JP2008215904A - Device and method for measuring, substrate surface height, working device, and working method - Google Patents

Device and method for measuring, substrate surface height, working device, and working method Download PDF

Info

Publication number
JP2008215904A
JP2008215904A JP2007050972A JP2007050972A JP2008215904A JP 2008215904 A JP2008215904 A JP 2008215904A JP 2007050972 A JP2007050972 A JP 2007050972A JP 2007050972 A JP2007050972 A JP 2007050972A JP 2008215904 A JP2008215904 A JP 2008215904A
Authority
JP
Japan
Prior art keywords
substrate surface
height
measuring
substrate
arbitrary portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007050972A
Other languages
Japanese (ja)
Other versions
JP4882800B2 (en
Inventor
Kenichi Kaita
健一 戒田
Yasushi Mizuoka
靖司 水岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2007050972A priority Critical patent/JP4882800B2/en
Publication of JP2008215904A publication Critical patent/JP2008215904A/en
Application granted granted Critical
Publication of JP4882800B2 publication Critical patent/JP4882800B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method for measuring the height of an arbitrary part of a substrate surface without being affected by the material or the like of the substrate, and to provide a working device and method for controlling the height of a working part on the basis of the height of the measured arbitrary part. <P>SOLUTION: The device includes: a laser irradiation device 8 for irradiating the measurement point on the substrate surface with a laser beam to apply instantaneous thermal excitation; an ultrasonic sensor 9 for detecting a vibration wave generated from vibration excited on the substrate surface by the applied thermal excitation at a prescribed height position; a control part 10 for measuring the height h1 of the measurement point with respect to a substrate reference surface on the basis of the elapsed time since the thermal excitation is applied to the substrate surface until the vibration wave is detected; and a mount height control part 13 for calculating a mount height h3 by subtracting the height h1 of the measurement point with respect to the substrate reference surface from the mount height h2 which is preset with the substrate reference surface as the reference and controlling the height of a nozzle 7 on the basis of the mount height h3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、基板表面の任意箇所の高さを測定する基板表面高さ測定装置および基板表面高さ測定方法と、測定された任意箇所の高さに基づいて作業部の高さ制御を行う作業装置および作業方法に関するものである。   The present invention relates to a substrate surface height measuring device and a substrate surface height measuring method for measuring the height of an arbitrary location on the substrate surface, and an operation for controlling the height of the working unit based on the measured height of the optional location. The present invention relates to an apparatus and a working method.

部品の表面実装においては、実装ヘッドを基板表面に向けて下降させることで実装ヘッドにピックアップされた部品を基板表面に装着する手法がとられている。実装ヘッドの下降距離すなわち実装高さは、基板表面に部品を過不足のない荷重で装着することができるように制御されるが、基板の反り等により基板表面に凹凸が生じている場合、凹部に対しては荷重が不足し、凸部に対しては荷重が過大となり、いずれにしても実装品質の上で好ましくない状況を招くことになる。そこで従来、レーザ光を基板表面に照射してから反射光を受光するまでの経過時間の長短により基板表面の凹凸形状を検出し、この凹凸形状に基づいて実装高さを補正する方法が提案されている（特許文献１参照）。
特開２０００−２９９５９７号公報 In surface mounting of components, a technique is used in which a component picked up by a mounting head is mounted on the substrate surface by lowering the mounting head toward the substrate surface. The descending distance of the mounting head, that is, the mounting height, is controlled so that components can be mounted on the substrate surface with a load that is not excessive or insufficient, but if the substrate surface is uneven due to warpage of the substrate, etc. In this case, the load is insufficient, and the load is excessive on the convex portion. In any case, this leads to an unfavorable situation in terms of mounting quality. Therefore, conventionally, a method has been proposed in which the uneven shape of the substrate surface is detected based on the length of the elapsed time from when the laser beam is applied to the substrate surface until the reflected light is received, and the mounting height is corrected based on the uneven shape. (See Patent Document 1).
JP 2000-299597 A

