JP2008208443A - Vapor deposition film-forming apparatus, vapor deposition film formation method, and manufacturing method of display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vapor deposition film-forming apparatus and a vapor deposition film-forming method capable of uniformizing the distribution of vapor-deposited film thickness in the line direction of the vapor deposition source irrespective of the progress state of film formation, in the vapor deposition film-forming process using a line-type vapor deposition source. <P>SOLUTION: The vapor deposition film-forming apparatus includes a linear shaped crucible 12 to be filled with a vapor deposition material, a heat source 14 for heating the crucible 12, and a vapor deposition source 10 provided with a top surface plate 13a having a plurality of openings 11 arranged above the crucible 12 and linearly along the top surface plate 13a. A vapor deposition film is formed on a substrate such that the substrate to be a film-forming object is arranged opposedly to and above the vapor deposition source 10 and moved in a direction crossing at a right angle to the linearly extended direction of the vapor deposition source 10. The crucible 12 is partitioned by partition plates 12a so that a vapor deposition material m filled into the crucible 12 is uniformly consumed in the linearly extended direction when the vapor deposition material m is evaporated from the crucible 12 by being heated with the heat source 14. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a vapor deposition film forming apparatus, a vapor deposition film forming method, and a display device manufacturing method, and more particularly to a vapor deposition film forming apparatus having a line-type vapor deposition source, a vapor deposition film forming method, and a display device manufacturing method.

  In recent years, as a flat display device, a display device in which organic electroluminescent elements (organic EL elements) are arranged, that is, a so-called organic EL display has attracted attention. This organic EL display is a self-luminous flat panel display that does not require a backlight, and has an advantage that a display with a wide viewing angle peculiar to the self-luminous type can be realized. In addition, since only necessary pixels need to be lit, this is advantageous in terms of power consumption compared to the backlight type (liquid crystal display, etc.), and high-definition high-speed video signals that are expected to be put to practical use in the future. Is considered to have sufficient response performance.

The organic EL element used for such an organic EL display generally has a structure in which an organic material is sandwiched between electrodes (anode and cathode) from above and below. Then, holes are injected from the anode and electrons are injected from the cathode into the organic layer made of the organic material, and the holes and electrons are recombined in the organic layer to emit light. At this time, in the organic EL element, luminance of several hundred to several tens of thousands of cd / m ² can be obtained with a driving voltage of 10 V or less. In addition, by appropriately selecting an organic material (fluorescent substance), light emission of a desired color can be obtained. For these reasons, the organic EL element is regarded as very promising as a light-emitting element for constituting a multi-color or full-color display device.

  By the way, the organic material which forms the organic layer in an organic EL element has low water resistance, and cannot use a wet process. Therefore, when forming an organic layer, it is common to perform vacuum evaporation using a vacuum thin film formation technique. That is, as a vapor deposition film forming apparatus for an organic EL element for forming an organic layer, an apparatus having an organic material vapor deposition source in a vacuum chamber is widely used.

  As shown in FIG. 12, such a vapor deposition apparatus 200 includes a line-type vapor deposition source 201. The vapor deposition source 201 is provided with a plurality of openings 102a arranged in a line-shaped extending direction x, and vapor of a vapor deposition material m such as an organic material is supplied through the openings 201a. Then, the deposition film (organic layer) is formed on the substrate W by moving the substrate W, which is a film formation target, in a direction y orthogonal to the linear extending direction x.

  FIG. 13A shows a cross-sectional view in the side direction of the vapor deposition source 201 with respect to the linear extending direction x in FIG. FIG. 13B is a cross-sectional view of the vapor deposition source 201 viewed from the direction of the opening 201a in FIG. As shown in these drawings, the vapor deposition source 201 includes a crucible 203 filled with a vapor deposition material m, an outer box 205 in which the crucible 203 is detachably stored, and heats the crucible 203 through the outer box 205. A heat source 207.

