JP2008251894A - Equipment for manufacturing intermediate member of electronic circuit substrate and method for manufacturing intermediate member of electronic circuit substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To set a feeding length of an interposer substrate tape exactly. <P>SOLUTION: The equipment for manufacturing an intermediate member of an electronic circuit substrate includes a feeding mechanism 4 which feeds the interposer substrate tape 10 by a predetermined distance without causing a slip, a sensor 5 which detects the head of the interposer substrate to position it, and a rotating table 3 which receives each interposer substrate 12 to feed only a non-defective interposer substrate 12 onto a carrier tape 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an apparatus and a method for manufacturing an electronic circuit board intermediate member that is preferably applied to a method for manufacturing a contactless ID (identification information) card.

  Conventionally, as a so-called non-contact ID card, non-contact tag or the like (hereinafter referred to collectively as non-contact ID cards) in which an IC chip is mounted on an antenna circuit board, for example, Patent Document 1 discloses. Things are known.

  These non-contact ID cards are composed of an antenna circuit board in which an antenna is formed on a base material, and an interposer board in which an enlarged electrode connected to the electrode of the IC chip is formed on a base material in which an IC chip is embedded. Both substrates are laminated so that the antenna electrode and the enlarged electrode are joined. However, the IC chip may be mounted on the surface of the base material.

  Moreover, as an apparatus for manufacturing an electronic circuit board intermediate member before obtaining such non-contact ID cards, an apparatus shown in Patent Document 2 has been proposed.

  This apparatus includes a first transport mechanism for transporting an interposer substrate tape, a second transport mechanism for transporting a carrier tape, a discharge nozzle for applying an adhesive to the interposer substrate tape being transported, and an interposer substrate tape. An identification mark recognition unit for recognizing an identification mark formed at a predetermined position, a cutter for cutting the interposer substrate tape to obtain individual interposer substrates, a conveyance processing unit for conveying and processing individual interposer substrates, and And an elevating position for supporting the carrier tape when receiving the interposer substrate.

The first transport mechanism is a servo-driven tape feed roller that attracts the tape and applies a feed force.
International publication number WO01 / 062517 International Publication Number WO2005 / 073902

  By manufacturing the electronic circuit board intermediate member using the apparatus described in Patent Document 2, it is possible to obtain an electronic circuit board intermediate member in which only good interposer substrates are arranged on a carrier tape.

  However, since the interposer board tape is attracted by the servo-driven tape feed roller to generate the feed force, it is difficult to eliminate slippage. As a result, the interposer board tape feed is difficult. There is a problem that the length becomes inaccurate, and as a result, the size of the cut interposer substrate varies.

  Further, even if the interposer substrate is different from the regular size, it does not become a defective product and is processed as a good interposer substrate.

  The present invention has been made in view of the above problems, and can accurately set the feed length of an interposer substrate tape, and recognize an interposer substrate that is different from a regular size as a defective product. An object of the present invention is to provide an electronic circuit board intermediate member manufacturing apparatus that can be used.

The electronic circuit board intermediate member manufacturing apparatus of the present invention cuts an interposer board tape formed with enlarged electrodes connected to the electrodes of each electronic component on a base material on which a plurality of electronic components are mounted. Obtaining a Poser substrate, selecting only good interposer substrates, and placing only good interposer substrates at predetermined intervals on a carrier tape formed with a release layer,
A feeding mechanism that feeds the interposer board tape for a predetermined distance without causing slippage, a sensor that detects the top of the interposer board for positioning, and an individual interposer board. And a turntable for feeding onto the carrier tape.

  According to this electronic circuit board intermediate member manufacturing apparatus, an interposer board tape in which enlarged electrodes connected to the electrodes of each electronic component are formed on a base material on which a plurality of electronic components are mounted is cut into individual interfaces. When the POSSAR board is obtained, only the non-defective interposer board is selected, and only the non-defective interposer board is placed at predetermined intervals on the carrier tape formed with the release layer, slippage occurs due to the feeding mechanism. Without interfering, the interposer board tape is fed by a predetermined distance, the leading edge of the interposer board is detected by the sensor for positioning, the individual interposer board is received by the rotary table, and only the good interposer board is placed on the carrier tape Can be supplied to.

