printed wiring board manufacturing method according to the present invention, in the electric wire component preparation step, an outer conductive wire having an outer conductive wire intersecting end portion that intersects the electric wire and is disposed on the surface of the resin sealing portion. The electric wire component is prepared by connecting the crossing terminal for use and the outer conductor disposed on the outer periphery of the covering portion, and in the conduction hole forming step, the interlayer conduction hole reaching the outer conductor crossing end is formed in the second portion. It is formed on an insulating base material.

この構成により、電線から互いに反対方向で離れた位置にある第2導体層パターンそれぞれを外側導線用交差端子によって電線と交差させて接続できることから、導線用延長板部の周囲に配置された第2導体層パターンの配線自由度を向上させることが可能となる。   With this configuration, each of the second conductor layer patterns that are located away from each other in the opposite direction from the electric wire can be connected to the electric wire by intersecting with the outer conductive wire crossing terminal. It is possible to improve the degree of freedom of wiring of the conductor layer pattern.

また、本発明に係る電線複合プリント配線基板製造方法では、前記電線部品準備工程で、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側導線用延長交差端部を有する外側導線用延長交差端子と前記被覆部の外周に配設された外側導線とを接続した前記電線部品を準備し、前記導通孔形成工程で、前記外側導線用延長交差端部に至る層間導通孔を前記第2絶縁基材に形成することを特徴とする。   Moreover, in the electric wire composite printed wiring board manufacturing method according to the present invention, in the electric wire component preparation step, the extended cross end portion for the outer conductor extended in the direction intersecting the electric wire and disposed on the surface of the resin sealing portion The wire part connecting the extended crossing terminal for the outer conductive wire and the outer conductive wire disposed on the outer periphery of the covering portion is prepared, and the layer reaching the extended crossing end portion for the outer conductive wire in the conduction hole forming step is prepared. A conduction hole is formed in the second insulating substrate.

この構成により、電線から互いに反対方向で離れた位置にある第2導体層パターンそれぞれを外側導線用延長交差端子によって電線と交差させて接続できることから、導線用延長板部の周囲に配置された第2導体層パターンの配線自由度を向上させることが可能となる。   With this configuration, each of the second conductor layer patterns located at positions away from each other in the opposite direction from the electric wire can be connected to be crossed with the electric wire by the outer conductive wire extension crossing terminal, so that the second conductor layer pattern disposed around the conductive wire extension plate portion is provided. It is possible to improve the degree of freedom of wiring of the two conductor layer pattern.

また、本発明に係る電線複合プリント配線基板製造方法では、前記電線部品準備工程で、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側被覆部用延長交差端部を有する外側被覆部用延長交差端子と前記外側導線を絶縁して被覆する外側被覆部とを当接させた前記電線部品を準備し、前記導通孔形成工程で、前記外側被覆部用延長交差端部に至る層間導通孔を前記第2絶縁基材に形成することを特徴とする。   Moreover, in the electric wire composite printed wiring board manufacturing method according to the present invention, in the electric wire component preparation step, the extended covering end for the outer covering portion extended in the direction intersecting with the electric wire and disposed on the surface of the resin sealing portion The outer covering portion extended crossing terminal and the outer covering portion that insulates and coats the outer conducting wire are contacted, and the outer covering portion extending intersection is prepared in the conduction hole forming step. An interlayer conduction hole reaching the end is formed in the second insulating substrate.

この構成により、電線から互いに反対方向で離れた位置にある第2導体層パターンそれぞれを外側被覆部用延長交差端子によって電線と交差させて接続できることから、導線用延長端子の周囲に配置された第2導体層パターンの配線自由度を向上させることが可能となる。   With this configuration, each of the second conductor layer patterns located at positions away from each other in the opposite direction from the electric wire can be connected to the electric wire by the outer covering portion extension crossing terminal, and therefore, the second conductor layer pattern disposed around the conductive wire extension terminal. It is possible to improve the degree of freedom of wiring of the two conductor layer pattern.

また、本発明に係る電線部品は、第1絶縁基材および第1導体層パターンを有する第1配線基板と、前記第1配線基板に積層された第2絶縁基材および第2導体層パターンを有する第2配線基板と、導線を有する電線および該電線の端部を樹脂封止して前記第1配線基板に並置され前記第2配線基板が積層された樹脂封止部を有する電線部品とを備える電線複合プリント配線基板に適用される電線部品であって、前記導線は、前記樹脂封止部から延長され前記第1導体層パターンに対向する導線用延長板部を有する導線用延長端子と接続され、前記導線用延長板部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続される接続孔を有することを特徴とする。   The electric wire component according to the present invention includes a first wiring board having a first insulating base material and a first conductor layer pattern, and a second insulating base material and a second conductor layer pattern laminated on the first wiring board. A second wiring board having an electric wire having a conductive wire, and an electric wire component having a resin sealing portion in which an end portion of the electric wire is resin-sealed and juxtaposed with the first wiring board and the second wiring board is laminated. An electric wire component applied to an electric wire composite printed wiring board, wherein the conductive wire is connected to a conductive wire extension terminal having a conductive wire extension plate portion extending from the resin sealing portion and facing the first conductive layer pattern. The conductive wire extension plate has a connection hole connected to the first conductor layer pattern through a conduction hole conductor formed in an interlayer conduction hole of the second insulating base.

この構成により、電線複合プリント配線基板に適用でき、第1層導体層パターン(第1配線基板)に対する導線の接続を容易かつ強固に行なう電線部品とすることが可能となる。   With this configuration, the present invention can be applied to an electric wire composite printed wiring board, and can be an electric wire component that easily and firmly connects a conductive wire to the first layer conductor layer pattern (first wiring board).

また、本発明に係る電線部品では、前記導線を被覆する被覆部は、前記樹脂封止部から延長され前記第1導体層パターンに対向する被覆部用延長板部を有する被覆部用延長端子と結合され、前記被覆部用延長板部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続される接続孔を有し、前記導線用延長板部の両側に並置してあることを特徴とする。   Moreover, in the electric wire component according to the present invention, the covering portion that covers the conducting wire includes a covering portion extension terminal that has a covering portion extension plate portion that extends from the resin sealing portion and faces the first conductor layer pattern. The covering extension plate portion is coupled and has a connection hole connected to the first conductor layer pattern via a conduction hole conductor formed in an interlayer conduction hole of the second insulating substrate, and the conductor It is characterized by being juxtaposed on both sides of the extension plate portion for use.

この構成により、電線複合プリント配線基板に適用でき、電線から互いに反対方向で離れた位置にある第1層導体層パターンそれぞれを被覆部用延長端子によって電線と交差させて接続し、導線用延長端子の周囲に配置された第1導体層パターンの配線自由度を向上させる電線部品とすることが可能となる。   With this configuration, it can be applied to the electric wire composite printed wiring board, and the first layer conductor layer patterns located at positions separated from each other in the opposite direction from the electric wires are connected to each other by crossing the electric wires with the covering extension terminals, and the conductive wire extension terminals It is possible to provide an electric wire component that improves the degree of freedom of wiring of the first conductor layer pattern disposed around the.

また、本発明に係る電線部品では、前記被覆部の外周に配設された外側導線は、前記樹脂封止部から延長され前記第1導体層パターンに対向する外側導線用延長板部を有する外側導線用延長端子と接続され、前記外側導線用延長板部は、前記第2絶縁基材の層間導通孔に形成された前記導通孔導体を介して前記第1導体層パターンに接続される接続孔を有することを特徴とする。   Further, in the electric wire component according to the present invention, the outer conductive wire disposed on the outer periphery of the covering portion has an outer conductive wire extension plate portion extending from the resin sealing portion and facing the first conductor layer pattern. A connecting hole connected to the conducting wire extension terminal, and the outer conducting wire extension plate portion is connected to the first conductor layer pattern via the conducting hole conductor formed in the interlayer conducting hole of the second insulating substrate. It is characterized by having.

この構成により、電線複合プリント配線基板に適用でき、第1層導体層パターン(第1配線基板)に対する外側導線(電線部品)の接続を容易かつ強固に行なう電線部品とすることが可能となる。   With this configuration, the present invention can be applied to an electric wire composite printed wiring board, and can be an electric wire component that easily and firmly connects an outer conductor (electric wire component) to the first layer conductor layer pattern (first wiring substrate).

また、本発明に係る電線部品では、前記外側導線用延長板部は、前記導線用延長板部の両側に並置してあることを特徴とする。   Moreover, in the electric wire component according to the present invention, the outer conductor extension plate portion is juxtaposed on both sides of the conductor extension plate portion.

この構成により、電線から互いに反対方向で離れた位置にある第1導体層パターンそれぞれを外側導線用延長端子によって電線と交差させて接続し、導線用延長端子の周囲に配置された第1導体層パターンの配線自由度を向上させる電線部品とすることが可能となる。   With this configuration, the first conductor layer patterns that are separated from the electric wires in the opposite directions are connected to the electric wires by crossing the electric wires with the outer conductive wire extension terminals, and are arranged around the conductive wire extension terminals. It is possible to provide an electric wire component that improves the wiring flexibility of the pattern.

また、本発明に係る電線部品では、前記外側導線用延長板部が有する前記接続孔は、前記外側導線用延長板部の延長方向に沿って複数形成してあることを特徴とする。   In the electric wire component according to the present invention, a plurality of the connection holes included in the outer conductive wire extension plate portion are formed along the extending direction of the outer conductive wire extension plate portion.

この構成により、第1導体層パターン(および第2導体層パターン)の配置状態に応じた自由度の高い接続が可能な電線部品とすることができる。   With this configuration, it is possible to provide an electric wire component that can be connected with a high degree of freedom according to the arrangement state of the first conductor layer pattern (and the second conductor layer pattern).

また、本発明に係る電線部品では、前記被覆部の外周に配設された外側導線は、前記電線と交差して前記樹脂封止部の表面に配設された外側導線用交差端部を有する外側導線用交差端子と接続され、前記外側導線用交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続される構成としてあることを特徴とする。   Moreover, in the electric wire component according to the present invention, the outer conductive wire disposed on the outer periphery of the covering portion has an outer conductive wire intersection end portion disposed on the surface of the resin sealing portion so as to intersect the electric wire. The outer conductor crossing terminal is connected to the outer conductor crossing terminal, and the outer conductor crossing end is connected to the second conductor layer pattern via a conduction hole conductor formed in an interlayer conduction hole of the second insulating substrate. It is characterized by being.

この構成により、両面配線構造とされた第1配線基板の各面にそれぞれ積層された第2導体層パターンを相互に接続できることから、多層(4層)構造とされた電線複合プリント配線基板での第2導体層パターンの配線自由度を向上させる電線部品とすることが可能となる。   With this configuration, the second conductor layer patterns laminated on the respective surfaces of the first wiring board having the double-sided wiring structure can be connected to each other. Therefore, in the electric wire composite printed wiring board having a multilayer (four-layer) structure It is possible to provide an electric wire component that improves the wiring flexibility of the second conductor layer pattern.

また、本発明に係る電線部品では、前記被覆部の外周に配設された外側導線は、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側導線用延長交差端部を有する外側導線用延長交差端子と接続され、前記外側導線用延長交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続される構成としてあることを特徴とする。   Moreover, in the electric wire component according to the present invention, the outer conductive wire disposed on the outer periphery of the covering portion is extended in the direction intersecting with the electric wire and extended on the surface of the resin sealing portion. The second conductor layer pattern is connected to an outer conductor extended intersection terminal having an end portion, and the outer conductor extended intersection end portion is formed through a conduction hole conductor formed in an interlayer conduction hole of the second insulating substrate. It is characterized by being configured to be connected to.

この構成により、電線から互いに反対方向で離れた位置にある第2導体層パターンそれぞれを外側導線用延長交差端子によって電線と交差させて接続し、導線用延長板部の外側に配置された第2導体層パターンの配線自由度を向上させる電線部品とすることが可能となる。   With this configuration, the second conductor layer patterns at positions separated from each other in the opposite direction from the electric wire are connected to each other by crossing the electric wire by the outer conductive wire extension crossing terminal, and are arranged outside the conductive wire extension plate portion. It is possible to provide an electric wire component that improves the degree of freedom of wiring of the conductor layer pattern.

また、本発明に係る電線部品では、前記外側導線を被覆する外側被覆部は、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側被覆部用延長交差端部を有する外側被覆部用延長交差端子と当接され、前記外側被覆部用延長交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続される構成としてあることを特徴とする。   In the electric wire component according to the present invention, the outer covering portion covering the outer conductive wire is extended in the direction intersecting with the electric wire, and is extended on the surface of the resin sealing portion. The outer covering portion extended crossing terminal is in contact with the outer covering portion extending crossing end, and the second covering layer is connected to the second conductor layer via a conduction hole conductor formed in an interlayer conduction hole of the second insulating substrate. It is characterized by being configured to be connected to a pattern.

この構成により、電線から互いに反対方向で離れた位置にある第2導体層パターンそれぞれを外側被覆部用延長交差端子によって電線と交差させて接続し、導線用延長端子の周囲に配置された第2導体層パターンの配線自由度を向上させる電線部品とすることが可能となる。   With this configuration, each of the second conductor layer patterns located at positions away from each other in the opposite direction from the electric wire is connected to be crossed with the electric wire by the outer covering portion extension crossing terminal, and is arranged around the extension terminal for the conducting wire. It is possible to provide an electric wire component that improves the degree of freedom of wiring of the conductor layer pattern.

また、本発明に係る電線部品では、前記導線は、絶縁性心材の周囲に配設されて円筒状とされた編組線で構成してあることを特徴とする。   Moreover, in the electric wire component according to the present invention, the conducting wire is formed of a braided wire that is disposed around the insulating core and has a cylindrical shape.

この構成により、導線を構成する編組線の形状を円筒状に保持することが可能となり、柔軟性と形態性を確保した電線とすることができる。   With this configuration, the shape of the braided wire constituting the conducting wire can be held in a cylindrical shape, and an electric wire having flexibility and formability can be obtained.

また、本発明に係る電線部品製造方法は、第1絶縁基材および第1導体層パターンを有する第1配線基板と、前記第1配線基板に積層された第2絶縁基材および第2導体層パターンを有する第2配線基板と、導線を有する電線および該電線の端部を樹脂封止して前記第1配線基板に並置され前記第2配線基板が積層された樹脂封止部を有する電線部品とを備える電線複合プリント配線基板に適用される電線部品を製造する電線部品製造方法であって、前記導線を露出させて前記電線を準備する電線準備工程と、前記樹脂封止部から延長され前記第1導体層パターンに対向する導線用延長板部に前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続される接続孔を有する導線用延長端子と前記導線とを接続する導線用延長端子接続工程と、前記電線の端部を樹脂封止して前記導線用延長端子が有する前記接続孔を露出させた前記樹脂封止部を形成する樹脂封止工程とを備えることを特徴とする。   Moreover, the electric wire component manufacturing method according to the present invention includes a first wiring substrate having a first insulating base material and a first conductor layer pattern, a second insulating base material and a second conductor layer laminated on the first wiring substrate. A second wiring substrate having a pattern, an electric wire having a conductive wire, and an electric wire component having a resin sealing portion in which an end portion of the electric wire is resin-sealed and juxtaposed on the first wiring substrate and the second wiring substrate is laminated An electric wire component manufacturing method for manufacturing an electric wire component applied to an electric wire composite printed wiring board, the electric wire preparing step of exposing the conductive wire to prepare the electric wire, and extending from the resin sealing portion, For a conductor having a connection hole connected to the first conductor layer pattern through a conduction hole conductor formed in an interlayer conduction hole of the second insulating base material in a conductor extension plate facing the first conductor layer pattern The extension terminal and the conductor A conductive wire extension terminal connecting step, and a resin sealing step of resin-sealing the end portion of the electric wire to form the resin sealing portion exposing the connection hole of the conductive wire extension terminal. It is characterized by that.

この構成により、第1導体層パターンに対向して接続される接続孔を有する導線用延長端子を高精度に位置決めした電線部品を製造することが可能となる。   With this configuration, it is possible to manufacture an electric wire component in which a conductor extension terminal having a connection hole connected to face the first conductor layer pattern is positioned with high accuracy.

また、本発明に係る電子機器は、電線部品を接続された電線複合プリント配線基板を搭載した電子機器であって、前記電線複合プリント配線基板は、本発明に係る電線複合プリント配線基板であることを特徴とする。   Moreover, the electronic device according to the present invention is an electronic device equipped with an electric wire composite printed wiring board to which electric wire components are connected, and the electric wire composite printed wiring board is the electric wire composite printed wiring board according to the present invention. It is characterized by.

この構成により、導線(電線部品)と第1層導体層パターン(第1配線基板)との結合が強固であり、自由な立体配置が可能で、筐体形状を小型化、薄型化して所望の形状とすることが可能で接続の信頼性が高い電子機器とすることができる。   With this configuration, the connection between the conductive wire (electric wire component) and the first layer conductor layer pattern (first wiring board) is strong, and free three-dimensional arrangement is possible, and the housing shape is reduced in size and thickness to a desired level. The electronic device can be shaped and has high connection reliability.

本発明に係る電線複合プリント配線基板、電線複合プリント配線基板製造方法によれば、樹脂封止部から延長され第1導体層パターンに対向する導線用延長板部を有する導線用延長端子と導線とを接続し、導線用延長板部が有する接続孔を通過して第1導体層パターンに至る第2絶縁基材の層間導通孔に形成された導通孔導体を介して導線用延長板部と第1導体層パターンとを接続することから、導線(電線部品)と第1層導体層パターン(第1配線基板)とを容易かつ強固に接続して、自由な立体配置が可能で、信号伝送を確実に行なえ、電線部品と第1導体層パターンとの接続の信頼性を向上させるという効果を奏する。   According to the electric wire composite printed wiring board and the electric wire composite printed wiring board manufacturing method according to the present invention, a conductive wire extension terminal and a conductive wire having a conductive wire extension plate portion that extends from the resin sealing portion and faces the first conductor layer pattern. The conductor extension plate portion and the first conductor via the conduction hole conductor formed in the interlayer conduction hole of the second insulating base material that passes through the connection hole of the conductor extension plate portion and reaches the first conductor layer pattern. Since one conductor layer pattern is connected, the conductor (electric wire component) and the first layer conductor layer pattern (first wiring board) can be connected easily and firmly, enabling free three-dimensional arrangement and signal transmission. This can be performed reliably, and there is an effect that the reliability of the connection between the electric wire component and the first conductor layer pattern is improved.

また、本発明に係る電線部品、電線部品製造方法によれば、樹脂封止部から延長され第1導体層パターンに対向する導線用延長板部を有する導線用延長端子と導線とを接続し、導線用延長板部が有する接続孔を通過して第1導体層パターンに至る第2絶縁基材の層間導通孔に形成された導通孔導体を介して導線用延長板部と第1導体層パターンとを接続することことから、電線複合プリント配線基板に適用でき、第1層導体層パターン(第1配線基板)に対する導線の接続を容易かつ強固に行なうことが可能となるという効果を奏する。   Moreover, according to the electric wire component and the electric wire component manufacturing method according to the present invention, the conductive wire extension terminal having the conductive wire extension plate portion extended from the resin sealing portion and facing the first conductive layer pattern is connected to the conductive wire, The conductor extension plate portion and the first conductor layer pattern through the conduction hole conductor formed in the interlayer conduction hole of the second insulating base material that passes through the connection hole of the conductor extension plate portion and reaches the first conductor layer pattern. Can be applied to the electric wire composite printed wiring board, and there is an effect that the conductive wire can be easily and firmly connected to the first layer conductor layer pattern (first wiring board).

また、本発明に係る電子機器によれば、本発明に係る電線複合プリント配線基板を搭載することから、導線(電線部品)と第1層導体層パターン(第1配線基板)との結合が強固であり、自由な立体配置が可能で、筐体形状を小型化、薄型化して所望の形状とすることが可能で接続の信頼性が高い電子機器とすることができるという効果を奏する。   Further, according to the electronic device according to the present invention, since the electric wire composite printed wiring board according to the present invention is mounted, the connection between the conductor (electric wire component) and the first layer conductor layer pattern (first wiring board) is strong. Thus, free three-dimensional arrangement is possible, and the housing shape can be reduced in size and thickness to obtain a desired shape, thereby providing an electronic device with high connection reliability.

以下、本発明の実施の形態を図面に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<実施の形態1>
図1ないし図5Bに基づいて、本発明の実施の形態1に係る電線部品および電線部品製造方法について説明する。
<Embodiment 1>
Based on FIG. 1 thru | or FIG. 5B, the electric wire component and electric wire component manufacturing method which concern on Embodiment 1 of this invention are demonstrated.

なお、本実施の形態に係る電線部品は、第1絶縁基材11および第1導体層パターン12pを有する第1配線基板10と、第1配線基板10に積層された第2絶縁基材21および第2導体層パターン22pを有する第2配線基板20と、導線31cを有する電線31および電線31の端部を樹脂封止して第1配線基板10に並置され第2配線基板20が積層された樹脂封止部39(図4Aないし図4D参照)を有する電線部品30(図5A、図5B参照)とを備える電線複合プリント配線基板1(実施の形態2、図18参照。)に適用される。   The electric wire component according to the present embodiment includes a first wiring substrate 10 having a first insulating base material 11 and a first conductor layer pattern 12p, a second insulating base material 21 laminated on the first wiring substrate 10, and The second wiring board 20 having the second conductor layer pattern 22p, the electric wire 31 having the conductive wire 31c, and the end portion of the electric wire 31 are resin-sealed and juxtaposed with the first wiring board 10, and the second wiring board 20 is laminated. The present invention is applied to an electric wire composite printed wiring board 1 (see Embodiment 2 and FIG. 18) provided with an electric wire component 30 (see FIGS. 5A and 5B) having a resin sealing portion 39 (see FIGS. 4A to 4D). .

図1は、本発明の実施の形態1に係る電線部品を製造する電線部品製造方法の概略工程フローを示すフロー図である。   FIG. 1 is a flowchart showing a schematic process flow of a wire component manufacturing method for manufacturing a wire component according to Embodiment 1 of the present invention.

以下、各工程(S1ないしS4)について説明するが、各工程に対応する図2Aないし図5Bについても併せて説明する。   Hereinafter, although each process (S1 thru | or S4) is demonstrated, FIG. 2A thru | or FIG. 5B corresponding to each process is also demonstrated collectively.

工程S1:
図2Aおよび図2Bは、本発明の実施の形態1に係る電線部品が備える電線の構造を模式的に示す説明図であり、それぞれ(A)は正面図、(B)は先端側を示す側面図である。
Step S1:
2A and 2B are explanatory views schematically showing the structure of the electric wire provided in the electric wire component according to Embodiment 1 of the present invention, in which (A) is a front view and (B) is a side view showing the tip side, respectively. FIG.

電線部品30を構成する電線31を準備する(電線準備工程)。   The electric wire 31 which comprises the electric wire component 30 is prepared (electric wire preparation process).

電線31は、信号線を構成する導線31cおよび導線31cを絶縁して被覆する被覆部31hを有する。電線31は、被覆部31hの外周に配設された外側導線31sおよび外側導線31sを絶縁して被覆する外側被覆部31fをさらに有する同軸ケーブル(同軸電線)としてあることが好ましい。   The electric wire 31 has a conductor 31c constituting a signal line and a covering portion 31h that insulates and covers the conductor 31c. The electric wire 31 is preferably a coaxial cable (coaxial electric wire) further including an outer conductor 31s disposed on the outer periphery of the sheath 31h and an outer sheath 31f that insulates and coats the outer conductor 31s.

電線31の先端で外側被覆部31f、外側導線31s、被覆部31hを順次除去し、導線31cの端部を露出させて電線31を準備する。なお、電線準備工程で併せて、外側被覆部31fをさらに除去して外側導線31sの端部を露出させる。また、外側導線31sを部分的に除去して被覆部31hの端部を露出させる。外側導線31sは、信号線または遮蔽線として適用することが可能である。   The outer covering portion 31f, the outer conducting wire 31s, and the covering portion 31h are sequentially removed at the tip of the electric wire 31, and the end portion of the conducting wire 31c is exposed to prepare the electric wire 31. In addition, in the electric wire preparation process, the outer covering portion 31f is further removed to expose the end portion of the outer conductive wire 31s. Further, the outer conductive wire 31s is partially removed to expose the end portion of the covering portion 31h. The outer conducting wire 31s can be applied as a signal line or a shielding line.

図2Aに示した電線31は、導線31cを単線、導線31cに対して被覆部31hにより絶縁され同軸に配設された外側導線31sを編組線とした同軸電線である。外側導線31sを編組線で構成することにより、電線31の柔軟性を確保することが可能となる。   The electric wire 31 shown in FIG. 2A is a coaxial electric wire in which the conducting wire 31c is a single wire, and the outer conducting wire 31s arranged coaxially and insulated from the conducting wire 31c by the covering portion 31h is a braided wire. By configuring the outer conductor 31s with a braided wire, the flexibility of the electric wire 31 can be ensured.

図2Bに示した電線31は、基本的には図2Aに示した電線31と同様であるので主に異なる点について説明する。導線31cを編組線とした同軸電線である。外側導線31sに加えて導線31cも編組線で構成することにより、電線31の柔軟性をさらに向上させることが可能となる。   Since the electric wire 31 shown in FIG. 2B is basically the same as the electric wire 31 shown in FIG. 2A, different points will be mainly described. This is a coaxial electric wire in which the conducting wire 31c is a braided wire. In addition to the outer conductor 31s, the conductor 31c is also formed of a braided wire, whereby the flexibility of the electric wire 31 can be further improved.

なお、図2Bに示した電線31では、導線31cは、絶縁性心材31bの周囲に配設されて円筒状とされた編組線で構成してある。この構成により、導線31cを構成する編組線の形状を円筒状に保持することが可能となり、柔軟性と形態性を確保した電線31とすることができる。   In addition, in the electric wire 31 shown in FIG. 2B, the conducting wire 31c is formed of a braided wire that is disposed around the insulating core material 31b and has a cylindrical shape. With this configuration, the shape of the braided wire constituting the conducting wire 31c can be held in a cylindrical shape, and the electric wire 31 can be secured with flexibility and formability.

導線31cは、信号線であることから、導通抵抗が低いこと、柔軟性があること、また、劣化しにくいことが好ましい。例えば、銅または銅合金などに錫メッキなどを施したものを適用することができる。なお、上述したとおり、単線、編組線いずれでも良い。   Since the conducting wire 31c is a signal wire, it is preferable that the conducting resistance is low, that the conducting wire 31c is flexible, and that the conducting wire 31c is not easily deteriorated. For example, a copper or copper alloy that is tin-plated can be used. As described above, either a single wire or a braided wire may be used.

被覆部31hは、耐熱性があること、吸湿性が低いこと、柔軟性があること、また、電気特性(絶縁性)が優れていることが好ましい。例えば、フッ素系樹脂などを適用することができる。   The covering portion 31h preferably has heat resistance, low hygroscopicity, flexibility, and excellent electrical characteristics (insulating properties). For example, a fluorine resin or the like can be applied.

外側導線31sは、導通抵抗が低いこと、柔軟性があること、また、劣化しにくいことが好ましい。例えば、銅または銅合金などに錫メッキなどを施したものを適用することができる。また、外側導線31sを編組線で構成することにより、通常の撚り線に比較して柔軟性と強度をさらに向上させることが可能となる。   The outer conductor 31s preferably has a low conduction resistance, is flexible, and is hardly deteriorated. For example, a copper or copper alloy that is tin-plated can be used. Moreover, it becomes possible to further improve a softness | flexibility and an intensity | strength compared with a normal strand wire by comprising the outer side conducting wire 31s with a braided wire.

外側被覆部31fは、被覆部31hと同様に、耐熱性があること、吸湿性が低いこと、柔軟性があること、また、電気特性(絶縁性)が優れていることが好ましい。例えば、フッ素系樹脂などを適用することができる。   The outer covering portion 31f, like the covering portion 31h, preferably has heat resistance, low hygroscopicity, flexibility, and excellent electrical characteristics (insulating properties). For example, a fluorine resin or the like can be applied.

同軸状とした電線31は、内部に空気が残留しないように形成することが好ましい。例えば、被覆部31h、外側被覆部31fによって導線31c、外側導線31sとの隙間を充填することが好ましい。   It is preferable to form the coaxial electric wire 31 so that air does not remain inside. For example, it is preferable to fill a gap between the lead wire 31c and the outer lead wire 31s with the covering portion 31h and the outer covering portion 31f.

