JP2008199068A - Electronic parts connecting structure and electronic parts connecting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic parts connecting structure to enable easy mounting of even a plurality of electronic parts apart from a printed wiring substrate, and furthermore to enable batch connecting of the plurality of electronic parts onto the printed wiring substrate. <P>SOLUTION: The electronic parts connecting structure 2 connects a lower case 201 and the printed wiring substrate 204 by way of a plate member 203. The lower case 201 is constituted of a high thermal conductivity member, and is provided with a plurality of FETs 202 extruded from terminals 212. Through the printed wiring substrate 204, a plurality of through-holes 220 are bored to engage the terminals 212. The plate member 203 has heat and electric insulating quality, and is provided with tapered holes 215 to guide and position the plurality of through-holes 220 to respective terminals 212. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component connection structure and a connection method.

  In recent years, automobiles such as passenger cars and trucks have been digitized as is well known. In particular, electronic devices that perform switching have changed from electronic relays to transistors, that is, FETs.

  This FET has an extremely large amount of heat generated by the switching operation. Therefore, it is necessary to separate the FET from the printed wiring board and efficiently dissipate heat so as not to adversely affect other electronic devices on the printed wiring board connected to the FET.

  Therefore, paying attention to the case that houses the FET and the printed wiring board connected to the FET, the case is made of metal, the FET is separated from the printed wiring board, and the FET is fixed to the metal case to dissipate heat. An electrical junction box has been proposed.

  In this conventional electric junction box, the FET main body is fixed to the side wall of the metal case orthogonal to the printed wiring board, and the terminals extending from the FET main body are separated from the FET main body so as to separate the FET and the printed wiring board. It is a structure to connect (for example, refer patent document 1).

JP-A-10-201051 (first page, FIG. 1)

By the way, it is indispensable that a plurality of FETs are mounted on an automobile that is expected to have higher functionality and more electrification.
Although it is possible to mount several FETs in the electrical junction box described above, however, a metal case that is substantially U-shaped in cross-section is engaged so that it covers the wiring board with the opening facing down Because of this structure, it is difficult to mount the FET on the side wall of the metal case, and it is difficult to mount a plurality of FETs efficiently separated from the printed wiring board, and the circuit design is limited. Therefore, free circuit design is not possible.

On the other hand, there is a problem in production technology to mount a plurality of FETs on a printed wiring board.
That is, since it is necessary to insert the terminals extending from the plurality of FETs into the through holes formed in the printed wiring board, it cannot be said that the work efficiency is never good.

  Therefore, the present inventor has conceived a technical means for fixing a plurality of FETs together on a member and collectively inserting them into through holes formed in a printed wiring board.

  However, the through hole drilled in the printed wiring board is drilled with extremely high precision by a dedicated punching device. However, even if the FET is fixed to the member with the same precision as the through hole, the terminal extended from the FET If even one of them is bent, it cannot be simultaneously inserted into the through holes formed in the printed wiring board.

  Therefore, as a result of earnest research, the present inventor has found out technical means for simultaneously inserting a plurality of FETs into through holes formed in a printed wiring board at the same time.

  In view of such conventional circumstances, the present invention is designed so that even a plurality of electronic components can be easily mounted apart from the printed wiring board, and the plurality of electronic components are collectively printed. An electronic component connection structure and a connection method that can be connected to a substrate.

In order to solve the above problems, the electronic component connecting structure and connecting method according to the present invention employ the following technical means.
That is, the gist of the invention of claim 1 is that a plurality of electronic parts with extended terminals are fixed to each other and a fixing body made of a member having high thermal conductivity and a plurality of through holes engaging with the terminals are formed. The printed wiring board provided is connected to the plurality of through-holes via a plate member having heat insulating properties and insulating properties provided with tapered holes for guiding and positioning the respective terminals. It exists in the electronic component connection structure.

  The gist of the invention of claim 2 resides in the electronic component connection structure according to claim 1, wherein the plate member is made of a transparent or translucent member.

  The gist of the invention of claim 3 resides in the electronic component connection structure according to claim 1 or 2, wherein a rib for sandwiching and positioning the electronic component is provided on the plate member.

  The gist of the invention of claim 4 is that the fastening body is made of a box-shaped metal case in which the printed circuit board is housed, the electronic component is screwed onto the inner bottom surface of the metal case, and the terminal is above the metal case. The electronic component connection structure according to any one of claims 1 to 3, wherein the electronic component connection structure is formed of an FET extending toward the surface.