  The crucible 203 has a configuration in which a plurality of openings 201a are arranged in a line on the top plate 205a of the outer box 205 located above the wide opening. These openings 201a are provided with an uneven pitch p1 adjusted so that the film thickness of the deposited film formed on the substrate W is made uniform based on the temperature distribution by heating from the heat source 207. (See Patent Document 1 below).

  The crucible 203 is divided into a plurality of rooms along a line-shaped extending direction x by a partition plate 203a for reinforcing the strength of the crucible 203 and heating the vapor deposition material m uniformly. Yes.

JP 2006-152441 A (see particularly paragraph 0032)

  However, in the vapor deposition film forming apparatus having the above-described configuration and the vapor deposition film forming method using the vapor deposition film forming apparatus, the vapor deposition material is discharged from the openings arranged at uneven pitches, so that the partition plate is moved along with the progress of the film formation. There is a difference in the consumption of the vapor deposition material in each room in the crucible partitioned by. Thereby, the filling amount (filling height) of the vapor deposition material in each room becomes non-uniform, and the temperature distribution in the crucible changes. Such a change in the temperature distribution causes a variation in the film thickness distribution of the deposited film in the line-shaped extending direction.

  In addition, when the deposition material is replenished in the crucible in a plurality of continuous repeated deposition film formation, the deposition material must be replenished according to the portion where the deposition material is consumed most quickly, and the replenishment frequency Is expensive and time consuming. In other words, when vapor deposition film formation is performed for a long time, the material in the room where the vapor deposition material is consumed first is exhausted due to the difference in the consumption of vapor deposition material in each room, and the distribution of the film thickness of the vapor deposition film varies. It is generated.

  In order to solve the above problems, it is possible to perform the deposition rate control by surely controlling the temperature in the extending direction of the line. However, since such control often causes mutual interference between control systems, it is extremely difficult to perform stable control.

  Therefore, the present invention provides a vapor deposition film that can make the distribution of the vapor deposition film thickness in the line direction of the vapor deposition source more uniform in the vapor deposition film formation using the line type vapor deposition source, regardless of the progress state of the film deposition. An object is to provide an apparatus, a vapor deposition film forming method, and a manufacturing method of a display device capable of arranging organic electroluminescent elements having uniform characteristics in a plane by applying the vapor deposited film forming method. To do.

  In order to achieve the above object, the vapor deposition apparatus of the present invention includes a line-shaped crucible filled with a vapor deposition material, a heat source for heating the crucible, and a plurality of lines arranged along the line shape disposed above the crucible. And a top surface plate provided with an opening, and a substrate that is a film formation target is opposed to the upper side of the deposition source and is opposed to a direction perpendicular to the line extending direction. The deposited film is formed on the substrate by moving it. In particular, the crucible is characterized in that the crucible is partitioned into a plurality of rooms by a partition plate provided at a non-uniform pitch in the line extending direction. These partition plates are provided so that the vapor deposition material filled in the crucible by heating with a heat source is evenly consumed in the line-shaped extending direction.

  The vapor deposition film forming method of the present invention is, for example, a vapor deposition film forming method using the above-described vapor deposition film forming apparatus, and the vapor deposition material filled in the crucible by dividing the inside of the crucible into a line extending direction. It is characterized in that the film is formed while consuming the film uniformly in the extending direction of the line. The present invention is also a method for manufacturing a display device that performs a process to which such a vapor deposition method is applied.

  According to the vapor deposition film forming apparatus, the vapor deposition film forming method, and the display device manufacturing method as described above, the filling amount (filling height) of the vapor deposition material is maintained in the line-shaped crucible regardless of the progress of film formation. It is kept uniform. For this reason, vapor deposition in the line-shaped extending direction is caused by non-uniformity in the filling amount of the vapor deposition material in the line-shaped extending direction in repeated vapor deposition film formation for a long time or in a long-time vapor deposition film forming. Variations in the film thickness are prevented, and a deposited film having a uniform film thickness can be obtained in the line-shaped extending direction.

