JP2008192186A - Optical pickup device and optical disk drive - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To maintain the performance and improve life of a laser diode by attaching a heat conductive material to easily and efficiently radiate its heat. <P>SOLUTION: The laser diode stem surface is made parallel with the XZ plane before adjusting, and the center surface of the U-shaped heat conductive material is brought into contact with the stem surface of the laser diode by utilizing that the stem surface does not incline in the X axis direction since the rotating direction around the Z axis is not adjusted. Then, the surfaces erected from both sides of the heat conductive material are brought into contact with the sides of projections on the optical base, respectively. Thus, it becomes possible to effectively transfer the heat of the laser diode to the optical base. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an optical pickup device for recording or reproducing information by condensing a laser beam on an information recording surface of an optical disc, and an optical disc apparatus including the same.

2. Description of the Related Art In recent years, optical disc apparatuses that use an optical disc as an information recording medium and record information such as audio signals and video signals with high density and reproduce the same have become widespread. In such an optical disc apparatus, an optical pickup device is used for condensing a laser beam on the information recording surface of the optical disc to form a light spot and receiving reflected light from the information recording surface. .

FIG. 18 is a diagram showing the adjustment direction of the laser diode with respect to the optical base of the optical pickup device. As shown in FIG. 18, when the laser diode 101 is fixed to the optical base 102, the X axis (axis perpendicular to the direction of the emitted laser beam (optical axis direction) and parallel to the optical disk), Y
Translational movement in three directions, the axis (axis perpendicular to the outgoing laser beam direction (optical axis direction) and perpendicular to the optical disk) and the Z axis (emission laser beam direction (optical axis direction)), and the radial direction (around the Y axis) Rotation direction) and tangential direction (rotation direction around the X axis), adjusting the position in the above five directions while monitoring the position of the optical axis and the amount of light distribution. Is fixed to the optical base 102 in a hollow manner using an adhesive or the like. There can be partial point contact or line contact.

The laser diode 101 generates heat when irradiated with laser light. When data is recorded on an optical disc, a large amount of heat is generated because a large laser power is required. In the laser diode 101, there is a possibility that the wavelength of the laser beam may change due to heat, or the lifetime may be shortened. For this reason, it is necessary to dissipate heat efficiently.

In order to dissipate heat, it is conceivable that a component having a high thermal conductivity is brought into contact with the laser diode. The thermal conductivity is, for example, 0.024 [W / m * K] for air, 0.2 to 0.3 [W / m * K] for an ultraviolet curable adhesive, and 1 to 3 [W] for heat radiation grease. / M * K]. Compared to this, aluminum has a large thermal conductivity of 240 [W / m * K] and copper has a large thermal conductivity of 390 [W / m * K]. Therefore, it is desirable to dissipate heat by bringing a metal into contact with the laser diode.

For example, Patent Document 1 describes a method in which a holder made of metal such as aluminum is attached to a laser diode so as to cover the rear portion of the laser diode, and a part of the holder is bonded to an optical base.
JP 2005-108300 A

However, as described above, since the laser diode 101 is rotationally moved in the radial direction and the tangential direction with respect to the optical base 102 when the position is adjusted, the laser diode 101, the holder, and the optical base 102 are At least one of the parts is in point contact or line contact with the other two parts, and sufficient heat conduction cannot be obtained. If an attempt is made to make the contact of the three parts surface contact, an external force is applied to any of the parts, and the adjustment position of the laser diode 101 with respect to the optical base 102 may be shifted over time.

The laser diode 101 and the optical base 102 are brought into surface contact with each other without applying an external force to the laser diode 101 that is positionally adjusted in five directions and fixed to the optical base 102 in a hollow manner, so that the laser diode 101 generates heat. It is desired to dissipate heat efficiently.

