JP2008187428A - Flexible board with microstrip line, and optical module using the same - Google Patents

Flexible board with microstrip line, and optical module using the same Download PDF

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Publication number
JP2008187428A
JP2008187428A JP2007018859A JP2007018859A JP2008187428A JP 2008187428 A JP2008187428 A JP 2008187428A JP 2007018859 A JP2007018859 A JP 2007018859A JP 2007018859 A JP2007018859 A JP 2007018859A JP 2008187428 A JP2008187428 A JP 2008187428A
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conductor
flexible substrate
electrode
via hole
microstrip line
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Tsuneo Hamaguchi
恒夫 濱口
Atsushi Sugidachi
厚志 杉立
Yasunori Nishimura
靖典 西村
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguides (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Structure Of Printed Boards (AREA)
  • Semiconductor Lasers (AREA)
  • Waveguide Connection Structure (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To simply and surely solder a flexible board with a microstrip line to a rigid wiring board. <P>SOLUTION: First conductors 12 and a second conductor 13 are formed on mutually opposed first surface 11a and second surface 11b of a flexible resin film 11, respectively, while an electrode 14 is fitted at a place separate from the first conductors 12 on the first surface 11a. The electrode 14 and the second conductor 13, formed on the second surface 11b, are connected via a conductor 16 in a via hole 15. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、マイクロストリップ線路を有するフレキシブル基板、およびこれを用いた光モジュールに関する。   The present invention relates to a flexible substrate having a microstrip line and an optical module using the same.

一般に、高周波信号を伝送する場合には、同軸ケーブルが広く使用されているが、このような同軸ケーブルは、嵩張って小型化が難しい。そこで、従来技術では、同軸ケーブルに代わるものとしてマイクロストリップ線路を形成したフレキシブル基板が提案されている（例えば、特許文献１参照）。   Generally, when transmitting a high frequency signal, a coaxial cable is widely used. However, such a coaxial cable is bulky and difficult to downsize. Therefore, in the prior art, a flexible substrate in which a microstrip line is formed has been proposed as an alternative to a coaxial cable (see, for example, Patent Document 1).

すなわち、上記の特許文献１記載のフレキシブル基板は、ポリイミドやポリエステル等の可撓性の樹脂フィルムの互いに対向する一方側の表面に信号伝送路なる信号導体を、他方側の表面に接地用となるグランド導体をそれぞれ形成して構成されている。このようなフレキシブル基板を用いれば、小型化が図れるとともに、伝送特性を劣化させずに高周波信号伝送が可能になる。   That is, the flexible substrate described in Patent Document 1 has a signal conductor serving as a signal transmission path on one surface of a flexible resin film such as polyimide or polyester, and a grounding surface on the other surface. Each is formed by forming a ground conductor. By using such a flexible substrate, it is possible to reduce the size and to transmit a high frequency signal without degrading the transmission characteristics.

特開平９−１３９６１０号公報JP-A-9-139610

ところで、特許文献１に記載されているようなフレキシブル基板をリジッドな配線基板に電気的に接続する場合、従来より導電性エポキシ樹脂などの導電性接着剤や半田を用いて接合するようにしている。   By the way, when electrically connecting a flexible substrate as described in Patent Document 1 to a rigid wiring substrate, it is conventionally joined using a conductive adhesive such as a conductive epoxy resin or solder. .

しかしながら、フレキシブル基板とリジッドな配線基板との接続に導電性接着剤を用いると、半田付けする場合に比べて接続抵抗が大きくなり、信号伝送特性が劣化し、また、接着剤による固定なので長期の接合信頼性が低いという問題がある。   However, if a conductive adhesive is used to connect the flexible board to the rigid wiring board, the connection resistance will be larger than when soldering, the signal transmission characteristics will deteriorate, and it will be fixed for a long time due to the adhesive. There is a problem that bonding reliability is low.

また、フレキシブル基板とリジッドな配線基板とを半田付けする場合、フレキシブル基板と配線基板との間に半田を介在させた状態で、フレキシブル基板上からヒートツールにて加熱する方法が一般に採用される。このような方法で半田付けする場合、フレキシブル基板の樹脂フィルムは、熱伝導率の極めて低いポリイミド等の有機材料からなるため、従来構造のものでは、信号導体側の表面を加熱しても、グランド導体側の表面にまで十分な熱が伝導されず、フレキシブル基板と配線基板との間に介在された半田が溶融しにくいという問題が生じる。   Further, when soldering a flexible substrate and a rigid wiring substrate, a method of heating with a heat tool from the flexible substrate in a state where solder is interposed between the flexible substrate and the wiring substrate is generally employed. When soldering by such a method, the resin film of the flexible substrate is made of an organic material such as polyimide having extremely low thermal conductivity. Therefore, in the conventional structure, even if the surface on the signal conductor side is heated, There is a problem that sufficient heat is not conducted to the surface on the conductor side, and the solder interposed between the flexible substrate and the wiring substrate is difficult to melt.