  As described above, according to the present invention, in the vapor deposition film formation using the linear vapor deposition source, the vapor deposition film having a uniform film thickness is formed in the line extending direction regardless of the progress of the film formation. Is possible. As a result, it is possible to arrange organic electroluminescent elements with uniform characteristics on the substrate surface by providing a deposited film with a uniform film thickness, thereby obtaining a display device with excellent display characteristics. become.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<Vapor deposition system>
FIG. 1 is a schematic diagram showing a schematic configuration example of a vapor deposition film forming apparatus according to the present invention. Moreover, FIG. 2 (1) and FIG. 2 (2) are the cross-sectional schematic diagrams of each direction which show the structural example of the vapor deposition source based on this invention provided in this vapor deposition film-forming apparatus. In addition, the same code | symbol is attached | subjected and demonstrated to the component same as the conventional structure demonstrated using FIG.

  The vapor deposition film forming apparatus 1 shown in FIGS. 1 and 2 is for forming an organic layer on a substrate W made of, for example, a glass substrate in the manufacture of a display device using, for example, an organic electroluminescent element. is there. Such a vapor deposition film forming apparatus 1 has a vapor deposition source 10 of an organic material (vapor deposition material m) disposed in a vacuum chamber (not shown) and a transport for changing the relative position between the vapor deposition source 10 and the substrate W. Means (not shown).

  Among these, the vapor deposition source 10 is a so-called line type, and includes a plurality of openings 11 arranged in a line in a direction x substantially perpendicular to a direction in which the relative position of the substrate W can be changed (direction y indicated by an arrow in the figure). Have.

  FIG. 2A shows a cross-sectional view in the side surface direction of the vapor deposition source 10 with respect to the linear extending direction x in FIG. 2B is a cross-sectional view of the vapor deposition source 10 as viewed from the direction of the opening 11 in FIG.

  As shown in FIGS. 2 (1) and 2 (2), the vapor deposition source 10 includes a crucible 12 filled with a vapor deposition material m, an outer box 13 in which the crucible 12 is stored freely. And a heat source 14 for heating the crucible 12 through the outer box 13. Then, the opening 11 is arranged in a line on the top plate 13a of the outer box 13 which is the upper part of the wide-mouth opening in the crucible 12.

  The openings 11 are arranged along a line at each pitch p1 so that the film thickness distribution of the deposited film becomes more uniform. For this reason, here, it is assumed that the openings 11 are arranged at unequal pitches p1 according to the temperature distribution in the linear extending direction x generated by heating with the heat source 14, for example, in the direction in which the openings 11 are arranged. On the edge side, the intervals may be narrowed. The temperature distribution is assumed to be a temperature distribution when the vapor deposition material m is filled at a uniform height in the crucible 12.

  The crucible 12 has a filling portion of the vapor deposition material m in the interior thereof, which mainly reinforces the strength of the crucible 12 and is linearly extended by a partition plate 12a for the purpose of heating the vapor deposition material m evenly. It is divided into a plurality of rooms along x.

  As the material of the crucible 12 as described above, a material having good thermal conductivity is selected and used from heat resistant materials having low reactivity with the vapor deposition material m filled therein. Here, since an organic material is used as the vapor deposition material m, the crucible 12 is configured using tantalum (Ta), molybdenum (Mo), or the like. Further, the surface of a carbon (C) material having good thermal conductivity may be coated with Ta (tantalum) or Mo (molybdenum).

  And especially in this embodiment, there exists the characteristic in the arrangement | positioning state of the partition plate 12a in the crucible 12. That is, the partition plates 12a are provided at unequal pitches p2 based on the arrangement state of the openings 11. In particular, when the vapor deposition material m is evaporated from the crucible by heating with a heat source, these partition plates 12a consume the vapor deposition material m filled in the crucible 12 evenly in the line extending direction x. It is important that it is provided as follows.

  The partition plate 12a is arranged in such a state that the openings 11 are arranged at non-uniform pitches p1 in accordance with the temperature distribution in the linear extending direction x generated by heating with the heat source 14 as described above. It is set by a simulation assuming vapor deposition film formation.