  Accordingly, the feed length of the interposer board tape can be set accurately, and the variation in the size of the interposer board can be greatly reduced. An electronic circuit board intermediate member can be obtained.

  Here, the feeding mechanism preferably includes a gripping and fixing device that grips and fixes the interposer substrate tape, and a gripping and feeding device that grips and feeds the interposer substrate tape by a predetermined distance. The feeding length of the tape can be set accurately, and misalignment when feeding is not performed can be prevented.

  Further, the sensor preferably detects a blank portion of the interposer substrate tape in order to position the leading end of the interposer substrate, and can position the leading end of the interposer substrate reliably and accurately. it can.

  The rotary table has a first position for receiving an individual interposer substrate, a second position for detecting the presence or absence of a defect mark indicating that the individual interposer substrate is defective, and dimensions of the individual interposer substrate. Preferably, a fourth position for discharging a defective interposer substrate, and a fifth position for supplying a non-defective interposer substrate onto the carrier tape. The interposer substrate having a size different from the regular size can be discharged as a defective interposer substrate. As a result, a high-quality electronic circuit board intermediate member including only a good interposer substrate can be obtained.

  Furthermore, it preferably further includes a first pressing roll that presses the tip of the interposer substrate tape against the rotary table before cutting the interposer substrate tape to obtain individual interposer substrates. The substrate can be reliably and smoothly supplied.

  Furthermore, it is preferable to further include a second pressing roll that presses the portion of the interposer substrate that protrudes from the rotary table at the fifth position onto the carrier tape, and ensures supply of the interposer substrate onto the carrier tape. And can be achieved smoothly.

  The method for producing an electronic circuit board intermediate member according to the present invention cuts an interposer board tape in which enlarged electrodes connected to the electrodes of each electronic component are formed on a base material on which a plurality of electronic components are mounted, to provide individual interposers. An electronic circuit board intermediate member manufacturing method comprising obtaining a POR substrate (12), selecting only non-defective interposer substrates, and arranging only non-defective interposer substrates at predetermined intervals on a carrier tape formed with a release layer. Then, the interposer board tape is fed by a predetermined distance without causing any slip by the feeding mechanism, the head of the interposer board is detected for positioning by the sensor, and the individual interposer board is received by the rotary table, In this method, only good interposer substrates are supplied onto the carrier tape.

  According to this electronic circuit board intermediate member manufacturing method, the feed length of the interposer board tape can be accurately set, and the variation in the size of the interposer board can be greatly reduced. A high-quality electronic circuit board intermediate member including only the interposer board can be obtained.

  Here, the feeding mechanism preferably includes a gripping and fixing device that grips and fixes the interposer substrate tape, and a gripping and feeding device that grips and feeds the interposer substrate tape by a predetermined distance. The feeding length of the tape can be set accurately, and misalignment when feeding is not performed can be prevented.

  Further, the sensor preferably detects a blank portion of the interposer substrate tape in order to position the leading end of the interposer substrate, and can position the leading end of the interposer substrate reliably and accurately. it can.

  The rotary table has a first position for receiving an individual interposer substrate, a second position for detecting the presence or absence of a defect mark indicating that the individual interposer substrate is defective, and dimensions of the individual interposer substrate. Preferably, a fourth position for discharging a defective interposer substrate, and a fifth position for supplying a non-defective interposer substrate onto the carrier tape. The interposer substrate having a size different from the regular size can be discharged as a defective interposer substrate. As a result, a high-quality electronic circuit board intermediate member including only a good interposer substrate can be obtained.

  Furthermore, it is preferable to press the tip of the interposer substrate tape against the rotary table by the first pressing roll before cutting the interposer substrate tape to obtain individual interposer substrates. Supply can be achieved reliably and smoothly.

