JP2008248272A - Plating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plating apparatus capable of expelling bubbles present inside a container to the outside of the container. <P>SOLUTION: The container 3 has a plating solution passing holes 321 in the lower side and a mesh member 31 in the upper side and is dipped into a plating solution 11. Materials 51 to be plated are housed in the container 3. A flowing means 71 forms a plating solution stream F2 flowing from the plating solution passing holes 321 to the mesh member 31 in the container 3. Media 52 is housed in the container 3 and has a specific gravity higher than that of the plating solution 11 and lower than that of the materials 51 to be plated. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a plating apparatus.

  As an apparatus for plating electronic components such as chip capacitors, a barrel container having a mesh structure was filled with electronic parts as plating objects and a current-carrying medium, and the barrel container was immersed in a plating solution. A barrel plating apparatus that performs plating while rotating in a state is known. In such a barrel apparatus, bubbles are generated inside the barrel container as the plating proceeds. If air bubbles in the barrel container are left, there is a problem that the air bubbles adhere to the electrode portions of the electronic components and the formation of the plating film is hindered. In addition, there is a problem that the electronic component adheres to the inner surface of the barrel container through bubbles and plating is not performed. In particular, in recent years, the mesh of the barrel container has become finer in accordance with the miniaturization of electronic components, so it has become increasingly difficult to expel bubbles.

  As means for solving these problems, Patent Document 1 provides a pair of sieve members on the upper and lower sides of a pod, and plating is performed from one sieve member in a state where the pod is disposed inside the plating tank. A technique of causing the liquid to flow out is disclosed. When the plating solution is caused to flow out of the sieve member, a plating solution flow is generated inside the pod, and it is considered that bubbles existing in the vicinity of the object to be plated are removed by this plating solution flow.

  However, in the invention described in Patent Document 1, it has been found that bubbles tend to accumulate on the sieve member provided on the upper side of the pod, and the bubbles cannot be completely removed.

Patent Document 2 discloses a technique in which air bubbles accumulated inside a barrel container are sucked and discharged to the outside of the barrel container by a suction pipe that connects the inside and outside of the barrel container. However, if a lot of minute bubbles generated as the electronic components are miniaturized adhere to the inside of the barrel container, it is difficult to remove even if the plating solution flows in the suction pipe. Further, in the suction using the suction pipe, only the bubbles existing at a specific position inside the barrel container can be removed.
JP 2007-56361 A JP 2005-325405 A

  The subject of this invention is providing the plating apparatus which can drive out the bubble which exists in the inside of a container to the exterior of a container.

  In order to solve the above-described problems, a plating apparatus according to the present invention includes a container, an object to be plated, a flow means, and a medium.

  The container has a plating solution circulation hole on the lower side, a mesh member on the upper side, and is immersed in the plating solution. The flow means generates at least a plating solution flow from the plating solution circulation hole to the mesh member inside the container. The object to be plated and the medium are accommodated in the container. The media has a specific gravity greater than the specific gravity of the plating solution and smaller than the specific gravity of the object to be plated.

  In the above-described plating apparatus according to the present invention, since the container is immersed in the plating solution and the object to be plated is accommodated inside the container, the basic action of plating the object to be plated inside the container is performed. Obtainable.

  Further, since the flow means generates a plating solution flow from the plating solution flow hole to the mesh member inside the container, the plating solution is swollen by the plating solution flow, and air bubbles in the vicinity of the plating object are swept away, Air bubbles can be removed from the object to be plated.

  However, even if the air bubbles are removed from the object to be plated, the air bubbles are still inside the container. Inside the container, the bubble rises due to its own buoyancy and therefore tends to accumulate on the mesh member provided on the upper side of the container.

  Therefore, in the present invention, bubbles are driven out of the container using a medium. That is, the medium is accommodated in the container, and the specific gravity of the medium is larger than the specific gravity of the plating solution and smaller than the specific gravity of the object to be plated. According to such a configuration, when the flow means is driven to generate a plating solution flow from the plating solution flow hole to the mesh member inside the container, the medium is moved ahead of the object to be plated by the plating solution flow. It can be raised and made to collide with the mesh member. By causing the medium to collide with the mesh member in this way, the bubbles attached to the mesh member can be driven out of the container.

