JP2008252052A5 - - Google Patents

Download PDF

Info

Publication number
JP2008252052A5
JP2008252052A5 JP2007126490A JP2007126490A JP2008252052A5 JP 2008252052 A5 JP2008252052 A5 JP 2008252052A5 JP 2007126490 A JP2007126490 A JP 2007126490A JP 2007126490 A JP2007126490 A JP 2007126490A JP 2008252052 A5 JP2008252052 A5 JP 2008252052A5
Authority
JP
Japan
Prior art keywords
illuminance detection
detection component
light receiving
translucent member
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007126490A
Other languages
Japanese (ja)
Other versions
JP2008252052A (en
JP5281252B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2007126490A priority Critical patent/JP5281252B2/en
Priority claimed from JP2007126490A external-priority patent/JP5281252B2/en
Priority to KR1020080020046A priority patent/KR20080081833A/en
Priority to US12/041,840 priority patent/US7728283B2/en
Priority to TW097107611A priority patent/TW200901432A/en
Publication of JP2008252052A publication Critical patent/JP2008252052A/en
Publication of JP2008252052A5 publication Critical patent/JP2008252052A5/ja
Application granted granted Critical
Publication of JP5281252B2 publication Critical patent/JP5281252B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (19)

基板本体と、前記基板本体の主面に設けられたパッドと、を有する支持基板と、前記パッドと電気的に接続され、外部から照射された光を受光する受光素子と、前記受光素子と電気的に接続された外部接続端子と、を備えた照度検出部品であって、
前記基板本体は、シリコンからなり、前記基板本体の前記主面側に前記受光素子をアレイ状に複数配置し、
透光性部材を前記基板本体に設けることにより、該透光性部材と前記基板本体との間に前記複数の受光素子を収容する気密な空間を形成したことを特徴とする照度検出部品。 A support substrate having a substrate body, a pad provided on a main surface of the substrate body, a light receiving element that is electrically connected to the pad and receives light emitted from the outside, and the light receiving element and the Illuminance detection component comprising externally connected external connection terminals,
The substrate body is made of silicon, and a plurality of the light receiving elements are arranged in an array on the main surface side of the substrate body,
An illuminance detection component characterized in that an airtight space for accommodating the plurality of light receiving elements is formed between the translucent member and the substrate body by providing the translucent member on the substrate body. 前記複数の受光素子は、前記外部から照射された光を受光する受光部を有し、
前記透光性部材の前記受光素子と対向する面に前記外部から照射された光を遮光する遮光部材を設けると共に、前記複数の受光素子の前記受光部と対向する部分の前記遮光部材に前記外部から照射された光を通過させる開口部を設けたことを特徴とする請求項１記載の照度検出部品。 The plurality of light receiving elements have a light receiving unit that receives light emitted from the outside,
Provided on the surface of the translucent member facing the light receiving element is a light shielding member that shields light emitted from the outside, and on the light shielding member of the plurality of light receiving elements facing the light receiving unit The illuminance detection component according to claim 1, further comprising an opening through which light emitted from the light passes . 前記開口部の直径は、前記受光部の有効エリアの直径よりも小さいことを特徴とする請求項２記載の照度検出部品。  The illuminance detection component according to claim 2, wherein a diameter of the opening is smaller than a diameter of an effective area of the light receiving unit. 前記パッドは、めっき膜からなることを特徴とする請求項１ないし３のうち、いずれか一項記載の照度検出部品。 The illuminance detection component according to claim 1 , wherein the pad is made of a plating film. 前記透光性部材に前記受光素子を収容するための凹部を形成すると共に、
前記支持基板を平板形状としたことを特徴とする請求項１ないし４のうち、いずれか一項記載の照度検出部品。 While forming a recess for accommodating the light receiving element in the translucent member,
The illuminance detection component according to claim 1, wherein the support substrate has a flat plate shape. 前記支持基板に前記受光素子を収容するための凹部を形成すると共に、
前記透光性部材を平板形状としたことを特徴とする請求項１ないし４のうち、いずれか一項記載の照度検出部品。 Forming a recess for accommodating the light receiving element in the support substrate;
The illuminance detection component according to claim 1, wherein the translucent member has a flat plate shape. 前記透光性部材は、ガラスからなり、
前記基板本体と前記透光性部材とを陽極接合したことを特徴とする請求項１ないし６のうち、いずれか一項記載の照度検出部品。 The translucent member is made of glass,
The illuminance detection component according to claim 1, wherein the substrate body and the translucent member are anodically bonded. 前記基板本体を貫通し、前記パッドと電気的に接続された貫通ビアを設けると共に、前記基板本体の前記主面とは反対側に位置する前記貫通ビアの端部と前記外部接続端子とを電気的に接続したことを特徴とする請求項１ないし７のうち、いずれか一項記載の照度検出部品。   A through via that penetrates the substrate main body and is electrically connected to the pad is provided, and an end portion of the through via located on the opposite side of the main surface of the substrate main body and the external connection terminal are electrically connected. The illuminance detection component according to claim 1, wherein the illuminance detection component is connected in a mechanical manner. 前記透光性部材の前記受光素子と対向する面と反対側の面に、前記透光性部材の面において前記外部から照射された光が反射されることを防止する反射防止部材を設けたことを特徴とする請求項１ないし８のうち、いずれか一項記載の照度検出部品。   An antireflection member is provided on the surface of the translucent member opposite to the surface facing the light receiving element to prevent light irradiated from the outside from being reflected on the surface of the translucent member. The illuminance detection component according to claim 1, wherein: 請求項１ないし９のうち、いずれか一項記載の照度検出部品を複数有すると共に、