なお、導線31c、外側導線31sは、金属線そのものでなく、線状体(あるいは帯状体)に蒸着や鍍金などで線状導体を構成したものを適用することも可能である。   The conducting wire 31c and the outer conducting wire 31s can be applied to a linear body (or a strip-like body) in which a linear conductor is formed by vapor deposition or plating instead of the metal wire itself.

工程S2:
図3Aは、本発明の実施の形態1に係る電線部品の中間品としての実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。図3Bは、図3Aに示した電線部品の中間品での導線用延長端子の実施例を示す説明図であり、(A)は分解斜視図、(B)は導線用延長端子を導線に接続した状態を示す斜視図である。
Step S2:
FIG. 3A is an explanatory view schematically showing an example as an intermediate product of the electric wire component according to Embodiment 1 of the present invention, where (A) is a plan view, (B) is a front view, and (C) is a front view. It is a side view which shows the front end side. 3B is an explanatory view showing an embodiment of an extension terminal for conducting wire in the intermediate product of the electric wire part shown in FIG. 3A, (A) is an exploded perspective view, and (B) is a connection of the extension terminal for conducting wire to the conducting wire. It is a perspective view which shows the state which carried out.

準備した電線31(導線31c)に導線用延長端子32を接続する(導線用延長端子接続工程)。なお、電線31としては、例えば図2Bに示したものを適用して説明する(以下において同様である。)。   The conductor extension terminal 32 is connected to the prepared electric wire 31 (conductor 31c) (conductor extension terminal connecting step). The electric wire 31 will be described by applying, for example, the one shown in FIG. 2B (the same applies below).

導線31cは、樹脂封止部39(図4Aないし図4D参照)から延長され第1導体層パターン12pに対向する導線用延長板部32fを有する導線用延長端子32と接続される。導線用延長端子32は、相互に接続された導線用延長板部32fと導線用接続部32cとを備える。本実施例では、導線用延長板部32fと導線用接続部32cは、板金加工により一体に形成してある。導線用接続部32cは、矢符Fc方向(図3B(A))で湾曲され電線31(導線31c)を挟持する。したがって、導線用延長端子32は、導線用接続部32cにより導線31cに接続される。   The conducting wire 31c is connected to the conducting wire extension terminal 32 having a conducting wire extension plate portion 32f extending from the resin sealing portion 39 (see FIGS. 4A to 4D) and facing the first conductor layer pattern 12p. The conducting wire extension terminal 32 includes a conducting wire extension plate portion 32f and a conducting wire connection portion 32c which are connected to each other. In this embodiment, the conductive wire extension plate portion 32f and the conductive wire connection portion 32c are integrally formed by sheet metal processing. The conductor connecting portion 32c is bent in the direction of the arrow Fc (FIG. 3B (A)) and sandwiches the electric wire 31 (conductor 31c). Therefore, the extension terminal 32 for conducting wire is connected to the conducting wire 31c by the connection part 32c for conducting wire.

導線用延長板部32fは、第2絶縁基材21の層間導通孔40(図13参照)に形成された導通孔導体41(図14参照)を介して第1導体層パターン12pに接続される接続孔32hを有する。また、導線用延長板部32fは、導通孔導体41により第2導体層パターン22pとも接続される構成としてある(図14参照)。   The conductive wire extension plate portion 32f is connected to the first conductor layer pattern 12p via a conduction hole conductor 41 (see FIG. 14) formed in the interlayer conduction hole 40 (see FIG. 13) of the second insulating base material 21. It has a connection hole 32h. The conductive wire extension plate 32f is also connected to the second conductor layer pattern 22p by the conduction hole conductor 41 (see FIG. 14).

電線部品30は、第1導体層パターン12pに平面状に対向して積層される導線用延長板部32fを備え、導線用延長板部32fは、第1導体層パターン12pに対して高精度に位置合わせすることが可能な接続孔32hを有する。したがって、電線部品30は、電線複合プリント配線基板1に適用でき、第1層導体層パターン12p(第1配線基板10)に対する導線31cの接続を容易かつ強固に行なうことが可能となる。   The electric wire component 30 includes a conductive wire extension plate portion 32f laminated in a planar manner facing the first conductor layer pattern 12p, and the conductive wire extension plate portion 32f is highly accurate with respect to the first conductor layer pattern 12p. It has a connection hole 32h that can be aligned. Therefore, the electric wire component 30 can be applied to the electric wire composite printed wiring board 1 and can easily and firmly connect the conductive wire 31c to the first layer conductor layer pattern 12p (first wiring board 10).

導線用延長端子接続工程では、併せて、外側導線用交差端子35と外側導線31sとを接続することが可能である。外側導線31sは、電線31と交差して樹脂封止部39の表面に露出させて配設される外側導線用交差端部35pを有する外側導線用交差端子35と接続される。なお、外側導線用交差端部35pは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第2導体層パターン22pに接続される構成としてある(図15A参照)。   In the conductor extension terminal connection step, the outer conductor intersection terminal 35 and the outer conductor 31s can be connected together. The outer conducting wire 31 s is connected to the outer conducting wire intersecting terminal 35 having the outer conducting wire intersecting end portion 35 p that is arranged to be exposed on the surface of the resin sealing portion 39 so as to intersect the electric wire 31. The outer conductor crossing end 35p is configured to be connected to the second conductor layer pattern 22p via a conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base 21 (see FIG. 15A). ).

外側導線用交差端子35によって、両面配線構造とされた第1配線基板10の各面にそれぞれ積層された第2導体層パターン22pを相互に接続できることから、多層(4層)構造とされた電線複合プリント配線基板1での第2導体層パターン22pの配線自由度を向上させることが可能となる。   Since the second conductor layer pattern 22p laminated on each surface of the first wiring board 10 having a double-sided wiring structure can be connected to each other by the outer conductive wire crossing terminal 35, the electric wire having a multilayer (four-layer) structure It becomes possible to improve the degree of freedom of wiring of the second conductor layer pattern 22p on the composite printed wiring board 1.

また、電線31(外側導線31s)の信号(電位)を導線31cから離れて導線31cを覆う位置にある第2導体層パターン22pに供給(印加)することにより、導線31cに対する外部からの電気的影響を排除することが可能な電線部品30とすることができる。   Further, by supplying (applying) a signal (potential) of the electric wire 31 (outer conductor 31s) to the second conductor layer pattern 22p located at a position that covers the conductor 31c away from the conductor 31c, an electric signal from the outside to the conductor 31c is supplied. It can be set as the electric wire component 30 which can exclude an influence.

なお、外側導線用交差端部35pは、第2導体層パターン22pとの接続を容易かつ高精度に行なうために第2導体層パターン22pに対向した平面状としてある。つまり、外側導線用交差端子35は、外形を直方体として構成し、中央部に電線31を貫通させて外側導線31sと接続される構成とする。なお、外側導線用交差端子35は、外側導線用交差端部35pによって第2導体層パターン22pに接続できる形状であれば良く直方体に限らない。   The outer conductor crossing end portion 35p has a planar shape facing the second conductor layer pattern 22p in order to easily and accurately connect the second conductor layer pattern 22p. That is, the outer conductor crossing terminal 35 has an outer shape configured as a rectangular parallelepiped, and is configured to be connected to the outer conductor 31s through the electric wire 31 in the center. The outer conductor crossing terminal 35 is not limited to a rectangular parallelepiped as long as it has a shape that can be connected to the second conductor layer pattern 22p by the outer conductor crossing end 35p.

図3Cは、本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。   3C is an explanatory view schematically showing another example as an intermediate product of the electric wire component according to Embodiment 1 of the present invention, in which (A) is a plan view, (B) is a front view, and (C ) Is a side view showing the tip side.

外側導線用交差端子35は、図3Aの場合と同様の構成としてある。導線用延長端子32は、図3A、図3Bの場合と異ならせた構成としてある。以下、主に異なる点について説明する。   The outer conductor crossing terminal 35 has the same configuration as in FIG. 3A. The conducting wire extension terminal 32 is configured differently from the case of FIGS. 3A and 3B. Hereinafter, mainly different points will be described.

導線用延長端子32は、導線用接続部32cに対して配線基板(第1配線基板10および第2配線基板20)の積層方向で高さHfを有するように導線用延長板部32fを導線用接続部32cから延長して導線用延長板部32fを樹脂封止部39から突出させる構成としてある(図4A参照)。導線用延長板部32fを樹脂封止部39から突出させることにより、第1配線基板10(第1導体層パターン12p)に対する位置合わせを容易に行なうことが可能となる。また、第1配線基板10の厚さが厚い場合にも容易に接続することが可能となる。   The conductor extension terminal 32f has a height Hf in the stacking direction of the wiring boards (the first wiring board 10 and the second wiring board 20) with respect to the conductor connecting portion 32c. The conductive wire extension plate portion 32f extends from the connection portion 32c and protrudes from the resin sealing portion 39 (see FIG. 4A). By projecting the conductive wire extension plate portion 32f from the resin sealing portion 39, it is possible to easily align the first wiring substrate 10 (the first conductor layer pattern 12p). Further, even when the thickness of the first wiring board 10 is thick, it is possible to easily connect.

また、導線用接続部32cは、外形を直方体または円筒として構成し、中央部に電線31を貫通させて外側導線31sと接続される構成とする。この構成により、導線用接続部32cを折り曲げ加工する必要が無くなり工程を簡略化することができる。導線用接続部32cと導線用延長板部32fとは、個別に形成されたものを溶着などにより適宜接続し導線用延長端子32として一体化してある。   Moreover, the connection part 32c for conducting wires has a configuration in which the outer shape is configured as a rectangular parallelepiped or a cylinder, and is connected to the outer conducting wire 31s by passing the electric wire 31 through the center. With this configuration, it is not necessary to bend the conductive wire connection portion 32c, and the process can be simplified. The conducting wire connection portion 32c and the conducting wire extension plate portion 32f are integrally formed as a conducting wire extension terminal 32 by appropriately connecting individually formed members by welding or the like.

図3Dは、本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。   3D is an explanatory view schematically showing another example as an intermediate product of the electric wire component according to Embodiment 1 of the present invention, in which (A) is a plan view, (B) is a front view, and (C ) Is a side view showing the tip side.

外側導線用交差端子35は、図3Aの場合と同様の構成としてある。導線用延長端子32は、図3Cの場合と異ならせた構成としてある。以下、主に異なる点について説明する。   The outer conductor crossing terminal 35 has the same configuration as in FIG. 3A. The conducting wire extension terminal 32 is configured differently from the case of FIG. 3C. Hereinafter, mainly different points will be described.

導線用延長端子32は、図3Cの場合に設けた高さHfを設定しない構成としてある。つまり、配線基板の積層方向(第1配線基板10に対する第2配線基板20の積層方向)で、導線用延長板部32fは、導線用延長板部32fの板厚方向で樹脂封止部39に埋設された形態とすることが可能となる(図4Bないし図4D参照。)。導線用延長板部32fは、樹脂封止部39から延長され、第1導体層パターン12pに対向する構成としてある。   The conducting wire extension terminal 32 is configured not to set the height Hf provided in the case of FIG. 3C. That is, in the wiring board stacking direction (stacking direction of the second wiring board 20 with respect to the first wiring board 10), the conductive wire extension plate portion 32f is connected to the resin sealing portion 39 in the thickness direction of the conductive wire extension plate portion 32f. It becomes possible to set it as the embedded form (refer FIG. 4B thru | or FIG. 4D). The conductive wire extension plate portion 32f extends from the resin sealing portion 39 and faces the first conductor layer pattern 12p.

また、導線用延長端子32(導線用接続部32c、導線用延長板部32f)は、配線基板の積層方向で電線31(導線31c)に対して対称的に配設され、接続されている。つまり、電線31(導線用延長端子32)は、第2配線基板20の積層方向で対称的に接続される構成としてあり、第1配線基板10の両面にそれぞれ形成された第1導体層パターン12p、それぞれの第1導体層パターン12pに積層された第2導体層パターン22pに対して対称的にそれぞれ接続される構成としてある。なお、第2配線基板20の積層方向での電線部品30の対称性は、以下に説明する各構成についても同様とすることが可能である。   In addition, the conductive wire extension terminals 32 (conductive wire connection portion 32c, conductive wire extension plate portion 32f) are disposed symmetrically with respect to the electric wire 31 (conductive wire 31c) in the stacking direction of the wiring board. That is, the electric wires 31 (conductive wire extension terminals 32) are configured to be symmetrically connected in the stacking direction of the second wiring board 20, and the first conductor layer patterns 12p formed on both surfaces of the first wiring board 10, respectively. The second conductor layer pattern 22p stacked on each first conductor layer pattern 12p is connected to each other symmetrically. In addition, the symmetry of the electric wire component 30 in the stacking direction of the second wiring board 20 can be the same for each configuration described below.

配線基板の積層方向で対称的に配設された導線用延長板部32fの間に第1配線基板10を配設することが可能となり(図10、図11参照)、電線31をより強固に電線複合プリント配線基板1に接続することができる。また、多層(4層)構造の配線基板(第1配線基板10および第2配線基板20)の各導体層パターン(第1導体層パターン12pおよび第2導体層パターン22p)に対して積層方向で対称的に接続された電線部品30を有する電線複合プリント配線基板1とすることが可能となる。   It becomes possible to arrange the first wiring board 10 between the conductive wire extension plate portions 32f arranged symmetrically in the wiring board stacking direction (see FIGS. 10 and 11), and the electric wire 31 is made stronger. It can be connected to the electric wire composite printed wiring board 1. Further, in the stacking direction with respect to each conductor layer pattern (first conductor layer pattern 12p and second conductor layer pattern 22p) of the multilayer (four-layer) structure wiring substrate (first wiring substrate 10 and second wiring substrate 20). It becomes possible to set it as the electric wire composite printed wiring board 1 which has the electric wire components 30 connected symmetrically.

外側導線用交差端子35(外側導線用交差端部35p)は、導線用延長端子32と同様に、配線基板の積層方向で電線31(導線31c)に対して対称的に配設してある。つまり、電線31(外側導線用交差端子35)は、第2配線基板20の積層方向で対称的に接続される構成としてあり、外側導線用交差端部35pは、第1配線基板10の両面に積層されたそれぞれの第2導体層パターン22pに対してそれぞれ対称的に接続することが可能となる。   The outer conductor crossing terminal 35 (outer conductor crossing end 35p) is arranged symmetrically with respect to the electric wire 31 (conductor 31c) in the wiring board stacking direction, like the conductor extension terminal 32. That is, the electric wires 31 (outer conducting wire intersection terminals 35) are configured to be symmetrically connected in the stacking direction of the second wiring board 20, and the outer conducting wire intersection ends 35p are formed on both surfaces of the first wiring board 10. It becomes possible to connect symmetrically to each of the stacked second conductor layer patterns 22p.

図3Eは、本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。   FIG. 3E is explanatory drawing which shows typically the other Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C ) Is a side view showing the tip side.

導線用延長端子32(導線用延長板部32f、導線用接続部32c)は、図3Dの場合と同様の構成としてある。図3Aで示した外側導線用交差端子35に対して、外側導線用延長板部34f、外側導線用接続部34cを有する外側導線用延長端子34を外側導線31sに接続するとした点が異なる。以下、主に異なる点について説明する。   The conductive wire extension terminal 32 (conductive wire extension plate portion 32f, conductive wire connection portion 32c) has the same configuration as in FIG. 3D. The outer conductor crossing terminal 35 shown in FIG. 3A is different in that an outer conductor extension terminal 34 having an outer conductor extension plate part 34f and an outer conductor connection part 34c is connected to the outer conductor 31s. Hereinafter, mainly different points will be described.

外側導線31sは、樹脂封止部39(図4B参照)から延長され第1導体層パターン12pに対向する外側導線用延長板部34fを有する外側導線用延長端子34と接続される。外側導線用延長端子34は、相互に接続された外側導線用延長板部34fと外側導線用接続部34cとを備える。外側導線用接続部34cは、外形を直方体または円筒として構成し、中央部に電線31を貫通させて外側導線31sと接続される構成としてある。外側導線用接続部34cと外側導線用延長板部34fとは、個別に形成され溶着などにより適宜接続し外側導線用延長端子34として一体化してある。外側導線用接続部34cと外側導線用延長板部34fとは、板金加工により一体に形成することも可能である。   The outer conductor 31s is connected to an outer conductor extension terminal 34 that has an outer conductor extension plate 34f that extends from the resin sealing portion 39 (see FIG. 4B) and faces the first conductor layer pattern 12p. The outer conductor extension terminal 34 includes an outer conductor extension plate part 34f and an outer conductor connection part 34c connected to each other. The outer conductive wire connecting portion 34c is configured to have a rectangular parallelepiped shape or a cylindrical outer shape and to be connected to the outer conductive wire 31s through the electric wire 31 in the central portion. The outer conductor connecting portion 34c and the outer conductor extension plate portion 34f are individually formed and appropriately connected by welding or the like and integrated as an outer conductor extension terminal 34. The outer conductor connecting portion 34c and the outer conductor extension plate 34f can be integrally formed by sheet metal processing.

なお、導線用延長端子接続工程で、導線用延長端子32と導線31cの接続に併せて、外側導線用延長端子34と外側導線31sとを接続する構成としてある。   In the lead wire extension terminal connecting step, the lead wire extension terminal 34 and the lead wire 31c are connected together with the lead wire extension terminal 32 and the lead wire 31c.

外側導線用延長板部34fは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続される接続孔34hを有する。また、外側導線用延長板部34fは、導通孔導体41により第2導体層パターン22pとも接続される構成としてある(図14参照)。   The outer conductive wire extension plate portion 34 f has a connection hole 34 h connected to the first conductor layer pattern 12 p via a conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base material 21. Further, the outer conductive wire extension plate part 34f is configured to be connected to the second conductor layer pattern 22p by the conduction hole conductor 41 (see FIG. 14).

したがって、電線部品30は、電線複合プリント配線基板1に適用でき、第1層導体層パターン12p(第1配線基板10)に対する外側導線31s(電線部品31)の接続を容易かつ強固に行なうことが可能となる。   Therefore, the electric wire component 30 can be applied to the electric wire composite printed wiring board 1, and the outer conductive wire 31s (electric wire component 31) can be easily and firmly connected to the first conductor layer pattern 12p (first wiring substrate 10). It becomes possible.

外側導線用延長板部34fは、外側導線用接続部34cから反対方向へそれぞれ延長され、導線用延長板部32fと同様に第1配線基板10に対向させて導線用延長板部32fの両側に対称的に並置してある。この構成により、電線31から互いに反対方向で離れた位置にある第1導体層パターン12pそれぞれを外側導線用延長端子34によって電線31と交差させて接続し、外側導線用延長端子34を中継部として作用させて導線用延長端子32の周囲に配置された第1導体層パターン12pの配線自由度を向上させる電線部品30とすることが可能となる。   The outer conductive wire extension plate portions 34f extend in opposite directions from the outer conductive wire connection portions 34c, respectively, and are opposed to the first wiring board 10 on both sides of the conductive wire extension plate portions 32f in the same manner as the conductive wire extension plate portions 32f. Symmetrically juxtaposed. With this configuration, each of the first conductor layer patterns 12p located at positions separated from each other in the opposite direction from the electric wire 31 is connected to the electric wire 31 by crossing the outer conductive wire extension terminal 34, and the outer conductive wire extension terminal 34 is used as a relay portion. The electric wire component 30 that improves the degree of freedom of wiring of the first conductor layer pattern 12p disposed around the conductive wire extension terminal 32 can be obtained.

外側導線用延長端子34(外側導線用接続部34c、外側導線用延長板部34f)は、導線用延長端子32と同様に、配線基板の積層方向で電線31(導線31c、外側導線31s)に対して対称的に配設され、接続されている。つまり、電線31(外側導線用延長端子34)は、第2配線基板20の積層方向で対称的に接続される構成としてあり、外側導線用延長板部34fは、第1配線基板10の両面にそれぞれ形成された第1導体層パターン12p、それぞれの第1導体層パターン12pに積層された第2導体層パターン22pに対して対称的にそれぞれ接続される構成としてある。   The outer conductor extension terminal 34 (outer conductor connection portion 34c, outer conductor extension plate portion 34f) is connected to the electric wire 31 (conductor 31c, outer conductor 31s) in the wiring board stacking direction, like the conductor extension terminal 32. They are symmetrically arranged and connected. That is, the electric wires 31 (external conductor extension terminals 34) are configured to be symmetrically connected in the stacking direction of the second wiring board 20, and the outer conductor extension plates 34f are provided on both surfaces of the first wiring board 10. Each of the first conductor layer patterns 12p formed and the second conductor layer pattern 22p stacked on each first conductor layer pattern 12p are connected symmetrically.

したがって、多層(4層)構造の配線基板(第1配線基板10および第2配線基板20)の各導体層パターン(第1導体層パターン12pおよび第2導体層パターン22p)に対して積層方向で対称的に接続された電線部品30を有する電線複合プリント配線基板1とすることが可能となる。   Therefore, in the stacking direction with respect to each conductor layer pattern (first conductor layer pattern 12p and second conductor layer pattern 22p) of the multilayer (four-layer) structure wiring board (first wiring board 10 and second wiring board 20). It becomes possible to set it as the electric wire composite printed wiring board 1 which has the electric wire components 30 connected symmetrically.

図3Fは、本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。   3F is an explanatory view schematically showing another example as an intermediate product of the electric wire component according to Embodiment 1 of the present invention, in which (A) is a plan view, (B) is a front view, (C ) Is a side view showing the tip side.

導線用延長端子32(導線用延長板部32f、導線用接続部32c)は、図3Dの場合と同様の構成としてある。また、外側導線用延長端子34(外側導線用延長板部34f、外側導線用接続部34c)は、図3Eと基本的には同様の構成としてあり、接続孔34hを複数配設した点が異なる。以下、主に異なる点について説明する。   The conductive wire extension terminal 32 (conductive wire extension plate portion 32f, conductive wire connection portion 32c) has the same configuration as in FIG. 3D. Further, the outer conductor extension terminal 34 (outer conductor extension plate part 34f, outer conductor connection part 34c) has basically the same configuration as that shown in FIG. 3E, except that a plurality of connection holes 34h are provided. . Hereinafter, mainly different points will be described.

外側導線用延長板部34fは、外側導線用延長板部34fの延長方向(導線用延長板部32fの延長方向と平行な方向)に沿って複数分散して形成された接続孔34hを有することから、対応する複数の箇所で、対応する第1導体層パターン12p(および第2導体層パターン22p)と接続される。   The outer conductor extension plate portion 34f has a plurality of connection holes 34h formed in a distributed manner along the extension direction of the outer conductor extension plate portion 34f (the direction parallel to the extension direction of the conductor extension plate portion 32f). To the corresponding first conductor layer pattern 12p (and the second conductor layer pattern 22p) at a plurality of corresponding locations.

したがって、第1導体層パターン12p(および第2導体層パターン22p)の配置状態に応じた自由度の高い接続が可能な電線部品30となる。また、複数の箇所での接続孔34hによる接続が同一の第1導体層パターン12p(および第2導体層パターン22p)に対して行なわれるときは、同一の配線パターンに対して複数の接続を異なる位置で行なうことから、相互接続の信頼性を向上させ、また、第1導体層パターン12pおよび第2導体層パターン22pの抵抗による影響を抑制することが可能となる。   Accordingly, the electric wire component 30 can be connected with a high degree of freedom according to the arrangement state of the first conductor layer pattern 12p (and the second conductor layer pattern 22p). In addition, when the connection by the connection holes 34h at a plurality of locations is performed on the same first conductor layer pattern 12p (and the second conductor layer pattern 22p), the plurality of connections are different for the same wiring pattern. Since it is performed at the position, it is possible to improve the reliability of interconnection and to suppress the influence of the resistance of the first conductor layer pattern 12p and the second conductor layer pattern 22p.

例えば、本実施例で示すように、電線31の延長方向に対して外側導線用延長板部34fを延長し、外側導線用延長板部34fの延長方向で複数の接続孔34hを配置した場合、外側導線用延長板部34fの延長方向に対応させた電線部品配置用開口部10wを配置し、第1導体層パターン12pを電線部品配置用開口部10wに沿った配線パターンとすることが可能となる。なお、このときの第1導体層パターン12pは、例えば接続孔34hすべてに対応する1つの配線パターンであっても良いし、各接続孔34hそれぞれに個別に対応して電線31と交差する方向に配置された複数の配線パターンであっても良い。   For example, as shown in the present embodiment, when the outer conductive wire extension plate portion 34f is extended with respect to the extending direction of the electric wire 31, and a plurality of connection holes 34h are arranged in the extending direction of the outer conductive wire extension plate portion 34f, It is possible to arrange the wire component placement opening 10w corresponding to the extending direction of the outer conductive wire extension plate portion 34f and make the first conductor layer pattern 12p a wiring pattern along the wire component placement opening 10w. Become. The first conductor layer pattern 12p at this time may be, for example, one wiring pattern corresponding to all the connection holes 34h, or in a direction intersecting with the electric wires 31 corresponding to each connection hole 34h individually. A plurality of arranged wiring patterns may be used.

この構成により、電線31から互いに反対方向で離れた位置にある第1導体層パターン12pそれぞれを外側導線用延長端子34によって電線31と交差させて接続し、外側導線用延長端子34を中継部として作用させて導線用延長端子32の周囲に配置された第1導体層パターン12pの配線自由度を向上させる電線部品30とすることが可能となる。また、電線部品30を電線部品30に沿った形状の電線部品配置用開口部10wに配置することから、電線部品30の電線複合プリント配線基板1に対する結合強度を向上させて信頼性をさらに向上させることが可能となる。   With this configuration, each of the first conductor layer patterns 12p located at positions separated from each other in the opposite direction from the electric wire 31 is connected to the electric wire 31 by crossing the outer conductive wire extension terminal 34, and the outer conductive wire extension terminal 34 is used as a relay portion. The electric wire component 30 that improves the degree of freedom of wiring of the first conductor layer pattern 12p disposed around the conductive wire extension terminal 32 can be obtained. Moreover, since the electric wire component 30 is arrange | positioned in the electric wire component arrangement | positioning opening part 10w of the shape along the electric wire component 30, the joint strength with respect to the electric wire composite printed wiring board 1 of the electric wire component 30 is improved, and reliability is improved further. It becomes possible.

図3Gは、本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。   FIG. 3G is explanatory drawing which shows typically the other Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C ) Is a side view showing the tip side.

導線用延長端子32(導線用延長板部32f、導線用接続部32c)は、図3Dの場合と同様の構成としてある。また、外側導線用交差端子35は、図3Aの場合と同様の構成としてある。図3Dの場合に対して、被覆部31hに被覆部用延長板部33f、被覆部用結合部33cを有する被覆部用延長端子33を結合した点が異なる。以下、主に異なる点について説明する。   The conductive wire extension terminal 32 (conductive wire extension plate portion 32f, conductive wire connection portion 32c) has the same configuration as in FIG. 3D. Further, the outer conductor crossing terminal 35 has the same configuration as in FIG. 3A. 3D is different from the case of FIG. 3D in that a covering portion extension terminal 33 having a covering portion extension plate portion 33f and a covering portion coupling portion 33c is coupled to the covering portion 31h. Hereinafter, mainly different points will be described.

被覆部31hは、樹脂封止部39から延長され第1導体層パターン12pに対向する被覆部用延長板部33fを有する被覆部用延長端子33と結合される。被覆部用延長端子33は、相互に接続された被覆部用延長板部33fと被覆部用結合部33cとを備える。被覆部用結合部33cは、外形を直方体または円筒として構成し、中央部に電線31を貫通させて被覆部31hと結合される構成としてある。被覆部用結合部33cと被覆部用延長板部33fとは、個別に形成され溶着などにより適宜接続し被覆部用延長端子33として一体化してある。なお、被覆部用結合部33cと被覆部用延長板部33fとは、板金加工により一体に形成することも可能である。   The covering portion 31h is coupled to the covering portion extension terminal 33 having the covering portion extension plate portion 33f that extends from the resin sealing portion 39 and faces the first conductor layer pattern 12p. The covering portion extension terminal 33 includes a covering portion extension plate portion 33f and a covering portion coupling portion 33c which are connected to each other. The connecting portion 33c for the covering portion is configured to have a rectangular parallelepiped shape or a cylindrical shape, and to be connected to the covering portion 31h with the electric wire 31 passing through the center portion. The covering portion coupling portion 33c and the covering portion extension plate portion 33f are individually formed and appropriately connected by welding or the like, and are integrated as the covering portion extension terminal 33. The covering portion coupling portion 33c and the covering portion extension plate portion 33f can be integrally formed by sheet metal processing.

