JP2008201815A - Printing ink composition, method for producing the same, method for forming electrode for plasma display panel using the composition and electrode - Google Patents

Printing ink composition, method for producing the same, method for forming electrode for plasma display panel using the composition and electrode Download PDF

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JP2008201815A
JP2008201815A JP2007035876A JP2007035876A JP2008201815A JP 2008201815 A JP2008201815 A JP 2008201815A JP 2007035876 A JP2007035876 A JP 2007035876A JP 2007035876 A JP2007035876 A JP 2007035876A JP 2008201815 A JP2008201815 A JP 2008201815A
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ink composition
electrode
component
resin
printing
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JP5135818B2 (en
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Masahide Arai
将英 荒井
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Mitsubishi Materials Corp
三菱マテリアル株式会社
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<P>PROBLEM TO BE SOLVED: To provide a printing ink composition enabling high-precision printing, leaving less or no residues of organic components in baking and satisfying the high-precision printing and the good electrical conductivity at the same time. <P>SOLUTION: The printing ink composition 11 is composed of the mixture of a conductive metal powder, glass frit, resin component and solvent component, and is printed on a substrate 14 with a desired pattern and dried and baked. The resin component of the printing ink composition 11 is an alicyclic resin component obtained by hydrogenating a resin containing an aromatic component, and the amount of the aromatic component in the alicyclic resin component is ≤0.5 pt.wt. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、プラズマディスプレイパネル(Plasma Display Panel、以下、PDPという。)用前面板のバス電極を形成するため、或いはPDP用背面板のアドレス電極を形成するために用いることができる印刷用インキ組成物と、この組成物を製造する方法と、この組成物を用いた上記バス電極やアドレス電極の形成方法と、そのインキ組成物を用いて形成された電極に関するものである。   The present invention relates to a printing ink composition that can be used to form a bus electrode of a front panel for a plasma display panel (hereinafter referred to as PDP) or an address electrode of a back panel for a PDP. And a method for producing the composition, a method for forming the bus electrode and the address electrode using the composition, and an electrode formed using the ink composition.
電子回路基板や表示デバイス等の半導体デバイスにおける電極等の形成には従来よりフォトリソグラフィー法が用いられてきたが、このフォトリソグラフィー法は製造工程が複雑であり、また材料ロスが多く、パターン形成に必要な露光装置等の製造設備に莫大な費用がかかるため、製造コストが極めて高くなるという問題があった。更に、パターン形成時の現像処理等にて生じる廃液を処理するコストも高く、しかもこの廃液については環境保護の観点からも問題があった。   Conventionally, a photolithography method has been used to form electrodes and the like in semiconductor devices such as electronic circuit boards and display devices. However, this photolithography method has a complicated manufacturing process and has a lot of material loss, so that pattern formation can be performed. There is a problem that the manufacturing cost becomes extremely high because a huge amount of cost is required for manufacturing equipment such as an exposure apparatus. Furthermore, the cost of processing the waste liquid generated in the development process at the time of pattern formation is high, and the waste liquid has a problem from the viewpoint of environmental protection.
そこで、低コストでかつ有害な廃液等を生じることのないパターン形成方法に関する研究が種々なされている。なかでも、凹版オフセット印刷法は、微細パターンを高い精度で形成することが可能であることから、フォトリソグラフィー法の代替法として注目されている。凹版オフセット印刷法では、印刷用ブランケットからガラス基板などの被転写体に印刷用インキ組成物を100%転写させるため、印刷用ブランケット表面にはシリコーンゴムシートを用い、印刷用インキ組成物には印刷用ブランケット表面のシリコーンゴムに濡れやすく、かつ浸透し難い溶剤を添加し、印刷用インキ組成物とシリコーンゴムとの界面の張力を低下させることで、シリコーンゴムから印刷用インキ組成物を剥離し易くして印刷用インキ組成物を印刷用ブランケットから基板上に転写させている。   Thus, various researches have been conducted on pattern formation methods that are low in cost and do not generate harmful waste liquids. In particular, the intaglio offset printing method is attracting attention as an alternative to the photolithography method because it can form a fine pattern with high accuracy. In the intaglio offset printing method, 100% of the printing ink composition is transferred from the printing blanket to a transfer medium such as a glass substrate. Therefore, a silicone rubber sheet is used on the printing blanket surface, and printing is performed on the printing ink composition. It is easy to peel off the printing ink composition from the silicone rubber by adding a solvent that easily wets the silicone rubber on the surface of the printing blanket and does not easily penetrate, and reduces the tension at the interface between the printing ink composition and the silicone rubber. Thus, the printing ink composition is transferred from the printing blanket onto the substrate.
上記印刷用インキ組成物としては、導電性金属粉末、ガラスフリット、遷移金属酸化物及び分散剤と、ポリiso−ブチルメタクリレート、ポリiso−プロピルメタクリレート、ポリメチルメタクリレート、ポリテトラフルオロエチレン又はポリ−α−メチルスチレンのうちの少なくとも1種以上の有機バインダを含むビヒクルから構成される導電性インキが開示されている(例えば、特許文献1参照。)。このように構成された導電性インキでは、オフセット印刷に適したインキを調製でき、またオフセット印刷により高精細のパターンを回路基板上に簡単に、しかも従来のスクリーン印刷による方法よりもエッジの直線性に優れ、スケや欠け等の発生が少ない微細なパターンを形成でき、更に精度の点からも高品質のパターンが得られるようになっている。   Examples of the printing ink composition include conductive metal powder, glass frit, transition metal oxide and dispersant, polyiso-butyl methacrylate, polyiso-propyl methacrylate, polymethyl methacrylate, polytetrafluoroethylene or poly-α. -The conductive ink comprised from the vehicle containing the at least 1 sort (s) or more of organic binder of methylstyrene is disclosed (for example, refer patent document 1). With the conductive ink configured in this way, it is possible to prepare ink suitable for offset printing, and it is easy to create a high-definition pattern on the circuit board by offset printing, and the edge linearity than the conventional screen printing method In addition, it is possible to form a fine pattern with less occurrence of scratches and chips, and to obtain a high quality pattern from the viewpoint of accuracy.
