JP2008216936A - Optical circuit substrate and manufacturing method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical circuit substrate having high reliability free from deterioration of a reflection area and decline in strength, by forming an optical path conversion means using a supplementary material of a prescribed refractive index, and also to provide a manufacturing method of the same. <P>SOLUTION: In the optical circuit substrate 100, the optical path conversion means 130 is formed in a manner having two reflection faces including first and second reflection faces 131, 132. By such formation of the optical path conversion means 130, the optical axis of a core 121 is designed to be converted dividedly in two times. The optical path conversion means 130 is formed by using a filling material 133 having a different refractive index from that of an optical waveguide 120, wherein the first and second reflection faces 131, 132 are formed in the boundary between the optical waveguide 120 and the filling material 133. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical circuit board provided with an optical path changing means for converting an optical axis of an optical waveguide into a substantially vertical direction and a manufacturing method thereof.

  In recent years, in the field of integrated devices made of semiconductors, progress toward high speed and high density has been remarkable, and interconnections using conventional electrical wiring cannot expect sufficient characteristics due to signal delay, attenuation, interference, etc. Is a problem. This problem is said to be an IO bottleneck, and optical interconnection technology has attracted attention in order to solve this problem. The optical interconnection technology is considered to be applied not only between communication devices and between boards in a communication device, but also between integrated circuit elements in one board.

  As a conventional optical circuit board for realizing on-board optical interconnection, a multilayer printed board on which an optical waveguide disclosed in Patent Document 1 is formed is known. Here, the signal light emitted in the direction perpendicular to the substrate from the surface emitting element (VCSEL) mounted on the substrate surface is reflected by the optical path conversion mirror formed in the optical wiring to guide the optical waveguide. The guided signal light is reflected by another optical path conversion mirror and received by a surface-receiving optical element (planar photodiode).

  In such an optical circuit board, it is necessary to extract the light propagating through the optical waveguide in the optical circuit board to the surface of the substrate, but the extraction direction is perpendicular to the optical axis of the optical waveguide. Means for converting the optical axis of the light to 90 ° is required.

  As such an optical path changing means, for example, the one shown in FIG. 8 disclosed in Patent Document 2 is conventionally known. Here, a reflection surface 902 inclined by 45 ° with respect to the optical axis is formed in the middle of the optical waveguide 901, and this reflection surface 902 is used as an optical path changing means. The reflecting surface 902 is formed by the interface between the air in the air hole 903 and the core of the optical waveguide 901, and utilizes the fact that the difference between the refractive index of the core and the refractive index of the air in the air hole 903 is relatively large. It is a thing. When the refractive index of the core is 1.55, the critical angle with respect to the normal direction of the reflecting surface 902 is approximately 40 degrees, and the total reflection is achieved by setting the inclination angle of the reflecting surface with respect to the optical axis of the optical waveguide 901 to 45 degrees. As a result, it is possible to convert the propagation direction of 90 degrees.

As another optical path changing means, there is also known an apparatus that efficiently converts the optical axis by forming a metal film on a reflection surface that is an optical path changing means (Patent Document 3). As the metal film formed on the reflecting surface, a metal such as gold (Au) or silver (Ag) is used.
JP 2006-120956 A JP 2006-337748 A JP 2004-341454 A

  However, the conventional optical circuit board has the following problems. That is, when an inclined surface inclined by 45 ° with respect to the optical axis of the optical waveguide is formed, and a reflecting surface as an optical path changing means is formed at the interface between the inclined surface of the optical waveguide and air, light is reflected at the portion of the reflecting surface. There has been a problem that the circuit board becomes thin and the strength of the optical circuit board decreases. In addition, there is a possibility that the reflecting surface may be deformed due to a change in temperature or the like, and there is a problem that reliability is low.

