JP2008206762A - Cooling method of circuit element, cooling structure of circuit element and game machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling method of a circuit element, a cooling structure of the circuit element and a game machine capable of efficiently cooling the circuit element such as an arithmetic element on a circuit board disposed in its inside while effectively preventing a fraudulent access from the back face to the inside by substantially closing the back face of the game machine. <P>SOLUTION: This Pachinko machine 2 is provided with a back face plate 3 disposed in its back face side in the rear part of a casing frame 4 surrounding the circumference of the Pachinko machine 2, a symbol control board 16a disposed in front of the back face plate 3, and the arithmetic element 16h mounted on the symbol control board 16a and disposed to transmit heat between itself and the back face plate 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  TECHNICAL FIELD The present invention relates to a circuit element cooling method, a circuit element cooling structure, and a gaming machine, and more particularly, a cooling method for efficiently cooling a circuit element that is mounted on a circuit board in a gaming machine such as a pachinko machine and becomes high temperature. Etc. The present invention is also applicable to various gaming machines other than pachinko machines and other electric / electronic devices.

  In a gaming machine such as a pachinko machine, a ball that has been shot flows down on the surface of the game board, and in the process of flowing down, the ball rolls while colliding with a gauge (also called a nail) or impeller on the surface of the game board. The flow direction changes. As a result, if a ball wins at various winning holes arranged on the surface of the game board, a predetermined prize ball is paid out. On the other hand, if a ball flows into the out port without winning any prize hole, no prize ball is paid out. . The player enjoys the game by demonstrating his / her skill in the ball or using the chance of the ball flowing down and expecting to win a prize and give away a prize ball.

  Among such pachinko machines, recently, there are those in which an accessory such as a symbol display device or a variable winning device is arranged on a game board surface.

  The variable winning device has, for example, a character doll for gaming effects and a plurality of types of winning openings, and the ball that has flowed into the variable winning device is affected by the action of the character doll and any type of It is configured to enjoy whether or not to win a prize opening. Depending on the type of prize opening that the ball has won, the number of prize balls to be paid out may be different, or different types of different games may be started.

  In addition, the symbol display device is for configuring a so-called “hit” that allows a player to acquire a large amount of prize balls when the symbol displayed on the display screen changes and becomes a specific display mode. is there. By arranging this symbol variation device in the gaming machine, not only when a predetermined number of prize balls are paid out by winning a prize at the winning opening of the game board surface, but a lot of prize balls are also generated depending on the result of the symbol variation. Since it is paid out, the interest of the player is further improved.

  Conventionally, such a pachinko machine is surrounded by a casing frame, and a game board is arranged so as to be accommodated inside the casing frame. The game board is held by a machine frame that is swingably supported so as to be openable and closable with respect to the housing frame. Various ball paths, various mechanical components, circuit boards, etc. are provided on the back side of the machine frame and the game board. Is attached.

  In other words, the ball path, which is an important part that composes and produces the game, various mechanism parts such as a prize ball payout device and a winning ball processing device, a payout control board for controlling the operation of these various mechanical parts, a symbol display device, etc. A game control board, a symbol control board, and the like for controlling the effect operation are configured such that the front is covered with a game board and a machine frame, and the upper and lower sides and the left and right sides are covered with a housing frame.

  However, the back of the pachinko machine, that is, the back side is not covered, and the above-mentioned important parts are substantially exposed. Therefore, the back side of the pachinko machine is defenseless against unauthorized access, and from here, it is possible to easily perform unauthorized actions on important parts.

  Thus, in recent years, a pachinko machine has also been proposed that can prevent unauthorized access to important parts from the back side by covering the back side with a back plate. According to this, since the back surface of the pachinko machine is substantially closed, for example, it is possible to prevent an illegal game or the like performed by inserting a piano wire from the gap between adjacent pachinko machines to the back side.

  However, if the back side of the pachinko machine is closed by the back plate in this way, the inside of the pachinko machine is covered in all directions, up, down, left, and right, front and back, so that heat generated from the circuit board such as the dispensing control board is generated inside the pachinko machine. I'll be trapped.

