JP2008251852A - Chip type capacitor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate a lift or sinking of a lead wire due to a variation of a bending angle of the lead wire, and to prevent a reduction of a solder strength and a solder failure between a chip type capacitor and a board. <P>SOLUTION: The chip type capacitor comprises: a capacitor body in which a capacitor element is accommodated in a bottomed cylindrical sheathing case, and an opening of the sheathing case is sealed by a sealing member, and also which has a plurality of lead wires led out from the capacitor element and penetrating the sealing member; and an insulating member attached to the side where the lead wire is led out, and having a cavity for accommodating the lead wire in its lower face, wherein the lead wire is bent along the cavity of the insulating member. An auxiliary member is inserted into between the lead wire bent and accommodated in the cavity and the cavity of the insulating member, the auxiliary member is held by the lead wire, and a desired planar state is formed on the lower face of the insulating member. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a chip capacitor used by being mounted on a substrate as a surface mount type.

  FIG. 4 is a front sectional view showing the structure of this type of conventional chip capacitor.

  Conventionally, in these chip type capacitors, a recess 27 for inserting and bending a pair of lead wires 23 a and 23 b led out from the capacitor element 24 into the insulating member 26 and storing in a perpendicular direction is formed on the lower surface portion of the insulating member 26. It is configured so that it can be surface-mounted on the substrate.

  Since the lead wires 23a and 23b, in which the pair of lead wires 23a and 23b inserted through the insulating member 26 are folded and accommodated along the concave portion 27, try to return to the original state by the springback phenomenon of the bent portion, the concave portion of the insulating member 26 As a result, the floating 20 is generated such that the bent tip portions of the lead wires 23 a and 23 b protrude from the lower surface side of the insulating member 26. When the chip capacitor 21 is mounted on the substrate by soldering due to the float 20, the chip capacitor is inclined and bonded to the substrate, or only a part of the lead wire is soldered to the substrate. There was a problem that the bonding strength between the mold capacitor and the substrate was lowered.

For this reason, there is a chip-type capacitor in which the bottom surface depth of the concave portion of the insulating member is formed so that the end surface side is deep, and the lead wire is bent so that the leading end portion of the lead wire bent along the concave portion fits in the concave portion. (Patent Document 1)
In addition, a protrusion serving as a fulcrum for bending the lead wire is provided in the recess of the insulating member, and the lead wire is bent at two locations, that is, the peripheral edge of the through hole of the insulating member and the protrusion provided in the recess. There are chip-type capacitors that suppress the occurrence of springback by storing them. (Patent Document 2)
Japanese Patent Laid-Open No. 62-186518 JP 2002-25871 A

  However, in any of the chip-type capacitors as shown in Patent Document 1 or 2, the lead wire once bent and stored in the recess of the insulating member causes a springback phenomenon and floats from the bottom of the recess to return to the original state. become. The lead wire is bent in anticipation of the spring back of this lead wire, but the lead wire bending angle after this spring back varies, so the tip of the lead wire protrudes from the lower surface side of the insulation member In some cases, the lead wire is submerged in the recess of the insulating member.

  When the chip capacitor is soldered to the substrate with the tip of the lead wire protruding from the lower surface side of the insulating member, the chip capacitor is inclined and fixed to the substrate, or a part of the lower surface of the insulating member is the substrate Since the chip-type capacitor and the substrate are soldered in a state where the chip-type capacitor floats from the substrate, there is a problem in that the soldering strength between the chip-type capacitor and the substrate decreases.

  Further, when the chip capacitor is soldered to the substrate in a state where the lead wire is submerged, there is a problem of poor soldering in which only a part of the bent portion of the lead wire is soldered.

  The present invention solves such a problem, can eliminate a decrease in soldering strength between the chip capacitor and the substrate and a defective soldering, and can stably obtain a high soldering strength. Is intended to provide.

In order to solve the above-mentioned problem, the invention according to claim 1 of the present invention provides:
A capacitor body is housed inside a bottomed cylindrical outer case, the opening of the outer case is sealed by a sealing member, and a capacitor main body having a plurality of lead wires led out from the capacitor element and penetrating the sealing member; In an insulating member attached to the lead-out side of the lead wire and having a concave portion for accommodating the lead wire on a lower surface thereof, and a chip capacitor in which the lead wire is bent along the concave portion of the insulating member, the concave portion is bent. A chip capacitor in which an auxiliary member is inserted between the lead wire housed in the insulating member and the recess of the insulating member, the auxiliary member is held by the lead wire, and a desired planar state is formed on the lower surface of the insulating member It is what.