  On the other hand, when an optical path changing means in which a metal film is formed on a reflecting surface as disclosed in Patent Document 3, peeling of the metal film becomes a big problem. When gold is used as the metal film, the reflectance can be increased, but there is a problem that it is easy to peel off. Further, when silver is used for the metal film, peeling due to oxidation of silver also becomes a problem. Since these metals do not have high adhesion to the resin, there is a possibility that a peeling problem may occur.

  Therefore, the present invention has been made to solve these problems, and by forming the optical path changing means using a compensation material having a predetermined refractive index, the reliability of the reflecting surface is not deteriorated and the strength is not lowered. An object of the present invention is to provide a high optical circuit board and a manufacturing method thereof.

  According to a first aspect of the optical circuit board of the present invention, there is provided a printed wiring board, an optical waveguide having a core formed parallel to the printed wiring board and a clad surrounding the core, and an optical axis of the optical waveguide. An optical circuit board comprising: an optical path conversion means for converting substantially perpendicular to the main surface of the plate, wherein the optical path conversion means is a first reflecting surface comprising a single plane that crosses the core at a predetermined angle. A second reflecting surface comprising one or more planes that continuously traverse one of the clads sandwiched between the core and the printed wiring board with the first reflecting surface; and the first reflecting And a supplementary material installed adjacent to the core and the clad with the surface and the second reflecting surface serving as an interface, and the second reflecting surface has an angle with the main surface that is the first reflecting surface Set at an angle closer to the vertical than the surface, the light Waveguides of the optical axis, characterized in that it is converted at least twice between the first reflecting surface and the second reflecting surface.

  In another aspect of the optical circuit board of the present invention, the second reflecting surface is composed of two or more planes, from the plane in contact with the end of the first reflecting surface to the plane in contact with the printed wiring board, It is characterized in that the angle formed with the main surface is formed so as to gradually approach the vertical.

  In another aspect of the optical circuit board of the present invention, the refractive index of the filling material is such that the refractive index of the core or the cladding of the cladding is such that incident light is totally reflected by the first reflecting surface and the second reflecting surface. It is determined based on the refractive index.

  In another aspect of the optical circuit board of the present invention, the filling material includes a first filling material adjacent to the core with the first reflecting surface as an interface, and the cladding with the second reflecting surface as an interface. The second supplementary material is adjacent to each other, and the refractive index of the first supplementary material and the refractive index of the second supplementary material are such that incident light is incident on the first reflective surface and the second reflective surface, respectively. It is determined based on the refractive index of the core and the refractive index of the clad so as to be totally reflected.

  According to a first aspect of the optical circuit board manufacturing method of the present invention, there is provided a printed wiring board, an optical waveguide having a core formed in parallel with the printed wiring board and a clad surrounding the core, and an optical axis of the optical waveguide. An optical circuit board manufacturing method comprising: an optical path conversion means for converting substantially perpendicularly to a main surface of the printed wiring board, wherein the first dicing blade has a cutting surface whose tip is formed at a first angle. A first step of cutting from the surface facing the printed wiring board of the optical waveguide along the axis perpendicular to the main surface until crossing the core, and the tip is the first Using the second dicing blade having a cutting surface having a second angle smaller than one angle, the printed wiring board and a predetermined position toward the printed wiring board along the same axis as the first step Core A filling material having a predetermined refractive index is filled in the holes of the optical waveguide formed in the second step of cutting the clad between the first step and the first step and the second step. And a third step.

  In another aspect of the method of manufacturing an optical circuit board according to the present invention, a tip is larger than the second angle and smaller than the first angle between the first step and the second step. One or more cutting the clad between the printed wiring board and the core to a predetermined position along the same axis as the first step by using one or more other dicing blades having a cutting surface It further has the process of characterized by the above-mentioned.

