JP2008240023A - Heating apparatus for vacuum deposition - Google Patents

Heating apparatus for vacuum deposition Download PDF

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JP2008240023A
JP2008240023A JP2007079088A JP2007079088A JP2008240023A JP 2008240023 A JP2008240023 A JP 2008240023A JP 2007079088 A JP2007079088 A JP 2007079088A JP 2007079088 A JP2007079088 A JP 2007079088A JP 2008240023 A JP2008240023 A JP 2008240023A
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vapor deposition
filament
deposition material
vacuum
heating apparatus
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JP4969281B2 (en
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Atsumi Tanaka
淳美 田中
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COSMO A KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a novel heating apparatus for vacuum deposition by which the treatability of a vapor deposition material is improved, and the contact state between a filament and the vapor deposition material is improved to perform a more suitable vapor deposition. <P>SOLUTION: The filament 1 for vacuum deposition is obtained by providing the upper part of a melting action part 22 with a mounting part 23 of a vapor deposition material W so as to be continuous to the longitudinal direction, and also the mounting part 23 has an introduction shape of the vapor deposition material W from the upper part. In addition, the vapor deposition material W has a bent shape so as to be mounted in a loosely engaged state to the filament 1 for vacuum deposition in the mounting part 23, the set of the vapor deposition material W to the filament 1 for vacuum deposition can be easily performed, and further, heat conduction from the melting action part 23 to the vapor deposition material W can be efficiently performed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、真空蒸着により樹脂製品、金属製品等に対し、アルミメッキ等を施すための真空蒸着用加熱装置に関するものである。   The present invention relates to a vacuum deposition heating apparatus for applying aluminum plating or the like to resin products, metal products, and the like by vacuum deposition.

真空チャンバの中に、被加工材と蒸着材たるアルミ片等とを収め、蒸着材を加熱蒸発させて被加工材にアルミ被覆を形成する真空蒸着の手法が広く行われている。このような過程においては、蒸着材のロスを少なく且つ高能率で被加工材へのメッキ等の薄膜形成ができるように種々の改良が試みられている。例えば従来アルミ等の蒸着材と、加熱用のフィラメントとの相互の形状を工夫して、効率的に蒸着材の溶解、蒸発が行われるようにしたものが知られている（例えば特許文献１参照。）。
特開２００１−２２０６６２ A vacuum deposition method is widely used in which a workpiece and an aluminum piece as a deposition material are housed in a vacuum chamber, and the deposition material is heated and evaporated to form an aluminum coating on the workpiece. In such a process, various improvements have been attempted so as to reduce the loss of the vapor deposition material and to form a thin film such as plating on the workpiece with high efficiency. For example, a conventional vapor deposition material such as aluminum and a heating filament are devised so that the vapor deposition material can be efficiently dissolved and evaporated (see, for example, Patent Document 1). .)
JP 2001-220660 A

本発明もこのような技術改良の一環としてなされたものであって、蒸着材の取り扱いやすさを向上させ、更にはフィラメントと蒸着材との接触状況を改善してより好適な蒸着ができるようにした新規な真空蒸着用加熱装置を案出することを技術課題としたものである。   The present invention was also made as part of such a technical improvement, so that the handling of the vapor deposition material is improved, and further, the contact state between the filament and the vapor deposition material is improved, so that more suitable vapor deposition can be performed. It is a technical problem to devise a novel heating apparatus for vacuum deposition.

すなわち請求項１記載の真空蒸着用加熱装置は、通電により加熱を受けるフィラメントに対して蒸着材を保持させ、この蒸着材を加熱蒸発させて被加工材に蒸着皮膜を形成する装置において、前記フィラメントは、溶融作用部の上方に長手方向に連続するように蒸着材の載置部を設けて成るものであり、且つこの載置部は上方からの蒸着材の導入形状を有するものであり、一方、前記蒸着材は載置部においてフィラメントに対し緩係合状態に載置されるような屈曲形状を有するものであることを特徴として成るものである。
この発明によれば、フィラメントに対する蒸着材のセットを容易に行うことができるとともに、溶融作用部から蒸着材への熱伝導を効率的に行うことが可能となる。 That is, the heating apparatus for vacuum vapor deposition according to claim 1 is an apparatus for holding a vapor deposition material on a filament that is heated by energization, and heating and evaporating the vapor deposition material to form a vapor deposition film on a workpiece. Is provided with a deposition material placing part so as to be continuous in the longitudinal direction above the melting action part, and this placing part has an introduction shape of the deposition material from above, The vapor deposition material has a bent shape so as to be placed in a loosely engaged state with respect to the filament in the placement portion.
According to the present invention, it is possible to easily set the vapor deposition material on the filament, and to efficiently conduct the heat conduction from the melting portion to the vapor deposition material.