また印刷用インキ組成物として、少なくとも導電性粉体と焼成除去可能な有機成分とからなり、導電性粉体を60〜90重量%の範囲で含有し、焼成除去可能な有機成分を10〜40重量%の範囲で含有する光硬化型導電インキが開示されている(例えば、特許文献2参照。)。この光硬化型導電インキでは、有機成分中にスチレンと光反応性の官能基が付与された光反応性アクリル系樹脂、光反応性モノマー及びオリゴマーを含有する。このように構成された光硬化型導電インキでは、導電性粉体の分散性が向上し、インキの粘度を所望の値にコントロールできるので、平版オフセット印刷法により高精度な電極パターンを形成できるようになっている。
特開平4−213373号公報(請求項2、段落[0007]、段落[0012]) 特開2002−285063号公報(請求項1、段落[0008]、段落[0012])
The printing ink composition comprises at least a conductive powder and an organic component that can be removed by baking, contains the conductive powder in a range of 60 to 90% by weight, and contains 10 to 40 organic components that can be removed by baking. A photocurable conductive ink contained in the range of wt% is disclosed (for example, see Patent Document 2). This photocurable conductive ink contains a photoreactive acrylic resin, a photoreactive monomer, and an oligomer to which a functional group reactive with styrene is added in an organic component. In the photocurable conductive ink thus configured, the dispersibility of the conductive powder is improved, and the viscosity of the ink can be controlled to a desired value, so that a highly accurate electrode pattern can be formed by the lithographic offset printing method. It has become.
JP-A-4-213373 (Claim 2, paragraph [0007], paragraph [0012]) JP 2002-285063 A (claim 1, paragraph [0008], paragraph [0012])
PDP用の電極については、エッジの直線性に優れ、欠け等の発生が少ない高品質の微細パターンを得ることが必須であり、また近年、表示部の高解像度化に伴う電極の微細化に伴い、より細い電極での高品質の確保が課題となっている。
上記従来の特許文献1に示された導電性インキや特許文献2に示された光硬化型導電インキでは、有機バインダとしてスチレンのような芳香族樹脂を使用しているため、より精度の高い印刷が可能である。
しかし、上記従来の特許文献1に示された導電性インキや特許文献2に示された光硬化型導電インキのように、芳香族樹脂を印刷用インキ組成物の樹脂成分として用いると、焼成時に有機成分が完全に焼失せずに、電極中に残ってしまい、電極の導電性が低下するおそれがあった。
本発明の目的は、精度の高い印刷が可能であり、しかも焼成時に有機成分が全く又は殆ど残らず、高精度の印刷性及び良好な導電性の双方を両立させることができる、印刷用インキ組成物及びその製造方法並びに該組成物を用いたプラズマディスプレイパネル用電極の形成方法及びその電極を提供することにある。
As for electrodes for PDP, it is essential to obtain high-quality fine patterns with excellent edge linearity and few occurrences of chipping, etc. In recent years, with the miniaturization of electrodes accompanying the increase in resolution of display parts Ensuring high quality with thinner electrodes is an issue.
In the conventional conductive ink shown in Patent Document 1 and the photocurable conductive ink shown in Patent Document 2, since an aromatic resin such as styrene is used as an organic binder, printing with higher accuracy is possible. Is possible.
However, when an aromatic resin is used as the resin component of the printing ink composition, such as the conductive ink shown in the above-mentioned conventional Patent Document 1 and the photo-curable conductive ink shown in Patent Document 2, when firing, The organic component was not completely burned out but remained in the electrode, and the conductivity of the electrode could be lowered.
An object of the present invention is to provide a printing ink composition that can be printed with high accuracy, and has no or almost no organic component left during firing, and can achieve both high-precision printability and good conductivity. It is an object of the present invention to provide an electrode, a manufacturing method thereof, a method of forming an electrode for a plasma display panel using the composition, and an electrode thereof.
請求項1に係る発明は、図1に示すように、導電性金属粉末、ガラスフリット、樹脂成分及び溶剤成分を含む混合物からなり、基材14上に所望のパターンで印刷された後に乾燥され焼成される印刷用インキ組成物11の改良である。
その特徴ある構成は、樹脂成分が、芳香族成分を含む樹脂に水素添加させることにより得られた脂環式の樹脂成分であり、この脂環式の樹脂成分に含まれる芳香族成分が0.5重量部以下であるところにある。
この請求項1に記載された印刷用インキ組成物では、この印刷用インキ組成物11中の樹脂成分が芳香族成分を含む樹脂に水素添加させることにより得られた脂環式の樹脂成分であり、この脂環式の樹脂成分は導電性金属粉末の分散性が良く、しかもインキ組成物11の粘度調整が容易であるため、この脂環式の樹脂成分を含む印刷用インキ組成物11により所望のパターンに高精細に印刷することができる。また印刷用インキ組成物11中の樹脂成分における、燃え難い原因となるベンゼン環を含む芳香族成分が0.5重量部以下であるため、この印刷用インキ組成物11を基材14上にパターン印刷して塗膜を形成し、この塗膜を乾燥し焼成して得られた電極中に、導電性を阻害する有機成分が全く或いは殆ど残らず、電極の導電性を向上できる。
As shown in FIG. 1, the invention according to claim 1 is composed of a mixture containing conductive metal powder, glass frit, a resin component and a solvent component, printed on a substrate 14 in a desired pattern, dried and fired. This is an improvement of the printing ink composition 11.
The characteristic structure is that the resin component is an alicyclic resin component obtained by hydrogenating a resin containing an aromatic component, and the aromatic component contained in the alicyclic resin component is 0. The amount is 5 parts by weight or less.
In the printing ink composition described in claim 1, the resin component in the printing ink composition 11 is an alicyclic resin component obtained by hydrogenating a resin containing an aromatic component. Since the alicyclic resin component has good dispersibility of the conductive metal powder and the viscosity of the ink composition 11 can be easily adjusted, the printing ink composition 11 containing the alicyclic resin component is desirable. Can be printed with high definition on the pattern. Moreover, since the aromatic component containing the benzene ring which causes a flame hardly in the resin component in the printing ink composition 11 is 0.5 parts by weight or less, the printing ink composition 11 is patterned on the substrate 14. In the electrode obtained by printing and forming a coating film, drying and baking this coating film, the organic component which inhibits electroconductivity does not remain at all or hardly, and can improve the electroconductivity of an electrode.
請求項3に係る発明は、芳香族成分を含む樹脂に水素添加させることにより芳香族成分を0.5重量部以下とした脂環式の樹脂成分を得る工程と、脂環式の樹脂成分と導電性金属粉末とガラスフリットと溶剤成分を混合して印刷用インキ組成物を調製する工程とを含む印刷用インキ組成物の製造方法である。
この請求項3に記載された印刷用インキ組成物の製造方法では、印刷用インキ組成物中の樹脂成分が芳香族成分を含む樹脂に水素添加させた脂環式の樹脂成分であり、導電性金属粉末の分散性が良く、しかもインキ組成物11の粘度調整が容易であるため、この脂環式の樹脂成分を含む印刷用インキ組成物を用いて、所望のパターンに高精細に印刷することができる。また樹脂成分中の燃え難い原因となるベンゼン環を含む芳香族成分を0.5重量部以下としたため、この印刷用インキ組成物を基材上にパターン印刷して塗膜を形成し、この塗膜を乾燥し焼成した場合、電極中に導電性を阻害する有機成分が全く或いは殆ど残らず、電極の導電性を向上できる。
The invention according to claim 3 includes a step of obtaining an alicyclic resin component in which the aromatic component is 0.5 parts by weight or less by hydrogenating a resin containing the aromatic component, and an alicyclic resin component; A method for producing a printing ink composition comprising a step of preparing a printing ink composition by mixing conductive metal powder, glass frit and a solvent component.