  According to another aspect of the method for producing an optical circuit board of the present invention, a printed wiring board, an optical waveguide having a core formed in parallel with the printed wiring board and a clad surrounding the core, and the optical axis of the optical waveguide are An optical circuit board manufacturing method comprising optical path conversion means for converting substantially perpendicularly to a main surface of a printed wiring board, wherein an angle formed with a bottom surface sequentially increases from two or more planes toward the bottom surface A first step of filling a mold having a side surface with a resin having a predetermined refractive index from the injection port to form a filling material, and when the core material and the clad material are uncured, the upper surface is printed. A second step of placing the filling material in contact with the wiring board and contacting a side surface composed of the two or more planes with the core material and the cladding material; and the core material and the cladding material of the side surface Predetermined A third step of curing by shaping the core material and the clad material into contact with the surface, and having a.

  According to another aspect of the method for producing an optical circuit board of the present invention, a printed wiring board, an optical waveguide having a core formed in parallel with the printed wiring board and a clad surrounding the core, and the optical axis of the optical waveguide are An optical circuit board manufacturing method comprising an optical path changing means for converting substantially perpendicularly to a main surface of a printed wiring board, wherein the first mold having a side surface comprising a plane that forms a first angle with the bottom surface. A first step of filling a first resin having a predetermined refractive index to form a first filling material; and a second step having a side surface formed by a plane whose angle to the bottom surface is closer to perpendicular to the first angle. A second step of filling the mold with a second resin having a predetermined refractive index to form a second filling material, and an uncured first clad material disposed on the printed wiring board Until the upper surface is in contact with the printed wiring board. A fourth step of press-fitting the first filling material into the uncured core material disposed on the first cladding material until the upper surface is in contact with the second filling material. And a fifth step of placing and curing a second clad material on the core material.

  Another aspect of the optical circuit board manufacturing method of the present invention is characterized in that a resin having the same refractive index as that of the first resin is used for the second resin.

  In another aspect of the method for producing an optical circuit board of the present invention, a resin having a predetermined refractive index different from that of the first resin is used for the second resin.

  As described above, according to the present invention, by providing an optical path changing unit having two or more reflecting surfaces formed by using a filling material having a predetermined refractive index, reliability without deterioration of the reflecting surfaces and reduction in strength is achieved. High optical circuit board can be provided. Further, it is possible to provide a manufacturing method capable of easily manufacturing an optical path changing unit having two or more reflecting surfaces at low cost.

  According to the present invention, it is possible to reduce the optical path conversion angle by one reflection on one reflecting surface, and therefore, using an auxiliary material having a small refractive index difference from the optical waveguide material, It is possible to realize the optical path changing means without reducing the intensity.

  A configuration of an optical circuit board and a manufacturing method thereof in a preferred embodiment of the present invention will be described in detail with reference to the drawings. In addition, about each structural part which has the same function, the same code | symbol is attached | subjected and shown for simplification of illustration and description.

  A first embodiment of the optical circuit board of the present invention will be described below with reference to FIG. The optical circuit board 100 of the present embodiment includes a printed wiring board 110 and an optical waveguide 120 arranged in parallel therewith, and an optical path changing means 130 is provided at a predetermined position of the optical waveguide 120. Correspondingly, the printed wiring board 110 is provided with an optical opening 140.

  The printed wiring board 110 has a conductor pattern layer 112 formed on both sides of the insulating layer 111. The optical waveguide 120 includes a core 121 and a clad 122 surrounding the core 121, and the optical axis of the core 121 is parallel to the main surface 112 a of the printed wiring board 110.

  The optical path changing means 130 converts the optical axis of the core 121 substantially perpendicularly to the direction of the printed wiring board 110, and conventionally has a single reflecting surface inclined by 45 ° with respect to the optical axis of the core 121. Was formed. On the other hand, in the optical circuit board 100 of the present embodiment, the optical path changing means 130 is formed to have two reflecting surfaces of the first reflecting surface 131 and the second reflecting surface 132. By forming the optical path conversion means 130 so as to have two reflecting surfaces, the optical axis of the core 121 is converted in two steps. The optical path changing means 130 is formed by using a filling material 133 having a refractive index different from that of the optical waveguide 120, and the first reflecting surface 131 and the second reflecting surface 132 are formed between the optical waveguide 120 and the filling material 133. It is formed at the interface.