  Furthermore, it is preferable that the portion of the interposer substrate protruding from the rotary table in the fifth position is pressed onto the carrier tape by the second pressing roll, and the supply of the interposer substrate onto the carrier tape is ensured and Can be achieved smoothly.

  The electronic circuit board intermediate member manufacturing apparatus of the present invention can accurately set the feed length of the interposer board tape, and can greatly reduce the variation in the size of the interposer board. It is possible to obtain a high-quality electronic circuit board intermediate member including only the interposer board.

  The electronic circuit board intermediate member manufacturing method of the present invention can accurately set the feed length of the interposer board tape, and can greatly reduce the variation in the size of the interposer board. It is possible to obtain a high-quality electronic circuit board intermediate member including only the interposer board.

  Embodiments of an electronic circuit board intermediate member manufacturing apparatus according to the present invention will be described below in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic view showing an embodiment of an electronic circuit board intermediate member manufacturing apparatus according to the present invention, and FIG. 2 is a schematic view showing a main part in detail.

  The electronic circuit board intermediate member manufacturing apparatus according to the present invention includes a first feed mechanism 1 for feeding an interposer board tape 10 formed by laminating a base tape 11 with an adhesive layer, and a second feed mechanism 2 for feeding a carrier tape 20. The rotary table 3 that receives the interposer substrate 12 from the interposer substrate tape 10 and supplies only the non-defective interposer substrate 12 onto the carrier tape 20, and the grip feed that holds the interposer substrate tape 10 and sends it for a predetermined length. In order to position the mechanism 4 and the top of the interposer substrate 12, the leading detection sensor 5 that detects the blank portion of the interposer substrate tape 10 and the interposer substrate tape 10 are cut to obtain individual interposer substrates 12. Rotate the cutting device 6 and the tip of the interposer substrate 12 The first pressing roll 31 that presses against the table 3, the second pressing roll 32 that presses the portion of the interposer substrate 12 that protrudes from the rotary table 3 onto the carrier tape 20, and the interposer substrate 12 on the carrier tape 20. It has the transfer confirmation sensor 21 which confirms that it was transferred, and the controller (not shown) which controls the operation | movement of each part.

Examples of the interposer substrate tape 10 include a substrate on which a plurality of IC chips are mounted, and enlarged electrodes connected to the electrodes of the IC chips.
The first feed mechanism 1 feeds the interposer substrate tape 10 formed by bonding the base tape 11 from the unwinding shaft 13 to the winding shaft 15 via the guide roller 14, and the interposer is placed at a predetermined position. It has a dancer 16 that applies tension (excludes slack) to the substrate tape 10. The grip feed mechanism 4 is disposed at a predetermined position in the feed path of the interposer substrate tape 10, and the interposer substrate tape 10 is peeled from the base tape 11 on the downstream side of the grip feed mechanism 4.

  The second feeding mechanism 2 feeds the carrier tape 20 from the unwinding shaft 22 to the winding shaft 24 via the guide roller 23, and applies tension to the carrier tape 20 at a predetermined position (prevents sagging). ) Has a dancer 25. Then, on the downstream side of the position where the interposer substrate 12 is received, a transfer confirmation sensor 21 that confirms that the interposer substrate 12 has been transferred, and a third pressing roll 26 that presses the interposer substrate 12 against the carrier tape 20. It is arranged. In addition, a driving roller 28 that is driven by the servo motor 27 and applies a feeding force to the carrier tape 20 is disposed to face a predetermined guide roller 23. Furthermore, the encoder 29 is arranged at a predetermined position. Further, the guide roller 23 facing the second pressing roll 32 is reciprocated in the opposite direction to the second pressing roll 32.

