JP2008231148A - Fixing part gear pair of copying machine, made from heat resistant resin - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pair of gears obtained by combining a gear obtained by improving the compatibility of a resin composition consisting of a PAI (polyamideimide) resin and PAS (polyarylene sulfide) resin to make the compounding by melting and kneading as easy and especially excellent in durability at ≥80 and ≤260°C using temperature and ≥0.5 and ≤80 kgf cm using torque, with a partner gear of which material consists of any of a metal, thermosetting resin or thermoplastic resin. <P>SOLUTION: This pair of gears consists of the gear produced from a resin composition obtained by adding (C) 0.01 pt.wt.-10 pts.wt. episulfide compound to (A) 5 to 60 pts.wt. aromatic polyamideimide resin having 1,000 to 100,000 Mw, weight-average molecular weight and also 0.002 to 0.00002 mol/g amino group contained in its molecule and (B) 95 to 40 pts.wt. polyarylene sulfide resin, and the partner gear of which material consists of any of the metal, thermosetting resin or thermoplastic resin. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a gear pair made of a novel resin composition which is excellent in extrusion moldability and injection moldability, and excellent in heat resistance, fluidity and strength upon melting, toughness and sliding characteristics.

  Aromatic polyamide-imide resin (hereinafter abbreviated as PAI resin) is a plastic material having excellent heat resistance, mechanical strength, electrical properties, chemical resistance, and self-lubricating properties. However, except for varnish and film applications, the melt fluidity is inferior, and most of them are often difficult to injection mold. Therefore, the present situation is that the molding is performed by the compression molding method.

  On the other hand, polyarylene sulfide resins (hereinafter abbreviated as PAS resins) typified by polyphenylene sulfide resins (hereinafter abbreviated as PPS) are excellent in heat resistance, electrical properties, and solvent resistance, and are particularly melt flowable. Is characteristic. It is also known that excellent mechanical strength, rigidity and dimensional stability can be imparted by strengthening with a filler or the like.

  It has been proposed that a resin composition excellent in heat resistance, mechanical strength, and fluidity can be obtained by combining these PAI resin and PAS resin (see Patent Document 1 and Patent Document 2).

  However, even in the above resin composition, the PAI resin and the PAS resin are not well compatibilized, and a material having good melt fluidity, toughness, and mechanical strength after compounding has not been obtained. Therefore, it was unsuitable for uses such as precision molding and thin molding.

Japanese Patent No. 2868043 JP-A-11-293109

  In view of the above-mentioned drawbacks, the object of the present invention is to improve the compatibility with a resin composition comprising a PAI resin and a PAS resin, facilitate compounding by melt-kneading, and use temperature of 80 ° C. or higher and 260 ° C. or lower. , A pair of gears in which a gear having a particularly high durability at a working torque of 0.5 kgf · cm or more and 80 kgf · cm or less and a mating gear made of either a metal, a thermosetting resin or a thermoplastic resin are combined. Is to provide.

  As a result of intensive studies to solve the above problems, the present inventors have found that (A) the weight average molecular weight Mw is 1000 to 100,000, and the amino group contained in the molecule is 0.002 to 0.00002 mol. Resin composition obtained by adding 0.01 to 10 parts by weight of (C) episulfide compound to 5 to 60 parts by weight of aromatic polyamideimide resin / g and 95 to 40 parts by weight of (B) polyarylene sulfide resin. It has been found that the problem can be solved by a gear pair made up of a gear made of the above and a mating gear made of either a metal, a thermosetting resin or a thermoplastic resin.

  According to the present invention, with respect to a resin composition comprising a PAS resin, a PAI resin, and an episulfide compound, the PAI resin uses a gear containing a specific amount of an amino group in the molecule, and the material is a metal. Or by combining with a mating gear made of either a thermosetting resin or a thermoplastic resin, the operating temperature is 80 ° C. or higher and 260 ° C. or lower, and the operating torque is 0.5 kgf · cm or higher and 80 kgf · cm or lower. A gear pair with excellent durability can be provided.

（Ａｒ_１は炭素数６〜１８の２価の芳香族基、Ａｒ_２は炭素数６〜１８の３価の芳香族基、ｎは４〜４００の整数を表す） The aromatic polyamideimide resin as the component (A) is represented by the following general formula.