  Particularly in recent years, the game effects of the symbol display device and the variable prize device have become complicated, and the arithmetic processing load by the arithmetic element (CPU) on the circuit board and the accompanying heat generation have increased. If this heat generation is not efficiently exhausted to the outside of the pachinko machine and the arithmetic element is not cooled efficiently, the arithmetic processing will run out of heat, causing problems in the operation control of the pachinko machine.

  As a proposal for discharging the heat generated from the circuit board, for example, there is one disclosed in Patent Document 1.

JP 2003-93704 A

  However, in the pachinko machine having the back plate as described above, it is necessary to block the back side of the pachinko machine with the back plate as much as possible in order to prevent unauthorized access to the inside. If it does so, it will become difficult to discharge | emit the air inside the pachinko machine which became high temperature outside, and cooling of an arithmetic element cannot be performed efficiently.

  In the device disclosed in Patent Document 1, the heat of the circuit board is exhausted to the thin plate in the housing by the heat dissipation block. However, the waste heat still remains inside the housing and is not discharged outside the gaming machine.

  Therefore, in the pachinko machine having the back plate as described above, even if heat is transferred from the circuit board to the thin board, the heat is eventually accumulated inside the pachinko machine, and the circuit board and the board are efficiently The upper computing element cannot be cooled.

  The present invention has been made in view of the above circumstances, and a circuit board disposed inside the gaming machine while substantially closing the back surface of the gaming machine and effectively preventing unauthorized access to the inside from the back surface. It is an exemplary object to provide a circuit element cooling method, a circuit element cooling structure, and a game machine that can efficiently cool circuit elements such as the above arithmetic elements.

  In order to solve the above problems, a gaming machine as an exemplary aspect of the present invention includes a back plate disposed on the back side of the gaming machine and behind a housing frame surrounding the gaming machine, It has a circuit board arranged in front of the face plate, and a circuit element mounted on the circuit board and arranged so as to be able to conduct heat with the back plate.

  Since the circuit elements mounted on the circuit board are arranged so as to be able to conduct heat with the back plate, the entire back plate can be used as a heat sink with a large heat capacity, and heat generated from the circuit elements can be efficiently Heat can be exhausted outside the gaming machine. The accumulation of heat inside the gaming machine can be prevented, and the temperature rise of the circuit board and the circuit element can be suppressed. Therefore, there is no problem with the gaming machine due to thermal runaway, the reliability of the gaming machine can be improved, and the player can play the game with peace of mind.

  Here, in addition to pachinko machines, gaming machines include pachislot machines, slot machines, arcade game machines, and the like. In addition, in the “arrangement so that heat conduction is possible”, the circuit element and the back plate are indirectly contacted and arranged through an intermediate member capable of conducting heat, in addition to the case where the circuit element and the back plate are arranged in direct contact. In other words, the circuit element and the intermediate member are in direct contact, and the intermediate member and the back plate are in direct contact. The circuit element includes various electric elements and electronic elements arranged on the circuit board, and particularly includes an arithmetic element such as a CPU whose exterior is formed of a ceramic package and has a substantially flat plate shape.

  The circuit board may be swingably supported so as to be openable and closable with respect to the housing frame so as to be separable from the back plate.

  If the circuit board is separable from the back plate, the maintainability during replacement and repair of the circuit board is improved. For example, a game board of a pachinko machine as a gaming machine is held in a machine frame that is swingably supported so as to be openable and closable with respect to the housing frame, and a circuit board is attached to the back side of the gaming board or the back side of the machine frame If so, the circuit board can be separated from the back plate.

  Both the housing frame and the back plate may be formed of a metal material, and the back plate may substantially close the back side of the gaming machine.

  If the back plate is made of a metal material, efficient cooling of the circuit elements can be realized at low cost. In addition, if the back plate and the housing frame are combined and the housing frame is made of a metal material, not only the back plate but also the housing frame can be used as a heat sink, and the heat sink having a very large heat capacity. It can be.