  As shown in FIG. 3, the rotary table 3 has a notch portion that is directed to the center at every predetermined angle, and a first transfer position 33 that receives the interposer substrate 12 from the first feed mechanism 1 and a defective mark. Defect mark detection position 34 to be detected, dimension measurement position 35 for measuring the dimension of the interposer substrate 12, defective interposer substrate 12 (interposer substrate 12 having a defect mark, and interposer substrate 12 having a dimension different from the normal dimension) ), A second transfer position 37 for supplying the interposer substrate 12 to the carrier tape 20, and a transfer error discharge for discharging the remaining interposer substrate 12 not supplied to the carrier tape 20. It has a position 38. Further, the turntable 3 has a temporary stop position not less than the number of the positions, rotates by a predetermined angle for each interposer substrate 12, and then temporarily performs a predetermined time for performing necessary processing. To stop.

  At the defective mark detection position 34, for example, a defective mark can be detected by an image processing device or an optical sensor 34a.

  In the dimension measurement position 35, for example, the dimension of the interposer substrate 12 can be measured by a laser length measuring device 35a.

  At the defective product discharge position 36, for example, the defective interposer substrate 12 can be blown off by air blow, or the defective interposer substrate 12 can be scraped off using a claw member.

  At the transfer mistake discharge position 38, for example, the interposer substrate 12 remaining due to the transfer mistake can be blown off by air blow, or the interposer substrate 12 remaining due to the transfer mistake is scraped off using a claw member. be able to.

  The grip feed mechanism 4 sandwiches the interposer substrate tape 10 formed by laminating the fixing grip member 41 for sandwiching and fixing the interposer substrate tape 10 formed by laminating the base tape 11. And a moving grip member 42 for feeding a predetermined length in a pressed state. Then, when the moving grip member 42 sends the interposer substrate tape 10 formed by laminating the base tape 11 with a predetermined length, the clamping force fixing by the fixing grip member 41 is released, After the interposer substrate tape 10 formed by laminating the base tape 11 is fed with a predetermined length while being clamped, the moving grip member 42 is operated so as to release the clamped state, and the original position is directly reached. Returning, while performing these operations, the fixing grip member 41 is operated in the pinching fixed state.

  The head detection sensor 5 is, for example, an optical sensor, and detects the head of a series of interposer substrates 12 by detecting a blank portion when the interposer substrate tape 10 is provided as shown in FIG. can do. Further, if a blank portion is provided for each interposer substrate 12, the head of each interposer substrate 12 can be detected.

  The cutting device 6 cuts the interposer substrate tape 10 by reciprocating the cutting mold so as to come in contact with and away from the interposer substrate tape 10 to obtain individual interposer substrates 12. In the period during which the clamping pressure is fixed by the grip member 41, the cutting operation is performed after the front end portion of the interposer substrate 12 is pressed against the rotary table 3 by the first pressing roll 31. Then, the cutting die moves backward before the pressing of the tip of the interposer substrate 12 to the rotary table 3 by the first pressing roll 31 is released.

  The second pressing roll 32 presses the portion of the interposer substrate 12 that protrudes from the rotary table 3 onto the carrier tape 20, and in this state, the carrier tape 20 is fed by the second feeding mechanism 2. As a result, the entire interposer substrate 12 can be transferred from the turntable 3 onto the carrier tape 20.

The transfer confirmation sensor 21 is an optical sensor, for example, and can detect that the transfer has been performed by detecting the presence of the interposer substrate 12 on the carrier tape 20. Here, when it is not possible to confirm that the transfer has been performed, a discharge mechanism (such as a discharge mechanism using air pressure) is used to discharge the interposer substrate 12 at the transfer error discharge position 38. , Not shown) and the carrier tape 20 is moved backward by the second feeding mechanism 2 in order to prevent the generation of blank portions.
The rotary table 3, the grip feed mechanism 4, the cutting device 6, the first pressing roll 31, and the second pressing roll 32 are synchronized with each other from one servo motor 7 through a power transmission mechanism (such as a belt driving mechanism). To transmit the driving force. An encoder 72 is connected to the common drive shaft 71. However, the rotary table 3, the grip feed mechanism 4, the cutting device 6, the first pressing roll 31, and the second pressing roll 32 can be configured to be driven individually.

  The controller controls the operation of each unit as described above.

