JP2008254038A - Method and equipment of manufacturing string solder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a string solder manufacturing method and equipment by which a solder more brittle than a conventionally used Sn-Pb based solder like a lead-free solder can be continuously formed as a string solder that has a nearly circular cross section and a diameter larger than 0.5 mm. <P>SOLUTION: This is a string solder manufacturing method by which a string solder is formed by discharging molten solder to the surface of a member that moves relatively at a prescribed speed. The method is characterized in that the member is adjusted at a prescribed temperature at least in the position where the molten solder is discharged, that the molten solder is discharged at the prescribed speed synchronized with the moving speed of the member, and that the string solder is formed by essentially solidifying the molten solder in a few seconds. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for manufacturing linear solder.

  The linear solder is also called thread solder, and is generally manufactured by a drawing method in which a rod-shaped solder alloy is formed by extrusion from a through hole of a die. In recent years, lead-free solder has been requested due to environmental problems, and Sn-Ag solder, Sn-Zn solder, etc. have been used in place of conventional Sn-Pb solder. These solders are inferior in wettability compared to Sn—Pb solders, and so Bi has been added to improve the wettability. However, there is a tendency to become brittle. When it is going to process, it has the problem that it is difficult to fracture | rupture in the middle and to form continuously. On the other hand, Patent Document 1 discloses that a Sn-Ag-Bi solder is linearized by using a spinning method, and it is explained that a linear solder having a diameter of 0.2 mm could be obtained. Has been.

A detailed technique is described in Patent Document 2 regarding the rotary spinning method. According to this, in the spinning method, a liquid layer is formed by centrifugal force in a continuously rotating cylindrical drum, and the molten metal is jetted into the liquid layer as a jet to solidify the molten metal at a high cooling rate. This is a method of manufacturing a fine metal wire, and when a thin wire is formed by injecting molten metal into the atmosphere, only a diameter of 0.1 mm or less was obtained, whereas a thickness of about 0.5 mm was obtained. It is explained that it was obtained continuously.
Further, Patent Document 3 is intended for an aluminum alloy instead of solder, but an element having a predetermined composition is added to improve the viscosity and surface tension of the molten metal, and the coolant is ejected from pores or slits. A technique for continuously manufacturing a fine wire in contact with a thin film is disclosed. According to this, known methods such as a single roll method used for producing an amorphous ribbon, the above-described rotary spinning method, or a flowing water coagulation method are known as methods for spraying molten metal from pores or slits and bringing it into contact with a cooling medium A round thin wire having a diameter of about 0.3 mm can be obtained by the rotary spinning method, and a tape-like thin wire having a thickness of about 0.3 mm can be obtained by the single roll method. It is explained that it was obtained.

JP 2001-212663 A JP 55-64948 A JP 59-190336 A

  When linear solder is used for joining fine parts such as electronic parts, the diameter should be small, but when used for joining large parts, it has a circular section with a thickness of about 1 mm or more. May be required. Of course, lead-free solder is desired in addition to the solder at this time. According to Patent Document 1, it can be seen that fine wires of lead-free solder can be continuously formed by the spinning method, but the thickness of the fine wires obtained is about 0.2 mm. Moreover, even if it is not limited to lead-free solder, as shown in Patent Documents 2 and 3, in the thin wire manufacturing technology by the spinning method, the thickness of the thin wire is limited to about 0.5 mm, and the single roll method It can be seen that only tape-like thin lines can be obtained. This is because, in the single roll method, the jet to be ejected is crushed and becomes a ribbon. As described above, the conventional technique cannot cope with the request.

  Therefore, the present invention continuously forms solder that is more brittle than Sn-Pb solder that has been conventionally used, such as lead-free solder, as linear solder having a substantially circular cross-sectional shape and a diameter larger than 0.5 mm. An object of the present invention is to provide a method and apparatus for manufacturing linear solder that can be used.