また請求項２記載の真空蒸着用加熱装置は、前記要件に加え、前記フィラメントは、線材を複数本縒り合わせて構成されたものであることを特徴として成るものである。
この発明によれば、溶融した蒸発材を溶融作用部全域に行き渡らせることができ、蒸着材の蒸発を好適に行うことができる。 The heating apparatus for vacuum vapor deposition according to claim 2 is characterized in that, in addition to the above requirements, the filament is formed by winding a plurality of wires.
According to the present invention, the molten evaporating material can be spread over the entire melting portion, and the vapor deposition material can be suitably evaporated.

更にまた請求項３記載の真空蒸着用加熱装置は、前記要件に加え、前記フィラメントには、巻付線が装着されていることを特徴として成るものである。
この発明によれば、溶融した蒸着材をより円滑に溶融作用部全域に行き渡らせることができる。 Furthermore, in addition to the above requirements, the heating apparatus for vacuum vapor deposition according to claim 3 is characterized in that a winding wire is attached to the filament.
According to the present invention, the melted vapor deposition material can be more smoothly spread over the entire melting operation part.

更にまた請求項４記載の真空蒸着用加熱装置は、前記要件に加え、前記蒸着材は、螺旋形状であることを特徴として成るものである。
この発明によれば、溶融作用部と蒸発材との緩係合を確実に行わせることができる。 Furthermore, the heating apparatus for vacuum vapor deposition according to claim 4 is characterized in that, in addition to the above requirements, the vapor deposition material has a spiral shape.
According to this invention, the loose engagement between the melting portion and the evaporating material can be reliably performed.

更にまた請求項５記載の真空蒸着用加熱装置は、前記要件に加え、前記蒸着材は、線材を複数本縒り合わせて構成されたものであることを特徴として成るものである。
この発明によれば、蒸発材全体への熱伝導を促進して溶融を円滑に行うことができる。
そしてこれら各請求項記載の発明の構成を手段として前記課題の解決が図られる。 Furthermore, the heating apparatus for vacuum vapor deposition according to claim 5 is characterized in that, in addition to the above-mentioned requirements, the vapor deposition material is constituted by combining a plurality of wires.
According to the present invention, heat conduction to the entire evaporation material can be promoted and melting can be performed smoothly.
The above problems can be solved by using the configuration of the invention described in each of the claims as a means.

本発明によれば、蒸着材の取り扱いやすさを向上させ、更にはフィラメントと蒸着材との接触状況を改善してより好適な蒸着が可能となる。   According to the present invention, it is possible to improve the ease of handling of the vapor deposition material, and further improve the contact state between the filament and the vapor deposition material, thereby enabling more suitable vapor deposition.

以下、本発明を実施するための最良の形態について図示の実施例に基づいて説明する。なお以下の実施例に対して本発明の技術的思想の範囲内において適宜変更を加えることも可能である。   Hereinafter, the best mode for carrying out the present invention will be described based on the illustrated embodiments. It should be noted that the following embodiments can be appropriately modified within the scope of the technical idea of the present invention.