  The operation of the electronic circuit board intermediate member manufacturing apparatus having the above-described configuration is as follows.

  In the first feeding mechanism 1, the interposer substrate tape 10 formed by bonding the base tape 11 can be fed from the unwinding shaft 13 to the winding shaft 15 via the guide roller 14. Then, at a predetermined position in the feed path, the grip feed mechanism 4 intermittently feeds the interposer substrate tape 10 bonded with the base tape 11 by a predetermined length without causing slippage, and grip feed. The interposer substrate tape 10 can be peeled from the base tape 11 by guiding only the base tape 11 by the guide roller 14 on the downstream side of the mechanism 4 at an angle of about 90 degrees with respect to the feed direction so far. it can.

  Then, immediately after being peeled off from the base tape 11, the leading edge of the interposer substrate tape 10 is detected by detecting the blank portion of the interposer substrate tape 10 by the leading detection sensor 5, and thereby the interposer substrate tape 10 is detected. The top of 10 can be positioned.

  Next, the interposer substrate tape 10 can be cut by the cutting device 6 to obtain individual interposer substrates 12. Specifically, the tip of the interposer substrate tape 10 is pressed against the rotary table 3 by the first pressing roll 31, and is cut by the cutting device 6 in this state to become the interposer substrate 12, so that The interposer substrate 12 can be smoothly transferred to the turntable 3.

  Since the turntable 3 rotates by a predetermined angle, the transferred interposer substrate 12 detects a defective mark at the defective mark detection position 34 and measures the dimension of the interposer substrate 12 at the dimension measurement position 35 (dimension measurement). Based on the result, the interposer substrate 12 having a size different from the normal size is recognized as a defective interposer substrate 12), and the defective interposer substrate 12 (the interposer substrate 12 having a defective mark) at the defective product discharge position 36. The interposer substrate 12) having a size different from the regular size is discharged, and the portion of the interposer substrate 12 protruding from the rotary table 3 at the second transfer position 37 is carrier tape by the second pressing roll 32. 20 and press Moreover, the interposer substrate 12 is transferred onto the carrier tape 20 by feeding the carrier tape 20 by the second feeding mechanism 2, and the interposer substrate 12 is transferred onto the carrier tape 20 by the transfer confirmation sensor 21. I can confirm that.

  Here, when it is not possible to confirm that the interposer substrate 12 has been transferred onto the carrier tape 20, the interposer substrate 12 remains on the turntable 3, so at the transfer error discharge position 38, By discharging the remaining interposer substrate 12 and returning the carrier tape 20 by the second feeding mechanism 2, it is possible to prevent the occurrence of a portion where the interposer substrate 12 does not exist.

  In this manner, an electronic circuit board intermediate member in which only good interposer boards 12 are arranged at predetermined intervals on the carrier tape 20 can be manufactured.

It is the schematic which shows one Embodiment of the electronic circuit board intermediate member manufacturing apparatus of this invention. It is the schematic which shows the principal part of the electronic circuit board intermediate member manufacturing apparatus of this invention in detail. It is a schematic plan view explaining each position of a turntable. It is a schematic plan view which shows an example of an interposer substrate tape.

Explanation of symbols

3 Rotary table 4 Grip feed mechanism 5 Lead detection sensor 10 Interposer substrate tape 12 Interposer substrate 20 Carrier tape 31 First pressing roll 32 Second pressing roll 33 First transfer position 34 Defective mark detection position 35 Dimension measurement position 36 Non-defective product discharge position 37 Second transfer position 41 Fixing grip member 42 Moving grip member

Claims (12)