  Moreover, the plating solution reaches the mesh member before the object reaches the mesh member by interposing the medium between the object to be plated and the mesh member by causing the medium to rise before the object to be plated. It is possible to prevent the object to be plated from directly colliding with the mesh member by weakening or stopping the flow. Therefore, there is no possibility that the object to be plated is damaged by the collision with the mesh member.

  As described above, according to the present invention, it is possible to provide a plating apparatus that can expel bubbles existing inside a container to the outside of the container.

  FIG. 1 is a sectional view showing an embodiment of a plating apparatus according to the present invention. The illustrated plating apparatus includes a plating tank 1, a container 3, a flow means 71, an object to be plated 51, and a medium 52.

  The plating tank 1 plays a role of storing the plating solution 11. The plating tank 1 is a bottomed container that is formed in a rectangular parallelepiped shape by an insulating material such as a resin and has an open top. The interior of the plating tank 1 is filled with a plating solution 11. Furthermore, a rod-like cathode 22 is provided so as to penetrate the bottom of the plating tank 1.

  An anode 21 is provided at a portion where the cathode 22 extends from the bottom of the plating tank 1. The anode 21 is a ring-shaped electrode having a hole 210, and is provided in such a manner that the cathode 22 penetrates the hole 210. A voltage is applied to the cathode 22 and the anode 21 by DC voltage applying means (DC power supply or rectifier) (not shown).

  The container 3 is disposed inside the plating tank 1 while being immersed in the plating solution 11. The container 3 plays a role of accommodating the workpiece 51 and the medium 52. The container 3 is a cylindrical body extending in the vertical direction so that the flow of the plating solution 11 is easily generated therein, and a plating solution circulation hole 321 is provided on the lower side of the container 3. A mesh member 31 is provided on the upper side. In the case of the illustrated embodiment, the plating solution flow hole 321 is configured by a mesh of mesh members 32 provided on the lower side of the container 3. The container 3 is fixed to the cathode 22 via a mesh member 32 inside the plating tank 1.

  The mesh members 31 and 32 provided on the upper side and the lower side of the container 3 are configured so that the workpiece 51 and the medium 52 do not substantially pass through the mesh. For example, the mesh of the mesh members 31 and 32 is configured to be smaller than the individual objects to be plated 51 and the media 52, or the objects to be plated 51 and the media 52 cannot be passed by stacking a plurality of meshes. Also good. In addition, as the mesh members 31 and 32, members that perform the same function by forming fine holes in a sheet-like member or a plate-like member by laser processing or the like may be used.

  The flow means 71 plays a role in causing the flow of the plating solution 11 from the plating solution circulation hole 321 to the mesh member 31 inside the container 3, and the plating solution 11 from the mesh member 31 to the plating solution circulation hole 321. Play a role in creating the flow of

  In the case of the illustrated embodiment, in order to play the above two roles, the flow means 71 is composed of a cylinder that can accommodate the container 3 therein. The shape of the cylinder is not limited to the cylindrical shape, and can be arbitrarily changed according to the shape of the container 3. The flow means 71 formed of a cylinder has an upper end closed and a lower end opened, and the lower end is immersed in the plating solution 11 inside the plating tank 1. The inside of the flow means 71 is filled with the plating solution 11 to such an extent that the container 3 can be immersed in the plating solution 11.

  The flow means 71 formed of a cylinder can be raised or lowered by a vertical movement means (not shown). As will be described later, the flow of the plating solution 11 extending from the plating solution circulation hole 321 to the mesh member 31 inside the container 3 by fixing the container 3 at a fixed position and raising or lowering the flow means 71. Alternatively, the flow of the plating solution 11 from the mesh member 31 to the plating solution circulation hole 321 can be generated.

  The to-be-plated object 51 is an object for forming a plating film, and a chip-shaped electronic component such as a chip capacitor, a chip varistor, a chip inductor, or a chip bead can be used.

  An important feature of the plating apparatus according to the present invention is that the medium 52 is accommodated in the container 1 together with the object 51, the specific gravity Wc of the medium 52 is larger than the specific gravity Wa of the plating solution 11, and This is because the specific gravity Wb of the object 51 is set to be smaller.

  The specific gravity Wb of the object to be plated 51 is not determined only when the object to be plated 51 is made of a single type of object to be plated having the same specific gravity. Even if it consists of materials, it can be defined as an apparent specific gravity when the object 51 is viewed as an aggregate. Similarly, the specific gravity Wc of the medium 52 can also be determined as an apparent specific gravity when the medium 52 is viewed as an aggregate, even if the medium 52 is composed of a plurality of types of materials having different specific gravities.