図中、符号１で示すものが真空蒸着用フィラメントであって、このものはタングステン等の線材を用いたフィラメント本体２と、その外側に巻き付けられる金属細線等を適用した巻付材３とを主要部材として構成される。この真空蒸着用フィラメント１は、図１に骨格的に示すような蒸着装置５内において真空蒸着用加熱装置の構成要素となるものである。そして真空蒸着用フィラメント１は真空環境下において通電加熱され、この真空蒸着用フィラメント１に保持された蒸着材Ｍが溶融・蒸発させられて、蒸着装置５内に配された被加工材Ｗの表面に蒸着することにより金属薄膜（メッキ）が形成されるものである。   In the figure, reference numeral 1 denotes a filament for vacuum vapor deposition, which mainly includes a filament body 2 using a wire material such as tungsten and a winding material 3 to which a thin metal wire or the like wound around the filament body 2 is applied. Configured as a member. The vacuum vapor deposition filament 1 is a constituent element of a vacuum vapor deposition heating device in a vapor deposition device 5 as shown in a skeleton form in FIG. The vacuum vapor deposition filament 1 is energized and heated in a vacuum environment, and the vapor deposition material M held in the vacuum vapor deposition filament 1 is melted and evaporated, so that the surface of the workpiece W disposed in the vapor deposition apparatus 5 is obtained. A metal thin film (plating) is formed by vapor deposition.

まず真空蒸着用フィラメント１の具体的な説明に先立ち、蒸着装置５の概略を説明する。この蒸着装置５は図１に示すように、ドラム状のチャンバ本体５０の内部を加工室５０Ａとし、そのほぼ中央に電極ロッド５１が立ち上がるように形成されている。そしてこの電極ロッド５１から上下に多数枝分かれするように一対のフィラメントホルダ５２を突出させ、そのフィラメントホルダ５２の先端に固定ネジ５３により真空蒸着用フィラメント１を固定することにより真空蒸着用加熱装置が構成される。
更にこのような多数取り付けられた真空蒸着用フィラメント１を囲むようにワークスタンド５５が複数組その周辺に設けられる。このワークスタンド５５は、詳細な説明は省略するが一例としてその基部はターンテーブル状の部材に支持され、真空蒸着用フィラメント１の周辺を回りながら、且つ遊星運動をするように構成される。このような動きによりワークスタンド５５に支持された被加工材Ｗは、真空蒸着用フィラメント１により溶解・蒸発させられた蒸着材Ｍを満遍なく受け入れることとなる。
なおチャンバ本体５０は、その外殻部材が単独で上昇したり、一部が分割・展開されることにより加工室５０Ａ内に位置する真空蒸着用フィラメント１及びワークスタンド５５が曝されるような構成が採られるものであり、これら真空蒸着用フィラメント１及びワークスタンド５５が適宜スライド自在に構成されることにより、蒸着材Ｍ及び被加工材Ｗのセットが行い易いように構成されている。 First, prior to specific description of the vacuum vapor deposition filament 1, an outline of the vapor deposition apparatus 5 will be described. As shown in FIG. 1, the vapor deposition apparatus 5 is formed such that the inside of a drum-shaped chamber main body 50 is a processing chamber 50A, and an electrode rod 51 rises at substantially the center thereof. Then, a pair of filament holders 52 are projected from the electrode rod 51 so as to be branched into a large number in the vertical direction, and the vacuum deposition filament 1 is fixed to the tip of the filament holder 52 by a fixing screw 53 to constitute a vacuum deposition heating apparatus. Is done.
Further, a plurality of sets of work stands 55 are provided around the vacuum deposition filaments 1 attached in large numbers. Although the detailed description is omitted, the base of the work stand 55 is supported by a turntable-like member as an example, and is configured to move around the periphery of the vacuum evaporation filament 1 and perform planetary motion. The workpiece W supported by the work stand 55 by such a movement will uniformly receive the vapor deposition material M dissolved and evaporated by the vacuum vapor deposition filament 1.
The chamber body 50 is configured such that the vacuum vapor deposition filament 1 and the work stand 55 located in the processing chamber 50A are exposed when the outer shell member rises alone or is partially divided and expanded. The vacuum vapor deposition filament 1 and the work stand 55 are appropriately slidably configured so that the vapor deposition material M and the workpiece W can be easily set.

