JP2008238198A - Die set and die mounting method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a die set capable of positioning a die with high accuracy without installing a sub guide, and a method of mounting the die thereof. <P>SOLUTION: The die set D is equipped with a lower die holder 1, upper die holder 2, guide post 3 and guide bush 4. The lower die holder 1 is equipped with a position adjustment substrate 5. After the substrate 5 is positioned by a centering device 100, an upper die is set in the upper die holder 2, and a lower die is set in the position adjustment substrate 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a die set and a mold mounting method thereof. More specifically, the present invention relates to a die set capable of maintaining high processing accuracy without providing a sub guide and a mold mounting method thereof.

  Conventionally, in press molding, a die set comprising a lower mold holder, an upper mold holder, a guide post, and a guide bush as a unit has been used in order to facilitate mold matching and attachment of a mold to a press machine. .

  In this die set, in order to improve the molding accuracy by improving the positioning accuracy of the die, as shown in FIG. 20, each die in the die set is provided with a sub guide SG including a guide post and a guide bush. A die set D ′ employing a so-called sub-guide method is known.

  However, such a sub-guide type die set D ′ has a problem that the die is increased due to the provision of the sub-guide SG, leading to an increase in size and cost of the die set D ′. Further, since the sub guide SG exists, there is a problem that the effective area of the mold is limited and the replacement of the mold is complicated.

  The present invention has been made in view of the problems of the prior art, and an object thereof is to provide a die set capable of positioning a mold with high accuracy without providing a sub guide and a mold mounting method thereof.

  The die set of the present invention is a die set including a lower mold holder, an upper mold holder, a guide post, and a guide bush, wherein the lower mold holder includes a position adjustment substrate. .

  In the die set of the present invention, it is preferable that the lower mold holder includes a storage recess, and the position adjustment substrate is stored in the storage recess in a flush manner.

  In the die set of the present invention, it is preferable to include a displacement prevention pin for preventing displacement of the position adjustment substrate after position adjustment.

  Furthermore, in the die set of the present invention, it is preferable that the upper mold holder includes an elevating positioning mechanism having elevating positioning pins for positioning the upper substrate and / or the upper mold.

  Further, in the die set of the present invention, the position adjustment substrate includes an elevating positioning mechanism having elevating positioning pins for positioning the lower substrate and / or the lower die, or the lower die holder is located under the device. It is preferable to provide an elevating positioning mechanism having elevating positioning pins for positioning the side substrate and / or the lower mold.

  Furthermore, in the die set of the present invention, it is preferable that the upper mold holder includes a guide member having a guide portion for guiding the apparatus upper substrate and / or the upper mold set.

  The mold mounting method of the present invention is a mold mounting method in a die set having a position adjusting substrate, and a procedure for setting the position adjusting substrate in a lower mold holder so that the position can be adjusted, and a device lower substrate by a centering device The procedure for measuring the deviation between the position adjustment board and the upper substrate of the apparatus, the procedure for adjusting the position of the position adjustment board based on the measured value, and the position adjustment board are inserted with a deviation prevention pin to prevent the position adjustment board from being displaced. And a procedure.

  According to the present invention, after the position adjustment substrate is adjusted so that the lower mold is not misaligned with the upper mold, the upper die and the lower die are set on the die set. An excellent effect that precision molding can be achieved is obtained.

  Further, according to the present invention, since the sub guide is not provided, an excellent effect of increasing the effective area of the die set can be obtained.

  Furthermore, according to the present invention, since the sub guide is not provided, an excellent effect that the mold can be replaced quickly is obtained.

  Hereinafter, although the present invention is explained based on an embodiment, referring to an accompanying drawing, the present invention is not limited only to this embodiment.

Embodiment 1
A die set according to Embodiment 1 of the present invention is schematically shown in FIGS.

  As shown in FIGS. 1 and 2, the die set D includes a lower mold holder 1, an upper mold holder 2, a guide post 3, and a guide bush 4 as main components. In FIG. 2, the symbol L indicates a pass line.

