JP2008226466A - Tool for ic, ic socket and ic - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tool for an IC capable of easily separating the IC from an IC socket. <P>SOLUTION: When installing the tool 100A for the IC in the IC socket 200A in a fixed state where a reed contact part 233b of the IC socket 200A presses a contact part 323 in a reed 320 of the IC 300 in an installation completed position to a contact regulating part 222, a pushing-down part 130 of the tool 100A for the IC moves downward along an outside surface of a fixing guide 220, and a lever part 233a of a contact 230 is pushed downward, and slidingly moves the IC 300 released from pressing force by the reed contact part 233b of the contact 230, and transfers to a temporary holding position of positioning the reed 320 to a reed standby space part being an upper space of a reed standby part 221. When removing the tool 100A for the IC from the IC socket 200A, the IC 300 with an upper surface 311 stuck to an IC holder 140, is also removed from the IC socket 200A together with the tool 100A for the IC. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an IC jig suitable for removing an IC used for a computer, a game table, etc. from an IC socket, an IC socket to which the IC jig can be applied, and an IC that can be mounted on the IC socket. It is.

  Conventionally, an IC used for a computer or a game machine (slot machine or pachinko machine) encloses a silicon chip on which a semiconductor integrated circuit is formed in a package such as a resin, and externally connects a plurality of leads as connection terminals. A DIP type is widely known in which exposed pins are inserted into a package and aligned on two opposite sides. In general, a method is employed in which an IC is detachably attached to an IC socket provided on the substrate and connected to a circuit element provided on the substrate without directly attaching the IC to the substrate. A silicon chip may be called an IC, LSI, VLSI, or VLSI depending on the number of transistors (integration degree), but is hereinafter collectively referred to as an IC regardless of the degree of integration.

  As described above, when the circuit element on the substrate and the IC are connected via the substrate wiring and the IC socket, it is necessary that the IC is appropriately mounted on the IC socket without causing a contact failure. In order to achieve a good contact state between the IC lead and the IC socket contact, for example, the lever part provided on the elastic metal contact is pushed down by the pressing part of the IC package mounting jig, and the contact contact part When the IC is slid so that the IC lead is positioned in this gap, and the IC package mounting jig is removed in this state, the contact lever part is released from the pressing force. A structure in which the contact portion of the contact is elastically restored so that the contact portion of the contact is pressed against the support portion of the housing and the IC lead is sandwiched between the contact of the IC socket and the support portion of the housing is proposed. (For example, refer to Patent Document 1).

JP 2002-198138 A

  However, the invention described in Patent Document 1 does not consider the convenience in removing the IC package from the IC socket when rewriting information in the IC. That is, even if the IC package mounting jig is used to release the IC socket contact pressure and the IC package is slid in the direction of removal, and the IC package mounting jig is removed, the IC package remains in the IC socket. The IC package has to be taken out of the IC socket by using an IC-only clip tool, and the work efficiency is poor.

  In view of the above problems, an object of the present invention is to provide an IC jig, an IC socket, and an IC that can easily separate an IC from an IC socket.

  In order to solve the above-mentioned problem, the invention according to claim 1 is an IC jig capable of removing an IC mounted on an IC socket, and is removed from the IC socket through a temporary holding position from a mounting completion position. A holding means for holding the IC so that it can be removed from the IC socket when the enabled IC is in the temporary holding position is provided.

  The invention according to claim 2 is the IC jig according to claim 1, wherein the IC socket having a fixing means for fixing the IC at the mounting completion position is released from the fixing by the fixing means, There is provided a fixing release means for enabling the IC to be moved from the mounting completion position to the temporary holding position.

  According to a third aspect of the present invention, in the IC jig according to the first aspect, the lever portions respectively provided on the respective contacts that come into contact with the respective leads of the IC at the mounting completion position are contacted from above. A pressing part to be pressed down is provided, and the pressing part presses down the lever part of each contact, thereby elastically deforming each contact of the IC socket, and pressing the lead of the IC against the contact restricting part from below. The lead contact portion of each contact to be fixed is moved downward, the lead of each IC is released, and the IC can be moved from the mounting completion position to the temporary holding position.

  According to a fourth aspect of the present invention, there is provided the IC jig according to the first aspect, wherein the IC is in a temporary holding position in which leads are respectively positioned above the lead contact portions provided in the respective contacts of the IC socket. On the other hand, with respect to the IC socket provided with lead push-down means for pushing down each lead from above and making it fixed at the mounting completion position where it is brought into contact with the lead contact portion of each contact, fixing for releasing the lead from the lead push-down means A release means is provided, and the IC is returned from the installation completion position to the temporary holding position by releasing the fixation of each lead by the lead push-down means of the IC socket by the fixation release means. To do.

  Further, the invention according to claim 5 is an IC socket to which an IC can be attached and detached, and the IC can be removed from a mounting completion position through a temporary holding position, and fixing means for fixing the IC at the mounting completion position. It is provided.

  According to a sixth aspect of the present invention, in the IC socket according to the fifth aspect of the present invention, a main body base including an IC placement surface on which a bottom surface of the main body package of the IC is mounted, and each lead of the IC provided on the main body base, A contact that is disposed on one end of the contact and that is attached to the substrate, and a lead contact that is provided on the other end and is capable of contacting the lead from below. And a lever portion that is provided on the other end side of the lead contact portion and is elastically deformed so as to move the lead contact portion downward by being pressed downward. A contact restricting portion that is provided corresponding to the lead contact portion of each contact, and that restricts the lead contacted from below to move upward, and each lead of the IC. Lead introduction that occurs between each lead contact portion and each contact restriction portion by pressing the lever portion of each contact from the temporary holding position in the lead standby portion formed between adjacent contact restriction portions Each lead contact portion that has been elastically restored to its normal state by moving the IC to the mounting completion position where each lead of the IC is located in the possible empty portion and releasing the pressing force on the lever portion of each contact lowers each lead The IC can be fixed so that it does not easily move from the mounting completion position to the temporary holding position by pressing the contact restricting portion from each position.

  According to a seventh aspect of the present invention, in the IC socket according to the fifth aspect of the present invention, a main body base having an IC placement surface on which a bottom surface of the main body package of the IC is mounted, and provided on the main body base, And a contact that is provided on one end side and attached to the substrate, and a lead that is provided on the other end side and that can contact the depressed lead. A lead that is fixed to the main body base at a mounting completion position in which each lead of the IC placed on the IC placement surface is pushed down from above and brought into contact with the lead contact portion of each contact. Push-down means is provided, and each lead of the IC is pushed down from the temporary holding position above the lead contact portion of each contact by the lead-down means. Characterized in that at Rukoto and be fixed at the mounting completion position in contact with the lead contact portion of each contact.

  The invention according to claim 8 is characterized in that in the IC socket according to any one of claims 5 to 7, urging means for urging the IC upward is provided.

  The invention according to claim 9 is an IC socket to which an IC can be attached and detached, wherein the IC can be removed from a mounting completion position through a temporary holding position, and an IC mounting surface on which the bottom surface of the main body package of the IC is mounted. The main body base includes an end wall that rises up to face the non-lead side surface of the main body package of the IC, and the end wall has a notch portion that extends from the protruding upper edge toward the IC mounting surface. It is characterized by.

  According to a tenth aspect of the present invention, in the IC socket according to the ninth aspect, the deepest position of the notch provided in the end wall is the IC mounting surface.

  The invention according to claim 11 is the IC socket according to claim 9 or claim 10, further comprising contacts provided on the main body base and arranged to come into contact with the leads of the IC, respectively. Is provided on one end side, and is provided on the other end side with respect to the lead contact portion provided on the other end side, provided on the other end side, and on the other end side with respect to the lead contact portion. A lever portion that is elastically deformed so as to move the lead contact portion downward by being pressed downward, and the main body base is provided corresponding to the lead contact portion of each contact. Provided with a contact restricting part that restricts the lead that has contacted from below to move upward, and each lead of the IC is a lead standby part formed between adjacent contact restricting parts From the temporary holding position, to the mounting completion position where each lead of the IC is positioned to the lead-introducible empty space generated between each lead contact portion and each contact restriction portion by pressing the lever portion of each contact By moving the IC and releasing the pressing force on the lever portion of each contact, each lead contact portion elastically returned to the normal state presses each lead from below to each contact restricting portion, so that the IC is removed from the mounting completion position. It is characterized in that it can be fixed so as not to easily move to the temporary holding position.

  The invention according to claim 12 is the IC socket according to claim 9 or claim 10, further comprising a contact provided on the main body base and spaced apart below each lead of the IC. Is provided with a substrate contact portion which is provided on one end side and is attached to the substrate, and a lead contact portion which is provided on the other end side and which can be brought into contact with the depressed lead. There is provided lead pressing means for pressing down each lead of the IC placed on the mounting surface from above and fixing it at the mounting completion position where it is brought into contact with the lead contact portion of each contact, and each lead of the IC is connected to the lead of each contact From the temporary holding position above the contact portion, each lead of the IC is pushed down by the lead push-down means to be brought into contact with the lead contact portion of each contact. Characterized in that so as to fix in position.

  According to a thirteenth aspect of the present invention, there is provided an IC that can be attached to and detached from an IC socket, and can be removed from the IC socket mounting completion position through a temporary holding position, and is attached upward from the IC mounting surface of the IC socket. An urging means for urging is provided.

  According to a fourteenth aspect of the present invention, there is provided an IC detachable from the IC socket, which can be removed from the IC socket mounting completion position through a temporary holding position, at least below the lead forming side surface of the main body package of the IC. When each lead protruding in the direction is in a temporary holding state on the lead standby portion provided in the IC socket, the lead non-formation side surface of the main body package of the IC protrudes higher than the end wall of the IC socket. Thus, the length of each lead is set as described above.

  According to the present invention, by using an IC jig, it is possible to improve work efficiency for removing an IC from an IC socket.

  Hereinafter, embodiments of an IC jig 100, an IC socket 200, and an IC 300 according to the present invention will be described in detail with reference to the accompanying drawings.

<First Embodiment of IC Jig>
FIG. 1 is a perspective view of an IC jig 100A according to the first embodiment. 2A is a side view of the IC jig 100A, and FIG. 2B is converted into a detachable state in which the IC jig 100A can be attached to or detached from the IC socket 200 (detailed later). 2 (c) is a plan view of the IC jig 100A, FIG. 2 (d) is a bottom view of the IC jig 100A, and FIG. 2 (e) is an EE arrow in FIG. 2 (c). FIG.