しかしながら、基板が透光性の高い素材で形成されていたり、基板表面に鏡面状の電極等が形成されていたりする場合、レーザ光が基板表面で適切に反射しないことがあるため、凹凸が正確に検出できないという問題がある。一方、レーザ光に代えて超音波を使用する方法も知られており、超音波であれば基板の素材を問わないが、レーザ光と異なり超音波は指向性がないため、基板表面の任意の個所のみを検出対象とすることができないという問題がある。   However, if the substrate is made of a highly transparent material, or if a mirror-like electrode or the like is formed on the substrate surface, the laser beam may not be reflected properly on the substrate surface. There is a problem that cannot be detected. On the other hand, there is also known a method of using ultrasonic waves instead of laser light, and any substrate material can be used as long as the ultrasonic waves are used. There is a problem that it is not possible to set only a location as a detection target.

そこで本発明は、基板の素材等に影響されることなく基板表面の任意箇所の高さを測定する基板表面高さ測定装置および基板表面高さ測定方法と、測定された任意箇所の高さに基づいて作業部の高さ制御を行う作業装置および作業方法を提供することを目的とする。   Therefore, the present invention provides a substrate surface height measuring device and a substrate surface height measuring method for measuring the height of an arbitrary location on the substrate surface without being affected by the material of the substrate, and the measured height of the arbitrary location. It is an object of the present invention to provide a working device and a working method for controlling the height of a working unit based on the above.

請求項１記載の基板表面高さ測定装置は、基板表面の任意個所に対して瞬間的な熱刺激を印加する熱刺激印加手段と、印加された熱刺激により基板表面に励起された振動から生じる振動波を所定の高さ位置で検知する振動波検知手段と、基板表面に熱刺激を印加してから熱振動波を検知するまでの経過時間に基づいて基板表面の任意個所の高さを測定する測定手段を備えた。   The apparatus for measuring the height of a substrate surface according to claim 1 is generated from thermal stimulation applying means for applying instantaneous thermal stimulation to an arbitrary portion of the substrate surface, and vibration excited on the substrate surface by the applied thermal stimulation. Measures the height of any part of the substrate surface based on the vibration wave detection means that detects the vibration wave at a predetermined height and the elapsed time from when the thermal stimulus is applied to the substrate surface until the thermal vibration wave is detected The measuring means is provided.

請求項２記載の基板表面高さ測定装置は請求項１に記載の基板表面高さ測定装置であって、前記熱刺激印加手段が、パルス状のレーザ光を基板表面の任意個所に照射することで瞬間的な熱刺激を印加する。   The substrate surface height measuring device according to claim 2 is the substrate surface height measuring device according to claim 1, wherein the thermal stimulation applying unit irradiates a pulsed laser beam to an arbitrary portion of the substrate surface. Apply an instantaneous thermal stimulus.

請求項３記載の基板表面高さ測定方法は、基板表面の任意個所に対して瞬間的な熱刺激を印加する工程と、印加された熱刺激により基板表面に励起された振動から生じる振動波を所定の高さ位置で検知する工程と、基板表面に熱刺激を印加してから振動波を検知するまでの経過時間に基づいて基板表面の任意個所の高さを測定する工程を含む。   The method for measuring the height of a substrate surface according to claim 3 includes a step of applying an instantaneous thermal stimulus to an arbitrary portion of the substrate surface, and a vibration wave generated from vibration excited on the substrate surface by the applied thermal stimulus. A step of detecting at a predetermined height position, and a step of measuring the height of an arbitrary portion of the substrate surface based on an elapsed time from the application of the thermal stimulus to the substrate surface until the vibration wave is detected.

請求項４記載の作業装置は、前記測定手段により測定された基板表面の任意個所の高さに基づいて基板表面の任意個所に対して作業する作業部の高さ制御を行う。   According to a fourth aspect of the present invention, the height of a working unit that works on an arbitrary portion of the substrate surface is controlled based on the height of the arbitrary portion of the substrate surface measured by the measuring means.