なお、導線用延長端子接続工程で、導線用延長端子32と導線31cの接続に併せて、被覆部用延長端子33と被覆部31hとを結合する構成としてある。   In the lead wire extension terminal connection step, the covering portion extension terminal 33 and the covering portion 31h are coupled together with the connection of the lead wire extension terminal 32 and the lead wire 31c.

被覆部用延長板部33fは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続される接続孔33hを有する。また、被覆部用延長板部33fは、導通孔導体41により第2導体層パターン22pとも接続される構成としてある(図14参照)。   The extension plate portion 33 f for the covering portion has a connection hole 33 h that is connected to the first conductor layer pattern 12 p via a conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base material 21. Further, the covering extension plate 33f is connected to the second conductor layer pattern 22p by the conduction hole conductor 41 (see FIG. 14).

被覆部用延長板部33fは、被覆部用結合部33cから反対方向へそれぞれ延長され、導線用延長板部32fと同様に第1配線基板10に対向させて導線用延長板部32fの両側に対称的に並置してある。この構成により、電線31から互いに反対方向で離れた位置にある第1層導体層パターン12pそれぞれを被覆部用延長端子33によって電線31と交差させて接続し、被覆部用延長端子33を中継部として作用させて導線用延長端子32の周囲に配置された第1導体層パターン12pの配線自由度を向上させる電線部品とすることが可能となる。   The extension plate portion 33f for the covering portion is extended in the opposite direction from the coupling portion 33c for the covering portion, and is opposite to the first wiring board 10 in the same direction as the extension plate portion 32f for the lead wire, on both sides of the extension plate portion 32f for the lead wire. Symmetrically juxtaposed. With this configuration, the first layer conductor layer patterns 12p located at positions away from each other in the opposite direction from the electric wire 31 are connected to the electric wire 31 so as to cross each other by the covering portion extension terminal 33, and the covering portion extension terminal 33 is connected to the relay portion. Thus, it is possible to provide an electric wire component that improves the degree of freedom of wiring of the first conductor layer pattern 12p disposed around the extension terminal 32 for conducting wire.

被覆部用延長端子33(被覆部用延長板部33f)は、導線用延長端子32と同様に、配線基板の積層方向で電線31(導線31c)に対して対称的に配設され、接続されている。つまり、電線31(被覆部用延長端子33)は、第2配線基板20の積層方向で対称的に接続される構成としてあり、第1配線基板10の両面にそれぞれ形成された第1導体層パターン12p、それぞれの第1導体層パターン12pに積層された第2導体層パターン22pに対して対称的にそれぞれ接続される構成としてある。   The covering portion extension terminal 33 (covering portion extension plate portion 33f) is disposed symmetrically with respect to the electric wire 31 (the conducting wire 31c) in the direction of stacking of the wiring boards in the same manner as the conducting wire extension terminal 32. ing. That is, the electric wires 31 (covering portion extension terminals 33) are configured to be symmetrically connected in the stacking direction of the second wiring board 20, and the first conductor layer patterns formed on both surfaces of the first wiring board 10, respectively. 12p is configured to be symmetrically connected to the second conductor layer pattern 22p stacked on each first conductor layer pattern 12p.

図3Hは、本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。   FIG. 3H is explanatory drawing which shows typically the other Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C ) Is a side view showing the tip side.

導線用延長端子32(導線用延長板部32f、導線用接続部32c)は、図3Dの場合と同様の構成としてある。また、被覆部用延長端子33(被覆部用延長板部33f、被覆部用結合部33c)は、図3Gの場合と同様の構成としてある。また、外側導線用延長交差端子36は、図3Aの場合での外側導線用交差端子35および外側導線用交差端部35pに対して電線31と交差する方向で延長してある外側導線用延長交差端部36pを有する点が異なる。以下、主に異なる点について説明する。   The conductive wire extension terminal 32 (conductive wire extension plate portion 32f, conductive wire connection portion 32c) has the same configuration as in FIG. 3D. Further, the covering portion extension terminal 33 (the covering portion extension plate portion 33f and the covering portion coupling portion 33c) has the same configuration as that of FIG. 3G. Further, the outer conductor extended intersection terminal 36 is extended in the direction intersecting the electric wire 31 with respect to the outer conductor intersection terminal 35 and the outer conductor intersection end portion 35p in the case of FIG. 3A. The point which has the edge part 36p differs. Hereinafter, mainly different points will be described.

外側導線31sは、電線31と交差する方向で延長され樹脂封止部39(図4D参照)の表面に配設された外側導線用延長交差端部36pを有する外側導線用延長交差端子36と接続される。なお、外側導線用延長交差端部36pは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第2導体層パターン22pに接続される構成としてある。つまり、上述したとおり、本実施例での外側導線用延長交差端子36は、図3Aで示した外側導線用交差端子35に対して電線31と交差する方向で端部が延長してある点が異なる。   The outer conductor 31s is connected to the outer conductor extension crossing terminal 36 having an outer conductor extension crossing end 36p that is extended in the direction intersecting the electric wire 31 and disposed on the surface of the resin sealing portion 39 (see FIG. 4D). Is done. The outer conductor extended crossing end 36p is configured to be connected to the second conductor layer pattern 22p via a conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating substrate 21. That is, as described above, the outer conductor extended cross terminal 36 in the present embodiment has an end extending in the direction intersecting the electric wire 31 with respect to the outer conductor cross terminal 35 shown in FIG. 3A. Different.

この構成により、電線31から互いに反対方向で離れた位置にある第2導体層パターン22pそれぞれを外側導線用延長交差端子36によって電線31と交差させて接続し、外側導線用延長交差端子36を中継部として作用させて導線用延長板部32fの外側に配置された第2導体層パターン22pの配線自由度を向上させる電線部品30とすることが可能となる。   With this configuration, each of the second conductor layer patterns 22p located at positions away from each other in the opposite direction from the electric wire 31 is connected to be crossed with the electric wire 31 by the outer conductor extended cross terminal 36, and the outer conductor extended cross terminal 36 is relayed. It becomes possible to make the electric wire component 30 that improves the degree of freedom of wiring of the second conductor layer pattern 22p disposed outside the conductive wire extension plate portion 32f by acting as a portion.

また、外側導線用延長交差端子36(外側導線用延長交差端部36p)は、導線用延長端子32と同様に、配線基板の積層方向で電線31(導線31c、外側導線31s)に対して対称的に配設され、接続されている。つまり、電線31(外側導線用延長交差端子36)は、第2配線基板20の積層方向で対称的に接続される構成としてあり、外側導線用延長交差端部36pは、第1配線基板10の両面に積層されたそれぞれの第2導体層パターン22pに対してそれぞれ対称的に接続することが可能となる。   In addition, the outer conductor extended cross terminal 36 (outer conductor extended cross end 36p) is symmetric with respect to the electric wire 31 (conductor 31c and outer conductor 31s) in the wiring board stacking direction, like the conductor extension terminal 32. Are arranged and connected. In other words, the electric wires 31 (external conductor extension crossing terminals 36) are configured to be symmetrically connected in the stacking direction of the second wiring board 20, and the outer conductor extension crossing end portions 36p are connected to the first wiring board 10. It becomes possible to connect symmetrically to each of the second conductor layer patterns 22p laminated on both surfaces.

外側導線用延長交差端子36は、直方体として示すが、外側導線31sと接続して外側導線用延長交差端部36pを構成することができる形状であればどのような形状であっても良い。   Although the outer conductor extended intersection terminal 36 is shown as a rectangular parallelepiped, it may have any shape as long as it can be connected to the outer conductor 31s to form the outer conductor extended intersection 36p.

なお、導線用延長端子接続工程で、導線用延長端子32と導線31cの接続に併せて、外側導線用延長交差端子36と外側導線31sとを接続する構成としてある。   In addition, it is set as the structure which connects the extended crossing terminal 36 for outer side conductors, and the outer side conducting wire 31s in connection with the extension terminal 32 for conducting wires, and the connection of the conducting wire 31c in the extension terminal connecting step for conducting wires.

図3Jは、本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。   FIG. 3J is explanatory drawing which shows typically the other Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C ) Is a side view showing the tip side.

導線用延長端子32(導線用延長板部32f、導線用接続部32c)、被覆部用延長端子33(被覆部用結合部33c)、外側導線用延長交差端子36(外側導線用延長交差端部36p)は、図3Hの場合と同様の構成としてある。また、図3Hに対して、電線31と交差する方向で延長してある外側被覆部用延長交差端部37pを有する外側被覆部用交差端子37が外側被覆部31fに当接されている点が異なる。以下、主に異なる点について説明する。   Conductive wire extension terminal 32 (conductive wire extension plate portion 32f, conductive wire connection portion 32c), covering portion extension terminal 33 (covering portion coupling portion 33c), outer conductive wire extension crossing terminal 36 (outer conductive wire extension crossing end portion) 36p) has the same configuration as in FIG. 3H. Further, with respect to FIG. 3H, the outer covering portion crossing terminal 37 having the outer covering portion extending intersection end portion 37p extending in the direction crossing the electric wire 31 is in contact with the outer covering portion 31f. Different. Hereinafter, mainly different points will be described.

外側導線31sを被覆する外側被覆部31fは、電線31と交差する方向で延長され樹脂封止部39(図4D参照)の表面に配設された外側被覆部用延長交差端部37pを有する外側被覆部用延長交差端子37と当接される。なお、外側被覆部用延長交差端部37pは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第2導体層パターン22pに接続される構成としてある。   The outer covering portion 31f that covers the outer conducting wire 31s is an outer side having an extended covering end portion 37p for the outer covering portion that is extended in the direction intersecting the electric wire 31 and disposed on the surface of the resin sealing portion 39 (see FIG. 4D). It abuts on the extended cross terminal 37 for the covering portion. The extended covering end portion 37p for the outer covering portion is configured to be connected to the second conductor layer pattern 22p via the conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base material 21.

この構成により、電線31から互いに反対方向で離れた位置にある第2導体層パターン22pそれぞれを外側被覆部用延長交差端子37によって電線31と交差させて接続し(図15A参照)、外側被覆部用延長交差端子37を中継部として作用させて導線用延長端子32fの周囲に配置された第2導体層パターン22pの配線自由度を向上させる電線部品30とすることが可能となる。   With this configuration, each of the second conductor layer patterns 22p located away from each other in the opposite direction from the electric wire 31 is connected to the electric wire 31 by being crossed by the outer covering portion extension crossing terminal 37 (see FIG. 15A). It becomes possible to make the electric wire component 30 that improves the degree of freedom of wiring of the second conductor layer pattern 22p disposed around the conductive wire extension terminal 32f by causing the extended cross terminal 37 to act as a relay portion.

外側被覆部用延長交差端子37(外側被覆部用延長交差端部37p)は、導線用延長端子32と同様に、配線基板の積層方向で電線31(外側被覆部31f)に対して対称的に配設され、当接されている。つまり、電線31(外側被覆部用延長交差端子37)は、第2配線基板20の積層方向で対称的に当接される構成としてあり、外側被覆部用延長交差端部37pは、第1配線基板10の両面に積層されたそれぞれの第2導体層パターン22pに対してそれぞれ対称的に接続することが可能となる。   The outer covering extended extension terminal 37 (outer covering extension extended end 37p) is symmetrical with respect to the electric wire 31 (outer covering 31f) in the wiring board stacking direction, like the conductive wire extension terminal 32. Arranged and abutted. That is, the electric wires 31 (extended covering terminals 37 for the outer covering portion) are configured to abut symmetrically in the stacking direction of the second wiring board 20, and the extended covering end portions 37 p for the outer covering portions are connected to the first wiring. It becomes possible to connect symmetrically to the respective second conductor layer patterns 22p laminated on both surfaces of the substrate 10.

外側被覆部用延長交差端子37は、電線31(外側被覆部31f)に当接させて容易に位置決めすることが可能であることから、樹脂封止部39による樹脂封止を高精度に行なうことが可能となる。   The extended covering terminal 37 for the outer covering portion can be easily positioned by contacting the electric wire 31 (outer covering portion 31f), so that the resin sealing by the resin sealing portion 39 is performed with high accuracy. Is possible.

なお、導線用延長端子接続工程で、導線用延長端子32と導線31cの接続に併せて、外側被覆部用延長交差端子37と外側被覆部31fとを当接する構成としてある。外側被覆部用延長交差端子37(外側被覆部用延長交差端部37p)は、外側被覆部31fに当接した状態で樹脂封止する必要があることから、樹脂封止部39を形成するときは、例えば外側被覆部用延長交差端子37の長さを長くして外部から固定しておく。   In the lead wire extension terminal connecting step, the outer covering extension extension terminal 37 and the outer covering portion 31f are brought into contact with the connection of the lead extension terminal 32 and the lead wire 31c. When the resin sealing portion 39 is formed, the outer covering portion extended intersection terminal 37 (outer covering portion extended intersection end portion 37p) needs to be resin-sealed in contact with the outer covering portion 31f. For example, the length of the outer covering portion extension crossing terminal 37 is increased and fixed from the outside.

上述した図3Aないし図3H、図3Jで示した電線部品30の中間品は、互いに他の実施例の構成と組み合わせて、さらに異なる他の実施例とすることが可能である。   The intermediate product of the electric wire component 30 shown in FIG. 3A to FIG. 3H and FIG. 3J described above can be combined with the configuration of the other embodiment to make another different embodiment.

導線用延長端子32(導線用接続部32c、導線用延長板部32f)、外側導線用延長端子34(外側導線用接続部34c、外側導線用延長板部34f)、外側導線用交差端子35(外側導線用交差端部35p)、外側導線用延長交差端子36(外側導線用延長交差端部36p)は、導線31c、外側導線31sとの接続が可能な材料で構成してある。なお、圧着によって接続する場合は、ハンダ付けを併用することが好ましい。接続部に空気が残留しないように接続することが好ましい。   Conductive wire extension terminal 32 (conductive wire connection portion 32c, conductive wire extension plate portion 32f), outer conductive wire extension terminal 34 (outer conductive wire connection portion 34c, outer conductive wire extension plate portion 34f), outer conductive wire intersection terminal 35 ( The outer conductor crossing end portion 35p and the outer conductor extension crossing terminal 36 (outer conductor extension crossing end portion 36p) are made of a material that can be connected to the conductor 31c and the outer conductor 31s. In addition, when connecting by crimping, it is preferable to use soldering together. It is preferable to connect so that air does not remain in a connection part.

導線用延長端子32、外側導線用延長端子34、外側導線用交差端子35、外側導線用延長交差端子36は、導通抵抗が低いこと、電線31との結合強度が強く、また、劣化しにくいことが好ましい。導通孔導体41との接続性、導通性が良いものであることが好ましい。例えば、導通孔導体41が銅メッキであれば、例えば、銅または銅合金などに錫メッキなどを施したものを適用することが好ましい。この構成により、導線31c、外側導線31sと第1導体層パターン12p、第2導体層パターン22pとの接続を容易に行なうことが可能となる。   The conducting wire extension terminal 32, the outside conducting wire extension terminal 34, the outside conducting wire crossing terminal 35, and the outside conducting wire extension crossing terminal 36 have a low conduction resistance, a strong coupling strength with the electric wire 31, and are hardly deteriorated. Is preferred. It is preferable that the connection with the conduction hole conductor 41 and the conductivity are good. For example, if the conduction hole conductor 41 is copper-plated, it is preferable to apply, for example, copper or a copper alloy that is tin-plated. With this configuration, it is possible to easily connect the conducting wire 31c and the outer conducting wire 31s to the first conductor layer pattern 12p and the second conductor layer pattern 22p.

また、被覆部用延長端子33(被覆部用結合部33c、被覆部用延長板部33f)は、被覆部31hと結合し、第1導体層パターン12p、第2導体層パターン22pとの接続が可能な材料で構成してあり、例えば銅、銅合金が好ましい。外側被覆部用延長交差端子37(外側被覆部用延長交差端部37p)は、被覆部用延長端子33と同様に構成することが好ましい。   In addition, the covering portion extension terminal 33 (the covering portion coupling portion 33c and the covering portion extension plate portion 33f) is coupled to the covering portion 31h, and is connected to the first conductor layer pattern 12p and the second conductor layer pattern 22p. For example, copper or a copper alloy is preferable. The outer covering portion extended intersection terminal 37 (outer covering portion extended intersection end 37p) is preferably configured in the same manner as the covering portion extension terminal 33.

導線用延長端子32、被覆部用延長端子33、外側導線用延長端子34は、板厚が例えば0.1ないし0.3mm程度、電線31の延長方向での幅が例えば0.4ないし1.2mm程度、樹脂封止部39から電線31の延長方向での長さが例えば1.0ないし3.0mm程度とすることが可能である。この程度の大きさとすることにより、十分な機械的強度と積層性を確保することが可能となる。   The conductor extension terminal 32, the covering extension terminal 33, and the outer conductor extension terminal 34 have a plate thickness of, for example, about 0.1 to 0.3 mm, and a width in the extension direction of the electric wire 31, for example, 0.4 to 1. The length in the extending direction of the electric wire 31 from the resin sealing portion 39 can be about 1.0 to 3.0 mm, for example. By setting the size to this level, it is possible to ensure sufficient mechanical strength and stackability.

また、外側導線用交差端子35は、樹脂封止部39に収納可能な程度の大きさとすることが可能であり、外側導線用延長交差端子36、外側被覆部用延長交差端子37は導線用延長端子32と同程度の厚さとし、樹脂封止部39での第2配線基板20に対向する両面に収まる程度の大きさとすることが可能である。   Further, the outer conductor crossing terminal 35 can be sized so as to be housed in the resin sealing portion 39, and the outer conductor extension crossing terminal 36 and the outer covering extension crossing terminal 37 are conductor extensions. It is possible to make the thickness about the same as that of the terminal 32, and to have a size that can fit on both surfaces of the resin sealing portion 39 facing the second wiring board 20.

工程S3:
図4Aは、本発明の実施の形態1に係る電線部品での電線の端部を樹脂封止した状態の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。
Step S3:
FIG. 4A is an explanatory view schematically showing an example in a state where an end portion of the electric wire in the electric wire component according to Embodiment 1 of the present invention is resin-sealed, (A) is a plan view, and (B). Is a front view, (C) is a side view showing the tip side.

図4Aは、図3Cで示した電線31の端部を樹脂封止して形成した樹脂封止部39の状態を示す。図3Cで説明したとおり、導線用延長端子32(導線用延長板部32f)は、樹脂封止部39から配線基板の積層方向に高さHfsで突出して、第1配線基板10(第1導体層パターン12p)に対向する形態としてある。   4A shows a state of the resin sealing portion 39 formed by resin sealing the end portion of the electric wire 31 shown in FIG. 3C. As described with reference to FIG. 3C, the conductive wire extension terminal 32 (conductive wire extension plate portion 32 f) protrudes from the resin sealing portion 39 in the stacking direction of the wiring substrate at a height Hfs, and the first wiring substrate 10 (first conductor). The layer pattern 12p) is opposed to the layer pattern 12p).

また、導線用延長板部32fに形成された接続孔32hを樹脂封止部39から露出させる形態で樹脂封止してある。この構成により、第2絶縁基材21に形成される層間導通孔40は、接続孔32hを通過して第1導体層パターン12pに容易に対向することが可能となる。   The connection hole 32h formed in the conductive wire extension plate portion 32f is resin-sealed in a form that is exposed from the resin sealing portion 39. With this configuration, the interlayer conduction hole 40 formed in the second insulating base 21 can easily face the first conductor layer pattern 12p through the connection hole 32h.

電線31の端部を樹脂封止し、併せて導線用延長端子32を適宜の形状で樹脂封止する(樹脂封止工程)。樹脂封止工程により、電線31と樹脂封止部39とを備える電線部品30を構成することとなる。なお、樹脂封止工程での樹脂封止は、例えばトランスファーモールド技術、適宜の金型、適宜の封止樹脂(配線基板と同様な樹脂材料であることが好ましい。)などを適用して適宜行なうことが可能である。   The end portion of the electric wire 31 is resin-sealed, and the conductive wire extension terminal 32 is also resin-sealed in an appropriate shape (resin sealing step). The electric wire component 30 provided with the electric wire 31 and the resin sealing part 39 will be comprised by a resin sealing process. The resin sealing in the resin sealing step is appropriately performed by applying, for example, a transfer mold technique, an appropriate mold, an appropriate sealing resin (preferably a resin material similar to that of the wiring substrate), and the like. It is possible.

樹脂封止部39は、第1配線基板10と並置され、第2配線基板20が積層されるように直方体に形成される(図10参照)ことが好ましい。直方体の上下両面(導線用延長板部32fに対応する表面)が第2配線基板20(第2絶縁基材21)に対向し、先端面(電線31が導出される面と反対側の面、つまり、電線31の延長方向。)が第1配線基板10に対向して並置される。   The resin sealing portion 39 is preferably juxtaposed with the first wiring board 10 and formed in a rectangular parallelepiped so that the second wiring board 20 is laminated (see FIG. 10). The upper and lower surfaces (surface corresponding to the conductive wire extension plate portion 32f) of the rectangular parallelepiped face the second wiring board 20 (second insulating base material 21), and the tip surface (the surface opposite to the surface from which the electric wire 31 is led out) That is, the extending direction of the electric wires 31) is arranged in parallel to face the first wiring board 10.

また、外側導線用交差端子35(外側導線用交差端部35p)は、第2絶縁基材21と対向するように樹脂封止部39の表面に露出するように配設してある。   Further, the outer conductive wire intersection terminal 35 (outer conductive wire intersection end portion 35 p) is disposed so as to be exposed on the surface of the resin sealing portion 39 so as to face the second insulating substrate 21.

導線用延長端子32、外側導線用交差端子35は、いずれも樹脂封止部39で樹脂封止され保持されることから、構造的に安定した端子部を構成することが可能となる。   The extension terminal 32 for conducting wire and the intersecting terminal 35 for outside conducting wire are both resin-sealed and held by the resin-sealing portion 39, so that a structurally stable terminal portion can be configured.

図4Bないし図4Dは、本発明の実施の形態1に係る電線部品での電線の端部を樹脂封止した状態の他の実施例を模式的に示す説明図であり、それぞれ(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。基本的な構成は図4Aに示した電線部品と共通するので主に特徴となる点について説明する。   4B to 4D are explanatory views schematically showing other examples in which the ends of the electric wires in the electric wire component according to Embodiment 1 of the present invention are resin-sealed. A top view, (B) is a front view, (C) is a side view which shows the front end side. Since the basic configuration is the same as that of the electric wire component shown in FIG.

図4Bは、図3Eで示した電線31の端部を樹脂封止して形成した樹脂封止部39の状態を示す。導線用延長端子32(導線用延長板部32f、接続孔32h)は、樹脂封止部39の先端面から延長され、導線用延長板部32fおよび接続孔32hが第1導体層パターン12pに対向する形態としてある。この構成により、導線用延長端子32の積層方向での剥がれを防止して固定強度を向上させることが可能となる。   FIG. 4B shows a state of the resin sealing portion 39 formed by resin sealing the end portion of the electric wire 31 shown in FIG. 3E. The conductive wire extension terminal 32 (conductive wire extension plate portion 32f, connection hole 32h) is extended from the front end surface of the resin sealing portion 39, and the conductive wire extension plate portion 32f and connection hole 32h are opposed to the first conductor layer pattern 12p. As a form to do. With this configuration, it is possible to prevent peeling in the stacking direction of the conductive wire extension terminals 32 and improve the fixing strength.

また、外側導線用延長端子34(外側導線用延長板部34f、接続孔34h)は、導線用延長端子32(導線用延長板部32f)と同様に樹脂封止部39の先端面から延長され、外側導線用延長板部34fおよび接続孔34hが第1導体層パターン12pに対向する形態としてある。導線用延長板部32fを樹脂封止部39の先端面から延長することにより、樹脂封止部39による固定を確実で強固に行なうことが可能となる。   Further, the outer conductor extension terminal 34 (outer conductor extension plate portion 34f, connection hole 34h) is extended from the front end surface of the resin sealing portion 39 in the same manner as the conductor extension terminal 32 (conductor extension plate portion 32f). The outer conductive wire extension plate part 34f and the connection hole 34h are configured to face the first conductor layer pattern 12p. By extending the conductive wire extension plate portion 32f from the front end surface of the resin sealing portion 39, the resin sealing portion 39 can be reliably and firmly fixed.

なお、図3Gで示した電線31の端部を樹脂封止して形成した樹脂封止部39の場合も図4Bと同様な状態となる。   In addition, also in the case of the resin sealing part 39 formed by resin-sealing the edge part of the electric wire 31 shown in FIG. 3G, it will be in the same state as FIG. 4B.

図4Cは、図3Fで示した電線31の端部を樹脂封止して形成した樹脂封止部39の状態を示す。図3Fで説明したとおり、導線用延長端子32(導線用延長板部32f、接続孔32h)は、図3D(図3E)と同様である。つまり、導線用延長端子32(導線用延長板部32f、接続孔32h)は、図4Bと同様に、樹脂封止部39の先端面から延長され第1導体層パターン12pに対向する形態としてある。   FIG. 4C shows a state of the resin sealing portion 39 formed by resin sealing the end portion of the electric wire 31 shown in FIG. 3F. As described in FIG. 3F, the conductor extension terminal 32 (conductor extension plate portion 32f, connection hole 32h) is the same as FIG. 3D (FIG. 3E). That is, the conductive wire extension terminal 32 (conductive wire extension plate portion 32f, connection hole 32h) is extended from the front end surface of the resin sealing portion 39 and faces the first conductor layer pattern 12p, as in FIG. 4B. .

また、外側導線用延長端子34(外側導線用延長板部34f、接続孔34h)は、図4Bの場合と異なる。つまり、樹脂封止部39の先端面だけでなく、電線31と交差する側面方向でも樹脂封止部39から突出されている。   Further, the outer conductor extension terminal 34 (outer conductor extension plate 34f, connection hole 34h) is different from the case of FIG. 4B. That is, it protrudes from the resin sealing part 39 not only at the front end surface of the resin sealing part 39 but also in the side surface direction intersecting with the electric wire 31.

外側導線用延長板部34fは、図3Fで示したとおり、外側導線用延長板部34fの延長方向(導線用延長板部32fの延長方向と平行な方向)に沿って複数分散して形成された接続孔34hを有する。複数の接続孔34hは、樹脂封止部39の側面(電線31と交差する方向)から突出された状態で樹脂封止されていることから、対応する複数の箇所で、対応する第1導体層パターン12p(および第2導体層パターン22p)と接続されることが可能となる。   As shown in FIG. 3F, a plurality of outer conductor extension plate portions 34f are formed in a distributed manner along the extension direction of the outer conductor extension plate portion 34f (the direction parallel to the extension direction of the conductor extension plate portion 32f). A connecting hole 34h. Since the plurality of connection holes 34h are resin-sealed in a state of protruding from the side surface (direction intersecting the electric wire 31) of the resin sealing portion 39, the corresponding first conductor layer is provided at a plurality of corresponding positions. It becomes possible to be connected to the pattern 12p (and the second conductor layer pattern 22p).

つまり、樹脂封止部39の側面(電線31と交差する方向)に配置された第1配線基板10(第1導体層パターン12p)に対しても対向する形態(図3Fの第1配線基板10参照)とすることが可能となり、第1導体層パターン12pの配線自由度を向上させることができる。したがって、配線自由度の高い電線複合プリント配線基板1を提供することが可能となる。   In other words, the configuration (first wiring board 10 in FIG. 3F) is also opposed to the first wiring board 10 (first conductor layer pattern 12p) disposed on the side surface of the resin sealing portion 39 (direction intersecting the electric wires 31). The degree of freedom of wiring of the first conductor layer pattern 12p can be improved. Therefore, it is possible to provide the electric wire composite printed wiring board 1 having a high degree of freedom in wiring.

