JP2008212363A - Endoscope - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an endoscope capable of protecting an electronic component provided in the endoscope from heat. <P>SOLUTION: This endoscope comprises a housing 24 storing a circuit board 25 having an electronic component 251 and forming a space C toward the circuit board 25, a housing 23 storing the housing 24 and forming a space B toward the housing 24, and a check valve 21 capable of changing the pressure of the space B, wherein the check valve 21 is configured to change the insulative property of the space B by changing the pressure of the space B. The check valve 21 is configured to irreversibly reduce the pressure of the space B with the decrease in the external pressure of the housing 23. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an endoscope.

  Endoscopes can be used to observe organs in body cavities by inserting an elongated insertion part of the endoscope into the body cavity, and to perform various treatments using treatment tools inserted into the insertion channel of the treatment tool as necessary. Widely used in medical fields. The distal end of the insertion portion is provided with a bending portion and a distal end portion, and an operator or the like is bent by a wire connected to the endoscope operation portion, whereby the objective lens of the observation optical system disposed in the distal end portion The observation direction can be changed.

  Endoscopes are cleaned, disinfected or sterilized after use to prevent infection. As a method of sterilization, a high-temperature high-pressure steam sterilization (autoclave) method is known, and in this method, an endoscope is sterilized using a dedicated autoclave device. Sterilization and sterilization using an autoclave device has been widely used in many fields because of its low running cost and the absence of harmful substances.

  An endoscope is provided with electronic components such as an imaging device for imaging and an electric circuit for driving the imaging device, but such electronic components are vulnerable to heat. For this reason, there is a problem in that deterioration of electronic components is accelerated by high-temperature processing in an autoclave apparatus.

  In Patent Document 1, the electronic component is accommodated in the housing in a state of being supported by the inner wall of the housing constituting the exterior. However, when exposed to the high temperature treatment as described above, the gas in the housing becomes high temperature. As a result, the electronic component also becomes high temperature.

Japanese Patent No. 3490687

  The objective of this invention is providing the endoscope which can protect the electronic component with which the endoscope was equipped from heat.

The object is achieved by the present inventions (1) to (15) below.
(1) An endoscope having a circuit board provided with electronic components,
A first housing that houses the circuit board;
An endoscope comprising: a second housing that accommodates the first housing via a heat insulating layer configured by a space in a negative pressure state.

  Thereby, since a heat insulation layer heat-insulates between the exterior of a 2nd housing, and a circuit board, an electronic component can be protected from a heat | fever.

(2) An endoscope having a circuit board with electronic components,
A first housing that houses the circuit board and forms a first space with the circuit board;
A second housing that houses the first housing and forms a second space with the first housing;
Pressure changing means capable of changing the pressure of the second space;
The endoscope, wherein the pressure changing means is configured to change a heat insulation characteristic of the second space by changing a pressure of the second space.

  Thus, even when the temperature is high, such as during autoclave sterilization, the pressure changing means places the second space in a negative pressure state, so that the second space is located between the outside of the second housing and the circuit board. Insulation can be used to protect the electronic components from heat. In addition, when the endoscope is used (when the electronic component is operated), the pressure changing means releases the negative pressure state of the second space, so that the heat transfer property of the second space is increased, and the circuit board. This heat can be positively released to the outside of the second housing through the second space. Therefore, it is possible to prevent overheating of the electronic component and prevent problems such as failure and malfunction of the electronic component.

  (3) The pressure change unit according to (2), wherein the pressure changing unit is configured to irreversibly decrease the pressure in the second space as the pressure outside the second housing decreases. Endoscope.

  Thereby, the second space can be brought into a negative pressure state without using a means such as a pump for decompression by utilizing the negative pressure environment in the pre-process of autoclave sterilization.

  (4) The pressure changing means is provided in the communication portion that communicates the second space with the outside of the second housing, and is provided in the communication portion, and the outside of the second housing from the second space. The endoscope according to (3), further comprising: a check valve that prevents gas from passing from the outside of the second housing to the second space while allowing gas to pass through.

  Thus, while making the configuration of the pressure changing means relatively simple, the second pressure can be obtained by using a negative pressure environment in the previous process of autoclave sterilization without requiring a means such as a pressure reducing pump. The space can be in a negative pressure state.

  (5) The endoscope according to any one of (2) to (4), wherein the pressure changing unit is configured to be able to bring the second space into an atmospheric pressure state when the circuit board is used.