  Moreover, it is preferable that the partition plate 12a arrange | positioned in this way is diagonally arrange | positioned with respect to the linear extending direction so that it may mutually become non-parallel, for the purpose of the improvement of the mechanical strength of the crucible 12, for example. .

  In addition, for the purpose of improving the mechanical strength of the crucible 12, a partition plate 12a is provided so that the inside of the crucible 12 is partitioned by a honeycomb structure, for example, as shown in a cross-sectional view in the upper surface direction of FIG. May be. Even in such a case, it is important that the partition plate 12a is provided so that the vapor deposition material m filled in the crucible 12 is evenly consumed in the linear extending direction x.

  The partition plate 12a as described above is preferably formed integrally with the crucible 12 in consideration of efficiently heating the vapor deposition material m in the crucible 12.

  Further, a leg portion 12 b is provided on the bottom surface of the crucible 12, whereby a space is provided between the crucible 12 and the floor surface 13 b of the outer box 13.

  These leg portions 12b are desirably installed at the end positions that do not affect the film thickness distribution of the deposited film, taking into account the position of the opening 11 and the like. Therefore, the leg part 12b shall be provided in the position where the opening 11 is not arrange | positioned upwards in the both ends side of the linear extending direction x in which the opening 11 was arranged.

  The material of the leg portion 12b provided in this way is preferably the same material as that of the main body of the crucible 12 and is integrated with the crucible 12 in consideration of heat conduction. However, when it is not necessary to expect the crucible 12 to be heated by heat conduction from the leg 12b, the leg 12b may not be integrated with the main body of the crucible 12, and is made of a different material. Also good.

  In addition, as shown in the figure, the crucible 12 is preferably arranged with a space also from the inner wall of the outer box 13. Thereby, most of the heating of the crucible 12 can be performed by heating by radiant heat.

  The outer box 13 is preferably configured using a material having high thermal conductivity, and is made of, for example, carbon. The heat source 14 is composed of, for example, a thermocouple and a temperature controller, and is a temperature-controlled heater.

  With the configuration described above, in the vapor deposition source 10, when the outer box 13 is heated by the heat source 14, the crucible 12 housed in the outer box 13 is heated thereby, and the organic material (vapor deposition) filled in the crucible 12 is heated. The material m) evaporates or sublimates and scatters through the openings 11.

  Further, the transport means moves the substrate W in a state of being opposed to the vapor deposition source 10 in a direction y substantially perpendicular to the linear extending direction x in the vapor deposition source 10, thereby allowing the vapor deposition source 10 and the substrate W to move. The relative position is made variable. At this time, the substrate W needs to be moved in a vacuum. For this reason, it is conceivable to adopt a simple method in which the carriage on which the substrate W is mounted is connected to a wire, and the wire is pulled at a constant speed by a servo motor or the like from outside. However, as long as measures against degassing are taken, it is of course possible to use a well-known transport system such as a ball screw or a belt conveyor.

<Vapor deposition method>
A vapor deposition film forming method using the vapor deposition film forming apparatus 1 configured as described above will be described.

  First, each chamber in the crucible 12 partitioned by the partition plate 12a is filled with the vapor deposition material m at the same height. Next, the crucible 12 filled with the vapor deposition material m is accommodated in the outer box 13 installed in the vacuum chamber. At this time, the storage direction of the crucible 12 with respect to the outer box 13 is set so that the arrangement state of the crucible 12 whose interior is partitioned by the partition plate 12a with respect to the arrangement of the openings 11 of the outer box 13 is the same as in the above simulation. Match.

  In this state, the substrate W as a film formation target is transferred into the vacuum chamber by a handling robot, a transfer conveyor, or the like. Then, by controlling the heating temperature of the crucible 12 through the outer box 13 by the heat source 14, the vapor deposition material m in the crucible 12 is evaporated and scattered above the vapor deposition source 10 through the opening 11. In this state, the substrate W is moved at a constant speed in the direction y orthogonal to the linear extending direction x above the opening 11 in the vapor deposition source 10 by the transport means. Thereby, a thin film of the vapor deposition material m is formed on the lower surface of the substrate W as a vapor deposition film.