  Moreover, each opposing surface of the lower mold | type holder 1 and the upper mold | type holder 2 is shown in FIG. 3 and FIG. 4, respectively. As shown in FIGS. 1 to 3, the lower mold holder 1 is provided with a position adjustment substrate 5 on the upper surface.

  First, the lower mold holder 1 and the position adjustment substrate 5 will be described with reference to FIGS.

  The position adjustment board 5 is a rectangular parallelepiped block body, and an elevating positioning mechanism 51 for positioning a lower board (hereinafter referred to as the apparatus lower board) 101 of the lower mold and the centering apparatus 100 (refer to FIG. 7). In addition, there are four female screw holes 52 appropriately arranged to bolt the lower die and the lower substrate 101 of the apparatus. Further, the fixing, that is, the setting of the position adjusting board 5 to the lower mold holder 1 is carried out by bolting the four corners of the position adjusting board 5 to the lower mold holder 1. Two pin holes (displacement prevention pin holes) 53 provided on the center line of the adjustment substrate 5 and pin holes (displacement prevention pin holes) provided in the lower mold holder 1 corresponding to the displacement prevention pin holes 53 This is done by inserting a slip prevention pin. The interval between the slip prevention pin holes 53 and 53 is adjusted so that each slip prevention pin is outside the lower mold on which the position adjustment substrate 5 is placed and the apparatus lower substrate 101.

  The bolt hole 54 for bolting the position adjustment board 5 to the lower mold holder 1 is provided with a predetermined margin so that the position adjustment board 5 can be adjusted in the temporarily fixed state. The bolt hole 54 is not clearly illustrated, but is a stepped hole so that the bolt head does not protrude from the upper surface of the position adjustment board 5.

  Note that the fixing of the position adjustment substrate 5 to the lower mold holder 1 is not limited to bolting, and may be performed by, for example, a hydraulic clamping mechanism.

  The elevating positioning mechanism 51 includes elevating positioning pins 55 and elevating means 56 that elevates and lowers the elevating positioning pins 55. As shown in FIG. 3, two elevating positioning pins 55 are arranged diagonally or arranged linearly along the side edges.

  As shown in FIG. 5, for example, as shown in FIG. 5, the raising / lowering means 56 for raising / lowering the raising / lowering positioning pins 55 arranged diagonally includes an operation rod 57 having a lifting projection 57a eccentrically disposed at the tip, and the raising / lowering positioning pins 55 An engaging groove 55a formed on the lower portion and engaged with the lifting projection 57a is provided. In FIG. 5A, a portion surrounded by a circle A composed of a two-dot chain line indicates an arrow AA in FIG.

  More specifically, the elevating type positioning pin 55 is inserted into the positioning pin hole so that the engaging groove 55a faces the operation side end face, and the operating rod 57 has the elevating projection 57a inserted into the engaging groove 55a. The position adjusting substrate 5 is engaged and has an opening on the operation side end face, and is rotatably inserted into a rod lateral hole communicating with the positioning pin hole. Here, while the operating rod 57 for raising and lowering the elevating positioning pin 55 located on the operation end side (near side) is short, the elevating positioning pin 55 located on the opposite side (back side) from the operation end is provided. The operating rod 57 that moves up and down is elongated. In addition, an operation knob 57b is provided at a portion protruding from the operation side end face of each operation rod 57, and a retaining groove 57c provided in the operation rod 57 is provided at an operation side end of each operation rod 57. A known retaining prevention mechanism 57e having a retaining bolt 57d that engages with the retaining groove 57c is provided.

  Since the lifting / lowering positioning mechanism 51 is configured as described above, the lifting / lowering positioning pins 55 are moved up and down by rotating the operation knob 57b. That is, the head of the liftable positioning pin 55 protrudes or retracts from the upper surface of the position adjustment substrate 5. In addition, the code | symbol 55b in a figure shows the guide bush which guides raising / lowering of the raising / lowering type positioning pin 55. FIG.

  As shown in FIG. 6, for example, as shown in FIG. 6, the elevating means 56 for elevating the two elevating positioning pins 55 arranged in a straight line includes two elevating types arranged along the side edges of the position adjusting substrate 5. The racks 55c are formed at the lower portions of the positioning pins 55, and the operation rods 58 are formed with gears 58a that mesh with the racks 55c at predetermined intervals. In FIG. 6A, a portion surrounded by a circle B consisting of a two-dot chain line indicates an arrow BB in FIG.