  Thereby, when the endoscope is used (when the electronic component is operated), the heat transfer property of the second space is increased, and the heat of the circuit board is released to the outside of the second housing through the second space. be able to.

  (6) A third housing that houses the second housing and forms a third space with the second housing, and other pressure changing means capable of changing the pressure in the third space And the other pressure changing means is configured to change the heat insulation characteristics of the third space by changing the pressure of the third space. The endoscope according to any one of the above.

  As a result, even when the temperature is high, such as during autoclave sterilization, the other space is placed in a negative pressure state by the other pressure changing means, so that the third space is located between the outside of the third housing and the circuit board. It is possible to insulate the gap and more reliably protect the electronic component from heat. Further, when the endoscope is used (when the electronic component is activated), the other pressure changing means releases the negative pressure state of the third space, thereby improving the heat transfer property of the third space, The heat of the circuit board can be positively released to the outside of the third housing through the third space. For this reason, it is possible to more reliably prevent overheating of the electronic component and prevent problems such as failure and malfunction of the electronic component.

  (7) In the above (6), the other pressure changing means is configured to irreversibly decrease the pressure in the third space as the pressure outside the third housing decreases. The endoscope described.

  Thereby, the third space can be brought into a negative pressure state without using a means such as a pump for decompression by utilizing the negative pressure environment in the pre-process of autoclave sterilization.

  (8) The other pressure changing means is provided in the other communication portion that communicates the third space and the outside of the third housing, and the other communication portion. The above (7), comprising: another check valve that allows the passage of gas to the outside of the third housing and prevents the passage of gas from the outside of the third housing to the third space. The endoscope described.

  Thus, while making the configuration of the other pressure changing means relatively simple, it is possible to use the negative pressure environment in the previous process of autoclave sterilization and the like without requiring a separate means such as a decompression pump. 3 space can be made into a negative pressure state.

  (9) The internal pressure according to any one of (6) to (8), wherein the other pressure changing means is configured to be able to bring the third space into an atmospheric pressure state when the circuit board is used. mirror.

  Thereby, when the endoscope is used (when the electronic component is operated), the heat transfer property of the third space is increased, and the heat of the circuit board is released to the outside of the third housing through the third space. be able to.

  (10) Between the first housing and the second housing, the first housing is supported with respect to the second housing, and the support member is configured by using a heat insulating material as a main material. The endoscope according to any one of 1) to (9).

  Thereby, the first housing can be supported with respect to the second housing while preventing heat transfer from the second housing to the first housing.

  (11) The endoscope according to any one of (1) to (10), wherein the first housing and / or the second housing is configured with a ferromagnetic material as a main material.

  As a result, leakage of electromagnetic waves from the circuit board to the outside and mixing of electric field noise from the outside to the circuit board can be prevented.

  (12) The endoscope according to (11), wherein the first housing and / or the second housing is subjected to rust prevention treatment in the vicinity of a surface thereof.

  Accordingly, it is possible to prevent leakage of electromagnetic waves from the circuit board to the outside and mixing of electric field noise from the outside to the circuit board while preventing rust of the first housing and the second housing.

  (13) Any one of (1) to (12), further including a thermally conductive member that is interposed between the circuit board and the first housing and transfers heat from the circuit board to the first housing. The endoscope described.

  Thereby, the heat transfer from the circuit board to the first housing can be made excellent. Therefore, the heat of the circuit board can be more efficiently released to the outside of the second housing when the endoscope is used (when the electronic component is operated).

  (14) The endoscope according to any one of (2) to (13), wherein the first space is a sealed space maintained in an atmospheric pressure state.

  Thereby, the influence of the pressure of the external environment with respect to a circuit board can be prevented, and malfunctions, such as damage and malfunctioning of an electronic component, can be prevented. Further, the heat transfer from the circuit board to the first housing can be made excellent. Therefore, the heat of the circuit board can be more efficiently released to the outside of the second housing when the endoscope is used (when the electronic component is operated).

  (15) A part of each of the first housing and the second housing is formed by a hermetic connector, and the circuit board is electrically connected to the outside of the second housing through these parts. The endoscope according to any one of (1) to (14).

  Thereby, the first space and the second space can be electrically connected to the circuit board externally while increasing the airtightness of the first space and the second space when necessary.