  The IC jig 100A is attached to the IC socket 200 provided on the substrate so as to be covered from above, so that the IC 300 can be converted into a fixed state and a temporary holding state. A structure suitable for removing the IC 300 from the device is provided. Although there is no restriction that the IC 300 must be removed upward from the IC socket 200, from the viewpoint of workability and safety, the substrate is usually placed in a substantially horizontal direction with the IC mounting surface of the IC socket 200 facing upward. The IC 300 is attached to the IC socket 200 so as to be dropped from above, and the attachment / detachment operation is performed such that the IC 300 is lifted and removed from the IC socket 200 upward. That is, when removing the IC 300 from the IC socket 200, the IC 300 must be lifted against gravity. Therefore, the IC 300 must be taken out from the IC socket 200 by picking it with a fingertip or using a dedicated IC clip. Since workability has been impaired, the IC jig 100A has a function suitable for removing the IC 300 from the socket 200.

  The IC jig 100A formed of non-conductive resin or the like is provided with a pair of engaging / disengaging members 120 facing a body member 110 having a required shape that can be covered from above so as to cover the IC socket 200, and a bearing portion. When a finger or the like is put on the operation portion 122 of the engagement / disengagement member 120 that is rotatably held by the main body member 110 via 121, the operation portions 122 of the engagement / disengagement members 120 are rotated so as to approach each other ( 2B), the locking portion 123 including the locking piece 123a locked to the required portion of the IC socket 200 is removed from the locking position, and the IC jig 100A is attached to the IC socket 200. Conversely, the IC jig 100A can be removed from the IC socket 200. The engaging / disengaging member 120 is urged in a direction in which the operation units 122 are separated from each other by urging means (not shown), and normally maintains the state shown in FIG.

  The main body member 110 of the IC jig 100A is provided with an upper plate portion 111 covering the upper surface side of the IC 300 placed on the IC socket 200, and a side (a pair of engaging / disengaging members 120) of the upper plate portion 111. And a pair of side plate portions 112 extending downward from the side (not side). An operation opening 111a penetrating vertically is provided at an appropriate position of the upper plate portion 111, and a pressing portion 130 extending further downward is provided on the lower surface of each side plate portion 112.

  Therefore, an IC holder 140 is provided on the lower surface side of an appropriate position of the upper plate portion 111 (for example, the non-opening region 111b where the operation opening 111a is not provided) (for example, FIGS. 2D and 2E). See). The IC holder 140 is formed of rubber having adhesiveness and plasticity. When the substantially flat upper surface 311 of the main body package 310 of the IC 300 comes into contact with the lower surface of the IC holder 140, the IC 300 has its own weight due to its viscosity. When a holding force that does not peel off occurs and the IC jig 100 is removed from the IC socket 200, the IC 300 is held by the IC jig 100A and removed from the IC socket 200 (FIGS. 3A and 3B). )).

  As described above, when the IC jig 100A according to the present embodiment is used, the lead 320 (for example, the side extending portion 321 and the downward extending portion 322) extending from the lead forming side surface 312 in the main body package 310 of the IC 300 is used. The IC 300 can be easily removed from the IC socket 200 without touching the contact portion 323), and the work for removing the IC 300 from the IC socket 200 can be performed efficiently. That is, in the present embodiment, the IC holder 140 functions as a holding unit that holds the IC 300 so that it can be removed from the IC socket 200.

  The IC 300 held by the IC holder 140 of the IC jig 100A can be peeled from the IC holder 140 by, for example, pressing down the upper surface 311 of the main body package 310 with a fingertip inserted from the operation opening 111a. . The IC jig 100A may be used not only to remove the IC 300 from the IC socket 200 but also to attach the IC 300 to the IC socket 200.

<First Embodiment of IC Socket>
Next, the IC socket 200A according to the first embodiment will be described. FIG. 4 is a perspective view of the IC socket 200A. 5A is a plan view of the IC socket 200A, FIG. 5B is a cross-sectional view taken along the line BB in FIG. 5A, and FIG. 5C is a view taken along the line CC in FIG. It is sectional drawing. This IC socket 200A has a fixing means for fixing the IC 300 in this state when the IC 300 moves to the mounting completion position through the temporary holding position. By the IC jig 100A according to the first embodiment described above, The structure is such that the fixed state can be released.

  The IC socket 200A has an IC mounting surface 211 on the main body base 210, and when the bottom surface 313 of the main body package 310 of the IC 300 is mounted on the IC mounting surface 211, the IC socket 200A has two sides on which the respective leads 320 of the IC 300 are arranged. An adhering guide 220 is provided. The adhering guide 220 has lead standby portions 221 formed at substantially the same intervals as the arrangement intervals of the leads 320. Each lead standby empty portion 221a, which is a space above the lead standby portion 221, The state where the contact portion 323 of the lead 320 is located is the temporary holding position of the IC 300. In the IC socket 200 </ b> A of the present embodiment, when the IC 300 is placed on the placement surface 211, the contact portion 323 of each lead 320 is generally placed on the flat upper end surface of the lead standby portion 221.

  Further, the adhering guide 220 is formed with a contact restricting portion 222 protruding inward (on the IC mounting surface 211 side) between the adjacent lead waiting portions 221, and the lead waiting empty portion 221 a is partitioned by each contact restricting portion 222. As a result, each lead 320 of the IC 300 is guided to each lead standby space 211a and properly positioned to the temporary holding position.

  Thus, by adjusting the height difference between the lower end surface formation position of each contact restricting portion 222 and the upper end surface formation position of the lead standby portion 221 to be equal to or greater than the thickness of the contact portion 323 of the lead 320 in the IC 300. Then, the IC 300 in the temporary holding position can be slid in a predetermined direction to shift the contact portion 323 of each lead 320 to the mounting completion position located below each contact restriction portion 222. Note that guides are provided on both side edges of the IC mounting surface 211 so that the IC 300 can be smoothly slid in order to move the IC 300 from the temporary holding position to the mounting completion position or from the mounting completion position to the temporary holding position. A wall 212 is provided. The height of the guide wall 212 is not particularly limited, but is limited to a height that does not hit the laterally extending portion 321 of the lead 320 at least when the IC 300 is placed on the IC placement surface 211. Keep it.

  In addition, the IC socket 200A according to the present embodiment is provided on the upper sides of the first end wall 240 and the second end wall 250 respectively corresponding to the lead non-formation side surfaces 314 of the IC 300 on which the IC mounting surface 211 is mounted, and outwardly. The locking receiving convex portions 241 and 251 that protrude are provided, and the locking pieces 123a provided on the locking portion 123 of the locking member 120 of the IC jig 100A described above are the first and second end walls 240 and 250. The IC jig 200A can be attached to an appropriate position of the IC socket 200A (see FIGS. 6A and 6B). Further, the first end wall 240 is provided with a mounting position restricting protrusion 242 that protrudes inward, and slides until the non-lead forming side surface 314 of the IC 300 contacts the mounting position restricting protrusion 242 of the first end wall 240. As a result, all the leads 320 are positioned in a state corresponding to the arrangement site of the contacts 230 (see FIG. 7).

  As described above, when the IC 300 is moved from the temporary holding position to the mounting completion position, the IC 300 is fixed to the IC socket 200A and is electrically connected to the wiring on the substrate on which the IC socket 200A is mounted. Metal contacts 230 are provided in correspondence with the respective contact restricting portions 222. In this embodiment, the IC 300 is mounted at the mounting completion position by the arrangement structure of the contacts 230 and the contact restricting portion 222 of the fixing guide 220. The function of the fixing means for fixing is realized.

  The contact 230 is formed by forming an elastic metal member in a substantially U shape. For example, the contact 230 is formed at the end of the lower lead-out portion 232 that bends outward from the lower edge of the upright portion 231 arranged in the vertical direction. A substrate contact portion 232a attached to the substrate is provided, and a lever portion 233a protruding from the outer surface of the fixing guide 220 is provided at the end of the upper lead-out portion 233 that bends outward from the upper edge of the upright portion 231. A lead contact portion 233b that protrudes upward in an arc shape and presses against the lower surface of the contact restricting portion 222 is provided inside the portion 233a, and a deformation buffer portion 233c that protrudes downward in an arc shape is provided inside the lead contact portion 233b. . The deformation buffer portion 233c facilitates elastic deformation in which the lever portion 233a and the lead contact portion 233b move downward when the lever portion 233a is pressed downward, and the pressing force on the lever portion 233a is released. Sometimes, the lever portion 233a and the lead contact portion 233b are moved upward to quickly return to the normal state.

  The IC 300 placed in the temporary holding position with respect to the IC socket 200A including the contact 230 configured as described above is completely mounted because the lead contact portion 233b of the contact 230 is in contact with the lower surface of the contact restricting portion 222. Cannot slide to position. However, when the IC jig 100A is attached to the IC socket 200A, the pressing portions 130 respectively provided on the both side plate portions 112 move downward along the outer surface of the fixing guide 220, and the lever portions 233a in all the contacts 230 are moved. At the same time, the locking piece 123a provided on the locking portion 123 of the IC jig 100A is engaged with the lower surfaces of the locking receiving projections 241 and 251 of the first and second end walls 240 and 250. By being stopped, it is possible to maintain a state where an introductible void is generated between the lower surface of each contact restricting portion 222 and the lead contact portion 233b of the contact 230. Therefore, if the IC jig 100A is mounted on the IC socket 200A, the IC 300 can be freely moved to the temporary holding position and the mounting completion position. The IC jig 100A described above is the IC 300 by the fixing means of the IC socket 200A. It has a function as a fixing release means for releasing the fixing.

  That is, with the IC 300 placed in a temporary holding position with respect to the IC socket 200A, the IC jig 100A is mounted on the IC socket 200A, the IC 300 is slid to move to the mounting completion position, and then the IC jig. If 100A is removed, the pressing force applied to the lever portion 233a of the contact 230 by the pressing portion 130 is eliminated, so that the lead contact portion 233b is connected to the lead 320 as the lever portion 233a and the lead contact portion 233b return to the normal state. Since the lower surface of the contact portion 323 is pressed and pressed against the lower surface of the contact restricting portion 222, a good electrical conduction state between the lead 320 and the contact 230 can be obtained, and the IC 300 easily shifts from the mounting completion position to the temporary holding position. Can be fixed so as not to.