  In addition, the shape of the medium 52 may be any shape as long as the collision force can be exerted on the mesh member 31 by causing the medium 52 to collide with the mesh member 31 inside the container 3. Can do. In the illustrated embodiment, the shape of the medium 52 is a sphere that is slightly smaller than the dimension of the object 51 to be plated.

  In barrel plating, the media is generally considered as mediating electrical conductivity between objects to be plated. In the present invention, the term “media” may include the above-mentioned original meaning, but is not necessarily limited to such meaning, and is made of an electrical insulator, and conducts electricity between objects to be plated. It does not have to mediate sex.

  Next, a plating method using the plating apparatus of FIG. 1 will be described based on FIGS. This plating method includes the steps shown in FIG. 2 and the steps shown in FIG.

  First, in the step shown in FIG. 2, no voltage is applied to the anode 21 and the cathode 22, and no current is supplied to the object to be plated 51. When the flow means 71 formed of a cylinder is raised as shown by an arrow A1, a negative pressure P2 that raises the plating solution 11 is generated inside the flow means 71. For this reason, the plating solution 11 flows from the lower end of the flow means 71 into the flow means 71 as indicated by the arrow F1, so that the plating from the plating solution flow hole 321 to the mesh member 31 is formed inside the container 3. A liquid flow F2 is generated. With this plating solution flow F2, the workpiece 51 is lifted as indicated by the arrow A2, and the bubbles 53 in the vicinity of the workpiece 51 can be swept away to remove the bubbles 53 from the workpiece 51.

  However, even if the bubbles 53 are removed from the object to be plated 51, the bubbles 53 still remain inside the container 3. Inside the container 3, the bubble 53 rises due to its own buoyancy, and therefore tends to accumulate on the mesh member 31 provided on the upper side of the container 3 (see FIG. 2). Although there are bubbles 53 that are discharged from the container 3 to the outside by the plating solution flow F2, it is difficult to discharge all the bubbles 53 only by the plating solution flow F2 when the object to be plated 51 is small and the opening of the mesh member becomes small. is there.

  Solving this problem is a central problem of the present invention. As a problem attaining means, in the plating apparatus according to the present invention, as described with reference to FIG. The medium 52 is accommodated together with the object 51, and the specific gravity of the medium 52 is set larger than the specific gravity of the plating solution 11 and smaller than the specific gravity of the object 51 to be plated.

  According to such a configuration, as shown in FIG. 2, the medium 52 is swollen ahead of the object to be plated 51 as shown by an arrow A3 by the plating solution flow F2 from the plating solution flow hole 321 to the mesh member 31. The mesh member 31 can be made to collide. By causing the medium 52 to collide with the mesh member 31 in this manner, the bubbles 53 attached to the mesh member 31, in particular, the minute bubbles 53 attached to the mesh member 31 can be driven out. The bubble 53 expelled from the container 3 receives its own buoyancy, moves further upward, and moves away from the container 3 as indicated by an arrow A4.

  Moreover, as shown by the arrow A3, the medium 52 is interposed between the object 51 and the mesh member 31 by causing the medium 52 to rise before the object 51, so that the object 51 is directly connected to the object 51. The collision with the mesh member 31 can be prevented. Therefore, even if the plating solution flow F2 extending from the plating solution circulation hole 321 to the mesh member 31 is strong, the object to be plated 51 is not likely to be damaged by the collision with the mesh member 31, so the strong plating solution flow F2 Sufficient collision energy can be given to the medium 52 and the bubbles 53 can be reliably removed from the container 3. Alternatively, the fluid 52 is stopped before the workpiece 51 reaches the mesh member 31, and the flow of the plating solution 11 reaching the mesh member 31 is weakened or stopped. Although the mesh member 31 collides with the mesh member 31 and eliminates the bubbles 53 from the container 3, the object to be plated 51 can be prevented from contacting the mesh member 31.