請求項５記載の作業方法は、前記測定手段により測定された基板表面の任意個所の高さに基づいて基板表面の任意個所に対して作業する作業部の高さ制御を行う。   According to a fifth aspect of the present invention, the height of a working unit that works on an arbitrary portion of the substrate surface is controlled based on the height of the arbitrary portion of the substrate surface measured by the measuring means.

本発明によれば、基板表面の任意箇所に印加された熱刺激により励起された振動から生じる振動波を検知することで基板表面の任意箇所の高さをスポット的に測定するので、基板の素材や測定箇所の周辺状況に影響されることなく正確な高さを測定することができる。   According to the present invention, the height of an arbitrary portion of the substrate surface is spot-measured by detecting a vibration wave generated from vibration excited by a thermal stimulus applied to an arbitrary portion of the substrate surface. The accurate height can be measured without being affected by the surrounding conditions of the measurement location.

本発明の実施の形態について図面を参照して説明する。図１は本発明の実施の形態の部品実装装置の斜視図、図２は本発明の実施の形態の基板表面高さ測定装置の構成図である。   Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a configuration diagram of a substrate surface height measuring apparatus according to an embodiment of the present invention.

最初に本発明の実施の形態の部品実装装置について説明する。図１において、部品実装装置１は基板に部品を表面実装する装置である。基板２は基板搬送レール３により部品実装装置１の所定位置に搬入される。部品は部品供給装置４に複数個収納されている。実装ヘッド５は直交ロボット６により基板２と部品供給装置の上方で水平移動可能であり、部品供給装置４からピックアップした部品を所定位置にある基板２に実装する。なお、図１では１つの基板２に対し実装ヘッド５と部品供給装置４が２つずつ設けられたデュアルヘッド型実装装置を示している。   First, a component mounting apparatus according to an embodiment of the present invention will be described. In FIG. 1, a component mounting apparatus 1 is an apparatus for surface mounting components on a substrate. The substrate 2 is carried into a predetermined position of the component mounting apparatus 1 by the substrate transport rail 3. A plurality of components are stored in the component supply device 4. The mounting head 5 can be moved horizontally above the substrate 2 and the component supply device by the orthogonal robot 6, and the components picked up from the component supply device 4 are mounted on the substrate 2 at a predetermined position. FIG. 1 shows a dual head type mounting apparatus in which two mounting heads 5 and two component supply devices 4 are provided on one substrate 2.

図２において、実装ヘッド５には複数のノズル７が設けられている。各ノズル７はそれぞれ独立して昇降動作が可能であり、実装時には基板表面に向けて下降し、部品が基板表面に接した後は部品を基板表面に対して押下することで荷重を印加し、部品と基板の接合強度を確保するようになっている。さらに実装ヘッド５にはレーザ照射装置８と超音波センサ９が併設されている。レーザ照射装置８は基板表面の任意箇所を測点としてパルス状のレーザ光（矢印ａ）を照射する装置である。レーザ光を受けた測点には熱刺激が印加され、基板表面に振動が励起される。この振動により測点を発信源とする振動波（破線ｂ）が発生し、レーザ照射装置８に併設された超音波センサ９により検知される。超音波センサ９は基板基準面から所定の高さ位置となる箇所に振動波を検知するセンサ部が設けられている。   In FIG. 2, the mounting head 5 is provided with a plurality of nozzles 7. Each nozzle 7 can be moved up and down independently, descends toward the substrate surface during mounting, and after the component contacts the substrate surface, a load is applied by pressing the component against the substrate surface, The bonding strength between the component and the board is ensured. Further, the mounting head 5 is provided with a laser irradiation device 8 and an ultrasonic sensor 9. The laser irradiation device 8 is a device that irradiates a pulsed laser beam (arrow a) using an arbitrary point on the substrate surface as a measuring point. A thermal stimulus is applied to the measuring point that has received the laser beam, and vibration is excited on the substrate surface. Due to this vibration, a vibration wave (broken line b) having a measurement point as a transmission source is generated and detected by an ultrasonic sensor 9 provided in the laser irradiation device 8. The ultrasonic sensor 9 is provided with a sensor unit that detects a vibration wave at a position at a predetermined height from the substrate reference plane.