  Since the back plate substantially closes the back side of the gaming machine, unauthorized access to the inside of the gaming machine from the back side can be effectively prevented. Due to the closure on the back side, the air inside the gaming machine is hard to be exhausted to the outside, and the inside air stays, but the heat is efficiently exhausted to the outside by the back plate and the housing frame, so the gaming machine Internal temperature rise can be suppressed.

  You may further have the heat conductive elastic body arrange | positioned between a circuit element and a backplate.

  If it arrange | positions so that a circuit element and a backplate may contact directly, it will be necessary to position each arrangement position with high precision. If they are separated even a little, heat conduction will not be performed efficiently, and if they are urged against more than necessary, they will be damaged.

  However, if an elastic body is disposed between the circuit element and the back plate, it is not necessary to make the positional accuracy of both higher than necessary. Therefore, it is possible to contribute to the reduction of component costs and the efficiency of assembly work.

  Moreover, since the elastic body can conduct heat, the heat from the circuit element can be efficiently transferred to the back plate. As this heat conductive elastic body, for example, heat conductive silicon rubber or the like can be considered.

  The height of the elastic body between the first contact surface that is in contact with the circuit element so as to conduct heat and the second contact surface that is in contact with the front surface of the back plate so as to be capable of conducting heat is the front of the circuit element and the back plate. It may be substantially larger than the gap size in the arrangement state between the direction.

  Since the height dimension of the elastic body is substantially larger than the gap dimension in the arrangement state of the circuit element and the front surface of the back plate, the contact state capable of conducting heat between the elastic body, the circuit element and the back plate is strong and It can be done reliably. As a result, the efficiency of heat conduction from the circuit element to the back plate via the elastic body can be improved.

  The front surface means the front of the back plate, that is, the surface in the player direction. The term “contact so as to allow heat conduction” includes not only the case of direct contact but also the state where heat conduction can be performed indirectly through another part having heat conductivity.

  Of course, the “gap size between the circuit element and the front surface” is not limited to the direct distance between the circuit element and the front surface. When a heat sink component as a separate component is attached to the circuit element side, the clearance between the heat sink component and the front surface, and when the heat sink component is attached to the front surface side, the heat sink component and circuit element When the heat sink parts are attached to both of the gap dimensions, it means the gap dimension between the two heat sink parts.

  A circuit element cooling method according to another exemplary aspect of the present invention is a circuit element cooling method for cooling a circuit element mounted on a circuit board, and includes a back plate disposed on the back side of a gaming machine. The circuit board is arranged in front, and the circuit element on the circuit board is arranged to be substantially thermally conductive with respect to the back plate.

  Since the circuit elements mounted on the circuit board are arranged so as to be able to conduct heat substantially to the back plate, the entire back plate functions as a heat sink with a large heat capacity, and the heat generated from the circuit elements is efficiently removed from the gaming machine. Heat can be exhausted. The accumulation of heat inside the gaming machine can be prevented, and the temperature rise of the circuit board and the circuit element can be suppressed. Therefore, there is no problem with the gaming machine due to thermal runaway, the reliability of the gaming machine can be improved, and the player can play the game with peace of mind.

  According to still another exemplary aspect of the present invention, there is provided a circuit element cooling structure in which a back plate that substantially closes the back of a gaming machine is disposed on the back side of the gaming machine, and a circuit board on which the circuit element is mounted on the surface. It is arranged in front of the back plate, and circuit elements on the circuit board are arranged so as to be substantially thermally conductive with respect to the back plate.

  Since the circuit elements mounted on the circuit board are arranged so as to be able to conduct heat substantially with respect to the back plate, the entire back plate functions as a heat sink with a large heat capacity, and the heat from the circuit elements is efficiently played. Heat can be exhausted outside the machine. The accumulation of heat inside the gaming machine can be prevented, and the temperature rise of the circuit board and the circuit element can be suppressed. Therefore, there is no problem with the gaming machine due to thermal runaway, the reliability of the gaming machine can be improved, and the player can play the game with peace of mind.