  After the soaring step shown in FIG. 2, the sedimentation step shown in FIG. 3 is performed. In the settling step shown in FIG. 3, when the flow means 71 formed of a cylinder is lowered as indicated by an arrow A <b> 5, a positive pressure P <b> 2 that pushes the plating solution 11 is generated inside the flow means 71. For this reason, since the plating solution 11 flows into the container 3 through the mesh member 31 as indicated by an arrow F3, the plating solution that reaches from the mesh member 31 to the plating solution circulation hole 321 inside the container 3. A flow F4 is generated. The plating solution flow F4 allows the object 51 and the medium 52 to settle down as indicated by arrows A6 and A7 and be deposited on the mesh member 32 provided on the lower side of the container 3. In this state, a predetermined voltage is applied to the anode 21 and the cathode 22, and the plating object 51 is energized from the cathode 22 to perform the plating process.

  In the present invention, as described above, the specific gravity of the medium 52 is set smaller than the specific gravity of the workpiece 51. In other words, the specific gravity of the workpiece 51 is larger than the specific gravity of the media 52. According to such a configuration, as shown by the arrow A <b> 6, the workpiece 51 can be deposited in a state separated from the media 52 by allowing the workpiece 51 to settle before the media 52. Therefore, the current to be plated 51 can be efficiently conducted. Since the medium 52 is deposited on the object to be plated 51 in a state separated from the object to be plated 51, energization is not hindered.

  Thereafter, by repeating the cycle including the soaring step shown in FIG. 2 and the sedimentation step shown in FIG. 3, plating is repeated to grow a plating film on the object 51 to be plated.

  In addition, the specific gravity of the medium 52 is set to be smaller than the specific gravity of the workpiece 51. In the sedimentation step shown in FIG. 3, the media 52 is settled in the plating solution 11 to obtain collision energy. It is also useful for earning the necessary travel distance. That is, in the settling step shown in FIG. 3, the medium 52 can be settling down by a sufficient moving distance, and as a result, the medium 52 is set up by a sufficient moving distance in the raising step shown in FIG. Thus, sufficient collision energy can be given to the mesh member 31. Sufficient collision energy helps to expel bubbles attached to the mesh member 31 to the outside of the container 3.

  Next, referring to Table 1 below, the preferred range of specific gravity for the object to be plated and the media will be described.

  Table 1 shows the specific gravity of the plating solution, the object to be plated, and the medium, and the ratio based on the specific gravity of the plating solution.

  First, the specific gravity of the object to be plated was examined from the viewpoint of the raising step shown in FIG. 2, and the specific gravity of the object to be plated was set in the range of 2.6 times to 4.3 times the specific gravity of the plating solution. It turned out to be preferable. If the specific gravity of the object to be plated exceeds 4.3 times the specific gravity of the plating solution, the object to be plated may not be sufficiently lifted by the plating solution flow. Further, if the specific gravity of the object to be plated is less than 2.6 times the specific gravity of the plating solution, there is a possibility that the object to be plated will adhere to the mesh member through bubbles.

  Next, even when the specific gravity of the object to be plated was examined from the viewpoint of the sedimentation step shown in FIG. 3, it was found that the specific gravity of the object to be plated was preferably set in the above range. When the specific gravity of the object to be plated exceeds 4.3 times the specific gravity of the plating solution, the object to be plated is allowed to settle and deposit, and then the object to be plated is lifted again in the raising step shown in FIG. It can be difficult. Moreover, when the specific gravity of a to-be-plated object is less than 2.6 times the specific gravity of a plating solution, sedimentation of a to-be-plated object may become slow and may be after a medium.

  Next, when the specific gravity of the media was examined from the viewpoint of the raising step shown in FIG. 2, it is preferable to set the specific gravity of the media within a range of 1.1 to 2.5 times the specific gravity of the plating solution. I understood. When the specific gravity of the media exceeds 2.5 times the specific gravity of the plating solution, it is slow to soar the media and may be behind the object to be plated. Also, if the specific gravity of the media is less than 1.1 times the specific gravity of the plating solution, even if the raised media collides with the mesh member, the mass is small, so bubbles adhering to the mesh member are discharged out of the container. Therefore, there is a possibility that the necessary collision energy cannot be given.

  Finally, even if the specific gravity of the media is examined from the viewpoint of the sedimentation step shown in FIG. 3, it has been found that the specific gravity of the media is preferably set in the above range. If the specific gravity of the media exceeds 2.5 times the specific gravity of the plating solution, the media will settle quickly and may be the tip of the object to be plated. Moreover, if the specific gravity of the media is less than 1.1 times the specific gravity of the plating solution, the media cannot be sufficiently settled, and the travel distance of the media necessary for obtaining collision energy can be increased. It may not be possible.