In the method for producing a printing ink composition according to claim 3, the resin component in the printing ink composition is an alicyclic resin component obtained by hydrogenating a resin containing an aromatic component, and is conductive. Since the dispersibility of the metal powder is good and the viscosity of the ink composition 11 can be easily adjusted, using the printing ink composition containing this alicyclic resin component, high-definition printing is performed in a desired pattern. Can do. In addition, since the aromatic component containing a benzene ring that causes incombustibility in the resin component is 0.5 parts by weight or less, this printing ink composition is pattern-printed on a substrate to form a coating film. When the film is dried and baked, there is no or almost no organic component that inhibits conductivity in the electrode, and the conductivity of the electrode can be improved.
請求項4に係る発明は、図1に示すように、請求項1又は2記載の印刷用インキ組成物11を基材14上に所望のパターンで印刷して塗膜を形成する工程と、塗膜を乾燥し焼成して電極を形成する工程とを含むプラズマディスプレイパネル用電極の形成方法である。
請求項5に係る発明は、請求項3記載の方法により製造された印刷用インキ組成物11を基材14上に所望のパターンで印刷して塗膜を形成する工程と、塗膜を乾燥し焼成して電極を形成する工程とを含むプラズマディスプレイパネル用電極の形成方法である。
この請求項4又は請求項5に記載されたプラズマディスプレイパネル用電極の形成方法では、高精細な印刷性及び良好な導電性を有する電極を比較的容易に形成できる。
As shown in FIG. 1, the invention according to claim 4 includes a step of printing a printing ink composition 11 according to claim 1 or 2 in a desired pattern on a substrate 14 to form a coating film, A method of forming an electrode for a plasma display panel, comprising: drying and baking the film to form an electrode.
The invention according to claim 5 includes a step of printing the ink composition 11 for printing produced by the method of claim 3 in a desired pattern on the substrate 14 to form a coating film, and drying the coating film. A method of forming an electrode for a plasma display panel including a step of forming an electrode by firing.
In the method for forming an electrode for a plasma display panel according to claim 4 or claim 5, an electrode having high-definition printability and good conductivity can be formed relatively easily.
請求項6に係る発明は、請求項1又は2に記載の印刷用インキ組成物を用いて形成されたプラズマディスプレイパネル用電極である。
請求項7に係る発明は、請求項3に記載の印刷用インキ組成物の製造方法を用いて形成されたプラズマディスプレイパネル用電極である。
請求項8に係る発明は、請求項4又は5に記載の電極の形成方法を用いて形成されたプラズマディスプレイパネル用電極である。
この請求項6ないし8いずれか1項に記載されたプラズマディスプレイパネル用電極では、高精細な印刷性及び良好な導電性を有する電極となる。
The invention according to claim 6 is an electrode for a plasma display panel formed using the printing ink composition according to claim 1 or 2.
The invention according to claim 7 is an electrode for a plasma display panel formed by using the method for producing a printing ink composition according to claim 3.
The invention according to claim 8 is an electrode for a plasma display panel formed by using the electrode forming method according to claim 4 or 5.
The electrode for a plasma display panel according to any one of claims 6 to 8 is an electrode having high-definition printability and good conductivity.
本発明によれば、印刷用インキ組成物の樹脂成分が、芳香族成分を含む樹脂に水素添加させることにより得られた脂環式の樹脂成分であり、この脂環式の樹脂成分に含まれる芳香族成分が0.5重量部以下であるので、この印刷用インキ組成物を基材上にパターン印刷し、乾燥し、更に焼成することにより、エッジの直線性に優れ、欠け等の発生が少ない高品質の微細パターンの電極を得ることができるとともに、電極中に樹脂成分が残留せず電極の比抵抗を小さくすることができる。この結果、上記印刷用組成物を用いて、高精度な印刷性及び良好な導電性の双方を両立させた電極を形成することができる。
また芳香族成分を含む樹脂に水素添加させることにより芳香族成分を0.5重量部以下とした脂環式の樹脂成分を得た後に、この脂環式の樹脂成分と導電性金属粉末とガラスフリットと溶剤成分を混合して印刷用インキ組成物を調製すれば、この印刷用インキ組成物を基材上にパターン印刷し、乾燥し、更に焼成することにより高精度な印刷性及び良好な導電性の双方を両立させた電極を比較的容易に形成できる。
更に上記印刷用インキ組成物を基材上に所望のパターンで印刷して塗膜を形成した後に、この塗膜を乾燥し焼成してプラズマディスプレイパネル用電極を形成すれば、この電極の印刷パターンは高精細となり、導電性は良好となる。
According to the present invention, the resin component of the printing ink composition is an alicyclic resin component obtained by hydrogenating a resin containing an aromatic component, and is included in the alicyclic resin component. Since the aromatic component is 0.5 parts by weight or less, this printing ink composition is pattern-printed on a substrate, dried, and further baked, resulting in excellent edge linearity and occurrence of chipping and the like. It is possible to obtain an electrode with a small number of high-quality fine patterns, and the resin component does not remain in the electrode and the specific resistance of the electrode can be reduced. As a result, an electrode that achieves both high-precision printability and good conductivity can be formed using the printing composition.
Moreover, after obtaining the alicyclic resin component which made the aromatic component 0.5 weight part or less by hydrogenating the resin containing an aromatic component, this alicyclic resin component, electroconductive metal powder, and glass If a frit and a solvent component are mixed to prepare a printing ink composition, the printing ink composition is pattern-printed on a substrate, dried, and further baked to achieve high-precision printability and good conductivity. Therefore, it is possible to relatively easily form an electrode having both properties.
Furthermore, after printing the ink composition for printing in a desired pattern on a substrate to form a coating film, the coating pattern is dried by baking the coating film to form an electrode for a plasma display panel. Becomes high definition and has good conductivity.