基板基準面は表面に凹凸がなく平坦な状態にある基板２の表面高さに設定されている。この基板基準面は部品の実装高さを決定するための基準となっており、基板基準面と一致した高さにある基板２の表面に部品を過不足ない荷重を印加しながら実装することができるようにノズル７の下降量が設定されている。基板２の表面に凹凸がある場合、基板基準面より高い箇所では印加荷重が過大となり、基板基準面より低い箇所では印加荷重の不足が発生するので、実装に先立って実装予定の箇所を測点として基板基準面に対する高さを測定し、測定結果に基づいて実装高さの補正を行うことが必要となる。   The substrate reference surface is set to the surface height of the substrate 2 in a flat state with no irregularities on the surface. This board reference surface is a reference for determining the mounting height of the component, and the component can be mounted on the surface of the board 2 at a height coincident with the board reference surface while applying an appropriate load. The lowering amount of the nozzle 7 is set so that it can be done. If the surface of the substrate 2 is uneven, the applied load will be excessive at locations higher than the substrate reference surface, and the applied load will be insufficient at locations lower than the substrate reference surface. As described above, it is necessary to measure the height with respect to the substrate reference surface and correct the mounting height based on the measurement result.

次に本発明の実施の形態の基板表面高さ測定装置について説明する。図２において、基板表面高さ測定装置は、基板表面の任意個所に対して瞬間的な熱刺激を印加する熱刺激印加手段であるレーザ照射装置８と、印加された熱刺激により基板表面に励起された振動から生じる振動波を所定の高さ位置で検知する振動波検知手段である超音波センサ９と、基板表面に熱刺激を印加してから熱振動波を検知するまでの経過時間に基づいて基板表面の任意個所の高さを測定する測定手段である制御部１０とで構成されている。   Next, a substrate surface height measuring apparatus according to an embodiment of the present invention will be described. In FIG. 2, a substrate surface height measuring device is excited on a substrate surface by a laser irradiation device 8 which is a thermal stimulation applying unit that applies instantaneous thermal stimulation to an arbitrary portion of the substrate surface, and an applied thermal stimulation. Based on an ultrasonic sensor 9 which is a vibration wave detecting means for detecting a vibration wave generated from the generated vibration at a predetermined height position, and an elapsed time from when a thermal stimulus is applied to the substrate surface until the thermal vibration wave is detected. And a control unit 10 which is a measuring means for measuring the height of an arbitrary portion of the substrate surface.

制御部１０から出力部１１に出力信号が送信されると、レーザ照射装置８からパルス状
のレーザ光が測点に照射される。超音波センサ９が測点から発信された振動波を検知すると、入力部１２から制御部１０に入力信号が送信される。制御部１０において出力信号の送信時から入力信号の受信時までの経過時間に温度補正をした音速を乗ずることで測点から超音波センサ９のセンサ部までの距離が測定される。センサ部と基板基準面との距離は既知であるので、制御部１０は測点の基板基準面に対する高さｈ１を測定し、測定結果をノズルの昇降動作の制御を行う実装高さ制御部１３に送信する。 When an output signal is transmitted from the control unit 10 to the output unit 11, pulsed laser light is emitted from the laser irradiation device 8 to the measuring point. When the ultrasonic sensor 9 detects a vibration wave transmitted from the measuring point, an input signal is transmitted from the input unit 12 to the control unit 10. The distance from the measuring point to the sensor unit of the ultrasonic sensor 9 is measured by multiplying the elapsed time from the time when the output signal is transmitted to the time when the input signal is received by the control unit 10 by multiplying the sound speed with temperature correction. Since the distance between the sensor unit and the substrate reference surface is known, the control unit 10 measures the height h1 of the measurement point with respect to the substrate reference surface, and the measurement result controls the lifting operation of the nozzle. Send to.