(Ar ₁ is a bivalent aromatic group having 6 to 18 carbon atoms, Ar ₂ is a trivalent aromatic group having 6 to 18 carbon atoms, and n represents an integer of 4 to 400)

Specific examples of Ar ₁ include the following, but two or more compounds may be mixed and used.

Particularly preferable examples are as follows.

Specific examples of Ar ₂ include the following, but a mixture of two or more compounds can also be used.

  The PAI resin can be produced by, for example, an acid chloride method in which an aromatic diamine and trimellitic anhydride monochloride are polymerized (for example, Japanese Patent Publication No. 46-15513), an isocyanate in which an aromatic diisocyanate and trimellitic anhydride are polymerized. Any known production method such as a direct polymerization method in which an aromatic diamine and trimellitic anhydride are heated to 200 to 250 ° C. (for example, Japanese Patent Publication No. 49-4077). The method can also be used.

  As the PAI resin used in the present invention, those having a weight average molecular weight in terms of PEG using GPC of 1000 to 100,000 can be used. Preferably, the weight average molecular weight in terms of PEG is 1000 to 50000, more preferably 1000 to 30000.

  Moreover, what is 0.002-0.00002 mol / g of amino groups contained in the molecule | numerator of the PAI resin used for this invention as measured by neutralization titration using hydrochloric acid can be used. Preferably, it is 0.0005-0.00002 mol / g.

  The PAS resin as the component (B) used in the resin composition of the present invention is an arylene represented by the formula [—Ar—S—] (wherein —Ar— is an arylene group). It is an aromatic polymer whose main constituent is a sulfide repeating unit. When [-Ar-S-] is defined as 1 mol (repeating unit), the PAS used in the present invention usually has this repeating unit of 50 mol% or more, preferably 70 mol% or more, more preferably 90 mol% or more. It is a polymer to contain. Examples of the arylene group include a p-phenylene group, an m-phenylene group, a substituted phenylene group (the substituent is preferably an alkyl group having 1 to 6 carbon atoms, or a phenyl group), p, p′-di. Examples thereof include a phenylene sulfone group, p, p′-biphenylene group, p, p′-diphenylenecarbonyl group, and naphthylene group. As the PAS resin, polymers having the same arylene group can be preferably used. However, from the viewpoint of processability and heat resistance, a copolymer containing two or more arylene groups can also be used.

  Among these PAS resins, a PPS resin having a repeating unit of p-phenylene sulfide as a main constituent element is particularly preferable because it has excellent processability and is easily industrially available. In addition, polyarylene ketone sulfide, polyarylene ketone ketone sulfide, and the like can be used. Specific examples of the copolymer include a random or block copolymer having a repeating unit of p-phenylene sulfide and a repeating unit of m-phenylene sulfide, a random or block copolymer having a repeating unit of phenylene sulfide and a repeating unit of arylene ketone sulfide, and phenylene sulfide. And a random or block copolymer having a repeating unit of arylene ketone ketone sulfide and a random or block copolymer having a repeating unit of phenylene sulfide and a repeating unit of arylene sulfone sulfide. These PAS resins are preferably crystalline polymers. The PAS resin is preferably a linear polymer from the viewpoint of toughness and strength. Such a PAS resin can be obtained by a known method (for example, Japanese Patent Publication No. 63-33775) in which an alkali metal sulfide and a dihalogen-substituted aromatic compound are subjected to a polymerization reaction in a polar solvent.

  Examples of the alkali metal sulfide include lithium sulfide, sodium sulfide, potassium sulfide, rubidium sulfide, and cesium sulfide. Sodium sulfide produced by reacting NaSH and NaOH in the reaction system can also be used. Examples of the dihalogen-substituted aromatic compound include p-dichlorobenzene, m-dichlorobenzene, 2,5-dichlorotoluene, p-dibromobenzene, 2,6-dichloronaphthalene, 1-methoxy-2,5-dichlorobenzene, 4 , 4'-dichlorobiphenyl, 3,5-dichlorobenzoic acid, p, p'-dichlorodiphenyl ether, 4,4'-dichlorodiphenyl sulfone, 4,4'-dichlorodiphenyl sulfoxide, 4,4'-dichlorodiphenyl ketone, etc. Can be mentioned. These can be used alone or in combination of two or more.

