JP2008235066A - Organic el element and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL element and an organic EL display which consist of an organic light emitting medium layer including at least a cathode, an anode, a positive hole transport layer and an organic light-emitting layer, in the organic EL element to light emit the organic light-emitting layer by making a current flow from both electrodes to the organic light-emitting layer, in which a thick membrane of the positive hole transportation layer is realized, in which as prevention of reduction of light emission efficiency due to leakage in a current flowing between patternized electrodes, the positive hole transport layer is disconnected between the cathodes in parallel, and which is less in light emission unevenness, and superior in display quality. <P>SOLUTION: A barrier rib part divided at the center part is formed between line patterns of the cathodes, an angle formed by a wall face of the cathode side of this barrier rib and the substrate is made an acute angle, and the angle formed by the wall face of the barrier rib side and the substrate is made a blunt angle. This is a manufacturing method of the organic EL element in which the positive hole transport layer and the light-emitting layer are laminated on this barrier rib. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an organic EL element used for an organic EL element or the like in which an organic light emitting layer is made of a polymer material, and a manufacturing method thereof, and more particularly to an organic EL element formed by coating the entire surface of a hole transport layer and a manufacturing method thereof About.

  An organic light-emitting device is composed of two opposing electrodes and an organic light-emitting medium layer such as a hole transport layer, a light-emitting layer, and an electron transport layer stacked between the two opposing electrodes. The organic light emitting device emits light by passing an electric current through these organic light emitting medium layers. However, the film thickness of the organic light emitting medium layer is important for efficient light emission, and it is necessary to form a thin film of about 100 nm. is there. Furthermore, in order to make this a display panel, it is necessary to pattern it with high definition.

  Hole transport materials and organic light-emitting materials that form the organic light-emitting layer include low-molecular materials and high-molecular materials. In general, low-molecular materials are formed into thin films by vacuum deposition or the like, and a fine pattern mask is used at this time. However, this method has a problem that the patterning accuracy is less likely to increase as the substrate becomes larger. In addition, since the film is formed in a vacuum, there is a problem that the throughput is poor.

  Therefore, recently, a method in which a polymer material is dissolved in a solvent to form a coating solution and a thin film is formed by a wet coating method has been tried. When forming an organic light emitting medium layer including an organic light emitting layer and a hole transport layer by wet coating using a coating material of a polymer material, the layer structure is laminated with the hole transport layer and the organic light emitting layer from the anode side. A two-layer configuration is common. At this time, the organic light emitting layer is formed by dissolving or stably dispersing organic light emitting materials having respective emission colors of red (R), green (G), and blue (B) in a solvent in order to form a color panel. It is necessary to paint with organic luminescent ink.

  On the other hand, the hole transport layer is generally formed by using a coating method such as a spin coating method or a die coating method, without applying patterning, so that the entire surface of the organic EL element involved in image formation is generally coated, so-called solid coating. (See Patent Document 1 and Patent Document 2). This is because the film thickness of the hole transport layer is generally a thin film of 100 nm or less, and the current flowing in the thickness direction is overwhelmingly easier to flow than the current flowing in the lateral direction of the layer, so if the electrode is patterned, This is because it has been said that there is very little leakage of current outside the pixel.

JP-A-10-162955 JP-A-11-121172

  However, the inventors of the present invention patterned a pixel electrode as an anode on a glass substrate, patterned a partition wall between the anodes, and then applied a hole transport layer to the entire surface of the organic EL element, As a result of manufacturing a passive matrix type organic EL device in which the light emitting layer was patterned and the cathode layer was formed, it was confirmed that the current flowing between the patterned electrodes leaked and the luminous efficiency was lowered. Therefore, in order to improve the luminous efficiency, it is necessary to prevent this leakage current by disconnecting between the anodes in which the hole transport layers are arranged.

Therefore, the present invention provides a method for manufacturing an organic EL element capable of performing display with good uniformity without lowering of light emission efficiency due to leakage current even when a hole transport layer is formed by solid coating. Was an issue.