  Further, with the IC 300 fixed to the IC socket 200A at the mounting completion position, the IC jig 100A is mounted on the IC socket 200A, and the IC 300 is slid to move to the temporary holding position. When the tool 100A is removed, the main body package 310 of the IC 300 is held on the lower surface of the IC holder 140 of the IC jig 100A and is removed from the IC socket 200. Therefore, if the IC jig 100A is used, the IC 300 can be easily released from the IC socket 200A, and the IC 300 can be removed from the IC socket 200A, so that the IC 300 can be removed very efficiently.

  When the IC jig 100A is attached to the IC socket 200A, the IC 300 is held by the IC holder 140. However, since the IC holder 140 is formed of a plastic material, the temporary holding position and the attachment are completed. The IC holder 140 does not become an obstacle as long as the IC 300 is slid between the positions.

<Second Embodiment of IC Jig>
The IC jig 100A described above uses the adhesive IC holder 140 as a holding means for holding the IC 300, but the holding means is not limited to this structure. Next, an IC jig 100B according to a second embodiment that employs the suction cup member 150 as a holding means will be described. 8A is a perspective view of an IC jig 100B according to the second embodiment, FIG. 8B is a plan view of the IC jig 100B, and FIG. 8C is a bottom view of the IC jig 100B. It is. 9A is a cross-sectional view taken along arrow IXA-IXA in FIG. 8B, FIG. 9B is a schematic cross-sectional view of the state in which the suction cup member 150 is pressed from the state of FIG. 9A, and FIG. ) Is a schematic cross-sectional view of the state in which the IC 300 is held by the suction cup member 150.

  In the IC jig 100B according to the present embodiment, the same structure as the IC jig 100A according to the first embodiment described above is denoted by the same reference numeral, and the description thereof is omitted. Further, the IC jig 100B according to the present embodiment can be attached to and detached from the IC 300 by being mounted on the IC socket 200A described above.

  The suction cup member 150 in the IC jig 100 </ b> B forms a suction cup portion 152 that expands in the lower part of a cylindrical lifting / lowering portion 151 having a through hole 151 a in the vertical direction, and is a guide established in the upper plate portion 111 in the main body member 110. An elevating part 151 is arranged in the hole 113 so as to be movable up and down, and the suction cup part 152 is positioned on the lower surface side of the upper plate part 111. The length of the lifting / lowering portion 151 of the suction cup member 150 is set to be appropriately longer than the thickness of the upper plate portion 111, and when the suction cup portion 152 is disposed close to the lower surface of the upper plate portion 111, Since the elevating part 151 is in a protruding state, a coil spring 154 as an urging member is fitted on the outer periphery of the elevating part 151 protruding from the upper plate part 111, and the retaining pressing part 155 having a larger diameter than the elevating part 151. Is attached to the upper end of the elevating part 151.

  In the thus configured IC jig 100B, due to the elasticity of the coil spring 154, the retaining pressing part 155 provided at the upper end of the elevating part 151 is pushed up away from the upper surface of the upper plate part 111, and the guide hole 113 A state where the suction cup portion 152 having a diameter larger than the opening diameter is in contact with the bottom surface of the upper plate portion 111 is a normal state (see FIG. 9A). The retaining pressing portion 155 is provided with a connecting opening 155a that communicates with the through hole 151a of the elevating portion 151, and a through hole that penetrates in the vertical direction to the central opening 152a of the suction cup portion 152 is formed.

  Further, when the upper end of the retaining pressing portion 155 is pushed downward against the elasticity of the coil spring 154, the elevating portion 151 moves downward (see FIG. 9B), and the suction cup portion provided at the lower end thereof 152 also moves downward. That is, the IC jig 100B is mounted on the IC socket 200A, and the suction cup portion 152 can be lowered toward the upper surface 311 of the IC 300 at the temporary holding position. At this time, when the connection opening 155a of the retaining pressing portion 155 is pressed so as to be blocked by the tip of the fingertip, the upper end side of the through hole 151a is closed, and the suction cup portion 152 can be adsorbed to the upper surface 311 of the IC 300. Then (see FIG. 9C), the IC 300 can be easily removed from the IC socket 200A by the IC jig 100B.

  Moreover, by simply releasing the finger from the retaining pressing portion 155, the suction force of the IC 300 by the suction cup portion 152 disappears, and the IC 300 can be removed from the IC jig 100B. Since the IC 300 does not need to be peeled off against the viscosity of the IC holder 140 as in the jig 100A, the convenience in removing the IC 300 can be further enhanced.

<Third Embodiment of IC Jig>
Next, an IC jig 100C according to the third embodiment will be described. The IC jig 100C is attached to the IC socket 200B according to the second embodiment (which will be described in detail later) that fixes the IC 300 in the mounting completion state by a fixing means different from the IC socket 200A according to the first embodiment described above. It has a fixing release means that can easily release this fixed state. 10A is a perspective view of an IC jig 100C according to the third embodiment, FIG. 10B is a cross-sectional view taken along the line BB in FIG. 10A, and FIG. 10C1 is an IC in a normal state. FIG. 10C2 is a bottom view of the IC jig 100C in a fixed release state.

  The IC jig 100 </ b> C according to the third embodiment is provided with a fixing release member 160 on two opposite sides of the main body member 110 (side corresponding to the non-lead forming side surface 314 of the IC 300). Reference numeral 160 denotes an operation arm portion 162 that extends downward from the outer end of the slide arm portion 161 that enters and exits from the main body member 110, and a pair of release protrusions 163 are provided on the inner surface side of the lower portion of each operation arm portion 162. Thus, normally, the slide arm portion 161 of the fixing release member 160 is urged by an urging mechanism (not shown) so as to protrude most from the main body member 110 (see FIG. 10C1). When the operation arm portion 162 of both the fixing release members 160 is pressed against the urging force, the slide arm portion 161 enters the main body member 110. Accordingly, each operation arm portion 1 Release projection 163 which is provided to 1 is normal state closer together than at (see Figure 10 (c2)). When the pressing force applied to the fixing release member 160 is released, the fixing release member 160 returns to the normal state, and the release protrusions 163 are separated from each other.

  Further, in the IC jig 100C, the IC holder 140 provided on the bottom surface of the main body member 110 is attached to the lower surface of each operation arm portion 162 in a state where the IC holder 140 is in contact with the upper surface 311 of the IC 300 attached to the IC socket 200B. The thickness of the IC holder 140 and the length of the operation arm portion 162 are set so that the provided release protrusion 163 is positioned on the outer surface side of the outer wall of the IC socket 200B.

<Second Embodiment of IC Socket>
Next, an IC socket 200B according to the second embodiment will be described. 11A1 is a plan view of the IC socket 200B in the lead non-fixed state, FIG. 11A2 is a side view of the IC socket 200B in the lead non-fixed state, and FIG. 11B1 is an IC in the lead fixed state. FIG. 11B2 is a plan view of the socket 200B, and FIG. 11B2 is a side view of the IC socket 200B in a fixed lead state. 12A1 is a plan view of the IC socket 200B in the lead non-fixed state and the IC 300 in the temporary holding position, and FIG. 11A2 is a side view of the IC socket 200B in the lead non-fixed state and the IC 300 in the temporary holding position. FIG. 11B1 is a plan view of the IC socket 200B in the lead fixed state and the IC 300 shifted to the mounting completion position, and FIG. 11B2 is the IC socket 200B in the lead fixed state and the IC 300 shifted to the mounting completion position. FIG.

  The IC socket 200B corresponds to a pair of guide walls 212 corresponding to the lead forming side surface 312 of the IC 300 and a lead non-forming side surface 314 of the IC 300 with respect to the four sides of the IC mounting surface 211 on which the IC 300 is mounted on the main body base 210. By providing the pair of end guide walls 213, the IC 300 is properly positioned when the IC 300 is placed on the IC placement surface 211, and at a temporary holding position where the lead contact portion 233b of the contact 230 ′ is positioned appropriately below each lead 320. The IC 300 can be held. The contact 230 'has substantially the same structure as the contact 230 of the IC socket 200A according to the first embodiment described above, but does not need to be elastically deformed greatly, and thus does not include the lever portion 233a and the deformation buffer portion 233c. .

  In addition, an outer wall 260 is provided outside each end guide wall 213 in the IC socket 200B, and a pair of lead push-down members 270 are rotatably supported by the pair of outer walls 260. Each lead push-down member 270 is biased by a biasing means (not shown), and in a normal state, the lead push-down member 270 is not fixed to the lead that is away from the lead contact portion 233b of the contact 230 ′ in which the lead push-down portion 271 is aligned. Although the state is maintained (see FIGS. 11A1 and 11A2), when the lead pressing members 270 are rotated so as to approach each other against this urging force, each lead pressing portion 271 is all It is converted into a fixed lead state close to the upper side of the lead contact portion 233b of the contact 230 ′ (see FIGS. 11B1 and 11B2).

  Therefore, the IC 300 placed on the IC socket 200B in the lead non-fixed state away from the lead contact portion 233b of the contact 230 ′ in which the lead push-down portion 271 is aligned is held in the temporary holding position (FIG. 12 ( a1) and (a2)), when the IC socket 200B is converted to the lead fixed state, each lead push-down portion 271 is pressed from above, so that the contact portions 323 of all the leads 320 of the IC 300 are pushed down. Then, the position shifts to the mounting completion position in contact with the lead contact portion 233b of each contact 230 ′ (see FIGS. 12B1 and 12B2). Since each contact 230 ′ is made of an elastic metal, the lead contact portion 233 b is also gently bent and pushed down according to the pressed state of the lead 320 pushed down by the lead push-down portion 271, and the lead 320 and the contact 230 are pushed down. 'Can be kept in a good conduction state.

  Further, when the push-down member 270 is converted from the lead non-fixed state to the lead-fixed state, the engagement protrusion 272a provided on the end edge of the rotating arm portion 272 of the push-down member 270 is the engagement receiver opened on the outer wall 260. This state is maintained by being caught on the opening edge of the hole 261. In other words, in the IC socket 200B according to the present embodiment, the push-down member 270 is “at the mounting completion position where each lead of the IC placed on the IC placement surface is pushed down and brought into contact with the lead contact portion of each contact. It functions as “lead pressing means for fixing”.