続いて前記真空蒸着用フィラメント１について更に具体的に説明する。前記フィラメント本体２は、一例としてタングステン単線を複数本縒り合わせて構成されるものであって、その両端に例えばほぼ直線状の通電端２１が形成される。そしてこの通電端２１の間を三次元方向に展開させた溶融作用部２２とするものであって、一例として図２、３、４に示すように上方からの蒸発材Ｍの導入を許容するような導入形状を有するように形成される。
具体的には図６（ａ）に示すように、フィラメント本体２を形成する線材を、側面視でＶ字状になり、且つ全体が図４に示すように平面視でサインカーブ様になるように展開するように曲げ加工して溶融作用部２２を形成するものである。そして溶融作用部２２の上方空間を蒸着材Ｍの載置部２３とする。
なお前記フィラメント本体２そのものは縒り線を適用することに限定されず、金属単線によって構成してもよい。
更に前記溶融作用部２２にはコイル状の巻付材３（コイル状の巻付材３については特にこのものを示すときには符号３１で示す）を巻き付けるようにする。
なお溶融作用部２２と蒸着材Ｍとの接触状況を良好なものとするために、前記両通電端２１は図３（ａ）の側面図に示すように高さレベルを同じにして横に張り出すように構成されるものであり、且つ通電端２１の高さレベルが溶融作用部２２の下端部に位置するようになっていることが好ましい。 Next, the vacuum evaporation filament 1 will be described more specifically. As an example, the filament body 2 is formed by twisting a plurality of single tungsten wires, and substantially linear energization ends 21 are formed at both ends thereof, for example. And it is set as the fusion | melting action part 22 expand | deployed between this electricity supply end 21 in the three-dimensional direction, Comprising: As shown in FIG. It is formed to have a simple introduction shape.
Specifically, as shown in FIG. 6 (a), the wire forming the filament body 2 has a V-shape when viewed from the side, and the entire shape is like a sine curve when viewed in plan as shown in FIG. The melting action part 22 is formed by bending so as to expand to the center. The space above the melting portion 22 is used as a placement portion 23 for the vapor deposition material M.
The filament body 2 itself is not limited to the use of a twisted wire, and may be composed of a single metal wire.
Further, a coil-shaped winding material 3 (in particular, the coil-shaped winding material 3 is indicated by reference numeral 31 when this is shown) is wound around the melting portion 22.
In addition, in order to make the contact state of the fusion | melting action part 22 and the vapor deposition material M favorable, as shown in the side view of FIG. It is preferable that the height of the energization end 21 is positioned at the lower end of the melting portion 22.

このような形状の真空蒸着用フィラメント１に対しては図２（ｂ）、図３（ｂ）、図４（ｂ）に示すように、アルミ線等を一例として螺旋状に形成して構成された蒸着材Ｍが、載置部２３に緩係合状態に設置される。
この際、溶融作用部２２は上方からの蒸発材Ｍの導入を許容するような導入形状を有するように形成されているため、図６（ａ）に示すように側面視Ｖ字状に展開した溶融作用部２２の上面何れの部位に蒸発材Ｍが投入された場合であっても最下部に到達し、左右両側の溶融作用部２２と絡み合うように緩係合するため、確実に多大な接触面積が確保されることとなる。
このため、蒸発材Ｍの投入装置には、極端に高い精度は要求されない。また手作業で行う場合も過度の技量は必要とされない。 As shown in FIGS. 2 (b), 3 (b), and 4 (b), the vacuum evaporation filament 1 having such a shape is formed by spirally forming an aluminum wire or the like as an example. The deposited material M is placed on the placing portion 23 in a loosely engaged state.
At this time, the melting portion 22 is formed so as to have an introduction shape that allows the introduction of the evaporation material M from above, so that it is developed in a V shape as viewed from the side as shown in FIG. Even when the evaporating material M is put in any part of the upper surface of the melting action part 22, it reaches the lowermost part and loosely engages with the melting action parts 22 on both the left and right sides, so that a large amount of contact is ensured. An area will be secured.
For this reason, extremely high accuracy is not required for the charging device for the evaporation material M. In addition, excessive skill is not required when performing manually.

