JP2008251948A - Method of manufacturing circuit component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit component which improves productivity and enables down-spacing within an electronic device. <P>SOLUTION: Regarding a method of manufacturing a circuit component for manufacturing the circuit component comprising a wiring pattern on a surface of a resin mold, while abutting a member 21 to a resin mold 1 including a plated area to which a plating catalyst is applied, the member 21 covering the plated area while remaining a void 34 and comprising two openings 33a and 33b respectively linking the void and the outside, a plating liquid 22 is supplied from one opening 33a through the void to the other opening 33b, thereby forming a wiring pattern 3 constituted of a plating film in the plated area. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a circuit component, and more particularly to a method of manufacturing an MID that is a circuit component in which a wiring pattern is three-dimensionally formed along the surface of a resin molded body.

As electronic devices become smaller, lighter, and have higher performance, printed circuit boards are required to have fine patterns and multilayers, and studies are being actively conducted to make effective use of free space inside electronic devices. It has been broken.
One of means for utilizing an empty space inside an electronic device is a MID (Molded Interconnect device).
The MID is a circuit component in which a wiring pattern is three-dimensionally formed along the surface of a resin molded body that is injection-molded into a predetermined three-dimensional shape, and its outer shape is a shape corresponding to an empty space inside the electronic device. Thus, the MID can be arranged in the empty space, so that the space inside the electronic device can be saved and the electronic device can be downsized.

  As a method for producing MID, there are generally a “single molding method” as described in Patent Document 1 and a “double molding method” as described in Patent Document 2.

The “one-time molding method” is a method in which the entire surface of the resin molded body is made conductive by roughening the entire surface of the resin molded body, then applying a plating catalyst to the roughened surface and performing electroless copper plating. In this method, a wiring pattern is three-dimensionally formed on a resin molded body by forming a film and processing the conductive film using a photolithography method.
As a wiring pattern forming method, a subtractive method in which the conductive film is etched using a patterned etching resist, or a semiconducting method in which electrolytic copper plating is performed using a plating resist patterned using the conductive film as a plating conductive film. There is an additive method.

  However, the “single molding method” is parallel light when the etching resist or plating resist is patterned using a photolithography method, and more specifically, when the etching resist or plating resist is partially exposed. Patterning on the surface orthogonal to the exposure light is relatively easy, but on the surface parallel to the exposure light, the exposure accuracy deteriorates and it is difficult to manage the exposure amount, so patterning on this surface is difficult. This is the actual situation.

On the other hand, the “double molding method” includes a first resin molded body that can be provided with a plating catalyst and can form an electroless plating film, and a second resin that is not provided with a plating catalyst, that is, an electroless plating film is not formed. This is a method of forming a wiring pattern in a portion where the first resin molded body is exposed by performing electroless copper plating by a full additive method in a state where the resin molded body is integrated.
In other words, the “two-time molding method” can form the wiring pattern without performing the exposure process like the “one-time molding method”, and thus can solve the above-mentioned problem of the “one-time molding method”.

However, the “double molding method” is inferior in productivity because it requires at least two molding steps as compared with the “single molding method”, and is manufactured because it has at least two resin molded bodies. Since the outer size of the MID becomes large, it is disadvantageous for space saving inside the electronic device.
In addition, it is conceivable to remove the second resin molded body after the wiring pattern is formed. In this case, however, a process for removing the second resin molded body is further required, which causes the productivity to be further deteriorated.

Therefore, Patent Document 3 describes a means for forming a wiring pattern without performing an exposure process and without requiring two resin moldings.
In the method of manufacturing a circuit component described in Patent Document 3, the surface of the resin molded body to which the plating catalyst is applied and the plating catalyst in the vicinity thereof are removed, and then the surface and the vicinity thereof are partially removed with a laser beam. A wiring pattern is formed by exposing an internal plating catalyst application part and performing electroless copper plating on the exposed plating catalyst application part.
JP 61-43497 A JP-A-5-299815 JP 2007-48827 A

However, in the method of manufacturing a circuit component described in Patent Document 3, when the resin molded body has a complicated outer shape, for example, when it has a hole, the circulation of the plating catalyst removal solution into the hole is more difficult than other parts. Therefore, the plating catalyst on the inner surface of the hole may not be completely removed.
If the plating catalyst is not completely removed, an electrolytic copper plating film is formed in this portion, so that the wiring patterns may be short-circuited by this electrolytic copper plating film.
Moreover, when the variation in the depth from the surface in the region where the plating catalyst is removed is large, there is a possibility that a region where the plating catalyst applying portion inside the surface layer is not completely exposed may occur.
Since the electrolytic copper plating film is not formed in the region where the plating catalyst application portion is not exposed, a wiring pattern having a disconnection may be formed.