  More specifically, the elevating positioning pin 55 is inserted into the positioning pin hole so that the rack 55c faces the other side so as to be raised and lowered, and the operation rod 58 is adjusted in position by engaging the gear 58a with the rack 55c. The substrate 5 is rotatably inserted in a rod lateral hole having an opening on the operation side end face and communicating with the positioning pin hole.

  In addition, an operation knob 58b is provided at a portion protruding from the operation side end face of the operation rod 58, and a retaining groove 58c provided in the operation rod 58 is provided at the operation side end portion of the operation rod 58. A known retaining mechanism 58e having a retaining bolt 58d engaged with the retaining groove 58c is provided.

  Since the elevating type positioning mechanism 51 is configured as described above, the elevating type positioning pin 55 is moved up and down by rotating the operation knob 58b. That is, the head of the liftable positioning pin 55 protrudes or retracts from the upper surface of the position adjustment substrate 5.

  As shown in FIG. 4, the upper mold holder 2 includes an elevating positioning mechanism 21 that positions an upper substrate (hereinafter referred to as an apparatus upper substrate) 102 of the upper mold and the centering device 100, an upper mold and an apparatus upper substrate 102. Four female screw holes 22 that are appropriately arranged to be bolted, and an L-shaped guide portion that is opposed to guide the set of the upper die and the device upper substrate 102 while preventing the upper die and the device upper substrate 102 from dropping. It has the guide member 23 which has.

  The lifting / lowering positioning mechanism 21 has a lifting / lowering positioning pin 25 and a lifting / lowering means 26 that lifts and lowers the lifting / lowering positioning pin 25. In addition, since those structures are the same as that of the raising / lowering positioning mechanism 51 of the position adjustment board | substrate 5, the detailed description is abbreviate | omitted.

  Next, the centering device 100 that performs centering will be described.

  As shown in FIG. 7, the centering device (hereinafter simply referred to as “device”) 100 has a device upper substrate 102 that is positioned and bolted to the upper mold holder 2 by the elevating type positioning mechanism 21 and measures misalignment. A misalignment measurement unit (hereinafter, simply referred to as a measurement unit) 110 and an apparatus lower substrate 101 that is positioned and bolted to the position adjustment substrate 5 by an elevating positioning mechanism 51, and misalignment is measured. A measurement unit (hereinafter simply referred to as a measured unit) 120 is provided. In addition, the attachment position of the measurement part 110 and the to-be-measured part 120 may be switched. That is, the measuring unit 110 may be set on the position adjustment substrate 5 and the measured unit 120 may be set on the upper mold holder 2.

  In addition to the apparatus upper substrate 102, the measurement unit 110 provides a predetermined interval on a measurement side mounting table placed and fixed on the apparatus upper substrate 102 and a measurement reference line (for example, a center line) of the measurement side mounting table. The first measuring tool and the second measuring tool that have the same structure are provided.

  The apparatus upper board 102 has elevating positioning pin holes through which the elevating positioning pins 25 are inserted and bolt holes for bolting the apparatus upper board 102 to the upper mold holder 2. Although the bolt hole is not clearly illustrated, the bolt hole is a stepped hole so that the bolt head does not protrude from the apparatus upper substrate 102.

  The measuring tool has a measurement reference axis with a ridge formed near the end on the measurement side mounting table, that is, near the upper end, and a holder that is rotatably mounted on the other end of the measurement reference axis, that is, near the lower end. The member and a dial gauge disposed on the outer peripheral portion of the holding member with the probe facing inward and downward are provided.

  In addition to the apparatus lower substrate 101, the measurement target 120 includes a measurement target mounting table that is placed and fixed on the apparatus lower substrate 101, and a measurement reference line (for example, a center line) of the measurement target mounting table. The first measured axis and the second measured axis are provided with the same structure and disposed at the predetermined interval on the upper side. A ridge is formed at the lower end of the shaft to be measured.