  Since the back plate substantially closes the back side of the gaming machine, unauthorized access to the inside of the gaming machine from the back side can be effectively prevented. Due to the closure on the back side, the air inside the gaming machine is difficult to be exhausted to the outside, and the internal air stays, but the heat is efficiently exhausted outside the gaming machine by the back plate, so the temperature rise inside the gaming machine Can be suppressed.

  Further objects and other features of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, the entire back plate for closing the back of the gaming machine is utilized as a heat sink having a large heat capacity while effectively closing the back of the gaming machine to effectively prevent unauthorized access to the inside from the back. Thus, the circuit elements on the circuit board disposed inside the gaming machine can be efficiently cooled.

  The accumulation of heat inside the gaming machine can be prevented, and the temperature rise of the circuit board and the circuit element can be suppressed. Therefore, there is no problem with the gaming machine due to thermal runaway, the reliability of the gaming machine can be improved, and the player can play the game with peace of mind.

[Embodiment 1]
Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view showing an external appearance of a pachinko machine 2 as a gaming machine according to Embodiment 1 of the present invention as viewed from the front (that is, a player side). FIG. 2 is an external perspective view showing the external appearance of the pachinko machine 2 viewed from the rear (that is, the back side).

  The pachinko machine 2 includes a housing frame 4, a game board (game device body) 6, a machine frame 8, a front glass (front transparent plate) 10, a decorative frame 12, an upper plate (ball tray) 14, a ball launcher (see FIG. Not shown), and has a firing handle 17. In addition, as will be described later, this pachinko machine 2 has a back plate 3 on the back side, and inside the pachinko machine 2 a symbol control board (circuit board) 16a, a main board (circuit board), a frame board (circuit board). 16b and a power supply board 16c (both see FIG. 3).

  The pachinko machine 2 includes a combination pachinko machine, an enclosed circulation pachinko machine, a sparrow ball machine, and the like. In addition to pachinko machines, gaming machines can be conceptualized as pachislot machines and slot machines, various game machines and arcade machines that use coins as gaming media.

  The housing frame 4 is a frame for enclosing the periphery of the pachinko machine 2 and is configured to have a substantially rectangular shape in plan view. Wood, resin, metal, or the like can be used as the material, and aluminum is used in the first embodiment. The housing frame 4 surrounds the upper and lower surfaces and left and right side surfaces of the pachinko machine 2, and a hinge portion (swing support portion) 18 for swinging and supporting the machine frame 8 and the decorative frame 12 on the left side as viewed from the front. Is provided.

  The game board 6 is a game apparatus body for producing a game by flowing down a ball 20 as a game medium in the pachinko machine 2. A rail ornament 22 is attached to the game board surface 6a of the game board 6 in a substantially circular shape so as to surround the periphery, and an inner side surface 22a of the rail ornament 22 is erected with respect to the game board surface 6a to define a game area 6b. is doing.

  In the game area 6b, a large number of gauges 24, a winning opening 26, a symbol display device 28, an out opening 30, and other various accessories are arranged. When the ball 20 is launched toward the upper part in the game area 6b by a ball launching device (not shown), the ball 20 collides with the gauge 24 and flows down in the game area 6b while changing its flow direction. . In the middle of the flow, a certain thing wins the prize opening 26 and triggers a prize ball payout, a certain thing triggers the start of the symbol variable game by the symbol display device 28, and a certain thing enters any winning slot 26. Is also discharged from the outlet 30 to the outside of the pachinko machine 2 without winning a prize. As described above, various games are produced when the ball 20 flows down on the game board 6.

  On the back side of the game board 6, a ball path for discharging the winning ball that has won the winning port 26 and the out ball that has flowed into the out port 30 is arranged, but the details are omitted. In the first embodiment, a game board 6 as a gaming machine body used for a pachinko machine 2 as a gaming machine will be described as an example. Of course, if the gaming machine is a pachislot machine or a slot machine, The trunk device corresponds to a gaming device body.

  The machine frame 8 is a frame for holding the game board 6, and an attachment opening for attaching the game board 6 is formed in the vicinity of the center thereof. An attachment portion for removably attaching the game board 6 is provided around the attachment opening, and the machine frame 8 is configured to surround the game board 6. The machine frame 8 is disposed in front of the housing frame 4 and is swingably supported by the housing frame 4 at the hinge portion 18, and is swingably supported with respect to the housing frame 4 so that the front surface can be opened and closed.