次に本発明を実施するための最良の形態を説明する。
本発明の印刷用インキ組成物は、導電性金属粉末、ガラスフリット、樹脂成分及び溶剤成分を含む混合物からなる。導電性金属粉末を100重量部とするとき、ガラスフリットが、好ましくは1〜10重量部、より好ましくは2〜5重量部の割合となるように配合される。また樹脂成分と溶剤成分の比率については、樹脂成分を100重量部とするとき、溶剤成分が、好ましくは30〜200重量部、より好ましくは50〜120重量部の割合となるように配合される。更に導電性金属粉末を100重量部とするとき、樹脂成分及び溶剤成分の合計量が、好ましくは10〜50重量部、より好ましくは15〜30重量部の割合となるように配合される。ここで、上記ガラスフリットを導電性金属粉末100重量部に対して1〜10重量部の範囲内に限定したのは、1重量部未満では焼成後の電極の基材(ガラス基板等)への密着性が悪く、10重量部を越えると焼成後の電極の導電性が低下してしまうからである。また溶剤成分を樹脂成分100重量部に対して30〜200重量部の範囲内に限定したのは、30重量部未満では溶剤の揮発による印刷不良が発生し、200重量部を越えるとインキ組成物の粘度の低下による印刷後のインキ組成物の垂れが発生してしまうからである。更に樹脂成分及び溶剤成分の合計量を導電性金属粉末100重量部に対して10〜50重量部の範囲内に限定したのは、10重量部未満では溶剤の揮発による印刷不良が発生し、50重量部を越えるとインキ組成物の粘度の低下による印刷後のインキ組成物の垂れが発生してしまうからである。
Next, the best mode for carrying out the present invention will be described.
The printing ink composition of the present invention comprises a mixture containing conductive metal powder, glass frit, a resin component and a solvent component. When the conductive metal powder is 100 parts by weight, the glass frit is preferably blended so as to have a ratio of 1 to 10 parts by weight, more preferably 2 to 5 parts by weight. Moreover, about the ratio of a resin component and a solvent component, when a resin component shall be 100 weight part, it mix | blends so that a solvent component may become the ratio of preferably 30-200 weight part, More preferably, 50-120 weight part. . Furthermore, when the conductive metal powder is 100 parts by weight, the total amount of the resin component and the solvent component is preferably 10 to 50 parts by weight, more preferably 15 to 30 parts by weight. Here, the glass frit was limited to the range of 1 to 10 parts by weight with respect to 100 parts by weight of the conductive metal powder. This is because the adhesion is poor, and if it exceeds 10 parts by weight, the conductivity of the electrode after firing is lowered. Further, the solvent component is limited to the range of 30 to 200 parts by weight with respect to 100 parts by weight of the resin component. If the amount is less than 30 parts by weight, printing failure occurs due to volatilization of the solvent. This is because sagging of the ink composition after printing due to a decrease in the viscosity of the ink occurs. Further, the total amount of the resin component and the solvent component is limited to the range of 10 to 50 parts by weight with respect to 100 parts by weight of the conductive metal powder. This is because if the amount exceeds part by weight, dripping of the ink composition after printing due to a decrease in the viscosity of the ink composition occurs.
一方、導電性金属粉末の平均粒径は0.1〜1.0μmの範囲内に設定されることが好適である。また導電性金属粉末としては、銀粉末、銅粉末、アルミニウム粉末、金粉末、ニッケル粉末などが挙げられる。ガラスフリットは、酸化鉛、酸化ビスマス、酸化亜鉛、酸化ホウ素、酸化ケイ素、酸化アルミニウム、酸化リン、酸化カルシウム及び酸化チタンからなる群より選ばれた1種又は2種以上の酸化物からなり、350〜500℃の軟化点を有する酸化物が好ましい。ガラスフリットの平均粒径は、0.1〜1.0μmの範囲内に設定されることが好ましい。ここで、導電性金属粉末の平均粒径を0.1〜1.0μmの範囲内に限定したのは、0.1μm未満ではインキ組成物の粘度が高くなって凹版によるオフセット印刷が困難となり、1.0μmを越えると焼成後の電極の焼結性が悪く導電性が低下してしまうからである。またガラスフリットの軟化点を350〜500℃の範囲内に限定したのは、350℃未満では焼成時に導電性金属粉末の焼結を阻害し導電性が低下してしまい、500℃を越えると焼成後の電極の基材(ガラス基板等)への密着性が低下してしまうからである。更にガラスフリットの平均粒径を0.1〜1.0μmの範囲内に限定したのは、0.1μm未満では焼成後の電極の基材(ガラス基板等)への密着性が低下してしまい、1.0μmを越えると焼成後の電極の導電性が低下してしまうからである。   On the other hand, the average particle size of the conductive metal powder is preferably set within a range of 0.1 to 1.0 μm. Examples of the conductive metal powder include silver powder, copper powder, aluminum powder, gold powder, and nickel powder. The glass frit is composed of one or more oxides selected from the group consisting of lead oxide, bismuth oxide, zinc oxide, boron oxide, silicon oxide, aluminum oxide, phosphorus oxide, calcium oxide and titanium oxide, An oxide having a softening point of ˜500 ° C. is preferred. The average particle size of the glass frit is preferably set within a range of 0.1 to 1.0 μm. Here, the average particle size of the conductive metal powder is limited to the range of 0.1 to 1.0 μm, and if it is less than 0.1 μm, the viscosity of the ink composition becomes high, and offset printing by the intaglio is difficult. This is because if the thickness exceeds 1.0 μm, the sinterability of the electrode after firing is poor and the conductivity is lowered. Further, the softening point of the glass frit is limited to the range of 350 to 500 ° C. If the temperature is lower than 350 ° C., the sintering of the conductive metal powder is inhibited at the time of firing, and the conductivity is lowered. This is because the adhesion of the subsequent electrode to the base material (glass substrate or the like) is lowered. Furthermore, the average particle size of the glass frit is limited to the range of 0.1 to 1.0 μm. If the average particle size is less than 0.1 μm, the adhesion of the electrode after firing to the base material (glass substrate or the like) decreases. If the thickness exceeds 1.0 μm, the conductivity of the electrode after firing is lowered.