  In the IC socket 200B holding the lead fixed state, the engagement protrusion 272a of the push-down member 270 protrudes from the inner surface side of the outer wall 260 to the opening edge of the engagement receiving hole 261, and the engagement state is maintained. Therefore, when the engagement protrusion 272a is pressed inward from the outer surface side of the outer wall 260, the engagement protrusion 272a is disengaged from the opening edge of the engagement receiving hole 261, so that the push-down member 270 is returned by the urging means. To convert to a lead non-fixed state.

  Therefore, the release protrusion 163 provided on the fixation release member 160 of the IC jig 100C according to the third embodiment described above is adjusted so as to come to a position corresponding to the engagement protrusion 272a of the push-down member 270 in the lead fixed state ( When both operating arm portions 162 are pressed closer to each other, the release protrusion 163 pushes the engagement protrusion 272a inward from the outer surface side of the outer wall 260, and the outer wall 260 receives the engagement. The engagement protrusion 272a is removed from the opening edge of the hole 261, and the push-down member 270 is returned and rotated by the biasing means, so that the IC socket 200B returns to the lead non-fixed state (see FIG. 13B).

  As described above, the IC jig 100C has a function of a fixing release unit that releases the fixation of the lead 320 of the IC 300 in combination with the structure of the IC socket 200B. Further, when the IC socket 200B is converted from the lead fixed state to the lead non-fixed state by the IC jig 100C, the lower surface of the IC holder 140 contacts the upper surface 311 of the IC 300, so that the IC jig 100C is used as it is. And can be removed from the IC socket 200B (see FIG. 13C).

  Unlike the IC socket 200B described above, each lead 320 of the IC 300 is brought into contact with each contact 230 ′ in a non-fixed state where the IC 300 is mounted on the IC mounting portion 211, and the push-down member 270 is rotated. When the lead is fixed, the lead push-down portion 271 pushes the lead 320 and the contact 230 ′ downward against the elasticity of the contact 230 ′ and the lead 320, so that each lead 320 is electrically connected to the contact 230 ′. It is good also as a structure fixed in the state. That is, “in an IC socket to which an IC can be attached and detached, a main body base including an IC mounting surface on which a bottom surface of the main body package of the IC is mounted, and a contact disposed so as to be in contact with each lead of the IC mounted on the IC mounting surface; The contact is provided with a substrate contact portion that is provided on one end and attached to the substrate, and a lead contact portion that is provided on the other end side and bends following the depressed lead, In the main body base, each lead of the IC in a non-fixed state placed on the IC mounting surface is pushed down from above to convert it into a fixed lead state in which each lead is fixed in a conductive state with each contact. An IC socket characterized in that a lead fixing means is provided so that the IC can be attached and detached in the lead non-fixed state. At this time, if the structure for holding the lead fixed state is the same as that of the IC socket 200B, the lead can be easily returned to the non-fixed state by using the IC jig 100C.

<Fourth Embodiment of IC Jig>
Next, an IC jig 100D according to the fourth embodiment will be described. The IC jigs 100A to 100C according to the first to third embodiments described above each include a holding unit that holds the IC 300. However, the IC jig 100D according to the present embodiment includes a holding unit. It differs in that it does not have. Note that, in the IC jig 100D according to the present embodiment, the same structures as those of the IC jigs 100A to 100C according to the first to third embodiments described above are denoted by the same reference numerals and description thereof is omitted. 14A is a side view of the IC jig 100D, and FIG. 14B is converted into a detachable state in which the IC jig 100D can be attached to or detached from the IC socket 200C (detailed later). 14 (c) is a plan view of the IC jig 100D, FIG. 14 (d) is a bottom view of the IC jig 100D, and FIG. 14 (e) is an EE arrow in FIG. 14 (c). FIG.

  The IC jig 100D according to the fourth embodiment has an IC pressing portion 114 formed on the lower surface side of an appropriate position of the upper plate portion 111 (for example, the non-opening region 111b where the operation opening 111a is not provided). When the jig 100D is mounted on the IC socket 200C, adjustment is made so that a gap corresponding to the thickness of the main body package 310 of the IC 300 is generated between the IC placement surface 211 and the IC pressing portion 114.

<Third embodiment of IC socket>
Next, an IC socket 200C according to the third embodiment will be described. The IC socket 200C includes a biasing unit that biases the IC 300 upward, and the IC jig 100D according to the fourth embodiment described above is used to attach and detach the IC 300. Further, the IC socket 200C includes IC fixing means similar to the IC socket 200A according to the first embodiment described above, and the same structure as the IC socket 200A is denoted by the same reference numeral and description thereof is omitted. 15A is a perspective view of an IC socket 200C according to the third embodiment, FIG. 15B is a plan view of the IC socket 200C, and FIG. 15C is a cross-sectional view taken along the line CC in FIG. FIG. 16A is a side view of the IC socket 200C mounted on the IC 300, FIG. 16B is a cross-sectional view taken along the line BB in FIG. 16A, and FIG. 16C is mounted on the IC socket 200C. FIG. 16D is a cross-sectional view taken along the line DD in FIG. 16C, in a state where the IC 300 is moved to the temporary holding position.

  The IC socket 200 </ b> C according to the third embodiment includes a pair of elastic urging pieces 214 that bend upward at appropriate positions (for example, the IC placement surface 211) of the main body base 210, and the most protruding end edges of both elastic urging pieces 214. When the IC 300 is placed on the 214a, the bottom surface 313 of the IC 300 can be held so as to be substantially parallel to the IC mounting surface 211 (see FIGS. 16A and 16B). That is, the elastic biasing piece 214 functions as a biasing means that biases the IC 300 upward.

  The elastic biasing piece 214 has sufficient load resistance to support the relatively lightweight IC 300, but when further pressed with a fingertip or the like, the elastic biasing piece 214 is substantially flush with the IC placement surface 211. (See FIGS. 16 (c) and 16 (d)). That is, when the upper surface 311 of the IC 300 is pressed against the urging force of the elastic urging piece 214, the IC 300 is temporarily held (each lead 320 moves down the lead waiting space 221 a and contacts the upper surface of the lead waiting portion 221. Or close position). Note that the elastic biasing piece 214 in the present embodiment is configured such that a part of a plate material (for example, an elastic synthetic resin plate) constituting the IC mounting surface 211 is cut out and warped upward. .

  Here, when the IC 300 is pressed against the IC placement surface 211 of the IC socket 200C by using the IC pressing portion 114 of the IC jig 100D according to the fourth embodiment described above, the IC jig 100D is pressed accordingly. The portion 130 moves downward along the outer surface of the fixing guide 220, and simultaneously pushes down the lever portions 233a of all the contacts 230 to be introduced between the lower surface of each contact restricting portion 222 and the lead contact portion 233b of the contact 230. A possible empty portion is created (see FIGS. 17A and 17B), and in this state, the IC 300 is slid sideways to complete the mounting position (the contact portion 323 of each lead 320 has its contact restriction). (Position facing the lower part of the portion 222).

  When the IC 300 is moved to the mounting completion position and the IC jig 100D is removed, the contact portion 323 of each lead 320 is moved to the contact portion 323 of each lead 320 even if the force that pushes the bottom surface 313 of the IC 300 upward is applied by the elastic biasing piece 214. By contacting the lower surface of the contact restricting portion 222, the IC socket 200C is not detached.

  On the other hand, when the IC 300 is moved to the temporary holding position and the IC jig 100D is detached, the IC 300 is pushed up by the elastic biasing piece 214 because the pressing force by the IC pressing portion 114 is eliminated, and the main body package 310 of the IC 300 is removed. A state in which the non-lead forming side surface 314 protrudes upward from the upper surfaces of the first and second end walls 240 and 250 in the IC package 200C (a state in which the IC 300 is placed on the most protruding end edge 214a of both elastic biasing pieces 214). Automatically return to. Therefore, the first and second end walls 240 and 250 of the IC socket 200C do not become an obstacle, and the IC 300 can be picked up with a fingertip or the like, so that the first to third embodiments provided with holding means for holding the IC 300 are provided. The IC 300 can be easily removed from the IC socket 200C without using the IC jigs 100A to 100C according to the embodiment.

  In the IC socket 200C according to the third embodiment, the IC socket 200A according to the first embodiment is provided with the biasing means for biasing the IC 300 upward. For example, the IC socket 200B according to the second embodiment is provided. The IC mounting surface 211 may be provided with biasing means. In the case of using the IC socket configured as described above, by rotating the push-down member with the IC 300 placed at an appropriate position on the elastic biasing piece, each lead push-down portion pushes down each lead 320 of the IC 300 downward. When the bottom surface 314 of the IC 300 resists the biasing force of the elastic biasing piece and is moved to the temporary holding position where it is pushed down until it contacts the IC mounting surface, and the push-down member is further rotated, the contacts of all the leads 320 of the IC 300 are contacted. The portion 323 can be shifted to the mounting completion position where it abuts the lead contact portion of each contact. Further, when the push-down member is returned to the normal state, the force to push down each lead 320 of the IC 300 disappears, so that the IC 300 is pushed upward as the biasing elastic piece is restored to the normal state. The lead-free side surface 314 of 310 is automatically returned to a state where it protrudes upward from the upper surfaces of the first and second end walls of the IC package, and the IC 300 can be easily picked up by a fingertip or the like and easily removed from the IC socket. .

<Fourth Embodiment of IC Socket>
Next, an IC socket 200D according to the fourth embodiment will be described. This IC socket 200D is provided with a biasing means realized by a structure different from the IC socket 200C according to the third embodiment described above. The IC jig according to the fourth embodiment described above can be attached to and detached from the IC socket 200D. 100D is used. Further, the IC socket 200D includes IC fixing means similar to the IC socket 200A according to the first embodiment described above, and the same structure as the IC socket 200A is denoted by the same reference numeral and description thereof is omitted. 18A is a perspective view of an IC socket 200D according to the fourth embodiment, FIG. 18B is a plan view of the IC socket 200D, and FIG. 18C is a cross-sectional view taken along the line CC in FIG. FIG. 19A is a side view of the IC socket 200D with the IC 300 mounted thereon, FIG. 19B is a cross-sectional view taken along the line BB in FIG. 19A, and FIG. 19C is mounted on the IC socket 200D. FIG. 19D is a cross-sectional view taken along the line DD in FIG. 19C, in a state where the IC 300 is moved to the temporary holding position.