The invention according to claim 1, which has been made to solve the above problems, includes a step of forming a striped anode pattern on a substrate, a step of forming a partition between the anode patterns, and the anode pattern. A method for producing an organic EL device comprising: forming an organic light emitting medium layer having at least a hole transport layer thereon; and forming a cathode pattern in a direction perpendicular to the anode line. In the step of forming the partition wall, the partition wall portion 1 and the partition wall portion 2 that are substantially parallel to the anode line are formed, and after the step of forming at least the hole transport layer among the steps of forming the organic light emitting medium layer, And, before the step of forming the cathode pattern, the step of combining the two partition walls, and further, in the two partition walls, a surface on the side of the opposing partition walls, the substrate, Angle formed is a method for producing an organic EL element, wherein the 90 degrees or less on the side of the opposed partition wall.

The invention according to claim 2 is the method of manufacturing an organic EL element according to claim 1, wherein the minimum value of the width of the two partition walls is 0.2 μm or more.

The invention according to claim 3 is that, in the cross-sectional shape of the partition wall, the width of the vertical line drawn down on each substrate from the most protruding point of the wall surface on the partition wall side and the most intruded point is 0.2 μm or more. It is a manufacturing method of the organic EL element of Claim 1 or 2 characterized by the above-mentioned.

The invention according to claim 4 is the method for manufacturing an organic EL element according to claim 1, wherein an angle formed between the wall of the partition wall on the anode side and the substrate is 90 degrees or more on the anode side. is there.

5. The organic EL device according to claim 1, wherein in the step of forming the cathode pattern, the height of the partition wall from the substrate is 0.5 to 5 μm. It is a manufacturing method.

The invention according to claim 6 is characterized in that in the step of forming the hole transport layer, a working solution containing a hole transport layer material is applied using a slit coat method. It is a manufacturing method of the organic EL element of the above.

The invention according to claim 7 is characterized in that, in the step of filling the gap between the two partition walls, ink containing a partition material is ejected into the gap between the partition walls using an ink jet method. It is a manufacturing method of the organic EL element of the above.

According to an eighth aspect of the present invention, in the step of forming the partition, a negative resist is applied onto the substrate, and then parallel exposure light is applied through a mask having one opening in the partition formation portion. The partition is divided into two partitions by obliquely incident, then exposing the resist by obliquely incident parallel exposure light with the incident angle of the oblique incident reversed right and left, and then developing the resist. A method for producing an organic EL device according to any one of claims 1 to 7, wherein:

In the invention according to claim 9, in the step of forming the partition, a positive resist is applied on the substrate, and then exposed through a mask having an opening in the pattern portion of the anode, 8. The partition part divided into two partition parts is formed by exposing through a mask having an exposure light transmitting part at the center part of the partition forming part and then developing. It is a manufacturing method of the organic EL element in any one.

According to a tenth aspect of the present invention, there is provided a line-shaped anode pattern on the substrate, a partition between the anode patterns, an organic light emitting medium layer having at least a hole transport layer on the anode pattern, and the anode line. An organic EL element having at least a cathode pattern intersecting perpendicularly to the anode, wherein the partition wall has two partition wall portions substantially parallel to the anode line, and the two partition wall portions are at least two partition walls. It is an organic EL element characterized by being coupled at the upper part of the gap between the parts.

The invention according to claim 11 is the organic EL element according to claim 10, wherein a partition wall material is formed in a lid shape on the two partition walls.

The invention according to claim 12 is the organic EL element according to claim 10, wherein a partition wall material is formed between the two partition walls in a bridge shape.

According to a thirteenth aspect of the present invention, in the two partition walls, an angle formed between a surface of each opposing partition wall and the substrate is 90 degrees or less on the facing partition wall side. An organic EL element according to claim 11 or 12, which is characterized in that it is an organic EL element.

The invention according to claim 14 is characterized in that the angle formed by the wall surface on the anode side of the partition wall and the substrate is 90 degrees or more on the anode side. This is a method for manufacturing an EL element.

The invention according to claim 15 is the organic EL element according to claim 10, wherein the height of the partition wall from the substrate is 0.5 to 5 μm.