  With this configuration, the auxiliary member is inserted between the bent lead wire and the recessed portion, and the lead wire is bent to the lower surface side of the insulating member to hold the auxiliary member by the lead wire, thereby bending the lead wire. Is corrected to a desired angle substantially parallel to the lower surface portion of the insulating member, and a desired planar state can be formed by the lead wire and the lower surface portion of the insulating member. The attachment strength can be obtained stably.

  According to a second aspect of the present invention, in the first aspect of the invention, the desired flat state is formed by a bent lead wire and a lower surface portion of the insulating member to form substantially the same plane. The chip capacitor is characterized by the above.

  As a result, when soldering the chip capacitor to the substrate, the chip capacitor is inclined and bonded to the substrate, or the chip capacitor is bonded to the substrate with a part of the insulating member floating. Therefore, the chip capacitor can be soldered on the substrate more stably.

  Furthermore, a third aspect of the present invention is the chip capacitor according to the first or second aspect of the present invention, wherein the auxiliary member has a wedge-shaped cross section.

  As a result, since the tip of the auxiliary member becomes acute, the auxiliary member can be easily inserted between the bottom surface of the recess and the bent lead wire, and the effect of significantly improving productivity can be obtained.

  According to a fourth aspect of the present invention, there is provided the chip capacitor according to the first to third aspects, wherein the auxiliary member is made of a solderable metal member.

  As a result, when the chip type capacitor is soldered to the substrate, the auxiliary member is soldered to the substrate together with the lead wires. Therefore, after the chip type capacitor and the substrate are soldered, the auxiliary member is peeled off from the solder. Since it does not fall off, the bonding strength between the chip-type capacitor and the substrate is stabilized, and an effect that a more reliable chip-type capacitor can be obtained.

  Furthermore, the invention according to claim 5 is that a capacitor element is housed in a bottomed cylindrical outer case, the opening of the outer case is sealed by a sealing member, and the lead is led out from the capacitor element and penetrates the sealing member. A capacitor body having a plurality of lead wires, an insulating member attached to the lead wire lead-out side and having a concave portion for accommodating the lead wire on a lower surface thereof, and the lead wire bent along the concave portion of the insulating member In the manufactured chip capacitor manufacturing method, after the lead wire is bent and stored in the recess, an auxiliary member is inserted between the lead wire and the recess of the insulating member to push the lead wire to a desired angle. In this method, the auxiliary member is held by the lead wire, and a desired planar state is formed on the lower surface of the insulating member.

  As a result, the bending angle of the lead wire with variation is controlled and fixed to a desired angle at which the lead wire and the lower surface portion of the insulating member are substantially parallel, so that the lower surface portion of the insulating member is in close contact with the substrate. Thus, since the chip capacitor and the substrate can be soldered, high soldering strength can be stably maintained.

  In the present invention, the auxiliary member is inserted and held between the bent lead wire and the bottom surface of the recessed portion of the insulating member, whereby the bending angle of the lead wire is corrected to a desired angle so that the lead wire is insulated from the lead wire. Since the lower surface of the member can form a desired flat state, the chip capacitor and the substrate can be stably bonded with high soldering strength, and high reliability that can prevent soldering failure. It is possible to provide a chip type capacitor.

  In addition, when bonded to the substrate in a desired flat state formed on the lower surface portion of the insulating member according to the present invention, since there is no gap between the chip capacitor and the substrate, the chip capacitor is particularly vibrated. In this case, since it becomes possible to suppress the oscillation and abnormal vibration of the chip type capacitor, there is an effect that it is possible to provide a highly reliable and long-life type chip capacitor.

  Hereinafter, embodiments of the invention will be described with reference to the drawings.

FIG. 1 is a front cross-sectional view of the chip-type capacitor of the first embodiment, and FIG. 2 is a half cross-sectional front view showing a state where the lead wire in the first embodiment is bent acutely in a recess. (C) is a cross-sectional view showing an example of the shape of the auxiliary member disposed in the recess of the insulating member.
Example 1
The chip type capacitor of Example 1 has a cross-sectional shape as shown in FIG. 1 and is led out through a sealing member 5 that seals an opening of an aluminum outer case 9 that houses a capacitor element 4 therein. The capacitor body 2 having the lead wires 3a and 3b thus formed, and the insulating member 6 disposed so that the upper surface is in contact with the sealing end surface of the capacitor body 2 from which the lead wires 3a and 3b are led out. Yes.

  Capacitor element 4 is formed by winding a separator foil between an anode foil made of valve metal such as aluminum and a cathode foil, wound and impregnated with an electrolytic solution, or a solid polymer conductive material as an electrolyte. A solid electrolytic capacitor element or the like in which a conductive polymer is formed between an anode foil and a cathode foil made of a valve metal such as aluminum can be used.