  Further, in this vapor deposition film formation, the crucible 12 is partitioned in the line extending direction x as described above, whereby the vapor deposition material m filled in the crucible 12 is moved in the line extending direction x. On the other hand, film formation is performed while consuming evenly.

<Manufacturing method of display device>
Next, as a method for manufacturing a display device using the vapor deposition apparatus having the above-described configuration, manufacturing a display device in which a plurality of organic electroluminescent elements are formed on a substrate will be described. FIG. 4 is a schematic cross-sectional view of three pixels in the display device manufactured here.

  As shown in FIG. 4, first, for example, an anode 21 is formed as a lower electrode on an apparatus substrate W made of a glass substrate or the like. The anode 21 is patterned for each pixel, for example, and is connected to each pixel circuit having a thin film transistor not shown here. Next, an insulating pattern 22 is formed so as to cover the peripheral edge of the anode 21, and pixel separation is performed. The pixel circuit will be described in detail later.

  Thereafter, by applying the film forming method using the above-described vapor deposition apparatus, for example, the hole injection layer 23 and the hole transport layer 24 are vapor deposited in this order as an organic layer (vapor deposited film) common to all pixels. To do. In this case, in order from the upper side of the transport direction y of the substrate W, an evaporation source filled with a hole injection material for forming the hole injection layer 23 as an evaporation material and a hole transport layer 24 are formed. A vapor deposition source filled with a hole transport material as a vapor deposition material is disposed. Thereby, the hole injection layer 23 and the hole transport layer 24 are continuously formed by vapor deposition. The vapor deposition film formation of the hole injection layer 23 and the hole transport layer 24 may be performed individually using a vapor deposition film forming apparatus provided with only one vapor deposition source.

  Next, a red light emitting layer 25g, a green light emitting layer 25g, and a blue light emitting layer 25b are formed in a pattern on each pixel on the hole transport layer 24 by applying a film forming method using the vapor deposition apparatus. . In this case, a metal mask having, for example, a portion where the red light emitting layer 25g is formed is disposed between the substrate W on which the hole transport layer 24 is formed and the evaporation source. Then, vapor deposition is performed by integrally transporting the substrate W and the metal mask in the transport direction y above the vapor deposition source filled with the red light emitting material for depositing the red light emitting layer 25g as the vapor deposition material. The pattern formation of the green light emitting layer 25g and the blue light emitting layer 25b is sequentially performed in the same manner.

  After that, by applying a film forming method using the above-described vapor deposition apparatus, for example, the electron transport layer 26 is vapor deposited as an organic layer (vapor deposited film) common to all pixels.

  After the above, a cathode 27 using a transparent conductive material is sputter-deposited on the electron transport layer 26 as an upper electrode common to all pixels.

  As a result, organic electroluminescent elements of the respective colors formed by sandwiching the organic layer (deposited film) from the hole injection layer 23 to the electron transport layer 26 between the anode 21 and the cathode 27, that is, the red light emitting element 31r, the green color. The light emitting element 31g and the blue light emitting element 31b are obtained. Although illustration is omitted here, a sealing film covering each of the organic electroluminescent elements 31r, 31g, and 31b is further formed, and a sealing substrate made of a light-transmitting material is bonded with an adhesive. As a result, the active matrix display device 33 in which the light emission of the organic electroluminescent elements 31r, 31g, and 31b of each color is controlled by each pixel circuit connected to each anode 21 is completed. In the display device 33, the emitted light generated by the organic electroluminescent elements 31r, 31g, and 31b is extracted from the sealing substrate side through the cathode 27 made of a light transmissive material.