図4Dは、図3Jで示した電線31の端部を樹脂封止して形成した樹脂封止部39の状態を示す。導線用延長端子32(導線用延長板部32f、接続孔32h)は、樹脂封止部39上下両面から板厚部分が部分的に突出し、樹脂封止部39の先端面から延長され第1導体層パターン12pに対向する形態としてある。また、被覆部用延長端子33(被覆部用延長板部33f、接続孔33h)は、導線用延長端子32(導線用延長板部32f)と同様に配設されている。したがって、導線用延長板部32fと被覆部用延長板部33fの平面形状の相違がそのまま樹脂封止部39の表面に現出している。導線用延長端子32、被覆部用延長端子33は、一部を樹脂封止部39で固定されることから、機械的強度を確保することが可能となる。   FIG. 4D shows a state of the resin sealing portion 39 formed by resin sealing the end portion of the electric wire 31 shown in FIG. 3J. The conductive wire extension terminal 32 (conductive wire extension plate portion 32f, connection hole 32h) partially protrudes from both the upper and lower surfaces of the resin sealing portion 39 and extends from the front end surface of the resin sealing portion 39 to be a first conductor. The layer pattern 12p is opposed to the layer pattern 12p. Further, the covering portion extension terminal 33 (covering portion extension plate portion 33f, connection hole 33h) is disposed in the same manner as the conducting wire extension terminal 32 (conducting wire extension plate portion 32f). Accordingly, the difference in planar shape between the conductive wire extension plate portion 32f and the covering portion extension plate portion 33f appears on the surface of the resin sealing portion 39 as it is. Since the lead wire extension terminal 32 and the covering portion extension terminal 33 are partially fixed by the resin sealing portion 39, the mechanical strength can be secured.

また、外側導線用延長交差端子36(外側導線用延長交差端部36p)および外側被覆部用延長交差端子37(外側被覆部用延長交差端部37p)は、樹脂封止部39の表面に露出し樹脂封止部39の表面と面一となるように配設してある。外側導線用延長交差端部36pおよび外側被覆部用延長交差端部37pは、樹脂封止部39と面一としてあることから、高精度の平面性で第2絶縁基材21に対向することが可能であり、第2導体層パターン22pと高精度での接続を行なうことが可能となる。   Further, the outer conductor extended cross terminal 36 (outer conductor extended cross end portion 36p) and the outer covering portion extended cross terminal 37 (outer covering portion extended cross end portion 37p) are exposed on the surface of the resin sealing portion 39. The resin sealing portion 39 is disposed so as to be flush with the surface. The outer conductor extended crossing end portion 36p and the outer covering portion extended crossing end portion 37p are flush with the resin sealing portion 39, and therefore can face the second insulating substrate 21 with high precision flatness. It is possible to connect the second conductor layer pattern 22p with high accuracy.

なお、外側被覆部用延長交差端子37のように電線31に対して固定されていない場合には、上述したとおり、外側被覆部用延長交差端子37をさらに延長して金型の側で固定し、樹脂封止部39を形成した後、樹脂封止部39から飛び出している余分な部分を切断して樹脂封止部39の外形に一致させて構成することが可能である。   If the outer covering portion extension crossing terminal 37 is not fixed to the electric wire 31, as described above, the outer covering portion extension crossing terminal 37 is further extended and fixed on the mold side. After forming the resin sealing portion 39, it is possible to configure by cutting off an excess portion protruding from the resin sealing portion 39 to match the outer shape of the resin sealing portion 39.

図4Aないし図4Dで示したとおり、樹脂封止部39は、導線用延長端子32、被覆部用延長端子33、外側導線用延長端子34、外側導線用交差端子35、外側導線用延長交差端子36、外側被覆部用延長交差端子37の位置を高精度に固定できることから、第1導体層パターン12p、第2導体層パターン22pとの接続を高精度で容易にすることが可能となる。   As shown in FIGS. 4A to 4D, the resin sealing portion 39 includes the conductive wire extension terminal 32, the covering portion extension terminal 33, the outer conductive wire extension terminal 34, the outer conductive wire intersection terminal 35, and the outer conductive wire extension cross terminal. 36, since the position of the extended covering terminal 37 for the outer covering portion can be fixed with high accuracy, the connection with the first conductor layer pattern 12p and the second conductor layer pattern 22p can be facilitated with high accuracy.

接続孔32h、接続孔33h、接続孔34hを樹脂封止部39の外部に露出させて配置することから、導通孔導体41による第1導体層パターン12pに対する接続を容易にし、信頼性を向上させることができる。また、外側導線用交差端部35p、外側導線用延長交差端部36p、外側被覆部用延長交差端部37pを樹脂封止部39の表面に露出させることから、導通孔導体41による第2導体層パターン22pに対する接続を容易にし、信頼性を向上させることができる。   Since the connection hole 32h, the connection hole 33h, and the connection hole 34h are exposed to the outside of the resin sealing portion 39, the connection to the first conductor layer pattern 12p by the conduction hole conductor 41 is facilitated and the reliability is improved. be able to. Further, since the outer conductor crossing end 35p, the outer conductor extended crossing end 36p, and the outer covering extension extended crossing 37p are exposed on the surface of the resin sealing portion 39, the second conductor by the conduction hole conductor 41 is provided. The connection to the layer pattern 22p can be facilitated and the reliability can be improved.

樹脂封止部39は、熱膨張による変形などを防止するために、第1絶縁基材11、第2絶縁基材21に比較して同等以上の物性(例えば、耐熱特性、電気的特性、硬さなど)を有する材料で構成することが好ましい。例えば、エポキシ樹脂などを適用することが可能である。   The resin sealing portion 39 has physical properties equivalent to or higher than those of the first insulating base material 11 and the second insulating base material 21 (for example, heat resistance characteristics, electrical characteristics, hardness) in order to prevent deformation due to thermal expansion. And the like. For example, an epoxy resin or the like can be applied.

工程S4:
樹脂形成工程で構成した電線部品30の導線用延長端子32の露出表面を粗化する(粗化工程)。つまり、第1配線基板10(第1導体層パターン12p)および第2配線基板20(第2導体層パターン22p)との接続性を向上させるために、第1導体層パターン12p、第2導体層パターン22pに対する接続が行なわれる表面を粗化する。
Step S4:
The exposed surface of the extension terminal for conducting wire 32 of the electric wire component 30 configured in the resin forming step is roughened (roughening step). That is, in order to improve the connectivity with the first wiring board 10 (first conductor layer pattern 12p) and the second wiring board 20 (second conductor layer pattern 22p), the first conductor layer pattern 12p and the second conductor layer. The surface to be connected to the pattern 22p is roughened.

例えば、図4Aないし図4Dで示した導線用延長端子32(導線用延長板部32f)、被覆部用延長端子33(被覆部用延長板部33f)、外側導線用延長端子34(外側導線用延長板部34f)、外側導線用交差端子35(外側導線用交差端部35p)、外側導線用延長交差端子36(外側導線用延長交差端部36p)、外側被覆部用延長交差端子37(外側被覆部用延長交差端部37p)などの樹脂封止部39から露出した表面領域を粗化する。   For example, the conductor extension terminal 32 (conductor extension plate part 32f), the covering part extension terminal 33 (covering part extension plate part 33f), and the outer conductor extension terminal 34 (outside conductor use) shown in FIGS. 4A to 4D. Extension plate portion 34f), outer conductor crossing terminal 35 (outer conductor crossing end portion 35p), outer conductor extension crossing terminal 36 (outer conductor extension crossing end 36p), outer covering portion extension crossing terminal 37 (outer side) The surface region exposed from the resin sealing portion 39 such as the extended intersection end portion 37p) is roughened.

粗化工程は、一般に知られている過酸化水素系の薬液による表面エッチングにより行なうことが可能である。工程S1ないし工程S4により、電線部品30は完成する。完成した電線部品30の例を図5Aおよび図5Bで示す。   The roughening step can be performed by surface etching with a generally known hydrogen peroxide chemical. The electric wire component 30 is completed by the steps S1 to S4. An example of the completed electric wire component 30 is shown in FIGS. 5A and 5B.

図5Aおよび図5Bは、本発明の実施の形態1に係る電線部品の実施例を模式的に示す説明図であり、それぞれ(A)は平面図、(B)正面図である。   5A and 5B are explanatory views schematically showing examples of the electric wire component according to Embodiment 1 of the present invention, in which (A) is a plan view and (B) is a front view, respectively.

図5Aは、図4Bで示した電線部品30(電線31および樹脂封止部39)の全体を示す。図5Bは、図4Dで示した電線部品30(電線31および樹脂封止部39)の全体を示す。つまり、電線31の両端を樹脂封止部39で樹脂封止した場合を示す。なお、電線部品30は、両端で対称的な形態としてあるが、これに限るものではなく、一方の端部に対して他方の端部が異なる形態であっても良い。   FIG. 5A shows the entire electric wire component 30 (the electric wire 31 and the resin sealing portion 39) shown in FIG. 4B. FIG. 5B shows the entirety of the electric wire component 30 (the electric wire 31 and the resin sealing portion 39) shown in FIG. 4D. That is, the case where both ends of the electric wire 31 are resin-sealed by the resin sealing portion 39 is shown. In addition, although the electric wire component 30 is made into the symmetrical form at both ends, it is not restricted to this, The other edge part may differ with respect to one edge part.

電線部品30は、電線31に接続された導線用延長端子32、外側導線用延長端子34、外側導線用交差端子35、外側導線用延長交差端子36によって、第2配線基板20の積層方向で対称的に配置された第1導体層パターン12pまたは第2導体層パターン22pにそれぞれ対称的に接続される。   The electric wire component 30 is symmetrical in the stacking direction of the second wiring board 20 by the conductive wire extension terminal 32, the outer conductive wire extension terminal 34, the outer conductive wire intersection terminal 35, and the outer conductive wire extension intersection terminal 36 connected to the electric wire 31. Are symmetrically connected to the first conductor layer pattern 12p or the second conductor layer pattern 22p, respectively.

電線部品30は、電線31に結合された被覆部用延長端子33、電線31に当接された外側被覆部用延長交差端子37によって、第2配線基板20の積層方向で対称的に配置された第2導体層パターン22pにそれぞれ対称的に接続される。   The electric wire component 30 is symmetrically arranged in the stacking direction of the second wiring board 20 by the covering portion extension terminal 33 coupled to the electric wire 31 and the outer covering portion extension crossing terminal 37 in contact with the electric wire 31. The second conductor layer patterns 22p are symmetrically connected to each other.

したがって、上述したとおり、多層(4層)構造の配線基板の各導体層パターンに対して両面で対称的に接続された電線部品30を有する電線複合プリント配線基板1とすることが可能となる。   Therefore, as described above, the electric wire composite printed wiring board 1 having the electric wire components 30 symmetrically connected on both sides to each conductor layer pattern of the wiring board having a multilayer (four layers) structure can be obtained.

本実施の形態に係る電線部品製造方法は、第1絶縁基材11および第1導体層パターン12pを有する第1配線基板10と、第1配線基板10に積層された第2絶縁基材21および第2導体層パターン22pを有する第2配線基板20と、導線31cを有する電線31および電線31の端部を樹脂封止して第1配線基板10に並置され第2配線基板20が積層された樹脂封止部39を有する電線部品30とを備える電線複合プリント配線基板1に適用される電線部品30を製造する電線部品製造方法である。   The electric wire component manufacturing method according to the present embodiment includes a first wiring substrate 10 having a first insulating base material 11 and a first conductor layer pattern 12p, a second insulating base material 21 laminated on the first wiring substrate 10, and The second wiring board 20 having the second conductor layer pattern 22p, the electric wire 31 having the conductive wire 31c, and the end portion of the electric wire 31 are resin-sealed and juxtaposed with the first wiring board 10, and the second wiring board 20 is laminated. It is an electric wire component manufacturing method for manufacturing the electric wire component 30 applied to the electric wire composite printed wiring board 1 including the electric wire component 30 having the resin sealing portion 39.

また、本実施の形態に係る電線部品製造方法は、導線31cを露出させて電線31を準備する電線準備工程と、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続される接続孔32hを樹脂封止部39から延長され第1導体層パターン12pに対向する導線用延長板部32fに有する導線用延長端子32と導線31cとを接続する導線用延長端子接続工程と、電線31の端部を樹脂封止して導線用延長端子32が有する接続孔32hを露出させた樹脂封止部39を形成する樹脂封止工程とを備える。   Moreover, the electric wire component manufacturing method according to the present embodiment includes an electric wire preparation step of preparing the electric wire 31 by exposing the conductive wire 31c, and a conductive hole conductor 41 formed in the interlayer conductive hole 40 of the second insulating base material 21. A conductive wire extension terminal 32 and a conductive wire 31c, which are provided on a conductive wire extension plate portion 32f extending from the resin sealing portion 39 and having a connection hole 32h connected to the first conductive layer pattern 12p through the resin sealing portion 39. A conductive wire extension terminal connecting step, and a resin sealing step of forming a resin sealing portion 39 in which the connection hole 32h of the conductive wire extension terminal 32 is exposed by resin sealing the end portion of the electric wire 31. Prepare.

したがって、第1導体層パターン12pに対向して接続される接続孔32hを有する導線用延長端子32を高精度に位置決めした電線部品30を製造することが可能となる。   Therefore, it is possible to manufacture the electric wire component 30 in which the conductive wire extension terminal 32 having the connection hole 32h connected to face the first conductor layer pattern 12p is positioned with high accuracy.

<実施の形態2>
図6ないし図20に基づいて、本発明の実施の形態2に係る電線複合プリント配線基板1(要部構成としての図18参照。)および電線複合プリント配線基板1を製造する電線複合プリント配線基板製造方法について説明する。
<Embodiment 2>
Based on FIG. 6 thru | or FIG. 20, the electric wire composite printed wiring board 1 (refer FIG. 18 as a principal part structure) which concerns on Embodiment 2 of this invention, and the electric wire composite printed wiring board which manufactures the electric wire composite printed wiring board 1 A manufacturing method will be described.

本実施の形態に係る電線複合プリント配線基板1は実施の形態1で説明した電線部品30を適用して構成してあるので、適宜援用して説明を省略することがある。また、実施の形態1で説明した電線部品30の特徴をそのまま有する形態として適用してある。   Since the electric wire composite printed wiring board 1 according to the present embodiment is configured by applying the electric wire component 30 described in the first embodiment, description thereof may be omitted as appropriate. Moreover, it has applied as a form which has the characteristic of the electric wire component 30 demonstrated in Embodiment 1 as it is.

なお、電線複合プリント配線基板1の電線部品30以外の部分はリジッド部として構成してあり、4層の配線構造(両面に配線層(第1導体層パターン12p)を有する内層基板(第1配線基板10)、内層基板の両面外側に配置された各外層基板(第2配線基板20))を有する電線・リジッドプリント配線基板を例示して説明する。   In addition, the part other than the electric wire component 30 of the electric wire composite printed wiring board 1 is configured as a rigid part, and has a four-layer wiring structure (an inner layer board (first wiring layer pattern 12p) on both surfaces) (first wiring layer). The electric wire / rigid printed wiring board having the board 10) and the respective outer layer boards (second wiring boards 20) arranged on both outer sides of the inner layer board will be described as an example.

図6は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の工程フローを概略的に示すフロー図である。以下、各工程について順次説明するが、各工程(S10ないしS22)に対応する図7ないし図18についても併せて説明する。   FIG. 6 is a flowchart schematically showing a process flow of the electric wire composite printed wiring board manufacturing method according to Embodiment 2 of the present invention. Hereinafter, although each process is demonstrated sequentially, FIG. 7 thru | or FIG. 18 corresponding to each process (S10 thru | or S22) is also demonstrated collectively.

本実施の形態に係る電線複合プリント配線基板製造方法で製造する電線複合プリント配線基板1は、第1絶縁基材11および第1導体層パターン12pを有する第1配線基板10と、導線31cを有する電線31および電線31の端部を樹脂封止して第1配線基板10に並置された樹脂封止部39を有する電線部品30と、第1配線基板10および樹脂封止部39に積層された第2絶縁基材21および第2導体層パターン22pを有する第2配線基板20とを備えた構成としてある(図15A参照)。   An electric wire composite printed wiring board 1 manufactured by the electric wire composite printed wiring board manufacturing method according to the present embodiment includes a first wiring substrate 10 having a first insulating base material 11 and a first conductor layer pattern 12p, and a conductive wire 31c. The electric wire 31 and the electric wire component 30 having the resin sealing portion 39 juxtaposed to the first wiring substrate 10 by resin sealing the end portions of the electric wires 31, and the first wiring substrate 10 and the resin sealing portion 39 are laminated. The second insulating substrate 21 and the second wiring substrate 20 having the second conductor layer pattern 22p are provided (see FIG. 15A).

なお、上述したとおり、第1配線基板10は4層配線構造での内層基板(2層)に対応し、第2配線基板20は外層基板(2層)に対応する。4層配線構造を例示するがこれに限るものではない。   As described above, the first wiring board 10 corresponds to the inner layer board (two layers) in the four-layer wiring structure, and the second wiring board 20 corresponds to the outer layer board (two layers). A four-layer wiring structure is illustrated but not limited to this.

また、本実施の形態に係る電線複合プリント配線基板製造方法は、第1絶縁基材11および第1導体層パターン12pを有する第1配線基板10と、導線31cを有する電線31および電線31の端部を樹脂封止して第1配線基板10に並置された樹脂封止部39を有する電線部品30と、第1配線基板10および樹脂封止部39に積層された第2絶縁基材21および第2導体層パターン22pを有する第2配線基板20とを備える電線複合プリント配線基板1を製造する構成としてある。   In addition, in the method for manufacturing an electric wire composite printed wiring board according to the present embodiment, the first wiring board 10 having the first insulating base material 11 and the first conductor layer pattern 12p, the electric wires 31 having the conductive wires 31c, and the ends of the electric wires 31 are used. An electric wire component 30 having a resin sealing portion 39 juxtaposed to the first wiring substrate 10 by resin sealing, a second insulating base material 21 laminated on the first wiring substrate 10 and the resin sealing portion 39, and It is set as the structure which manufactures the electric wire composite printed wiring board 1 provided with the 2nd wiring board 20 which has the 2nd conductor layer pattern 22p.

電線部品30は、実施の形態1で示したとおり、第1導体層パターン12pに対向して第1導体層パターン12pに接続される導線用延長端子32(導線用接続部32c)を有する。したがって、導線31c(電線部品30)と第1導体層パターン12p(第1配線基板10)とを容易かつ強固に接続して自由な立体配置が可能で、信号伝送を確実に行なえ、電線部品30と第1導体層パターン12pとの接続の信頼性の高い電線複合プリント配線基板1とすることが可能となる。   As shown in the first embodiment, the electric wire component 30 includes the conductive wire extension terminal 32 (conductive wire connection portion 32c) that is opposed to the first conductive layer pattern 12p and connected to the first conductive layer pattern 12p. Therefore, the conductive wire 31c (the electric wire component 30) and the first conductor layer pattern 12p (the first wiring substrate 10) can be easily and firmly connected to each other, and free three-dimensional arrangement is possible, signal transmission can be reliably performed, and the electric wire component 30 It becomes possible to make the electric wire composite printed wiring board 1 with high reliability of connection between the first conductor layer pattern 12p and the first conductor layer pattern 12p.

また、導線用延長端子32(導線用接続部32c)に加えて種々の端子(被覆部用延長端子33(被覆部用延長板部33f)、外側導線用延長端子34(外側導線用延長板部34f)、外側導線用交差端子35(外側導線用交差端部35p)、外側導線用延長交差端子36(外側導線用延長交差端部36p)、外側被覆部用延長交差端子37(外側被覆部用延長交差端部37p))を有する構成としてある。   Further, in addition to the conductor extension terminal 32 (conductor connection part 32c), various terminals (cover extension terminal 33 (cover extension plate 33f), outer conductor extension terminal 34 (outer conductor extension plate). 34f), outer conductor crossing terminal 35 (outer conductor crossing end 35p), outer conductor extension crossing terminal 36 (outer conductor extension crossing end 36p), outer covering extension terminal 37 (for outer covering) The extended crossing end 37p)) is provided.

被覆部用延長端子33(被覆部用延長板部33f)、外側導線用延長端子34(外側導線用延長板部34f)、外側導線用交差端子35(外側導線用交差端部35p)、外側導線用延長交差端子36(外側導線用延長交差端部36p)、外側被覆部用延長交差端子37(外側被覆部用延長交差端部37p)は、第2配線基板20の層間導通孔40に形成された導通孔導体41により、第1導体層パターン12pまたは第2導体層パターン22pに接続される構成としてある。   Covering terminal extension terminal 33 (covering part extension plate part 33f), outer conductor extension terminal 34 (outer conductor extension board part 34f), outer conductor intersection terminal 35 (outer conductor intersection end 35p), outer conductor The extension crossing terminal 36 (extended crossing end portion 36p for the outer conductor) and the outer covering portion extension crossing terminal 37 (outer covering portion extension crossing end portion 37p) are formed in the interlayer conduction hole 40 of the second wiring board 20. The conductive hole conductor 41 is connected to the first conductor layer pattern 12p or the second conductor layer pattern 22p.

したがって、第1導体層パターン12pまたは第2導体層パターン22pの配線自由度を向上させた電線複合プリント配線基板1とすることが可能となる。   Therefore, the electric wire composite printed wiring board 1 with improved wiring flexibility of the first conductor layer pattern 12p or the second conductor layer pattern 22p can be obtained.

工程S10:
図7は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の電線部品準備工程で準備した電線部品を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。なお、電線31の断面でのハッチングは図面の見易さを考慮して省略してある(図10ないし図15A、図16ないし図18において同様とする。)。
Step S10:
7A and 7B are explanatory views showing electric wire components prepared in the electric wire component preparation step of the electric wire composite printed wiring board manufacturing method according to Embodiment 2 of the present invention, where FIG. 7A is a plan view, and FIG. It is an end view which shows the end surface of the cross section by arrow BB of). In addition, the hatching in the cross section of the electric wire 31 is abbreviate | omitted in consideration of the legibility of drawing (it is the same in FIG. 10 thru | or FIG. 15A, FIG. 16 thru | or FIG. 18).

電線部品30を準備する(電線部品準備工程)。つまり、導線用延長端子接続工程で導線用延長端子32を導線31cに接続し、樹脂封止工程で樹脂封止部39を形成した電線部品30を準備する。なお、本実施の形態では、図5B(図3J、図4D)に示した電線部品30を例示して説明する。   The electric wire component 30 is prepared (electric wire component preparation process). That is, the electric wire component 30 in which the conductive wire extension terminal 32 is connected to the conductive wire 31c in the conductive wire extension terminal connecting step and the resin sealing portion 39 is formed in the resin sealing step is prepared. In the present embodiment, the electric wire component 30 shown in FIG. 5B (FIGS. 3J and 4D) will be described as an example.

電線部品30の詳細は、実施の形態1で説明したとおりである。なお、実施の形態1の工程S1ないし工程S4は、電線部品準備工程に含めても良く、また、予め完成した電線部品30として準備することも可能である。   The details of the electric wire component 30 are as described in the first embodiment. Note that the steps S1 to S4 of the first embodiment may be included in the electric wire component preparation step, or may be prepared as a completed electric wire component 30 in advance.

また、実施の形態1で説明したとおり、導線用延長端子接続工程で、導線用延長端子32(導線用接続部32c、導線用延長板部32f)は、導線用接続部32cを介して導線31cに接続され、被覆部用延長端子33(被覆部用結合部33c、被覆部用延長板部33f)は、被覆部用結合部33cを介して被覆部31hに結合され、外側導線用延長交差端子36(外側導線用延長交差端部36p)は、外側導線31sに接続され、外側被覆部用延長交差端子37(外側被覆部用延長交差端部37p)は、外側被覆部31fに当接される。   Further, as described in the first embodiment, in the lead wire extension terminal connection step, the lead wire extension terminal 32 (the lead wire connection portion 32c, the lead wire extension plate portion 32f) is connected to the lead wire 31c via the lead wire connection portion 32c. The covering portion extension terminal 33 (the covering portion connecting portion 33c and the covering portion extension plate portion 33f) is connected to the covering portion 31h via the covering portion connecting portion 33c, and is extended to the outer conductor extension crossing terminal. 36 (outer conductor extended intersection 36p) is connected to the outer conductor 31s, and the outer covering extension extended terminal 37 (outer covering extension 37p) is in contact with the outer covering 31f. .

導線用延長端子接続工程の後、電線31の先端(端部)は樹脂封止部39で樹脂封止され、樹脂封止部39の先端面から導線用延長端子32(導線用延長板部32f)が延長されて第1導体層パターン12p(第1配線基板10)に対向する構成とされる。   After the lead wire extension terminal connecting step, the tip end (end portion) of the electric wire 31 is resin-sealed with a resin sealing portion 39, and the lead wire extension terminal 32 (lead wire extension plate portion 32f) extends from the tip end surface of the resin seal portion 39. ) Are extended to face the first conductor layer pattern 12p (first wiring board 10).

上述したとおり、電線部品準備工程で準備される電線部品30では、樹脂封止部39から延長され第1導体層パターン12pに対向する導線用延長板部32fを有する導線用延長端子32と導線31cとが接続してあり、また、第1導体層パターン12pおよび第2導体層パターン22pと電線31との接続に応じて適宜次の構成としてある。   As described above, in the electric wire component 30 prepared in the electric wire component preparation step, the conductive wire extension terminal 32 and the conductive wire 31c having the conductive wire extension plate portion 32f extending from the resin sealing portion 39 and facing the first conductor layer pattern 12p. Are connected to each other, and the following configuration is appropriately set according to the connection between the first conductor layer pattern 12p and the second conductor layer pattern 22p and the electric wire 31.

つまり、電線部品30では、樹脂封止部39から延長され導線用延長板部32fに並置されて第1導体層パターン12pに対向する被覆部用延長板部33fを有する被覆部用延長端子33と導線31cを絶縁して被覆する被覆部31hとが結合してある。   That is, in the electric wire component 30, the covering portion extension terminal 33 having the covering portion extension plate portion 33f extending from the resin sealing portion 39 and juxtaposed with the conductive wire extension plate portion 32f and facing the first conductor layer pattern 12p; A covering portion 31h that insulates and covers the conductive wire 31c is coupled.

また、電線部品30では、電線31と交差する方向で延長され樹脂封止部39の表面に配設された外側導線用延長交差端部36pを有する外側導線用延長交差端子36と被覆部31hの外周に配設された外側導線31sとが接続してある(図3H参照)。   Further, in the electric wire component 30, the outer conductor extended cross terminal 36p having the outer conductor extended cross end 36p extended in the direction intersecting the electric wire 31 and disposed on the surface of the resin sealing portion 39 and the covering portion 31h are provided. The outer conductor 31s disposed on the outer periphery is connected (see FIG. 3H).

また、電線部品30では、電線31と交差する方向で延長され樹脂封止部39の表面に配設された外側被覆部用延長交差端部37pを有する外側被覆部用延長交差端子37と外側導線31sを絶縁して被覆する外側被覆部31fとが当接してある。   Further, in the electric wire component 30, the outer covering portion extended crossing terminal 37 and the outer conductive wire which are extended in the direction intersecting with the electric wire 31 and have the outer covering portion extended intersection end portion 37 p disposed on the surface of the resin sealing portion 39. An outer covering portion 31f that insulates and covers 31s is in contact.

また、他の形態の電線部品30とした場合には、樹脂封止部39から延長され導線用延長板部32fに並置されて第1導体層パターン12pに対向する外側導線用延長板部34fを有する外側導線用延長端子34と被覆部31hの外周に配設された外側導線31sとが接続されることとなる(図3F参照)。また、電線31と交差して樹脂封止部39の表面に配設された外側導線用交差端部35pを有する外側導線用交差端子35と被覆部31hの外周に配設された外側導線31sとが接続されることとなる(図3A、図3C、図3D、図3G参照)。   Further, in the case of the electric wire component 30 of another form, the outer conductive wire extension plate portion 34f extending from the resin sealing portion 39 and juxtaposed with the conductive wire extension plate portion 32f and facing the first conductor layer pattern 12p is provided. The outer conductive wire extension terminal 34 and the outer conductive wire 31s disposed on the outer periphery of the covering portion 31h are connected (see FIG. 3F). Also, an outer conductor crossing terminal 35 having an outer conductor crossing end 35p that is disposed on the surface of the resin sealing portion 39 so as to intersect the electric wire 31, and an outer conductor 31s disposed on the outer periphery of the covering portion 31h. Are connected (see FIGS. 3A, 3C, 3D, and 3G).