The method for producing linear solder of the present invention is a method for producing linear solder in which molten solder is discharged onto the surface of a member that moves at a relatively predetermined speed to form linear solder, and the member is at least The position where the molten solder is discharged is adjusted to a predetermined temperature, the molten solder is discharged at a predetermined speed according to the moving speed of the member, and the molten solder is substantially solidified within a few seconds to form a linear solder. It is characterized by doing. In the present invention, it is preferable that the molten solder is substantially solidified within a few seconds after being cooled by the member. In the above invention, it is preferable that the molten solder runs substantially horizontally until it is at least substantially solidified after being discharged. In the above invention, as an embodiment, it is desirable that the molten solder is discharged onto the surface of the member whose temperature is adjusted to several tens of degrees Celsius and travels at a speed of several millimeters / second to several tens of millimeters / second.
Note that substantially solidified as described above refers to a state where the outer shell is solidified to such an extent that the outer shape is not deformed, and it does not matter whether the outer shell is solidified. Also, running almost horizontally means that the molten solder moves so that gravity does not act in the running direction of the molten solder, but as long as the molten solder does not flow in the running direction as the linear shape deteriorates, A slight tilt or vertical fluctuation is acceptable.

An apparatus for manufacturing linear solder according to the present invention includes a solder discharge unit that discharges molten solder in the direction of gravity, and a solder formation unit that cools and forms the linear solder while receiving and moving the discharged molten solder. The solder discharge part includes a syringe having a cylinder part in which molten solder is accommodated and a piston part for extruding the molten solder, and a drive means for controlling the speed of the piston part. A traveling member that travels endlessly receiving solder and a temperature control unit that adjusts the temperature of the traveling member are provided. In the invention, the cylinder portion of the solder discharge portion has a circular cross-sectional pore formed in the lower portion, and the running member of the solder formation portion has poor wettability with respect to the molten solder on the surface where the molten solder is discharged. The material is preferably used.
Further, in the above invention, the solder forming portion has a belt conveyor structure, the running member is a belt, the carrier side belt runs almost horizontally at least in the vicinity of the position where the solder discharge portion is disposed, and the drive roller controls the rotational speed. It is preferable that the driven roller is temperature-adjusted by the temperature control means, and the solder discharge portion is disposed near the top of the driven roller. In this case, the belt is preferably a metal belt.
In the above invention, the solder forming portion has a rotating plate structure, the running member is rotated substantially horizontally by the rotating plate, and the solder discharging portion is disposed ahead of the position where the discharged molten solder is substantially solidified. The linear solder may be led out from the rotating plate.

  According to the present invention, even solder such as lead-free solder that is more brittle than Sn-Pb solder that has been conventionally used is continuously formed as linear solder having a diameter larger than 0.5 mm. be able to.

(Embodiment 1)
Unlike the amorphous metal manufacturing apparatus, the linear solder manufacturing apparatus of the present invention is characterized in that it solidifies into a linear shape while maintaining a substantially circular cross-sectional shape when molten solder is discharged. FIG. 1 shows a schematic structure of a linear solder manufacturing apparatus 30 according to the present invention in Embodiment 1, which can be roughly divided into a solder forming part 10 and a solder discharge part 20.
The solder forming part 10 has a belt conveyor structure, and the driving roller 2 and the driven roller 1 are predetermined to the left and right so that the respective rotating shafts 2a and 2b are horizontal and the tops thereof are at the same height and are parallel to each other. The upper carrier side belt 3a of the wound belt 3 is horizontally moved leftward by rotating the drive roller 2 shown leftward in FIG. 1 in a counterclockwise direction. A motor capable of accurately controlling the rotational speed, for example, a servo motor or an inverter control motor (not shown) is connected to the rotating shaft 2a of the driving roller 2 and the belt 3 is at a predetermined speed of several millimeters to several tens of millimeters per second. Traveled. Further, the tension roller 4 is pressed against the lower return side belt 3b, and a predetermined tension is applied so that the belt 3 does not loosen. Further, when the distance between the rollers 1 and 2 is wide, a support roller 5 that contacts the lower surface of the carrier side belt 3a may be provided in order to prevent the carrier side belt 3a from being bent or wavy.