  According to the present invention, the space between the first housing and the second housing can insulate between the outside of the second housing and the circuit board, thereby protecting the electronic component from heat.

  In addition, if the pressure in the space between the outside of the second housing and the circuit board can be changed, the space between the first housing and the second housing can be changed even at high temperatures such as during autoclave sterilization. By setting the space in a negative pressure state, the space can insulate between the outside of the second housing and the circuit board and protect the electronic component from heat. On the other hand, when the endoscope is used (when the electronic component is operated), the negative pressure state of the space between the first housing and the second housing is released, thereby improving the heat transfer property of the space. Thus, the heat of the circuit board can be actively released to the outside of the second housing through the space. Therefore, it is possible to prevent overheating of the electronic component and prevent problems such as failure and malfunction of the electronic component.

  Hereinafter, an endoscope of the present invention is explained in detail based on a suitable embodiment shown in an accompanying drawing. In the following, the case where the endoscope of the present invention is applied to a medical endoscope, particularly, an electronic endoscope (electronic scope) will be described.

  1 is an overall view showing an electronic endoscope according to an embodiment of the present invention, FIG. 2 is a partial cross-sectional view showing a light source insertion portion provided in the electronic endoscope shown in FIG. 1, and FIG. FIG. 4 is a diagram for explaining a heat insulating mechanism provided in the electronic endoscope shown in FIG. 1. Hereinafter, in FIG. 1, the upper side is described as “base end” and the lower side is described as “tip”.

  An electronic endoscope 10 (hereinafter referred to as “endoscope 10”) illustrated in FIG. 1 includes a long insertion portion flexible tube 11 having flexibility (flexibility), and an insertion portion flexible tube 11. The bending portion 12 provided at the distal end portion, the operation portion 13 provided at the proximal end portion of the insertion portion flexible tube 11 and operated by the operator to operate the endoscope 10 as a whole, and connected to the operation portion 13 The connecting portion flexible tube 14 and the light source insertion portion 15 provided on the distal end side of the connecting portion flexible tube 14 are provided.

  Each of the insertion portion flexible tube 11 and the connection portion flexible tube 14 is a flexible tube for an endoscope in which the outer periphery of a tubular core material having a hollow portion is covered with an outer skin.

  The insertion portion flexible tube 11 is used by being inserted into a body lumen such as a digestive tract, for example. The operation section 13 is provided with operation knobs 16 and 17 on the side surfaces thereof. When the operation knobs 16 and 17 are operated, a wire (not shown) disposed in the insertion portion flexible tube 11 is pulled, and the bending portion 12 is bent in, for example, four directions, and the direction can be changed. it can. An image sensor (not shown) (a solid-state image sensor such as a CMOS image sensor or a CCD) that captures a subject image at the observation site is provided at the distal end of the bending portion 12.

  The light source insertion portion 15 is provided with a light source connector 18 and an image signal connector 19 on the distal end side, and check valves 20 and 21 on the proximal end side.

  The check valves 20 and 21 are configured not to allow the passage of gas from the outside to the inside of the endoscope 10 while allowing the passage of gas from the inside of the endoscope 10 to the outside. By providing the check valves 20 and 21 having such a configuration in the light source insertion portion 15, the air in the endoscope 10 is released outside in the vacuum sterilization chamber of the autoclave device, and the internal pressure is lowered. Although a high-pressure steam atmosphere is sometimes obtained, entry of steam into the endoscope 10 is prevented. In other words, in the present embodiment, the check valves 20 and 21 constitute a communication portion that allows the inside and the outside of the endoscope 10 to communicate with each other when necessary. When performing autoclaving, the inside of the endoscope 10 is hidden behind. The pressure state can be maintained. The check valves 20 and 21 (light source insertion portion 15) will be described in detail later.

  The light source connector 18 is connected to the external device 200, and illumination light emitted from a light source device (not shown) provided in the external device 200 is connected to the light source connector 18, the light source insertion portion 15, and the connection portion. The distal end portion of the bending portion 12 passes through a light guide (not shown) by an optical fiber bundle arranged continuously in the flexible tube 14, the operation portion 13, the insertion portion flexible tube 11 and the bending portion 12. The observation site is illuminated and illuminated.

  The image signal connector 19 is connected to the external device 200, and the external device 200 is further connected to the monitor device 210 via the cable 220.