  The apparatus lower substrate 101 has an elevating positioning pin hole through which the elevating positioning pin 55 is inserted, and a bolt hole for bolting the apparatus lower substrate 101 to the position adjustment substrate 5. Although the bolt hole is not clearly illustrated, the bolt hole is a stepped hole so that the bolt head does not protrude from the lower substrate 101 of the apparatus.

  Therefore, centering in the die set D using the apparatus 100 configured as described above is performed as follows.

  Procedure 1: After positioning the liftable positioning pin 25 of the liftable positioning mechanism 21 of the upper mold holder 2 through the positioning pin hole provided in the apparatus upper substrate 102, the apparatus upper substrate 102 is bolted to the upper mold holder 2. Fasten (fixed).

  Procedure 2: The position adjustment substrate 5 is bolted (temporarily fixed) to the lower mold holder 1. That is, the position adjustment substrate 5 is set in a slidable state on the lower mold holder 1.

  Step 3: After positioning the liftable positioning pins 55 of the liftable positioning mechanism 51 of the position adjusting substrate 5 through the pin holes provided in the lower substrate 101 of the apparatus, the lower substrate 101 of the apparatus is placed on the position adjusting substrate 5. Secure with bolts (fixed).

  Procedure 4: The first and second measuring tools of the measuring unit 110 are used to measure the misalignment of the first and second measured axes of the measured unit 120.

  Procedure 5: Calculate the misalignment amount and the misalignment direction from the measured values.

  Procedure 6: Adjust the position of the position adjustment board 5 based on the calculated misalignment amount and misalignment direction.

  Procedure 7: After the position adjustment of the position adjustment board 5 is completed, the position adjustment board 5 is permanently fixed to the lower mold holder 1. That is, the position adjustment substrate 5 is set in the lower mold holder 1 in a non-slidable state.

  Procedure 8: After the position adjustment board 5 is fixed, the misalignment is measured again.

  Procedure 9: If there is no problem in the measured value, the misalignment prevention pin hole of the position adjustment substrate 5 and the misalignment prevention pin hole of the lower mold holder 1 are shared with a hand reamer and the misalignment prevention pin is inserted.

  Step 10: Measure misalignment again.

  Thereby, the centering of the apparatus lower substrate 101 and the apparatus upper substrate 102, that is, the alignment of the lower mold and the upper mold is completed.

  As described above, according to the first embodiment, the upper mold and the lower mold can be centered with high accuracy, so that the molding accuracy can be improved. Further, since the sub guide is not provided, the mold can be replaced smoothly and the effective area of the die set D is increased.

Embodiment 2
A die set D1 according to Embodiment 2 of the present invention is schematically shown in FIGS. The second embodiment is a modification of the first embodiment. The lower mold holder 1A is provided with a storage recess 11 for storing the position adjustment substrate 5A, and the position adjustment substrate 5A is stored in the storage recess 11 in the same plane. It is supposed to be. Further, an elevating type positioning mechanism 12 is provided at the bottom of the housing recess 11 and an elevating type positioning pin 15 is provided so that its head protrudes from the upper surface of the position adjusting substrate 5A. The remaining configuration of the second embodiment is the same as that of the first embodiment.

  Hereinafter, the differences of the second embodiment from the first embodiment will be mainly described with reference to FIGS.

  The storage recess 11 has a predetermined tolerance in the inner dimension so that the position of the position adjustment board 5A can be adjusted, and the positioning pin hole through which the elevating positioning pin 15 is inserted is formed in a diagonal or linear shape on the bottom surface. There are 4 female screw holes for bolting the position adjustment board 5A in the bottom surface as appropriate, and the displacement prevention pin hole through which the position prevention board for preventing position displacement of the position adjustment board 5A is inserted is on the bottom center line. Have two.

  The lifting / lowering positioning mechanism 12 is long enough to allow the lifting / lowering positioning pins 15 to protrude from the upper surface of the position adjusting substrate 5A, and the lifting / lowering means 16 including the operation rod 17 is the lifting / lowering positioning of the first embodiment. It is the same as that of the mechanism 51 (see FIG. 12 and FIG. 13). In FIG. 12, the part surrounded by a circle C composed of a two-dot chain line shows an arrow CC in FIG. 13, and the part surrounded by a circle D composed of a two-dot chain line in FIG. Arrow view DD in the figure is shown.