  The belt 3 is a traveling member that continuously moves the molten solder h discharged from the solder discharge portion 20 (see FIG. 2) to linearize it, but in addition, as a cooling member that solidifies the molten solder h. It has a function. Accordingly, a material that has heat resistance, high strength and rigidity, and can be processed into an endless belt with high accuracy is used. For example, a metal belt, a resin belt, a rubber belt, or the like can be used, but the heat conductivity is good. In this respect, it is preferable to use a metal belt. Also, in terms of maintaining as much as possible the circular cross-sectional shape when the molten solder is discharged, the contact portion of the belt with the molten solder h should have poor wettability, and the stainless steel whose surface is covered with an oxide film It is recommended to use Further, even if it is a band made of another material, it may be used by coating the contact surface with the molten solder h with a material having poor wettability. For example, the surface of the aluminum alloy band is anodized, The steel material may be Ni-plated or coated with alumina or glass. By using the belt 3 as a cooling member for the molten solder h, it can be easily replaced even if it is damaged.

  In addition, the molten solder h is discharged continuously in a satisfactory manner and cooled while maintaining a circular cross-sectional shape, so that the discharged molten solder h is cooled with a temperature gradient that is solidified within a few seconds to a few dozen seconds. It is important to. For this reason, the belt temperature at the position where the molten solder h is discharged must be adjusted to a temperature corresponding to the melting temperature or solidification temperature of the solder. In the present linear solder manufacturing apparatus 30, the driven roller 1 that is sent out in contact with the belt 3 is made of a material such as a metal having good thermal conductivity, and the temperature of the driven roller 1 is controlled to send out the driven roller 1 from the belt 3. The temperature of this portion is made substantially the same as the temperature of the driven roller 1. Since the heat capacity of the driven roller 1 is larger than that of the belt 3, the temperature of the contacting belt can be quickly and stably adjusted. The temperature of the driven roller 1 is set to a predetermined temperature according to the melting point or solidification point of the target solder and the thickness to be formed, but is usually controlled in the heating direction. The temperature control means 6 for controlling the temperature of the driven roller 1 may be an internal mounting type means (not shown) in which a fluid passage is formed in the driven roller 1 to flow a fluid at a predetermined temperature. The hot air generator 6a may be an externally mounted type means arranged on the outer periphery of the driven roller 1.

  The solder discharge unit 20 is disposed above the top of the driven roller 1. The solder discharge unit 20 discharges the molten solder h accommodated in the container from the nozzle at the tip of the container onto the traveling carrier-side belt 3 at a predetermined speed that is the same as or close to the belt traveling speed described above. Therefore, it is possible to adopt a structure in which the container is extruded as a sealed structure with pressurized gas, or as shown in FIG. 2, the piston part 23 is moved and extruded as a syringe structure. Here, the running speed of the belt is defined as the speed at which the molten solder discharged and circularized by surface tension can move to the belt while maintaining its shape substantially, and as described above, it is several millimeters per second. It is said that the speed is about tens of millimeters. Therefore, in order to realize a stable and highly accurate discharge speed of the molten solder h in accordance with such a slow belt running speed, it is preferable to use a syringe structure. For example, the piston portion 23 includes a servo motor and a ball screw. It is connected to the precision drive means 21 used. The material of the cylinder part 24 and the piston part 23 is preferably a material that does not react with the molten solder h and has a low linear expansion coefficient, and ceramics or glass can be used. The molten solder h is supplied to the cylinder portion 24 by removing the piston portion 23 after one shot is finished, or by forming a molten solder supply port on the side wall of the cylinder portion 24 and separately providing a molten solder pool through a pipe. You may make it supply with a pump etc. from (not shown).

  The solder discharge unit 20 is disposed above the top T of the driven roller 1 as shown in FIG. 3, but the tangential direction (X direction) of the driven roller 1, the direction parallel to the rotation axis (Y direction), It is desirable to provide the triaxial moving mechanism 22 so that the position can be changed in the radial direction (Z direction). Thereby, the tip of the nozzle 25 can be positioned at a predetermined position in the vicinity of the top portion T of the driven roller 1. Further, the solder discharge unit 20 is provided with a heater 27 around the syringe unit in order to maintain the stored molten solder h at a predetermined temperature. The thickness of the linear solder H is defined by the inner diameter d of the pore 26 penetrating the nozzle 25 and the traveling speed of the belt 3, and when it is desired to obtain the linear solder H having the same diameter m as the inner diameter d, the solder discharge portion The discharge speed from 20 and the running speed of the belt 3 may be matched.