  The reflected light (subject image) from the observation site illuminated by the illumination light is imaged by the image sensor. The image sensor outputs an image signal corresponding to the captured subject image.

  This image signal is continuously arranged in the bending portion 12, the insertion portion flexible tube 11, the operation portion 13, and the connection portion flexible tube 14, and connects the image sensor and the image signal connector 19. The light is transmitted to the light source insertion portion 15 via an image signal cable (not shown).

  Then, predetermined processing (for example, signal processing, image processing, etc.) is performed in the light source insertion unit 15 and the light source device, and then input to the monitor device 210. The monitor device 210 displays an endoscope monitor image of a moving image captured by the image sensor.

Here, the check valves 20 and 21 (light source insertion portion 15) will be described in detail.
As shown in FIG. 2, the light source insertion portion 15 includes a housing (third housing) 22 that constitutes an exterior of the light source insertion portion 15, and a housing (second housing) 23 provided in the housing 22. And a housing 24 (first housing) provided in the housing 23.

  A space (third space) A in which the pressure can be changed by the check valve 20 is formed between the housing 22 and the housing 23, and the check valve 21 is formed between the housing 23 and the housing 24. Thus, a space (second space) B in which the pressure can be changed is formed, and the circuit board 25 including the electronic component 251 is accommodated in the housing 24, and the space between the housing 24 and the circuit board 25 is approximately A space (first space) C that is maintained at a constant pressure is formed.

Hereinafter, each part which comprises the light source insertion part 15 is demonstrated.
The housing 22 accommodates the housing 23 and forms a space A as a third space between the housing 23. One end of each of the connecting portion flexible tube 14, the light source connector 18, and the image signal connector 19 is fixed to the housing (third housing) 22.

  Further, the check valves 20 and 21 described above are attached to the housing 22 so as to protrude from the outer wall surface of the housing 22.

  In the present embodiment, the housing 22 is formed with a through hole 221 that penetrates the inside and outside of the housing 22, and the check valve 20 is disposed in the through hole 221. The check valve 20 and the housing 22 are hermetically sealed. Here, the through hole 221 functions as a communication portion (another communication portion) that allows the space A to communicate with the outside of the housing 22.

  The check valve 20 is configured to prevent the passage of gas from the outside of the housing 22 to the space A while allowing the passage of gas from the space A to the outside of the housing 22. Thus, the check valve 20 configured to restrict the gas flow direction to one direction is opened when the pressure outside the housing 22 is equal to or lower than a predetermined value (a negative pressure state equal to or lower than the predetermined pressure). When the pressure outside the housing 22 is equal to or higher than the predetermined value, the closed state is established. Therefore, the check valve 20 can irreversibly reduce the pressure in the space A as the pressure outside the housing 22 decreases.

  Here, the check valve 20 constitutes another pressure changing means for changing the pressure of the space A which is the third space. Such other pressure changing means changes the pressure in the space A, so that the heat insulation characteristics of the space A can be changed.

  In addition, the check valve (other pressure changing means) 20 can release the restriction on the gas flow direction as described above to make the space A into an atmospheric pressure state when desired, such as when the circuit board 25 is used. It is configured.

  The housing 22 is formed with a through hole 222 that penetrates the inside and outside of the housing 22, and the housing 23 is formed with a through hole 231 that penetrates the inside and outside of the housing 23. A stop valve 21 is provided. The space between the check valve 21 and the housing 22 and the space between the check valve 21 and the housing 23 are hermetically sealed. Here, the through-hole 231 functions as a communication portion that communicates the space B with the outside of the housing 22 (outside of the housing 23).

  The check valve 21 has the same configuration as the check valve 20 described above, and allows gas to pass from the outside of the housing 22 to the space B while allowing the gas to pass from the space B to the outside of the housing 22. It is configured to prevent the passage of. The check valve 21 configured to restrict the gas flow direction in one direction as described above is in an open state when the pressure outside the housing 22 is equal to or lower than a predetermined value (a negative pressure state equal to or lower than the predetermined pressure). When the pressure outside the housing 22 is equal to or higher than the predetermined value, the closed state is established. Therefore, the check valve 21 can irreversibly reduce the pressure in the space B as the pressure outside the housing 22 decreases.

  Here, the check valve 21 constitutes a pressure changing means for changing the pressure of the space B which is the second space. When the pressure changing means changes the pressure in the space B, the heat insulation characteristics of the space B can be changed.