  In order to introduce some branched structure or crosslinked structure into the PAS resin, a small amount of a polyhalogen-substituted aromatic compound having 3 or more halogen substituents per molecule can be used in combination. Preferred examples of the polyhalogen-substituted aromatic compound include 1,2,3-trichlorobenzene, 1,2,3-tribromobenzene, 1,2,4-trichlorobenzene, 1,2,4-tribromobenzene, Examples include trihalogen-substituted aromatic compounds such as 1,3,5-trichlorobenzene, 1,3,5-tribromobenzene, 1,3-dichloro-5-bromobenzene, and alkyl-substituted products thereof. These can be used alone or in combination of two or more. Among these, 1,2,4-trichlorobenzene, 1,3,5-trichlorobenzene, and 1,2,3-trichlorobenzene are more preferable from the viewpoints of economy, reactivity, and physical properties.

  As the polar solvent, N-alkylpyrrolidone such as N-methyl-2-pyrrolidone, 1,3-dialkyl-2-imidazolidinone, tetraalkylurea, aprotic organic amide solvent typified by hexaalkylphosphate triamide, It is preferable because the stability of the reaction system is high and a high molecular weight polymer is easily obtained. The PAS resin used in the present invention has a melt viscosity of usually 10 to 600 Pa · s, preferably 50 to 550 Pa · s, more preferably 70 to 550 Pa · s, measured at a temperature of 310 ° C. and a shear rate of 1200 / sec. is there. When two or more kinds of PAS resins having different melt viscosities are blended and used, it is preferable that the melt viscosity of the blend is in the above range. Further, it is particularly desirable that the PAS resin has a melt viscosity of 100 Pa · s or more from the viewpoint of mechanical strength, toughness, and the like. If the melt viscosity of the PAS resin is too small, physical properties such as mechanical strength and toughness may be insufficient. If the melt viscosity of the PAS resin is too large, the melt fluidity will be insufficient, and the injection moldability and extrusion moldability may be insufficient.

  The PAS resin used in the present invention can be washed after the completion of the polymerization, but is further treated with an aqueous solution containing an acid such as hydrochloric acid or acetic acid, or a water-organic solvent mixed solution, It is preferable to use one that has been treated with a salt solution such as ammonium. In particular, when a PAS resin that has been washed until the pH in a mixed solvent adjusted to acetone: water = 1: 2 (volume ratio) is 8 or less is used, the melt fluidity and mechanical properties of the resin composition are increased. The physical properties can be further improved.

  The PAS resin used in the present invention is desirably a granular material having an average particle diameter of 100 μm or more. If the average particle size of the PAS resin is too small, the feed amount is limited during melt extrusion by the extruder, so the residence time of the resin composition in the extruder becomes long, and problems such as deterioration of the resin composition occur. May occur. Further, it is not desirable in terms of manufacturing efficiency.

  The episulfide compound which is the component (C) used in the present invention is a compound having one or more episulfide groups in the molecule.

（式中、Ｘ_１はそれぞれ独立に水素原子または一般式：Ｅ−Ｒ_２−Ｘ_２−を表し、Ｅはエピスルフィド基またはエポキシ基を表し、エピスルフィド基は分子中に必ず１つ以上含まれる。Ｘ_２はそれぞれ独立に炭素数１〜６の２価の炭化水素基、エーテル結合、チオエーテル結合、ジスルフィド結合、カルボニル結合、エステル結合、アミド結合、または単結合を表す。Ｘ_３はそれぞれ独立に、水素原子または炭素数１〜２４の１価の炭化水素基、ビニル基、水酸基、アミノ基、ウレイド基、イソシアネート基、エピスルフィド基、エポキシ基、又は及びメルカプト基を表す。Ｒ_１はそれぞれ独立に炭素数１〜２４の４価の炭化水素基を表し、Ｒ_２はそれぞれ独立に炭素数１〜２４の２価の炭化水素基を表す。ｎは０以上２０以下の整数を表す。） As the episulfide compound, a compound having the following general formula is preferably used.

(Wherein, X ₁ is each independently a hydrogen atom or a general formula: E-R 2 _-X 2 _- represents, E is represents an episulfide group or an epoxy group, episulfide group is always included one or more in a molecule. X ₂ each independently represents a divalent hydrocarbon group having 1 to 6 carbon atoms, an ether bond, a thioether bond, a disulfide bond, a carbonyl bond, an ester bond, an amide bond, or a single bond, and each X ₃ independently represents R ₁ represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 24 carbon atoms, a vinyl group, a hydroxyl group, an amino group, a ureido group, an isocyanate group, an episulfide group, an epoxy group, or a mercapto group. represents a tetravalent hydrocarbon group having 1 to 24, .n representing a divalent hydrocarbon group having 1 to 24 carbon atoms _{R 2} are each independently 0 to 20 integer Represent.)