樹脂成分としては、芳香族成分を80〜100重量部と多く含む樹脂であり、かつこの芳香族成分を含む樹脂に水素添加することにより脂環式の樹脂成分が合成される樹脂が用いられる。このような樹脂に限定したのは、芳香族成分を多く含む樹脂のままでは焼成時に炭化して有機成分が残存してしまうのに対し、水素添加により芳香族成分を全く又は殆ど含まない脂環式の樹脂では焼成時に全く又は殆ど炭化せず、全て又は殆ど全てが焼失するからである。具体的には、脂環式の樹脂成分は、水添式スチレン樹脂、水添式ビスフェノールAタイプエポキシ樹脂、水添式ビスフェノールFタイプエポキシ樹脂及び長鎖脂肪族ジグリシジルエーテルからなる群より選ばれた1種又は2種以上の単一又は混合した樹脂成分である。また水素添加により脂環式の樹脂を合成する際に、未反応の芳香族が残留成分とし樹脂中に残る場合があるけれども、この未反応の芳香族の割合は、脂環式の樹脂成分を100重量部としたとき0.5重量部以下、好ましくは0.4重量部以下である。ここで、未反応の芳香族の含有量を0.5重量部以下に限定したのは、0.5重量部を越えると焼成時の樹脂の消失性が悪くなり電極の導電性を低下させてしまうからである。なお、芳香族成分を含む樹脂に水素添加して脂環式の樹脂成分を合成する具体的な方法としては、芳香族成分を含む樹脂をテトラヒドロフランなどのエーテル類に溶解し、ロジウムなどの白金族触媒の存在下であって、50〜130℃の温度で3〜15MPaの水素圧力により、水素添加して脂環式の樹脂成分を合成する方法が挙げられる。   As the resin component, a resin containing a large amount of an aromatic component as 80 to 100 parts by weight, and a resin in which an alicyclic resin component is synthesized by hydrogenating the resin containing the aromatic component is used. The limitation to such resins is that if the resin containing a large amount of aromatic components is used, carbonization will occur during firing and organic components will remain, whereas hydrogenation will result in no or little aromatic components. This is because the resin of the formula does not carbonize at all or hardly at the time of firing, and all or almost all is burned out. Specifically, the alicyclic resin component is selected from the group consisting of hydrogenated styrene resin, hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin, and long-chain aliphatic diglycidyl ether. In addition, one or a mixture of two or more single or mixed resin components. In addition, when synthesizing an alicyclic resin by hydrogenation, unreacted aromatics may remain in the resin as residual components. However, the ratio of the unreacted aromatics depends on the alicyclic resin component. When it is 100 parts by weight, it is 0.5 parts by weight or less, preferably 0.4 parts by weight or less. Here, the content of the unreacted aromatic is limited to 0.5 parts by weight or less. If the content of the unreacted aromatic exceeds 0.5 parts by weight, the resin disappearance at the time of firing deteriorates and the conductivity of the electrode decreases. Because it ends up. As a specific method for synthesizing an alicyclic resin component by hydrogenating a resin containing an aromatic component, a resin containing the aromatic component is dissolved in ethers such as tetrahydrofuran, and then a platinum group such as rhodium is used. Examples thereof include a method of synthesizing an alicyclic resin component by hydrogenation in the presence of a catalyst at a temperature of 50 to 130 ° C. and a hydrogen pressure of 3 to 15 MPa.
溶剤成分は、樹脂成分を溶解できる有機溶剤であれば特に限定されない。溶剤成分の具体例としては、アルコール系溶剤、ケトン系溶剤、エーテル系溶剤、カルビトール系溶剤、炭化水素系溶剤、ジオール系溶剤、グリコール系溶剤、グリコールエーテル系溶剤などが挙げられ、更にこれらの溶剤を複数混合させた溶剤も使用できる。なお、乾燥した後に硬化させるために、印刷用インキ組成物にアクリルモノマー、メタクリルモノマーとなどの不飽和モノマーとブチルパーオキサイドのような熱ラジカル化合物を添加してよい。また加熱硬化ではなく紫外線硬化させるために、印刷用インキ組成物にアクリルモノマー、メタクリルモノマーとなどの不飽和モノマーと、2−メチル−1(4−メチルチオ)フェニル)−2−モノフォリノプロパン−1−オンのような紫外線でラジカルを発生する化合物を添加してもよい。このような加熱硬化又は紫外線硬化の添加剤は、電極形成プロセスの設備環境によって選択されるものであり、本発明と直接関係するものではない。   The solvent component is not particularly limited as long as it is an organic solvent that can dissolve the resin component. Specific examples of the solvent component include alcohol solvents, ketone solvents, ether solvents, carbitol solvents, hydrocarbon solvents, diol solvents, glycol solvents, glycol ether solvents, and the like. A solvent in which a plurality of solvents are mixed can also be used. In order to cure after drying, an unsaturated monomer such as an acrylic monomer or a methacrylic monomer and a thermal radical compound such as butyl peroxide may be added to the printing ink composition. In addition, in order to cure by ultraviolet rays rather than heat curing, an unsaturated monomer such as an acrylic monomer and a methacrylic monomer, and 2-methyl-1 (4-methylthio) phenyl) -2-monoforinopropane- You may add the compound which generate | occur | produces a radical with an ultraviolet-ray like 1-one. Such heat curing or ultraviolet curing additives are selected according to the equipment environment of the electrode forming process and are not directly related to the present invention.
このように構成された印刷用インキ組成物を用いて、凹版オフセット印刷法によりガラス基板上にPDP用電極を形成する方法を図1に基づいて説明する。
先ず図1(a)に示すように、所定の凹状パターン10aを有する平面凹版10を印刷版として用意し、この平面凹版10表面に印刷用インキ組成物11を所定量供給する。この平面凹版10表面にスキージ12をあててスライドさせることにより、印刷用インキ組成物11を凹版パターン10aに埋め込む。次いで図1(b)に示すように、表面にシリコーンブランケット13aが取付けられたブランケットロール13を印刷用ブランケットとして用意し、印刷用インキ組成物11が凹状パターン10aに埋め込まれた平面凹版10上にブランケットロール13を圧接し、この状態でブランケットロール13を回転させて平版凹版10上を転動させることにより、平面凹版10の凹状パターン10aに埋め込まれたインキ11の一部をブランケットロール13のシリコーンゴムシート13a表面に転写する。このときの転写率は平面凹版の凹状パターンやインキ組成物に含まれる成分や比率、或いはブランケットの圧接の強弱にもよっても異なるが、ほぼ50〜60%程度の割合である。次に図1(c)に示すように、印刷用インキ組成物11を転写したブランケットロール13をガラス基板14(基材:被転写体)に圧接し、この状態でブランケットロール13を回転させ、ガラス基板14上を転動させることにより、ガラス基板14表面に印刷用インキ組成物11が所定のパターンで転写されて、所望の印刷パターンを有する塗膜となる(図1(d))。更にこの所望の印刷パターンの塗膜が形成されたガラス基板14を空気中で100〜200℃に1〜30分間保持して乾燥させた後に、空気中で500〜600℃、好ましくは540〜580℃で焼成を行う。焼成の温度保持時間は5〜30分が好ましく、10〜20分がより好ましい。
A method for forming an electrode for PDP on a glass substrate by an intaglio offset printing method using the thus configured printing ink composition will be described with reference to FIG.