  In addition, since the region where the wiring pattern is formed on the surface layer is removed by laser processing, an enormous laser processing time is required, and this laser processing step becomes a factor that deteriorates productivity.

  Therefore, the problem to be solved by the present invention is to provide a circuit component manufacturing method that can improve productivity and can save space in an electronic device.

In order to solve the above problems, each invention of the present application has the following means.
1) In a circuit component manufacturing method for manufacturing a circuit component in which a wiring pattern is provided on the surface of a resin molded body, the resin molded body (1) having a plated area to which a plating catalyst is applied is provided on the plated area. In the state in which the member (21) provided with two openings (33a, 33b) for connecting the gap and the outside is brought into contact with the one opening ( A plating solution (22) is supplied from 33a) through the gap to the other opening (33b) to form a wiring pattern (3) made of a plating film in the area to be plated. This is a method for manufacturing a circuit component (10).
2) The method of manufacturing a circuit component according to 1), wherein the resin molded body has a recess (42), and the plated region is provided in the recess.

  According to the present invention, it is possible to improve productivity and achieve an effect of saving space inside the electronic device.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to FIGS.
1 to 4 are diagrams for explaining an embodiment of a circuit component manufacturing method according to the present invention.
In the embodiment, a manufacturing method of an MID (Molded Interconnect device) which is one form of a circuit component will be described as an example.

<Example>
First, as shown in FIG. 1, a rectangular parallelepiped resin molded body 1 is produced by injection molding an insulating resin mixed with about 0.1% by weight of palladium (Pd), which is a catalyst for electroless plating. To do. FIG. 1 is a perspective view showing a resin molded body 1.
The resin molded body 1 serves as a base of the MID 10 described later, and the shape thereof is not limited to the first embodiment, but may be a shape corresponding to the space of the electronic device in which the MID 10 is disposed. it can.
In the example, the length L1 and the width W1 of the resin molded body 1 were 2.4 cm and the height H1 was 1 cm, respectively.

  Next, a method for forming the wiring pattern 3 on the resin molded body 1 using the electroless plating apparatus 20 will be described.

First, the electroless plating apparatus 20 will be described with reference to FIG.
FIG. 2 is a schematic diagram for explaining the electroless plating apparatus 20, where (a) in FIG. 2 is a schematic configuration diagram of the electroless plating apparatus 20, and (b) is a cross-sectional view in the ABCD section in (a). (C) is sectional drawing in the EFGH cross section in (a).

  As shown in FIG. 2, the electroless plating apparatus 20 mainly includes a main body portion 21, a tank portion 23 that stores an electroless plating solution 22, and a pumping of the electroless plating solution 22 from the tank portion 23 to the main body portion 21. The pressure feeding means 24, the flow rate adjusting means 25 for adjusting the flow rate of the electroless plating solution 22 fed by the pressure feeding means 24, the analysis adjusting device 26 for analyzing and managing the electroless plating solution 22, the main body 21, The tank portion 23, the pressure feeding means 24, the flow rate adjusting means 25, and a piping portion 29 for connecting the analysis adjusting device 26, and a fixing means 27 for fixing the resin molded body 1 to the main body portion 21 are configured.

  The main body 21 is made of a material (for example, stainless steel) having corrosion resistance with respect to the electroless plating solution 22, and is mainly formed on the housing 31 for housing the resin molded body 1 and the inner surface of the housing 31. A recess 32 serving as a flow path 34 for the electroless plating solution 22, an elastic seal portion 21 b provided along the outer periphery of the recess 32 so as to surround the recess 32, a recess 32, and a piping portion 29. Are formed by gaps 33a and 33b and female thread 21a.

  The tank unit 23 includes heating control means (not shown), and the heating control means can control the electroless plating solution 22 by heating it to a predetermined temperature.