実装高さ制御部１３は、基板基準面を基準として予め設定された実装高さｈ２から実装高さの補正量となる測点の基板基準面に対する高さｈ１を減ずる演算を行い、測点となった箇所に部品を実装する際の実装高さｈ３を算出し、この実装高さｈ３に基づいて測点となった箇所に部品を実装する際の実装高さ制御を行う。なお、図２に示すように基板表面が凸状に変形し、測点が基板基準面より上位にある場合はｈ２からｈ１を減じる演算を行うが、これとは逆に基板表面が凹状に変形し、測点が基板基準面より下位にある場合はｈ２にｈ１を加える演算を行うことになる。   The mounting height control unit 13 performs an operation of subtracting the height h1 of the measurement point, which is the correction amount of the mounting height, from the predetermined mounting height h2 with respect to the substrate reference surface as a reference, and the measurement point. The mounting height h3 when the component is mounted at the determined location is calculated, and the mounting height control when the component is mounted at the location that becomes the measurement point is performed based on the mounting height h3. As shown in FIG. 2, when the substrate surface is deformed into a convex shape and the measurement point is higher than the substrate reference plane, an operation of subtracting h1 from h2 is performed. On the contrary, the substrate surface is deformed into a concave shape. However, when the measurement point is lower than the substrate reference plane, an operation of adding h1 to h2 is performed.

なお、出力信号の送信時からレーザ光が基板表面に到達するまでの時間は、光速が音速の約９０万倍であることから超音波がセンサ部に到達するまでの時間に比べて極めて小さいので、上記の演算において考慮していない。また、上記の演算において測定された測点から超音波センサ９のセンサ部までの距離は、超音波センサ９が測点の鉛直上方に位置する場合に測点から超音波センサ９のセンサ部までの高さとすることができる。超音波センサ９は測点の鉛直上方に位置することが必須ではなく、適宜補正を行うことで測定距離を高さに変換することは可能である。   Note that the time from when the output signal is transmitted until the laser beam reaches the substrate surface is extremely small compared to the time until the ultrasonic wave reaches the sensor unit because the speed of light is approximately 900,000 times the speed of sound. This is not considered in the above calculation. The distance from the measurement point measured in the above calculation to the sensor unit of the ultrasonic sensor 9 is the distance from the measurement point to the sensor unit of the ultrasonic sensor 9 when the ultrasonic sensor 9 is positioned vertically above the measurement point. Can be as high as possible. It is not essential for the ultrasonic sensor 9 to be positioned vertically above the measurement point, and it is possible to convert the measurement distance to height by performing appropriate correction.

また、レーザ照射装置８は測点に確実にレーザ光を照射することが可能であれば配置は問われない。望ましくは、レーザ照射装置８と超音波センサ９を測点の略鉛直上方となる位置に配置することで、測点周辺に遮蔽物があっても測定結果に与える影響を最小限に抑えることが可能である。なお、熱刺激印加手段として、パルス状のレーザ光を照射するレーザ照射装置８の他に基板表面の任意個所に対してスポット的に瞬間的な熱刺激を印加する装置であれば使用することができる。また、振動波検知手段として、振動波に含まれる超音波成分を検知する超音波センサ９の他に振動波の到達を検知可能な装置であれば使用することができる。   Further, the laser irradiation device 8 may be arranged as long as it can reliably irradiate the measuring point with the laser beam. Desirably, by arranging the laser irradiation device 8 and the ultrasonic sensor 9 at a position substantially vertically above the measurement point, even if there is a shield around the measurement point, the influence on the measurement result can be minimized. Is possible. In addition to the laser irradiation device 8 that irradiates pulsed laser light, any device that applies instantaneous thermal stimulation in a spot manner to any part of the substrate surface can be used as the thermal stimulation application means. it can. In addition to the ultrasonic sensor 9 that detects an ultrasonic component included in the vibration wave, any device that can detect the arrival of the vibration wave can be used as the vibration wave detection means.