Next, the linear solder manufacturing method of the present invention using the linear solder manufacturing apparatus 30 will be described.
First, the driving roller 2 is rotated counterclockwise, the wound belt 3 is caused to travel, and the carrier side belt 3a is caused to travel leftward at a predetermined speed s. Next, the hot air generator 6a is operated, and the hot air is blown toward the outer peripheral surface of the driven roller 1, and the temperatures of the belt 3 and the driven roller 1 are increased and maintained at the set temperature. The hot air generator 6a may perform automatic control such as PID control by measuring the temperature of the belt 3 near the outer peripheral surface of the driven roller or the top of the driven roller with a sensor. Alternatively, the control pattern such as the air volume may be obtained and the adjustment may be performed manually while measuring the temperature of the belt in contact with the driven roller 1 with a thermometer.

  On the other hand, the molten solder h is stored in the cylinder portion 24 of the solder discharge portion 20. The molten solder h is maintained at a predetermined temperature by the heater 27. When the outer peripheral surface temperature of the driven roller 1 reaches the set temperature, the solder discharge unit 20 is positioned so that the nozzle 25 is positioned at a predetermined position above the top T of the driven roller 1. As shown in FIG. 3, the circumferential position (X direction) of the nozzle 25 is between a position separated by g1 from the top T of the driven roller and a position separated by g2 ahead. Since the belt 3 is in contact with the driven roller 1 at the top T and a position on the near side from the top T, it is preferable because the traveling locus is constant and the temperature fluctuation due to the outside air is difficult. However, if it is too far, the influence of gravity on the molten solder due to the inclination of the belt in the traveling direction based on the curvature of the roller cannot be ignored. Scope. The distance between the nozzle tip and the belt is several mm, but it is better to be narrow in that the molten solder h being discharged is not cut by its own weight, but the shape of the molten solder that has been cooled and rounded by the surface tension is good. In terms of being easily maintained, a wider one is better, and it is appropriately set according to the solder composition and the wire diameter.

When the driven roller 1 is maintained at the set temperature, the piston part 23 of the solder discharge part 20 is moved at a predetermined speed V, and the molten solder h is discharged onto the belt 3 (3a) at the discharge speed v. When the discharge speed v is set to be substantially the same as the belt speed s, the piston speed V is calculated by V = v (d / D) ² where the cylinder inner diameter D and the nozzle pore diameter d are set. Is done. Since the speed of the piston portion 23 is controlled by the number of rotations of the servo motor, the accuracy is very good even at a low speed and the speed control can be easily performed. In most cases, the molten solder h stored does not hang down from the nozzle pores before the piston moves, but a stopper for preventing sag may be provided if necessary.

  By making the discharge speed v and the belt speed s substantially the same, and cooling and solidifying by a predetermined temperature gradient, the molten solder h discharged onto the belt 3 (3a) is linear without breaking. It becomes the shape solder. Since the belt 3 (3a) moves in the horizontal direction, the tensile force due to gravity does not act in the longitudinal direction of the linear solder H, and even a thick linear solder having a diameter of 1 mm or more is cut. Never happen. Further, since the belt 3 has a surface property that is poor in wettability with the molten solder h, the molten solder h hardly spreads on the belt 3 (3a) and is solidified before the cross-sectional shape is changed. The circular cross section when discharged is substantially maintained. The linear solder H on the belt 3 (3a) is sufficiently solidified to reach the driving roller 2 and is discharged in the tangential direction of the driving roller 2. Therefore, a linear solder can be continuously obtained by installing a winding device (not shown) having a known structure behind the driving roller 2 and winding the discharged linear solder.