The present invention has been made in view of the circumstances as described above, and after a laser diode is mounted at an accurate position with respect to the optical base, a heat conducting member that promotes heat radiation of the laser diode at an appropriate position is provided. It is an object of the present invention to provide an optical pickup device that can easily and efficiently dissipate heat generated by a laser diode, maintain the performance of the laser diode, and extend the life of the laser diode, and an optical disk device including the optical pickup device.

In order to achieve the above object, an optical pickup device of the present invention is arranged so that a laser diode that emits laser light and the laser diode are fixed and the laser diode is sandwiched between both sides of the vicinity of the laser diode. A base having two side surfaces substantially parallel to the optical axis of the laser beam, a substantially plate-shaped central portion, and a substantially plate-shaped rising portion substantially perpendicular to the central portion on both sides of the central portion. It has a U-shape, and the center portion has a surface contact with the stem portion of the laser diode, and the rising portions on both sides have a heat conduction member that makes a surface contact with the two side surfaces of the base. And

The optical disk device of the present invention includes a laser diode that emits laser light, and an optical axis of the laser light that is fixed so that the laser diode is sandwiched between both sides of the vicinity of the laser diode. A base having two substantially parallel side surfaces;
A substantially plate-shaped central portion and a substantially plate-shaped rising portion that is substantially perpendicular to the central portion on both sides of the central portion are formed in a U shape, and the central portion is a stem portion of the laser diode. An optical pickup device having a surface contact and a heat conducting member in which the rising portions on both sides are in surface contact with the two side surfaces of the base is mounted.

According to the present invention, after mounting the laser diode at a precise position with respect to the optical base, optical performance is sacrificed by constructing an efficient heat transfer path with a contact surface with the laser diode. Therefore, heat radiation performance can be ensured and the characteristics and life of the laser diode can be improved.

  Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing a configuration of an optical disc apparatus according to an embodiment of the present invention. Optical disc 2
On the information recording surface, land tracks and groove tracks are formed in a spiral shape. Examples of the optical disc 2 include a DVD-R and a DVD-RW. The optical disk 2 is rotationally driven by a spindle motor 3.

Information recording / reproduction with respect to the optical disc 2 is performed by an optical pickup device 5 (a portion surrounded by a broken line on the left side in the figure). The optical pickup device 5 is connected to a thread motor 6 through a gear 8, and the thread motor 6 is controlled by a thread motor control circuit 9.

A speed detector 7 located below the thread motor 6 detects the moving speed of the optical pickup, and is connected to the thread motor control circuit 9. A speed signal of the optical pickup device 5 detected by the speed detector 7 is sent to the sled motor control circuit 9. A permanent magnet (not shown) is provided in the fixed portion of the thread motor 6, and the optical pickup device 5 is driven in the radial direction of the optical disk 2 when the drive coil is excited by the thread motor control circuit 9.

The optical pickup device 5 is provided with an objective lens 10 supported by a wire or a leaf spring (not shown). The objective lens 10 can be moved in the focusing direction (the optical axis direction of the lens) and the tracking direction (the direction orthogonal to the optical axis of the lens) by driving the focusing coil 11 and the tracking coil 12.

When recording information on the optical disk 2, the modulation circuit 14 receives an information signal to be recorded from the host device 33 via the interface circuit 32 and the bus 27, and receives the information signal from the modulation system (for example, 8- 16 modulation). The laser control circuit 13 supplies a write signal to the laser diode 15 based on the modulation data supplied from the modulation circuit 14 when information is recorded on the optical disc 2 (at the time of mark formation). The laser control circuit 13 supplies a read signal smaller than the write signal to the laser diode 15 during information reproduction.

The laser diode 15 generates laser light according to a signal supplied from the laser control circuit 13. Laser light emitted from the laser diode 15 is irradiated onto the optical disc 2 through the collimator lens 18, the half prism 19, and the objective lens 10. Optical disc 2
The reflected light from the light is guided to the photodetector 22 through the objective lens 10, the half prism 19, the condenser lens 20, and the cylindrical lens 21.