  The gist of the invention of claim 5 is that the mounting surface is formed and the terminal is extended in the opposite direction to the mounting surface, and the FET protruding from the screw in the mounting surface direction is fixed to the inner bottom surface of the metal case, Thermal insulation and insulation provided with a printed wiring board having a plurality of through holes, a tapered hole for guiding and positioning the terminal to the through hole, and a rib for sandwiching and positioning the FET And a plate member made of a transparent member having the above, and the terminal is inserted into the through hole through the tapered hole to connect the metal case, the FET, the transparent member, and the printed wiring board. The electronic component connecting method is characterized by the above.

  The gist of the invention of claim 6 is that a printed wiring board having a plurality of through holes is turned upside down, and a tapered hole for guiding and positioning a terminal of the FET is provided in the plurality of through holes, and the FET is arranged. A plate member composed of a transparent member having a heat insulating property and an insulating property is provided with ribs for sandwiching and positioning. The plate member is overlapped with the printed wiring board, and a mounting surface is formed, and the terminal is opposite to the mounting surface. The FET with the screw extending in the mounting surface direction is inserted into the rib and the terminal is inserted into the through hole through the tapered hole and placed on the transparent member. A metal case which is provided with a communication hole for attaching the FET on the bottom surface and is inverted upside down, so that the screw is inserted into the communication hole, the FET, the transparent member, The printed wiring board is covered, the screws protruding from the metal case are tightened, the FET is fixed to the bottom surface of the metal case, and the metal case, the FET, the transparent member, and the printed wiring board are connected. There exists in the electronic component connection method characterized by this.

Since the present invention is configured as described above, the following advantageous effects can be obtained.
According to the first aspect, the fastening body to which the electronic component is fastened and the printed wiring board are connected via the heat insulating and insulating plate member provided with the tapered hole for guiding and positioning the terminal. Therefore, it is possible to mount even a plurality of electronic components corresponding to the mounting position based on a free circuit design while ensuring efficient heat dissipation.
Furthermore, since the tapered hole is forcibly guided and guided to the through hole even when the bent terminal is mixed during the assembly operation, a plurality of terminals can be inserted into the through hole at once.

  According to claim 2, since the plate member is made of a transparent or translucent member, the positional relationship between the tapered hole and the through hole can be visually observed. Therefore, working efficiency can be improved.

  According to the third aspect of the present invention, the rib for positioning the electronic component by sandwiching the electronic component from the fixing body is provided so that the electronic component can be guided and placed at a predetermined position during the assembly operation. The orientation can be recognized at a glance. Therefore, working efficiency can be improved.

According to the fifth and sixth aspects, by adopting the connection method (assembly procedure) of such an electronic component connection structure, it is possible to easily assemble even a plurality of electronic components.

  Next, embodiments of the present invention will be described with reference to the drawings. 1 to 5 show the first embodiment, and FIGS. 6 to 11 show the second embodiment. In the drawings, reference numerals 1 and 2 denote an electronic component connection structure.

(Embodiment 1)
The electronic component connection structure 1 according to the first embodiment is an example in which a plurality of FETs can be mounted apart from the printed wiring board 103.
As shown in FIGS. 1 to 3, the electronic component connection structure 1 according to the first embodiment includes a lower case 101, an FET 102, a printed wiring board 103, and a height adjusting unit 104.

  The lower case 101 is made of a non-ferrous metal such as copper or aluminum having high thermal conductivity, a bottom surface 105 is floated to a required height, and a stay 107 provided with a mounting hole 106 for an automobile body or the like has a lower end on one side. In addition, it has a substantially box-like appearance with a protruding portion 108 slidably engaged with a printed wiring board 103 (to be described later) on the side surface.

  Further, on the bottom surface 105, a rib 109 for guiding and placing the FET 102, which will be described later, to a predetermined position is projected, and a communication hole 110 for fixing the FET 102 to the bottom surface 105 is provided.

By providing the rib 109, the FET 102 can be guided and placed at a predetermined position, and the placement direction of the FET 102 can be recognized at a glance.
In addition, this lower case 101 is comprised so that it may become a sealed container by the upper case (not shown) to engage.

  The FET 102 has a substantially block shape in which an attachment surface 111 is formed and an attachment hole 112 is provided at an end portion and a required circuit is internally provided. The FET 102 is bent by about 90 degrees from a side surface opposite to the attachment hole 112. The terminal 113 is protruded. Then, the head is guided into the rib 109 projecting on the bottom surface 105 so that the open end side of the bent terminal 113 extends upward, and is inserted from the mounting hole 112 through the communication hole 110. The screw 114 is screwed onto the bottom surface 105 by the attached screw 114 and a nut 115 screwed into the screw rod portion of the screw 114 protruding from below the bottom surface 105.