  According to the embodiment described above, the inside of the crucible 12 is partitioned into the line extending direction x, so that the vapor deposition material m filled in the crucible 12 is consumed evenly with respect to the line extending direction x. In this configuration, film formation is performed. For this reason, in the vapor deposition film formation using the line type vapor deposition film forming apparatus, the filling amount (filling height) of the vapor deposition material can be kept uniform in the line crucible regardless of the progress of the vapor deposition film formation. it can.

  This prevents variations in the film thickness of the vapor deposition film in the line extending direction x due to the uneven filling amount of the vapor deposition material m in the line extending direction x. It becomes possible to obtain a deposited film having a uniform film thickness. As a result, in the manufacture of the display device 33 in which a plurality of organic electroluminescent elements are arrayed on the substrate W, when an organic film including the light emitting layers 25r, 25g, and 25b is deposited, the in-plane of the substrate W is obtained. Therefore, it is possible to form an organic film having a uniform film thickness, so that organic electroluminescent elements having uniform characteristics can be arranged in the substrate W plane. Thereby, it is possible to obtain the display device 33 having excellent display characteristics.

  Further, as described above, since the film formation is performed while the vapor deposition material m is consumed evenly in the line extending direction x, the vapor deposition material is almost simultaneously performed in each room in the crucible 12 partitioned by the partition plate 12a. It becomes necessary to replenish m. As a result, in the repeated vapor deposition film formation, the frequency of replenishing the vapor deposition material m into the crucible 12 is reduced, and maintenance is facilitated.

  Furthermore, the partition plate 12a in the crucible 12 is disposed obliquely with respect to the linear extending direction x so as to be non-parallel to each other, or the inside of the crucible 12 is partitioned into a honeycomb structure. As a result, the strength of the crucible 12 is reinforced, and deformation or the like hardly occurs during handling. For this reason, in the state heated by the heat source 14, the generation | occurrence | production of the nonuniformity of the local temperature resulting from a deformation | transformation of the crucible 12 is suppressed. This also achieves a uniform film thickness of the deposited film in the linear extending direction x.

<Schematic configuration of display device>
FIGS. 5A and 5B are diagrams showing an example of the entire configuration of the display device 33 manufactured according to the above embodiment. FIG. 5A is a schematic configuration diagram, and FIG. 5B is a configuration diagram of a pixel circuit. Here, an embodiment in which the present invention is applied to an active matrix display device will be described.

  As shown in FIG. 5A, a display region W-1 and its peripheral region W-2 are set on a substrate W which is a support substrate of the display device 33. The display area W-1 is configured as a pixel array section in which a plurality of scanning lines 41 and a plurality of signal lines 43 are wired vertically and horizontally, and one pixel a is provided corresponding to each intersection. Yes. Each of these pixels a is provided with one of the organic electroluminescent elements 31r, 31g, 31b shown in FIG. In the peripheral region W-2, a scanning line driving circuit b that scans and drives the scanning line 41 and a signal line driving circuit c that supplies a video signal (that is, an input signal) corresponding to luminance information to the signal line 43 are arranged. Has been.

  As shown in FIG. 5B, the pixel circuit provided in each pixel a includes, for example, any one of organic electroluminescent elements 31r, 31g, and 31b, a driving transistor Tr1, a writing transistor (sampling transistor) Tr2, and a holding circuit. It is comprised by the capacity | capacitance Cs. Then, the video signal written from the signal line 43 via the write transistor Tr2 is held in the holding capacitor Cs by driving by the scanning line driving circuit b, and a current corresponding to the held signal amount is sent from the drive transistor Tr1 to each organic transistor. The light is supplied to the electroluminescent elements 31r, 31g, and 31b, and the organic electroluminescent elements 31r, 31g, and 31b emit light with luminance according to the current value.

  Note that the configuration of the pixel circuit as described above is merely an example, and a capacitor element may be provided in the pixel circuit as necessary, or a plurality of transistors may be provided to configure the pixel circuit. Further, a necessary driving circuit is added to the peripheral area W-2 according to the change of the pixel circuit.