  As shown in FIG. 1, the insulating member 6 is made of a resin having a predetermined thickness and having electrical insulation, and is formed by injection molding in which molding is performed by discharging resin fluidized by heating into a mold. ing. The insulating member 6 is provided with recesses 7a and 7b on the lower surface (upper surface in the drawing) for storing a pair of lead wires 3a and 3b led out from the capacitor element.

  In addition, although the shape of the insulating member of the present embodiment is a flat plate, it may be an insulating member having a support wall for supporting the capacitor side surface as a countermeasure against vibration.

  In this embodiment, the insulating member 6 is made of polyphenylene sulfide (PPS) having heat resistance and electrical insulation capable of withstanding heating during soldering during mounting. However, the present invention is not limited to this. Inorganic materials such as ceramics and glass, and composites of these materials may be used, as long as they have sufficient insulation properties and heat resistance that can withstand heating during soldering. be able to.

  Here, the attachment of the lead wire to the insulating member will be described in detail.

  First, as shown in FIG. 2, the lead wires 3 a and 3 b are led out to the lower surface side of the insulating member 6 through the insulating member 6, and along the recesses 7 a and 7 b formed on the lower surface portion of the insulating member 6. It can be bent. The lead wires 3a and 3b are bent so that the leading ends of the lead wires 3a and 3b are in contact with the bottom surfaces of the recesses 7a and 7b so that the bent lead wire 10 has an acute angle of less than 90 degrees. . In this case, if the lead wires 3a and 3b are bent not from the peripheral portion of the through hole 11 of the insulating member 6 but from a remote position, the bending angle 10 of the lead wire tends to be an acute angle. In addition, it is preferable that the bending angle 10 of the lead wire be bent more acutely so that the bending angle 10 can maintain an acute state even when the lead wire returns due to a springback phenomenon.

  Further, the depth of the recesses 7a and 7b is such that even when the lead wires 3a and 3b are bent acutely away from the through hole 11, a part of the bent lead wire protrudes from the lower surface side of the insulating member 6. It is preferable to have such a depth.

  The lead wires 3a and 3b are bent after being bent so that their tip ends reach the side surface of the insulating member 6, or are bent at the side surface of the insulating member 6 after being bent. The

  In addition, the cross-sectional shape of the lead wire used here may be either a circular shape or a flat plate shape, and is not particularly limited.

  As shown in FIG. 1, the auxiliary members 8a and 8b are inserted so as to spread the lead wires 3a and 3b between the bottom surfaces of the recesses 7a and 7b of the insulating member 6 and the bent lead wires 3a and 3b, respectively. Being held. As a result, the auxiliary members 8a and 8b are urged and held on the bottom surfaces of the recesses 7a and 7b by the spring elasticity of the bent lead wires 3a and 3b.

  Further, in order to insert the auxiliary members 8a and 8b so that the bent lead wires 3a and 3b are substantially parallel to the lower surface portion of the insulating member 6, the insertion positions of the auxiliary members 8a and 8b and the auxiliary members 8a and 8b By adjusting the height, the bent lead wires 3a and 3b are parallel to the lower surface portion of the insulating member, so that substantially the same planar state can be formed.

  More specifically, by adjusting the insertion position and height of the auxiliary member according to the state of the lead wire when there is variation in the depth of the concave portion of the insulating member, the bent height or bending of the lead wire, Since the bending angle and height of the lead wire can be matched to the lower surface portion of the insulating member, a desired planar state can be more reliably formed.

  With these configurations, the lead wires 3a and 3b form a desired planar state with the lower surface portion of the insulating member 6, so that the chip capacitor is bonded to the substrate in a tilted state or with a part of the insulating member floating. Therefore, it is possible to provide a highly reliable chip capacitor in which high soldering strength can be stably obtained.

  3A to 3C show some typical examples that can be considered as the cross-sectional shape of the auxiliary member 8 disposed in the concave portion 7 of the insulating member 6 in this embodiment.

  FIG. 3A shows a shape in which a tapered portion 12 is provided on a part of the upper surface of the auxiliary member 8c. As a result, the workability of inserting the auxiliary member 8c between the lead wire and the bottom surface of the recess can be improved, and the auxiliary member 8c is inserted by the flat portion 13 so that the lead wire is inserted into the insulating member. It can be parallel to the lower surface.