First, as shown in FIG. 1A, a flat intaglio 10 having a predetermined concave pattern 10a is prepared as a printing plate, and a predetermined amount of a printing ink composition 11 is supplied to the surface of the flat intaglio 10. The squeegee 12 is applied to the surface of the flat intaglio 10 and is slid to embed the printing ink composition 11 in the intaglio pattern 10a. Next, as shown in FIG. 1B, a blanket roll 13 having a silicone blanket 13a attached to the surface is prepared as a printing blanket, and the printing ink composition 11 is placed on the flat intaglio 10 embedded in the concave pattern 10a. In this state, the blanket roll 13 is pressed, and the blanket roll 13 is rotated to roll on the planographic intaglio 10 so that a portion of the ink 11 embedded in the concave pattern 10 a of the flat intaglio 10 is transferred to the silicone of the blanket roll 13. Transfer to the surface of the rubber sheet 13a. The transfer rate at this time is approximately 50 to 60%, although it varies depending on the concave pattern of the plane intaglio, the components and ratios contained in the ink composition, and the pressure of the blanket. Next, as shown in FIG.1 (c), the blanket roll 13 which transcribe | transferred the printing ink composition 11 is press-contacted to the glass substrate 14 (base material: to-be-transferred body), the blanket roll 13 is rotated in this state, By rolling on the glass substrate 14, the printing ink composition 11 is transferred to the surface of the glass substrate 14 in a predetermined pattern to form a coating film having a desired printing pattern (FIG. 1 (d)). Furthermore, after drying the glass substrate 14 on which the coating film having the desired print pattern is formed at 100 to 200 ° C. for 1 to 30 minutes in the air, the glass substrate 14 is dried at 500 to 600 ° C., preferably 540 to 580 in the air. Calcination is performed at 0 ° C. The firing temperature holding time is preferably 5 to 30 minutes, more preferably 10 to 20 minutes.
次に本発明の実施例を比較例とともに詳しく説明する。
<実施例1>
導電性金属粉末として、平均粒径が0.4μmである球状の銀粉末を用意し、またガラスフリットとして、軟化点が450℃である酸化ビスマス−酸化ホウ素系のガラスフリットを用意した。また樹脂成分としてビスフェノールA型のエポキシ樹脂を水素添加することにより得られた水添式ビスフェノールA型エポキシ樹脂を用意し、溶剤成分としてグリコールエーテル系溶剤を用意した。このときの水添式ビスフェノールA型エポキシ樹脂に含まれる芳香族成分は0.3重量部であった。上記導電性金属粉末100重量部と、ガラスフリット3重量部と、樹脂成分10重量部と、グリコールエーテル系溶剤7重量部とをそれぞれ混合し、この混合物をプラネタリーミキサーを使用して30分間分散した後に、更に3本ロールミルを使用して3分間分散することにより、ペースト状の印刷用インキ組成物を調製した。
一方、図1に示すように、凹版オフセット印刷法に用いる印刷版として、ラインの幅、深さ及びピッチがそれぞれ150μm、30μm及び300μmである複数の凹状パターンを有する平面凹版10を用意し、基材(被転写体)として、厚さが2.8mmである対角50インチのガラス基板14(旭硝子社製の前面側の電極基板:PD200)を用意した。また印刷用ブランケットとして、表面に厚さが700μmであって、硬さが40(JIS K 6253 タイプA)であるシリコーンゴムシート(常温硬化型シリコーンゴム(付加型))が取付けられたブランケットロール13を用意した。
Next, examples of the present invention will be described in detail together with comparative examples.
<Example 1>
A spherical silver powder having an average particle diameter of 0.4 μm was prepared as the conductive metal powder, and a bismuth oxide-boron oxide glass frit having a softening point of 450 ° C. was prepared as the glass frit. Also, a hydrogenated bisphenol A type epoxy resin obtained by hydrogenating a bisphenol A type epoxy resin as a resin component was prepared, and a glycol ether solvent was prepared as a solvent component. At this time, the aromatic component contained in the hydrogenated bisphenol A type epoxy resin was 0.3 parts by weight. 100 parts by weight of the above conductive metal powder, 3 parts by weight of glass frit, 10 parts by weight of resin component, and 7 parts by weight of glycol ether solvent are mixed, and this mixture is dispersed for 30 minutes using a planetary mixer. Then, a paste-like printing ink composition was prepared by further dispersing for 3 minutes using a three-roll mill.
On the other hand, as shown in FIG. 1, as a printing plate used in the intaglio offset printing method, a planar intaglio 10 having a plurality of concave patterns with line width, depth and pitch of 150 μm, 30 μm and 300 μm, respectively, is prepared. As a material (transfer object), a 50-inch diagonal glass substrate 14 (front electrode substrate manufactured by Asahi Glass Co., Ltd .: PD200) having a thickness of 2.8 mm was prepared. As a printing blanket, a blanket roll 13 having a silicone rubber sheet (room temperature curing type silicone rubber (additional type)) having a thickness of 700 μm and a hardness of 40 (JIS K 6253 type A) attached to the surface. Prepared.
先ず、平面凹版10の表面に上記印刷用インキ組成物11を所定量供給し、SUS製スキージ12を用いて平面凹版10の凹状のパターン10aに印刷用インキ組成物11を埋め込んだ。次いでブランケットロール13を平面凹版10上に圧接した状態で回転させ、平面凹版10上を転動させることにより、上記凹状のパターン10aに埋め込まれた印刷用インキ組成物11の一部をブランケットロール13のシリコーンゴムシート13a表面に転写した。次にブランケットロール13をガラス基板14に圧接した状態で回転させ、ガラス基板14上を転動させることにより、ガラス基板14の表面に所定のパターンを有する印刷用インキ組成物11を転写して、所望のパターンを有する印刷用インキ組成物の塗膜を形成した。更に印刷後のガラス基板14を空気中で150℃に5分保持して乾燥させた後、空気中で10℃/分の速度で560℃まで昇温し、560℃に10分保持して塗膜を焼成した。以上の工程を経ることにより、表面に電極が形成されたガラス基板を作製した。このガラス基板を実施例1とした。   First, a predetermined amount of the above-mentioned printing ink composition 11 was supplied to the surface of the flat intaglio 10, and the printing ink composition 11 was embedded in the concave pattern 10 a of the flat intaglio 10 using a SUS squeegee 12. Next, the blanket roll 13 is rotated in a state of being pressed against the flat intaglio 10 and is rolled on the flat intaglio 10, whereby a part of the printing ink composition 11 embedded in the concave pattern 10 a is blanket roll 13. Was transferred to the surface of the silicone rubber sheet 13a. Next, the blanket roll 13 is rotated in a state of being pressed against the glass substrate 14, and the printing ink composition 11 having a predetermined pattern is transferred to the surface of the glass substrate 14 by rolling on the glass substrate 14. A coating film of a printing ink composition having a desired pattern was formed. Further, the glass substrate 14 after printing is dried at 150 ° C. for 5 minutes in the air, then heated to 560 ° C. at a rate of 10 ° C./min in the air, and kept at 560 ° C. for 10 minutes for coating. The film was baked. By passing through the above process, the glass substrate in which the electrode was formed on the surface was produced. This glass substrate was referred to as Example 1.