  The episulfide compound suitably used in the present invention is exemplified below, but it may be used alone or in combination of two or more. 1-propyl-episulfide, 2-propyl-episulfide, 1-butyl-episulfide, 2-butyl-episulfide, methylthioglycidyl ether, propylthioglycidyl ether, butylthioglycidyl ether, phenylthioglycidyl ether, benzylthioglycidyl ether, 2, 3-episulfide-1-propanol, 2,3-episulfide-1-butanol, 3,4-episulfide-1-butanol, 3,4-episulfide-2-butanol, 4,5-episulfide-1-pentanol, 4 , 5-episulfide-2-pentanol, 5,6-episulfide-1-hexanol, 5,6-episulfide-2-hexanol, bisthioglycidyl sulfide, bisthioglycidyl ether, bisti Glycidyl disulfide, 2-thioglycidyl-1-benzenethiol, bis (2,3-epithiopropyl) sulfide, bis (2,3-epithiopropylthio) methane, 1,2-bis (2,3-epithio) Propylthio) ethane, 1,2-bis (2,3-epithiopropylthio) propane, 1,3-bis (2,3-epithiopropylthio) propane, 1,3-bis (2,3-epi Thiopropylthio) -2-methylpropane, 1,4-bis (2,3-epithiopropylthio) butane, 1,4-bis (2,3epithiopropylthio) -2-methylbutane, 1,3- Bis (2,3-epithiopropylthio) butane, 1,5-bis (2,3-epithiopropylthio) pentane, 1,5-bis (2,3-epithiopropylthio) -3-thiapentane, , 2,3-Tris (2,3-epithiopropylthio) propane, 2,2-bis (2,3-epithiopropylthio) -1,3-bis (2,3-epithiopropylthiomethyl) Propane, 2,2-bis (2,3-epithiopropylthiomethyl) -1- (2,3-epithiopropylthio) butane, 1,5-bis (2,3-epithiopropylthio) -2 -(2,3-epithiopropylthiomethyl) -3-thiapentane, 1,5-bis (2,3-epithiopropylthio) -2,4-bis (2,3-epithiopropylthiomethyl)- 3-thiapentane, 1,1,2,2-tetrakis [{2- (2,3-epithiopropylthio) ethyl} thiomethyl] ethane, 1,3-bis (2,3-epithiopropylthio) cyclohexane, 1,4-bis (2,3-epithio Opropylthio) cyclohexane, 1,3-bis (2,3-epithiopropylthiomethyl) cyclohexane, 1,4-bis (2,3-epithiopropylthiomethyl) cyclohexane, 2,5-bis (2,3- Epithiopropylthiomethyl) -1,4-dithiane, 2,5-bis [{2- (2,3-epithiopropylthio) ethyl} thiomethyl] -1,4-dithiane, 1,3-bis (2 , 3-epithiopropylthio) benzene, 1,4-bis (2,3-epithiopropylthio) benzene, 1,3-bis (2,3-epithiopropylthiomethyl) benzene, 1,4-bis (2,3-epithiopropylthiomethyl) benzene, bis {4- (2,3-epithiopropylthio) phenyl} methane, 2,2-bis {4- (2,3-epithiopropylthio) phenyl Sulfonyl} propane, 4,4'-bis (2,3-epithiopropylthio) biphenyl, and compounds some of episulfide groups of the above compounds by substituting the epoxy groups can be used. More preferably, methylthioglycidyl ether, propylthioglycidyl ether, butylthioglycidyl ether, phenylthioglycidyl ether, benzylthioglycidyl ether, 2,3-episulfide-1-propanol, 2,3-episulfide-1-butanol, 3, 4-episulfide-1-butanol, 3,4-episulfide-2-butanol, bisthioglycidyl sulfide, and bisthioglycidyl ether.