なお蒸発材Ｍは、細めの線材を複数本縒り合わせたものを螺旋形状に曲げ加工することにより各線材への熱伝導性を高め、蒸発材Ｍ全体への熱伝導を促進するようにしたが、蒸発材Ｍを単線を曲げ加工して形成するようにしてもよい。
また蒸発材Ｍの螺旋ピッチについては、図４（ｂ）に示すように溶融作用部２２のピッチの二倍 (整数倍）とすることにより、蒸発材Ｍと溶融作用部２２とが絡み合うように緩係合してこれらの接触面積をより広くすることができるが、図３（ａ）に示す蒸発材Ｍ１のように、異なったピッチとすることも可能である。
更にまた蒸発材Ｍの形状は、載置部２３においてフィラメント本体２に対し緩係合状態に載置されるような屈曲形状を有するものであればよいので、図５に示すように蒸発材Ｍの両端部を螺旋状とし、その間の部分を直線状としてもよく、更には螺旋ではなく同一面内で波型形状に屈曲したとしてもよい。 The evaporating material M is formed by bending a plurality of thin wire rods into a spiral shape, thereby increasing the thermal conductivity to each wire material and promoting the heat conduction to the entire evaporating material M. The evaporating material M may be formed by bending a single wire.
Further, the spiral pitch of the evaporating material M is set to be twice (integer multiple) the pitch of the melting action portion 22 as shown in FIG. 4B so that the evaporating material M and the melting action portion 22 are intertwined. These contact areas can be increased by loose engagement, but different pitches are possible as in the evaporating material M1 shown in FIG.
Furthermore, the shape of the evaporating material M may be any shape as long as it has a bent shape so as to be placed in a loosely engaged state with respect to the filament main body 2 in the placing portion 23. Both ends may be formed in a spiral shape, and a portion in between may be formed in a straight line shape, and may be bent in a corrugated shape in the same plane instead of a spiral.

本発明の真空蒸着用加熱装置は一例として上述したように構成されるものであり、蒸着を行うにあたっては、まずチャンバ本体５０を上昇させ、加工室５０Ａ内に位置する真空蒸着用フィラメント１及びワークスタンド５５をスライドさせて蒸着材Ｍ及び被加工材Ｗのセットを行う。
次いで真空蒸着用フィラメント１及びワークスタンド５５並びにチャンバ本体５０を元の位置に戻すこととなるが、この際、蒸着材Ｍは載置部２３において真空蒸着用フィラメント１に対し緩係合状態に載置されているため、移動時の振動等によって蒸着材Ｍが脱落してしまうことはない。
因みに図６（ｂ）に示すように蒸着材Ｍと真空蒸着用フィラメント１とが緩係合状態となっていない場合には、移動時の振動等によって蒸着材Ｍが脱落してしまうことがあった。 The heating apparatus for vacuum vapor deposition according to the present invention is configured as described above as an example. When performing vapor deposition, the chamber main body 50 is first lifted, and the vacuum vapor deposition filament 1 and the workpiece located in the processing chamber 50A. The vapor deposition material M and the workpiece W are set by sliding the stand 55.
Next, the vacuum deposition filament 1, the work stand 55, and the chamber body 50 are returned to their original positions. At this time, the deposition material M is placed in a loosely engaged state with respect to the vacuum deposition filament 1 in the mounting portion 23. Therefore, the vapor deposition material M does not fall off due to vibration during movement.
Incidentally, as shown in FIG. 6B, when the vapor deposition material M and the vacuum vapor deposition filament 1 are not loosely engaged, the vapor deposition material M may fall off due to vibration during movement. It was.