  Further, the check valve (pressure changing means) 21 is configured to release the restriction on the gas flow direction as described above and to bring the space B into an atmospheric pressure state when desired, such as when the circuit board 25 is used. Has been.

  The housing 22 provided with such check valves 20 and 21 is, for example, PPS, LCP, PEEK, PSU, PPSU, PEI, fluororesin (PFA, FEP, PTFE, The main material is a resin such as ETFE). In addition, the constituent material of the housing 22 is not limited to what was mentioned above.

  The housing 23 accommodates the housing 24 and forms a space B as a second space between the housing 24 and the housing 24. As shown in FIG. 3, the housing 23 has a box 234 that opens upward in FIG. 3 and a lid 235 that covers the opening of the box 234. It is fixed by a plurality of screws 237. Further, an O-ring 236 made of fluorine rubber or the like is interposed between the box 234 and the lid 235, and the box 234 and the lid 235 are hermetically sealed. Yes. Such a housing 23 can access the inside of the housing 23 by removing the lid 235 when desired while securing the airtightness of the space B when in use.

  On the bottom surface of the box 234 of the housing 23, a support member 238 composed mainly of a heat insulating material is provided, and the housing 24 is fixed on the support member 238. That is, the housing 24 is supported by the housing 23 via the support member 238 having excellent heat insulation. Thereby, the housing 24 can be supported with respect to the housing 23 while preventing heat transfer from the housing 23 to the housing 24.

  The constituent material of the support member 238, that is, the heat insulating material is not particularly limited as long as it supports the housing 24 with respect to the housing 23 and has excellent heat insulating properties, and may be PPS, LCP, PEEK, PSU, PPSU, PEI, fluororesin (PFA, FEP, PTFE, ETFE) or the like can be used.

  A part of the housing 23 is composed of hermetic connectors 232 and 233. Thereby, the electrical connection inside and outside the housing 23 can be performed while ensuring the airtightness inside the housing 23 (space B).

  The housing 24 accommodates the circuit board 25 and forms a space C as a first space between the housing 24 and the circuit board 25. Such a housing 24 has a box 244 that opens upward in FIG. 3 and a lid 245 provided so as to cover the opening of the box 244, and these are fixed by a plurality of screws 247. ing. Further, an O-ring 246 made of fluorine-based rubber or the like is interposed between the box 244 and the lid 245, and the box 244 and the lid 245 are hermetically sealed. Yes. Such a housing 24 can access the inside of the housing 24 by removing the lid 245 when desired while ensuring the airtightness of the space C during use (specifically, repair or replacement of the circuit board 25 or the like). Maintenance).

  A part of the housing 24 is composed of hermetic connectors 242 and 243. Thereby, the electrical connection inside and outside the housing 24 can be performed while ensuring the airtightness in the housing 24 (space C). In the present embodiment, the circuit board 25 and the hermetic connectors 232 and 233 are electrically connected via the hermetic connectors 242 and 243. That is, the housings 23 and 24 are configured to electrically connect the circuit board 25 outside the housing 23 via the hermetic connectors 232, 233, 242, and 243. Thereby, it is possible to electrically connect the circuit board 25 to the outside while improving the airtightness of the space C and the space B when necessary.

  In the present embodiment, a heat conductive member 248 that transfers heat from the circuit board 25 to the housing 24 is interposed between the circuit board 25 and the housing 24. Thereby, the heat conductivity from the circuit board 25 to the housing 24 can be made excellent. Therefore, the heat of the circuit board 25 can be more efficiently released to the outside of the housing 23 when the endoscope 10 is used (when the electronic component is operated).

  The constituent material of the heat conductive member 248 is not particularly limited, but for example, Al, Cu, graphite, ceramics, and the like are preferably used. Alternatively, high thermal conductivity silicon (adhesive, sheet, gel type) may be used.

  The circuit board 25 is supported by the box 244 of the housing 24 via the support member 241. The support member 241 is preferably made of a material excellent in thermal conductivity and electrical conductivity, like the above-described thermal conductive member 248. As a result, the heat transfer from the circuit board 25 to the housing 24 can be made excellent, and the operation of the circuit can be stabilized by using the ground of the circuit board.