The photodetector 22 is composed of, for example, four-divided photodetector cells 22a to 22d. The output signals of the respective light detection cells 22a to 22d of the light detector 22 are supplied to the signal processing circuit 23 and subjected to the following signal processing. The output signals of the respective photodetection cells 22a to 22d are added and subtracted via an amplifier for current / voltage conversion to obtain a reproduction signal, a focus error signal FE, and a tracking error signal TE.

The focus error signal FE is supplied to the focusing control circuit 24, and a focusing drive signal is generated. The focusing drive signal output from the focusing control circuit 24 is supplied to the focusing coil 11, and focusing control of the objective lens 10 is performed so that the laser light is always just focused on the recording surface of the optical disc 2.

The tracking error signal TE is supplied to the tracking control circuit 25, and a tracking drive signal is generated. The tracking drive signal output from the tracking control circuit 25 is supplied to the tracking coil 12, and tracking control of the objective lens 10 is performed so that the laser beam is always positioned on the target track on the recording surface of the optical disc 2. The tracking drive signal is also supplied to the sled motor control circuit 9.

The reproduction signal is supplied to the data reproduction circuit 26. The data reproduction circuit 26 is connected to the PLL circuit 16.
The read recording data is reproduced based on the reproduction clock signal from. Further, the data reproduction circuit 26 has a measurement function for measuring the amplitude of the signal RF, and the measurement value is output to the CPU 28 via the bus 27.

The sled motor control circuit 9 controls the sled motor 6 and moves the main body of the optical pickup device 5 so that the objective lens 10 is positioned near the center position in the optical pickup device 5.

The disk motor control circuit 4, the thread motor control circuit 9, the modulation circuit 14, the laser control circuit 13, the PLL circuit 16, the data reproduction circuit 26, the focusing control circuit 24, the tracking control circuit 25, and the like are configured in one LSI chip. These circuits are controlled by a CPU (Central Processing Unit) 28 via a bus 27. CPU2
8 comprehensively controls the optical disc recording / reproducing apparatus in accordance with an operation command supplied from the host device 33 via the interface circuit 32. The CPU 28 uses the RAM 29 as a work area, and performs predetermined control according to a program recorded in the ROM 30 and including processing according to the embodiment of the present invention.

FIG. 2 is a diagram illustrating the adjustment direction of the laser diode 15 with respect to the optical base 40 of the optical pickup device 5. The optical base 40 includes a collimator lens 18 and a half prism 19.
The objective lens 10 is disposed, and the laser light emitted from the laser diode 15 is
The light is irradiated onto the optical disk 2 through the collimator lens 18, the half prism 19 and the objective lens 10.

The adjustment direction of the laser diode 15 is X axis (axis perpendicular to the outgoing laser beam direction (optical axis direction) and parallel to the optical disk), Y axis (perpendicular to the outgoing laser beam direction (optical axis direction) and perpendicular to the optical disk). 3 axes of translational movement in the Z axis (the direction of the emitted laser beam (optical axis direction)), radial direction (rotation direction around the Y axis), and tangential direction (rotation direction around the X axis)
There are two directions of rotational movement. The translational movement in the X-axis direction and the Y-axis direction is mainly an optical axis adjustment that matches the optical axis of the optical system in the optical base 40 with the light emitting point of the laser diode 15. The translational movement in the Z-axis direction is mainly a focus adjustment of the laser beam. The radial direction and the tangential direction mainly adjust the optimum position of the intensity distribution of the laser beam. The direction of rotation around the Z axis is not adjusted.

If the stem upper surface 15b (surface facing the optical disk) of the stem 15a of the laser diode 15 is made parallel to the XZ plane before starting the adjustment, the rotation direction around the Z axis is not adjusted, so the stem upper surface 15b Does not tilt in the X-axis direction. The rotation in the tangential direction has an inclination with respect to the Z-axis direction. In the rotation in the radial direction, the stem upper surface 15b only rotates in the same plane and does not incline in the X direction.