平面視した状態において、露光装置により露光される配線基板と略等しい外形を有する板体と、前記板体に設けられ、前記照度検出部品に設けられた前記外部接続端子と電気的に接続される配線パターンと、を有する照度検出部品配設板を備えたことを特徴とする照度検出装置。 While having a plurality of illuminance detection components according to any one of claims 1 to 9,
In a plan view, a plate having an outer shape substantially equal to the wiring board exposed by the exposure apparatus, and provided on the plate and electrically connected to the external connection terminal provided on the illuminance detection component An illuminance detection device comprising an illuminance detection component-equipped plate having a wiring pattern. 支持基板と、
該支持基板に配設されており、外部から照射された光を受光する受光部を有する受光素子と、
外部から照射された光を透過させる材質により形成されており、前記支持基板に接合されることにより、前記支持基板との間で前記受光素子を気密に封止する透光性部材と、
前記受光素子と電気的に接続された外部接続端子とを有しており、
前記受光素子を、前記複数の受光部が同一チップ上にアレイ状に形成された構成としたことを特徴とする照度検出部品。 A support substrate;
A light receiving element disposed on the support substrate and having a light receiving portion for receiving light emitted from the outside;
It is formed of a material that transmits light emitted from the outside, and is joined to the support substrate so that the light receiving element is hermetically sealed with the support substrate; and
An external connection terminal electrically connected to the light receiving element;
An illuminance detection component characterized in that the light receiving element has a configuration in which the plurality of light receiving portions are formed in an array on the same chip. 前記透光性部材の前記受光素子と対向する面に、前記外部から照射された光を遮光する遮光部材を設けると共に、前記受光部と対向する部分に前記外部から照射された光を通過させる開口部を設けたことを特徴とする請求項１１記載の照度検出部品。 A light-shielding member that shields light emitted from the outside is provided on a surface of the translucent member that faces the light-receiving element, and an opening that allows light emitted from the outside to pass through a portion that faces the light-receiving portion. The illuminance detection component according to claim 11, further comprising a portion . 前記開口部の直径は、前記受光部の有効エリアの直径よりも小さいことを特徴とする請求項１２記載の照度検出部品。 The illuminance detection component according to claim 12, wherein a diameter of the opening is smaller than a diameter of an effective area of the light receiving unit . 前記支持基板と前記透光性部材とを陽極接合したことを特徴とする請求項１１ないし１３のうち、いずれか一項記載の照度検出部品。 The illuminance detection component according to any one of claims 11 to 13, wherein the support substrate and the translucent member are anodically bonded. 前記透光性部材に前記受光素子を封止するための凹部を形成すると共に、
前記支持基板を平板形状としたことを特徴とする請求項１１ないし１４のうち、いずれか一項記載の照度検出部品。 While forming a recess for sealing the light receiving element in the translucent member,
The illuminance detection component according to claim 11, wherein the support substrate has a flat plate shape. 前記支持基板に前記受光素子を封止するための凹部を形成すると共に、
前記透光性部材を平板形状としたことを特徴とする請求項１１ないし１４のうち、いずれか一項記載の照度検出部品。 While forming a recess for sealing the light receiving element in the support substrate,
The illuminance detection component according to claim 11, wherein the translucent member has a flat plate shape. 前記支持基板の基板本体はシリコンからなり、前記透光性部材はガラスからなることを特徴とする請求項１１ないし１６のうち、いずれか一項に記載の照度検出部品。 The illuminance detection component according to any one of claims 11 to 16 , wherein a substrate body of the support substrate is made of silicon, and the translucent member is made of glass. 前記透光性部材の前記受光素子と対向する面と反対側の面に、前記透光性部材の面において前記外部から照射された光が反射されることを防止する反射防止部材を設けたことを特徴とする請求項１１ないし１７のうち、いずれか一項記載の照度検出部品。 An antireflection member is provided on the surface of the translucent member opposite to the surface facing the light receiving element to prevent light irradiated from the outside from being reflected on the surface of the translucent member. The illuminance detection component according to any one of claims 11 to 17 , wherein: 請求項１１ないし１８のうち、いずれか一項記載の照度検出部品を複数有すると共に、
平面視した状態において、露光装置により露光される配線基板と略等しい外形を有する板体と、
前記板体に設けられ、前記照度検出部品に設けられた前記外部接続端子と電気的に接続される配線パターンと、を有する照度検出部品配設板を備えたことを特徴とする照度検出装置。 While having a plurality of illuminance detection components according to any one of claims 11 to 18 ,
In a state in plan view, a plate having an outer shape substantially equal to the wiring board exposed by the exposure apparatus;
An illuminance detection device provided with an illuminance detection component arrangement plate provided on the plate body and having a wiring pattern electrically connected to the external connection terminal provided on the illuminance detection component.
JP2007126490A 2007-03-05 2007-05-11 Illuminance detection device Expired - Fee Related JP5281252B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007126490A JP5281252B2 (en) 2007-03-05 2007-05-11 Illuminance detection device
KR1020080020046A KR20080081833A (en) 2007-03-05 2008-03-04 Illuminance detecting component and illuminance detecting apparatus
US12/041,840 US7728283B2 (en) 2007-03-05 2008-03-04 Illuminance detecting apparatus comprising a light shielding element containing openings for each detector element
TW097107611A TW200901432A (en) 2007-03-05 2008-03-05 Illuminance detecting component and illuminance detecting apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007054706 2007-03-05
JP2007054706 2007-03-05
JP2007126490A JP5281252B2 (en) 2007-03-05 2007-05-11 Illuminance detection device