  The housing 24 is configured so that the space C, which is the internal space, is a sealed space in which the atmospheric pressure is maintained. Thereby, the influence of the pressure of the external environment on the circuit board 25 can be prevented (the load due to the pressure is reduced), and problems such as damage and malfunction of the electronic component 251 can be prevented. Further, the heat transfer from the circuit board 25 to the housing 24 can be made excellent. Therefore, the heat of the circuit board 25 can be more efficiently released to the outside of the housing 23 when the endoscope 10 is used (when the electronic component is operated).

  The constituent material of the housing 23 and / or the housing 24 is not particularly limited, and various resin materials, various metal materials, and the like can be used. The housing 23 and / or the housing 24 are composed of various hard magnetic materials and various soft magnetic materials. It is preferable that a ferromagnetic material such as is used as a main material. Thereby, leakage of electromagnetic waves from the circuit board 25 to the outside and mixing of electric field noise from the outside to the circuit board 25 can be prevented.

  In particular, the ferromagnetic material constituting the housing 23 and / or the housing 24 is preferably a soft magnetic material such as Fe, various Fe alloys (silicon iron, permalloy, amorphous, sendust, etc.), and soft magnetic ferrite. Thereby, leakage of electromagnetic waves from the circuit board 25 to the outside and mixing of electric field noise from the outside to the circuit board 25 can be prevented more reliably.

  When such a ferromagnetic material is used as the constituent material of the housing 23 and / or the housing 24, it is preferable that a rust-proofing treatment is performed in the vicinity of the surface of the housing 23 and / or the housing 24. Thereby, leakage of electromagnetic waves from the circuit board 25 to the outside and mixing of electric field noise from the outside to the circuit board 25 can be prevented while preventing rusting of the housing 23 and the housing 24.

  The endoscope 10 having the above-described configuration protects the circuit board 25 from heat even when it is exposed to a high temperature and high pressure state for a predetermined time (for example, 137 ° C. for 20 minutes) during autoclave processing or the like. Can do. Even if the airtightness of the endoscope is destroyed due to some factor, the operation of the electric circuit including the circuit board 25 can be reliably performed without the circuit board 25 being exposed to the steam of the autoclave.

Hereinafter, the operation of the endoscope 10 will be described by taking the case where the endoscope 10 is autoclaved as an example.
[1] Removal from External Device First, an operator or the like removes the light source insertion portion 15 from the external device 200 after the end of the examination. Thereby, the endoscope 10 is detached from the external device 200. In this state, the endoscope 10 is temporarily stored for autoclave processing.

  At this time, the check valves 20 and 21 are in a closed state, and the pressures in the spaces A, B, and C are atmospheric pressure.

[2] Autoclave treatment Next, the endoscope 10 is subjected to autoclave treatment.

  In this autoclave treatment, after the endoscope 10 is housed in a sterilization chamber provided in the autoclave apparatus, a depressurization step for depressurizing the sterilization chamber, and sterilization in which high-pressure and high-temperature steam is sent into the depressurized sterilization chamber for sterilization. Process.

  The depressurization step is a step for distributing high-pressure and high-temperature steam to the details of the endoscope 10 during the subsequent sterilization step. By adopting a configuration in which the sterilization step is performed after the depressurization step, the endoscope 10 sterilization can be performed reliably.

  In the decompression step, the endoscope 10 itself is placed under a negative pressure environment, and the check valves 20 and 21 are opened as shown in FIG. Thereby, the gas (air) in the space A is discharged via the check valve (communication portion) 20. Further, the gas (air) in the space B is discharged through the check valve 21. Therefore, each of the spaces A and B is decompressed in the same manner as in the sterilization chamber and is in a negative pressure state. Note that the pressure in the space C is maintained substantially equal to the atmospheric pressure.

  Since the check valve 20 prevents the flow (entrance) of gas into the space A and the check valve 21 prevents the flow (entrance) of gas into the space B, the negative pressure state as described above is released. Even so, the spaces A and B are maintained in the negative pressure state.

  Therefore, in the subsequent sterilization process, as shown in FIG. 4B, the check valve 20 prevents the high-pressure and high-temperature steam from entering the space A and maintains the space A in a negative pressure state. The stop valve 21 prevents the high-pressure and high-temperature steam from entering the space B, and maintains the space B in a negative pressure state. Note that the pressure in the space C is maintained substantially equal to the atmospheric pressure.

  Therefore, each space A and B functions as a heat insulation layer, and can protect the circuit board 25 from the high temperature in a sterilization process.