  According to the method for producing an organic EL device of the present invention, a slit coating method with excellent uniformity, or a spin coating method, a die coating method, a dip coating method, a discharge coating method, a play coating method, a roll coating method, and a bar coating method. When applying organic functional material ink in which organic functional material is dissolved or stably dispersed in a solvent by wet coating method, etc., and forming an organic functional layer, it is possible to disconnect between pixels and reduce leakage current. Can be prevented. The effects of the present invention will be described below for each claim.

  According to the first aspect of the invention, in the step of forming the organic functional layer such as the hole transport layer and the light emitting layer, the partition wall portion is divided into two, so that even when solid coating is applied, each layer can be disconnected. And leakage current can be suppressed.

  In particular, since the minimum value of the width of the two partition walls is 0.2 μm or more as in the invention according to claim 2, there is no connection between the partition walls. The light emitting layer film does not cover the entire wall surface on the part side.

Further, since the angle formed by the wall surface on the anode side of the partition wall and the substrate is 90 degrees or less as in the invention according to claim 4, the height of the partition wall is 0. 0 as in the invention according to claim 4. By being 5-5 micrometers, it is possible to prevent that a cathode breaks.

Further, according to the invention according to claim 6, by using the slit coat method for forming the hole transport layer, it is possible to form a uniform film over a large area, and the use efficiency of the material is very high. Just do it.

According to the seventh aspect of the present invention, the partition walls can be easily combined. Further, by using the partition wall forming method according to claim 8 or 9, it is possible to appropriately design and manufacture a partition wall shape suitable for the method for manufacturing the organic EL element of the present invention.

  Hereinafter, an example in which the embodiment of the present invention is applied to a passive matrix type organic EL element will be described. There are a passive matrix type and an active matrix type as a driving method of the organic EL element, but the organic EL element of the present invention can be applied to both a passive matrix type organic EL element and an active matrix type organic EL element. .

  The passive matrix method is a method in which stripe-shaped electrodes are opposed to each other so as to be orthogonal to each other, and light is emitted at the intersection, whereas the active matrix method uses a so-called thin film transistor (TFT) substrate in which a transistor is formed for each pixel. Thus, the light is emitted independently for each pixel.

FIG. 1 shows a cross-sectional view of an organic EL device manufacturing process according to an embodiment of the present invention. Hereafter, the manufacturing method of organic EL of this invention is demonstrated using FIG. 1 as an example.

  The organic EL element in this organic EL element is formed on the substrate 1. When this organic EL element is a bottom emission type organic EL element that extracts light from the substrate side, it is necessary to use a transparent substrate, but in the case of the top emission type that extracts light from the opposite side of the substrate The substrate does not have to be translucent.

As the substrate 1, a glass substrate or a plastic film or sheet can be used. If a plastic film is used, a polymer EL element can be produced by winding, and a display panel can be provided at a low cost. In addition, as the plastic in that case, for example, polyethylene terephthalate, polypropylene, cycloolefin polymer, polyamide, polyethersulfone, polymethyl methacrylate, polycarbonate, or the like can be used. In addition, these films have a barrier layer made of a metal oxide such as silicon oxide showing water vapor barrier property and oxygen barrier property, oxynitride such as silicon nitride, polyvinylidene chloride, polyvinyl chloride, saponified ethylene-vinyl acetate copolymer. Provided as needed.

  An anode 2 patterned as an anode is provided on the substrate 1. As the material of the anode 2, transparent electrode materials such as ITO (indium tin composite oxide), IZO (indium zinc composite oxide), tin oxide, zinc oxide, indium oxide, and aluminum oxide composite oxide can be used. ITO is preferred because of its low resistance, solvent resistance, transparency, and the like. The anode can be formed by a known pattern forming method. For example, the line-shaped anode 2 can be formed by forming ITO on a substrate by sputtering and patterning by photolithography (step (a)).

  Next, a photosensitive material is applied between the stripes of the line-like anode 2 to form partition walls 6a and 6b (steps (b) and (c)). As the photosensitive material for forming the partition wall, either a negative resist or a positive resist can be used. The material may be a commercially available one, but it needs to have insulating properties. If the partition does not have sufficient insulation, a current flows to the adjacent anode through the partition, resulting in display failure. Specific examples thereof include polyimide, acrylic resin, novolac resin, and fluorene, but are not limited thereto. Further, for the purpose of improving the display quality of the organic EL element, a light shielding material may be included in the photosensitive material.