The laser diode 15 is fixed to the optical base 40 using an ultraviolet curing adhesive or the like while adjusting the position in the five directions while monitoring the position of the optical axis and the amount of light distribution. Projections 41 and 42 as shown in FIG. 2 are provided from the optical base 40, for example, and the distance between the side surfaces 41 a and 42 a on the laser diode 15 side of the protrusions 41 and 42 is the X-axis direction of the laser diode 15. Is set to the total distance of the length and the movable range in adjustment,
The position of the laser diode 15 is adjusted within this range, and an ultraviolet curable adhesive is filled between the laser diode 15 and the side surfaces 41a and 41b and cured and bonded.

FIG. 3 is a view showing the heat conducting member 43, the optical base 40, and the laser diode 15. A state before the heat conducting member 15 is mounted on the optical base 40 is shown. Thermal conduction member 4
3 is formed in a U-shape having a substantially plate-shaped central portion 43a and substantially plate-shaped rising portions 43b and 43c substantially perpendicular to the central portion 43a on both sides of the central portion 43a. For example, a rectangular plate as shown in FIG. 3 is bent at two locations. The heat conducting member 43 is preferably a metal having a high heat conductivity. For example, if the copper plate is bent and manufactured, the thermal conductivity is large and the manufacturing cost can be reduced. Alternatively, aluminum die casting or zinc die casting may be used. The distance between the U-shaped inner surfaces 43b1 and 43c1 of the rising portions 43b and 43c of the heat conducting member 43 is represented by W2.

The optical base 40 is provided with two side surfaces substantially parallel to the optical axis of the laser beam, which are arranged so as to sandwich the laser diode 15 on both sides near the laser diode 15. For example, FIG.
As shown in FIG. 4, the side surface 41b of the protrusion 41 opposite to the laser diode 15 and the side surface 42b of the protrusion 42 opposite to the laser diode 15 are substantially parallel to the YZ plane. Side surface 41b
And the distance between the side surfaces 42b is represented by W1. W2 is slightly longer than W1. For example, a dimensional tolerance of a general clearance fit may be used.

FIG. 4 is a view showing a state in which the heat conducting member 15 is attached to the optical base 40. In this state, the U-shaped inner surface 43a1 of the central portion 43a of the heat conducting member 43 and the laser diode 15
The upper surface 15b of the heat transfer member 43 is in surface contact, and the inner surfaces 43b1 and 43c1 of the rising portions 43b and 43c on both sides of the heat conducting member 43 face the side surface 41b of the protrusion 41 and the side surface 42b of the protrusion 42, respectively. In contact. Since the stem upper surface 15b does not have an inclination in the X-axis direction, the surface 43a1 of the heat conducting member 43 and the stem upper surface 15b can be in almost complete surface contact. FIG. 4 shows a state where the laser diode 15 hardly rotates in the tangential direction, that is, the stem upper surface 1.
5b shows a state where the tilt is not so much in the Z-axis direction.

FIG. 5 is a view of the state of FIG. 4 as viewed from the lead terminal surface side of the laser diode 15. The surface 43a1 of the heat conducting member 43 and the stem upper surface 15b, the surface 43b1 of the heat conducting member 43 and the side surface 41b of the optical base 40, and the surface 43c1 of the heat conducting member 43 and the side surface 42b of the optical base 40 are in surface contact. Show. In the laser diode 15, the side surface of the stem 15 a, the side surface 41 a of the protrusion 41, and the side surface 42 a of the protrusion 42 are filled with an adhesive and are fixed hollow.

FIG. 6 shows a state where the laser diode 15 is rotated in the tangential direction, and the stem upper surface 15.
It is the figure which highlighted and showed the state in which b inclined in the Z-axis direction. Even in this case, the stem upper surface 15
b has no inclination in the X-axis direction.