<実施例2>
樹脂成分として、ビスフェノールF型エポキシ樹脂を水素添加することにより得られる水添式ビスフェノールF型樹脂を使用したこと以外は、実施例1と同様にして表面に電極が形成されたガラス基板を作製した。このガラス基板を実施例2とした。なお、水添式ビスフェノールF型エポキシ樹脂に含まれる芳香族成分は0.4重量部であった。
<実施例3>
樹脂成分として、スチレン樹脂を水素添加することにより得られる水添式スチレン樹脂を使用したこと以外は、実施例1と同様にして表面に電極が形成されたガラス基板を作製した。このガラス基板を実施例3とした。なお、水添式スチレン樹脂に含まれる芳香族成分は0.2重量部であった。
<Example 2>
A glass substrate having an electrode formed on the surface was prepared in the same manner as in Example 1 except that a hydrogenated bisphenol F type resin obtained by hydrogenating a bisphenol F type epoxy resin was used as the resin component. . This glass substrate was referred to as Example 2. The aromatic component contained in the hydrogenated bisphenol F type epoxy resin was 0.4 parts by weight.
<Example 3>
A glass substrate having an electrode formed on the surface was prepared in the same manner as in Example 1 except that a hydrogenated styrene resin obtained by hydrogenating a styrene resin was used as the resin component. This glass substrate was referred to as Example 3. The aromatic component contained in the hydrogenated styrene resin was 0.2 parts by weight.
<比較例1>
樹脂成分として、スチレン樹脂を使用したこと以外は、実施例1と同様にして表面に電極が形成されたガラス基板を作製した。このガラス基板を比較例1とした。なお、スチレン樹脂に含まれる芳香族成分は100重量部であった。
<比較例2>
水添式ビスフェノールA型エポキシ樹脂に含まれる芳香族成分が1.0重量部であること以外は、実施例1と同様にして表面に電極が形成されたガラス基板を作製した。このガラス基板を比較例2とした。
<比較例3>
樹脂成分として、アクリル樹脂を使用したこと以外は実施例1と同様にして表面に電極が形成されたガラス基板を作製した。このガラス基板を比較例3とした。なお、アクリル樹脂に含まれる芳香族成分は0重量部であった。
<Comparative Example 1>
A glass substrate having an electrode formed on the surface was prepared in the same manner as in Example 1 except that a styrene resin was used as the resin component. This glass substrate was designated as Comparative Example 1. The aromatic component contained in the styrene resin was 100 parts by weight.
<Comparative example 2>
A glass substrate having an electrode formed on the surface was prepared in the same manner as in Example 1 except that the aromatic component contained in the hydrogenated bisphenol A type epoxy resin was 1.0 part by weight. This glass substrate was designated as Comparative Example 2.
<Comparative Example 3>
A glass substrate having an electrode formed on the surface was prepared in the same manner as in Example 1 except that an acrylic resin was used as the resin component. This glass substrate was designated as Comparative Example 3. In addition, the aromatic component contained in an acrylic resin was 0 weight part.
<比較試験1及び評価>
実施例1〜3及び比較例1〜3のガラス基板上に形成された電極の比抵抗を測定するとともに、これらの電極の印刷性を評価した。電極の比抵抗はロレスター(三菱化学社製)により測定した。また電極の印刷性は、各基板の所定位置における9箇所のライン幅をそれぞれ測定し、平面凹版の凹状のパターンのライン幅に対して上記測定値の最大値及び最小値が±2μm以内であるときを『良好』とし、±2μmを越えたときを『不良』とした。その結果を次の表1にそれぞれ示す。
<Comparative test 1 and evaluation>
While measuring the specific resistance of the electrode formed on the glass substrate of Examples 1-3 and Comparative Examples 1-3, the printability of these electrodes was evaluated. The specific resistance of the electrode was measured with a Lorester (Mitsubishi Chemical Corporation). In addition, the printability of the electrodes is determined by measuring the line widths of nine locations at predetermined positions on each substrate, and the maximum and minimum values of the above measured values are within ± 2 μm with respect to the line width of the concave pattern of the planar intaglio. The time was set as “good”, and the time when it exceeded ± 2 μm was set as “bad”. The results are shown in Table 1 below.
表1から明らかなように、樹脂成分として芳香族樹脂であるスチレン樹脂を用いた比較例1の電極や、樹脂成分中に芳香族成分を1.0重量部含む比較例2の電極では、印刷性が良好であったけれども、比抵抗がそれぞれ10.5μΩ・cm及び5.2μΩ・cmと大きくなり、また樹脂成分として芳香族成分を全く含まないアクリル樹脂を用いた比較例3の電極では、比抵抗が2.8μΩ・cmと比較的良好であったけれども、印刷性が不良であった。これらに対し、芳香族成分を含む樹脂成分に水素添加させることにより、樹脂成分中に芳香族成分を0.2〜0.4重量部と僅かしか含まない水添式脂環式の樹脂成分を用いた実施例1〜3の電極では、印刷性が良好であり、かつ比抵抗が2.6〜3.1μΩ・cmと小さくなった。上述のことから、微細配線に適した高精度の印刷性と比抵抗が小さく良好な導電性との双方を両立させた印刷用インキ組成物を得ることを確認できた。実施例1〜3のように、微細配線に適しかつ比抵抗が小さい電極は、PDP用前面板のバス電極及びPDP用背面板のアドレス電極として最適である。   As is clear from Table 1, the electrode of Comparative Example 1 using a styrene resin which is an aromatic resin as the resin component, or the electrode of Comparative Example 2 containing 1.0 part by weight of the aromatic component in the resin component is printed. In the electrode of Comparative Example 3 using an acrylic resin that does not contain any aromatic component as a resin component, the specific resistance was increased to 10.5 μΩ · cm and 5.2 μΩ · cm, respectively. Although the specific resistance was relatively good at 2.8 μΩ · cm, the printability was poor. On the other hand, by hydrogenating a resin component containing an aromatic component, a hydrogenated alicyclic resin component containing only 0.2 to 0.4 parts by weight of the aromatic component in the resin component is obtained. In the electrodes of Examples 1 to 3 used, the printability was good and the specific resistance was as small as 2.6 to 3.1 μΩ · cm. From the above, it was confirmed that a printing ink composition having both high-precision printability suitable for fine wiring and good electrical conductivity with small specific resistance was obtained. As in Examples 1 to 3, electrodes that are suitable for fine wiring and have a small specific resistance are optimal as bus electrodes for the front panel for PDP and address electrodes for the rear panel for PDP.
本発明実施形態の凹版オフセット印刷法の概略図である。It is the schematic of the intaglio offset printing method of embodiment of this invention.