The photosensitive material for forming the partition wall is applied using a coating method such as a spin coater, bar coater, roll coater, die coater, gravure coater, and patterned by a photolithography method. Further, the partition walls 6a and 6b may be formed by using a gravure offset printing method, a reverse printing method, a flexographic printing method, or the like without using a photosensitive resin.

As a method of forming the partition walls 6a and 6b, when a negative photosensitive resin is used, as shown in FIG. 1B, a mask having one opening in the partition wall forming portion is used. The parallel exposure light is incident obliquely as in 5a. Next, the photosensitive resin is cured into a tilted shape by entering obliquely parallel exposure light in a shape that is reversed left and right as in 5b. The exposure lights 5a and 5b may be irradiated simultaneously or simultaneously. Thereafter, development can be performed to form the inclined partition walls 6a and 6b.

When a positive resist is used, it can be formed by a two-step process as shown in FIG. After applying a positive resist and drying the solvent by heat treatment, exposure is performed using a mask 10a having an exposure light transmitting portion on the anode 2 portion ((a) of FIG. 2). Next, the resist in the anode portion is removed. Next, it exposes using the mask 10b which has an exposure light transmission part in the part applicable to the center of the partition photosensitive resin 12 ((b) of FIG. 2). The exposure light 11 includes light having an incident angle perpendicular to the substrate and inclined light. These may be exposed simultaneously or irradiated separately. Finally, development is performed to form partition walls 6a and 6b. The angle (inclination angle) formed by the wall surface of the partition wall can be determined by the light intensity of the exposure light, development conditions, and the like. Moreover, you may expose from the side which has not apply | coated the resist of a board | substrate.

The shape of the partition walls 6a and 6b is determined by the above process. For example, the distance between the partition walls 6a and 6b is determined by the size of the exposure light transmitting portion of the mask, the distance from the surface of the photosensitive resin layer 4, the angle of the obliquely incident exposure light, the development conditions, and the like. In the present invention, since it is necessary to break the hole transport layer at the partition wall portion, it is necessary to have a certain gap between the partition walls 6a and 6b. Although it varies depending on the viscosity, surface tension, and the like of the ink used for forming the hole transport layer, it is preferably 0.2 μm or more at the place where the distance between the partition walls 6a and 6b is the narrowest. This is because when the distance between the partition walls is 0.2 μm or less, the hole transport layer ink is crosslinked, and the hole transport layer may not be disconnected at the gap between the partition walls.

Further, it is necessary that the inclination angle on the side (partition wall side) where the partition walls 6a and 6b face each other is 90 degrees or more. This is because if the angle is 90 degrees or less, a hole transport layer is formed on the entire surface where the partition walls 6a and 6b face each other, and there is a risk that the hole will not be disconnected. In particular, it is preferable that the width of the perpendicular drawn to each substrate from the most protruding point and the intrusion point is 0.2 μm or more in the cross section of the partition wall surface on the partition wall side at 100 degrees or more. Moreover, it is preferable that the inclination | tilt angle of the side facing the anode 2 which is an anode of the partition walls 6a and 6b is 90 degrees or less. This is because if it is 90 degrees or more, the cathode formed on the top may be broken by the partition walls.

After the partition walls 6a and 6b are formed as described above, the hole transport layer 7 is formed next. As hole transport materials, metal phthalocyanines such as polyaniline derivatives, polythiophene derivatives, polyvinylcarbazole (PVK) derivatives, poly (3,4-ethylenedioxythiophene) (PEDOT), copper phthalocyanine, tetra (t-butyl) copper phthalocyanine, etc. And metal-free phthalocyanines, quinacridone compounds, 1,1-bis (4-di-p-tolylaminophenyl) cyclohexane, N, N′-diphenyl-N, N′-bis (3-methylphenyl) -1, Aromatic amines such as 1′-biphenyl-4,4′-diamine and N, N′-di (1-naphthyl) -N, N′-diphenyl-1,1′-biphenyl-4,4′-diamine A low molecular hole injection transport material can be exemplified. Further, a polymer hole transport material such as polyaniline, polythiophene, polyvinyl carbazole, a mixture of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid may be used. A polythiophene oligomer material can also be used. It is preferred that the hole transport layer to be formed has a low volume efficiency of 1 × 10 ⁶ Ω · cm or less from the viewpoint of light emission efficiency.