FIG. 7 is a view showing a state in which the heat conducting member 15 is attached to the optical base 40 in the state of FIG. Even in this state, the surface 43a1 and the stem upper surface 15b of the heat conducting member 43, the surface 43b1 of the heat conducting member 43 and the side surface 41b of the optical base 40, and the surface 43c1 of the heat conducting member 43 and the side surface 42b of the optical base 40 are in surface contact. is doing.

As described above, the stem upper surface 15b of the laser diode 15 is adjusted to XZ before starting the adjustment.
The stem upper surface 15b is set to be parallel to the plane and the rotation direction around the Z axis is not adjusted.
By utilizing the fact that it does not tilt in the axial direction, the surface 4 of the central portion 43a of the U-shaped heat conducting member 43 is used.
3a1 and the stem upper surface 15b of the laser diode 15 are brought into surface contact, and the rising portions 43b and 43c on both sides of the heat conducting member 43 are connected to the surfaces 43b1 and 43c1 of the protrusion 41, respectively.
By bringing the side surface 42b of the protrusion 42 into surface contact, the heat of the laser diode 15 can be efficiently transferred to the optical base. Further, since there is heat radiation by the heat conducting member 43 itself, a large heat radiation effect can be obtained.

Note that the inner surfaces of the rising portions 43b and 43c on both sides of the U-shape of the heat conducting member 43, the side surface 41b of the protrusion 41 opposite to the laser diode 15, and the side surface of the protrusion 42 opposite to the laser diode 15 are provided. Although the example in which the surface 42b is in surface contact is shown, the outer surfaces 43b2 and 43c2 of the rising portions 43b and 43c on both sides of the U-shape of the heat conducting member 43 may be in contact with a part of the optical base 40. Is possible. In that case, a protrusion is provided separately from the protrusions 41 and 42, and two side surfaces substantially parallel to the optical axis of the laser beam are disposed on both sides of the laser diode so as to sandwich the laser diode. What should I do? Alternatively, it may be possible to contact the surfaces 41a and 42a so as to avoid the application position of the adhesive in the Z-axis direction.

FIG. 8 is a diagram showing a case where the stem portion 45b of the laser diode 45 has an annular shape. In such a case, it is possible to install a surface similar to the stem upper surface 15b described above by mounting the holder 46, which is a separate component. A plane parallel to the direction in which the laser beam is emitted is added to the laser diode 45 by the holder 46. FIG. 9 is a view in which a holder 46 is attached to the laser diode 45. By doing so, it is possible to configure the surface 46b having the same function as the stem upper surface 15b. What is necessary is just to determine a shape suitably so that the plane of a holder closely_contact | adheres to the surface 43a1 of the center part 43a of the heat conductive member 43, and a surface contact is possible.

10 and 11 are diagrams showing examples of other shapes of the holder. In this way, it is possible to set a plane having the same function as the stem upper surface 15b by adding a holder having an appropriate shape to the laser diode regardless of the shape of the laser diode. The heat conducting member 43 can be applied. The holder is preferably made of metal in order to improve heat dissipation efficiency. Further, it is desirable that the laser diode 45 is fixed in close contact with the laser diode 45 and has a large contact area. In particular, the heat dissipation effect is enhanced when the contact is made at a position close to the portion that generates heat.

Next, an example in which the above-described U-shaped heat conducting member is applied to an optical pickup device 50 for a thin optical disk device will be described. FIG. 12 shows an optical pickup device 5 for a thin optical disk device.
FIG. FIG. 12 is a view as seen from the optical disk side, and an objective lens 51 is installed in the approximate center of the optical pickup device 50. A recess 53 is formed in a part of the optical base 52, and a laser diode 54 is hollowly fixed in the recess 53. A holder 55 is attached to the laser diode 54.