工程S11:
図8は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の第1配線基板準備工程で準備した第1配線基板を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。
Step S11:
FIG. 8 is an explanatory view showing the first wiring board prepared in the first wiring board preparation step of the electric wire composite printed wiring board manufacturing method according to Embodiment 2 of the present invention, (A) is a plan view, ) Is an end view showing the end face of the cross section at arrow BB in (A).

第1配線基板10を構成する内層部材を準備する。つまり、第1絶縁基材11および第1導体層パターン12pを有する第1配線基板10を準備する(第1配線基板準備工程)。第1配線基板10は、電線複合プリント配線基板1を多層配線構造とするために両面配線基板として構成され、第1絶縁基材11の両面に形成された第1導体層パターン12pを有する。第1配線基板10は、電線部品30(樹脂封止部39)を並置する電線部品配置用開口部10wを予め形成しておく。   An inner layer member constituting the first wiring board 10 is prepared. That is, the 1st wiring board 10 which has the 1st insulating base material 11 and the 1st conductor layer pattern 12p is prepared (1st wiring board preparation process). The first wiring board 10 is configured as a double-sided wiring board so that the electric wire composite printed wiring board 1 has a multilayer wiring structure, and has a first conductor layer pattern 12p formed on both surfaces of the first insulating base 11. The first wiring substrate 10 is formed in advance with an electric wire component placement opening 10w for juxtaposing the electric wire component 30 (resin sealing portion 39).

第1配線基板10は、両面リジッド配線基板としてあり、第1絶縁基材11は、例えばガラスエポキシ樹脂で構成され、厚さは例えば0.2mmである。厚さはこれに限らず、例えば0.4ないし1.2mm程度とすることも可能である。また、第1絶縁基材11の両面に積層された第1導体層12は、例えば銅箔で構成され、厚さは例えば18μmとしてあり、第1導体層12をパターニングして第1導体層パターン12pを形成する。なお、以下の各工程での処理は、第1配線基板10の両面で対称的に行なわれる。   The first wiring board 10 is a double-sided rigid wiring board, and the first insulating base 11 is made of, for example, a glass epoxy resin and has a thickness of, for example, 0.2 mm. The thickness is not limited to this, and can be about 0.4 to 1.2 mm, for example. Moreover, the 1st conductor layer 12 laminated | stacked on both surfaces of the 1st insulating base material 11 is comprised, for example with copper foil, and thickness is 18 micrometers, for example, the 1st conductor layer 12 is patterned and the 1st conductor layer pattern 12p is formed. The processes in the following steps are performed symmetrically on both surfaces of the first wiring board 10.

また、電線部品30(電線31)の端部(樹脂封止部39)を配置する電線部品配置用開口部10wを例えばNC(数値制御)ルーター加工により形成してある。電線部品配置用開口部10wは、配置する電線31の端部(樹脂封止部39)に対して、第2配線基板20を積層したときに第1配線基板10と樹脂封止部39との隙間が接着剤で充填される程度の距離で形成することが好ましい。   Moreover, the opening part 10w for electric wire component arrangement | positioning which arrange | positions the edge part (resin sealing part 39) of the electric wire component 30 (electric wire 31) is formed by NC (numerical control) router processing, for example. The wire component placement opening 10w is formed between the first wiring substrate 10 and the resin sealing portion 39 when the second wiring substrate 20 is stacked on the end portion (resin sealing portion 39) of the electric wire 31 to be arranged. It is preferable that the gap be formed at a distance such that the gap is filled with the adhesive.

工程S12:
図9は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の第2配線基板準備工程で準備した第2配線基板を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。
Step S12:
FIG. 9 is an explanatory view showing the second wiring board prepared in the second wiring board preparation step of the electric wire composite printed wiring board manufacturing method according to Embodiment 2 of the present invention, (A) is a plan view, ) Is an end view showing the end face of the cross section at arrow BB in (A).

第2配線基板20を構成する外層部材を準備する。つまり、第2絶縁基材21および第2導体層22を有する第2配線基板20を準備する(第2配線基板準備工程)。第2配線基板20は、電線複合プリント配線基板1を多層配線構造とするために第1配線基板10の両面にそれぞれ対向するように準備され、第1配線基板10に対向する面に第2絶縁基材21を配置し、外側に第2導体層22を配置した第2配線基板20として準備される。第2配線基板20は、第1配線基板10および電線部品30(樹脂封止部39)に積層する形状として準備される。   An outer layer member constituting the second wiring board 20 is prepared. That is, the 2nd wiring board 20 which has the 2nd insulating base material 21 and the 2nd conductor layer 22 is prepared (2nd wiring board preparation process). The second wiring board 20 is prepared so as to face both surfaces of the first wiring board 10 in order to make the electric wire composite printed wiring board 1 have a multilayer wiring structure, and the second insulation is formed on the face facing the first wiring board 10. Prepared as a second wiring board 20 in which a base material 21 is disposed and a second conductor layer 22 is disposed outside. The 2nd wiring board 20 is prepared as a shape laminated | stacked on the 1st wiring board 10 and the electric wire component 30 (resin sealing part 39).

第2配線基板20は、例えば第2導体層22に第2絶縁基材21を積層して形成することが可能である。具体的には、例えば、厚さ18μmの銅箔で構成される第2導体層22に、厚さ100μmのエポキシ系接着剤を塗布して第2絶縁基材21を形成する。   The second wiring board 20 can be formed by, for example, laminating the second insulating base material 21 on the second conductor layer 22. Specifically, for example, the second insulating substrate 21 is formed by applying an epoxy adhesive having a thickness of 100 μm to the second conductor layer 22 made of a copper foil having a thickness of 18 μm.

また、第1配線基板10および樹脂封止部39に第2配線基板20を積層したとき、電線31が第2配線基板20に接着しないように、電線31を第2配線基板20から分離する電線分離用開口部20wを例えばNCルーター加工により形成してある。つまり、工程13以降で、電線31は、電線分離用開口部20wに配置されることとなる。   In addition, when the second wiring board 20 is stacked on the first wiring board 10 and the resin sealing portion 39, the electric wires 31 are separated from the second wiring board 20 so that the electric wires 31 are not bonded to the second wiring board 20. The separation opening 20w is formed by NC router processing, for example. That is, the electric wire 31 will be arrange | positioned in the opening part 20w for electric wire separation after the process 13.

工程S13:
図10は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の導線用延長板部位置合わせ工程で電線部品、第1配線基板、第2配線基板を相互に位置合わせした状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。
Step S13:
FIG. 10 shows a state in which the electric wire component, the first wiring board, and the second wiring board are aligned with each other in the conductive wire extension plate positioning step of the electric wire composite printed wiring board manufacturing method according to Embodiment 2 of the present invention. It is explanatory drawing shown, (A) is a top view, (B) is an end view which shows the end surface of the cross section in the arrow BB of (A).

準備した電線部品30、内層部材(第1配線基板10)および外層部材(第2配線基板20)を組み立てる。つまり、電線部品30を電線部品配置用開口部10wに配置して、第1導体層パターン12pを形成した第1配線基板10と電線部品30(樹脂封止部39)とを並置して導線用延長板部32fが有する接続孔32hを第1導体層パターン12pに位置合わせする(導線用延長板部位置合わせ工程)。   The prepared electric wire component 30, the inner layer member (first wiring board 10), and the outer layer member (second wiring board 20) are assembled. That is, the electric wire component 30 is arranged in the electric wire component arrangement opening 10w, and the first wiring board 10 on which the first conductor layer pattern 12p is formed and the electric wire component 30 (resin sealing portion 39) are juxtaposed. The connection hole 32h of the extension plate portion 32f is aligned with the first conductor layer pattern 12p (conductive wire extension plate portion alignment step).

また、併せて第2配線基板20を第1配線基板10および樹脂封止部39に位置合わせして重畳する。相互間での位置の固定は、例えばピンラミネーションガイド52(図20参照)を適用して行なう。   In addition, the second wiring board 20 is aligned and superimposed on the first wiring board 10 and the resin sealing portion 39. The positions are fixed between each other, for example, by applying a pin lamination guide 52 (see FIG. 20).

なお、導線用延長板部位置合わせ工程では、配線基板の積層方向に対称的に配置された導線用延長板部32fの間に第1配線基板10を挿入する形態となるので、積層方向に対称的に配置された導線用延長板部32fの間に第1配線基板10を容易に挿入できるように電線部品配置用開口部10wを予め形成しておく(第1配線基板準備工程)。   In the conductive wire extension plate portion alignment step, the first wiring substrate 10 is inserted between the conductive wire extension plate portions 32f arranged symmetrically in the wiring substrate laminating direction, so that it is symmetric in the laminating direction. The wire component placement opening 10w is formed in advance so that the first wiring board 10 can be easily inserted between the conductive wire extension plate parts 32f (first wiring board preparation step).

また、導線用延長板部位置合わせ工程では、電線部品30の種類に応じて、接続孔32h以外の接続孔についても併せて位置合わせを行なう。例えば、被覆部用延長板部33fが有する接続孔33hを第1導体層パターン12pに位置合わせする。具体的には、接続孔32hと接続孔33hの配置関係は樹脂封止部39により予め固定されているので、いずれか一方を位置合わせすれば他方は、自己整合的に位置合わせされた状態となる。   Further, in the conductive wire extension plate portion alignment step, the connection holes other than the connection holes 32 h are also aligned according to the type of the electric wire component 30. For example, the connection hole 33h included in the covering extension plate 33f is aligned with the first conductor layer pattern 12p. Specifically, since the arrangement relationship between the connection holes 32h and the connection holes 33h is fixed in advance by the resin sealing portion 39, if one of them is aligned, the other is in a self-aligned state. Become.

また、他の形態の電線部品30とした場合では、導線用延長板部位置合わせ工程で外側導線用延長板部34fが有する接続孔34hを第1導体層パターン12pに位置合わせすることとなる。   Further, in the case of the electric wire component 30 of another form, the connection hole 34h included in the outer conductive wire extension plate portion 34f is aligned with the first conductor layer pattern 12p in the conductive wire extension plate portion alignment step.

工程S14:
図11は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の第2配線基板積層工程で電線部品、第1配線基板、第2配線基板を相互に積層した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。
Step S14:
FIG. 11 is an explanatory view showing a state in which the electric wire component, the first wiring board, and the second wiring board are laminated together in the second wiring board lamination step of the electric wire composite printed wiring board manufacturing method according to Embodiment 2 of the present invention. (A) is a plan view, and (B) is an end view showing an end face of a cross section taken along arrows BB in (A).

導線用延長板部位置合わせ工程の後、第2導体層パターン22pを形成するための第2導体層22と第2絶縁基材21とを積層した第2配線基板20を樹脂封止部39および第1配線基板10に積層する(第2配線基板積層工程)。なお、電線31は、電線分離用開口部20wに対応して配置されることから、第2配線基板20は、電線31に積層されない状態となる。   After the conductive wire extension plate portion aligning step, the second wiring board 20 in which the second conductor layer 22 and the second insulating base material 21 for forming the second conductor layer pattern 22p are laminated is attached to the resin sealing portion 39 and Lamination is performed on the first wiring board 10 (second wiring board lamination step). In addition, since the electric wire 31 is arrange | positioned corresponding to the opening part 20w for electric wire separation, the 2nd wiring board 20 will be in the state which is not laminated | stacked on the electric wire 31. FIG.

第2配線基板積層工程は、公知の多層配線基板の積層工程と同様に、真空中で加熱、加圧することにより行なう。加熱、加圧により、電線部品配置用開口部10wに配置された電線部品30(樹脂封止部39)と第1配線基板10との隙間は、接着剤で構成される第2絶縁基材21で充填される。したがって、電線部品30(樹脂封止部39)は確実かつ強固に第1配線基板10および第2配線基板20に積層(接着)される。   The second wiring board stacking step is performed by heating and pressurizing in a vacuum as in the known multilayer wiring substrate stacking step. A gap between the electric wire component 30 (resin sealing portion 39) and the first wiring board 10 arranged in the electric wire component arrangement opening 10w and the first wiring substrate 10 by heating and pressurizing is the second insulating base material 21 made of an adhesive. Filled with. Therefore, the electric wire component 30 (resin sealing portion 39) is laminated (adhered) to the first wiring board 10 and the second wiring board 20 reliably and firmly.

樹脂封止部39は、直方体として形成され、第2絶縁基材21に対向する平面を有することから、平面性良く積層することが可能となり、平面性の良い多層配線構造の電線複合プリント配線基板1とすることができる。   Since the resin sealing portion 39 is formed as a rectangular parallelepiped and has a flat surface facing the second insulating base material 21, the resin sealing portion 39 can be laminated with good flatness, and the electric wire composite printed wiring board having a multilayer wiring structure with good flatness. 1 can be used.

導線用延長板部32f、被覆部用延長板部33fは、第1配線基板10に高精度に位置合わせしてあり、また、第1配線基板10に対する第2絶縁基材21の積層方向で第2絶縁基材21の平面性を維持できる適宜の厚さを有する構成としてあることから、平面性の良い電線複合プリント配線基板1とすることが可能となる。   The conductive wire extension plate portion 32f and the covering portion extension plate portion 33f are aligned with the first wiring board 10 with high accuracy, and the second insulating base material 21 is stacked in the stacking direction of the first wiring board 10 with respect to the first wiring board 10. 2 Since the insulating base 21 has an appropriate thickness that can maintain the flatness, the electric wire composite printed wiring board 1 with good flatness can be obtained.

工程S15:
図12は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の導通孔開口部形成工程で導通孔開口部を第2導体層に形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。
Step S15:
FIG. 12 is an explanatory view showing a state in which the conductive hole opening is formed in the second conductor layer in the conductive hole opening forming step of the method for manufacturing the electric wire composite printed wiring board according to Embodiment 2 of the present invention. ) Is a plan view, and (B) is an end view showing an end face of a cross section taken along arrows BB in (A).

第2配線基板積層工程の後、層間導通孔40(図13参照)を形成するための窓部となるビアホール(導通孔開口部40w)を第2導体層22に開ける(導通孔開口部形成工程)。導通孔開口部40wは、層間導通孔40を形成する領域に対応させて第2導体層22を適宜パターニングすることにより形成することが可能である。パターニングは、周知のエッチング技術を例えば銅箔に適用することにより行なうことが可能である。   After the second wiring board lamination step, a via hole (conduction hole opening 40w) serving as a window for forming the interlayer conduction hole 40 (see FIG. 13) is opened in the second conductor layer 22 (conduction hole opening formation step). ). The conduction hole opening 40w can be formed by appropriately patterning the second conductor layer 22 so as to correspond to a region where the interlayer conduction hole 40 is formed. Patterning can be performed by applying a well-known etching technique to, for example, copper foil.

導通孔開口部40wの内径は、第1導体層パターン12pに対する導通孔開口部40wの位置合わせ精度を考慮して接続孔32hの内径より大きくしてある。したがって、層間導通孔40の内径を接続孔32hの内径より大きくすることが可能となることから、層間導通孔40を容易かつ確実に接続孔32hに位置合わせして、確実な導通が可能な導通孔導体41を形成することが可能となる。なお、導通孔開口部40wの内径は、接続孔32h以外の接続孔33h、接続孔34hの内径に対しても大きく形成してある。   The inner diameter of the conduction hole opening 40w is larger than the inner diameter of the connection hole 32h in consideration of the alignment accuracy of the conduction hole opening 40w with respect to the first conductor layer pattern 12p. Accordingly, since the inner diameter of the interlayer conduction hole 40 can be made larger than the inner diameter of the connection hole 32h, the interlayer conduction hole 40 can be easily and surely aligned with the connection hole 32h, and conduction that enables reliable conduction. The hole conductor 41 can be formed. The inner diameter of the conduction hole opening 40w is larger than the inner diameters of the connection holes 33h and the connection holes 34h other than the connection holes 32h.

工程S16:
図13は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の層間導通孔形成工程で層間のビアホール(層間導通孔)を第2絶縁基材に形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。
Step S16:
FIG. 13 is an explanatory view showing a state in which interlayer via holes (interlayer conduction holes) are formed in the second insulating base material in the interlayer conduction hole forming step of the method for manufacturing an electric wire composite printed wiring board according to Embodiment 2 of the present invention. Yes, (A) is a plan view, and (B) is an end view showing the end face of the cross section at arrow BB in (A).

導通孔開口部形成工程の後、導通孔開口部40wが開口された第2導体層22をマスクとしてビアホール(層間導通孔40)を第2絶縁基材21に開ける(導通孔形成工程)。つまり、導線用延長板部32fが有する接続孔32hを通過して第1導体層パターン12pに至る層間導通孔40を第2絶縁基材21に形成する。   After the conductive hole opening forming step, a via hole (interlayer conductive hole 40) is opened in the second insulating substrate 21 using the second conductor layer 22 having the conductive hole opening 40w opened as a mask (conductive hole forming step). That is, an interlayer conduction hole 40 that passes through the connection hole 32 h of the conductive wire extension plate portion 32 f and reaches the first conductor layer pattern 12 p is formed in the second insulating substrate 21.

層間導通孔40は、第2絶縁基材21をレーザー加工によるエッチングで形成することが可能である。なお、導通孔開口部形成工程および導通孔形成工程は、連続する単一の工程として実行することが可能である。例えば、層間導通孔40w、層間導通孔40を連続的なレーザー加工によって行なうことも可能である。   The interlayer conduction hole 40 can be formed by etching the second insulating substrate 21 by laser processing. The conduction hole opening forming step and the conduction hole forming step can be executed as a single continuous step. For example, the interlayer conduction hole 40w and the interlayer conduction hole 40 can be formed by continuous laser processing.

なお、接続孔32hと第1導体層パターン12pとの間には、第2絶縁基材21が充填されているが、接続孔32hをマスクとして第2絶縁基材21をエッチングすることにより層間導通孔40を容易に形成することが可能である。   The second insulating base material 21 is filled between the connection hole 32h and the first conductor layer pattern 12p, but interlayer conduction is achieved by etching the second insulating base material 21 using the connection hole 32h as a mask. The hole 40 can be easily formed.

また、導通孔形成工程で、被覆部用延長板部33fが有する接続孔33hを通過して第1導体層パターン12pに至る層間導通孔40を第2絶縁基材21に形成する。さらに同様に、外側導線用延長交差端部36p(外側導線用延長交差端子36)に至る層間導通孔40を第2絶縁基材21に形成し、外側被覆部用延長交差端部37p(外側被覆部用延長交差端子37)に至る層間導通孔40を第2絶縁基材21に形成する。   Further, in the conduction hole forming step, the interlayer conduction hole 40 that reaches the first conductor layer pattern 12p through the connection hole 33h included in the covering extension plate 33f is formed in the second insulating base material 21. Further, similarly, an interlayer conduction hole 40 reaching the outer conductor extended intersection 36p (outer conductor extension intersection terminal 36) is formed in the second insulating substrate 21, and the outer covering extension extended intersection 37p (outer coating). An inter-layer conduction hole 40 reaching the part extending cross terminal 37) is formed in the second insulating substrate 21.

また、他の形態の電線部品30とした場合には、同様に導通孔形成工程で、外側導線用延長板部34fが有する接続孔34hを通過して第1導体層パターン12pに至る層間導通孔40を第2絶縁基材21に形成し、外側導線用交差端部35(外側導線用交差端部35p)に至る層間導通孔40を第2絶縁基材21に形成することとなる。   Further, in the case of the electric wire component 30 of another form, in the same way, in the conduction hole forming step, the interlayer conduction hole that reaches the first conductor layer pattern 12p through the connection hole 34h of the outer conductive wire extension plate part 34f. 40 is formed in the 2nd insulating base material 21, and the interlayer conduction hole 40 which reaches the crossing edge part 35 for outer side conductors (crossing edge part 35p for outer side conductors) is formed in the 2nd insulating base material 21.

工程S17:
図14は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の導通孔導体形成工程で層間のビアホール(層間導通孔)に導通孔導体を形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。
Step S17:
FIG. 14 is an explanatory diagram showing a state in which a conduction hole conductor is formed in an interlayer via hole (interlayer conduction hole) in the conduction hole conductor forming process of the method for manufacturing an electric wire composite printed wiring board according to Embodiment 2 of the present invention; (A) is a top view, (B) is an end view which shows the end surface of the cross section by the arrow BB of (A).

導通孔形成工程の後、第2絶縁基材21に形成したビアホール(層間導通孔40)に導通孔導体41を形成する(導通孔導体形成工程)。導通孔導体41の形成は、例えば銅メッキを第2配線基板20(第2導体層22)の全面に対して施すことで行なうことが可能である。導通孔導体41は、第2配線基板20の全面に形成されることから、導通孔40に対して信頼性の高い導体層を形成することとなる。   After the conduction hole forming step, a conduction hole conductor 41 is formed in the via hole (interlayer conduction hole 40) formed in the second insulating substrate 21 (conduction hole conductor forming step). The conduction hole conductor 41 can be formed by, for example, performing copper plating on the entire surface of the second wiring board 20 (second conductor layer 22). Since the conduction hole conductor 41 is formed on the entire surface of the second wiring board 20, a highly reliable conductor layer is formed with respect to the conduction hole 40.

導通孔導体41により、電線部品30(電線31)と各導体層(第1導体層パターン12p、第2導体層22)との接続が可能となる。   The conduction hole conductor 41 enables connection between the electric wire component 30 (the electric wire 31) and each conductor layer (the first conductor layer pattern 12p, the second conductor layer 22).

導線用延長板部32f(導線用延長端子32)は、導線用延長板部32fが有する接続孔32hを通過して第1導体層パターン12pに至る第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pおよび第2導体層22に接続される。   The conductive wire extension plate portion 32f (conductive wire extension terminal 32) passes through the connection hole 32h of the conductive wire extension plate portion 32f to the interlayer conduction hole 40 of the second insulating base material 21 reaching the first conductor layer pattern 12p. It is connected to the first conductor layer pattern 12p and the second conductor layer 22 through the formed conduction hole conductor 41.

また、被覆部用延長板部33f(被覆部用延長端子33)は、被覆部用延長板部33fが有する接続孔33hを通過して第1導体層パターン12pに至る第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pおよび第2導体層22に接続される。   The covering portion extension plate portion 33f (covering portion extension terminal 33) passes through the connection hole 33h of the covering portion extension plate portion 33f and reaches the first conductor layer pattern 12p. It is connected to the first conductor layer pattern 12p and the second conductor layer 22 through a conduction hole conductor 41 formed in the interlayer conduction hole 40.

また、外側導線用延長交差端部36p(外側導線用延長交差端子36)、外側被覆部用延長交差端部37p(外側被覆部用延長交差端子37)は、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介してそれぞれ第2導体層22(第2導体層パターン22p。図15A、図15B参照。)に接続される。   Further, the outer conductor extended crossing end portion 36p (outer conducting wire extended crossing terminal 36) and the outer covering portion extending crossing end portion 37p (outer covering portion extending crossing terminal 37) are connected to each other by the interlayer insulation of the second insulating substrate 21. Each is connected to the second conductor layer 22 (second conductor layer pattern 22p; see FIGS. 15A and 15B) through a conduction hole conductor 41 formed in the hole 40.

また、導通孔導体41は、第1導体層パターン12pと第2導体層22(第2導体層パターン22p)との間の接続も行なう構成としてある(図15B参照)。   In addition, the conduction hole conductor 41 is configured to make a connection between the first conductor layer pattern 12p and the second conductor layer 22 (second conductor layer pattern 22p) (see FIG. 15B).

他の形態の電線部品30とした場合では、外側導線用延長板部34f(外側導線用延長端子34)は、外側導線用延長板部34fが有する接続孔34hを通過して第1導体層パターン12pに至る第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続される。また、外側導線用交差端部35p(外側導線用交差端子35)は、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第2導体層22(第2導体層パターン22p)に接続される。   In the case of the electric wire component 30 of another form, the outer conductor extension plate portion 34f (outer conductor extension terminal 34) passes through the connection hole 34h of the outer conductor extension plate portion 34f and passes through the first conductor layer pattern. It is connected to the first conductor layer pattern 12p through the conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base material 21 reaching 12p. Further, the outer conductor crossing end portion 35p (outer conductor crossing terminal 35) is connected to the second conductor layer 22 (second conductor) via a conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base material 21. Connected to the layer pattern 22p).

工程S18:
図15Aは、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の第2導体層パターン形成工程で第2導体層パターンを形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。図15Bは、図15Aの要部断面の状態を示す説明図であり、(A)は図15A(A)の矢符X−X方向、(B)は図15A(A)の矢符Y−Y方向での断面の端面図である。
Step S18:
FIG. 15A is an explanatory view showing a state in which the second conductor layer pattern is formed in the second conductor layer pattern forming step of the electric wire composite printed wiring board manufacturing method according to Embodiment 2 of the present invention, and FIG. FIG. 4B is an end view showing the end face of the cross section at the arrow BB in FIG. FIG. 15B is an explanatory diagram showing the state of the cross section of the main part of FIG. 15A, (A) is the arrow XX direction of FIG. 15A (A), (B) is the arrow Y— of FIG. 15A (A). It is an end view of the cross section in the Y direction.

導通孔導体形成工程の後、第2導体層22をパターニングして第2導体層パターン22pを形成する(第2導体層パターン形成工程)。必要に応じた適宜の第2導体層パターン22pを形成することが可能である。   After the conduction hole conductor forming step, the second conductor layer 22 is patterned to form a second conductor layer pattern 22p (second conductor layer pattern forming step). It is possible to form an appropriate second conductor layer pattern 22p as required.

本実施の形態では、電線31の端部を第2導体層パターン22pで覆う形態(第2導体層パターン22pd、22pe、22pf、22pg)/囲む形態(第2導体層パターン22pa、22pb、22pc)を例示して説明する。また、接続孔32hに対して第2導体層パターン22pi、接続孔33hに対して第2導体層パターン22phを形成してある。   In the present embodiment, the end of the electric wire 31 is covered with the second conductor layer pattern 22p (second conductor layer pattern 22pd, 22pe, 22pf, 22pg) / enclosed (second conductor layer pattern 22pa, 22pb, 22pc). An example will be described. A second conductor layer pattern 22pi is formed for the connection hole 32h, and a second conductor layer pattern 22ph is formed for the connection hole 33h.

なお、第2導体層パターン22pa、22pb、22pc、22pd、22pe、22pf、22pgは、それぞれが有する複数の導通孔導体41を介して電線部品30、第1配線基板10と適宜接続してある。第2導体層パターン22pa、22pb、22pc、22pd、22pe、22pf、22pg、22ph、22piを特に区別する必要がない場合には、単に第2導体層パターン22pとする。なお、第1導体層パターン12pの配置状態については図8を適用し、電線部品30の各端子の配設状態については、図7を適用して説明する。   Note that the second conductor layer patterns 22pa, 22pb, 22pc, 22pd, 22pe, 22pf, and 22pg are appropriately connected to the electric wire component 30 and the first wiring board 10 through the plurality of conductive hole conductors 41 included therein. If there is no need to distinguish the second conductor layer patterns 22pa, 22pb, 22pc, 22pd, 22pe, 22pf, 22pg, 22ph, and 22pi, they are simply referred to as the second conductor layer pattern 22p. 8 is applied to the arrangement state of the first conductor layer pattern 12p, and the arrangement state of each terminal of the electric wire component 30 is described with reference to FIG.

第2導体層パターン22paの中央部は、導通孔導体41を介して外側被覆部用延長交差端子37に接続してある。つまり、外側被覆部用延長交差端部37p(外側被覆部用延長交差端子37)は、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第2導体層パターン22pに接続してある。   The center portion of the second conductor layer pattern 22pa is connected to the outer covering portion extended intersection terminal 37 via the conduction hole conductor 41. That is, the outer covering portion extended intersection end portion 37p (outer covering portion extended intersection terminal 37) is connected to the second conductor layer pattern via the conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base material 21. 22p.

また、第2導体層パターン22paの端部は、導通孔導体41を介して第1導体層パターン12pに接続してある。つまり、外側被覆部用延長交差端部37pに接続された第2導体層パターン22は、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続してある。   The end portion of the second conductor layer pattern 22pa is connected to the first conductor layer pattern 12p through the conduction hole conductor 41. That is, the second conductor layer pattern 22 connected to the outer covering portion extended intersection end portion 37p is connected to the first conductor layer pattern via the conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base material 21. 12p.