  In the present invention, since the discharge speed v of the molten solder h and the belt traveling speed s as the linear solder traveling speed can be controlled with extremely high accuracy, the speed relationship can be controlled without changing the pore diameter d of the nozzle. The diameter m of the linear solder H can be controlled. That is, m> d can be achieved by setting v> s, and m <d can be achieved by setting v <s. However, if the speed difference between v and s is large, the shape accuracy may be deteriorated. In particular, when v <s, depending on the temperature gradient at the time of cooling the molten solder, it is broken at the transfer portion from the nozzle to the belt. Sometimes. This can be dealt with by adjusting the temperature of the driven roller 1 higher.

  As described above, in the first embodiment, the configuration in which the solder discharge unit 20 is disposed near the top of the driven roller 1 has been described. However, the carrier-side belt can stably travel horizontally even if it is farther away from the top. It is also possible to dispose a portion where the tension is applied, for example, a portion supported by the support roller 5 or the vicinity thereof, or a portion where an appropriate tension is applied between the driven roller and the support roller. In this case, since the belt is not in contact with the driven roller at the position where the molten solder is discharged, in order to set the temperature of this portion to the set temperature, in addition to the temperature control of the driven roller described above, the temperature of the support roller is also determined. What is necessary is just to respond | correspond according to a structure suitably, such as making a control means act, making a temperature control means act on a belt directly, or making a temperature control means act only on a belt directly. In addition, if the belt is made of a material with poor thermal conductivity compared to metals such as resin and rubber, the cooling capability of the molten solder by the belt will be reduced and the cooling rate of the molten solder will be slowed down. What is necessary is just to cool by spraying on solder.

(Embodiment 2)
In the first embodiment, the solder forming unit 10 has a belt conveyor structure, and the molten solder h discharged from the belt 3 is solidified while being continuously moved. This is a form in which the solder forming portion 50 has a rotating plate structure, and the molten solder h discharged from the rotating plate instead of the belt is solidified while being continuously moved and linearized. Hereinafter, the solder forming unit 50 will be described with reference to FIG. 4, but the solder discharge unit 20 is the same as that described in the first embodiment, and a description thereof will be omitted. Also, the method of manufacturing the linear solder in the second embodiment is basically the same as that in the first embodiment, and the description thereof is omitted.

  The solder forming unit 50 receives the molten solder h discharged from the solder discharge unit 20 and has a smooth rotating plate 51 that is continuously rotated horizontally around a rotation axis (not shown), and the surface of the rotating plate 51. A solder guide portion 52 and a solder discharge portion 53 are provided at a predetermined position with a slight gap. A motor, such as a servo motor or an inverter control motor (not shown), which can accurately control the rotation speed is connected to the rotation shaft, and is rotated at a predetermined rotation speed of several to several tens of rotations per minute. A solder discharge part 20 is disposed above the surface at a predetermined position r apart from the rotation center O of the rotary plate 51, and the molten solder h is discharged. Therefore, the discharged molten solder h moves on the circumference of the radius r of the rotating plate 51. The moving speed is set to a predetermined speed of several millimeters to several tens of millimeters per second like the belt speed in the first embodiment, and the rotational speed of the rotating plate 51 may be set in accordance with this. The outer diameter dimension of r and the rotation plate 51 defined from now on is substantially defined by the apparatus dimensions such as the solder discharge part 20, the solder guide part 52, and the solder discharge part 53, but r is preferably about 50 to 200 mm. .

  The solder guide portion 52 is disposed at a position where the molten solder h is substantially solidified and formed into the linear solder H and comes into contact therewith. For example, rollers are arranged in two rows on both sides of the linear solder H. It is good to have a configuration to do. The solder discharge part 53 is disposed downstream of the solder guide part 52 and is arranged so as to direct the linear solder H to a winding device (not shown) having a known structure provided outside the rotating plate 51. Or it is good to provide a flat plate so that the circumference of radius r may be crossed. The solder guide portion 52 and the solder discharge portion 53 are attached to a bracket (not shown) provided outside the rotating plate 51 and are not in contact with the rotating plate 51 but are in contact with the linear solder H. ing.