  The IC socket 200 </ b> D according to the fourth embodiment has an IC 300 by an elevating member 280 that can be converted into a state protruding upward from the IC placement surface 211 of the main body base 210 and a state substantially flush with the IC placement surface 211. A function as an urging means for urging upward is realized. This elevating member 280 is provided with an elevating guide part 282 so as to extend from the lower part of the pressing head 281 having a shape that can be fitted into the pressing head insertion recess 215 opened on the IC mounting surface 211. When the elevating guide part 282 is inserted into the elevating guide hole 216 provided so as to penetrate vertically from the bottom part of the pressing head fitting recess 215, the locking protrusion 282a provided at the lower end of the elevating guide part 282 becomes the elevating guide hole. 216 is caught by the lower opening edge of 216 and functions as a retaining member that prevents the lifting member 280 from falling out of the lifting guide hole 216, and the maximum protruding amount of the pressing head 281 is restricted.

  And in order to give the urging | biasing force which the press head 281 of the raising / lowering member 280 protrudes upwards rather than the IC mounting surface 211 in a normal state, the coil spring 283 is inserted in the outer periphery of the raising / lowering guide part 282, The lower surface was separated from the bottom surface of the pressing head insertion recess 215. The elastic repulsive force of the coil spring 283 can hold the bottom surface 313 of the IC 300 appropriately lifted from the IC mounting surface 211 even when the IC 300 is placed on the upper surface of the pressing head 281 (FIG. 19A ), See (b)). In this embodiment, the elevating member 280 is provided at two locations on a straight line passing through the center of gravity of the IC 300 so that the bottom surface 313 of the IC 300 can be held substantially parallel to the IC placement surface 211. The elevating members 280 may be provided at three or more locations so that they are easily stabilized when placed on the socket 200D.

  In addition, the coil spring 283 that biases the elevating member 280 upward has sufficient resilience characteristics to support the relatively lightweight IC 300, but when further pressed with a fingertip or the like, the upper surface of the pressing head 281 is mounted on the IC. It can be pushed down until it is substantially flush with the mounting surface 211 (see FIGS. 19C and 19D). That is, when the upper surface 311 of the IC 300 is pressed against the urging force of the coil spring 283, the IC 300 is temporarily held (each lead 320 descends the lead waiting space 221a and abuts the upper surface of the lead waiting portion 221). (Close position).

  Here, when the IC 300 is pressed against the IC placement surface 211 of the IC socket 200D by using the IC pressing portion 114 of the IC jig 100D according to the fourth embodiment described above, the IC jig 100D is pressed accordingly. The portion 130 moves downward along the outer surface of the fixing guide 220, and simultaneously pushes down the lever portions 233a of all the contacts 230 to be introduced between the lower surface of each contact restricting portion 222 and the lead contact portion 233b of the contact 230. A possible empty portion is created (see FIGS. 20A and 20B), and in this state, the IC 300 is slid sideways to complete the mounting position (the contact portion 323 of each lead 320 has its contact restriction). (Position facing the lower part of the portion 222).

  When the IC 300 is moved to the mounting completion position and the IC jig 100D is removed, a force is applied to push the bottom surface 313 of the IC 300 upward by the pressing head 281 of the elevating member 280 biased by the coil spring 283. However, the contact portion 323 of each lead 320 does not come off from the IC socket 200 </ b> D because the contact portion 323 contacts the lower surface of each contact restriction portion 222.

  On the other hand, when the IC 300 is moved to the temporary holding position and the IC jig 100D is removed, the IC 300 is pushed up by the pressing head 281 of the elevating member 280 due to the absence of the pressing force by the IC pressing portion 114, and the main body of the IC 300 A state in which the lead-free side surface 314 of the package 310 protrudes upward from the upper surfaces of the first and second end walls 240 and 250 in the IC package 200D (upward from the IC placement surface 211 by the biasing force of the coil spring 283). The IC 300 is automatically returned to a state in which the IC 300 is placed on the upper surface of the protruding pressing head 281. Therefore, the first and second end walls 240 and 250 of the IC socket 200D do not become an obstacle, and the IC 300 can be picked up with a fingertip or the like, so that the first to third embodiments provided with holding means for holding the IC 300 are provided. The IC 300 can be easily detached from the IC socket 200D without using the IC jigs 100A to 100C according to the embodiment.

  The IC socket 200D according to the fourth embodiment has been described as a configuration in which the urging means is provided in the IC socket 200A according to the first embodiment. For example, the IC socket 200B according to the second embodiment is mounted on the IC socket 200B. It is good also as a structure which provides a biasing means in the mounting surface 211. FIG. In the case of using the IC socket configured as described above, by rotating the push-down member in a state where the IC 300 is placed on the pressing head of the lifting member biased upward by the coil spring, When each lead 320 is pushed down and moved to a temporary holding position where the bottom surface 314 of the IC 300 is pressed against the urging force of the coil spring until it abuts against the IC mounting surface. The contact portions 323 of all the leads 320 can be shifted to the mounting completion position where they abut on the lead contact portions of the respective contacts. Further, when the pressing member is returned to the normal state, the force for pressing down each lead 320 of the IC 300 disappears, so that the pressing head of the lifting member is restored to the normal state by the elastic restoring force of the coil spring. Is pushed upward, the lead-free side surface 314 of the main body package 310 in the IC 300 automatically returns to a state protruding upward from the top surfaces of the first and second end walls of the IC package, and the IC 300 is picked up with a fingertip or the like. Can be easily removed from the IC socket.

<Fifth Embodiment of IC Socket>
Next, an IC socket 200E according to the fifth embodiment will be described. FIG. 21A is a perspective view of an IC socket 200E according to the fifth embodiment, FIG. 21B is a plan view of the IC socket 200E, and FIG. 21C is a cross-sectional view taken along the line CC in FIG. FIG. The IC socket 200E includes IC fixing means similar to the IC sockets 200A, 200C, and 200D according to the first, third, and fourth embodiments, and the same structure as the IC sockets 200A, 200C, and 200D has the following structure: The same reference numerals are given and the description is omitted.

  The IC socket 200E can easily remove the IC 300 without using the IC jigs 100A to 100C according to the first to third embodiments described above. However, the IC socket 200E is similar to the third and fourth embodiments described above. Like the IC sockets 200C and 200D, the IC 300 is not easily removed by pushing it up from the side wall of the socket by the biasing means. That is, in the IC socket 200E according to the present embodiment, the IC is mounted on the first and second end walls 240 ′ and 250 ′ rising from the protruding upper edge so as to face the non-lead-formed side surface 314 of the main body package 310 of the IC 300. Cutout portions 243 and 253 facing the placement surface 211 are provided.

  In the IC socket 200E in which the first and second end walls 240 ′ and 250 ′ are provided with the notches 243 and 253, respectively, even when the IC 300 is placed on the IC placement surface 211, the notches 243 and 243 are provided. Since the fingertip can be put on the non-lead forming side surface 314 of the IC 300 via the H.253, the IC 300 in the temporary holding position can be easily removed from the IC 200E. In addition, in the present embodiment, since the deepest positions of the notches 243 and 253 are notched deeply so as to be the IC mounting surface 211, even in the case of the IC 300 of the relatively thin IC package 310, the lead non-formation side surface 314 can be easily picked from both sides, and the IC 300 can be removed efficiently. The notch shape and size of the notches 243 and 253 are not particularly limited, but the first and second end walls 240 ′ and 250 ′ are not obstructed and the lead non-formation side surface 314 of the IC 300 is not used. In consideration of the fact that it can be picked with a fingertip, it is desirable to form it so as to have a width of at least 5 mm.

<First Embodiment of IC>
Next, the IC 300A according to the first embodiment will be described. The IC 300A includes first and second embodiments that do not include urging means such as the IC sockets 200C and 200D according to the third and fourth embodiments and a notch portion like the IC socket 200E according to the fifth embodiment. Even if the IC sockets 200A and 200B according to the embodiment are attached and used, the attaching / detaching work can be easily performed, and holding means such as the IC jigs 100A to 100c according to the first to third embodiments can be used. Even if the IC jig 200D according to the fourth embodiment which is not provided is used, it can be easily removed from the IC socket.

  FIG. 22A is a plan view of the IC 300A according to the first embodiment, FIG. 22B is a back view of the IC 300A, and FIG. 22C is a side view of the IC 300A on the non-lead side surface. 23A is a side view of the IC socket 200A according to the first embodiment with the IC 300A mounted thereon, FIG. 23B is a cross-sectional view taken along the line BB in FIG. 23A, and FIG. FIG. 23D is a side view of the state where the IC 300A placed on the IC socket 200A is moved to the temporary holding position, and FIG. 23D is a cross-sectional view taken along the line DD in FIG.

  The IC 300A according to the first embodiment is provided with a contractible elastic body 330 formed of sponge or the like on the bottom surface 313 of the main body package 310, and the contractible elastic body 330 has a substantially rectangular parallelepiped shape. When the bottom surface 331 of 330 is placed on the IC placement surface 211, the bottom surface 313 of the main body package 310 in the IC 300A can be held substantially parallel to the IC placement surface 211 (see FIGS. 23A and 23B). ). That is, the contractible elastic body 330 functions as a biasing means that biases upward from the IC mounting surface 211 of the IC socket 200A.

  Further, the contractible elastic body 330 is not crushed in the gravitational direction at a load level of the relatively light body package 310, but when further pressed with a fingertip or the like, the contractible elastic body 330 is crushed and the bottom surface of the body package 310 is pressed. 311 can be pushed down so as to be close to the IC mounting surface 211 (see FIGS. 23C and 23D). That is, when the upper surface 311 of the IC 300A is pressed against the urging force of the contractible elastic body 330, the IC 300 is temporarily held (each lead 320 descends the lead standby empty portion 221a and contacts the upper surface of the lead standby portion 221). Or close position). In the present embodiment, the contractible elastic body 330 is used as the biasing means, but a coil spring or the like may be used as the biasing means. In addition, assuming the thickness when the compressible elastic body 330 is compressed, if the IC mounting surface 211 is provided with a shallow hollow compression elastic body housing recess, the bottom surface 313 of the IC 300A is placed on the IC mounting surface. 211 can be brought into contact.