そして蒸着作用時においては、フィラメントホルダ５２からの通電を受けてフィラメント本体２が発熱し、載置部２３上に支持された蒸着材Ｍが効率的に溶融され、更に蒸発させられる。この際、溶融した蒸着材Ｍはフィラメント本体２に巻き付けられた巻付材３の毛細管現象により下方から上方に向かって余すところなく、流れるように展開する。そして最終的にはフィラメント本体２の溶融作用部２２に満遍なく広がり、そこからアルミ分子が蒸発し、被加工材Ｗの表面に蒸着して薄膜形成（メッキ）が成されることとなる。
因みに図６（ｂ）に示すように蒸着材Ｍを単に棒状のものとした場合には、溶融作用部２２との接触面積が僅かなものとなってしまうため、溶融作用部２２における発熱ロスが過剰なものとなってしまう。更には接触部のみが溶融して中間部分が溶融することなく脱落してしまうこともあった。 During the vapor deposition operation, the filament main body 2 generates heat when energized from the filament holder 52, and the vapor deposition material M supported on the mounting portion 23 is efficiently melted and further evaporated. At this time, the melted vapor deposition material M is unfolded so as to flow from the bottom to the top due to the capillary phenomenon of the winding material 3 wound around the filament body 2. Eventually, it spreads evenly over the melting action part 22 of the filament body 2, from which the aluminum molecules evaporate and deposit on the surface of the workpiece W to form a thin film (plating).
Incidentally, as shown in FIG. 6 (b), when the vapor deposition material M is simply a rod-shaped material, the contact area with the melting portion 22 becomes small, so that the heat loss in the melting portion 22 is reduced. It will be excessive. Furthermore, only the contact part melts and the intermediate part may fall off without melting.

なお前記溶融作用部２２には巻付材３を装着しないようにしてもよく、この場合には、真空蒸着用フィラメント２に支持される蒸着材Ｍは直接フィラメント本体２から熱伝導を受け、迅速な溶融がなされることとなる。   Note that the wrapping material 3 may not be attached to the melting portion 22, and in this case, the vapor deposition material M supported by the vacuum vapor deposition filament 2 directly receives heat conduction from the filament body 2, and quickly. Will be melted.

本発明の真空蒸着用加熱装置を構成要素とする真空蒸着装置の骨格的縦断面図（ａ）、真空蒸着用加熱装置を示す斜視図（ｂ）である。It is the skeletal longitudinal cross-sectional view (a) of the vacuum evaporation system which uses the heating apparatus for vacuum evaporation of this invention as a component, and the perspective view (b) which shows the heating apparatus for vacuum evaporation. 真空蒸着用フィラメント及び蒸着材を示す斜視図（ａ）並びに真空蒸着用フィラメントに蒸着材を保持させた状態を一部拡大して示す斜視図（ｂ）である。It is the perspective view (a) which shows the filament for vacuum vapor deposition, and a vapor deposition material, and the perspective view (b) which expands and shows the state which hold | maintained the vapor deposition material to the vacuum vapor deposition filament. 真空蒸着用フィラメント及び蒸着材を示す側面図（ａ）並びに真空蒸着用フィラメントに蒸着材を保持させた状態を示す側面図（ｂ）である。It is the side view (a) which shows the filament for vacuum vapor deposition, and a vapor deposition material, and the side view (b) which shows the state which hold | maintained the vapor deposition material to the filament for vacuum vapor deposition. 真空蒸着用フィラメントを示す平面図（ａ）並びに真空蒸着用フィラメントに蒸着材を保持させた状態を示す平面図（ｂ）である。It is the top view (a) which shows the filament for vacuum evaporation, and the top view (b) which shows the state by which the vapor deposition material was hold | maintained at the filament for vacuum evaporation. 蒸着材の他の形状例を示す側面図である。It is a side view which shows the other example of a shape of a vapor deposition material. 本発明の真空蒸着用加熱装置を構成する真空蒸着用フィラメントに蒸着材を保持させた状態を示す正面図（ａ）並びに棒状の蒸着材を保持させた状態を示す正面図（ｂ）である。It is the front view (a) which shows the state which hold | maintained the vapor deposition material in the vacuum vapor deposition filament which comprises the heating apparatus for vacuum vapor deposition of this invention, and the front view (b) which shows the state which hold | maintained the rod-shaped vapor deposition material.