  The rotating plate 51 is a traveling member that continuously moves the molten solder h discharged from the solder discharge portion 20 to form a line like the belt 3 in the first embodiment. It has a function as a cooling member for solidifying. Accordingly, the material of the base material and the material of the contact portion with the molten solder h may be the same as in the case of the belt 3, and the description thereof is omitted. Similarly, the temperature of the position where the molten solder h is discharged on the rotating plate 51 depends on the melting temperature or the solidification temperature of the solder so that the molten solder h after discharge is solidified within a few seconds to a few dozen seconds. Adjusted to temperature. In the first embodiment, this temperature adjustment is performed by controlling the temperature of the driven roller. However, in this embodiment, the temperature of the rotating plate 51 may be directly adjusted. As the temperature control means, as in the case of the driven roller, it is possible to adopt an internal mounting type means for forming a fluid passage in the rotating plate to flow a fluid of a predetermined temperature. However, the hot air generator is placed outside the rotating plate 51. It may be simpler to use the externally mounted means arranged.

  In the first and second embodiments, it has been described that the member for running the discharged molten solder h moves horizontally in the solder forming portions 10 and 50. That is, in the first embodiment, the belt 3 runs horizontally between the driving roller 2 and the driven roller 1, and in the second embodiment, the rotating plate 51 rotates horizontally around the rotation axis. The meaning of running the molten solder h horizontally is to prevent gravity from acting in the longitudinal direction of the linear solder in a fluid state. It is not always necessary to run horizontally for a specification that hardly changes, or a specification that hardly breaks or changes its shape even when gravity is applied. .

  Therefore, in the first embodiment, the belt only needs to run horizontally to a position where at least the molten solder solidifies. In FIG. 1, the support roller 5 is installed slightly ahead of the position where the molten solder solidifies, and the belt in the meantime. Is maintained horizontally, the driving roller 2 may be installed such that the top is lower than the top of the driven roller 1. Furthermore, when the wire diameter is small, the action of surface tension has a greater effect than the action of gravity, and is resistant to cutting and cross-sectional shape changes, and the coagulation time is short. The belt 3 and the rotating plate 51 may be able to cope with a gentle inclination as long as the diameter of the wire is approximately the same. In this case, even if the traveling member is a single roll, it may be possible to cope with it by increasing the diameter.

(Example)
In the linear solder manufacturing apparatus 30 of the present invention having the structure shown in FIG. 1, Sn-Ag high melting point (around 250 ° C.) lead-free solder linear solder was continuously manufactured. The belt 3 is made of SUS304 having a thickness of 0.3 mm and a width of 30 mm, the driven roller 1 for adjusting the temperature of the belt 3 is made of aluminum and has a diameter of 300 mm, the driving roller 2 for driving the belt 3 is made of aluminum and has a diameter of 140 mm, The distance between the axes of both rollers is 500 mm. The syringe used for the solder discharge part 20 was made of glass, the inner diameter of the cylinder was 12 mm, the length was 60 mm, and about 4 cc of molten solder h was stored. The solder discharge unit 20 was set so that the center of the pore 26 of the nozzle 25 was directly above the top T of the driven roller 1 and the distance between the tip of the nozzle 25 and the surface of the belt 3 was 5 mm.

  Two types of syringes having nozzle pore diameters of 1.25 mm and 0.6 mm were set in the apparatus having the above specifications, and linear solder was manufactured under four types of manufacturing conditions. Under any conditions, the molten solder was kept at 300 ° C. Table 1 shows the manufacturing conditions and the results of forming the linear solder at that time. Under this manufacturing condition, the molten solder h discharged from the fine holes was transferred on the carrier side belt 3a without being cut off in the middle, formed in a linear shape, and discharged from the end of the driving roller. The discharged linear solder H was manually wound around a bobbin. While the molten solder in the syringe was normally discharged, the linear solder H was continuously formed.