  In order to efficiently convert the optical axis of the core 121 by the optical path conversion unit 130, it is necessary to totally reflect the light propagating through the core 121 by the reflection surface of the optical path conversion unit 130. In order to totally reflect the reflection surfaces 131 and 132, the inclination angle of the reflection surfaces 131 and 132 is preferably set, and the filling material 133 having a refractive index smaller than the refractive index of the optical waveguide 120 by a predetermined value or more is used. , 132 must be used.

  In order to convert the optical axis of the core 121 by 90 ° with one reflecting surface, it is necessary to use a reflecting surface inclined by 45 ° with respect to the optical axis. All light incident on the reflecting surface at 45 ° is reflected on the reflecting surface. In order to reflect, the refractive index of the filling material forming the reflecting surface needs to satisfy the following conditions. That is, when the refractive index of the core 121 is 1.55, the refractive index of the filling material needs to be 1.09 or less in order to totally reflect light that travels linearly in the core 121. Although air can satisfy such conditions, there are very few materials other than air.

  On the other hand, the optical path conversion means 130 of this embodiment has two reflecting surfaces 131 and 132 so as to convert the optical axis of the core 121 in two steps, and the total of two reflections is 90. It suffices if the optical axis can be converted in degrees. For this reason, the conversion angle of the optical axis by each reflective surface 131,132 can be made smaller than 90 degrees, and the refractive index of the filling material 133 which forms the reflective surfaces 131,132 can be made larger than 1.09. It becomes.

  As an example, when the refractive index of the core 121 is 1.55, the refractive index of the cladding is 1.53, and the refractive index of the filling material 133 forming the reflecting surfaces 131 and 132 is 1.42, the inside of the core 121 is straight. The traveling light can be totally reflected when the angle formed between each reflecting surface 131 and 132 and each reflecting surface is 23.6 ° or 21.8 ° or less, respectively. .2 ° and 43.6 ° optical axes are converted, and a total optical axis conversion of approximately 90 ° is possible.

  As described above, the optical path changing unit 130 according to the present embodiment includes the two reflecting surfaces 131 and 132, and thus can be formed using a material having a refractive index of 1.42 or less for the filling material 133. . A material having such a refractive index can be widely selected from a resin or the like, and the material selection range can be greatly expanded. Further, since the reflecting surfaces 131 and 132 can be formed by using a filling material 133 such as a resin instead of being formed at the interface with air, the optical circuit board can be formed by forming the optical path changing means 130. There is no fear of reducing the strength of 100. Furthermore, since it is possible to totally reflect the reflective surfaces 131 and 132 without forming a metal film such as gold or silver, the problem of peeling off the metal film is eliminated.

  In FIG. 1, the first reflective surface 131 is formed so as to cross the core 121 at a predetermined inclination angle, and the second reflective surface 132 crosses the clad 122 between the core 121 and the printed wiring board 110. It is formed to do. The angle formed between the main surface 112a of the printed wiring board 110 and the second reflecting surface 132 is larger than the angle formed between the main surface 112a and the reflecting surface 131, and the light traveling through the core 121 by the two reflecting surfaces. The angle change received by the optical axis is 90 ° in total.

  A second embodiment of the optical circuit board of the present invention will be described below with reference to FIG. In the optical circuit board 200 of the present embodiment, the optical path changing means 230 is composed of a first filling material 233a and a second filling material 233b, and materials having different refractive indexes are used. Thus, the refraction of each of the filling material 233a that forms the first reflecting surface 231 at the interface with the core 221 and each of the filling material 233b that forms the second reflecting surface 232 at the interface with the cladding 222. By making it possible to set by changing the rate, it is possible to use an optimal filling material for each.

  That is, a material having a refractive index determined based on the refractive index of the core 221 can be used for the filling material 233a so that light incident from the core 221 is totally reflected by the first reflecting surface 231. Further, a material having a refractive index determined based on the refractive index of the cladding 222 is compensated so that light reflected by the first reflecting surface 231 and incident on the second reflecting surface 232 is totally reflected again here. It can be used for the material 233b.