  Here, when the IC 300A is pressed against the IC placement surface 211 of the IC socket 200A using the IC pressing portion 114 of the IC jig 100D according to the fourth embodiment described above, the IC jig 100D is pressed accordingly. The portion 130 moves downward along the outer surface of the fixing guide 220, and simultaneously pushes down the lever portions 233a of all the contacts 230 to be introduced between the lower surface of each contact restricting portion 222 and the lead contact portion 233b of the contact 230. A possible empty portion is created (see FIGS. 24A and 24B), and in this state, the IC 300A is slid sideways to complete the mounting position (the contact portion 323 of each lead 320 has its contact restriction). (Position facing the lower part of the portion 222).

  When the IC 300A is moved to the mounting completion position and the IC jig 100D is removed, even if a force that pushes the bottom surface 313 of the IC 300A upward is applied by the restoring force of the compressed contractible elastic body 330, each lead 320 Since the contact portion 323 contacts the lower surface of each contact restricting portion 222, the contact portion 323 is not detached from the IC socket 200A.

  On the other hand, when the IC 300A is moved to the temporary holding position and the IC jig 100D is removed, the IC 300A is pushed up by the restoring force of the contractible elastic body 330 because the pressing force by the IC pressing portion 114 is eliminated, and the main body of the IC 300A The lead-free side surface 314 of the package 310 returns to a state in which it projects upward from the top surfaces of the first and second end walls 240 and 250 in the IC package 200A. Therefore, the first and second end walls 240 and 250 of the IC socket 200A do not become an obstacle, and the IC 300A can be picked up with a fingertip or the like, so that the first to third embodiments provided with holding means for holding the IC 300A are provided. The IC 300A can be easily detached from the IC socket 200A without using the IC jigs 100A to 100C according to the embodiment.

  Note that even if the IC 300A according to the first embodiment is used so as to be attached to the IC socket 200B according to the second embodiment, the IC 300A can be removed efficiently. In such a case, the retractable elastic body 330 is appropriately lifted upward from the IC mounting surface 211, so that when the lead member 320 is above the original temporary holding position, Each lead 320 of the IC 300A is pushed downward by the lead push-down portion 271 and moved to a temporary holding position where the bottom surface 314 of the IC 300A is pushed against the IC mounting surface 211 against the restoring force of the contractible elastic body 330, When the push-down member 270 is further rotated, the contact portions 323 of all the leads 320 of the IC 300A can be shifted to the mounting completion position where they are in contact with the lead contact portions 233b of the respective contacts 230 ′. Further, when the push-down member 270 is returned to the normal state, the force that pushes down each lead 320 of the IC 300A disappears, so that the main body package 310 is pushed upward by the restoring force of the contractible elastic body 330, and the main body package 310 in the IC 300A. Of the IC package 200B automatically returns to a state protruding upward from the upper surfaces of the first and second end walls 240 and 250 of the IC package 200B, and the IC 300A is easily picked up by a fingertip or the like and easily removed from the IC socket 200B. Can be removed.

<Second Embodiment of IC>
Next, an IC 300B according to the second embodiment will be described. Like the IC socket 300A according to the first embodiment described above, the IC 300B is also similar to the biasing means such as the IC sockets 200C and 200D according to the third and fourth embodiments and the IC socket 200E according to the fifth embodiment. The IC jig according to the first and second embodiments can be easily attached / detached even if it is used by being attached to the IC socket 200A according to the first embodiment which does not have a notch. Using an IC socket 200 that does not include holding means such as 100A and 100B and does not include the IC pressing portion 114 such as the IC jig 200D according to the fourth embodiment, the IC socket 200A is easily removed. be able to.

  FIG. 25A is a plan view of the IC 300B according to the second embodiment, FIG. 25B is a back view of the IC 300B, and FIG. 22C is a side view of the IC 300B on the side where no leads are formed. 26A is a plan view of the IC socket 200A according to the first embodiment with the IC 300B mounted thereon, FIG. 23B is a cross-sectional view taken along the line BB in FIG. 23A, and FIG. These are side views of a state where IC 300B is placed on IC socket 200A.

  The IC 300 </ b> B according to the second embodiment is provided with a holding lead 340 having a holding strength sufficient to support the weight of the main body package 310 as a lead extending from the lead forming side surface 312 of the main body package 310. The holding lead 340 includes a laterally extending portion 341 that extends laterally from the lead forming side surface 312, a downwardly extending portion 342 that extends obliquely downward from the outer end of the laterally extending portion 341, and the downwardly extending portion. The contact portion 343 extends substantially horizontally outward from the lower end of the protruding portion 342.

  Accordingly, the downward extending portion 342 of the holding lead 340 extends further downward than the bottom surface 313 of the main body package 310, so that the load of the IC 300 </ b> B is supported by the holding lead 340. That is, when the IC 300B is placed on the IC package 26, the contact portion 343 of each holding lead 340 is in contact with the upper surface of the lead standby portion 221 in a state where the bottom surface 313 of the main body package 310 is not placed on the IC placement surface 211. Can be placed in the holding position.

  In addition, the downward extending portion 342 of the holding lead 340 is set to be substantially equal to the height at which the first and second end walls 240 and 250 of the IC package 200A protrude from the IC placement surface 211. That is, when the contact portion 343 of the holding lead 340 in the IC 300B is temporarily held on the lead standby portion 221 in the IC socket 200A, the non-lead forming side surface 314 in the main body package 310 of the IC 300B is the first and second sides of the IC socket 200A. Since the length of each holding lead 340 is set so as to protrude beyond the upper ends of the second end walls 240 and 250, the first and second end walls 240 and 250 of the IC socket 200A do not become an obstacle, and the IC 300B IC300B can be easily detached from the IC socket 200A without using the IC jigs 100A and 100B according to the first and second embodiments provided with IC holding means. is there.

  The IC jig 100 is used to shift the IC 300B configured as described above from the temporary holding position on the IC socket 200A to the mounting completion position. The IC jig 100 does not include a holding means or an IC pressing portion, but is engaged with the engagement receiving protrusions 241 and 251 of the first and second end walls 240 and 250 of the IC socket 200A. Part 123 and a pressing part 130 for pressing down the lever part 233a of the contact 230. Further, the thickness of the upper plate portion 111 is set so that the lower surface of the upper plate portion 111 does not hit the upper surface 311 of the IC 300B when the IC jig 100 is mounted on the IC socket 200A on which the IC 300B is mounted. .

  Here, when the IC jig 100 is mounted on the IC socket 200A, the pressing portion 130 of the IC jig 100 moves downward along the outer surface of the fixing guide 220, and the lever portions 233a of all the contacts 230 are simultaneously lowered. Is pushed down to a state where an introductory empty portion is formed between the lower surface of each contact restricting portion 222 and the lead contact portion 233b of the contact 230 (see FIGS. 26A and 26B), and in this state, the IC 300B Can be shifted to the mounting completion position (position where the contact portion 323 of each lead 320 faces below the contact restriction portion 222).

  As described above, when the IC 300B is moved to the mounting completion position and the IC jig 100 is removed, the pressing force applied to the lever portion 233a of the contact 230 by the pressing portion 130 is eliminated, so that the lever portion 233a and the lead contact portion 233b are Along with returning to the normal state, the lead contact portion 233b presses the lower surface of the contact portion 343 in the holding lead 340 and presses it against the lower surface of the contact restricting portion 222, so that good electrical conduction between the holding lead 340 and the contact 230 is achieved. The state can be obtained, and the IC 300B can be fixed so as not to easily shift from the mounting completion position to the temporary holding position.

<Configuration of slot machine>
The IC jig, the IC socket, and the IC according to the present invention described above can be applied to a computer or the like in which the IC is configured to be detachable. As a specific example to which this IC is applied, a schematic configuration of a game machine will be described. First, “a plurality of reels provided with a plurality of types of patterns, a start switch for starting the rotation of the plurality of reels, and a corresponding one for each of the plurality of reels, and individually stopping the rotation of the reels. A combination of a stop switch, a lottery means for determining whether or not internal winnings of a plurality of predetermined winning combinations are won by lottery, and a combination of pictures displayed by the plurality of reels at the time of stoppage are internally won by the lottery means The slot machine 1100 will be described as a “game table including determination means for determining whether or not to win a winning combination depending on whether or not the winning combination is a picture combination”.

  FIG. 28 is a perspective view showing an external appearance of the slot machine 1100. As shown in FIG. 1, inside the center of the slot machine 1100, a plurality of types of patterns (characters and symbols such as “7”, “Bar”, “bell”, “replay”, etc .: not shown) are arranged on the outer peripheral surface. The three cylindrical reels (left reel 1110, middle reel 1111, and right reel 1112) are accommodated and can be rotated inside the main body 1101b.

  The front door 1101a is provided with a reel display window 1113. When the reels 1110 to 1112 are viewed from the front, three patterns applied thereto can be seen from the reel display window 1113 in the vertical direction. That is, when all the reels 1110 to 1112 are stopped, the player can see a total of nine patterns of 3 × 3. When these reels 1110 to 1112 rotate and stop, various combinations of pictures are displayed on the reel display window 1113. In the present embodiment, three reels are provided, but the number of reels and the installation position of the reels are not limited to this. Further, a backlight (not shown) for illuminating each picture displayed on the reel display window 1113 is arranged on the back side of each reel 1110 to 1112.

  The winning line display lamp 1120 is a lamp indicating a winning line 1114 that is valid for each game. The valid pay line 1114 changes depending on the number of game media (in this embodiment, medals are assumed) inserted into the slot machine 1100. For example, as shown in FIG. 28, in the case of having five winning lines 1114, when one medal is inserted, the middle horizontal winning line, when two medals are inserted, the upper horizontal winning line and the lower horizontal winning line are inserted. When 3 sheets are added, 3 lines are added, and 5 lines including 2 diagonal lines are valid, and the winning combination is judged by the combination of the patterns on the effective line 1114. It becomes. Of course, the number of winning lines is not limited to five.