  The printed wiring board 103 has a substantially plate shape in which a required electronic circuit is formed on the base material 118 and a concave portion 116 slidably engaged with the convex portion 108 of the lower case 101 is provided at the edge. The concave portion 116 and the convex portion 108 are engaged with each other, and an open end portion of the terminal 113 extending upward is inserted into a through hole 117 formed in the printed wiring board 103 by a height adjusting means 104 described later. It floats and is supported at the required height.

The height adjusting means 104 includes a clip body 120 and a screw (screw rod) 126.
As shown in FIGS. 2 and 3, the clip body 120 is formed in a substantially L shape in side view with a pair of adjacent side surface portions 122 and flat surface portions 121, and has slits on the open end side sides of both side surface portions 122. Claws 124 that are elastically deformed by being partitioned by 123 are formed, and are fixed to the printed wiring board 103 with the corners of the printed wiring board 103 being sandwiched between the flat portion 121 and the claw 124.

  In addition, the clip body 120 and the printed wiring board 103 are formed so that the outer surface of the clip body 120 fixed to the printed wiring board 103 has a required outline size that is slidably brought into sliding contact with the inner surface of the lower case 101. Has been.

  The screw 126 has a required length with a head, and is screwed to the clip body 120 via a communication hole 119 provided in a corner portion of the printed wiring board 103 and a screw hole 125 provided in the clip body 120. Has been.

  In the electronic component connecting structure 1 according to the first embodiment configured as described above, as shown in FIG. 1, the screw tip of the electronic component connection structure 1 abuts the bottom surface 105 by rotating the screw constituting the height adjusting unit 104. The printed wiring board 103 is levitated and supported so as to be separated from the FET 102.

Next, a connection method (assembly procedure) of the electronic component connection structure 1 according to the first embodiment will be described with reference to FIGS. 4 and 5.
First, the clip body 120 is sandwiched between the corners of the printed wiring board 103 and the screws 126 are screwed together.

  Subsequently, as shown in FIG. 4, the printed wiring board 103 is turned upside down and placed on a jig (not shown), and screws 114 are attached to the mounting holes of the FET 102 so as to protrude toward the mounting surface 111 of the FET 102. 112, the FET 102 is inverted so that the open side of the terminal 113 of the FET 102 faces downward, and the inverted FET 102 is inserted into a through hole 117 formed in the printed wiring board 103 to be inserted into the printed wiring board 103. Place on the back.

When the FET 102 has been placed on the back surface of the printed wiring board 103, as shown in FIG. 5, the lower case 101 is inverted so that the FET 102 is guided to the rib 109, and the screw 114 is inserted into the communication hole 110. As described above, the lower case 101 is placed on the back surface of the printed wiring board 103 with the FET 102 interposed therebetween.
Then, the screw 114 protruding from the lower case 101 is tightened with a nut 115 to fix the FET 102 on the bottom surface 105.

When the fixing of the FET 102 is completed, these are reversed, the screw constituting the height adjusting means 104 is rotated, the tip of the screw is brought into contact with the bottom surface 105, and the printed wiring board 103 is floated away from the FET 102. Then, the connection is completed with the support (see FIG. 1).
Furthermore, the electronic device in which the FETs 102 are mounted by completing the integration of the terminal 113 by the soldering process, which is the next process, and mounting the upper case is completed.

As described above, in the electronic component connection structure 1 according to the first embodiment, the FET 102 is fixed on the bottom surface 105, and the printed wiring board is separated from the FET 102 via the height adjusting unit 104 capable of adjusting the height. By floating from 103, even a plurality of FETs 102 can be mounted while ensuring efficient heat dissipation. In addition, a free circuit design can be ensured.
In addition, by adopting the connection method (assembly procedure) of the electronic component connection structure 1 described above, even a plurality of FETs 102 can be easily assembled.

(Embodiment 2)
Next, an electronic component connection structure 2 according to the second embodiment will be described.
The electronic component connection structure 2 according to the second embodiment is an example in which even a plurality of FETs can be mounted apart from the printed wiring board, and at the same time, the plurality of FETs can be collectively connected to the printed wiring board.

  As shown in FIGS. 6 to 11, the electronic component connection structure 2 according to the second embodiment includes a lower case 201, an FET 202, a plate member 203, and a printed wiring board 204.