These materials are dissolved or dispersed in a solvent and applied onto a substrate as a hole transport material ink (step (d) in FIG. 1). As a coating method, known wet coating methods such as spin coating, die coating, dip coating, discharge coating, play coating, roll coating, and bar coating can be used. In particular, when the slit coating method is used as the coating method, a uniform film can be formed over a large area, and the material utilization efficiency is very high, so that the material can be minimized, which is preferable.

  In the present invention, even when the hole transport layer is formed on the entire substrate, it can be disconnected by having a gap in the partition wall. Therefore, the hole transport layer can be applied to the entire surface of the organic EL element forming substrate, and it is not necessary to form a pattern, and can be easily manufactured. Further, another organic light emitting medium layer such as a hole injection layer may be similarly formed by coating the entire surface under the light emitting layer.

  Next, the organic light emitting medium layer 8 is formed by a wet coating method (step (e)). The organic light emitting medium layer may be composed of a light emitting layer alone, or may be composed of a laminated structure such as a light emitting layer and an electron transport layer. In the case of a laminated structure, it is not necessary to form all the layers by the wet coat method, but it is also possible to form all the layers by the wet coat method.

  As the wet coating method, there are coating methods such as a spin coating method, a die coating method, a dip coating method, a discharge coating method, a play coating method, a roll coating method, and a bar coating method. Further, a relief printing method, an ink jet method, or the like may be used. When these methods are used, they can be selectively applied to the pixel portion. For this reason, it is possible to produce an organic EL element capable of color display by printing a light emitting layer that emits light in different colors on each pixel. In addition, even when a light emitting layer or further an organic light emitting medium layer is applied on the barrier ribs as shown in FIG. 1, color separation between adjacent pixels can be prevented because the barrier rib portions are disconnected.

  The main component of the light emitting layer is a light emitting material that emits light when a voltage is applied. Such luminescent materials include 9,10-diarylanthracene derivatives, pyrene, coronene, perylene, rubrene, 1,1,4,4-tetraphenylbutadiene, tris (8-quinolinolato) aluminum complex, tris (4-methyl). -8-quinolinolato) aluminum complex, bis (8-quinolinolato) zinc complex, tris (4-methyl-5-trifluoromethyl-8-quinolinolato) aluminum complex, tris (4-methyl-5-cyano-8-quinolinolato) Aluminum complex, bis (2-methyl-5-trifluoromethyl-8-quinolinolato) [4- (4-cyanophenyl) phenolate] aluminum complex, bis (2-methyl-5-cyano-8-quinolinolato) [4- (4-Cyanophenyl) phenolate] Aluminum , Tris (8-quinolinolato) scandium complex, bis [8- (para-tosyl) aminoquinoline] zinc complex and cadmium complex, 1,2,3,4-tetraphenylcyclopentadiene, pentaphenylcyclopentadiene, poly-2 , 5-diheptyloxy-para-phenylene vinylene and other low molecular weight light emitting materials can be used. Further, coumarin phosphors, perylene phosphors, pyran phosphors, anthrone phosphors, porphyrin phosphors, quinacridone phosphors, N, N′-dialkyl-substituted quinacridone phosphors, naphthalimide phosphors, A material obtained by dispersing a low molecular weight light emitting material such as an N, N′-diaryl-substituted pyrrolopyrrole fluorescent material or a phosphorescent light emitting material such as an Ir complex in a polymer can be used. As the polymer, polystyrene, polymethyl methacrylate, polyvinyl carbazole and the like can be used. Further, it may be a polymer light emitting material such as polyarylene, polyarylene vinylene, polyfluorene, polyparaphenylene vinylene, polythiophene or polyspiro. In addition, a material obtained by dispersing or copolymerizing the low molecular weight material into these high molecular materials, or other existing light emitting materials can be used.

  As the electron transporting layer, 2- (4-bifinylyl) -5- (4-t-butylphenyl) -1,3,4-oxadiazole, 2,5-bis (1-naphthyl) -1, 3,4-oxadiazole, oxadiazole derivatives, bis (10-hydroxybenzo [h] quinolinolato) beryllium complexes, triazole compounds, and the like can be used.