  The machine frame 8 is provided with a locking device 1, and the locking device 1 can lock the casing frame 4 and the decorative frame 12 in a locked manner. The machine frame 8 is formed of resin or metal, and a back mechanism board (not shown) is disposed on the back side thereof. On the back mechanism board, a winning ball processing device (not shown) for counting and discharging the winning balls, a prize ball paying device (not shown) for counting and paying out the prize balls, and the like are arranged. Yes.

  In the case of a pachislot machine or a slot machine, the machine frame 8 is omitted and a rotating device is installed in the housing frame 4 so that a decorative frame 12 (to be described later) is locked and closed.

  FIG. 3 is an internal configuration diagram showing a state in which the machine frame 8 in the pachinko machine 2 is opened forward with respect to the housing frame 4 around the hinge portion 18.

  A back plate 3 is disposed on the back of the pachinko machine 2 and behind the housing frame 4. The back plate 3 is a plate-like member formed of a metal having high thermal conductivity such as aluminum, and is connected to the aluminum frame 4 on the left and right sides and the upper side.

  The back plate 3 substantially seals the rear of the housing frame 4 and substantially closes the back of the pachinko machine 2. Therefore, unauthorized access to the inside of the pachinko machine 2 from the back by a player or a store clerk of the pachinko hall can be effectively prevented.

  A symbol control board 16a, a main board (not shown), a frame board 16b, and a power board 16c are attached to the front surface 3a of the back plate 3. As a result, these circuit boards 16a to 16c are arranged inside the housing frame 4. Therefore, it is arranged behind the game board 6.

  The symbol control board 16a is a circuit board for displaying symbols such as numbers and characters on the symbol display device 28 on the game board surface 6a. The main board is a circuit board for performing overall control of game effects such as operation control of an accessory on the game board surface 6a, operation control of an electric lamp or speaker as a decoration member 32, and is also referred to as a game control board. .

  The frame substrate 16b is a circuit board for performing operation control of the winning ball processing device and the prize ball paying device, and detecting and counting winning balls and paying balls, and is also referred to as a payout control substrate. The power supply board 16c is a circuit board for DC conversion, transformation, and rectification of AC power supplied from the pachinko hall. Hereinafter, the symbol control board 16a will be described by way of example, but since the other circuit boards 16b and 16c are substantially the same, description of the other circuit boards 16b and 16c will be omitted.

  FIG. 4A is a top view of the symbol control board 16a as viewed from above, and FIG. 4B is a side view of the symbol control board 16a as viewed from side.

  On the symbol control board 16a, a connector portion 16e for wiring connection with the other circuit boards 16b and 16c and the symbol display device 28 is mounted and disposed. A capacitor (circuit element) 16f, a resistance element (circuit element) 16g, and an arithmetic element (circuit element) 16h for arithmetic processing are also mounted and arranged, and these are connected to each other by a wiring pattern on the substrate. The symbol control board 16a is housed in a substantially rectangular parallelepiped metal or resin housing case 16i.

  The arithmetic element 16h includes various integrated circuits inside, and its exterior is covered with a ceramic package 16j so as to have a substantially flat rectangular shape. The first contact surface 19a of the heat conductive sheet (elastic body) 19 is fixed to the flat surface (upper surface) 16k of the ceramic package 16j, and the heat conductive sheet 19 is attached so as to protrude from the notch 16m of the storage case 16i. It has been.

  This heat conduction sheet 19 is a sheet made of a silicon rubber sheet or the like having a high heat conduction efficiency, and the heat generated from the arithmetic element 16h is efficiently transferred to the back plate 3 via the flat portion 16k of the ceramic package 16j. It can be made to conduct heat.

  FIG. 5 is a side view showing a state in which the symbol control board 16 a is attached to the front surface 3 a of the back plate 3. In FIG. 5, a storage case 16i for storing the symbol control board 16a is attached to the front surface 3a of the back plate 3 by fastening means such as screws.