  The lower case 201 is made of a non-ferrous metal such as copper or aluminum having high thermal conductivity, the bottom surface 205 is floated to a required height, and a stay 207 provided with a mounting hole 206 for an automobile body or the like has a lower end on one side surface. It has a substantially box-like appearance with a convex portion 208 slidably engaged with a printed wiring board 204 (described later) on the side surface.

In addition, a communication hole 209 for fixing the FET 202 to the bottom surface 205 is provided on the bottom surface 205.
In addition, this lower case 201 is comprised so that it may become a sealed container by the upper case (not shown) to engage.

  The FET 202 has a substantially block shape in which a mounting surface 210 is formed and a mounting hole 211 is provided at an end thereof and a required circuit is internally provided, and is bent by about 90 degrees from a side surface opposite to the mounting hole 211. The terminal 212 is protruded. Then, the screw 213 of the screw 213 inserted from the attachment hole 211 through the communication hole 209 and the screw 213 protruding from the bottom of the bottom face 205 so that the open end side of the bent terminal 212 extends upward. The nut 214 is screwed onto the bottom surface 205.

  The plate member 203 is provided with tapered holes 215 for guiding and positioning the respective terminals 212 in a plurality of through-holes 220 formed in the printed wiring board 204 described later, and the FET 202 is guided and placed at a predetermined position. The rib 216 is formed of a transparent synthetic resin member having a heat insulating property and an insulating property.

  The plate member 203 has a substantially plate shape with an outer shape having a required outer dimension that is slidably contacted with the inner surface of the lower case 201 and is slidable on the edge of the convex portion 208 of the lower case 201. The concave portion 217 to be engaged is provided, and the concave portion 217 and the convex portion 208 are engaged with each other so that the enlarged diameter side of the tapered hole 215 is the FET 202 side, and the terminal 212 extending upward to the tapered hole 215 is inserted. A plate member 203 is placed on the FET 202.

  The diameter of the tapered hole 215 on the reduced diameter side is the same as or slightly smaller than the diameter of the through hole 220. When the terminal 212 is inserted into the through hole 220, the terminal 212 is formed at the edge of the through hole 220. It does not get caught by contact.

  In addition to being able to guide and place the FET 202 to a predetermined position by the rib 216 provided on the diameter expansion side of the tapered hole 215, it is easy to recognize the placement direction of the FET 202, and it is made of a transparent member. Therefore, visual observation is easy even from the surface opposite to the rib 216, which is extremely suitable.

  The printed circuit board 204 has a required electronic circuit formed on the base material 218 and a recess 219 slidably engaged with the protrusion 208 of the lower case 201 at the edge thereof. It has a substantially plate-like appearance shape having a required outer dimension to be fitted, and the concave portion 219 and the convex portion 208 are engaged with each other, and the open end portion of the terminal 212 extending upward is formed on the printed wiring board 204. It is inserted into the drilled through hole 220 and placed on the plate member 203.

  The electronic component connection structure 2 according to the second embodiment configured as described above includes a printed wiring board 204 in which a plurality of through holes 220 that engage with the terminals 212 of the FET 202 are formed, as shown in FIG. The plate member 203 is sandwiched and connected to the FET 202.

Next, a connection method (assembly procedure) of the electronic component connection structure 2 according to the second embodiment will be described.
First, the FET 202 is screwed to the bottom surface 205 with a screw 213 and a nut 214 so that the terminal 212 extends upward.

Then, the printed wiring board 204 and the plate member 203 are overlapped so that the diameter-reduced side of the tapered hole 215 is the back side of the printed wiring board 204, and the printed wiring board 204 and the plate member 203 are inserted while the terminal 212 is inserted into the tapered hole 215. Are placed on the FET 202 to complete the connection.
Furthermore, the electronic device in which the FET 202 is mounted by mounting the upper case by completing the welding process of the terminal 212 by solder, which is the next process, is completed.

  Furthermore, another connection method (assembly procedure) of the electronic component connection structure 2 according to the second embodiment will be described with reference to FIGS.

  First, the printed wiring board 204 in which a plurality of through holes 220 are formed and the plate member 203 made of a transparent member are superposed so that the reduced diameter side of the tapered hole 215 is on the back side of the printed wiring board 204. Invert and place on a dedicated jig G. Subsequently, the screw 213 is inserted into the mounting hole 211 of the FET 202 so as to protrude in the direction of the mounting surface 210 of the FET 202, the FET 202 is inverted so that the open side of the terminal 212 of the FET 202 is downward, and the terminal 212 is tapered. The FET 202 that is inverted upside down while being inserted through the plate 215 is guided by the rib 216 and placed on the plate member 203.