  Production condition no. Samples 1 and 5 were cooled at an appropriate temperature gradient with the same discharge speed and belt speed, and linear solder having a diameter substantially the same as the nozzle pore diameter was obtained. No. In the case of No. 2, the discharge speed and the belt speed are the same, but the temperature of the driven roller, that is, the belt temperature at the position where the molten solder has landed is too high, the cooling temperature gradient becomes loose, and the outer shell is solidified. It seems that the circular cross section has been crushed. No. Nos. 3 and 6 are examples in which linear solder having a diameter smaller than the nozzle pore diameter was obtained by increasing the belt speed rather than the discharge speed. No. 4 and 7 are examples in which linear solder having a diameter larger than the nozzle pore diameter was obtained by making the belt speed slower than the discharge speed. No. 8 is a condition for obtaining a linear solder having a large diameter, but since the temperature of the driven roller is high, it takes time to solidify to the central part of the linear, and the molten or semi-molten solder still accumulates. It seems that the enveloping outer shell was periodically expanded to form a hump. Accordingly, the belt speed is preferably about 10 to 60 mm / sec, and the belt temperature at the position where the molten solder is discharged is preferably within a predetermined range of about 20 to 70 ° C. At this time, when the molten solder travels about 150 mm, It can be seen that the time during this period is 1.6 to 6 seconds.

It is a side view which shows schematic structure of the linear solder manufacturing apparatus in Embodiment 1 of this invention. It is a figure which shows the conceptual structure of a solder discharge part. FIG. 6 is a diagram for explaining a positional relationship between a driven roller and a nozzle of a solder discharge unit in the first embodiment. It is a side view which shows schematic structure of the linear solder manufacturing apparatus in Embodiment 2 of this invention.

Explanation of symbols

10 Solder forming part
DESCRIPTION OF SYMBOLS 1 Driven roller 2 Drive roller 3 Belt 5 Support roller 6 Hot air generator 20 Solder discharge part 21 Piston part precision drive means
22 3-axis movement mechanism 23 Piston part
24 Cylinder part 25 Nozzle 26 Fine hole 50 Solder forming part 51 Rotating plate 53 Solder discharging part
h Molten solder H Linear solder

Claims (9)

A method of manufacturing linear solder in which molten solder is discharged onto a surface of a member that moves relatively at a predetermined speed to form linear solder, wherein at least the position at which the molten solder is discharged is adjusted to a predetermined temperature. And the molten solder is discharged at a predetermined speed in accordance with the moving speed of the member, and the molten solder is substantially solidified within a few seconds to form the linear solder. . 2. The method of manufacturing linear solder according to claim 1, wherein the molten solder is cooled by the member and substantially solidified within a few seconds. 3. The method of manufacturing linear solder according to claim 1, wherein the molten solder travels substantially horizontally until it is at least substantially solidified after being discharged. The molten solder is discharged onto the surface of a member whose temperature is adjusted to several tens of degrees Celsius, travels at a speed of several millimeters / second to several tens of millimeters / second, and is substantially solidified within several seconds. A method for producing a linear solder according to 1, 2 or 3. A solder discharge portion that discharges the molten solder in the direction of gravity, and a solder forming portion that cools and forms the linear solder while receiving and moving the discharged molten solder;
The solder discharge part includes a syringe having a cylinder part in which molten solder is accommodated and a piston part for extruding the molten solder, and a drive means for controlling the speed of the piston part,
The solder forming unit includes a traveling member that travels endlessly to receive the discharged molten solder, and a temperature control unit that adjusts the temperature of the traveling member. The cylinder part of the solder discharge part has a circular cross-sectional pore formed in the lower part, and the running member of the solder formation part is made of a material having poor wettability with the molten solder on the surface where the molten solder is discharged The apparatus for producing linear solder according to claim 6. The solder forming portion has a belt conveyor structure, the running member is a belt, the carrier side belt runs almost horizontally at least near the position where the solder discharge portion is disposed, and the drive roller is driven by the rotation speed control means. The temperature of the driven roller is adjusted by the temperature control means,
7. The apparatus for producing linear solder according to claim 5, wherein the solder discharge portion is disposed near the top of the driven roller. 8. The apparatus for producing linear solder according to claim 7, wherein the belt is a metal belt. The solder forming part has a rotating plate structure, the running member is rotated almost horizontally by the rotating plate, and a solder discharge part is disposed ahead of the position where the discharged molten solder is substantially solidified. 7. The apparatus for producing linear solder according to claim 5, wherein the solder is led out.

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