  In this attached state, the second contact surface 19b of the heat conductive sheet 19 is in close contact with the front surface 3a. Thereby, the heat from the arithmetic element 16h is conducted to the entire back plate 3 through the flat portion 16k, the first contact surface 19a, the second contact surface 19b, and the front surface 3a in this order. . Therefore, the heat conducting sheet 19 and the back plate 3 can efficiently cool the arithmetic element 16h and the symbol control board 16a.

  Further, in the first embodiment, the back plate 3 is connected to the aluminum casing frame 4 so that heat conduction from the back plate 3 to the casing frame 4 is possible. Therefore, both the back plate 3 and the housing frame 4 function as a heat sink having a large heat capacity, and are configured to efficiently cool the arithmetic element 16h and the symbol control board 16a.

  The heat conductive sheet 19 has elasticity, and the height dimension H (distance between the first contact surface 19a and the second contact surface 19b) in the non-attached state is equal to the flat portion 16k of the arithmetic element 16h in the attached state. It is formed to be substantially larger than the gap dimension G with the front surface 3a.

  Therefore, when the symbol control board 16a is attached to the front surface 3a, the heat conductive sheet 19 disposed in the gap between them receives the urging force in the compression direction by the flat portion 16k and the front surface 3a. As a result, the close contact between the first contact surface 19a and the flat portion 16k and the close contact between the second contact surface 19b and the front surface 3a are improved, and the heat conduction efficiency is further improved.

  Since the heat conductive sheet 19 is firmly sandwiched between the arithmetic element 16h and the back plate 3, for example, even if the heat conductive sheet 19 is not fixed to the ceramic package 16j, there is no possibility that the heat conductive sheet 19 falls. Of course, in order to further improve the adhesion, it is also an effective means to apply silicon grease having high thermal conductivity to the first contact surface 19a and the second contact surface 19b.

  In the first embodiment, the arithmetic element 16h and the back plate 3 are arranged to be able to conduct heat mainly for the purpose of cooling the arithmetic element 16h. Of course, other circuit elements such as a capacitor 16f and a resistive element 16g are used. It is also within the scope of the present invention to arrange the back plate 3 so as to be able to conduct heat. Further, by applying the present invention to other circuit boards such as the main board, the frame board 16b, and the power supply board 16c, the circuit boards 16b and 16c and various circuit elements mounted thereon are efficiently cooled. be able to.

  The front glass 10 is a transparent plate disposed at a certain distance from the game board 6. The front glass 10 is formed of transparent flat glass, and has a function of forming a flow-down space in which the ball 20 flows down between the game board 6 and the visibility so that the player can visually recognize the game board 6 through the front glass 10. The function and the function of preventing unauthorized access to prevent the player from illegally accessing (contacting) the game board 6 are exhibited.

  Of course, a resin material such as transparent acrylic may be used as the front transparent plate in addition to the front glass 10 made of glass. In the first embodiment, the front glass 10 is held by the decorative frame 12, but the front glass 10 is attached to the front surface of the game board 6 and is held by the machine frame 8 together with the game board 6. It may be configured.

  The decorative frame 12 is a frame for holding the front glass 10 or a decorative member 32 surrounding the periphery thereof. In the first embodiment, the decorative frame 12 holds both the front glass 10 and the decorative member 32. The decorative frame 12 is disposed on the front side of the machine frame 8 and is swingably supported by the housing frame 4 together with the machine frame 8 at the hinge portion 18, and is swingably supported by the machine frame 8 so that the front surface can be opened and closed. .

  The decorative frame 12 is formed of resin or metal, and a mounting opening for mounting the front glass 10 is formed at the center thereof. Around the front glass 10, a decoration member 32 to which a model, a color, and a lamp for decorating the pachinko machine 2 are attached is attached, which contributes to the game effect of the pachinko machine 2.