[3] After Autoclave Processing Next, the endoscope 10 that has been subjected to autoclave processing is taken out from the sterilization chamber.

  Although the spaces A and B are maintained in a negative pressure state by the action of the check valves 20 and 21 after being taken out from the sterilization chamber (after sterilization treatment), the operator or the like operates the check valves 20 and 21. By doing so, the negative pressure state is released. That is, by this operation, the spaces A and B communicate with the outside of the endoscope 10, and the spaces A and B return to the atmospheric pressure (normal pressure).

  By performing such an operation, the heat insulation properties of the spaces A and B can be reduced (that is, the heat transfer property can be increased). Therefore, when the endoscope 10 is used again after the autoclave process, the circuit board 25 (electronic component 251) can be actively dissipated. Thereby, the excessive temperature rise of the electronic component 251 can be prevented, and problems such as a failure or malfunction of the electronic component 251 can be prevented.

  In the endoscope 10 as described above, the space B functions as a heat insulating layer to insulate between the outside of the housing 23 and the circuit board 25, and thus can protect the electronic component 251 from heat.

  In particular, the endoscope 10 is configured to change the heat insulation characteristics of the space B by the check valve 21 changing the pressure of the space B, so that the excessive temperature rise of the electronic component 251 is reliably prevented. can do.

  For example, even at a high temperature such as during autoclave sterilization as described above, the check valve 21 places the space in a negative pressure state, so that the space B insulates between the outside of the housing 23 and the circuit board 25. Thus, the electronic component 251 can be protected from heat. On the other hand, when the endoscope 10 is used (when the electronic component 251 is activated), the check valve 21 releases the negative pressure state of the space B, thereby increasing the heat transfer property of the space B and the circuit board. 25 heat can be released to the outside of the housing 23 through the space B. Therefore, it is possible to prevent overheating of the electronic component 251 and prevent problems such as failure and malfunction of the electronic component 251.

  In addition, since the check valve 21 irreversibly decreases the pressure in the space B as the pressure outside the housing 23 (in the present embodiment, outside the housing 22) decreases, a pre-process of autoclave sterilization (the pressure reducing process described above) ), The space B can be brought into a negative pressure state without requiring a separate means such as a decompression pump.

  By using such a check valve 21, the configuration of the pressure changing means for changing the pressure in the space B can be made relatively simple.

  In addition, since the check valve 21 is configured so that the space B can be brought into an atmospheric pressure state when the circuit board 25 is used, the heat transfer property of the space B when the endoscope 10 is used (when the electronic component is activated). The heat of the circuit board 25 can be released to the outside of the housing 23 through the space B.

  Furthermore, in this embodiment, as described above, the circuit board 25 is covered with the three housings 22, 23, and 24, and the three spaces A and B are provided between the circuit board 25 and the outside of the endoscope 10. , C intervenes. And the non-return valve 20 is comprised so that the heat insulation characteristic of the space A may also be changed when the pressure of the space A is changed. Thereby, even at the time of high temperature such as during autoclave sterilization, the check valve 20 places the space A in a negative pressure state, so that the space A insulates between the outside of the housing 22 and the circuit board 25, The electronic component 251 can be more reliably protected from heat. On the other hand, when the endoscope 10 is used (when the electronic component 251 is operated), the check valve 20 releases the negative pressure state of the space A, thereby increasing the heat transfer property of the space A and the circuit board 25. The heat can be released to the outside of the housing 22 through the space A. Therefore, overheating of the electronic component 251 can be prevented more reliably, and problems such as failure and malfunction of the electronic component 251 can be prevented.

  In addition, since the check valve 20 is configured to irreversibly decrease the pressure in the space A as the pressure outside the housing 22 decreases, the negative pressure environment in the previous process of autoclave sterilization is used. Thus, the space A can be brought into a negative pressure state without requiring a separate means such as a decompression pump.

  By using such a check valve 20, the configuration of another pressure changing means for changing the pressure in the space A can be made relatively simple.

  In addition, since the check valve 20 is configured so that the space A can be brought into an atmospheric pressure state when the circuit board 25 is used, the heat transfer performance of the space A when the endoscope 10 is used (when the electronic component is activated). The heat of the circuit board 25 can be released to the outside of the housing 22 through the space A.

  The endoscope and the endoscope management system of the present invention have been described above with respect to the illustrated embodiments. However, the present invention is not limited to these embodiments, and the configuration of each member (each unit) has the same function. It can be replaced with an arbitrary one or an arbitrary configuration can be added.