  The display device according to the present invention described above includes a module-shaped one having a sealed configuration as disclosed in FIG. For example, a sealing portion 51 is provided so as to surround the display area W-1 that is a pixel array portion, and this sealing portion 51 is used as an adhesive and is attached to a facing portion (sealing substrate 52) such as transparent glass. Applicable display module. The transparent sealing substrate 52 may be provided with a color filter, a protective film, a light shielding film, and the like. The substrate W as a display module in which the display area W-1 is formed is provided with a flexible printed circuit board 53 for inputting / outputting signals to / from the display area W-1 (pixel array unit) from the outside. May be.

<Application example>
The display device according to the present invention described above is input to various electronic devices shown in FIGS. 7 to 11 such as digital cameras, notebook personal computers, portable terminal devices such as mobile phones, and video cameras. The present invention can be applied to display devices for electronic devices in various fields that display a video signal or a video signal generated in the electronic device as an image or video. An example of an electronic device to which the present invention is applied will be described below.

  FIG. 7 is a perspective view showing a television to which the present invention is applied. The television according to this application example includes a video display screen unit 101 including a front panel 102, a filter glass 103, and the like, and is created by using the display device according to the present invention as the video display screen unit 101.

  8A and 8B are diagrams showing a digital camera to which the present invention is applied. FIG. 8A is a perspective view seen from the front side, and FIG. 8B is a perspective view seen from the back side. The digital camera according to this application example includes a light emitting unit 111 for flash, a display unit 112, a menu switch 113, a shutter button 114, and the like, and is manufactured by using the display device according to the present invention as the display unit 112.

  FIG. 9 is a perspective view showing a notebook personal computer to which the present invention is applied. A notebook personal computer according to this application example includes a main body 121 including a keyboard 122 that is operated when characters and the like are input, a display unit 123 that displays an image, and the like. It is produced by using.

  FIG. 10 is a perspective view showing a video camera to which the present invention is applied. The video camera according to this application example includes a main body 131, a lens 132 for shooting an object on a side facing forward, a start / stop switch 133 at the time of shooting, a display unit 134, and the like. It is manufactured by using such a display device.

  FIG. 11 is a diagram showing a mobile terminal device to which the present invention is applied, for example, a mobile phone, in which (A) is a front view in an opened state, (B) is a side view thereof, and (C) is in a closed state. (D) is a left side view, (E) is a right side view, (F) is a top view, and (G) is a bottom view. The mobile phone according to this application example includes an upper housing 141, a lower housing 142, a connecting portion (here, a hinge portion) 143, a display 144, a sub display 145, a picture light 146, a camera 147, and the like. And the sub display 145 is manufactured by using the display device according to the present invention.

It is a schematic diagram which shows the schematic structural example of the vapor deposition film-forming apparatus which concerns on this invention. It is a cross-sectional schematic diagram of the vapor deposition source provided in the vapor deposition film-forming apparatus which concerns on this invention. It is a cross-sectional schematic diagram of the other vapor deposition source provided with the vapor deposition film-forming apparatus which concerns on this invention. It is a schematic diagram which shows the schematic structural example of the display apparatus produced using the vapor deposition film-forming apparatus of this invention. It is a figure which shows an example of the circuit structure of the display apparatus of embodiment. It is a block diagram which shows the module-shaped display apparatus of the sealed structure to which this invention is applied. It is a perspective view which shows the television to which this invention is applied. It is a figure which shows the digital camera to which this invention is applied, (A) is the perspective view seen from the front side, (B) is the perspective view seen from the back side. 1 is a perspective view showing a notebook personal computer to which the present invention is applied. It is a perspective view which shows the video camera to which this invention is applied. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the portable terminal device to which this invention is applied, for example, a mobile telephone, (A) is the front view in the open state, (B) is the side view, (C) is the front view in the closed state , (D) is a left side view, (E) is a right side view, (F) is a top view, and (G) is a bottom view. It is a figure which shows the structure of the conventional vapor deposition film-forming apparatus. It is a cross-sectional schematic diagram of the vapor deposition source of the conventional vapor deposition film-forming apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Evaporation film-forming apparatus, 10 ... Evaporation source, 11 ... Opening, 12 ... Crucible, 12a ... Partition plate, 13 ... Outer box, 13a ... Top plate, 14 ... Heat source, 23 ... Hole injection layer (deposition film), 24 ... hole transport layer (deposited film), 25r ... red light emitting layer (deposited film), 25g ... green light emitting layer (deposited film), 25b ... blue light emitting layer (deposited film), 26 ... electron transport layer, 31r ... red Light emitting element (organic electroluminescent element), 31g ... green light emitting element (organic electroluminescent element), 31b ... blue light emitting element (organic electroluminescent element), 33 ... display device, m ... vapor deposition material, p1 ... pitch (of opening) , P2: pitch (partition plate), W: substrate