  In the first embodiment, both the machine frame 8 and the decorative frame 12 are swingably supported by the hinge portion 18 provided in the housing frame 4. However, it goes without saying that the machine frame 8 and the decorative frame 12 may be swingably supported by different hinge portions. For example, the housing frame 4 may be provided with a hinge portion that swings and supports the machine frame 8, and the machine frame 8 may be provided with another hinge portion that swings and supports the decorative frame 12.

  The upper plate 14 is for storing the ball 20 so as to guide it to the ball launcher, and has a function of storing the player's ball together with the lower plate 15. The upper plate 14 is disposed on the front surface of the pachinko machine 2 and below the game board 6, that is, at the lower portion of the decorative frame 12, and the lower plate 15 is disposed further below the upper plate 14. In the first embodiment, the upper plate 14 and the lower plate 15 are configured separately. Of course, the upper plate 14 and the lower plate 15 may be integrated to form one ball plate. .

  The upper plate 14 has a function of receiving a sphere 20 paid out from the pachinko machine 2 as a giveaway sphere, and a function of storing the sphere 20 so as to be guided to a sphere launcher via a sphere supply device (not shown). is doing. At the end of the game, the player can discharge the ball 20 from the upper plate 14 to the lower plate 15 by operating the ball discharge button 14b.

  The ball launching device (not shown) is for firing (bulleting) the ball 20 sent from the upper plate 14 to the firing position by the ball supply device toward the upper part of the game area 6b. The ball launching device energizes, for example, a launcher for bulleting the ball 20 sent to the launch position toward the game area 6b, a launch motor for driving the launcher to reciprocate the ball, and a launcher. The unit is configured to have a firing spring or the like that generates a force for the ball and is attached to the machine casing 8.

  The firing handle 17 is a handle for adjusting the strength of the bullet ball by the ball launching device, and is operated by the player by hand. For example, it is arranged on the lower right side of the front surface of the pachinko machine 2 and has a substantially cylindrical shape, and its strength adjusting rod 17a is rotatable along the circumferential surface of the cylinder. The player can adjust the firing strength of the ball 20 by rotating the strength adjusting rod 17a while holding the firing handle 17 by hand.

[Embodiment 2]
FIG. 6 is a side view showing a state in which the symbol control board 16a inside the pachinko machine 2 as the gaming machine according to Embodiment 2 of the present invention is attached to the front surface 3a of the back plate 3.

  In the arithmetic element 16h mounted on the symbol control board 16a, the heat sink component 21 is attached to the flat portion 16k of the ceramic package 16j. The heat sink component 21 is, for example, an aluminum component having a high thermal conductivity, and has a shape having a large number of heat radiation fins 21a and also has a high heat radiation performance.

  A heat conductive sheet 19 is disposed between the heat sink component 21 and the front surface 3 a of the back plate 3. A part of the back plate 3 is formed in a concave shape in accordance with the shape of the heat conductive sheet 19, and the concave portion 3 b and the second contact surface 19 b of the heat conductive sheet 19 are in close contact with each other.

  Since the gap dimension G2 between the upper surface 21b of the heat sink component 21 and the recessed portion 3b in the mounted state of the symbol control board 16a is substantially smaller than the height dimension H of the heat conductive sheet 19, the heat sink component 21 and the heat The adhesion between the conductive sheet 19 and the concave portion 3b is improved, and the heat conduction efficiency is improved. Therefore, the arithmetic element 16h can be efficiently cooled.

  Moreover, since the design control board | substrate 16a can be attached to the backplate 3 so that the heat conductive sheet 19 may be fitted in the recessed part 3b, the positioning at the time of attachment becomes easy and assembly efficiency also improves.

[Embodiment 3]
FIG. 7 is an internal configuration diagram illustrating a state in which the machine casing 8 in the pachinko machine 2 according to Embodiment 3 of the present invention is opened forward with respect to the casing frame 4 around the hinge portion 18. In this pachinko machine 2, the symbol control board 16 a is attached to the back surface of the game board 6 held in the machine frame 8, so that the symbol control board 16 a is forward of the housing frame 4 around the hinge portion 18. It can be opened and closed. As a result, the symbol control board 16a can be separated from the back plate 3.