  Further, the endoscope of the present invention is not limited to the application of an electronic endoscope (electronic scope), and can also be applied to an optical endoscope (fiberscope type endoscope).

1 is an overall view showing an electronic endoscope according to an embodiment of the present invention. It is a fragmentary sectional view showing a light source insertion part with which an electronic endoscope shown in Drawing 1 is provided. It is the sectional view on the AA line in FIG. It is a figure for demonstrating the heat insulation mechanism with which the electronic endoscope shown in FIG. 1 was equipped.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electronic endoscope 11 Insertion part flexible tube 12 Bending part 13 Operation part 14 Connection part flexible tube 15 Light source insertion part 16, 17 Operation knob 18 Light source connector 19 Image signal connector 20 Check valve 21 Check valve 22 Housing (third housing)
221 Through hole (other communication part)
222 Through-hole 23 Housing (second housing)
231 Through hole (communication part)
232, 233 Hermetic connector 234 Box 235 Lid 236 O-ring 237 Screw 238 Support member 24 Housing (first housing)
241 Support member (heat conduction member)
242 and 243 Hermetic connector 244 Box 245 Cover 246 O-ring 247 Screw 248 Thermally conductive member 25 Circuit board 251 Electronic component 200 External device 210 Monitor device 220 Cable A space (third space)
B space (second space)
C space (first space)

Claims (15)

An endoscope having a circuit board with electronic components,
A first housing that houses the circuit board;
An endoscope comprising: a second housing that accommodates the first housing via a heat insulating layer configured by a space in a negative pressure state. An endoscope having a circuit board with electronic components,
A first housing that houses the circuit board and forms a first space with the circuit board;
A second housing that houses the first housing and forms a second space with the first housing;
Pressure changing means capable of changing the pressure of the second space;
The endoscope, wherein the pressure changing means is configured to change a heat insulation characteristic of the second space by changing a pressure of the second space.   The endoscope according to claim 2, wherein the pressure changing means is configured to irreversibly decrease the pressure in the second space as the pressure outside the second housing decreases.   The pressure changing means is provided in the communication portion for communicating the second space and the outside of the second housing, and the gas from the second space to the outside of the second housing is provided in the communication portion. The endoscope according to claim 3, further comprising: a check valve that allows gas to pass from the outside of the second housing to the second space while allowing the gas to pass therethrough.   The endoscope according to any one of claims 2 to 4, wherein the pressure changing unit is configured to be able to bring the second space into an atmospheric pressure state when the circuit board is used.   A third housing for accommodating the second housing and forming a third space with the second housing; and another pressure changing means capable of changing a pressure in the third space. The said other pressure change means is comprised so that the heat insulation characteristic of the said 3rd space may be changed by changing the pressure of the said 3rd space. Endoscope.   The internal view according to claim 6, wherein the other pressure changing means is configured to irreversibly reduce the pressure in the third space as the pressure outside the third housing decreases. mirror.   The other pressure changing means is provided in the other communication portion that communicates the third space with the outside of the third housing, and is provided in the other communication portion. The internal view of Claim 7 provided with the other check valve which prevents passage of the gas from the exterior of the said 3rd housing to the said 3rd space, allowing the passage of the gas to the exterior of a housing. mirror.   The endoscope according to any one of claims 6 to 8, wherein the other pressure changing means is configured to be able to bring the third space into an atmospheric pressure state when the circuit board is used.   10. A support member configured to support the first housing with respect to the second housing between the first housing and the second housing and to be configured with a heat insulating material as a main material. The endoscope according to any one of the above.   The endoscope according to any one of claims 1 to 10, wherein the first housing and / or the second housing is configured with a ferromagnetic material as a main material.   The endoscope according to claim 11, wherein the first housing and / or the second housing is subjected to a rust prevention treatment in the vicinity of a surface thereof.   The endoscope according to any one of claims 1 to 12, further comprising a thermally conductive member that is interposed between the circuit board and the first housing and transfers heat from the circuit board to the first housing.   The endoscope according to any one of claims 2 to 13, wherein the first space is a sealed space maintained in an atmospheric pressure state.   A part of each of the first housing and the second housing is constituted by a hermetic connector, and the circuit board is electrically connected to the outside of the second housing via these. The endoscope according to any one of claims 1 to 14.

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