FIG. 13 is a plan view of the optical pickup device 50 viewed from the side opposite to the optical disk side. In the optical pickup device 50, the heat conducting member 56 is installed on the surface opposite to the optical disk. 3 to 7, the heat conducting member 43 is configured to come into surface contact with the stem upper surface 15 b of the laser diode 15. As described above, the heat conducting member 56 includes the laser diode 54 and the optical disk of the holder 55. May be configured to contact the contact surface on the opposite side.

FIG. 14 is a perspective view in which the holder 55 is attached to the laser diode 54. The laser diode 54 has a substantially rectangular parallelepiped shape instead of an annular shape. The holder 55 is set in a shape that allows surface contact with the heat conducting member 56. Thus, even if the laser diode has a substantially rectangular parallelepiped shape, an appropriate contact surface can be secured by mounting the metal material holder 55.

FIG. 15 is a perspective view of the heat conducting member 56. It is a U-shape with three planes. This heat conducting member 56 is made by punching a copper plate with a press and then bending it. The center surface 56a is in surface contact with the holder 55, and the surfaces of the rising portions 56b and 56c are in surface contact with the optical base.

FIG. 16 is an enlarged perspective view of the vicinity of the heat conducting member 56 of the optical pickup device 50. Two side surfaces 57a and 57b substantially parallel to the optical axis of the laser beam are formed on both sides of the optical base 52 in the vicinity of the laser diode 54 so as to sandwich the laser diode. This side 5
7a and the surface of the rising portion 56b of the heat conducting member 56 are in surface contact, and the side surface 57b and the heat conducting member 56 are in contact with each other.
The surface of the rising portion 56c is configured to come into surface contact.

FIG. 17 is a view showing the heat conducting member 48 according to the second embodiment of the present invention. The difference between the second embodiment and the first embodiment is that the shape of the heat conducting member that is U-shaped in the first embodiment is changed to an L-shape in the second embodiment.

The heat conducting member 48 has an L shape having a substantially plate-like bottom portion 48a and a substantially plate-shaped rising portion 48b substantially perpendicular to the bottom portion 48a. For example, a rectangular plate as shown in FIG.
It is a shape bent at a point. The L-shaped inner surface 48a1 of the bottom portion 48a is in surface contact with the stem upper surface 15b of the stem portion 15a of the laser diode 15, and the rising portion 48b is on one side of the optical base 40 near the laser diode 15 on the optical axis of the laser light. In surface contact with the substantially parallel side surfaces 41a or 41b, or 42a, or 42b.

The L-shaped heat conducting member 48 is easier to install than the U-shaped heat conducting member 43. In the U-shape, the accuracy of the rising portion interval W2 is important in order to achieve surface contact. However, in the L-shape, the surface 48b1 or 48b2 of the rising portion may be abutted against the side surface of the optical base. Therefore, there is a degree of freedom of installation in the X-axis direction. However, the heat conduction performance of the L-shaped heat conducting member 48 is lower than that of the U-shaped heat conducting member 43. The U-shape or L-shape can be determined based on the balance between heat dissipation efficiency and installation.

As described above, after mounting the laser diode in the correct position with respect to the optical base,
By configuring an efficient heat transfer path having a contact surface with the laser diode, heat dissipation performance can be ensured without sacrificing optical performance, and the characteristics and life of the laser diode can be improved.

The figure which shows the structure of the optical disk apparatus as an information recording device which concerns on embodiment of this invention. The figure which shows the adjustment direction of the laser diode with respect to the optical base of an optical pick-up apparatus. The figure which showed the heat conductive member, the optical base, and the laser diode. The figure which shows the state with which the heat conductive member was mounted | worn with the optical base. The figure which looked at the state of FIG. 4 from the lead terminal surface side of the laser diode. The figure which showed the state which the laser diode rotated in the tangential direction. The figure which shows the state by which the heat conductive member was mounted | worn with the optical base in the state of FIG. The figure which showed the case where the stem part of a laser diode is an annular | circular shape. The figure which attached the holder to the laser diode. The figure which showed the example of another shape of a holder. The figure which attached the holder of another shape to the laser diode. The top view which showed the optical pick-up apparatus for thin optical disk apparatuses. The top view which looked at the optical pick-up apparatus from the optical disk side and the other side. The perspective view which attached the holder to the laser diode. The perspective view of a heat conductive member. The expansion perspective view of the vicinity of the heat conductive member of an optical pick-up apparatus. The figure which shows the heat conductive member which concerns on Example 2 of this invention. The figure which shows the adjustment direction of the laser diode with respect to the optical base of an optical pick-up apparatus