  In this case, when the machine frame 8 and the housing frame 4 of the pachinko machine 2 are closed to be able to play, the heat conduction sheet is formed by the arithmetic element 16h on the symbol control board 16a and the front surface 3a of the back plate 3. 19 is inserted and compressed, and high adhesion between the arithmetic element 16h and the heat conductive sheet 19 and between the heat conductive sheet 19 and the back plate 3 is ensured.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these, A various deformation | transformation and change are possible within the range of the summary.

It is the external appearance perspective view which looked at the pachinko machine concerning Embodiment 1 of the present invention from the front. It is the external appearance perspective view which looked at the pachinko machine concerning Embodiment 1 of the present invention from back. It is an internal block diagram which shows the state which open | released the machine frame in the pachinko machine shown in FIG. It is a figure which shows the symbol control board | substrate shown in FIG. 3, Comprising: (a) is the top view, (b) is the side view. It is a side view which shows the state in which the symbol control board shown in FIG. 4 was attached to the front surface of a backplate. It is a side view which shows the state by which the symbol control board inside the pachinko machine concerning Embodiment 2 of the present invention was attached to the front side of a back board. It is an internal block diagram which shows the state which open | released the machine frame forward in the pachinko machine which concerns on Embodiment 3 of this invention.

Explanation of symbols

G, G2: Gap dimension H: Height dimension 1: Locking device 2: Pachinko machine (game machine)
3: Back plate 3a: Front surface 3b: Recessed portion 4: Housing frame 6: Game board (game device body)
6a: Game board surface 6b: Game area 8: Machine frame 10: Front glass (front transparent plate)
12: Decoration frame 14: Upper plate (ball plate)
14b: Ball discharge button 15: Lower plate 16a: Symbol control board (circuit board)
16b: frame substrate (circuit board)
16c: Power supply board (circuit board)
16e: Connector portion 16f: Capacitor (circuit element)
16g: Resistance element (circuit element)
16h: arithmetic element (circuit element)
16i: Storage case 16j: Ceramic package 16k: Plane portion 16m: Notch portion 17: Launch handle 17a: Strength adjustment rod 18: Hinge portion (swing support portion)
19: Thermal conductive sheet (elastic body)
19a: first contact surface 19b: second contact surface 20: ball (game medium)
21: Heat sink component 21a: Radiating fin 21b: Upper surface 22: Rail decoration 22a: Inner surface 24: Gauge 26: Winning port 28: Symbol display device 30: Out port 32: Decorative component

Claims (7)

A back plate disposed on the back side of the gaming machine and behind a housing frame surrounding the gaming machine;
A circuit board disposed in front of the back plate;
A game machine comprising: a circuit element mounted on the circuit board and arranged to be capable of conducting heat between at least one of the housing frame and the back plate.   The gaming machine according to claim 1, wherein the circuit board is swingably supported so as to be openable and closable with respect to the housing frame and can be separated from the back plate.   The gaming machine according to claim 1 or 2, wherein the casing frame and the back plate are both formed of a metal material, and the back plate substantially closes the back side of the gaming machine.   The gaming machine according to any one of claims 1 to 3, further comprising a heat conductive elastic body disposed between the circuit element and the back plate.   The height dimension between the first contact surface of the elastic body that is in contact with the circuit element so as to be thermally conductive and the second contact surface that is in contact with the front surface of the back plate so as to be capable of heat conduction is The gaming machine according to claim 4, wherein the gaming machine is substantially larger than a gap dimension in the arrangement state between the rear plate and the front surface. A circuit element cooling method for cooling a circuit element mounted on a circuit board,
Disposing the circuit board in front of a back plate disposed on the back side of the gaming machine;
Disposing the circuit element on the circuit board so as to be substantially thermally conductive with respect to the back plate, and cooling the circuit element. A back plate substantially closing the back of the gaming machine is disposed on the back side of the gaming machine;
A circuit board for mounting circuit elements on the surface is disposed in front of the back plate,
A circuit element cooling structure in which circuit elements on the circuit board are arranged to be substantially thermally conductive with respect to the back plate.

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