さらに、基板表面高さ測定装置は、基板表面に対して作業する作業部の高さ制御を行う必要がある作業装置、例えば、作業部となる実装ヘッドの実装高さ制御を行って基板表面に過不足のない荷重を印加しながら部品を実装する部品実装装置１を始め、作業部となる塗布ノズルの塗布高さ制御を行って基板表面に適正な厚さの接着用ボンドを塗布するボンド塗布装置等に適用することが可能である。この場合、基板表面高さ装置は様々な装置から発せられるノイズに囲まれた環境下で振動波のセンシングを行うことになり、ノイズが外乱となって振動波を正確に検知することが困難になる場合も考えられる。この場合、振動波のパターンを周囲のノイズパターンから明確に区別することができるように、レーザ光の出力パターンを調整することで対応することができる。また、超音波センサ９に通過帯域の外のすべての周波数を完全に減衰させるバンドパスフィルタを適用し、測点からのみ発信され得る周波数帯のみを検知できるようにすることでもセンシングの信頼性を高めることができる。   Furthermore, the substrate surface height measuring device is a work device that needs to control the height of a working unit that works on the substrate surface, for example, controls the mounting height of the mounting head that becomes the working unit and controls the mounting surface on the substrate surface Bond coating that applies an adhesive bond with an appropriate thickness to the substrate surface by controlling the coating height of the coating nozzle as a working part, including the component mounting apparatus 1 that mounts components while applying a load with no excess or deficiency It can be applied to a device or the like. In this case, the substrate surface height device senses vibration waves in an environment surrounded by noise emitted from various devices, and noise becomes a disturbance and it is difficult to accurately detect vibration waves. It may be possible. This case can be dealt with by adjusting the output pattern of the laser beam so that the vibration wave pattern can be clearly distinguished from the surrounding noise pattern. In addition, by applying a bandpass filter that completely attenuates all frequencies outside the pass band to the ultrasonic sensor 9, it is possible to detect only the frequency band that can be transmitted only from the measuring point, thereby improving the reliability of sensing. Can be increased.

本発明によれば、基板表面の任意箇所に印加された熱刺激により励起された振動から生じる振動波を検知することで基板表面の任意箇所の高さをスポット的に測定するので、基板の素材や測定箇所の周辺状況に影響されることなく正確な高さを測定することができるという利点を有し、基板表面の高さを正確に測定する必要のある表面実装分野やボンド塗
布分野において有用である。 According to the present invention, the height of an arbitrary portion of the substrate surface is spot-measured by detecting a vibration wave generated from vibration excited by a thermal stimulus applied to an arbitrary portion of the substrate surface. This is advantageous in that it can measure the exact height without being affected by the surrounding conditions of the measurement location, and is useful in the field of surface mounting and bond coating where it is necessary to accurately measure the height of the substrate surface. It is.

本発明の実施の形態の部品実装装置の斜視図The perspective view of the component mounting apparatus of embodiment of this invention 本発明の実施の形態の基板表面高さ測定装置の構成図Configuration diagram of substrate surface height measuring apparatus according to an embodiment of the present invention

符号の説明Explanation of symbols

２ 基板
８ レーザ照射装置
９ 超音波センサ
１０ 制御部
１１ 出力部
１２ 入力部
１３ 実装高さ制御部 2 Substrate 8 Laser irradiation apparatus 9 Ultrasonic sensor 10 Control unit 11 Output unit 12 Input unit 13 Mounting height control unit

Claims (5)