  Next, the material for composing the medium will be described. The medium is preferably composed of an electrically insulating material. If the medium is made of an electrically insulating material, the plating film can be prevented from adhering to the medium even when plating is repeated, and the specific gravity of the medium can be prevented from increasing. Therefore, the relationship that the specific gravity of the media is smaller than the specific gravity of the object to be plated can be maintained even while the plating is repeated, so that air bubbles can be reliably excluded outside the container.

  Further, if the medium is made of an electrically insulating material, the medium is not energized, so the efficiency of energizing the object to be plated is improved. Thereby, the film thickness of the plating film adhering to a to-be-plated object can be increased.

  Examples of the electrical insulating material for constituting the medium include glass, vinyl chloride, and tetrafluoroethylene resin (PTFE). According to these materials, it is easy to set the specific gravity of the medium in the above-described preferable range, that is, in the range of 1.1 to 2.5 times the specific gravity of the plating solution. Furthermore, it is possible to adjust the apparent specific gravity of the medium to a preferable value by changing the size of the cavity containing the gas with a hollow structure of the medium.

  FIG. 4 is a sectional view showing another embodiment of the plating apparatus according to the present invention. In the drawing, the same reference numerals are assigned to the same components as those shown in FIG. 1, and the description thereof may be omitted. In the plating apparatus shown in FIG. 4, the container 3 is accommodated in the cylinder 72 and fixed at a fixed position via the cathode 22, as in the plating apparatus shown in FIG. 1. .

  In contrast to the plating apparatus shown in FIG. 1, in the plating apparatus shown in FIG. 4, the flow means (73, 74) includes the first flow means 73 and the first flow means 74. ing. The first flow means 73 plays a role of generating a plating solution flow from the plating solution circulation hole 321 to the mesh member 31 inside the container 3. In order to play the role, the illustrated first flow means 73 includes a pipe line 41 and a pump 42 provided in the pipe line 41. The pipe line 41 connects the cylinder 72 and the plating tank 11, one end 411 of the pipe line 41 is disposed inside the cylinder 72 and above the mesh member 31 of the container 3, and the other end 412 is It is arranged inside the plating tank 1 and outside the cylinder 72.

  The second flow means 74 plays a role of generating a plating solution flow from the mesh member 31 to the plating solution circulation hole 321 inside the container 3. The second flow means 74 is the same as the first flow means 73 in that the second flow means 74 includes the conduit 43 and the pump 44 provided in the conduit 43. Further, the pipe line 43 connects the cylinder 72 and the plating tank 11, and one end 431 of the pipe line 43 is disposed inside the cylinder 72 and above the mesh member 31 of the container 3, and the other end 432. However, it is the same in that it is arranged inside the plating tank 1 and outside the cylinder 72.

  In order to drive the first fluid means 73, the pump 42 may be operated so that the plating solution 11 flows in the direction of the arrow A6 through the conduit 41. As a result, the plating solution 11 is circulated from the cylinder 72 to the plating tank 1 via the pipe line 41, and a plating solution flow F <b> 2 from the plating solution flow hole 321 to the mesh member 31 is generated inside the container 3. Can be made.

  On the contrary, in order to drive the second fluid means 74, the pump 44 may be operated so that the plating solution 11 is circulated through the conduit 43 in the direction of arrow A7. As a result, the plating solution 11 is circulated from the plating tank 1 to the cylinder 72 via the pipe line 43 to generate a plating solution flow F4 from the mesh member 31 to the plating solution circulation hole 321 inside the container 3. Can be made.

  Even in the case where the plating apparatus of FIG. 4 is used, the plating solution flow F2 extending from the plating solution flow hole 321 to the mesh member 31 and the plating solution extending from the mesh member 31 to the plating solution flow hole 321 inside the container 3. Since the flow F4 can be generated, a plating method basically similar to the plating method described with reference to FIGS. 2 and 3 can be performed.

  FIG. 5 is a sectional view showing still another embodiment of the plating apparatus according to the present invention. In the drawing, the same reference numerals are assigned to the same components as those shown in FIG. 1, and the description thereof may be omitted. In the plating apparatus shown in FIG. 5, the container 3 is accommodated in the cylinder 72 and fixed at a fixed position via the cathode 22 as in the plating apparatus shown in FIG. 1. .