  PAI resin content in this invention is 5-60 weight part with respect to a total of 100 weight part of PAI resin and PAS resin. The PAS resin content in the present invention is 95 to 40 parts by weight with respect to 100 parts by weight of the total of the PAI resin and the PAS resin. The addition amount of the episulfide compound in the present invention is usually 0.01 to 10 parts by weight, preferably 0.01 to 8 parts by weight, more preferably 0.03 to 100 parts by weight with respect to the total of 100 parts by weight of the PAI resin and the PAS resin. 6 parts by weight.

  The resin composition used in the present invention is produced by melt-kneading PAI resin, PAS resin and episulfide compound. The melt kneading temperature is 250 to 400 ° C, preferably 280 to 360 ° C. The kneading method can be carried out with an extruder, a kneader, a Banbury mixer, a mixing roll or the like, but a preferred method is a method using a biaxial extruder.

  The resin composition used in the present invention includes other additives such as fillers, pigments, lubricants, plasticizers, stabilizers, UV agents, flame retardants, flame retardant auxiliary additives, and other resins as desired. Ingredients may be suitably formulated.

  Examples of fillers include glass beads, wollastonite, mica, talc, kaolin, silicon dioxide, clay, asbestos, calcium carbonate, magnesium hydroxide, silica, diatomaceous earth, graphite, carborundum, and molybdenum disulfide. Mineral fillers such as glass fiber, milled fiber, potassium titanate fiber, boron fiber, silicon carbide fiber and the like. The filler can be used in an amount of 1 to 70% by weight of the resin composition. Preferred fillers are glass fiber, milled fiber, carbon fiber, and potassium titanate fiber, and those treated with a silane coupling agent such as urethane or amino can also be suitably used.

  Examples of the pigment include titanium oxide, zinc sulfide, and zinc oxide.

  Representative examples of the lubricant include mineral oil, silicon oil, ethylene wax, polypropylene wax, metal salts such as sodium stearate, metal salts such as sodium montanate, and montanic acid amide.

  Examples of the plasticizer include commonly used silane compounds, phthalic acid compounds such as dimethyl phthalate and dioctyl phthalate, and compounds having an episulfide group. Moreover, generally used ultraviolet absorbers, colorants, and the like can be used.

  Examples of the flame retardant include phosphoric esters such as triphenyl phosphate, brominated compounds such as decabromobiphenyl, pentabromotoluene, and brominated epoxy resin; nitrogen-containing phosphorus compounds such as melamine derivatives, and the like. Flame retardant aids may be used, examples of which include compounds such as antimony, boron and zinc.

  Examples of other resins include polyesters such as epoxy resin, phenoxy resin, polyethylene terephthalate, polybutylene terephthalate, fluororesins such as tetrafluoroethylene, polyphenylene ether, polysulfone, polycarbonate, polyether ketone, polyether Aromatic resins such as imide, polythioetherketone, and polyetheretherketone are listed.

  In the present invention, a resin composition comprising (A) PAI resin, (B) PAS resin and (C) episulfide compound as described above is obtained. The gear can be molded by injection molding or an extruded resin block. Even if it cuts from, resin powder may be compression-molded. In the case of injection molding, the cylinder temperature is preferably in the range of 290 to 360 ° C, and the mold is preferably set to 120 to 160 ° C in order to obtain sufficient heat resistance. Further, it is desirable to perform heat treatment after molding for the purpose of improving heat resistance and removing residual stress. In particular, when molding is performed at a mold temperature lower than 120 ° C., heat treatment is preferable. The method of heat treatment is not particularly limited, and for example, a normal hot air oven, a microwave oven or an oven range is used. The heat treatment temperature may be 150 to 300 ° C., preferably 180 to 280 ° C., most preferably 200 to 260 ° C. for 30 seconds to 48 hours, preferably 1 to 36 hours under normal pressure or reduced pressure.

  The gear of the present invention can be suitably used in any shape such as a spur gear, a bevel gear, a bevel gear, and a worm gear. The gear may be produced by injection molding, by cutting from an injection molded or extruded resin block, or by compression molding resin powder.

  The gear can be used at any temperature, but can be suitably used at -70 ° C or higher, more preferably 80 ° C or higher and 260 ° C or lower. Although the torque of the gear can be used in any region, durability can be suitably exhibited when the torque is preferably 0.5 kgf · cm or more, more preferably 0.5 kgf · cm or more and 80 kgf · cm or less.