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical disk apparatus 2 Optical disk 5 Optical pick-up apparatus 10 Objective lens 15 Laser diode 15a Stem 15b Stem upper surface 18 Collimator lens 19 Half prism 40 Optical base 41 Projection part 41a, 41b Side surface 42 Projection part 42a, 42b Side surface 43 Thermal conduction member 43a Center part 43b, 43c Rising portion 45 Laser diode 46 Holder 47 Holder 48 Thermal conduction member 50 Optical pickup device 51 Objective lens 52 Optical base 54 Laser diode 55 Holder 56 Thermal conduction member 101 Laser diode 102 Optical base 103 Optical disc

Claims (10)

A laser diode that emits laser light;
A base having two side surfaces substantially parallel to the optical axis of the laser beam, which is disposed so as to sandwich the laser diode on both sides in the vicinity of the laser diode, while fixing the laser diode;
A substantially plate-shaped central portion and a substantially plate-shaped rising portion that is substantially perpendicular to the central portion on both sides of the central portion are formed in a U shape, and the central portion is a stem portion of the laser diode. Surface contact,
2. The optical pickup device according to claim 1, wherein the rising portions on both sides have a heat conducting member in surface contact with the two side surfaces of the base. 2. The optical pickup device according to claim 1, wherein an interval between the two side surfaces of the base is substantially equal to an interval between rising portions on both sides of the heat conducting member.   The optical pickup device according to claim 1, wherein the heat conducting member is a metal. A laser diode that emits laser light;
Fixing the laser diode, and a base having a side surface substantially parallel to the optical axis of the laser beam on one side near the laser diode;
An L-shape having a substantially plate-shaped bottom portion and a substantially plate-shaped rising portion substantially perpendicular to the bottom portion is formed, the bottom portion is in surface contact with the stem portion of the laser diode, and the rising portion is the base. An optical pickup device comprising: a heat conducting member that is in surface contact with the side surface.   The optical pickup device according to claim 4, wherein the heat conducting member is a metal. A laser diode that emits laser light;
A base having two side surfaces substantially parallel to the optical axis of the laser beam, which is disposed so as to sandwich the laser diode on both sides in the vicinity of the laser diode, while fixing the laser diode;
A substantially plate-shaped central portion and a substantially plate-shaped rising portion that is substantially perpendicular to the central portion on both sides of the central portion are formed in a U shape, and the central portion is a stem portion of the laser diode. Surface contact,
An optical pickup device in which the rising portions on both sides have a heat conducting member in surface contact with the two side surfaces of the base is mounted. 7. The optical disc apparatus according to claim 6, wherein an interval between the two side surfaces of the base and an interval between rising portions on both sides of the heat conducting member are substantially equal.   The optical disk apparatus according to claim 6, wherein the heat conducting member is a metal. A laser diode that emits laser light;
Fixing the laser diode, and a base having a side surface substantially parallel to the optical axis of the laser beam on one side near the laser diode;
An L-shape having a substantially plate-shaped bottom portion and a substantially plate-shaped rising portion substantially perpendicular to the bottom portion is formed, the bottom portion is in surface contact with the stem portion of the laser diode, and the rising portion is the base. An optical pickup device having a heat conducting member in surface contact with the side surface is mounted.   The optical disk apparatus according to claim 9, wherein the heat conducting member is a metal.

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