符号の説明Explanation of symbols
11 印刷用インキ組成物
14 ガラス基板(基材)
11 Ink composition for printing 14 Glass substrate (base material)

Claims (8)

  1. 導電性金属粉末、ガラスフリット、樹脂成分及び溶剤成分を含む混合物からなり、基材上に所望のパターンで印刷された後に乾燥され焼成される印刷用インキ組成物において、
    前記樹脂成分が、芳香族成分を含む樹脂に水素添加させることにより得られた脂環式の樹脂成分であり、
    この脂環式の樹脂成分に含まれる芳香族成分が0.5重量部以下である
    ことを特徴とする印刷用インキ組成物。
    In a printing ink composition comprising a mixture containing conductive metal powder, glass frit, resin component and solvent component, printed on a substrate in a desired pattern, dried and baked,
    The resin component is an alicyclic resin component obtained by hydrogenating a resin containing an aromatic component,
    The printing ink composition, wherein the aromatic component contained in the alicyclic resin component is 0.5 parts by weight or less.
  2. 脂環式の樹脂成分が、水添式スチレン樹脂、水添式ビスフェノールAタイプエポキシ樹脂、水添式ビスフェノールFタイプエポキシ樹脂及び長鎖脂肪族ジグリシジルエーテルからなる群より選ばれた1種又は2種以上の樹脂成分である請求項1記載の印刷用インキ組成物。   The alicyclic resin component is one or two selected from the group consisting of hydrogenated styrene resin, hydrogenated bisphenol A type epoxy resin, hydrogenated bisphenol F type epoxy resin and long chain aliphatic diglycidyl ether The printing ink composition according to claim 1, wherein the printing ink composition is one or more resin components.
  3. 芳香族成分を含む樹脂に水素添加させることにより芳香族成分を0.5重量部以下とした脂環式の樹脂成分を得る工程と、
    前記脂環式の樹脂成分と導電性金属粉末とガラスフリットと溶剤成分を混合して印刷用インキ組成物を調製する工程と
    を含む印刷用インキ組成物の製造方法。
    Obtaining an alicyclic resin component having an aromatic component of 0.5 parts by weight or less by hydrogenating a resin containing the aromatic component;
    A step of mixing the alicyclic resin component, conductive metal powder, glass frit and solvent component to prepare a printing ink composition.
  4. 請求項1又は2記載の印刷用インキ組成物を基材上に所望のパターンで印刷して塗膜を形成する工程と、
    前記塗膜を乾燥し焼成して電極を形成する工程と
    を含むプラズマディスプレイパネル用電極の形成方法。
    Printing the ink composition for printing according to claim 1 or 2 on a substrate in a desired pattern to form a coating film;
    A method of forming an electrode for a plasma display panel, comprising: drying and baking the coating film to form an electrode.
  5. 請求項3記載の方法により製造された印刷用インキ組成物を基材上に所望のパターンで印刷して塗膜を形成する工程と、
    前記塗膜を乾燥し焼成して電極を形成する工程と
    を含むプラズマディスプレイパネル用電極の形成方法。
    Printing the ink composition for printing produced by the method according to claim 3 in a desired pattern on a substrate to form a coating film;
    A method of forming an electrode for a plasma display panel, comprising: drying and baking the coating film to form an electrode.
  6. 請求項1又は2に記載の印刷用インキ組成物を用いて形成されたプラズマディスプレイパネル用電極。   The electrode for plasma display panels formed using the ink composition for printing of Claim 1 or 2.
  7. 請求項3に記載の印刷用インキ組成物の製造方法を用いて形成されたプラズマディスプレイパネル用電極。   The electrode for plasma display panels formed using the manufacturing method of the printing ink composition of Claim 3.
  8. 請求項4又は5に記載の電極の形成方法を用いて形成されたプラズマディスプレイパネル用電極。   The electrode for plasma display panels formed using the formation method of the electrode of Claim 4 or 5.
JP2007035876A 2007-02-16 2007-02-16 Ink composition for printing, method for producing the same, method for forming electrode for plasma display panel using the composition, and electrode therefor Expired - Fee Related JP5135818B2 (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03187948A (en) * 1989-08-31 1991-08-15 Dainippon Printing Co Ltd Electroconductive pattern-forming composition and forming method of electroconductive pattern
JPH05266708A (en) * 1992-03-23 1993-10-15 Tanaka Kikinzoku Kogyo Kk Printing ink for silver conductor circuit and method of forming silver conductor circuit
JP2002285063A (en) * 2001-03-27 2002-10-03 Dainippon Printing Co Ltd Photo-curable conductor ink, method for forming electrode and electrode pattern
JP2002289039A (en) * 2001-03-22 2002-10-04 Dainippon Printing Co Ltd Photocuring conductive ink, method of forming electrodes and electrode patterns
JP2003165938A (en) * 2001-12-03 2003-06-10 Sumitomo Chem Co Ltd Ink composition for printing on glass
JP2004161812A (en) * 2002-11-11 2004-06-10 Toyo Ink Mfg Co Ltd Electron beam-curable ink composition and printed matter
JP2005263859A (en) * 2004-03-16 2005-09-29 Sumitomo Rubber Ind Ltd Electroconductive ink paste
JP2008144151A (en) * 2006-11-15 2008-06-26 Mitsubishi Materials Corp Printing ink and its manufacturing method, and electrode for plasma display panel obtained by using printing ink and its manufacturing method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03187948A (en) * 1989-08-31 1991-08-15 Dainippon Printing Co Ltd Electroconductive pattern-forming composition and forming method of electroconductive pattern
JPH05266708A (en) * 1992-03-23 1993-10-15 Tanaka Kikinzoku Kogyo Kk Printing ink for silver conductor circuit and method of forming silver conductor circuit
JP2002289039A (en) * 2001-03-22 2002-10-04 Dainippon Printing Co Ltd Photocuring conductive ink, method of forming electrodes and electrode patterns
JP2002285063A (en) * 2001-03-27 2002-10-03 Dainippon Printing Co Ltd Photo-curable conductor ink, method for forming electrode and electrode pattern
JP2003165938A (en) * 2001-12-03 2003-06-10 Sumitomo Chem Co Ltd Ink composition for printing on glass
JP2004161812A (en) * 2002-11-11 2004-06-10 Toyo Ink Mfg Co Ltd Electron beam-curable ink composition and printed matter
JP2005263859A (en) * 2004-03-16 2005-09-29 Sumitomo Rubber Ind Ltd Electroconductive ink paste
JP2008144151A (en) * 2006-11-15 2008-06-26 Mitsubishi Materials Corp Printing ink and its manufacturing method, and electrode for plasma display panel obtained by using printing ink and its manufacturing method

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