  Since the refractive index of the core 221 and the refractive index of the cladding 222 are different, in this embodiment, the refractive index of the compensation material 230a and that of the compensation material 230b can be set to be different. As a result, a material having a refractive index determined to be totally reflected by the first reflecting surface 231 and a material having a refractive index determined to be totally reflected by the second reflecting surface 232 are respectively used as the filling material. 230a and filling material 230b.

  A third embodiment of the optical circuit board of the present invention will be described below with reference to FIG. In the optical circuit board 300 of the present embodiment, the second reflecting surface 332 of the optical path changing means 330 is formed by two or more planes. The inclination of the reflection surface is the smallest on the first reflection surface 331 (closest to the optical axis of the core 321), and increases in the order of the reflection surfaces 332a and 332b. By forming each reflecting surface in this way, the light propagating through the core 321 is reflected by the first reflecting surface 331, then reflected by one reflecting surface 332a of the second reflecting surface 332, and The optical axis is changed in a direction substantially perpendicular to the main surface 312a of the printed wiring board 310 by being reflected by the other reflecting surface 332b.

  As described above, in the optical path conversion unit 330 according to the present embodiment, the three reflecting surfaces of the first reflecting surface 331 and the two second reflecting surfaces 332a and 332b are formed. The angle for changing the axis can be reduced. For example, if the optical axis is changed by an equal angle on three reflecting surfaces, the optical axis may be changed by 30 ° on one reflecting surface. As described above, when the angle between the optical axis and the reflecting surface is made smaller and total reflection is performed, a material having a refractive index closer to the refractive index of the core 321 and the cladding 322 can be used for the filling material 333. The selection range of the material as the filling material 333 can be further expanded.

  Next, the manufacturing method of the optical circuit board of this invention is demonstrated below using drawing. FIG. 4 is a view for explaining the method of manufacturing the optical circuit board according to the first embodiment of the present invention. The optical circuit board manufacturing method of this embodiment provides a process until the optical circuit board 400 shown in FIG. 4 (e) is manufactured based on the optical circuit board material 401 shown in FIG. 4 (a). It is.

  The optical circuit board material 401 is obtained by integrating a printed wiring board 410 and an optical waveguide 420 including a core 421 and a clad 422. In the method of manufacturing an optical circuit board according to this embodiment, the optical circuit board 400 is manufactured by processing the optical circuit board material 401 to form the optical path changing means 430.

  First, in the first step shown in FIG. 4B, the tip of the optical waveguide 420 has a cutting surface 451a having a predetermined angle from the surface 420a opposite to the surface in contact with the printed wiring board 410 (hereinafter referred to as the lower surface). The optical waveguide 420 is cut while moving the first dicing blade 451 along an axis perpendicular to the optical axis of the optical waveguide 420. In the first dicing blade 451, the angle formed by the cutting surface 451a is equal to the inclination of the second reflecting surface 431 shown in FIG. 4E, and the optical waveguide 420 is cut until it crosses the core 421. I will do it. Thereby, the 1st reflective surface 431 is formed.

  In the second step shown in FIG. 4C, the optical waveguide 420 is processed using the second dicing blade 452 having a cutting surface with an angle smaller than that of the first dicing blade 451. The angle formed by the cutting surface 452a of the second dicing blade 452 is equal to the inclination of the first reflecting surface 432 shown in FIG. 4 (e), and the first dicing blade 451 is formed in the first step. The second dicing blade 452 is moved on the same axis to which is moved. Then, when the cutting surface 452a reaches the upper surface 420b of the optical waveguide 420 in contact with the printed wiring board 410, the cutting by the second dicing blade 452 is finished.