  A paint or ink can be obtained by adding a solvent and necessary additives to the material of each layer. Examples of the solvent include toluene, xylene, acetone, anisole, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, dichloromethane, dichloroethane, chloroform, ethyl acetate, 2-methoxyethanol, 2-ethoxyethanol, 2-butoxyethanol, 2-ethylethoxy. Acetate, 2-butoxyethyl acetate, 2-methoxyethyl ether, 2-ethoxyethyl ether, 2- (2-ethoxyethoxy) ethanol, 2- (2-butoxyethoxy) ethanol, 2- (2′ethoxyethoxy) ethyl acetate , 2- (2-butoxyethoxy) ethyl acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethylene glycol dimethyl Ether, tetrahydrofuran or the like can be used. Among these, aromatic organic solvents such as toluene, xylene, and anisole are preferable from the viewpoint of solubility of the organic light emitting material.

After the organic light emitting medium layer such as the hole transport layer 7 and the light emitting layer 8 is applied, the partition walls 6a and 6b are combined on the non-pixel line which is the gap on the non-pixel portion between the striped anodes. Two partition walls 9 are formed (step (f)). As a method for joining the partition walls, it can be formed by ejecting ink containing the resin into a gap between the partition walls 6a and 6b using an ink jet method and then baking the ink. Or you may transcribe | transfer the ink film of a partition material to a partition part upper part. In any case, it is not necessary to fill all the gaps between the partition walls 6a and 6b as shown in FIG. 1 (f), as long as it is continuous in the vicinity of the upper part of the partition walls and does not cause disconnection when forming the cathode. Satisfy the conditions of the present invention. As a material for forming the coupling portion of the partition wall, an insulating material may be used. For example, a material made of a resin such as acrylic, epoxy, silicone, fluororesin, or polyimide can be used.

  The partition wall 9 in the present invention desirably has a thickness in the range of 0.5 μm to 5.0 μm. For example, in a passive matrix type organic EL element, when a partition is provided between anodes, the cathode layer is formed so as to straddle the partition in order to form the cathode layer by directing the partition. At that time, if the partition walls are too high, disconnection of the cathode layer occurs, resulting in poor display. If the height of the partition wall exceeds 5.0 μm, disconnection of the cathode tends to occur.

  Next, the cathode is formed in a line pattern orthogonal to the line pattern of the anode 2. As the material of the cathode, those according to the light emission characteristics of the organic light emitting layer can be used. For example, simple metals such as lithium, magnesium, calcium, ytterbium and aluminum and alloys of these with stable metals such as gold and silver Etc. Alternatively, a conductive oxide such as indium, zinc, or tin can be used. Examples of the method for forming the cathode layer include a method using a vacuum vapor deposition method using a mask.

  Finally, in order to protect these organic EL constituents from external oxygen and moisture, a glass cap and an adhesive are hermetically sealed to obtain an organic EL element. In the case where the substrate has flexibility, sealing may be performed using a sealing agent and a flexible film.

A configuration example of the organic EL element of the present invention is shown in FIG. The barrier rib has two barrier rib portions that are substantially parallel to the anode line so that no short circuit or leakage current occurs even when the organic functional medium layer, particularly the hole transport layer, is solid-coated. Further, the partition walls are bonded with an insulating material so as not to be disconnected when the cathode is formed. Finally, as shown in FIGS. 3A to 3C, an organic EL element having a partition wall and a partition wall including a coupling portion is obtained. (A) is an organic EL element in which a gap between partition walls is filled with a partition wall material. (B) shows an organic EL device in which the width between the partition walls is small and the partition wall material used for bonding is applied in a lid shape on the partition walls and between the partition walls. (C) shows an organic EL device in which a partition material is formed in a bridge shape between partition portions.

As described above, by using the method for producing an organic EL element of the present invention, a high-quality organic EL element can be produced with no leakage current even when the organic functional layer is coated on the substrate.