When the placement of the FET 202 on the plate member 203 is completed, as shown in FIG. 11, the lower case 201 is turned upside down and the screw 213 is inserted into the communication hole 209 and placed on the FET 202.
Then, the screw 213 protruding from the lower case 201 is tightened with a nut 214 to fix the FET 202 on the bottom surface 205.

When the fixing of the FET 202 is completed, these are reversed to complete the connection.
Furthermore, the electronic device in which the FET 202 is mounted by mounting the upper case by completing the welding process of the terminal 212 by solder, which is the next process, is completed.

As described above, in the electronic component connection structure 2 according to the second embodiment, the FET 202 is fixed on the bottom surface 205, and a plurality of holes are formed in the through hole 220 of the printed wiring board 204 via the plate member 203 provided with the tapered hole 215. By inserting the terminals 212 together and separating the printed wiring board 204 from the FET 202, a plurality of FETs 202 can be easily mounted while ensuring efficient heat dissipation. In addition, a free circuit design can be ensured.
In addition, by adopting the connection method (assembly procedure) of the electronic component connection structure 2 described above, even a plurality of FETs 202 can be easily assembled.

  The electronic component connection structure and connection method according to the present embodiment have been described above. However, the above-described embodiment shows an example of a preferred embodiment of the present invention, and the present invention is not limited thereto. Various modifications can be made without departing from the scope of the invention.

It is a vertical front view of the electronic component connection structure according to the first embodiment. FIG. It is a perspective view of a height adjustment means. It is explanatory drawing which shows an assembly process same as the above. It is explanatory drawing which shows the assembly process following FIG. It is a vertical front view of the electronic component connection structure concerning Embodiment 2. FIG. FIG. It is a perspective view of an assembly state same as the above. It is explanatory drawing which shows an assembly process same as the above. FIG. 10 is an explanatory view showing an assembly process subsequent to FIG. 9. It is explanatory drawing which shows the assembly process following FIG.

Explanation of symbols

1, 2, ………… Electronic component connection structure 113, 212 …… Terminals 102, 202 …… FET (electronic component)
101, 201 ... Lower case (fastening body)
117, 220... Through hole 103, 204 ...... Printed wiring board 104 ............ Height adjusting means 120 ............ Clip body 126 ...... Screw (screw rod)
109, 216 ... rib 203 .......... plate member 215 .......... taper hole

Claims (6)

  A plurality of electronic parts having terminals extended thereto and a fixing body formed of a member having high thermal conductivity, and a printed wiring board having a plurality of through holes engaged with the terminals, An electronic component connecting structure, wherein the through-hole is connected via a plate member having heat insulating properties and insulating properties provided with tapered holes for guiding and positioning the respective terminals.   The electronic component connection structure according to claim 1, wherein the plate member is made of a transparent or translucent member.   The electronic component connection structure according to claim 1, wherein a rib for sandwiching and positioning the electronic component is provided on the plate member. The fastening body is composed of a box-shaped metal case that houses the printed wiring board,
The electronic component connection structure according to any one of claims 1 to 3, wherein the electronic component comprises an FET that is screwed to an inner bottom surface of the metal case and the terminal extends upward from the metal case. A mounting surface is formed and a terminal is extended in the opposite direction to the mounting surface, and the FET protruding from the screw in the mounting surface direction is fixed to the inner bottom surface of the metal case,
Thermal insulation and insulation provided with a printed wiring board having a plurality of through holes, a tapered hole for guiding and positioning the terminal to the through hole, and a rib for sandwiching and positioning the FET And a plate member composed of a transparent member having
Insert the terminal through the through hole through the tapered hole,
An electronic component connecting method comprising connecting the metal case, the FET, the transparent member, and the printed wiring board. Flip the printed wiring board with multiple through holes,
A plurality of through holes are provided with tapered holes for guiding and positioning the terminals of the FETs, and ribs for positioning the FETs are provided so as to protrude from the plate member made of a transparent member having heat insulating properties and insulating properties. Polymerized with the printed wiring board,
The FET, in which the mounting surface is formed and the terminal extends in the opposite direction to the mounting surface and the screw protrudes in the mounting surface direction, is inserted into the rib and the through-hole is inserted through the tapered hole. Insert the terminal through the hole and place it on the transparent member,
Covering the FET, the transparent member, and the printed wiring board so that the screw is inserted into the communication hole, a metal case provided with a communication hole for mounting the FET on the bottom surface and inverted upside down,
Tighten the screw protruding from the metal case to fix the FET to the bottom of the metal case,
An electronic component connecting method comprising connecting the metal case, the FET, the transparent member, and the printed wiring board.

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