  By the first step and the second step, the first reflecting surface 431 and the second reflecting surface 432 of the optical path changing unit 430 are formed. At this time, the first reflection surface 431 and the second reflection surface 432 are connected at the interface between the core 421 and the clad 422. In the third step shown in FIG. 4D, the filling material 433 having a predetermined refractive index is filled into the holes 453 formed in the optical waveguide 420 in the first step and the second step. As the filling material 433, the material having the refractive index described in the optical circuit board 100 of the first embodiment is used.

  Further, in the fourth step shown in FIG. 4E, at least a part of the printed wiring board 410 located at the upper part in the vertical direction of the second reflecting surface 432 is cut out to provide the light opening 440. Thereby, the optical circuit board 400 is manufactured.

  In the manufacturing method of the optical circuit board according to the present embodiment, the two reflecting surfaces 431 and 432 are formed using two kinds of dicing blades 451 and 452 having different angles of the cutting surface, and the reflecting surface included in the optical path changing unit 430. The optical path changing means 430 can be formed by using the same number of different types of dicing blades.

  Further, in the optical circuit board 300 of the third embodiment having three reflecting surfaces, the same process as that described with reference to FIG. 4 is used by using three types of dicing blades having different inclination angles of the cutting surfaces. The optical path changing means 330 can be formed. That is, between the first step and the second step, the first step is performed using another dicing blade having a cutting surface with a tip larger than the second angle and smaller than the first angle. And a step of cutting the clad between the printed wiring board and the core to a predetermined position along the same axis.

  Next, an optical circuit board manufacturing method according to the second embodiment of the present invention will be described with reference to FIG. The method for manufacturing an optical circuit board according to the present embodiment is to manufacture an optical path changing means by forming a filling material using a mold having a predetermined shape and installing it at a predetermined position of the optical waveguide.

  First, in the first step shown in FIG. 5A, the resin 502 for forming the filling material 533 is potted on the flat plate 501, and in the next step shown in FIG. The resin 502 is molded using the frame 503. A recess 503a having the same shape as the filling material 533 is formed in the mold 503, and the mold 503 is pressed down from above the resin 502 on the flat plate 501 so that the resin 502 is filled in the recess 503a. Then, the concave portion 503a is cured with the resin 502 filled therein.

  In the third step shown in FIG. 5C, the filling material 533 molded and cured in the second step is taken out from the mold 503, and the core 521 and the clad 522 are uncured and placed in a predetermined position. Install. At this time, the filling material 533 is positioned so that the first reflecting surface 531 of the optical path changing means 530 is in contact with the core 521 and the second reflecting surface 532 is in contact with the cladding 522. Thereafter, the core 521 and the clad 522 are cured, and further the clad 522 is applied on the core 521 and the filling material 533 and cured.

  Further, the optical circuit board 500 shown in FIG. 5D is manufactured by forming the optical opening 540 at a predetermined position of the printed wiring board 510 at a predetermined position. In the method of manufacturing an optical circuit board according to the present embodiment, the optical path changing unit 530 can be molded using only one mold 503 without using a plurality of dicing blades.

  An optical circuit board manufacturing method according to the third embodiment of the present invention will be described with reference to FIGS. FIG. 7D shows an optical circuit board 600 manufactured by the manufacturing method of this embodiment. In the manufacturing method of the present embodiment, the filling material 633 is molded using a mold as in the manufacturing method of the second embodiment, but in the present embodiment, the first material is formed at the interface with the core 621. The first filling material 633a for forming the first reflecting surface 631 and the second filling material 633b for forming the second reflecting surface 632 at the interface with the cladding 622 are molded in separate molds, respectively. Like to do.

  In FIG. 6, the first filling material 633a is molded in the first to third steps shown in (a) to (c), and the fourth to sixth steps shown in (d) to (f). The second filling material 633b is molded in the process. (The molding procedure is the same as that described with reference to FIGS. 5A and 5B according to the second embodiment.)

  The optical circuit board 600 is formed in each step shown in FIG. 7 using the first filling material 633a and the second filling material 633b thus molded. First, in the seventh step shown in FIG. 7A, until the second filling material 633b comes into contact with the printed circuit board 610 with the uncured lower clad 622a placed on one surface of the printed circuit board 610. After pressing, the lower cladding 622a is cured.