第2導体層パターン22paに接続される第2導体層パターン22pb、第2導体層パターン22pcは、それぞれ導通孔導体41を介して第1導体層パターン12pに接続してある。また、第2導体層パターン22paを介して外側被覆部用延長交差端部37pに接続された第2導体層パターン22pb、22pcは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続してある。   The second conductor layer pattern 22pb and the second conductor layer pattern 22pc connected to the second conductor layer pattern 22pa are connected to the first conductor layer pattern 12p via the conduction hole conductor 41, respectively. In addition, the second conductor layer patterns 22pb and 22pc connected to the outer covering portion extended intersection end portion 37p through the second conductor layer pattern 22pa are electrically connected to the interlayer conduction hole 40 of the second insulating base material 21. It is connected to the first conductor layer pattern 12p via the hole conductor 41.

したがって、第2導体層パターン22pb、第2導体層パターン22pcは、電線31から互いに反対方向で離れた位置にある第1導体層パターン12pそれぞれを外側被覆部用延長交差端子37によって電線31と交差させて接続することが可能となる。つまり、第1導体層パターン12pの配線自由度を向上させ、また、導線用延長端子32の周囲を囲む第1導体層パターン12pとすることができる。   Accordingly, the second conductor layer pattern 22pb and the second conductor layer pattern 22pc cross the first conductor layer pattern 12p at a position away from the electric wire 31 in the opposite direction to the electric wire 31 by the outer covering portion extended intersection terminal 37. Can be connected. That is, the degree of freedom of wiring of the first conductor layer pattern 12p can be improved, and the first conductor layer pattern 12p surrounding the conductive wire extension terminal 32 can be obtained.

第2導体層パターン22pdの中央部は、導通孔導体41を介して外側導線用延長交差端子36(外側導線用延長交差端部36p)に接続してある。つまり、外側導線用延長交差端部36p(外側導線用延長交差端子36)は、第2絶縁基材21の導通孔導体41を介して第2導体層パターン22peおよび第2導体層パターン22pfに接続してある。また、第2導体層パターン22pdの両端は、第2導体層パターン22peおよび第2導体層パターン22pfと接続(一体に形成)され、第2導体層パターン22pdおよび第2導体層パターン22pfは、第2絶縁基材21の導通孔導体41を介して第1導体層パターン12pに接続してある。   The central portion of the second conductor layer pattern 22pd is connected to the outer conductor extension crossing terminal 36 (outer conductor extension crossing end 36p) through the conduction hole conductor 41. In other words, the outer conductor extended intersection end 36p (outer conductor extended intersection terminal 36) is connected to the second conductor layer pattern 22pe and the second conductor layer pattern 22pf via the conduction hole conductor 41 of the second insulating substrate 21. It is. Further, both ends of the second conductor layer pattern 22pd are connected (integrally formed) with the second conductor layer pattern 22pe and the second conductor layer pattern 22pf, and the second conductor layer pattern 22pd and the second conductor layer pattern 22pf are 2 It is connected to the first conductor layer pattern 12p through the conduction hole conductor 41 of the insulating base material 21.

したがって、電線31から互いに反対方向で離れた位置にある第1導体層パターン12pそれぞれを第2導体層パターン22pe、22pfおよび外側導線用延長交差端部36pによって電線31と交差させて接続することから、第1導体層パターン12pおよび第2導体層パターン22pの配線自由度を向上させることが可能となる。また、導線用延長板部32fの外側に配置された第2導体層パターン22pによって導線用延長端子32を囲むことが可能となり、導線用延長端子32に対する外部からの電気的影響(電磁ノイズ)を排除することができる。   Therefore, each of the first conductor layer patterns 12p located at positions away from each other in the opposite direction from the electric wire 31 is connected to the electric wire 31 by being intersected by the second conductor layer patterns 22pe and 22pf and the outer conductor extended intersection 36p. It is possible to improve the degree of freedom of wiring of the first conductor layer pattern 12p and the second conductor layer pattern 22p. Further, the second conductor layer pattern 22p disposed outside the conductive wire extension plate portion 32f can surround the conductive wire extension terminal 32, so that the electrical influence (electromagnetic noise) from the outside on the conductive wire extension terminal 32 is reduced. Can be eliminated.

導線用延長端子32を覆うパターン形状としてある第2導体層パターン22pgは、第2導体層パターン22pdと一体とされ外側導線用延長交差端部36p(外側導線用延長交差端子36)に接続される。したがって、外側導線31s(外側導線用延長交差端部36p)に接続された第2導体層パターン22pgを導線31c(導線用延長端子32)に対する遮蔽部として確実に作用させることが可能となる。   The second conductor layer pattern 22pg having a pattern shape covering the conductor extension terminal 32 is integrated with the second conductor layer pattern 22pd and connected to the outer conductor extension intersection 36p (outer conductor extension intersection terminal 36). . Therefore, the second conductor layer pattern 22pg connected to the outer conductor 31s (outer conductor extension crossing end 36p) can surely act as a shield for the conductor 31c (conductor extension terminal 32).

第2導体層パターン22phに対応する領域で、被覆部用延長板部33fは、被覆部用延長板部33fが有する接続孔33hを通過して第1導体層パターン12pに至る第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続される。また、被覆部用延長板部33f(接続孔33h)は、導通孔導体41を介して第2導体層パターン22phに接続してある。なお、被覆部用延長板部33fは、導線用延長板部32fの両側に並置してある。   In the region corresponding to the second conductor layer pattern 22ph, the covering portion extension plate portion 33f passes through the connection hole 33h of the covering portion extension plate portion 33f and reaches the first conductor layer pattern 12p. 21 is connected to the first conductor layer pattern 12p through a conduction hole conductor 41 formed in the interlayer conduction hole 40. The extension plate portion 33f for the covering portion (connection hole 33h) is connected to the second conductor layer pattern 22ph through the conduction hole conductor 41. The extension plate portion 33f for the covering portion is juxtaposed on both sides of the extension plate portion 32f for the conductive wire.

この構成により、電線31から互いに反対方向で離れた位置にある第1導体層パターン12pそれぞれを被覆部用延長端子33によって電線31と交差させて接続することが可能となることから、導線用延長端子の周囲に配置された第1導体層パターン12pの配線自由度を向上させることが可能となる。   With this configuration, each of the first conductor layer patterns 12p located away from each other in the opposite direction from the electric wire 31 can be connected to the electric wire 31 through the covering portion extension terminals 33, so that the conductor extension It becomes possible to improve the wiring flexibility of the first conductor layer pattern 12p arranged around the terminal.

被覆部用延長板部33fが接続された第2導体層パターン22phは独立して配置してあるが、適宜のパターンで他の第2導体層パターン22pと接続させることにより、電線31から互いに反対方向で離れた位置にある第2導体層パターン22pそれぞれを被覆部用延長端子33によって電線31と交差させて接続することが可能となることから、導線用延長端子32の周囲に配置された第2導体層パターン22pの配線自由度を向上させることが可能となる。   The second conductor layer pattern 22ph to which the extension plate portion 33f for the covering portion is connected is arranged independently. However, by connecting to the other second conductor layer pattern 22p in an appropriate pattern, the second conductor layer pattern 22ph is opposite to each other from the electric wire 31. Since each of the second conductor layer patterns 22p located in the direction away from each other can be connected to the electric wire 31 by the covering extension terminal 33, the second conductor layer pattern 22p is arranged around the conducting wire extension terminal 32. It is possible to improve the degree of freedom of wiring of the two conductor layer pattern 22p.

第2導体層パターン22piに対応する領域で、導線用延長板部32fは、導線用延長板部32fが有する接続孔32hを通過して第1導体層パターン12pに至る第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続してある。   In the region corresponding to the second conductor layer pattern 22pi, the conductor extension plate portion 32f passes through the connection hole 32h of the conductor extension plate portion 32f and reaches the first conductor layer pattern 12p. It is connected to the first conductor layer pattern 12p through a conduction hole conductor 41 formed in the interlayer conduction hole 40.

他の形態の電線部品30とした場合も同様にして、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して外側導線用延長端子34(外側導線用延長板部34f、接続孔34h)、外側導線用交差端子35(外側導線用交差端部35p)と第1導体層パターン12p、第2導体層パターン22pとを接続することが可能である。   Similarly, in the case of the electric wire component 30 of another form, the outer conductor extension terminal 34 (outer conductor extension plate portion) is formed through the conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base 21. 34f, connection hole 34h), outer conductor crossing terminal 35 (outer conductor crossing end 35p), the first conductor layer pattern 12p, and the second conductor layer pattern 22p can be connected.

工程S19:
図16は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法のソルダーレジスト形成工程で第2配線基板の表面にソルダーレジストを形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。
Step S19:
FIG. 16 is an explanatory view showing a state in which a solder resist is formed on the surface of the second wiring board in the solder resist forming step of the method for manufacturing an electric wire composite printed wiring board according to Embodiment 2 of the present invention. A top view and (B) are the end views which show the end surface of the cross section by arrow BB of (A).

第2配線基板20の表面にソルダーレジスト層(例えばフォトソルダーレジスト層)を塗布し、適宜パターニングすることによりレジスト開口部48(図19参照。)を有するソルダーレジスト47を形成する(ソルダーレジスト形成工程)。また、外形形成工程(工程S21参照。)で除去する不要領域1mでも除去を容易にするためにソルダーレジスト層を除去しておく。   A solder resist layer (for example, a photo solder resist layer) is applied to the surface of the second wiring board 20 and is appropriately patterned to form a solder resist 47 having a resist opening 48 (see FIG. 19) (solder resist forming step). ). Further, the solder resist layer is removed in order to facilitate the removal of the unnecessary region 1m to be removed in the outer shape forming step (see step S21).

工程S20:
図17は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の防錆膜形成工程で露出させた第2導体層パターンの表面に防錆膜を形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。
Step S20:
FIG. 17 is an explanatory view showing a state in which a rust preventive film is formed on the surface of the second conductor layer pattern exposed in the rust preventive film forming process of the method for manufacturing an electric wire composite printed wiring board according to Embodiment 2 of the present invention. Yes, (A) is a plan view, and (B) is an end view showing the end face of the cross section at arrow BB in (A).

ソルダーレジスト42を形成した後、レジスト開口部48に露出する第2導体層パターン22p(第2導体層パターン22pa)の表面に防錆処理を施して防錆膜49を形成する(防錆膜形成工程)。防錆処理は、例えば水溶性フラックスを適用して行なうことが可能である。   After forming the solder resist 42, the surface of the second conductor layer pattern 22p (second conductor layer pattern 22pa) exposed in the resist opening 48 is subjected to rust prevention treatment to form a rust prevention film 49 (rust prevention film formation). Process). The rust prevention treatment can be performed, for example, by applying a water-soluble flux.

工程S21:
図18は、本発明の実施の形態2に係る電線複合プリント配線基板製造方法の外形形成工程で第1配線基板および第2配線基板の外形を形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。
Step S21:
FIG. 18 is an explanatory view showing a state in which the outer shapes of the first wiring substrate and the second wiring substrate are formed in the outer shape forming step of the electric wire composite printed wiring board manufacturing method according to the second embodiment of the present invention. Is a plan view, and (B) is an end view showing an end face of a cross section taken along arrows BB in (A).

第1配線基板10および第2配線基板20の外形を形成する(外形形成工程)。この工程により、最終形状を有する電線複合プリント配線基板1が完成する。外形形成加工は、例えばNCルーターを適用して行なうことが可能である。   The outer shapes of the first wiring substrate 10 and the second wiring substrate 20 are formed (outer shape forming step). By this step, the electric wire composite printed wiring board 1 having the final shape is completed. The contour forming process can be performed by applying an NC router, for example.

工程S22:
完成した電線複合プリント配線基板1に対して検査を行なう(検査工程)。検査の種類としては、例えば電気検査や外観検査などがある。
Step S22:
The completed electric wire composite printed wiring board 1 is inspected (inspection process). Examples of inspection types include electrical inspection and appearance inspection.

図19は、本発明の実施の形態2に係る電線複合プリント配線基板の実際のレイアウト例を示す平面図である。   FIG. 19 is a plan view showing an actual layout example of the electric wire composite printed wiring board according to Embodiment 2 of the present invention.

本実施の形態に係る電線複合プリント配線基板1は、第2導体層パターン22pのレイアウトとして形成された部品を実装するための部品接続端子22pt(レジスト開口部48)を有する。なお、要部Am(電線部品30の端部。樹脂封止部39および電線31の端部)が図7ないし図18で説明した領域(電線複合プリント配線基板1の要部)に対応する。   The electric wire composite printed wiring board 1 according to the present embodiment has a component connection terminal 22pt (resist opening 48) for mounting a component formed as a layout of the second conductor layer pattern 22p. The main part Am (the end of the electric wire component 30; the resin sealing part 39 and the end of the electric wire 31) corresponds to the region described in FIGS. 7 to 18 (the main part of the electric wire composite printed wiring board 1).

上述したとおり、本実施の形態に係る電線複合プリント配線基板1は、第1絶縁基材11および第1導体層パターン12pを有する第1配線基板10と、導線31cを有する電線31および電線31の端部を樹脂封止して第1配線基板10に並置された樹脂封止部39を有する電線部品30と、第1配線基板10と樹脂封止部39とに積層された第2絶縁基材21および第2導体層パターン22pを有する第2配線基板20とを備える。   As described above, the electric wire composite printed wiring board 1 according to the present embodiment includes the first wiring board 10 having the first insulating base material 11 and the first conductor layer pattern 12p, the electric wires 31 having the conductive wires 31c, and the electric wires 31. An electric wire component 30 having a resin sealing portion 39 juxtaposed on the first wiring substrate 10 with the end portion being resin-sealed, and a second insulating base material laminated on the first wiring substrate 10 and the resin sealing portion 39 21 and a second wiring board 20 having a second conductor layer pattern 22p.

また、導線31cは、樹脂封止部39から延長され第1導体層パターン12pに対向する導線用延長板部32fを有する導線用延長端子32と接続され、導線用延長板部32fは、導線用延長板部32fが有する接続孔32hを通過して第1導体層パターン12pに至る第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続してある。   The conducting wire 31c is connected to a conducting wire extension terminal 32 having a conducting wire extension plate portion 32f extending from the resin sealing portion 39 and facing the first conductor layer pattern 12p, and the conducting wire extension plate portion 32f is connected to the conducting wire. The first conductor layer pattern 12p is passed through the conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base material 21 passing through the connection hole 32h of the extension plate portion 32f and reaching the first conductor layer pattern 12p. Connected.

したがって、導線31c(電線部品30)と第1導体層パターン12p(第1配線基板10)とを容易かつ強固に接続して、自由な立体配置が可能で、信号伝送を確実に行なえ、電線部品30と第1導体層パターン12pとの接続の信頼性が高い電線複合プリント配線基板1とすることが可能となる。   Therefore, the conductive wire 31c (the electric wire component 30) and the first conductor layer pattern 12p (the first wiring board 10) can be easily and firmly connected to each other, and free three-dimensional arrangement is possible, signal transmission can be performed reliably, and the electric wire component. It becomes possible to make the electric wire composite printed wiring board 1 having a high connection reliability between the first conductive layer pattern 12p and the wiring 30.

また、電線部品30は、導線31cを被覆する被覆部31hを有し、被覆部31hは、樹脂封止部39から延長され第1導体層パターン12pに対向する被覆部用延長板部33fを有する被覆部用延長端子33と結合され、被覆部用延長板部33fは、被覆部用延長板部33fが有する接続孔33hを通過して第1導体層パターン12pに至る第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続され、被覆部用延長板部33fは、導線用延長板部32fの両側に並置してある。   Moreover, the electric wire component 30 has the coating | coated part 31h which coat | covers the conducting wire 31c, and the coating | coated part 31h has the extending part 33f for coating | coated parts extended from the resin sealing part 39 and facing the 1st conductor layer pattern 12p. The extension part 33f for covering part, which is coupled to the extension terminal 33 for covering part, passes through the connection hole 33h of the extension plate part 33f for covering part and reaches the first conductor layer pattern 12p. It is connected to the first conductor layer pattern 12p via a conduction hole conductor 41 formed in the interlayer conduction hole 40, and the covering extension plate portion 33f is juxtaposed on both sides of the conducting wire extension plate portion 32f.

したがって、電線31から互いに反対方向で離れた位置にある第1導体層パターン12pそれぞれを被覆部用延長端子33によって電線31と交差させて接続することが可能となることから、導線用延長端子32の周囲に配置された第1導体層パターン12pの配線自由度を向上させることが可能となる。   Therefore, each of the first conductor layer patterns 12p located away from each other in the opposite direction from the electric wire 31 can be connected to the electric wire 31 so as to cross the electric wire 31 by the covering extension terminal 33. It is possible to improve the degree of freedom of wiring of the first conductor layer pattern 12p disposed around the.

また、被覆部用延長板部33fは、導通孔導体41を介して第2導体層パターン22pに接続してある。   The extension plate portion 33f for the covering portion is connected to the second conductor layer pattern 22p through the conduction hole conductor 41.

したがって、電線31から互いに反対方向で離れた位置にある第2導体層パターン22pそれぞれを被覆部用延長端子33によって電線31と交差させて接続することが可能となることから、導線用延長端子32の周囲に配置された第2導体層パターン22pの配線自由度を向上させることが可能となる。   Therefore, each of the second conductor layer patterns 22p located away from the electric wires 31 in opposite directions can be connected to the electric wires 31 by the covering extension terminals 33. It is possible to improve the degree of freedom of wiring of the second conductor layer pattern 22p arranged around the.

また、電線部品30は、被覆部31hの外周に配設された外側導線31cを有し、外側導線31cは、樹脂封止部39から延長され第1導体層パターン12pに対向する外側導線用延長板部34fを有する外側導線用延長端子34と接続され、外側導線用延長板部34fは、外側導線用延長板部34fが有する接続孔34hを通過して第1導体層パターン12pに至る第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続してある。   Moreover, the electric wire component 30 has the outer side conducting wire 31c arrange | positioned on the outer periphery of the coating | coated part 31h, and the outer side conducting wire 31c is extended from the resin sealing part 39, and is the extension for outer side conducting wires which opposes the 1st conductor layer pattern 12p. The outer conductive wire extension terminal 34f having the plate portion 34f is connected to the outer conductive wire extension plate portion 34f through the connection hole 34h of the outer conductive wire extension plate portion 34f to reach the first conductor layer pattern 12p. It is connected to the first conductor layer pattern 12p through a conduction hole conductor 41 formed in the interlayer conduction hole 40 of the insulating base material 21.

したがって、外側導線31c(電線部品30)と第1導体層パターン(第1配線基板10)とを容易かつ強固に接続して、自由な立体配置が可能で、外側導線31cによる信号伝送を確実に行なえ、電線部品30と第1導体層パターン12pとの接続の信頼性が高い電線複合プリント配線基板1とすることが可能となる。   Therefore, the outer conductor 31c (the electric wire component 30) and the first conductor layer pattern (first wiring board 10) can be easily and firmly connected to form a free three-dimensional arrangement, and signal transmission by the outer conductor 31c is ensured. Therefore, the electric wire composite printed wiring board 1 having high connection reliability between the electric wire component 30 and the first conductor layer pattern 12p can be obtained.

また、外側導線用延長板部34fは、導線用延長板部32fの両側に並置してある。   Further, the outer conductor extension plate portion 34f is juxtaposed on both sides of the conductor extension plate portion 32f.

したがって、電線31から互いに反対方向で離れた位置にある第1導体層パターン12pそれぞれを外側導線用延長端子34によって電線31と交差させて接続することから、導線用延長板部32fの外側に配設された外側導線用延長板部34fによって導線用延長端子32を囲むことが可能となり、例えば導線用延長端子32に対する外部からの電気的影響(電磁ノイズ)を排除することができる。   Accordingly, each of the first conductor layer patterns 12p that are located away from the electric wires 31 in the opposite directions is connected to the electric wires 31 by the outer conductive wire extension terminals 34, so that the first conductive layer patterns 12p are arranged outside the conductive wire extension plate portion 32f. It is possible to surround the conductor extension terminal 32 by the provided outer conductor extension plate portion 34f, and for example, it is possible to eliminate an electrical influence (electromagnetic noise) from the outside on the conductor extension terminal 32.

また、電線部品30は、被覆部31hの外周に配設された外側導線31cを有し、外側導線31cは、電線31と交差して樹脂封止部39の表面に配設された外側導線用交差端部35pを有する外側導線用交差端子35と接続され、外側導線用交差端部35pは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第2導体層パターン22pに接続してある。   Further, the electric wire component 30 has an outer conductor 31c disposed on the outer periphery of the covering portion 31h. The outer conductor 31c intersects the electric wire 31 and is disposed on the surface of the resin sealing portion 39. It is connected to the outer conductor crossing terminal 35 having the crossing end 35p, and the outer conductor crossing end 35p is connected to the second conductor via the conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating substrate 21. It is connected to the layer pattern 22p.

したがって、両面配線構造とされた第1配線基板10の各面にそれぞれ積層された第2導体層パターン22pを相互に接続できることから、多層(4層)構造とされた電線複合プリント配線基板1での第2導体層パターン22pの配線自由度を向上させることが可能となる。   Accordingly, since the second conductor layer patterns 22p laminated on the respective surfaces of the first wiring board 10 having the double-sided wiring structure can be connected to each other, the electric wire composite printed wiring board 1 having a multilayer (four-layer) structure can be used. The degree of freedom of wiring of the second conductor layer pattern 22p can be improved.

また、外側導線用交差端部35pに接続された第2導体層パターン22pは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続してある。   In addition, the second conductor layer pattern 22p connected to the outer conductor crossing end portion 35p is connected to the first conductor layer pattern 12p via the conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base material 21. Connected.

したがって、電線31から互いに反対方向で離れた位置にある第1導体層パターン12pそれぞれを第2導体層パターン22pおよび外側導線用交差端子35によって電線31と交差させて接続できることから、第1導体層パターン12pおよび第2導体層パターン22pの配線自由度を向上させることが可能となる。また、導線用延長板部32fの外側に配置された第2導体層パターン22pによって導線用延長端子32を囲むことが可能となり、導線用延長端子32に対する外部からの電気的影響(電磁ノイズ)を排除することができる。   Therefore, each of the first conductor layer patterns 12p located at positions away from each other in the opposite direction from the electric wire 31 can be connected to the electric wire 31 by being intersected by the second conductor layer pattern 22p and the outer conductor crossing terminal 35. It becomes possible to improve the wiring flexibility of the pattern 12p and the second conductor layer pattern 22p. Further, the second conductor layer pattern 22p disposed outside the conductive wire extension plate portion 32f can surround the conductive wire extension terminal 32, so that the electrical influence (electromagnetic noise) from the outside on the conductive wire extension terminal 32 is reduced. Can be eliminated.

また、外側導線用交差端部35pに接続された第2導体層パターン22pは、導線用延長端子32を覆うパターン形状としてある。   The second conductor layer pattern 22p connected to the outer conductor crossing end 35p has a pattern shape that covers the conductor extension terminal 32.

したがって、外側導線31c(外側導線用交差端部35p)に接続された第2導体層パターン22pを導線31c(導線用延長端子32)に対する遮蔽部として確実に作用させることが可能となる。   Therefore, the second conductor layer pattern 22p connected to the outer conductor 31c (outer conductor intersection end portion 35p) can be reliably acted as a shield for the conductor 31c (conductor extension terminal 32).

また、電線部品30は、被覆部31hの外周に配設された外側導線31cを有し、外側導線31cは、電線31と交差する方向で延長され樹脂封止部39の表面に配設された外側導線用延長交差端部36pを有する外側導線用延長交差端子36と接続され、外側導線用延長交差端部36pは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第2導体層パターン22pに接続してある。   Further, the electric wire component 30 has an outer conductive wire 31c disposed on the outer periphery of the covering portion 31h, and the outer conductive wire 31c is extended in a direction intersecting the electric wire 31 and disposed on the surface of the resin sealing portion 39. The outer conductor extended intersection terminal 36p having the outer conductor extended intersection 36p is connected, and the outer conductor extended intersection 36p is formed in the conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating substrate 21. It is connected to the second conductor layer pattern 22p via

したがって、電線31から互いに反対方向で離れた位置にある第2導体層パターン22pそれぞれを外側導線用延長交差端子36によって電線31と交差させて接続することから、導線用延長板部32fの外側に配置された第2導体層パターン22pの配線自由度を向上させることが可能となる。   Accordingly, each of the second conductor layer patterns 22p located away from each other in the opposite direction from the electric wire 31 is connected to the electric wire 31 by being crossed by the outer electric wire extension crossing terminal 36, so that the outer side of the conductive wire extension plate portion 32f. It becomes possible to improve the wiring flexibility of the arranged second conductor layer pattern 22p.

また、外側導線用延長交差端部36pに接続された第2導体層パターン22pは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続してある。   In addition, the second conductor layer pattern 22p connected to the outer conductor extended intersection 36p is connected to the first conductor layer pattern 12p via the conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base material 21. Is connected to.

したがって、電線31から互いに反対方向で離れた位置にある第1導体層パターン12pそれぞれを第2導体層パターン22pおよび外側導線用延長交差端子36によって電線31と交差させて接続することから、第1導体層パターン12pおよび第2導体層パターン22pの配線自由度を向上させることが可能となる。また、導線用延長板部32fの外側に配置された第2導体層パターン22pによって導線用延長端子32を囲むことが可能となり、導線用延長端子32に対する外部からの電気的影響(電磁ノイズ)を排除することができる。   Accordingly, each of the first conductor layer patterns 12p located at positions away from each other in the opposite direction from the electric wire 31 is connected to the electric wire 31 by being intersected by the second conductor layer pattern 22p and the outer conductor extended intersection terminal 36. It becomes possible to improve the wiring freedom of the conductor layer pattern 12p and the second conductor layer pattern 22p. Further, the second conductor layer pattern 22p disposed outside the conductive wire extension plate portion 32f can surround the conductive wire extension terminal 32, so that the electrical influence (electromagnetic noise) from the outside on the conductive wire extension terminal 32 is reduced. Can be eliminated.

また、外側導線用延長交差端部36pに接続された第2導体層パターン22pは、導線用延長端子32を覆うパターン形状としてある。   Further, the second conductor layer pattern 22p connected to the outer conductor extension crossing end 36p has a pattern shape covering the extension terminal 32 for conductor.

したがって、外側導線31c(外側導線用延長交差端部36p)に接続された第2導体層パターン22pを導線31c(導線用延長端子32)に対する遮蔽部として確実に作用させることが可能となる。   Therefore, the second conductor layer pattern 22p connected to the outer conductor 31c (outer conductor extension intersection 36p) can be reliably acted as a shield for the conductor 31c (conductor extension terminal 32).

また、電線部品30は、外側導線31cを被覆する外側被覆部31fを有し、外側被覆部31fは、電線31と交差する方向で延長され樹脂封止部39の表面に配設された外側被覆部用延長交差端部37pを有する外側被覆部用延長交差端子37と当接され、外側被覆部用延長交差端部37pは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第2導体層パターン22pに接続してある。   Further, the electric wire component 30 has an outer covering portion 31 f that covers the outer conductive wire 31 c, and the outer covering portion 31 f is extended in a direction intersecting with the electric wire 31 and disposed on the surface of the resin sealing portion 39. The outer covering portion extended intersection terminal 37 having the portion extending intersection end portion 37p is in contact with the outer covering portion extended intersection end portion 37p, and the outer covering portion extended intersection end portion 37p is formed in the conduction hole formed in the interlayer conduction hole 40 of the second insulating substrate 21. The conductor 41 is connected to the second conductor layer pattern 22p via the conductor 41.

したがって、電線31から互いに反対方向で離れた位置に配置された第2導体層パターン22pbと第2導体層パターン22pcは、第2導体層パターン22paが接続された外側被覆部用延長交差端子37によって電線31と交差させて接続されることから、導線用延長端子32の周囲に配置された第2導体層パターン22pの配線自由度を向上させることが可能となる。   Therefore, the second conductor layer pattern 22pb and the second conductor layer pattern 22pc arranged at positions away from each other in the opposite direction from the electric wire 31 are formed by the extended covering terminal 37 for the outer covering portion to which the second conductor layer pattern 22pa is connected. Since the wires 31 are crossed and connected, the degree of freedom of wiring of the second conductor layer pattern 22p disposed around the conductive wire extension terminal 32 can be improved.

また、外側被覆部用延長交差端部37pに接続された第2導体層パターン22pは、第2絶縁基材21の層間導通孔40に形成された導通孔導体41を介して第1導体層パターン12pに接続してある。   Further, the second conductor layer pattern 22p connected to the outer covering portion extended intersection end portion 37p is connected to the first conductor layer pattern via the conduction hole conductor 41 formed in the interlayer conduction hole 40 of the second insulating base material 21. 12p.