  The start lamp 1121 is a lamp that informs the player that the reels 1110 to 1112 are in a state of being able to rotate. When the replay lamp 1122 wins a replay that is a winning combination (for example, when a combination of replay-replay-replay replay patterns is aligned on the winning line 1114), the next game is replayed to the player. It is a lamp that informs that it is. In the case of a re-game, the medal that is a game medium is exempted in the next game.

  The notification lamp 1123 is a lamp for notifying the player that a special winning combination (for example, a big bonus (BB) or a regular bonus (RB)) has been won internally. The medal insertion lamp 1124 is a lamp for informing the player that it is necessary to insert a medal at the start of the game.

  The medal insertion number display lamp 1125 is a lamp for displaying the number of medals inserted by the player. In this embodiment, since up to three medals can be inserted in one game, the number of medals inserted is displayed using three vertically arranged lamps. Of course, in addition to displaying with a lamp, the number of inserted medals may be directly displayed on a 7-segment display or the like.

  The payout number display unit 1126 is a display unit that displays the number of medals to be paid out to the player when winning a winning combination with a medal payout. The game number display 1127 is a display for displaying the number of general games in the big bonus game. The stored number display 1128 is a display that displays the number of medals stored electronically (credited). The effect lamp 1129 is a lamp used for an effect for enhancing the interest of the game.

  The medal insertion buttons 1131 and 1132 are insertion buttons for electronically inserting the stored medals into the slot machine 1100, and are so-called bet buttons. In the present embodiment, a three-medal insertion button 1131 (a so-called max bet button that can insert the maximum number of medals) and a one-medal insertion button 1132 that inserts one medal each time it is pressed are provided. When one of these buttons is pressed, 1 to 3 medals necessary for the game are electronically inserted into the slot machine 1100. When two medals are inserted, the one-medal insertion button 1131 is pressed twice. The number of inserted medals is subtracted from the current stored number, and the remaining number is displayed on the stored number display 1128.

  The medal slot 1133 has an opening through which a player directly inserts medals when starting a game. When a medal is directly inserted and a medal is clogged in a medal selector unit (not shown) immediately below the medal insertion slot, the medal cancel switch 1133a is operated to eliminate the clogging of the medal. The start lever 1135 is a lever-type switch that starts the rotation of the reels 1110 to 1112 as a game start operation.

  The stop button unit 1136 is provided with three stop buttons (a left stop button 1136a, a middle stop button 1136b, and a right stop button 1136c). Each stop button is a button-type switch that stops the corresponding reel 1110 to 1112 when pressed. Specifically, the left reel 1110 a is operated by operating the left stop button 1136 a, the middle reel 1111 is operated by operating the middle stop button 1136 b, and the right reel 1112 is stopped by operating the right stop button 1136 c.

  Each stop button is provided with a lamp (described in detail later). After the start lever 1135 is operated, all the lamps are turned on when the reels 1110 to 1112 can be stopped. Notify that the stop operation has become possible. Each stop button lamp is turned off each time the stop button is pressed. Of course, it is also possible to change the light emission color of the lamp between the stop operation enabled state and other states.

  The settlement button 1138 is a button that is pressed when performing a settlement process in which the medals acquired by the player are settled and discharged. The checkout button 1138 is used to switch whether or not to store up to a maximum of 50 medals acquired by winning or winning a predetermined number (for example, three) of medals inserted from the medal slot 1133 by the player. For example, when the checkout button 1138 is pressed once and the checkout process is performed, the non-storage mode is set, and when the checkout button 1138 is pressed again, the storage mode is set. Here, storing medals means temporarily storing the number of medals temporarily in a control unit (to be described later) without directly paying out medals.

  The key hole 1139 is a hole into which a door opening / closing key is inserted. When the key is inserted and turned clockwise, the lock is released and the front door 1101a of the slot machine 1100 can be opened. The medal payout opening 1165 is an opening for discharging medals, and medals paid out at the time of winning a prize are discharged from here. The discharged medals are accumulated in the tray 1160.

  Upper lamp 1190, side lamps 1151 and 1152, center lamps 1153 and 1154, waist lamps 1155 and 1156, and lower lamps 1157 and 1158 are effect lamps for exciting games, and are turned on / off / in accordance with the game state. Flashes. Further, the title panel 1140 is illuminated by a title panel lamp (not shown). Further, the tray 1160 is made of a translucent material, and is configured to exhibit the same effect as the lamp for production described above by making the lamp light incident from the tray mounting surface. In addition, the tray 1160 is provided with an ashtray unit 1170 configured to be detachable.

  In addition, in the central part of the upper part of the slot machine (above the reel display window 1113), various information related to the game (game screen for displaying characters and the like to make the game more exciting, error in the case of an abnormality in the slot machine) An LCD 1180 capable of displaying an error screen for displaying the contents is provided. By using the LCD 1180, various switches (for example, a three-medal insertion button 1131, a single-medal insertion button 1132, a start lever 1135) are provided. , Stop buttons 1136a to 1136c, checkout button 1138, etc.) are also notified.

  In the slot machine 1100 having the above-described structure, a control device (for example, a main control device, a sub control device, an LCD control device, a power supply device, etc.) in which a board on which various ICs are mounted is stored in a required storage case is appropriate. By operating, the slot machine 1100 operates normally and a game can be executed. In particular, the main CPU mounted on the control board of the main control device is a main CPU because a game control program corresponding to the model is written and is detachably attached via an IC socket. In order to facilitate the removal of the IC, the workability can be improved by applying the IC jig, IC socket, and IC according to the present invention.

<Configuration of pachinko machine>
Next, the pachinko machine 2000 will be described as “a gaming machine that includes a gaming board having a predetermined winning opening and gives a predetermined privilege when a gaming ball enters the predetermined winning opening”.

  FIG. 29 is a front view showing the appearance of the pachinko machine 2000. FIG. On the game board 2100 of the pachinko machine 2000, a game area 2300 is formed by an outer rail 2210 and an inner rail 2220 arranged in a substantially circular shape, and a sky lamp 2410 is arranged above the game area 2300. Further, a ball tray 2420 for storing pachinko balls is arranged below the game area 2300, and the game balls stored in the ball storage section of the ball tray 2420 can be extracted by operating the ball removal lever 2430. . Further, a launching handle 2440 for firing a pachinko ball and adjusting a flight distance is arranged on the side of the ball tray 2420.

  In addition, when the game ball is full in the ball storage unit in the ball tray 2420 and there is a problem in continuing the game, control such as forcibly stopping the launching device is performed. When the storage amount increases to some extent, it is desirable to display a warning so as to prompt the player to remove the ball. Therefore, in the pachinko machine 2000 of the present embodiment, the ball removal lever 2430 is provided with an illumination device (described in detail later), and the player is given a game before the amount stored in the ball storage portion of the ball tray 2420 reaches the danger zone. Warning notification is effectively performed.

  A relatively large variable display device 2500 is disposed in the approximate center of the game area 2300, and a normal symbol start gate 2510 is disposed on the left and right sides of the variable display device 2500. Also, below the variable display 2500, a special symbol starting port 2520, a variable winning port 2530, a big winning port 2540, and an out port 2550 are arranged side by side. Further, a special symbol display 2560 and a special symbol hold lamp 2570, a normal symbol display 2580 and a normal symbol hold lamp 2590 are arranged below the right side of the game area 2300.

  A windmill 2310 and an obstruction nail 2320 are appropriately disposed at appropriate positions in the game area 2300 as game ball contact bodies that change in the flow direction when the game balls come into contact. In the game area 2300, a winning opening 2330 is arranged at an appropriate place. The special symbol display 2560 and the normal symbol display 2580 are constituted by a so-called 7-segment display, a dot matrix display, or the like, and can variably display numbers and symbols.

  Next, an outline of the pachinko game will be described. The hit ball launched by the player pushes the ball return preventing member 2230 from the shot ball passage formed by the outer rail 2210 and the inner rail 2220 and jumps into the game area 2300. The hit ball that has entered the game area 2300 flows down to the lower side of the game area 2300 according to the firing force and the state of contact with the game ball contact body.

  When the game ball passes through the normal symbol start gate 2510 and is detected by the sensor, the normal symbol display 2580 is activated. When the variable display of the normal symbol display 2580 is stopped, if the stop mode is a predetermined mode, for example, “7” is stopped and displayed, the variable winning opening 2530 is activated and the ball is won. It changes to an easy state. Note that the number of passages through the normal symbol start gate 2510 is stored up to a predetermined number, for example, four, and is displayed by the normal symbol hold lamp 2590.

  On the other hand, the hit ball flowing down the game area 2300 enters the special symbol start port 2520, and when this ball is detected by the sensor, the special symbol display 2560 is activated. In addition, the display operation of the special symbol display 2560 is displayed on the variable display device 2500 as display contents with higher performance. When the stop display mode of the special symbol display 2560 (substantially, the stop display mode in the variable display device 2500) becomes a predetermined mode, a so-called big hit is made and the big prize opening 2540 is opened, and the big prize opening It becomes a big hit gaming state where it is easy to enter 2540.

  Note that the number of balls entered into the special symbol start opening 2520 is stored up to a predetermined number, for example, four, and is displayed by the special symbol hold lamp 2570. Since the information is of great interest to the player, for example, a special symbol hold display device 2600 is provided in the vicinity of the variable display device 2500 with high player visibility, and the number of balls entered into the special symbol start port 2520 is held and stored. Can be displayed effectively. When the number of reserved memories reaches an upper limit (for example, four), even if the ball enters the special symbol start port 2520 after that, it will not be added to the reserved memory, and only a prize ball for the entered ball will be given. According to the player's judgment, it becomes easier to proceed with the game such that the firing operation is interrupted until the reserved memory is decremented.

  The pachinko machine 2000 having the above-described structure is a control device (for example, a main control device, a sub-control device, a launch control device, a discharge control device, a power supply device, etc.) in which a substrate on which various ICs are mounted is stored in a required storage case. ) Operates properly, the pachinko machine 2000 operates normally and the game can be executed. In particular, the main CPU mounted on the control board of the main control device is a main CPU because a game control program corresponding to the model is written and is detachably attached via an IC socket. In order to facilitate the removal of the IC, the workability can be improved by applying the IC jig, IC socket, and IC according to the present invention.