The fixing means 27 is mainly constituted by a pressing means 27a having elasticity and a through hole 27b provided at a position facing the female screw portion 21a of the main body portion 21.
In the embodiment, a spring member is used as the pressing means 27a.
Then, the fixing means 27 can be fixed to the main body portion 21 by inserting the male screw 28 through the through hole 27 b and screwing into the female screw portion 21 a.

  As the tank unit 23, the pressure feeding unit 24, the flow rate adjusting unit 25, the analysis adjusting unit 26, and the piping unit 29, known ones can be used.

  Next, a method for forming the wiring pattern 3 on the resin molded body 1 using the electroless plating apparatus 20 will be described with reference to FIGS.

First, the resin molded body 1 (see FIG. 1) is housed in the housing portion 31 (see FIG. 2) of the main body 21 in the electroless plating apparatus 20.
Next, as shown in FIG. 3, the fixing means 27 is fixed to the main body portion 21 by inserting the male screw 28 through the through hole 27 b of the fixing means 27 and screwing into the female screw portion 21 a of the main body portion 21.
By fixing the fixing means 27 to the main body part 21, the resin molded body 1 is pressed and held by the main body part 21 via the seal part 21b by the pressing means 27a, and the sealing part 21 and the recessed part 32 of the main body part 21 are sealed. A gap 34 serving as a flow path 34 for the electroless plating solution 22 is formed by the portion 21 b and the surface of the resin molded body 1.

Next, the electroless plating solution 22 in the tank unit 23 is pumped to the main body 21 by the pumping unit 24, and the flow rate of the electroless plating solution 22 that is pumped is adjusted by the flow rate adjusting unit 25.
Then, the electroless plating solution 22 pumped to the main body portion 21 sequentially passes through the gap portion 33 a, the flow path 34, and the gap portion 33 b and returns to the tank portion 23.
Therefore, in a state where the resin molded body 1 is accommodated in the accommodating portion 31, the electroless plating solution 22 in the tank portion 23 can be circulated while passing through the flow path 34 of the main body portion 21.
By circulating the electroless plating solution 22 while passing through the flow path 34, the wiring pattern 3 made of an electroless plating film is formed in a region in contact with the electroless plating solution 22 on the surface of the resin molded body 1. That is, the wiring pattern 3 made of the electroless plating film is formed in a range corresponding to the range where the recess 32 is provided on the surface of the resin molded body 1.
The thickness of the wiring pattern 3 can be controlled by adjusting the electroless plating conditions such as the temperature of the electroless plating solution 22 and the plating time.
In the examples, an electroless copper plating solution was used as the electroless plating solution 22, and the electroless plating conditions were adjusted so that the wiring pattern 3 had a thickness of 5 μm.

  Thereafter, the pumping of the electroless plating solution 22 is stopped, the fixing means 27 is detached from the main body 21, and then the resin molded body 1 is taken out from the electroless plating apparatus 20, as shown in FIG. The MID 10 having the wiring pattern 3 formed on the surface of 1 is obtained.

Next, a modified example of the above-described embodiment will be described as a first modified example and a second modified example with reference to FIGS.
5 and 6 are perspective views for explaining a first modification and a second modification of the embodiment, respectively, and (a) and (b) in each figure show the state of the manufacturing process, respectively. Yes.

  First, a first modification will be described with reference to FIG.

<First Modification>
The first modified example is different from the above-described embodiment in that a recessed portion 42 is provided in advance in a region where the wiring pattern 43 of the resin molded body 41 is formed, and the rest is the same as the embodiment.
Similar to the embodiment, the resin molded body 41 can be manufactured by injection molding an insulating resin mixed with about 0.1 wt% of palladium (Pd), which is a catalyst for electroless plating.
And MID40 is obtained by forming the wiring pattern 43 in this resin molding 41 using the electroless-plating apparatus 20 similar to an Example.
The MID 40 is configured such that the wiring pattern 43 does not protrude outward from the surface of the resin molded body 41 by providing a recessed portion 42 in advance in the resin molded body 41 as a base.
According to this configuration, when an electronic component or the like is mounted on the wiring pattern 43, the electronic component is not displaced from the wiring pattern 43. Therefore, the mounting position accuracy of the electronic component can be improved as compared with the embodiment.

  Next, a second modification will be described with reference to FIG.