したがって、電線31から互いに反対方向で離れた位置にある第1導体層パターン12pそれぞれを外側被覆部用延長交差端子37によって電線31と交差させて接続することが可能となることから、導線用延長端子32の周囲に配置された第1導体層パターン12pの配線自由度を向上させ、また、導線用延長端子32の周囲を囲む第1導体層パターン12pとすることが可能となる。   Accordingly, each of the first conductor layer patterns 12p located at positions away from each other in the opposite direction from the electric wire 31 can be connected to the electric wire 31 by the outer covering portion extension crossing terminal 37. The degree of freedom of wiring of the first conductor layer pattern 12p arranged around the terminal 32 can be improved, and the first conductor layer pattern 12p surrounding the conductor extension terminal 32 can be obtained.

また、層間導通孔40の内径は接続孔32h、33h、34hの内径より大きくしてある。   The inner diameter of the interlayer conduction hole 40 is larger than the inner diameters of the connection holes 32h, 33h, 34h.

したがって、層間導通孔40を容易かつ確実に接続孔32h、33h、34hに位置合わせして、確実な導通が可能な導通孔導体41を形成することが可能となる。   Therefore, it is possible to easily and surely align the interlayer conduction hole 40 with the connection holes 32h, 33h, and 34h to form the conduction hole conductor 41 capable of reliable conduction.

また、第1導体層パターン12pは、第1配線基板10の両面に形成され、第2配線基板20は、第1配線基板10の両面にそれぞれ積層してあり、電線部品30は、第2配線基板20の積層方向で第1導体層パターン12pまたは第2導体層パターン22pに対称的に接続される構成としてある。   The first conductor layer pattern 12p is formed on both surfaces of the first wiring substrate 10, the second wiring substrate 20 is laminated on both surfaces of the first wiring substrate 10, and the electric wire component 30 is connected to the second wiring substrate 10. In the stacking direction of the substrate 20, the first conductor layer pattern 12p or the second conductor layer pattern 22p is symmetrically connected.

したがって、多層(4層)構造の配線基板の各導体層パターン(第1導体層パターン12p、第2導体層パターン22p)に対して両面で対称的に接続された電線部品30を有する電線複合プリント配線基板1とすることが可能となる。   Therefore, the electric wire composite print having the electric wire component 30 symmetrically connected on both sides to each conductor layer pattern (first conductor layer pattern 12p, second conductor layer pattern 22p) of the wiring board having a multilayer (four layers) structure. The wiring board 1 can be obtained.

上述したとおり、本実施の形態に係る電線複合プリント配線基板製造方法は、第1絶縁基材11および第1導体層パターン12pを有する第1配線基板10と、導線31cを有する電線31および電線31の端部を樹脂封止して第1配線基板10に並置された樹脂封止部39を有する電線部品30と、第1配線基板10と樹脂封止部39とに積層された第2絶縁基材21および第2導体層パターン22pを有する第2配線基板20とを備える電線複合プリント配線基板1を製造する方法である。   As described above, the electric wire composite printed wiring board manufacturing method according to the present embodiment includes the first wiring board 10 having the first insulating base material 11 and the first conductor layer pattern 12p, the electric wires 31 having the conductive wires 31c, and the electric wires 31. And the second insulating substrate laminated on the first wiring board 10 and the resin sealing portion 39. The electric wire component 30 having the resin sealing portion 39 juxtaposed with the first wiring substrate 10 by resin sealing the end portion thereof. This is a method of manufacturing the electric wire composite printed wiring board 1 including the material 21 and the second wiring board 20 having the second conductor layer pattern 22p.

また、本実施の形態に係る電線複合プリント配線基板製造方法は、樹脂封止部39から延長され第1導体層パターン12pに対向する導線用延長板部32fを有する導線用延長端子32と導線とを接続した電線部品30を準備する電線部品準備工程と、第1導体層パターン12pを形成した第1配線基板10と電線部品30とを並置して導線用延長板部32fが有する接続孔32hを第1導体層パターン12pに位置合わせする導線用延長板部位置合わせ工程と、導線用延長板部位置合わせ工程の後、第2導体層パターン22pを形成するための第2導体層22と第2絶縁基材21とを積層した第2配線基板20を樹脂封止部39および第1配線基板10に積層する第2配線基板積層工程と、導線用延長板部32fが有する接続孔32hを通過して第1導体層パターン12pに至る層間導通孔40を第2絶縁基材21に形成する導通孔形成工程と、導通孔形成工程で形成した層間導通孔40に導通孔導体41を形成する導通孔導体形成工程と、第2導体層22をパターニングして第2導体層パターン22pを形成する第2導体層パターン形成工程と、第1配線基板10および第2配線基板20の外形を形成する外形形成工程とを備える。   In addition, in the method for manufacturing the electric wire composite printed wiring board according to the present embodiment, the conductive wire extension terminal 32 and the conductive wire having the conductive wire extension plate portion 32f extending from the resin sealing portion 39 and facing the first conductive layer pattern 12p. A wire part preparing step for preparing the wire part 30 to which the first conductor layer pattern 12p is connected, the first wiring board 10 on which the first conductor layer pattern 12p is formed, and the wire part 30 are juxtaposed to form a connection hole 32h of the extension plate portion 32f for the conducting wire. After the conductor extension plate portion alignment step for aligning with the first conductor layer pattern 12p and the conductor extension plate portion alignment step, the second conductor layer 22 and the second conductor layer 22 for forming the second conductor layer pattern 22p Through the second wiring board lamination step of laminating the second wiring board 20 laminated with the insulating base material 21 on the resin sealing portion 39 and the first wiring board 10, and through the connection hole 32h of the extension board portion 32f for the conducting wire. Then, a conduction hole forming step for forming the interlayer conduction hole 40 reaching the first conductor layer pattern 12p in the second insulating substrate 21, and a conduction for forming the conduction hole conductor 41 in the interlayer conduction hole 40 formed in the conduction hole formation step. A hole conductor forming step, a second conductor layer pattern forming step of patterning the second conductor layer 22 to form the second conductor layer pattern 22p, and an outer shape for forming the outer shapes of the first wiring substrate 10 and the second wiring substrate 20 Forming step.

したがって、導線31c(電線部品30)と第1層導体層パターン12p(第1配線基板10)とを容易かつ強固に接続して、自由な立体配置が可能で、信号伝送を確実に行なえ、電線部品30と第1導体層パターン12pとの接続の信頼性が高い電線複合プリント配線基板1を生産性良く製造することが可能となる。   Therefore, the conductive wire 31c (the electric wire component 30) and the first layer conductor layer pattern 12p (the first wiring board 10) can be easily and firmly connected to each other so that a free three-dimensional arrangement is possible and signal transmission can be reliably performed. It becomes possible to manufacture the electric wire composite printed wiring board 1 having high connection reliability between the component 30 and the first conductor layer pattern 12p with high productivity.

また、電線部品準備工程で、樹脂封止部39から延長され導線用延長板部32fに並置されて第1導体層パターン12pに対向する被覆部用延長板部33fを有する被覆部用延長端子33と導線31cを絶縁して被覆する被覆部31hとを結合した電線部品30を準備し、導線用延長板部位置合わせ工程で、被覆部用延長板部33fが有する接続孔33hを第1導体層パターン12pに位置合わせし、導通孔形成工程で、被覆部用延長板部33fが有する接続孔33hを通過して第1導体層パターン12pに至る層間導通孔40を第2絶縁基材21に形成する。   Further, in the electric wire component preparation step, the covering portion extension terminal 33 having the covering portion extension plate portion 33f that extends from the resin sealing portion 39 and is juxtaposed to the conductive wire extension plate portion 32f and faces the first conductor layer pattern 12p. And a covering part 31h that insulates and covers the conductive wire 31c is prepared, and the connecting hole 33h provided in the covering extension plate part 33f is formed in the first conductor layer in the conductive wire extension plate part positioning step. Alignment with the pattern 12p, and formation of an interlayer conduction hole 40 in the second insulating substrate 21 that passes through the connection hole 33h of the extension plate portion 33f for the covering portion and reaches the first conductor layer pattern 12p in the conduction hole forming step. To do.

したがって、電線31から互いに反対方向で離れた位置にある第1導体層パターン12pそれぞれを被覆部用延長端子33によって電線31と交差させて容易かつ強固に接続することが可能となることから、導線用延長端子32の周囲に配置された第1導体層パターン12pの配線自由度を向上させた電線複合プリント配線基板1を生産性良く製造することが可能となる。   Therefore, each of the first conductor layer patterns 12p located at positions away from each other in the opposite direction from the electric wire 31 can be easily and firmly connected to the electric wire 31 by the covering portion extension terminals 33. It is possible to manufacture the electric wire composite printed wiring board 1 in which the degree of freedom of wiring of the first conductor layer pattern 12p disposed around the extension terminal 32 is improved with high productivity.

また、電線部品準備工程で、樹脂封止部39から延長され導線用延長板部32fに並置されて第1導体層パターン12pに対向する外側導線用延長板部34fを有する外側導線用延長端子34と被覆部31hの外周に配設された外側導線31sとを接続した電線部品30を準備し、導線用延長板部位置合わせ工程で、外側導線用延長板部34fが有する接続孔32hを第1導体層パターン12pに位置合わせし、導通孔形成工程で、外側導線用延長板部34fが有する接続孔34hを通過して第1導体層パターン12pに至る層間導通孔40を第2絶縁基材21に形成する。   Further, in the electric wire component preparation step, an outer conductor extension terminal 34 having an outer conductor extension plate portion 34f extending from the resin sealing portion 39 and juxtaposed with the conductor extension plate portion 32f and facing the first conductor layer pattern 12p. And the outer conductor 31s disposed on the outer periphery of the covering portion 31h are prepared, and in the conductor extension plate portion alignment step, the first connection hole 32h of the outer conductor extension plate portion 34f is provided. Alignment with the conductor layer pattern 12p, in the conduction hole forming step, the interlayer conduction hole 40 that reaches the first conductor layer pattern 12p through the connection hole 34h of the extension plate portion 34f for the outer conductor is provided in the second insulating substrate 21. To form.

したがって、外側導線31s(電線部品30)と第1層導体層パターン(第1配線基板10)とを容易かつ強固に接続して、自由な立体配置が可能で、外側導線31sによる信号伝送を確実に行なえ、電線部品30と第1導体層パターン12pとの接続の信頼性が高い電線複合プリント配線基板1を生産性良く製造することが可能となる。   Therefore, the outer conductor 31s (the electric wire component 30) and the first layer conductor layer pattern (first wiring board 10) can be easily and firmly connected to each other to allow free three-dimensional arrangement, and signal transmission by the outer conductor 31s is ensured. Therefore, it is possible to manufacture the electric wire composite printed wiring board 1 having high reliability in connection between the electric wire component 30 and the first conductor layer pattern 12p with high productivity.

また、電線部品準備工程で、電線31と交差して樹脂封止部39の表面に配設された外側導線用交差端部35pを有する外側導線用交差端子35と被覆部31hの外周に配設された外側導線31sとを接続した電線部品30を準備し、導通孔形成工程で、外側導線用交差端部35pに至る層間導通孔40を第2絶縁基材21に形成する。   Further, in the electric wire component preparation step, the outer conductive wire crossing terminal 35 having the outer conductive wire crossing end portion 35p crossing the electric wire 31 and disposed on the surface of the resin sealing portion 39 is disposed on the outer periphery of the covering portion 31h. An electric wire component 30 connected to the outer conductive wire 31s is prepared, and an interlayer conductive hole 40 reaching the outer conductive wire intersection end portion 35p is formed in the second insulating substrate 21 in a conductive hole forming step.

したがって、電線31から互いに反対方向で離れた位置にある第2導体層パターン22pそれぞれを外側導線用交差端子35によって電線31と交差させて接続できることから、導線用延長板部32fの周囲に配置された第2導体層パターン22pの配線自由度を向上させることが可能となる。   Accordingly, each of the second conductor layer patterns 22p located away from each other in the opposite direction from the electric wire 31 can be connected to the electric wire 31 by being intersected by the outer electric conductor crossing terminal 35, so that the second conductive layer pattern 22p is disposed around the conductive wire extension plate portion 32f. Further, the degree of freedom of wiring of the second conductor layer pattern 22p can be improved.

また、電線部品準備工程で、電線31と交差する方向で延長され樹脂封止部39の表面に配設された外側導線用延長交差端部36pを有する外側導線用延長交差端子36と被覆部の外周に配設された外側導線31sとを接続した電線部品30を準備し、導通孔形成工程で、外側導線用延長交差端部36pに至る層間導通孔40を第2絶縁基材21に形成する。   Further, in the electric wire component preparation step, the outer conductor extended cross terminal 36p having the outer conductor extended cross end 36p that is extended in the direction intersecting the electric wire 31 and disposed on the surface of the resin sealing portion 39, and the covering portion An electric wire component 30 connected to the outer conductor 31s disposed on the outer periphery is prepared, and an interlayer conduction hole 40 reaching the outer conductor extension crossing end 36p is formed in the second insulating substrate 21 in the conduction hole forming step. .

したがって、電線31から互いに反対方向で離れた位置にある第2導体層パターン22pそれぞれを外側導線用延長交差端子36によって電線31と交差させて接続できることから、導線用延長板部32fの周囲に配置された第2導体層パターン22pの配線自由度を向上させることが可能となる。   Therefore, each of the second conductor layer patterns 22p located away from the electric wire 31 in the opposite direction can be connected to the electric wire 31 by the outer conductive wire extension crossing terminal 36, so that it is arranged around the conductive wire extension plate portion 32f. It is possible to improve the wiring flexibility of the second conductor layer pattern 22p.

また、電線部品準備工程で、電線31と交差する方向で延長され樹脂封止部39の表面に配設された外側被覆部用延長交差端部37pを有する外側被覆部用延長交差端子37と外側導線31sを絶縁して被覆する外側被覆部31fとを当接させた電線部品30を準備し、導通孔形成工程で、外側被覆部用延長交差端部37pに至る層間導通孔40を第2絶縁基材21に形成する。   Further, in the electric wire component preparation step, the outer covering portion extended cross terminal 37 and the outer covering portion extended crossing terminal 37p which is extended in the direction intersecting with the electric wire 31 and disposed on the surface of the resin sealing portion 39 and the outer side. An electric wire component 30 is prepared in contact with the outer covering portion 31f that insulates and covers the conductive wire 31s, and the interlayer conduction hole 40 reaching the outer covering portion extended intersection end portion 37p is second insulated in the conduction hole forming step. Formed on the substrate 21.

したがって、電線31から互いに反対方向で離れた位置にある第2導体層パターン22pそれぞれを外側被覆部用延長交差端子37によって電線31と交差させて接続できることから、導線用延長端子32の周囲に配置された第2導体層パターン22pの配線自由度を向上させることが可能となる。   Therefore, each of the second conductor layer patterns 22p located away from each other in the opposite direction from the electric wire 31 can be connected to the electric wire 31 by the outer covering portion extension crossing terminal 37, so that the second conductor layer pattern 22p is arranged around the conducting wire extension terminal 32. It is possible to improve the wiring flexibility of the second conductor layer pattern 22p.

図20は、本発明の実施の形態2に係る電線複合プリント配線基板を製造するときに適用するワーク例を示す平面図である。   FIG. 20 is a plan view showing an example of a workpiece applied when manufacturing the electric wire composite printed wiring board according to Embodiment 2 of the present invention.

図19で完成品として示した電線複合プリント配線基板1は、実際の製造工程では、ワーク50に複数個(例えば16個)配置され、同時に16個の電線複合プリント配線基板1を製造することが可能な構成としてある。   In the actual manufacturing process, a plurality (for example, 16) of the electric wire composite printed wiring board 1 shown as a finished product in FIG. 19 is arranged on the work 50, and 16 electric wire composite printed wiring boards 1 can be manufactured at the same time. Possible configurations.

ワーク50は、例えば500mm×400mmの外形としてあり、加工ガイド51、ピンラミネーションガイド52を備える。加工ガイド51、ピンラミネーションガイド52は、例えばワーク50の4隅に配置してある。加工ガイド51、ピンラミネーションガイド52により、工程S10ないし工程S22での位置合わせ作業などを高精度かつ効率的に行なえる構成としてある。   The workpiece 50 has an outer shape of, for example, 500 mm × 400 mm, and includes a processing guide 51 and a pin lamination guide 52. The processing guide 51 and the pin lamination guide 52 are disposed at, for example, four corners of the workpiece 50. By the processing guide 51 and the pin lamination guide 52, the alignment work in the steps S10 to S22 can be performed with high accuracy and efficiency.

<実施の形態3>
本実施の形態に係る電子機器(不図示)は、実施の形態2に係る電線複合プリント配線基板1を搭載した電子機器としてある。つまり、電線部品30を接続された電線複合プリント配線基板1を搭載した電子機器としてある。
<Embodiment 3>
The electronic device (not shown) according to the present embodiment is an electronic device on which the electric wire composite printed wiring board 1 according to the second embodiment is mounted. That is, the electronic device includes the electric wire composite printed wiring board 1 to which the electric wire component 30 is connected.

電線複合プリント配線基板1の小型化、薄型化、および、筐体の形状に応じた自由な立体配置が可能であることから、筐体形状を小型化、薄型化して所望の形状とすることが可能で接続の信頼性が高い電子機器とすることが可能となる。   Since the wire composite printed wiring board 1 can be reduced in size and thickness, and can be freely arranged according to the shape of the housing, the housing shape can be reduced in size and thickness to a desired shape. It is possible to provide an electronic device that can be connected with high reliability.

なお、電子機器としては、高周波での優れた電気特性と小型軽量化が求められている携帯電話などの通信端末がある。   Note that electronic devices include communication terminals such as mobile phones that are required to have excellent electrical characteristics at high frequencies and to be small and light.

本発明の実施の形態1に係る電線部品を製造する電線部品製造方法の概略工程フローを示すフロー図である。It is a flowchart which shows the general | schematic process flow of the electric wire component manufacturing method which manufactures the electric wire component which concerns on Embodiment 1 of this invention. 本発明の実施の形態1に係る電線部品が備える電線の構造を模式的に示す説明図であり、(A)は正面図、(B)は先端側を示す側面図である。It is explanatory drawing which shows typically the structure of the electric wire with which the electric wire component which concerns on Embodiment 1 of this invention is equipped, (A) is a front view, (B) is a side view which shows the front end side. 本発明の実施の形態1に係る電線部品が備える電線の構造を模式的に示す説明図であり、(A)は正面図、(B)は先端側を示す側面図である。It is explanatory drawing which shows typically the structure of the electric wire with which the electric wire component which concerns on Embodiment 1 of this invention is equipped, (A) is a front view, (B) is a side view which shows the front end side. 本発明の実施の形態1に係る電線部品の中間品としての実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) shows the front end side. It is a side view. 図3Aに示した電線部品の中間品での導線用延長端子の実施例を示す説明図であり、(A)は分解斜視図、(B)は導線用延長端子を導線に接続した状態を示す斜視図である。It is explanatory drawing which shows the Example of the extension terminal for conducting wires in the intermediate product of the electric wire components shown to FIG. 3A, (A) is a disassembled perspective view, (B) shows the state which connected the extending terminal for conducting wires to the conducting wire. It is a perspective view. 本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the other Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a front end side. FIG. 本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the other Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a front end side. FIG. 本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the other Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a front end side. FIG. 本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the other Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a front end side. FIG. 本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the other Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a front end side. FIG. 本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the other Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a front end side. FIG. 本発明の実施の形態1に係る電線部品の中間品としての他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the other Example as an intermediate product of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a front end side. FIG. 本発明の実施の形態1に係る電線部品での電線の端部を樹脂封止した状態の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the Example of the state which carried out resin sealing of the edge part of the electric wire in the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view, (C) is a side view showing the tip side. 本発明の実施の形態1に係る電線部品での電線の端部を樹脂封止した状態の他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the other Example of the state which carried out resin sealing of the edge part of the electric wire in the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view FIG. 4C is a side view showing the tip side. 本発明の実施の形態1に係る電線部品での電線の端部を樹脂封止した状態の他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the other Example of the state which carried out resin sealing of the edge part of the electric wire in the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view FIG. 4C is a side view showing the tip side. 本発明の実施の形態1に係る電線部品での電線の端部を樹脂封止した状態の他の実施例を模式的に示す説明図であり、(A)は平面図、(B)は正面図、(C)は先端側を示す側面図である。It is explanatory drawing which shows typically the other Example of the state which carried out resin sealing of the edge part of the electric wire in the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) is a front view FIG. 4C is a side view showing the tip side. 本発明の実施の形態1に係る電線部品の実施例を模式的に示す説明図であり、(A)は平面図、(B)正面図である。It is explanatory drawing which shows typically the Example of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) It is a front view. 本発明の実施の形態1に係る電線部品の実施例を模式的に示す説明図であり、(A)は平面図、(B)正面図である。It is explanatory drawing which shows typically the Example of the electric wire component which concerns on Embodiment 1 of this invention, (A) is a top view, (B) It is a front view. 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の工程フローを概略的に示すフロー図である。It is a flowchart which shows schematically the process flow of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 2 of this invention. 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の電線部品準備工程で準備した電線部品を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the electric wire component prepared at the electric wire component preparation process of the electric wire composite printed wiring board manufacturing method concerning Embodiment 2 of this invention, (A) is a top view, (B) is an arrow of (A). It is an end elevation which shows the end surface of the cross section in BB. 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の第1配線基板準備工程で準備した第1配線基板を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the 1st wiring board prepared at the 1st wiring board preparation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 2 of this invention, (A) is a top view, (B) is (A It is an end view which shows the end surface of the cross section by arrow BB of). 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の第2配線基板準備工程で準備した第2配線基板を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the 2nd wiring board prepared at the 2nd wiring board preparation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 2 of this invention, (A) is a top view, (B) is (A It is an end view which shows the end surface of the cross section by arrow BB of). 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の導線用延長板部位置合わせ工程で電線部品、第1配線基板、第2配線基板を相互に位置合わせした状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the state which aligned the electric wire components, the 1st wiring board, and the 2nd wiring board in the extension board part alignment process for conducting wires of the electric wire composite printed wiring board manufacturing method according to Embodiment 2 of the present invention. Yes, (A) is a plan view, and (B) is an end view showing the end face of the cross section at arrow BB in (A). 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の第2配線基板積層工程で電線部品、第1配線基板、第2配線基板を相互に積層した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the state which laminated | stacked the electric wire component, the 1st wiring board, and the 2nd wiring board in the 2nd wiring board lamination process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 2 of this invention, ( (A) is a plan view, (B) is an end view showing an end face of a cross section at arrow BB in (A). 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の導通孔開口部形成工程で導通孔開口部を第2導体層に形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the state which formed the conduction hole opening in the 2nd conductor layer in the conduction hole opening formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 2 of this invention, (A) is a top view , (B) is an end view showing the end face of the cross section at the arrow BB in (A). 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の層間導通孔形成工程で層間のビアホール(層間導通孔)を第2絶縁基材に形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the state which formed the via hole (interlayer conduction hole) between layers in the 2nd insulating base material at the interlayer conduction hole formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 2 of this invention, (A ) Is a plan view, and (B) is an end view showing an end face of a cross section taken along arrows BB in (A). 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の導通孔導体形成工程で層間のビアホール(層間導通孔)に導通孔導体を形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the state which formed the conduction hole conductor in the via-hole (interlayer conduction hole) of an interlayer at the conduction hole conductor formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 2 of this invention, (A) A top view and (B) are the end views which show the end surface of the cross section by arrow BB of (A). 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の第2導体層パターン形成工程で第2導体層パターンを形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the state which formed the 2nd conductor layer pattern at the 2nd conductor layer pattern formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 2 of this invention, (A) is a top view, (B ) Is an end view showing the end face of the cross section at arrow BB in (A). 図15Aの要部断面の状態を示す説明図であり、(A)は図15A(A)の矢符X−X方向、(B)は図15A(A)の矢符Y−Y方向での断面の端面図である。It is explanatory drawing which shows the state of the principal part cross section of FIG. 15A, (A) is the arrow XX direction of FIG. 15A (A), (B) is the arrow YY direction of FIG. 15A (A). It is an end view of a cross section. 本発明の実施の形態2に係る電線複合プリント配線基板製造方法のソルダーレジスト形成工程で第2配線基板の表面にソルダーレジストを形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the state which formed the soldering resist on the surface of the 2nd wiring board at the soldering resist formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 2 of this invention, (A) is a top view, ( B) is an end view showing an end face of a cross section taken along arrows BB in (A). 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の防錆膜形成工程で露出させた第2導体層パターンの表面に防錆膜を形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the state which formed the antirust film on the surface of the 2nd conductor layer pattern exposed at the antirust film formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 2 of this invention, (A ) Is a plan view, and (B) is an end view showing an end face of a cross section taken along arrows BB in (A). 本発明の実施の形態2に係る電線複合プリント配線基板製造方法の外形形成工程で第1配線基板および第2配線基板の外形を形成した状態を示す説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing which shows the state which formed the external shape of the 1st wiring board and the 2nd wiring board in the external shape formation process of the electric wire composite printed wiring board manufacturing method which concerns on Embodiment 2 of this invention, (A) is a top view, (B) is an end elevation showing an end face of a cross section at arrow BB in (A). 本発明の実施の形態2に係る電線複合プリント配線基板の実際のレイアウト例を示す平面図である。It is a top view which shows the example of an actual layout of the electric wire composite printed wiring board which concerns on Embodiment 2 of this invention. 本発明の実施の形態2に係る電線複合プリント配線基板を製造するときに適用するワーク例を示す平面図である。It is a top view which shows the example of a workpiece | work applied when manufacturing the electric wire composite printed wiring board which concerns on Embodiment 2 of this invention. 従来例1に係るフレキシブルリジッド多層プリント配線板の説明図であり、(A)は平面図、(B)は(A)の矢符B−Bでの断面の端面を示す端面図である。It is explanatory drawing of the flexible rigid multilayer printed wiring board concerning the prior art example 1, (A) is a top view, (B) is an end elevation which shows the end surface of the cross section by the arrow BB of (A). 従来例2に係るプリント基板を説明する説明図であり、(A)は平面図、(B)は(A)の矢符Bでの側面図、(C)は(B)の矢符Rotに従って電線部品を折り曲げた状態での側面図である。It is explanatory drawing explaining the printed circuit board which concerns on the prior art example 2, (A) is a top view, (B) is a side view in the arrow B of (A), (C) is according to the arrow Rot of (B). It is a side view in the state where electric wire parts were bent. 従来例3に係るプリント基板を説明する説明図であり、(A)は平面図、(B)は(A)の矢符Bでの側面図、(C)は(B)の矢符Rotに従って電線部品を折り曲げた状態での側面図である。It is explanatory drawing explaining the printed circuit board which concerns on the prior art example 3, (A) is a top view, (B) is a side view in the arrow B of (A), (C) is according to the arrow Rot of (B). It is a side view in the state where electric wire parts were bent. 従来例4に係るプリント基板を説明する説明図であり、(A)は平面図、(B)は(A)の矢符Bでの側面図、(C)は(B)の矢符Rotに従って電線部品を折り曲げた状態での側面図である。It is explanatory drawing explaining the printed circuit board which concerns on the prior art example 4, (A) is a top view, (B) is a side view in the arrow B of (A), (C) is according to the arrow Rot of (B). It is a side view in the state where electric wire parts were bent.