  In the next eighth step shown in FIG. 7B, an uncured core 621 is placed on the lower clad 622a, and the first filling material 633a and the second filling material 633b are left uncured. Press until it touches. At this time, the first filling material 633a is positioned so that the first reflection surface 631 of the first filling material 633a and the second reflection surface 632 of the second filling material 633b are continuously connected. Thereafter, the core 621 is cured.

  Next, in the ninth step shown in FIG. 7C, an uncured upper clad 622b is placed on the upper portion of the core 621, and this is cured to complete the optical waveguide 620. In the tenth step shown in FIG. 7D, at least a part of the printed circuit board 610 in the direction perpendicular to the second reflecting surface 632 is cut to form the light opening 640.

  As described above, in the case where the filling material 633a that forms the interface with the core 621 and the filling material 633b that forms the interface with the clad 622 are molded using different molds in different steps, the lower clad 622a is formed. The filling material 633b can be fixed when cured, and the filling material 633a can be fixed when the core 621 is cured. Thereby, positioning of the filling material 633 is facilitated, and the optical circuit board 600 can be efficiently manufactured.

  In addition, the description in this Embodiment shows an example of the optical circuit board which concerns on this invention, and its manufacturing method, It is not limited to this. The detailed configuration and detailed operation of the optical circuit board and the like in this embodiment can be changed as appropriate without departing from the spirit of the present invention.

It is a figure explaining 1st Embodiment of the optical circuit board of this invention. It is a figure explaining 2nd Embodiment of the optical circuit board of this invention. It is a figure explaining 3rd Embodiment of the optical circuit board of this invention. It is a figure explaining 1st Embodiment of the manufacturing method of the optical circuit board of this invention. It is a figure explaining 2nd Embodiment of the manufacturing method of the optical circuit board of this invention. It is a figure explaining 3rd Embodiment of the manufacturing method of the optical circuit board of this invention. It is a figure explaining 3rd Embodiment of the manufacturing method of the optical circuit board of this invention. It is a figure explaining the conventional optical path changing means.

Explanation of symbols

100, 200, 300, 400, 500, 600 Optical circuit board 110, 210, 310, 410, 510, 610 Printed wiring board 111 Insulating layer 112 Conductive pattern layer 120, 220, 320, 420, 520, 620 Optical waveguide 121, 221, 321, 421, 521, 621 Core 122, 222, 322, 422, 522, 622 Clad 130, 230, 330, 430, 530, 630 Optical path changing means 131, 231, 331, 431, 531, 631 Reflective surface 132, 232, 332, 432, 532, 632 Second reflective surface 133, 233, 330, 430, 530, 630 Supplementary material 140, 240, 340, 440, 540, 640 Optical aperture 401 Optical circuit board material 451, 452 Dicing blade 502, 60 2 Resin 503, 603 Formwork 901 Optical waveguide 902 Reflecting surface 903 Air hole

Claims (10)

