JP2008198949A - 負荷ユニット - Google Patents
負荷ユニット Download PDFInfo
- Publication number
- JP2008198949A JP2008198949A JP2007035464A JP2007035464A JP2008198949A JP 2008198949 A JP2008198949 A JP 2008198949A JP 2007035464 A JP2007035464 A JP 2007035464A JP 2007035464 A JP2007035464 A JP 2007035464A JP 2008198949 A JP2008198949 A JP 2008198949A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- led
- power supply
- load
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 65
- 239000010409 thin film Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000012212 insulator Substances 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
Abstract
【解決手段】取付部21が複数配設された一対の導体20からなる給電線26と、前記導体20間を跨いで前記取付部21上に配置され且つ前記給電線26に電気的に接続される複数の負荷10と、を有する負荷ユニット1において、前記導体20は、前記取付部21と該取付部21に隣接する他の取付部21との間が折り曲げ自在に形成されている。
【選択図】図1
Description
10 LEDランプ(負荷)
20 導体
21 負荷端子(取付部)
22 給電端子(取付部)
23 導体の折り曲げ部
25 被覆導体
26 給電線
30 絶縁体
40 ケース
Claims (3)
- 取付部が複数配設された一対の導体からなる給電線と、前記導体間を跨いで前記取付部上に配置され且つ前記給電線に電気的に接続される複数の負荷と、を有する負荷ユニットにおいて、
前記導体は、前記取付部と該取付部に隣接する他の取付部との間が折り曲げ自在に形成されていることを特徴とする負荷ユニット。 - 前記導体は、薄膜状の金属で構成されていることを特徴とする請求項1記載の負荷ユニット。
- 前記導体は、前記取付部以外の表面が電気的に絶縁されていることを特徴とする請求項1または2に記載の負荷ユニット。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007035464A JP5297592B2 (ja) | 2007-02-15 | 2007-02-15 | Led発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007035464A JP5297592B2 (ja) | 2007-02-15 | 2007-02-15 | Led発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008198949A true JP2008198949A (ja) | 2008-08-28 |
JP5297592B2 JP5297592B2 (ja) | 2013-09-25 |
Family
ID=39757597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007035464A Active JP5297592B2 (ja) | 2007-02-15 | 2007-02-15 | Led発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5297592B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010082654A1 (ja) * | 2009-01-19 | 2010-07-22 | 矢崎総業株式会社 | 電流検出装置の組付け構造 |
JP2014029969A (ja) * | 2012-07-31 | 2014-02-13 | Nichia Chem Ind Ltd | 発光装置の製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60204212A (ja) * | 1984-03-27 | 1985-10-15 | 林 正之 | フラツトケ−ブル布設方法 |
JPH0287435U (ja) * | 1988-12-22 | 1990-07-11 | ||
JPH08213087A (ja) * | 1995-02-03 | 1996-08-20 | Alpha Corp | コネクタおよびコネクタ用導通経路部材 |
JP2002016292A (ja) * | 2000-06-28 | 2002-01-18 | Toshiba Lighting & Technology Corp | Led表示装置 |
WO2002089222A1 (fr) * | 2001-04-26 | 2002-11-07 | Moriyama Sangyo Kabushiki Kaisha | Coupleur de sources lumineuses, dispositif d'eclairage, conducteur a motifs et procede de fabrication d'un coupleur de sources lumineuses |
-
2007
- 2007-02-15 JP JP2007035464A patent/JP5297592B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60204212A (ja) * | 1984-03-27 | 1985-10-15 | 林 正之 | フラツトケ−ブル布設方法 |
JPH0287435U (ja) * | 1988-12-22 | 1990-07-11 | ||
JPH08213087A (ja) * | 1995-02-03 | 1996-08-20 | Alpha Corp | コネクタおよびコネクタ用導通経路部材 |
JP2002016292A (ja) * | 2000-06-28 | 2002-01-18 | Toshiba Lighting & Technology Corp | Led表示装置 |
WO2002089222A1 (fr) * | 2001-04-26 | 2002-11-07 | Moriyama Sangyo Kabushiki Kaisha | Coupleur de sources lumineuses, dispositif d'eclairage, conducteur a motifs et procede de fabrication d'un coupleur de sources lumineuses |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010082654A1 (ja) * | 2009-01-19 | 2010-07-22 | 矢崎総業株式会社 | 電流検出装置の組付け構造 |
JP2010164517A (ja) * | 2009-01-19 | 2010-07-29 | Yazaki Corp | 電流検出装置の組付け構造 |
US8421451B2 (en) | 2009-01-19 | 2013-04-16 | Yazaki Corporation | Assembly structure of current detection device |
JP2014029969A (ja) * | 2012-07-31 | 2014-02-13 | Nichia Chem Ind Ltd | 発光装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5297592B2 (ja) | 2013-09-25 |
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