  The position adjustment board 5A has an elevation type positioning pin hole, a bolt hole and a deviation prevention pin hole corresponding to the elevation type positioning pin hole, the female screw hole and the deviation prevention pin hole on the bottom surface of the storage recess 11, and the lower substrate of the apparatus. Four internal threaded holes for bolting 101 are appropriately arranged. Although the bolt hole is not clearly illustrated, the bolt hole is a stepped hole so that the bolt head does not protrude from the position adjustment board 5A. Here, the positioning pin hole and the bolt hole are provided with a predetermined margin so that the position of the position adjusting board 5A can be adjusted.

  Next, centering in the die set D1 using the apparatus 100 configured as described above is performed as follows.

  Procedure 1: After positioning the liftable positioning pins 25 of the liftable positioning mechanism 21 of the upper mold holder 2 through the pin holes provided in the apparatus upper substrate 102, the apparatus upper substrate 102 is bolted to the upper mold holder 2. (Fixed).

  Procedure 2: The position adjustment board 5A is housed in the housing recess 11 of the lower mold holder 1A and bolted (temporarily fixed). That is, the position adjustment board 5A is bolted to the storage recess 11 in a slidable state.

  Procedure 3: The elevating type positioning mechanism 12 is set on the bottom of the housing recess 11 of the lower mold holder 1A. That is, the elevating type positioning pin 15 is inserted through the positioning pin hole of the position adjusting substrate 5A and is engaged with the operation rod 17 inserted through the operation rod side hole so that the elevating type positioning pin 15 can be moved up and down.

  Procedure 4: After the elevating positioning pins 15 are inserted and positioned through elevating positioning pin holes provided in the apparatus lower substrate 101, the apparatus lower substrate 101 is bolted (fixed) to the position adjustment substrate 5A.

  Procedure 5: The misalignment of the first and second measured axes of the measured part 120 is measured by the first and second measuring tools of the measuring part 110.

  Procedure 6: Calculate the misalignment amount and misalignment direction from the measured values.

  Procedure 7: Based on the calculated misalignment amount and misalignment direction, the position of the position adjustment board 5A is adjusted. This position adjustment is performed, for example, by striking a position adjustment jig J whose tip is formed in a wedge shape into the gap between the storage recess 11 and the position adjustment substrate 5A (see FIG. 14).

  Procedure 8: After the position adjustment of the position adjustment board 5A is completed, the position adjustment board 5A is permanently fixed to the storage recess 11 of the lower mold holder 1A.

  Procedure 9: After the position adjustment substrate 5A is permanently fixed, the misalignment is measured again.

  Step 10: If there is no problem in the measured value, the misalignment prevention pin hole of the position adjustment substrate 5A and the misalignment prevention pin hole of the lower mold holder 1A are shared with a hand reamer and the misalignment prevention pin is inserted.

  Procedure 11: Measure misalignment again.

  Thereby, the centering of the apparatus lower substrate 101 and the apparatus upper substrate 102, that is, the alignment of the lower mold and the upper mold is completed.

  As described above, according to the second embodiment, since the storage recess 11 is provided in the lower mold holder 1A and the position adjustment substrate 5A is stored therein, the die height can be obtained in the same manner as in the first embodiment. Unobtainable effects are also obtained.

  Hereinafter, more specific examples will be described.

  Centering was performed by a centering apparatus shown in FIG. 15 (in the example shown, the measuring unit is on the lower side and the measured part is on the upper side). In this centering, the dial gauge slips from the ideal trajectory as shown in FIG. 16 according to the deviation from the upper die (device upper substrate) 102 and the lower die (device lower substrate) 101. The measurement was performed by setting the operation surface side to zero and rotating the measuring tool clockwise. In the figure, plus indicates that the dial gauge probe is being pressed, and minus indicates the opposite.

  For example, when the upper mold is shifted to the back of the lower mold (FIG. 16 (a)), when the upper mold is shifted to the front of the lower mold (FIG. 16 (b)), the upper mold is obliquely behind the lower mold. Or when the upper die is displaced obliquely in front of the lower die (FIG. 16D).