符号の説明Explanation of symbols

1 電線複合プリント配線基板
10 第1配線基板
10w 電線部品配置用開口部
11 第1絶縁基材
12 第1導体層
12p 第1導体層パターン
20 第2配線基板
20w 電線分離用開口部
21 第2絶縁基材
22 第2導体層
22p 第2導体層パターン
30 電線部品
31 電線
31b 絶縁性心材
31c 導線
31h 被覆部
31s 外側導線
31f 外側被覆部
39 樹脂封止部
32 導線用延長端子
32c 導線用接続部
32f 導線用延長板部
32h 接続孔
33 被覆部用延長端子
33c 被覆部用結合部
33f 被覆部用延長板部
33h 接続孔
34 外側導線用延長端子
34c 外側導線用接続部
34f 外側導線用延長板部
34h 接続孔
35 外側導線用交差端子
35p 外側導線用交差端部
36 外側導線用延長交差端子
36p 外側導線用延長交差端部
37 外側被覆部用延長交差端子
37p 外側被覆部用延長交差端部
40 層間導通孔
40w 導通孔開口部
41 導通孔導体
47 ソルダーレジスト
48 接続開口部
50 ワーク
51 加工ガイド
52 ピンラミネーションガイド
DESCRIPTION OF SYMBOLS 1 Electric wire composite printed wiring board 10 1st wiring board 10w Opening part for electric wire components placement 11 1st insulation base material 12 1st conductor layer 12p 1st conductor layer pattern 20 2nd wiring board 20w Opening part for electric wire separation 21 2nd insulation Base material 22 2nd conductor layer 22p 2nd conductor layer pattern 30 Electric wire component 31 Electric wire 31b Insulating core material 31c Conductive wire 31h Cover part 31s Outer conductor 31f Outer sheath 39 Resin sealing part 32 Conductor extension terminal 32c Conductor connection part 32f Conductor extension plate portion 32h Connection hole 33 Cover portion extension terminal 33c Cover portion coupling portion 33f Cover portion extension plate portion 33h Connection hole 34 Outer conductor extension terminal 34c Outer conductor connection portion 34f Outer conductor extension plate portion 34h Connection hole 35 Outer conductor crossing terminal 35p Outer conductor crossing end 36 Outer conductor extension crossing terminal 36p Outside Extended crossing end portion for wire 37 Extended crossing terminal for outer covering portion 37p Extended crossing end portion for outer covering portion 40 Interlayer conduction hole 40w Conduction hole opening portion 41 Conduction hole conductor 47 Solder resist 48 Connection opening portion 50 Work 51 Processing guide 52 Pin Lamination guide

Claims (33)

第1絶縁基材および第1導体層パターンを有する第1配線基板と、導線を有する電線および該電線の端部を樹脂封止して前記第1配線基板に並置された樹脂封止部を有する電線部品と、前記第1配線基板と前記樹脂封止部とに積層された第2絶縁基材および第2導体層パターンを有する第2配線基板とを備えた電線複合プリント配線基板であって、
前記導線は、前記樹脂封止部から延長され前記第1導体層パターンに対向する導線用延長板部を有する導線用延長端子と接続され、
前記導線用延長板部は、前記導線用延長板部が有する接続孔を通過して前記第1導体層パターンに至る前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続してあること
を特徴とする電線複合プリント配線基板。
A first wiring substrate having a first insulating base material and a first conductor layer pattern; an electric wire having a conductive wire; and an end portion of the electric wire that is resin-sealed and juxtaposed with the first wiring substrate. An electric wire composite printed wiring board comprising: an electric wire component; and a second wiring substrate having a second insulating base material and a second conductor layer pattern laminated on the first wiring board and the resin sealing portion,
The conducting wire is connected to a conducting wire extension terminal having a conducting wire extension plate portion extending from the resin sealing portion and facing the first conductor layer pattern,
The conductive wire extension plate portion passes through a conductive hole conductor formed in an interlayer conductive hole of the second insulating base material that passes through a connection hole of the conductive wire extension plate portion and reaches the first conductive layer pattern. An electric wire composite printed wiring board characterized by being connected to the first conductor layer pattern.
前記電線部品は、導線を被覆する被覆部を有し、該被覆部は、前記樹脂封止部から延長され前記第1導体層パターンに対向する被覆部用延長板部を有する被覆部用延長端子と結合され、
前記被覆部用延長板部は、前記被覆部用延長板部が有する接続孔を通過して前記第1導体層パターンに至る前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続され、
前記被覆部用延長板部は、前記導線用延長板部の両側に並置してあることを特徴とする請求項1に記載の電線複合プリント配線基板。
The electric wire component has a covering portion that covers a conductive wire, and the covering portion extends from the resin sealing portion and has an extension plate portion for covering portion that faces the first conductor layer pattern. Combined with
The covering extension plate portion includes a conduction hole conductor formed in an interlayer conduction hole of the second insulating base material that passes through a connection hole of the covering portion extension plate portion and reaches the first conductor layer pattern. Connected to the first conductor layer pattern via,
2. The electric wire composite printed wiring board according to claim 1, wherein the covering portion extension plate portion is juxtaposed on both sides of the conductive wire extension plate portion.
前記被覆部用延長板部は、前記導通孔導体を介して前記第2導体層パターンに接続してあることを特徴とする請求項2に記載の電線複合プリント配線基板。   The electric wire composite printed wiring board according to claim 2, wherein the extension plate portion for the covering portion is connected to the second conductor layer pattern through the conduction hole conductor. 前記電線部品は、前記被覆部の外周に配設された外側導線を有し、該外側導線は、前記樹脂封止部から延長され前記第1導体層パターンに対向する外側導線用延長板部を有する外側導線用延長端子と接続され、
前記外側導線用延長板部は、前記外側導線用延長板部が有する接続孔を通過して前記第1導体層パターンに至る前記第2絶縁基材の層間導通孔に形成された前記導通孔導体を介して前記第1導体層パターンに接続してあることを特徴とする請求項1ないし請求項3のいずれか一つに記載の電線複合プリント配線基板。
The electric wire component has an outer conductive wire disposed on the outer periphery of the covering portion, and the outer conductive wire has an outer conductive wire extension plate portion extending from the resin sealing portion and facing the first conductor layer pattern. Connected to the extension terminal for the outer conductor having
The outer conductive wire extension plate is formed in the conductive hole conductor formed in the interlayer conductive hole of the second insulating base material that passes through the connection hole of the outer conductive wire extension plate and reaches the first conductive layer pattern. The electric wire composite printed wiring board according to any one of claims 1 to 3, wherein the electric wire composite printed wiring board is connected to the first conductor layer pattern via a wire.
前記外側導線用延長板部は、前記導線用延長板部の両側に並置してあることを特徴とする請求項4に記載の電線複合プリント配線基板。   The electric wire composite printed wiring board according to claim 4, wherein the outer conductive wire extension plate is juxtaposed on both sides of the conductive wire extension plate. 前記外側導線用延長板部が有する前記接続孔は、前記外側導線用延長板部の延長方向に沿って複数形成してあることを特徴とする請求項4または請求項5に記載の電線複合プリント配線基板。   6. The electric wire composite print according to claim 4, wherein a plurality of the connection holes of the outer conductive wire extension plate are formed along an extending direction of the outer conductive wire extension plate. Wiring board. 前記電線部品は、前記被覆部の外周に配設された外側導線を有し、該外側導線は、前記電線と交差して前記樹脂封止部の表面に配設された外側導線用交差端部を有する外側導線用交差端子と接続され、
前記外側導線用交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続してあることを特徴とする請求項1ないし請求項3のいずれか一つに記載の電線複合プリント配線基板。
The electric wire component has an outer conductive wire disposed on the outer periphery of the covering portion, and the outer conductive wire intersects with the electric wire and is disposed on the surface of the resin sealing portion. Connected to the outer conductor crossing terminal having
The crossing end portion for the outer conductor is connected to the second conductor layer pattern through a conduction hole conductor formed in an interlayer conduction hole of the second insulating base. Item 4. The electric wire composite printed wiring board according to any one of Items 3 to 5.
前記外側導線用交差端部に接続された前記第2導体層パターンは、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続してあることを特徴とする請求項7に記載の電線複合プリント配線基板。   The second conductor layer pattern connected to the outer conductor crossing end is connected to the first conductor layer pattern via a conduction hole conductor formed in an interlayer conduction hole of the second insulating base. The electric wire composite printed wiring board according to claim 7. 前記外側導線用交差端部に接続された前記第2導体層パターンは、前記導線用延長端子を覆うパターン形状としてあることを特徴とする請求項7または請求項8に記載の電線複合プリント配線基板。   The electric wire composite printed wiring board according to claim 7 or 8, wherein the second conductor layer pattern connected to the outer conductive wire intersection end portion has a pattern shape covering the conductive wire extension terminal. . 前記電線部品は、前記被覆部の外周に配設された外側導線を有し、該外側導線は、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側導線用延長交差端部を有する外側導線用延長交差端子と接続され、
前記外側導線用延長交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続してあることを特徴とする請求項1ないし請求項3のいずれか一つに記載の電線複合プリント配線基板。
The electric wire component has an outer conductive wire disposed on the outer periphery of the covering portion, and the outer conductive wire is extended in a direction intersecting with the electric wire and is disposed on the surface of the resin sealing portion. Connected to an extended crossing terminal for the outer conductor with an extended crossing end,
The extended crossing end portion for the outer conductor is connected to the second conductor layer pattern through a conduction hole conductor formed in an interlayer conduction hole of the second insulating substrate. The electric wire composite printed wiring board according to claim 3.
前記外側導線用延長交差端部に接続された前記第2導体層パターンは、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続してあることを特徴とする請求項10に記載の電線複合プリント配線基板。   The second conductor layer pattern connected to the outer conductor extended crossing end is connected to the first conductor layer pattern via a conduction hole conductor formed in an interlayer conduction hole of the second insulating base. The electric wire composite printed wiring board according to claim 10, wherein the electric wire composite printed wiring board is provided. 前記外側導線用延長交差端部に接続された前記第2導体層パターンは、前記導線用延長端子を覆うパターン形状としてあることを特徴とする請求項10または請求項11に記載の電線複合プリント配線基板。   12. The electric wire composite printed wiring according to claim 10 or 11, wherein the second conductor layer pattern connected to the outer conductor extended intersection end portion has a pattern shape covering the conductor extended terminal. substrate. 前記電線部品は、前記外側導線を被覆する外側被覆部を有し、該外側被覆部は、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側被覆部用延長交差端部を有する外側被覆部用延長交差端子と当接され、
前記外側被覆部用延長交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続してあることを特徴とする請求項1ないし請求項12のいずれか一つに記載の電線複合プリント配線基板。
The electric wire component has an outer covering portion that covers the outer conductive wire, and the outer covering portion is extended in a direction intersecting with the electric wire and is disposed on the surface of the resin sealing portion. Abutting with the extended cross terminal for the outer covering portion having the cross end,
The extended crossing end portion for the outer covering portion is connected to the second conductor layer pattern via a conduction hole conductor formed in an interlayer conduction hole of the second insulating substrate. The electric wire composite printed wiring board according to claim 12.
前記外側被覆部用延長交差端部に接続された前記第2導体層パターンは、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続してあることを特徴とする請求項13に記載の電線複合プリント配線基板。   The second conductor layer pattern connected to the outer covering extension extended intersection is connected to the first conductor layer pattern via a conduction hole conductor formed in an interlayer conduction hole of the second insulating base. The electric wire composite printed wiring board according to claim 13, wherein the electric wire composite printed wiring board is provided. 前記層間導通孔の内径は前記接続孔の内径より大きくしてあることを特徴とする請求項1ないし請求項14のいずれか一つに記載の電線複合プリント配線基板。   The electric wire composite printed wiring board according to any one of claims 1 to 14, wherein an inner diameter of the interlayer conduction hole is larger than an inner diameter of the connection hole. 前記第1導体層パターンは、前記第1配線基板の両面に形成され、前記第2配線基板は、前記第1配線基板の両面にそれぞれ積層してあり、前記電線部品は、前記第2配線基板の積層方向で第1導体層パターンまたは第2導体層パターンに対称的に接続される構成としてあることを特徴とする請求項1ないし請求項15のいずれか一つに記載の電線複合プリント配線基板。   The first conductor layer pattern is formed on both surfaces of the first wiring substrate, the second wiring substrate is laminated on both surfaces of the first wiring substrate, and the electric wire component is formed on the second wiring substrate. 16. The electric wire composite printed wiring board according to claim 1, wherein the electric wire composite printed wiring board is symmetrically connected to the first conductor layer pattern or the second conductor layer pattern in the stacking direction. . 第1絶縁基材および第1導体層パターンを有する第1配線基板と、導線を有する電線および該電線の端部を樹脂封止して前記第1配線基板に並置された樹脂封止部を有する電線部品と、前記第1配線基板と前記樹脂封止部とに積層された第2絶縁基材および第2導体層パターンを有する第2配線基板とを備える電線複合プリント配線基板を製造する電線複合プリント配線基板製造方法であって、
前記樹脂封止部から延長され前記第1導体層パターンに対向する導線用延長板部を有する導線用延長端子と前記導線とを接続した前記電線部品を準備する電線部品準備工程と、
前記第1導体層パターンを形成した前記第1配線基板と前記電線部品とを並置して前記導線用延長板部が有する接続孔を前記第1導体層パターンに位置合わせする導線用延長板部位置合わせ工程と、
前記導線用延長板部位置合わせ工程の後、前記第2導体層パターンを形成するための第2導体層と前記第2絶縁基材とを積層した前記第2配線基板を前記樹脂封止部および前記第1配線基板に積層する第2配線基板積層工程と、
前記導線用延長板部が有する接続孔を通過して前記第1導体層パターンに至る層間導通孔を前記第2絶縁基材に形成する導通孔形成工程と、
前記導通孔形成工程で形成した層間導通孔に導通孔導体を形成する導通孔導体形成工程と、
前記第2導体層をパターニングして前記第2導体層パターンを形成する第2導体層パターン形成工程と、
前記第1配線基板および前記第2配線基板の外形を形成する外形形成工程とを備えること
を特徴とする電線複合プリント配線基板製造方法。
A first wiring substrate having a first insulating base material and a first conductor layer pattern; an electric wire having a conductive wire; and an end portion of the electric wire that is resin-sealed and juxtaposed with the first wiring substrate. An electric wire composite for manufacturing an electric wire composite printed wiring board comprising an electric wire component, and a second wiring substrate having a second insulating base material and a second conductor layer pattern laminated on the first wiring board and the resin sealing portion A printed wiring board manufacturing method comprising:
An electric wire component preparing step of preparing the electric wire component connecting the conductive wire and the conductive wire extension terminal having the conductive wire extension plate portion extending from the resin sealing portion and facing the first conductive layer pattern;
A conductor extension plate portion position in which the first wiring board on which the first conductor layer pattern is formed and the electric wire component are juxtaposed to align the connection hole of the conductor extension plate portion with the first conductor layer pattern. Combining process,
After the conductive wire extension plate portion alignment step, the second wiring board in which the second conductor layer for forming the second conductor layer pattern and the second insulating base material are laminated is used as the resin sealing portion and A second wiring board stacking step of stacking on the first wiring board;
A conduction hole forming step of forming, in the second insulating substrate, an interlayer conduction hole that passes through the connection hole of the conductive wire extension plate and reaches the first conductor layer pattern;
A conduction hole conductor forming step of forming a conduction hole conductor in the interlayer conduction hole formed in the conduction hole forming step;
A second conductor layer pattern forming step of patterning the second conductor layer to form the second conductor layer pattern;
An outer shape forming step of forming an outer shape of the first wiring board and the second wiring board.
前記電線部品準備工程で、前記樹脂封止部から延長され前記導線用延長板部に並置されて前記第1導体層パターンに対向する被覆部用延長板部を有する被覆部用延長端子と前記導線を絶縁して被覆する被覆部とを結合した前記電線部品を準備し、
前記導線用延長板部位置合わせ工程で、前記被覆部用延長板部が有する接続孔を前記第1導体層パターンに位置合わせし、
前記導通孔形成工程で、前記被覆部用延長板部が有する接続孔を通過して前記第1導体層パターンに至る層間導通孔を前記第2絶縁基材に形成することを特徴とする請求項17に記載の電線複合プリント配線基板製造方法。
In the electric wire component preparation step, the extension terminal for the covering portion and the lead wire having the extension plate portion for the covering portion that is extended from the resin sealing portion and juxtaposed with the extension plate portion for the conductive wire and faces the first conductor layer pattern Preparing the electric wire component combined with a covering portion for insulating and covering,
In the conductive wire extension plate portion alignment step, the connection hole of the covering portion extension plate portion is aligned with the first conductor layer pattern,
The interlayer conduction hole that reaches the first conductor layer pattern through the connection hole of the extension plate part for the covering part is formed in the second insulating base material in the conduction hole forming step. 17. The method for producing a composite wire printed wiring board according to item 17.
前記電線部品準備工程で、前記樹脂封止部から延長され前記導線用延長板部に並置されて前記第1導体層パターンに対向する外側導線用延長板部を有する外側導線用延長端子と前記被覆部の外周に配設された外側導線とを接続した前記電線部品を準備し、
前記導線用延長板部位置合わせ工程で、前記外側導線用延長板部が有する接続孔を前記第1導体層パターンに位置合わせし、
前記導通孔形成工程で、前記外側導線用延長板部が有する接続孔を通過して前記第1導体層パターンに至る層間導通孔を前記第2絶縁基材に形成することを特徴とする請求項17または請求項18に記載の電線複合プリント配線基板製造方法。
In the electric wire component preparation step, the outer conductive wire extension terminal having an outer conductive wire extension plate portion that is extended from the resin sealing portion and juxtaposed with the conductive wire extension plate portion and faces the first conductor layer pattern, and the covering Preparing the electric wire component connected to the outer conductor disposed on the outer periphery of the part,
In the conductor extension plate portion alignment step, the connection hole of the outer conductor extension plate portion is aligned with the first conductor layer pattern,
The interlayer hole formed in the second insulating base material through the connection hole of the outer conductive wire extension plate portion to reach the first conductor layer pattern is formed in the conductive hole forming step. The electric wire composite printed wiring board manufacturing method according to claim 17 or claim 18.
前記電線部品準備工程で、前記電線と交差して前記樹脂封止部の表面に配設された外側導線用交差端部を有する外側導線用交差端子と前記被覆部の外周に配設された外側導線とを接続した前記電線部品を準備し、
前記導通孔形成工程で、前記外側導線用交差端部に至る層間導通孔を前記第2絶縁基材に形成することを特徴とする請求項17または請求項18に記載の電線複合プリント配線基板製造方法。
In the electric wire component preparation step, an outer conductor crossing terminal having an outer conductor crossing end arranged on the surface of the resin sealing portion so as to intersect the electric wire and an outer side arranged on the outer periphery of the covering portion Prepare the electric wire component connected to the conductor,
19. The electric wire composite printed wiring board manufacturing according to claim 17 or 18, wherein an interlayer conductive hole reaching the outer conductive wire intersection end portion is formed in the second insulating base material in the conductive hole forming step. Method.
前記電線部品準備工程で、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側導線用延長交差端部を有する外側導線用延長交差端子と前記被覆部の外周に配設された外側導線とを接続した前記電線部品を準備し、
前記導通孔形成工程で、前記外側導線用延長交差端部に至る層間導通孔を前記第2絶縁基材に形成することを特徴とする請求項17または請求項18に記載の電線複合プリント配線基板製造方法。
In the wire part preparation step, on the outer periphery of the outer conductor extension crossing terminal having the outer conductor extension crossing end portion extended in the direction intersecting with the electric wire and disposed on the surface of the resin sealing portion, and the covering portion Prepare the electric wire component connected to the arranged outer conductor,
19. The electric wire composite printed wiring board according to claim 17, wherein an interlayer conduction hole reaching the outer conductor extended crossing end is formed in the second insulating base material in the conduction hole forming step. Production method.
前記電線部品準備工程で、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側被覆部用延長交差端部を有する外側被覆部用延長交差端子と前記外側導線を絶縁して被覆する外側被覆部とを当接させた前記電線部品を準備し、
前記導通孔形成工程で、前記外側被覆部用延長交差端部に至る層間導通孔を前記第2絶縁基材に形成することを特徴とする請求項17ないし請求項21のいずれか一つに記載の電線複合プリント配線基板製造方法。
In the electric wire component preparation step, the outer covering portion extended crossing terminal and the outer conductive wire extending in the direction intersecting with the electric wire and having an outer covering portion extended crossing end disposed on the surface of the resin sealing portion. Prepare the electric wire component that is in contact with the outer covering portion to be insulated and covered,
The interlayer conduction hole that reaches the extended intersection end portion for the outer covering portion is formed in the second insulating base material in the conduction hole forming step. Wire composite printed wiring board manufacturing method.
第1絶縁基材および第1導体層パターンを有する第1配線基板と、前記第1配線基板に積層された第2絶縁基材および第2導体層パターンを有する第2配線基板と、導線を有する電線および該電線の端部を樹脂封止して前記第1配線基板に並置され前記第2配線基板が積層された樹脂封止部を有する電線部品とを備える電線複合プリント配線基板に適用される電線部品であって、
前記導線は、前記樹脂封止部から延長され前記第1導体層パターンに対向する導線用延長板部を有する導線用延長端子と接続され、
前記導線用延長板部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続される接続孔を有することを特徴とする電線部品。
A first wiring board having a first insulating base material and a first conductor layer pattern; a second wiring board having a second insulating base material and a second conductor layer pattern laminated on the first wiring board; and a conductor. The present invention is applied to an electric wire composite printed wiring board comprising: an electric wire and an electric wire component having a resin sealing portion in which an end portion of the electric wire is resin-sealed and juxtaposed with the first wiring board and the second wiring board is laminated. Wire parts,
The conducting wire is connected to a conducting wire extension terminal having a conducting wire extension plate portion extending from the resin sealing portion and facing the first conductor layer pattern,
The electric wire component, wherein the conductive wire extension plate has a connection hole connected to the first conductor layer pattern through a conduction hole conductor formed in an interlayer conduction hole of the second insulating base.
前記導線を被覆する被覆部は、前記樹脂封止部から延長され前記第1導体層パターンに対向する被覆部用延長板部を有する被覆部用延長端子と結合され、
前記被覆部用延長板部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続される接続孔を有し、前記導線用延長板部の両側に並置してあることを特徴とする請求項23に記載の電線部品。
The covering portion that covers the conducting wire is coupled to the covering portion extension terminal that has an extension plate portion for covering portion that extends from the resin sealing portion and faces the first conductor layer pattern,
The extension part for covering part has a connection hole connected to the first conductor layer pattern through a conduction hole conductor formed in an interlayer conduction hole of the second insulating base material, The electric wire component according to claim 23, wherein the electric wire component is juxtaposed on both sides of the portion.
前記被覆部の外周に配設された外側導線は、前記樹脂封止部から延長され前記第1導体層パターンに対向する外側導線用延長板部を有する外側導線用延長端子と接続され、
前記外側導線用延長板部は、前記第2絶縁基材の層間導通孔に形成された前記導通孔導体を介して前記第1導体層パターンに接続される接続孔を有することを特徴とする請求項23または請求項24に記載の電線部品。
The outer conductor disposed on the outer periphery of the covering portion is connected to an outer conductor extension terminal having an outer conductor extension plate extending from the resin sealing portion and facing the first conductor layer pattern,
The outer conductive wire extension plate has a connection hole connected to the first conductor layer pattern via the conduction hole conductor formed in an interlayer conduction hole of the second insulating base. Item 25. The electric wire component according to item 23 or 24.
前記外側導線用延長板部は、前記導線用延長板部の両側に並置してあることを特徴とする請求項25に記載の電線部品。   26. The electric wire component according to claim 25, wherein the outer conductive wire extension plate is juxtaposed on both sides of the conductive wire extension plate. 前記外側導線用延長板部が有する前記接続孔は、前記外側導線用延長板部の延長方向に沿って複数形成してあることを特徴とする請求項25または請求項26に記載の電線部品。   27. The electric wire component according to claim 25 or claim 26, wherein a plurality of the connection holes of the outer conductive wire extension plate are formed along an extending direction of the outer conductive wire extension plate. 前記被覆部の外周に配設された外側導線は、前記電線と交差して前記樹脂封止部の表面に配設された外側導線用交差端部を有する外側導線用交差端子と接続され、
前記外側導線用交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続される構成としてあることを特徴とする請求項23または請求項24に記載の電線部品。
The outer conductor disposed on the outer periphery of the covering portion is connected to an outer conductor intersection terminal having an outer conductor intersection end disposed on the surface of the resin sealing portion so as to intersect the electric wire,
24. The outer conductor crossing end portion is configured to be connected to the second conductor layer pattern via a conduction hole conductor formed in an interlayer conduction hole of the second insulating base material. Or the electric wire component of Claim 24.
前記被覆部の外周に配設された外側導線は、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側導線用延長交差端部を有する外側導線用延長交差端子と接続され、
前記外側導線用延長交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続される構成としてあることを特徴とする請求項23または請求項24に記載の電線部品。
The outer conductors disposed on the outer periphery of the covering portion are extended in the direction intersecting with the electric wires and have outer conductor extended intersection ends disposed on the surface of the resin sealing portion. Connected with
The extended crossing end portion for the outer conductive wire is configured to be connected to the second conductor layer pattern via a conduction hole conductor formed in an interlayer conduction hole of the second insulating base material. The electric wire component according to claim 23 or claim 24.
前記外側導線を被覆する外側被覆部は、前記電線と交差する方向で延長され前記樹脂封止部の表面に配設された外側被覆部用延長交差端部を有する外側被覆部用延長交差端子と当接され、
前記外側被覆部用延長交差端部は、前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第2導体層パターンに接続される構成としてあることを特徴とする請求項23ないし請求項29のいずれか一つに記載の電線部品。
An outer covering portion that covers the outer conductive wire is extended in a direction crossing the electric wire, and has an outer covering portion extended crossing terminal that is disposed on the surface of the resin sealing portion, and has an outer covering portion extended intersection end. Abutted,
The extended intersection end portion for the outer covering portion is configured to be connected to the second conductor layer pattern via a conduction hole conductor formed in an interlayer conduction hole of the second insulating base. Item 30. The electric wire component according to any one of items 23 to 29.
前記導線は、絶縁性心材の周囲に配設されて円筒状とされた編組線で構成してあることを特徴とする請求項23ないし請求項30のいずれか一つに記載の電線部品。   31. The electric wire component according to any one of claims 23 to 30, wherein the conducting wire is formed of a braided wire disposed around an insulating core material and having a cylindrical shape. 第1絶縁基材および第1導体層パターンを有する第1配線基板と、前記第1配線基板に積層された第2絶縁基材および第2導体層パターンを有する第2配線基板と、導線を有する電線および該電線の端部を樹脂封止して前記第1配線基板に並置され前記第2配線基板が積層された樹脂封止部を有する電線部品とを備える電線複合プリント配線基板に適用される電線部品を製造する電線部品製造方法であって、
前記導線を露出させて前記電線を準備する電線準備工程と、
前記樹脂封止部から延長され前記第1導体層パターンに対向する導線用延長板部に前記第2絶縁基材の層間導通孔に形成された導通孔導体を介して前記第1導体層パターンに接続される接続孔を有する導線用延長端子と前記導線とを接続する導線用延長端子接続工程と、
前記電線の端部を樹脂封止して前記導線用延長端子が有する前記接続孔を露出させた前記樹脂封止部を形成する樹脂封止工程と
を備えることを特徴とする電線部品製造方法。
A first wiring board having a first insulating base material and a first conductor layer pattern; a second wiring board having a second insulating base material and a second conductor layer pattern laminated on the first wiring board; and a conductor. The present invention is applied to an electric wire composite printed wiring board comprising: an electric wire and an electric wire component having a resin sealing portion in which an end portion of the electric wire is resin-sealed and juxtaposed with the first wiring board and the second wiring board is laminated. An electric wire component manufacturing method for manufacturing an electric wire component,
An electric wire preparation step of preparing the electric wire by exposing the conductive wire;
The first conductor layer pattern is extended to the first conductor layer pattern through a conduction hole conductor formed in an interlayer conduction hole of the second insulating base material in the conductive wire extension plate portion extending from the resin sealing portion and facing the first conductor layer pattern. A conductor extension terminal connecting step for connecting the conductor extension terminal and the conductor extension terminal having a connection hole to be connected;
And a resin sealing step for forming the resin sealing portion in which the connection hole of the extension terminal for the conductive wire is exposed by resin sealing the end portion of the electric wire.
電線部品を接続された電線複合プリント配線基板を搭載した電子機器であって、前記電線複合プリント配線基板は、請求項1ないし請求項16のいずれか一つに記載の電線複合プリント配線基板であることを特徴とする電子機器。   It is an electronic device carrying the electric wire composite printed wiring board to which the electric wire component was connected, Comprising: The said electric wire composite printed wiring board is an electric wire composite printed wiring board as described in any one of Claim 1 thru | or 16. An electronic device characterized by that.
JP2007108472A 2007-04-17 2007-04-17 Wire composite printed-wiring board, its manufacturing method, wire part, manufacturing method for wire part and electronic equipment Pending JP2008270361A (en)

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