An interposer substrate tape (10) in which enlarged electrodes connected to the electrodes of the electronic components are formed on a base material on which a plurality of electronic components are mounted is cut to obtain individual interposer substrates (12). Electronic circuit board intermediate member manufacturing apparatus that selects only good interposer board (12) at predetermined intervals on carrier tape (20) formed by separating only the interposer board (12) and forming a release layer Because
A feed mechanism (4) for feeding the interposer substrate tape (10) by a predetermined distance without causing slipping;
A sensor (5) for detecting the top of the interposer substrate for positioning;
A turntable (3) for receiving an individual interposer substrate (12) and supplying only a good interposer substrate (12) onto the carrier tape (20);
An electronic circuit board intermediate member manufacturing apparatus comprising: The feeding mechanism (4) includes a gripping and fixing device (41) for gripping and fixing the interposer substrate tape (10), and a gripping and feeding device (42) for gripping and feeding the interposer substrate tape (10) by a predetermined distance. The electronic circuit board intermediate member manufacturing apparatus according to claim 1, comprising: 2. The electronic circuit board intermediate member manufacturing apparatus according to claim 1, wherein the sensor (5) detects a blank portion of the interposer board tape (10) in order to position the head of the interposer board. 3. The rotary table (3) detects a first position (33) for receiving the individual interposer substrate (12) and a second mark for detecting the presence or absence of a defect mark indicating that the individual interposer substrate (12) is defective. A position (34), a third position (35) for detecting the dimensions of the individual interposer substrate (12), a fourth position (36) for discharging the defective interposer substrate (12), and a good interposer The electronic circuit board intermediate member manufacturing apparatus according to claim 1, further comprising a fifth position (37) for supplying the board (12) onto the carrier tape (20). A first pressing roll (31) that presses the tip of the interposer substrate tape (10) against the rotary table (3) before cutting the interposer substrate tape (10) to obtain individual interposer substrates (12). The electronic circuit board intermediate member manufacturing apparatus according to claim 4, further comprising: The fourth pressing roll (32) further pressing a portion of the interposer substrate (12) protruding from the turntable (3) at the fifth position (37) onto the carrier tape (20). The electronic circuit board intermediate member manufacturing apparatus as described. An interposer substrate tape (10) in which enlarged electrodes connected to the electrodes of each electronic component are formed on a base material on which a plurality of electronic components are mounted is cut to obtain individual interposer substrates (12). Method for producing an intermediate member for an electronic circuit board in which only a good interposer substrate (12) is arranged at predetermined intervals on a carrier tape (20) formed by separating only the interposer substrate (12) and forming a release layer Because
The interposer substrate tape (10) is fed by a predetermined distance without causing any slip by the feeding mechanism (4),
Sensor (5) detects the top of the interposer board for positioning,
The individual interposer substrate (12) is received by the rotary table (3), and only the good interposer substrate (12) is supplied onto the carrier tape (20).
An electronic circuit board intermediate member manufacturing method, comprising: The feeding mechanism (4) includes a gripping and fixing device (41) for gripping and fixing the interposer substrate tape (10), and a gripping and feeding device (42) for gripping and feeding the interposer substrate tape (10) by a predetermined distance. The method for manufacturing an electronic circuit board intermediate member according to claim 7. The method for manufacturing an electronic circuit board intermediate member according to claim 7, wherein the sensor (5) detects a blank portion of the interposer board tape (10) in order to position the head of the interposer board. The rotary table (3) detects a first position (33) for receiving the individual interposer substrate (12) and a second mark for detecting the presence or absence of a defect mark indicating that the individual interposer substrate (12) is defective. A position (34), a third position (35) for detecting the dimensions of the individual interposer substrate (12), a fourth position (36) for discharging the defective interposer substrate (12), and a good interposer The method according to claim 7, further comprising a fifth position (37) for supplying the substrate (12) onto the carrier tape (20). Before the interposer substrate tape (10) is cut to obtain individual interposer substrates (12), the tip of the interposer substrate tape (10) is placed on the rotary table (3) by the first pressing roll (31). The electronic circuit board intermediate member manufacturing method according to claim 10, wherein the electronic circuit board intermediate member is pressed. The portion of the interposer substrate (12) protruding from the turntable (3) at the fifth position (37) is pressed onto the carrier tape (20) by the second pressing roll (32). Electronic circuit board intermediate member manufacturing method.

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