1 is an external perspective view of an IC jig according to a first embodiment. FIG. 2 is a configuration explanatory diagram of an IC jig according to the first embodiment. It is IC holding state explanatory drawing by the jig | tool for IC which concerns on 1st Embodiment. 1 is an external perspective view of an IC socket according to a first embodiment. 1 is a configuration explanatory diagram of an IC socket according to a first embodiment. FIG. It is explanatory drawing of the state which mounted | wore the IC socket which concerns on 1st Embodiment with the jig | tool for IC which concerns on 1st Embodiment. It is IC conversion operation | movement explanatory drawing with respect to the IC socket which concerns on 1st Embodiment. It is structure explanatory drawing of the jig | tool for IC which concerns on 2nd Embodiment. It is IC holding state explanatory drawing by the IC jig which concerns on 2nd Embodiment. It is structure explanatory drawing of the jig | tool for IC which concerns on 3rd Embodiment. It is structure explanatory drawing of the IC socket which concerns on 2nd Embodiment. It is IC conversion operation | movement explanatory drawing with respect to the IC socket which concerns on 2nd Embodiment. It is holding | maintenance explanatory drawing of IC by the jig | tool for IC which concerns on 3rd Embodiment. It is structure explanatory drawing of the IC socket which concerns on 3rd Embodiment. It is structure explanatory drawing of the IC socket which concerns on 3rd Embodiment. It is IC conversion operation explanatory drawing with respect to the IC socket which concerns on 3rd Embodiment. It is explanatory drawing of the state which mounted | wore the IC socket which concerns on 3rd Embodiment with the jig | tool for IC which concerns on 4th Embodiment. It is structure explanatory drawing of the IC socket which concerns on 4th Embodiment. It is IC conversion operation | movement explanatory drawing with respect to the IC socket which concerns on 4th Embodiment. It is explanatory drawing of the state which mounted | wore the IC socket which concerns on 4th Embodiment with the jig | tool for IC which concerns on 4th Embodiment. It is structure explanatory drawing of the IC socket which concerns on 5th Embodiment. It is structure explanatory drawing of IC which concerns on 1st Embodiment. It is conversion operation explanatory drawing of IC which concerns on 1st Embodiment with respect to IC socket which concerns on 1st Embodiment. It is explanatory drawing of the state which mounted | wore the IC socket which concerns on 1st Embodiment which mounted IC which concerns on 1st Embodiment in the temporary holding position with the jig | tool for IC which concerns on 4th Embodiment. It is structure explanatory drawing of IC which concerns on 2nd Embodiment. It is explanatory drawing of the state which put IC which concerns on 2nd Embodiment in the temporary holding position of the IC socket which concerns on 1st Embodiment. It is explanatory drawing of the state which mounted | wore the IC socket which concerns on 1st Embodiment which mounted | worn IC which concerns on 2nd Embodiment in the temporary holding position with the jig | tool for IC which concerns on 4th Embodiment. It is a perspective view showing the appearance of a slot machine which is an example of a game table. It is a perspective view which shows the external appearance of the pachinko machine which is an example of a game stand.

Explanation of symbols

100A IC jig (first embodiment)
DESCRIPTION OF SYMBOLS 110 Main body member 111a Operation opening 120 Engagement / disengagement member 123 Locking part 123a Locking piece 130 Pressing part 140 IC holder 200A IC socket (1st Embodiment)
210 Main body base 211 IC placement surface 221 Lead standby part 221a Lead standby empty part 222 Contact restriction part 230 Contact 232a Substrate contact part 233a Lever part 233b Lead contact part 300A IC (first embodiment)
310 Main body package 311 Upper surface 312 Lead forming side surface 313 Bottom surface 314 Lead non-forming side surface 320 Lead 323 Contact portion 330 Retractable elastic body

Claims (14)

An IC jig capable of removing an IC mounted on an IC socket,
An IC comprising: holding means for holding the IC so that it can be removed from the IC socket when the IC that can be removed from the IC socket through the temporary holding position from the mounting completion position is in the temporary holding position. Jig. In the IC jig according to claim 1,
An IC socket having a fixing means for fixing the IC at the mounting completion position is provided with fixing release means for releasing the fixing by the fixing means so that the IC can be moved from the mounting completion position to the temporary holding position. IC jig characterized by the above. In the IC jig according to claim 1,
Provided with a pressing portion to be pressed down from above on the lever portions provided in the respective contacts that come into contact with the respective leads of the IC at the mounting completion position,
Leads of the contacts that are pressed and fixed from below so that the contacts of the IC socket are elastically deformed and the leads of the IC are pressed against the contact restricting portions by the pressing portions pressing down the lever portions of the contacts. An IC jig characterized in that the contact portion is moved downward, each lead of the IC is released, and the IC can be moved from a mounting completion position to a temporary holding position. In the IC jig according to claim 1,
A mounting in which each lead is pushed down from above and brought into contact with the lead contact portion of each contact with respect to the IC in the temporary holding position where the lead is positioned above each lead contact portion provided for each contact of the IC socket. For the IC socket provided with the lead push-down means for fixing at the completion position, a fixing release means for releasing the fixation of the lead by the lead push-down means is provided,
An IC jig for returning the IC from the mounting completion position to the temporary holding position by releasing the fixing of each lead by the lead pressing means of the IC socket by the fixing release means. . IC socket to which an IC can be attached and detached,
An IC socket characterized in that the IC can be removed from a mounting completion position through a temporary holding position, and provided with a fixing means for fixing the IC at the mounting completion position. The IC socket according to claim 5,
A main body base including an IC placement surface on which a bottom surface of the main body package of the IC is placed;
Contacts provided on the main body base and arranged to contact each lead of the IC;
With
The contact includes
A substrate contact portion provided on one end side and attached to the substrate;
A lead contact portion provided on the other end side and capable of contacting the lead from below;
A lever portion that is provided on the other end side than the lead contact portion and is elastically deformed so as to move the lead contact portion downward by being pressed downward.
Provided,
The main body base is provided corresponding to the lead contact portion of each contact, and the lead contact portion is provided with a contact restricting portion that restricts the lead contacted from below from moving upward,
Each lead of the IC is placed between each lead contact portion and each contact restriction portion by pressing the lever portion of each contact from a temporary holding position in a lead standby portion formed between adjacent contact restriction portions. Each lead contact portion that has elastically returned to its normal state by moving the IC to the mounting completion position where each lead of the IC is positioned to the lead-introducible empty portion that occurs in each, and releasing the pressing force on the lever portion of each contact The IC socket can be fixed so that the IC is not easily moved from the mounting completion position to the temporary holding position by pressing each lead from below to each contact restricting portion. The IC socket according to claim 5,
A main body base including an IC placement surface on which a bottom surface of the main body package of the IC is placed;
A contact provided on the main body base and spaced apart below each lead of the IC;
With
The contact includes
A substrate contact portion provided on one end side and attached to the substrate;
A lead contact portion provided on the other end side and capable of contacting the depressed lead;
Provided,
The main body base is provided with a lead push-down means for fixing the lead of the IC placed on the IC placement surface from the upper side and fixing it at the mounting completion position in contact with the lead contact portion of each contact,
At the mounting completion position where each lead of the IC is brought into contact with the lead contact portion of each contact by depressing each lead of the IC from the temporary holding position above the lead contact portion of each contact by the lead push-down means. An IC socket characterized by being fixed. The IC socket according to any one of claims 5 to 7,
An IC socket, comprising a biasing means for biasing the IC upward. IC socket to which an IC can be attached and detached,
The IC can be removed from a mounting completion position via a temporary holding position,
The main body base including an IC placement surface on which the bottom surface of the main body package of the IC is mounted includes an end wall that rises up to face a non-lead-formed side surface in the main body package of the IC,
An IC socket, wherein the end wall is provided with a notch from the upper edge of the protrusion toward the IC mounting surface. The IC socket according to claim 9,
An IC socket characterized in that the deepest position of the notch provided on the end wall is the IC mounting surface. In the IC socket according to claim 9 or 10,
Provided on the main body base, provided with contacts arranged to contact each lead of the IC,
The contact includes
A substrate contact portion provided on one end side and attached to the substrate;
A lead contact portion provided on the other end side and capable of contacting the lead from below;
A lever portion that is provided on the other end side than the lead contact portion and is elastically deformed so as to move the lead contact portion downward by being pressed downward.
Provided,
The main body base is provided corresponding to the lead contact portion of each contact, and the lead contact portion is provided with a contact restricting portion that restricts the lead contacted from below from moving upward,
Each lead of the IC is placed between each lead contact portion and each contact restriction portion by pressing the lever portion of each contact from a temporary holding position in a lead standby portion formed between adjacent contact restriction portions. Each lead contact portion that has elastically returned to its normal state by moving the IC to the mounting completion position where each lead of the IC is positioned to the lead-introducible empty portion that occurs in each, and releasing the pressing force on the lever portion of each contact The IC socket can be fixed so that the IC is not easily moved from the mounting completion position to the temporary holding position by pressing each lead from below to each contact restricting portion. In the IC socket according to claim 9 or 10,
Provided on the base of the main body, provided with contacts arranged separately below each lead of the IC,
The contact includes
A substrate contact portion provided on one end side and attached to the substrate;
A lead contact portion provided on the other end side and capable of contacting the depressed lead;
Provided,
The main body base is provided with a lead push-down means for fixing the lead of the IC placed on the IC placement surface from the upper side and fixing it at the mounting completion position in contact with the lead contact portion of each contact,
At the mounting completion position where each lead of the IC is brought into contact with the lead contact portion of each contact by depressing each lead of the IC from the temporary holding position above the lead contact portion of each contact by the lead push-down means. An IC socket characterized by being fixed. An IC that can be attached to and detached from an IC socket,
It becomes possible to remove the IC socket through the temporary holding position from the mounting completion position of the IC socket,
An IC comprising biasing means for biasing upward from an IC placement surface of the IC socket. An IC that can be attached to and detached from an IC socket,
It becomes possible to remove the IC socket through the temporary holding position from the mounting completion position of the IC socket,
At least when each lead protruding downward from the lead forming side surface of the IC main body package is in a temporary holding state on the lead mounting portion provided in the IC socket, the lead non-forming side surface of the IC main body package is An IC characterized in that the length of each lead is set so as to protrude above the end wall of the IC socket.

Images