Schematic which shows the manufacturing process of the organic EL element by embodiment of this invention Schematic showing the manufacturing process of the partition using positive resist Schematic of the organic EL device of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Anode 3 ... Mask 1
4 ... photosensitive resin layer 5a ... oblique incidence exposure light 1
5b... Oblique incidence exposure light 2
6 ... partition part 6a ... partition part 1
6b ... partition 2
7: hole transport layer 8, 8a-8c ... organic light emitting layer 9 ... partition 10a ... mask 2
10b ... Mask 3
DESCRIPTION OF SYMBOLS 11 ... Vertical exposure light 12 ... Partition photosensitive resin 13 ... Cathode 14 ... Filled coupling | bond part 15 ... Lid-like coupling | bond part 16 ... Bridge-shaped coupling | bond part

Claims (15)

Forming a striped anode pattern on the substrate; forming a partition wall between the anode patterns; forming an organic light emitting medium layer having at least a hole transport layer on the anode pattern; A method of producing an organic EL device having at least a step of forming a cathode pattern in a direction perpendicular to the line of the anode,
In the step of forming the partition wall, the partition wall part 1 and the partition wall part 2 substantially parallel to the anode line are formed,
The step of combining the two partition walls after the step of forming at least the hole transport layer and before the step of forming the cathode pattern among the steps of forming the organic light emitting medium layer,
Further, in the two partition walls, an angle formed between a surface of each opposing partition wall and the substrate is 90 degrees or less on the facing partition wall side. Production method. 2. The method of manufacturing an organic EL element according to claim 1, wherein the minimum value of the width of the two partition walls is 0.2 [mu] m or more. The cross-sectional shape of the partition wall is characterized in that a width of a perpendicular drawn to each substrate from the most protruding point of the wall surface on the partition wall side and the most intruded point is 0.2 μm or more. 2. A method for producing an organic EL device according to 2. 2. The method of manufacturing an organic EL element according to claim 1, wherein an angle formed by a wall surface on the anode side of the partition wall and the substrate is 90 degrees or more on the anode side.   5. The method of manufacturing an organic EL element according to claim 1, wherein, in the step of forming the cathode pattern, the height of the partition wall from the substrate is 0.5 to 5 μm.   6. The organic EL device according to claim 1, wherein in the step of forming the hole transport layer, a working solution containing a hole transport layer material is applied using a slit coating method. Production method. 7. The method of manufacturing an organic EL element according to claim 1, wherein in the step of joining the two partition walls, a coating liquid containing a partition material is applied to a gap between the partition walls. In the step of forming the partition wall, a negative resist is applied onto the substrate, and then parallel exposure light is obliquely incident on the partition wall forming portion through a mask having one opening. The barrier rib portion divided into two barrier rib portions is formed by exposing the resist by obliquely incident parallel exposure light whose incident angle is reversed left and right, and then developing the resist. The manufacturing method of the organic EL element in any one of 1-7. In the step of forming the partition wall, a positive resist is applied on the substrate, then exposed through a mask having an opening in the pattern portion of the anode, and then exposed in the center of the partition wall forming portion. 8. The organic EL element according to claim 1, wherein a partition wall portion divided into two partition wall portions is formed by exposure through a mask having a light transmission portion and subsequent development. Manufacturing method. A line-like anode pattern on the substrate, a partition between the anode patterns, an organic light emitting medium layer having at least a hole transport layer on the anode pattern, and a cathode pattern perpendicularly intersecting the anode line An organic EL element having at least
The organic EL element, wherein the partition wall has two partition wall portions substantially parallel to the line of the anode, and the two partition wall portions are coupled at an upper portion of a gap between at least two partition wall portions.   The organic EL element according to claim 10, wherein a partition wall material is formed on the two partition walls in a lid shape.   The organic EL element according to claim 10, wherein a partition wall material is formed in a bridge shape between the two partition walls. 13. The angle between the surface of each of the facing partition walls and the substrate in the two partition walls is 90 degrees or less on the facing partition wall side. Organic EL element. The method for producing an organic EL element according to any one of claims 10 to 13, wherein an angle formed by a wall surface on the anode side of the partition wall and the substrate is 90 degrees or more on the anode side.   The organic EL element according to claim 10, wherein a height of the partition wall from the substrate is 0.5 to 5 μm.