基板表面の任意個所に対して瞬間的な熱刺激を印加する熱刺激印加手段と、印加された熱刺激により基板表面に励起された振動から生じる振動波を所定の高さ位置で検知する振動波検知手段と、基板表面に熱刺激を印加してから熱振動波を検知するまでの経過時間に基づいて基板表面の任意個所の高さを測定する測定手段を備えた基板表面高さ測定装置。   Thermal stimulation application means for applying instantaneous thermal stimulation to any part of the substrate surface, and vibration waves for detecting vibration waves generated from vibration excited on the substrate surface by the applied thermal stimulation at a predetermined height position A substrate surface height measuring apparatus comprising: a detecting means; and a measuring means for measuring a height of an arbitrary portion of the substrate surface based on an elapsed time from when a thermal stimulus is applied to the substrate surface until a thermal vibration wave is detected. 前記熱刺激印加手段が、パルス状のレーザ光を基板表面の任意個所に照射することで瞬間的な熱刺激を印加する請求項１に記載の基板表面高さ測定装置。   The substrate surface height measuring apparatus according to claim 1, wherein the thermal stimulation applying unit applies instantaneous thermal stimulation by irradiating an arbitrary portion of the substrate surface with a pulsed laser beam. 基板表面の任意個所に対して瞬間的な熱刺激を印加する工程と、印加された熱刺激により基板表面に励起された振動から生じる振動波を所定の高さ位置で検知する工程と、基板表面に熱刺激を印加してから振動波を検知するまでの経過時間に基づいて基板表面の任意個所の高さを測定する工程を含む基板表面高さ測定方法。   A step of applying an instantaneous thermal stimulus to an arbitrary portion of the substrate surface, a step of detecting a vibration wave generated from vibration excited on the substrate surface by the applied thermal stimulus at a predetermined height position, and a substrate surface A substrate surface height measuring method including a step of measuring a height of an arbitrary portion of a substrate surface based on an elapsed time from application of a thermal stimulus to detection of a vibration wave. 前記測定手段により測定された基板表面の任意個所の高さに基づいて基板表面の任意個所に対して作業する作業部の高さ制御を行う作業装置。   A working apparatus that performs height control of a working unit that works on an arbitrary portion of the substrate surface based on the height of the arbitrary portion of the substrate surface measured by the measuring unit. 前記測定手段により測定された基板表面の任意個所の高さに基づいて基板表面の任意個所に対して作業する作業部の高さ制御を行う作業方法。   A work method for controlling the height of a working unit for working on an arbitrary portion of the substrate surface based on the height of the arbitrary portion of the substrate surface measured by the measuring means.
JP2007050972A 2007-03-01 2007-03-01 Component mounting equipment Expired - Fee Related JP4882800B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007050972A JP4882800B2 (en) 2007-03-01 2007-03-01 Component mounting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007050972A JP4882800B2 (en) 2007-03-01 2007-03-01 Component mounting equipment

Publications (2)

Publication Number Publication Date
JP2008215904A true JP2008215904A (en) 2008-09-18
JP4882800B2 JP4882800B2 (en) 2012-02-22

Family

ID=39836124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007050972A Expired - Fee Related JP4882800B2 (en) 2007-03-01 2007-03-01 Component mounting equipment

Country Status (1)