  FIG. 17 shows a measurement result in a table, and FIG. 18 shows a graph. Further, the coordinate positions of the lower die (device lower substrate) 101 and the upper die (device upper substrate) 102 are determined as shown in FIG. 19, and centering is performed in consideration of the shift amount and the direction thereof.

  It can be seen from FIGS. 17 and 18 that the centering is performed with high accuracy.

  The present invention can be applied to manufacture of a die set and centering in the die set.

It is the schematic of the die set concerning Embodiment 1 of the present invention. It is the same schematic side view. It is a top view of the state which set the position adjustment board | substrate to the lower mold | type holder of the same die set. It is a bottom view of the upper mold holder of the same die set. It is a 2nd page figure of an example of the position adjustment board | substrate of the same die set, Comprising: (a) shows a side view, (b) shows a top view. It is a 2nd page figure of the other example of the position adjustment board | substrate of the same die set, The same (a) shows a side view, The same (b) shows a top view. It is the schematic of a centering apparatus. It is FIG. 1 equivalent view of the die set concerning Embodiment 2 of this invention. FIG. 3 is a view corresponding to FIG. It is the figure equivalent to FIG. FIG. 5 is a diagram corresponding to FIG. 4. FIG. 6 is a view corresponding to FIG. FIG. 7 is a view corresponding to FIG. 6. It is explanatory drawing of position adjustment of the position adjustment board | substrate in Embodiment 2 of this invention. It is the schematic of the centering apparatus in the Example of this invention, Comprising: The same (a) is a top view which shows a positional relationship, The same (b) is a schematic front view. It is a pattern diagram which shows the pattern of misalignment. It is a table figure which shows the result of misalignment. It is a graph which shows the result of misalignment. It is explanatory drawing of the coordinate position in misalignment measurement. FIG. 2 is a view corresponding to FIG. 1 of a conventional die set.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lower mold holder 11 Storage recessed part 12 Elevating type positioning mechanism 15 Elevating type positioning pin 16 Elevating means 17 Operation rod 2 Upper mold holder 21 Elevating type positioning mechanism 23 Guide member 25 Elevating type positioning pin 3 Guide post 4 Guide bush 5 Position adjustment board 51 Lifting Positioning Mechanism 55 Lifting Positioning Pin 56 Lifting Means 57 Operating Rod 100 Centering Device 101 Device Lower Substrate 102 Device Upper Substrate 110 Measuring Unit 120 Measured Part D Die Set J Position Adjustment Jig

Claims (8)

A die set comprising a lower mold holder, an upper mold holder, a guide post, and a guide bush,
A die set comprising a lower mold holder and a position adjusting substrate.   2. The die set according to claim 1, wherein the lower mold holder includes a storage recess, and the position adjustment substrate is stored flush with the storage recess.   2. The die set according to claim 1, further comprising a displacement prevention pin for preventing displacement of the position adjustment substrate after the position adjustment.   2. The die set according to claim 1, wherein the upper mold holder includes an elevating type positioning mechanism having elevating type positioning pins for positioning the upper substrate of the apparatus and / or the upper mold.   2. The die set according to claim 1, wherein the position adjustment substrate includes an elevating type positioning mechanism having elevating type positioning pins for positioning the lower substrate and / or the lower die of the apparatus.   3. The die set according to claim 2, wherein the lower mold holder includes a liftable positioning mechanism having liftable positioning pins for positioning the lower substrate of the apparatus and / or the lower mold.   The die set according to claim 1, wherein the upper mold holder includes a guide member having a guide portion for guiding the apparatus upper substrate and / or the upper mold set. A mold mounting method in a die set having a position adjustment substrate,
The procedure to set the position adjustment board to the lower mold holder so that the position can be adjusted
A procedure for measuring the deviation between the lower substrate and the upper substrate by the centering device;
A procedure for adjusting the position of the position adjustment board based on the measurement value;
A mold mounting method comprising: a step of inserting a displacement prevention pin through the position adjustment board to prevent the position adjustment board from being displaced.

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