  Any material can be used for the mating gear. Examples of mating gear materials include polyamide, polyamideimide, polyimide, polyacetal, polyphenylene ether, polysulfone, polyphenylene sulfide, polycarbonate, polyetherketone, polyetherimide, polythioetherketone, polyetheretherketone, epoxy resin, phenoxy Examples thereof include resins, polyesters such as polyethylene terephthalate and polybutylene terephthalate, fluororesins including tetrafluoroethylene, iron, steel, stainless steel, aluminum, and aluminum alloys.

The material of the mating gear is preferably polyamide, polyamideimide, polyimide, polyacetal, polyphenylene sulfide, polyethylene terephthalate, polybutylene terephthalate, or other polyesters, fluoropolymers such as tetrafluoroethylene, iron, steel, stainless steel, aluminum , Aluminum alloy and the like. More preferable are polyamide, polyamideimide, polyimide, fluororesin such as tetrafluoroethylene, iron, steel, stainless steel, aluminum, and aluminum alloy.

  The present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples. The PAI resin used in the following Examples and Comparative Examples was produced by the following and synthesis examples.

Synthesis example 1
3 L of N-methylpyrrolidone having a water content of 15 ppm was charged into a reactor equipped with a 5 liter stirrer, thermometer, and reflux condenser equipped with a drying tube filled with calcium chloride at the tip. To this was added 555 g (50 mol%) of trimellitic anhydride, and then 503 g (50 mol%) of 2,4-tolylene diisocyanate. The water content in the system when trimellitic anhydride was added was 30 ppm. Initially, 30 minutes from room temperature was required, and the temperature of the contents was 120 ° C., and this temperature was maintained for 8 hours. After completion of the polymerization, the polymerization solution was dropped into methanol having a volume twice that of N-methylpyrrolidone under strong stirring to precipitate a polymer. The precipitated polymer was filtered off with suction, washed thoroughly with methanol, and dried under reduced pressure at 200 ° C. to obtain a polyamideimide resin. When the weight average molecular weight in terms of PEG was measured using GPC, it was Mw = 9000 (solvent dimethylformamide). When the polyamideimide resin was dissolved in dimethylformamide and neutralization titration using hydrochloric acid was performed, the amino group contained in the molecule was 0.0001 mol / g.

Example 1
50 parts by weight of PAI resin produced in Synthesis Example 1, 50 parts by weight of PAS resin (DIC-PPS-LR03 manufactured by Dainippon Ink and Chemicals) and 1.0 part by weight of phenylthioglycidyl ether are blended and biaxially extruded. A resin composition was produced by melting and kneading at 320 ° C. using a machine and pelletizing.
This pellet was injection-molded to obtain a gear having an involute spur gear, a pitch circle diameter of 50 mm, a module 1.0, 50 teeth, a pressure angle of 20 °, and a tooth width of 5 mm. Using this one gear and one SUS304 gear of the same shape as the mating gear, a gear durability test was conducted at a rotation speed of 800 rpm, an atmospheric temperature of 200 ° C., a test time of 168 hrs, and a torque of 10 kgf · cm. The gear durability tester used is shown in FIG. The results are shown in Table 1.

Example 2
Evaluation was made in the same manner as in Example 1 except that aluminum alloy A5054 was used as the counter gear. The results are shown in Table 1.

Example 3
Evaluation was made in the same manner as in Example 1 except that PI resin (Vespel) was used as the counter gear. The results are shown in Table 1.

Example 4
A resin composition was produced in the same manner as in Example 1 except that the gear durability test was performed at an atmospheric temperature of −70 ° C., and the gear durability was evaluated. The results are shown in Table 1.

Example 5
A resin composition was manufactured in the same manner as in Example 1 except that the gear durability test was performed at an atmospheric temperature of 250 ° C., and the gear durability was evaluated. The results are shown in Table 1.

Example 6
A resin composition was produced in the same manner as in Example 1 except that the gear durability test was performed at a test torque of 0.5 kgf · cm, and the gear durability was evaluated. The results are shown in Table 1.

Example 7
A resin composition was produced in the same manner as in Example 1 except that the gear durability test was performed at a test torque of 30 kgf · cm, and the gear durability was evaluated. The results are shown in Table 1.

Comparative Example 1
Resin composition in the same manner as in Example 1 except that 50 parts by weight of PAI resin produced in Synthesis Example 1 and 50 parts by weight of PAS resin (DIC-PPS-LR03 manufactured by Dainippon Ink & Chemicals, Inc.) were blended. Products were manufactured and evaluated. The results are shown in Table 1.