Publications (3)

Publication Number Publication Date
JP2008252052A JP2008252052A (en) 2008-10-16
JP2008252052A5 true JP2008252052A5 (en) 2010-03-18
JP5281252B2 JP5281252B2 (en) 2013-09-04

Family

ID=39976599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007126490A Expired - Fee Related JP5281252B2 (en) 2007-03-05 2007-05-11 Illuminance detection device

Country Status (3)

Country Link
JP (1) JP5281252B2 (en)
KR (1) KR20080081833A (en)
TW (1) TW200901432A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7410782B2 (en) * 2020-04-03 2024-01-10 京セラ株式会社 Electromagnetic wave detection device and detection module

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627035U (en) * 1985-06-28 1987-01-16
JP2001196486A (en) * 2000-01-07 2001-07-19 Murata Mfg Co Ltd Reduced-pressure package structure and manufacturing method thereof
JP4139051B2 (en) * 2000-06-28 2008-08-27 富士フイルム株式会社 Linear image sensor chip and linear image sensor
JP2002329850A (en) * 2001-05-01 2002-11-15 Canon Inc Chip size package and its manufacturing method
JP2003123689A (en) * 2001-10-17 2003-04-25 Fuji Koken Kk High-brightness discharge lamp
JP3881888B2 (en) * 2001-12-27 2007-02-14 セイコーエプソン株式会社 Optical device manufacturing method
WO2003096427A1 (en) * 2002-05-10 2003-11-20 Hamamatsu Photonics K.K. Rear surface irradiation photodiode array and method for producing the same
JP4181807B2 (en) * 2002-07-11 2008-11-19 新光電気工業株式会社 Laser processing method
JP2004273747A (en) * 2003-03-07 2004-09-30 Nippon Kessho Kogaku Kk Photodetector and radiation detecting device
JP2007027279A (en) * 2005-07-13 2007-02-01 Shinko Electric Ind Co Ltd Semiconductor device and manufacturing method thereof
JP4889974B2 (en) * 2005-08-01 2012-03-07 新光電気工業株式会社 Electronic component mounting structure and manufacturing method thereof

Similar Documents

Publication Publication Date Title
JP5736253B2 (en) Optical sensor device
TWI695517B (en) Compact optoelectronic modules
TW201619576A (en) Optical module, method of manufacturing the same and electronic device
TWI479644B (en) Image sensor module
JP5896758B2 (en) LED light emitting device
TWI690779B (en) Image sensor chip encapsulation structure and method for manufacturing same
US20110267534A1 (en) Image sensor package and camera module using same
TW201410008A (en) Image sensor module and camera module
TWI495340B (en) Image sensor module and camera module
KR20200079441A (en) Identification unit and electronic device for under-screen optical fingerprint
TW201928490A (en) Lens module
TW201421987A (en) Image sensor module and camera module
TW201409671A (en) Image sensor module and camera module
TWI540469B (en) Electronic device with high electrostatic protection
JP2008252052A5 (en)
KR20160005317A (en) Electronic device having contactless temperature sensor
JP4145619B2 (en) OPTICAL MODULE AND ITS MANUFACTURING METHOD, CIRCUIT BOARD AND ELECTRONIC DEVICE
JP5908627B2 (en) Optical sensor device
TW202013707A (en) Sensor package structure
JP5281252B2 (en) Illuminance detection device
CN219246680U (en) Photoelectric chip packaging structure and reflective photoelectric encoder
JP2010237162A5 (en)
JP2019009301A (en) Substrate for optical sensor and optical sensor module
TWI556591B (en) Optical transceiversystem and light-sensing device thereof
TW200907535A (en) Camera module