Claims (10)

A vapor deposition source having a line-shaped crucible filled with a vapor deposition material, a heat source for heating the crucible, and a top plate disposed above the crucible and provided with a plurality of openings along the line shape is provided. Then, the deposition target film is deposited on the substrate by relatively moving the deposition target substrate in a direction substantially orthogonal to the linear extending direction in a state of being opposed to the deposition source. In the vapor deposition apparatus configured as described above,
The vapor deposition apparatus according to claim 1, wherein the crucible is partitioned into a plurality of chambers by partition plates provided at non-uniform pitches in the line-shaped substantially extending direction. The vapor deposition apparatus according to claim 1.
The crucible is configured so that when the vapor deposition material is evaporated from the crucible by heating with the heat source, the vapor deposition material filled in the crucible is consumed substantially evenly in the line extending direction. A vapor deposition apparatus characterized by being partitioned by a partition plate. The vapor deposition apparatus according to claim 1.
The vapor deposition apparatus according to claim 1, wherein the openings are arranged at a non-uniform pitch in the line extending direction. In the vapor deposition film-forming apparatus of Claim 3,
The openings are arranged at a pitch adjusted so that the deposited film is formed with a substantially uniform thickness on the substrate based on a heat distribution due to heating by the heat source. Vapor deposition system. The vapor deposition apparatus according to claim 1.
The deposition film forming apparatus characterized in that the partition plates for partitioning the crucible are arranged obliquely with respect to the linear extending direction so as to be non-parallel to each other. The vapor deposition apparatus according to claim 1.
The inside of the crucible is partitioned into a honeycomb structure. By heating a linear crucible filled with vapor deposition material, the vapor deposition material evaporated from the crucible passes through a plurality of openings provided along the line shape on the top plate disposed above the crucible. As well as
Vapor deposition film forming method of depositing a vapor deposition film on the substrate by relatively moving the substrate to be deposited in a direction substantially orthogonal to the linear extending direction at a position facing the top plate In
By partitioning the inside of the crucible in the line-shaped extending direction, the film formation is performed while the vapor deposition material filled in the crucible is consumed substantially evenly in the line-shaped extending direction. A vapor deposition film forming method. In the vapor deposition film-forming method of Claim 7,
The vapor deposition is characterized in that the openings are arranged at a pitch adjusted so that the vapor deposition film is formed with a substantially uniform film thickness on the substrate based on a heat distribution due to heating by the heat source. Film forming method. By heating a linear crucible filled with vapor deposition material, the vapor deposition material evaporated from the crucible passes through a plurality of openings provided along the line shape on the top plate disposed above the crucible. And depositing a vapor deposition film on the substrate by relatively moving the substrate to be deposited in a direction substantially orthogonal to the linear extending direction at a position facing the top plate. In a manufacturing method of a display device having
By partitioning the inside of the crucible in the line-shaped extending direction, the film formation is performed while the vapor deposition material filled in the crucible is consumed substantially evenly in the line-shaped extending direction. A method for manufacturing a display device. In the manufacturing method of the display device according to claim 9,
A method for manufacturing a display device, comprising: arranging a plurality of organic electroluminescent elements formed using the vapor deposition film on a substrate to be formed.

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