Country Link
JP (1) JP4882800B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011164402A (en) * 2010-02-10 2011-08-25 Shin-Etsu Chemical Co Ltd Method for manufacturing pellicle
KR101101191B1 (en) 2010-12-03 2012-01-03 주식회사 나래나노텍 Method of automatically measuring and adjusting gap height of nozzle device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57153209A (en) * 1981-03-17 1982-09-21 Toshiba Corp Minute dimension measuring device
JPH07248218A (en) * 1994-03-10 1995-09-26 Nippon Sheet Glass Co Ltd Shape-measuring apparatus
JP2000055642A (en) * 1998-08-04 2000-02-25 Shin Etsu Chem Co Ltd Measuring method of fluctuation of pellicle height and measuring method thereof
JP2000171232A (en) * 1998-12-03 2000-06-23 Toshiba Corp Ultrasonic wave measuring instrument
JP2000299597A (en) * 1999-04-12 2000-10-24 Sony Corp Apparatus and method for mounting component
JP2005300182A (en) * 2004-04-06 2005-10-27 Toshiba Corp Laser beam machining system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57153209A (en) * 1981-03-17 1982-09-21 Toshiba Corp Minute dimension measuring device
JPH07248218A (en) * 1994-03-10 1995-09-26 Nippon Sheet Glass Co Ltd Shape-measuring apparatus
JP2000055642A (en) * 1998-08-04 2000-02-25 Shin Etsu Chem Co Ltd Measuring method of fluctuation of pellicle height and measuring method thereof
JP2000171232A (en) * 1998-12-03 2000-06-23 Toshiba Corp Ultrasonic wave measuring instrument
JP2000299597A (en) * 1999-04-12 2000-10-24 Sony Corp Apparatus and method for mounting component
JP2005300182A (en) * 2004-04-06 2005-10-27 Toshiba Corp Laser beam machining system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011164402A (en) * 2010-02-10 2011-08-25 Shin-Etsu Chemical Co Ltd Method for manufacturing pellicle
CN102189066A (en) * 2010-02-10 2011-09-21 信越化学工业株式会社 Dustproof film assembly manufacturing method
KR101101191B1 (en) 2010-12-03 2012-01-03 주식회사 나래나노텍 Method of automatically measuring and adjusting gap height of nozzle device

Also Published As

Publication number Publication date
JP4882800B2 (en) 2012-02-22

Similar Documents

Publication Publication Date Title
US11631653B2 (en) Ultrasonic bonding apparatus, ultrasonic bonding inspection method and ultrasonically-bonded portion fabrication method
JP5260644B2 (en) Method for detecting contact point of laser beam at edge of object and laser processing machine
US20190234908A1 (en) Oscillation analysis on an object produced by means of additive manufacturing
JP4882799B2 (en) Component mounting equipment
CN105551930A (en) Semiconductor apparatus manufacturing method and manufacturing apparatus
JP2009175136A (en) Ultrasonic measuring method, electronic component manufacturing method, and semiconductor package
JP4882800B2 (en) Component mounting equipment
KR20180041591A (en) Wafer for inspection, and method of using wafer for inspection
CN105783802A (en) Structural deformation detecting device
US10830710B2 (en) Method and device for inspecting a semiconductor device
JP2012230053A (en) Crack depth measuring device and measuring method
KR20120106051A (en) Solder reflow equipment and method
TWI698301B (en) Cutting method and laser processing device
JP2010016090A (en) Substrate manufacturing apparatus
US20130011941A1 (en) Bond line thickness control for die attachment
US7336087B2 (en) Circuit board test device comprising contact needles which are driven in diagonally protruding manner
CN102101215B (en) Laser machining device with laser beam analyzer
JP2018122348A (en) Ultrasonic bonding apparatus and horn replacement informing device for the same
JP2005340780A (en) Electronic component mounting device and electronic component mounting method
TW584719B (en) Method and device for measuring the amplitude of a freely oscillating capillary of a wire bonder
JP2016119374A (en) Wire bonding device and wire bonding method
JP4646862B2 (en) Semiconductor chip ultrasonic bonding method and ultrasonic bonding apparatus therefor
JP2018122346A (en) Ultrasonic bonding apparatus and heat flow sensor fitting structure
JP7046483B2 (en) Electronic component mounting system and electronic component mounting method
US20230392921A1 (en) Measurement device, measurement method, and bonding system

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090213

RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20091127

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110408

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110419

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110530

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111108

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111121

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141216

Year of fee payment: 3

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141216

Year of fee payment: 3

LAPS Cancellation because of no payment of annual fees