<Second Modification>
The second modified example is different from the above-described embodiment in that the resin molded body 51 has a recess 52 and a plurality of wiring patterns, for example, four wiring patterns 53a, 53b, 53c, and 53d. Is different.
Similar to the embodiment, the resin molded body 51 can be manufactured by injection molding an insulating resin mixed with about 0.1 wt% of palladium (Pd), which is a catalyst for electroless plating.

Thus, when forming several wiring patterns 53a, 53b, 53c, 53d in the resin molding 51 which has the recessed part 52, each wiring pattern 53a, 53b is provided in the main-body part 21 of the electroless-plating apparatus 20 of an Example. , 53c and 53d may be provided.
That is, after fixing the resin molded body 51 to the main body portion, a plurality of wirings are connected to the resin molded body 51 by pumping the electroless plating solution into the flow path of the electroless plating solution formed by the recesses. Patterns 53a, 53b, 53c, and 53d can be formed.

As described above in detail, according to the method for manufacturing a circuit component according to the present invention, a wiring pattern can be directly formed by electroless plating without requiring a complicated process. Can also improve productivity.
In addition, according to the method for manufacturing a circuit component according to the present invention, a wiring pattern can be formed on the surface of the resin molded body without depending on the outer shape of the resin molded body. Since it can be set as the external shape according to the space space of the electronic device arrange | positioned, this space space can be utilized effectively and the space saving inside an electronic device is attained.

  The embodiment of the present invention is not limited to the configuration and procedure described above, and it goes without saying that modifications may be made without departing from the scope of the present invention.

  For example, in the example, the first modified example, and the second modified example, the resin molded bodies 1, 41, 51 were produced by injection molding an insulating resin mixed with a catalyst for electroless plating. However, the present invention is not limited to this. After a resin molded body is manufactured by injection molding an insulating resin not mixed with an electroless plating catalyst, at least a region where a wiring pattern is formed in the resin molded body is roughened. Furthermore, a catalyst for electroless plating may be applied only to this region.

  In the embodiment, as a method of fixing the fixing means 27 to the main body portion 21, a method of screwing screws is used, but the method is not limited to this.

  In the embodiment, a spring member is used as the pressing means 27a, but the present invention is not limited to this.

  In the embodiment, the MID manufacturing method has been described as an example of the circuit component manufacturing method. However, the present invention is not limited to this, and the circuit component manufacturing method having a wiring pattern on the surface of the substrate is not limited thereto. The invention can be used.

It is a figure for demonstrating the Example of the manufacturing method of the circuit component of this invention, and is a perspective view which shows the resin molding in an Example. It is a figure for demonstrating the Example of the manufacturing method of the circuit components of this invention, and is a schematic diagram for demonstrating the electroless-plating apparatus in an Example. It is a figure for demonstrating the Example of the manufacturing method of the circuit component of this invention, and is a schematic diagram for demonstrating the formation method of the wiring pattern in an Example. It is a figure for demonstrating the Example of the manufacturing method of the circuit component of this invention, and is a perspective view which shows MID in an Example. It is a perspective view for demonstrating the 1st modification of an Example. It is a perspective view for demonstrating the 2nd modification of an Example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin molding, 3 Wiring pattern, 10 MID, 20 Electroless plating apparatus, 21 Main body part, 21a Female thread part, 21b Seal part, 22 Electroless plating solution, 23 Tank part, 24 Pressure feeding means, 25 Flow rate adjustment means, 26 Analytical adjustment device, 27 fixing means, 27a pressing means, 27b through hole, 28 male screw, 29 piping part, 31 accommodating part, 32 dent part, 33a, 33b gap part, 34 channel (gap part), L1 length, W1 Width, H1 height

Claims (2)

In the method of manufacturing a circuit component for manufacturing a circuit component in which a wiring pattern is provided on the surface of the resin molded body,
A resin molded body having a plating area to which a plating catalyst is applied is contacted with a member having two openings for covering the plating area with a gap and connecting the gap and the outside. In this state, a plating solution is supplied from the one opening to the other opening through the gap, and a wiring pattern made of a plating film is formed in the plated area. Circuit component manufacturing method.   The method of manufacturing a circuit component according to claim 1, wherein the resin molded body has a recessed portion, and the plated region is provided in the recessed portion.

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