符号の説明Explanation of symbols

１ 真空蒸着用フィラメント
２ フィラメント本体
３ 巻付材
５ 蒸着装置
２１ 通電端
２２ 溶融作用部
２３ 載置部
３１ 巻付材（コイル状）
５０ チャンバ本体
５０Ａ 加工室
５１ 電極ロッド
５２ フィラメントホルダ
５３ 固定ネジ
５５ ワークスタンド
Ｍ 蒸着材
Ｗ 被加工材 DESCRIPTION OF SYMBOLS 1 Filament for vacuum evaporation 2 Filament main body 3 Wrapping material 5 Vapor deposition apparatus 21 Current supply end 22 Melting action part 23 Mounting part 31 Wrapping material (coil shape)
50 Chamber body 50A Processing chamber 51 Electrode rod 52 Filament holder 53 Fixing screw 55 Work stand M Deposition material W Work material

Claims (5)

通電により加熱を受けるフィラメントに対して蒸着材を保持させ、この蒸着材を加熱蒸発させて被加工材に蒸着皮膜を形成する装置において、前記フィラメントは、溶融作用部の上方に長手方向に連続するように蒸着材の載置部を設けて成るものであり、且つこの載置部は上方からの蒸着材の導入形状を有するものであり、一方、前記蒸着材は載置部においてフィラメントに対し緩係合状態に載置されるような屈曲形状を有するものであることを特徴とする真空蒸着用加熱装置。 In an apparatus in which a vapor deposition material is held on a filament that is heated by energization, and the vapor deposition material is heated and evaporated to form a vapor deposition film on a workpiece, the filament is continuous in the longitudinal direction above the melting portion. The deposition material is provided with a mounting portion for the vapor deposition material, and the mounting portion has a shape in which the vapor deposition material is introduced from above. On the other hand, the vapor deposition material is loosened with respect to the filament at the placement portion. A heating apparatus for vacuum vapor deposition having a bent shape so as to be placed in an engaged state. 前記フィラメントは、線材を複数本縒り合わせて構成されたものであることを特徴とする請求項１記載の真空蒸着用加熱装置。 2. The heating apparatus for vacuum evaporation according to claim 1, wherein the filament is formed by winding a plurality of wires. 前記フィラメントには、巻付線が装着されていることを特徴とする請求項１または２記載の真空蒸着用加熱装置。 The heating apparatus for vacuum evaporation according to claim 1 or 2, wherein a winding wire is attached to the filament. 前記蒸着材は、螺旋形状であることを特徴とする請求項１、２または３記載の真空蒸着用加熱装置。 The said vapor deposition material is a helical shape, The heating apparatus for vacuum vapor deposition of Claim 1, 2, or 3 characterized by the above-mentioned. 前記蒸着材は、線材を複数本縒り合わせて構成されたものであることを特徴とする請求項１、２、３または４記載の真空蒸着用加熱装置。 The heating apparatus for vacuum vapor deposition according to claim 1, 2, 3, or 4, wherein the vapor deposition material is formed by twisting a plurality of wires.
JP2007079088A 2007-03-26 2007-03-26 How to use heating equipment for vacuum deposition Expired - Fee Related JP4969281B2 (en)

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CNA2007101485175A CN101275217A (en) 2007-03-26 2007-08-22 Heating apparatus for vacuum evaporation

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552727A (en) * 1978-06-21 1980-01-10 Hitachi Ltd Vacuum evaporation apparatus
JPS6160879A (en) * 1984-08-31 1986-03-28 Japan Atom Energy Res Inst Metallic evaporation wire
JP2001220662A (en) * 2000-02-04 2001-08-14 Biko Sangyo Kk Vapor deposition material used for vacuum vapor deposition
JP2003268534A (en) * 2002-03-18 2003-09-25 Hitachi Metals Ltd Composite vapor deposition material and its manufacturing method
JP2005290483A (en) * 2004-03-31 2005-10-20 Biko Mekku Kogyo Kk Filament for vacuum deposition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS552727A (en) * 1978-06-21 1980-01-10 Hitachi Ltd Vacuum evaporation apparatus
JPS6160879A (en) * 1984-08-31 1986-03-28 Japan Atom Energy Res Inst Metallic evaporation wire
JP2001220662A (en) * 2000-02-04 2001-08-14 Biko Sangyo Kk Vapor deposition material used for vacuum vapor deposition
JP2003268534A (en) * 2002-03-18 2003-09-25 Hitachi Metals Ltd Composite vapor deposition material and its manufacturing method
JP2005290483A (en) * 2004-03-31 2005-10-20 Biko Mekku Kogyo Kk Filament for vacuum deposition

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