  In contrast to the plating apparatus shown in FIG. 1, in the plating apparatus shown in FIG. 5, the flow means 75 includes a pipe 45 and a screw 46. The pipe 45 connects the cylinder 72 and the plating tank 11. One end 451 of the pipe 45 is disposed inside the cylinder 72 and above the mesh member 31 of the container 3, and the other end 452 is It is arranged inside the plating tank 1 and outside the cylinder 72.

  Further, a shaft 461 is provided so as to penetrate the bottom of the plating tank 1, and the cathode 22 is provided at the tip of the shaft 461.

  The screw 46 is attached to the shaft 461 and is located inside the cylinder 72. The screw 46 is rotationally driven via the shaft 461.

  By rotating the screw 46 so that the plating solution 11 in the cylinder 71 flows upward, the plating solution 11 is sent from the cylinder 72 via the pipe 45 to the plating tank 1 as indicated by an arrow A8. The plating solution flow F <b> 2 extending from the plating solution circulation hole 321 to the mesh member 31 can be generated inside the container 3.

  Further, by rotating the screw 46 so that the plating solution 11 in the cylinder 71 flows downward, the plating solution 11 is transferred from the plating tank 1 to the cylinder 45 via the conduit 45 as indicated by an arrow A9. The plating solution flow F4 from the mesh member 31 to the plating solution circulation hole 321 can be generated inside the container 3.

  Even in the case of using the plating apparatus of FIG. 5, the plating solution flow F <b> 2 extending from the plating solution circulation hole 321 to the mesh member 31 and the plating solution extending from the mesh member 31 to the plating solution circulation hole 321 inside the container 3. Since the flow F4 can be generated, a plating method basically similar to the plating method described with reference to FIGS. 2 and 3 can be performed.

  In each of the above-described embodiments, the plating solution flow from the plating solution circulation hole 321 to the mesh member 31 or the mesh member 31 to the plating solution circulation hole 321 with the container 3 fixed at a certain position. However, the present invention is not limited to this. For example, even if the container 3 itself is raised or lowered in the stationary plating solution 11 without providing a cylinder, the plating solution flow from the plating solution circulation hole 321 to the mesh member 31 inside the vessel 3 or the mesh member Since a plating solution flow from 31 to the plating solution circulation hole 321 can be generated, the same effects as those of the plating method described with reference to FIGS. 2 and 3 can be obtained.

  Moreover, in each embodiment mentioned above, although the electroplating method is employ | adopted, this invention is not limited to an electroplating method, It is applicable also to the electroless-plating method.

  Although the contents of the present invention have been specifically described with reference to the preferred embodiments, various modifications can be made by those skilled in the art based on the basic technical idea and teachings of the present invention. It is self-explanatory.

It is sectional drawing which shows one Embodiment of the plating apparatus which concerns on this invention. It is a figure for demonstrating the plating method using the plating apparatus of FIG. It is another figure for demonstrating the plating method using the plating apparatus of FIG. It is sectional drawing which shows another embodiment of the plating apparatus which concerns on this invention. It is sectional drawing which shows another embodiment of the plating apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Plating tank 3 Container 11 Plating solution 51 To-be-plated object 52 Media 71 Flow means

Claims (5)

A plating apparatus including a container, a flow means, an object to be plated, and a medium,
The container has a plating solution circulation hole on the lower side, a mesh member on the upper side, and is immersed in the plating solution,
The flow means generates at least a plating solution flow from the plating solution circulation hole to the mesh member inside the container,
The object to be plated and the medium are accommodated in the container, and the medium has a specific gravity greater than the specific gravity of the plating solution and smaller than the specific gravity of the object to be plated.
Plating equipment. The plating apparatus according to claim 1,
The to-be-plated object has a specific gravity of 2.6 to 4.3 times the specific gravity of the plating solution,
The media has a specific gravity of 1.1 to 2.5 times the specific gravity of the plating solution.
Plating equipment.   The plating apparatus according to claim 1, wherein the medium is made of an electrical insulator.   4. The plating apparatus according to claim 1, wherein the flow means generates a plating solution flow from the mesh member to the plating solution flow hole inside the container. 5. . The plating apparatus according to claim 4, wherein
The flow means includes a first flow means and a second flow means,
The first flow means generates a plating solution flow from the plating solution circulation hole to the mesh member inside the container,
The second flow means generates a plating solution flow from the mesh member to the plating solution circulation hole inside the container.
Plating equipment.

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