Comparative Example 2
A resin composition was produced and evaluated in the same manner as in Example 1 except that 100 parts by weight of PAS resin (DIC-PPS-LR03, manufactured by Dainippon Ink and Chemicals, Inc.) was extruded and kneaded. The results are shown in Table 1.

Comparative Example 3
Evaluation was performed in the same manner as in Example 1 except that 100 parts by weight of PAS resin (DIC-PPS-LR03, manufactured by Dainippon Ink and Chemicals, Inc.) was extruded and kneaded, and aluminum (A5054) was used as the counter gear. did. The results are shown in Table 1.

  From the above results, with respect to a resin composition comprising a PAS resin, a PAI resin, and an episulfide compound, the PAI resin uses a gear containing a specific amount of an amino group in the molecule and a metal or metal Provides a pair of gears that are particularly durable when used at a temperature of 80 ° C or higher and at a torque of 0.5 kgf / cm or higher by combining with a mating gear made of either thermosetting resin or thermoplastic resin. can do.

表中の記号の説明
ＰＡＩ樹脂：合成例１のＰＡＩ樹脂
ＰＡＳ樹脂：ポリアリーレンスルフィド樹脂
大日本インキ化学工業（株）製 ＤＩＣ−ＰＰＳ−ＬＲ０３
ＥＰＳ化合物：フェニルチオグリシジルエーテル
ＳＵＳ：ＳＵＳ３０４
アルミ：アルミニウムＡ５０５４
ＰＩ：ベスペル

Explanation of symbols in the table PAI resin: PAI resin of Synthesis Example 1 PAS resin: Polyarylene sulfide resin
DIC-PPS-LR03 manufactured by Dainippon Ink & Chemicals, Inc.
EPS compound: phenylthioglycidyl ether SUS: SUS304
Aluminum: Aluminum A5054
PI: Vespel

Gear durability tester.

Explanation of symbols

1. 1. Powder brake 2. Thermostatic bath 3. Hot air / cold air generator Motor 5. 5. Drive gear Driven gear

Claims (9)

(A) 5 to 60 parts by weight of an aromatic polyamideimide resin having a weight average molecular weight Mw of 1,000 to 100,000 and an amino group contained in the molecule of 0.002 to 0.00002 mol / g, and (B) A gear made of a resin composition obtained by adding 0.01 to 10 parts by weight of (C) an episulfide compound to 95 to 40 parts by weight of a polyarylene sulfide resin, and the material is a metal, a thermosetting resin, or a thermoplastic resin A gear pair consisting of a mating gear consisting of The gear pair according to claim 1, wherein the compound (C) is represented by the following general formula.

(Wherein, X ₁ is each independently a hydrogen atom or a general formula: E-R 2 _-X 2 _- represents, E is represents an episulfide group or an epoxy group, episulfide group is always included one or more in a molecule. X ₂ each independently represents a divalent hydrocarbon group having 1 to 6 carbon atoms, an ether bond, a thioether bond, a disulfide bond, a carbonyl bond, an ester bond, an amide bond, or a single bond, and each X ₃ independently represents A hydrogen atom or a monovalent hydrocarbon group having 1 to 24 carbon atoms, a vinyl group, a hydroxyl group, an amino group, a ureido group, an isocyanate group, an episulfide group, an epoxy group, or a mercapto group, each R ₁ independently represents a carbon number. represents a tetravalent hydrocarbon group having 1 to 24, the table a .n is 0 to 20 integer representing a divalent hydrocarbon group having 1 to 24 carbon atoms, each _{R 2} is independently .) The gear pair according to claim 1, wherein the operating temperature is 80 ° C. or higher and 260 ° C. or lower. The gear pair according to claim 1, wherein the operating torque is 0.5 kgf · cm or more and 80 kgf · cm or less. The gear pair according to claim 1, wherein the counter gear is a thermoplastic resin. The gear pair according to claim 5, wherein the thermoplastic resin is selected from the group consisting of polyamideimide, polyamide, polyimide, or a composite material containing them. The gear pair according to claim 1, wherein the counter gear is a metal. The gear pair according to claim 7, wherein the metal of the counter gear is iron or an alloy containing iron. The gear pair according to claim 7, wherein the metal of the counter gear is aluminum or an alloy containing aluminum.

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