An optical waveguide having a printed wiring board, a core formed parallel to the printed wiring board and a clad surrounding the core, and an optical path conversion for converting the optical axis of the optical waveguide substantially perpendicular to the main surface of the printed wiring board An optical circuit board comprising means,
The optical path changing means is
A first reflecting surface consisting of a single plane crossing the core at a predetermined angle;
A second reflective surface comprising one or more planes that continuously cross one of the clads sandwiched between the core and the printed wiring board with the first reflective surface;
A filling material installed adjacent to the core and the clad with the first reflective surface and the second reflective surface as an interface,
The second reflecting surface is set at an angle closer to perpendicular to the first reflecting surface than the first reflecting surface.
An optical circuit board, wherein the optical axis of the optical waveguide is converted at least twice between the first reflecting surface and the second reflecting surface. The second reflecting surface is composed of two or more planes,
The angle formed with the main surface from the flat surface in contact with the end portion of the first reflecting surface to the flat surface in contact with the printed wiring board is sequentially formed so as to approach vertically. An optical circuit board according to 1. The refractive index of the filling material is determined on the basis of the refractive index of the core or the refractive index of the clad so that incident light is totally reflected by the first reflecting surface and the second reflecting surface. The optical circuit board according to claim 1 or 2. The filling material is composed of a first filling material adjacent to the core with the first reflecting surface as an interface, and a second filling material adjacent to the clad with the second reflecting surface as an interface,
The refractive index of the first filling material and the refractive index of the second filling material are the refractive index of the core and the refractive index of the core so that incident light is totally reflected by the first reflecting surface and the second reflecting surface, respectively. The optical circuit board according to claim 1, wherein the optical circuit board is determined based on a refractive index of the clad. An optical waveguide having a printed wiring board, a core formed parallel to the printed wiring board and a clad surrounding the core, and an optical path conversion for converting the optical axis of the optical waveguide substantially perpendicular to the main surface of the printed wiring board A method of manufacturing an optical circuit board comprising means,
Using a first dicing blade having a cutting surface with a tip formed at a first angle, the surface of the optical waveguide facing a surface contacting the printed wiring board along an axis perpendicular to the main surface A first step of cutting until crossing the core;
Using a second dicing blade having a cutting surface with a second angle smaller than the first angle at the tip, along the same axis as the first step, toward the predetermined position toward the printed wiring board A second step of cutting the clad between the printed wiring board and the core;
A third step of filling a hole in the optical waveguide formed in the first step and the second step with a filling material having a predetermined refractive index. Manufacturing method. Between the first step and the second step, using one or more other dicing blades having a cutting surface whose tip is larger than the second angle and smaller than the first angle, 6. The method according to claim 5, further comprising at least one step of cutting the clad between the printed wiring board and the core to a predetermined position along the same axis as the first step. Optical circuit board manufacturing method. An optical waveguide having a printed wiring board, a core formed parallel to the printed wiring board and a clad surrounding the core, and an optical path conversion for converting the optical axis of the optical waveguide substantially perpendicular to the main surface of the printed wiring board A method of manufacturing an optical circuit board comprising means,
A filling material is formed by filling a mold having a side surface composed of two or more planes whose angle formed with the bottom surface sequentially increases from the injection port toward the bottom surface, by filling a resin having a predetermined refractive index from the injection port. And the process of
When the core material and the clad material are uncured, the top surface is brought into contact with the printed wiring board, and the side surface composed of the two or more planes is brought into contact with the core material and the clad material. Two steps;
And a third step of shaping and curing the core material and the clad material so that the core material and the clad material are in contact with a predetermined flat surface of the side surface. . An optical waveguide having a printed wiring board, a core formed parallel to the printed wiring board and a clad surrounding the core, and an optical path conversion for converting the optical axis of the optical waveguide substantially perpendicular to the main surface of the printed wiring board A method of manufacturing an optical circuit board comprising means,
A first step of forming a first filling material by filling a first mold having a predetermined refractive index into a first mold having a side surface composed of a plane that forms a first angle with the bottom surface;
A second filling material is formed by filling a second mold having a side surface formed of a plane whose angle with the bottom surface is perpendicular to the first angle with a second resin having a predetermined refractive index. And the process of
A third step of press-fitting the second filling material into the uncured first clad material disposed on the printed wiring board until the upper surface is in contact with the printed wiring board;
A fourth step of press-fitting the first filling material into an uncured core material disposed on the first cladding material until an upper surface is in contact with the second filling material;
And a fifth step of placing and curing a second cladding material on the core material. A method of manufacturing an optical circuit board, comprising: The method for manufacturing an optical circuit board according to claim 8, wherein a resin having the same refractive index as that of the first resin is used for the second resin. The method for manufacturing an optical circuit board according to claim 8, wherein a resin having a predetermined refractive index different from that of the first resin is used for the second resin.

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