  The width of the auxiliary member 8c is not particularly limited as long as it has a width that is slightly narrower than the width of the concave portion of the insulating member and can be easily inserted into the concave portion and is held between the lead wires in the concave portion. Further, regarding the height of the auxiliary member 8c, when the auxiliary member 8c is inserted between the lead wire and the bottom surface of the recess, the bent lead wire is parallel to the lower surface of the insulating member, and is substantially in the same plane state. The height to form is suitable.

  FIG. 3B shows a shape in which the curved surface shape portion 14 is provided on the upper surface of the auxiliary member 8d. Accordingly, the auxiliary member 8d can be inserted into the recess between the lead wire and the recess more smoothly.

  In addition, although the taper part 12 or the curved-surface-shaped part 14 is provided in the upper surface side of auxiliary member 8c, 8d, when inserting auxiliary member 8c or 8d between a lead wire and the bottom face of a recessed part, any surface is provided. There is no particular limitation as to whether the bottom surface side of the concave portion is selected, and it is preferable to select one depending on the bending condition of the lead wire holding the auxiliary member.

  FIG.3 (c) shows the shape which formed the double-sided taper part 15 in the one end of the auxiliary member 8e. This makes it possible to easily insert the auxiliary member 8e between the lead wire and the bottom surface of the recess without selecting the upper and lower surfaces of the auxiliary member 8e, thereby improving the workability of inserting the auxiliary member 8e. To do.

  As described above, the shape of the auxiliary member can be variously considered, and any shape of the bent lead wires 3a and 3b and the bottom surfaces of the recesses 7a and 7b of the insulating member 6 is the basic concept of the present invention. By inserting and holding the auxiliary member between them, the lead wires 3a and 3b and the lower surface portion of the insulating member form a desired planar state, thereby bonding the chip capacitor and the substrate with stable soldering. It is possible to achieve the effects of the present invention.

  Although the embodiments of the present invention have been described with reference to the drawings, the specific configuration is not limited to these embodiments, and modifications and additions within the scope of the present invention are included in the present invention. It is.

  For example, in this embodiment, the auxiliary member is held between the bottom surface of the concave portion of the insulating member and the lead wire by the spring elasticity of the lead wire, but in order to prevent the inserted auxiliary member from falling off later. In addition, the auxiliary member may be bonded to the bottom surface of the recess of the insulating member.

It is front sectional drawing of the chip type capacitor in the Example of this invention. It is a half cross-sectional front view which shows the state which bent the lead wire in the recessed part acutely in the Example of this invention. (A)-(c) It is sectional drawing which showed the example of the shape of the auxiliary member in Example 1 of this invention. It is a half cross-sectional front view which shows the floating state of the lead wire in the conventional chip type capacitor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip-type capacitor 2 Capacitor main body 3a, 3b Lead wire 4 Capacitor element 5 Sealing member 6 Insulating member 7a, 7b Recessed part
8a, 8b, 8c, 8d, 8e Auxiliary member 9 Case 10 Bending angle 11 Through hole 12 Tapered portion 13 Flat portion 14 Curved shape portion 15 Double-side tapered portion

Claims (5)

A capacitor body is housed inside a bottomed cylindrical outer case, the opening of the outer case is sealed with a sealing member, and a capacitor body having a plurality of lead wires led out from the capacitor element and penetrating the sealing member;
An insulating member attached to the lead-out side of the lead wire, and having a concave portion for housing the lead wire on the lower surface thereof;
In the chip capacitor in which the lead wire is bent along the concave portion of the insulating member,
An auxiliary member is inserted between the lead wire bent and housed in the concave portion and the concave portion of the insulating member, and the auxiliary member is held by the lead wire,
A chip capacitor in which a desired planar state is formed on the lower surface of the insulating member.   2. The chip capacitor according to claim 1, wherein in the desired planar state, the bent lead wire and the lower surface portion of the insulating member form substantially the same plane.   The chip type capacitor according to claim 1, wherein a cross section of the auxiliary member has a wedge shape.   4. The chip capacitor according to claim 1, wherein the auxiliary member is made of a solderable metal member. A capacitor body is housed inside a bottomed cylindrical outer case, the opening of the outer case is sealed with a sealing member, and a capacitor body having a plurality of lead wires led out from the capacitor element and penetrating the sealing member;
An insulating member attached to the lead-out side of the lead wire, and having a concave portion for housing the lead wire on the lower surface thereof;
In the method of manufacturing a chip capacitor in which the lead wire is bent along the concave portion of the insulating member,
After bending the lead wire and storing it in the recess,
By inserting an auxiliary member between the lead wire and the recess of the insulating member,
While spreading the lead wire to a desired angle and holding the auxiliary member with the lead wire,
A method for manufacturing a chip capacitor in which a desired planar state is formed on the lower surface of the insulating member.