本発明は、上記の課題を解決するためになされたもので、リジッドな配線基板に容易かつ確実に半田付けすることができるマイクロストリップ線路を有するフレキシブル基板を提供することを目的とする。   The present invention has been made to solve the above-described problems, and an object thereof is to provide a flexible substrate having a microstrip line that can be easily and reliably soldered to a rigid wiring substrate.

上記の目的を達成するために、本発明のマイクロストリップ線路を有するフレキシブル基板（以下、単にフレキシブル基板と称する）は、可撓性の樹脂フィルムの互いに対向する第１と第２の面上にそれぞれ第１導体と第２導体が形成され、上記第１の面には、上記第１導体と分離した位置に電極が設けられ、この電極と上記第２の面に形成された第２導体とがバイアホール内の導体を介して接続されていることを特徴としている。   In order to achieve the above object, a flexible substrate (hereinafter simply referred to as a flexible substrate) having a microstrip line according to the present invention is respectively formed on first and second surfaces of a flexible resin film facing each other. A first conductor and a second conductor are formed, and an electrode is provided on the first surface at a position separated from the first conductor, and the electrode and the second conductor formed on the second surface include It is characterized by being connected via a conductor in the via hole.

本発明によれば、フレキシブル基板とリジッドな配線基板とを、フレキシブル基板上からヒートツールにて加熱して半田付けする場合、第１導体と共に形成されている電極が加熱されて、その熱が電極からバイアホール内の導体を経由して第２導体に効率良く伝導される。このため、第２導体を配線基板に容易かつ確実に半田付けすることができる。しかも、基本的には半田付けにより両者を接続するため、導電性接着剤を用いる場合よりも接続抵抗が小さく良好に特性を維持できるとともに、長期信頼性を確保することができる。   According to the present invention, when a flexible substrate and a rigid wiring substrate are soldered by heating from above the flexible substrate with a heat tool, the electrode formed with the first conductor is heated, and the heat is transferred to the electrode. Is efficiently conducted to the second conductor via the conductor in the via hole. For this reason, the second conductor can be easily and reliably soldered to the wiring board. Moreover, since the two are basically connected by soldering, the connection resistance is smaller than when a conductive adhesive is used, and the characteristics can be maintained well, and long-term reliability can be ensured.

実施の形態１．
図１は本発明の実施の形態１におけるフレキシブル基板をリジッドな配線基板に接続した状態を示す斜視図、図２は図１のＡ−Ａ線に沿う断面図である。 Embodiment 1 FIG.
FIG. 1 is a perspective view showing a state in which a flexible board in Embodiment 1 of the present invention is connected to a rigid wiring board, and FIG. 2 is a cross-sectional view taken along line AA of FIG.

この実施の形態１のフレキシブル基板１は、ポリイミドやポリエステル等の有機材料からなる可撓性で絶縁性の樹脂フィルム１１を有し、この樹脂フィルム１１の互いに対向する第１、第２の面１１ａ，１１ｂの内、第１の面１１ａに第１導体としての左右一対の信号導体１２が、第２の面に第２導体としてのグランド導体１３がそれぞれ形成されている。そして、信号導体１２とグランド導体１３は、例えば銅などの金属を用いて写真製版とめっき、またはスパッタなどのドライプロセスによりパターン形成されたもので、両者でマイクロストリップ線路が構成されている。   The flexible substrate 1 of the first embodiment has a flexible and insulating resin film 11 made of an organic material such as polyimide or polyester, and the first and second surfaces 11a of the resin film 11 facing each other. 11b, a pair of left and right signal conductors 12 as the first conductor is formed on the first surface 11a, and a ground conductor 13 as the second conductor is formed on the second surface. The signal conductor 12 and the ground conductor 13 are formed by patterning by a dry process such as photoengraving and plating or sputtering using a metal such as copper, and both form a microstrip line.

さらに、この実施の形態１の特徴として、フレキシブル基板１の端部の第１の面１１ａには、一対の信号導体１２で挟まれた位置に電極１４が設けられている。この電極１４は、信号導体１２とは分離して形成されていて電気的に絶縁された状態となっている。また、樹脂フィルム１１、電極１４およびグランド導体１３を上下に貫通してバイアホール１５が形成されており、このバイアホール１５内に設けられた導体１６によって電極１４とグランド導体１３とが接続されている。なお、バイアホール１５は、フレキシブル基板１の製造過程において、例えば電極１４とグランド導体１３をエッチングして開口部を形成してからその開口部の形成箇所に位置する樹脂フィルム１１をレーザ加工により削除して形成することができる。   Further, as a feature of the first embodiment, an electrode 14 is provided on the first surface 11 a at the end of the flexible substrate 1 at a position sandwiched between a pair of signal conductors 12. The electrode 14 is formed separately from the signal conductor 12 and is electrically insulated. A via hole 15 is formed through the resin film 11, the electrode 14, and the ground conductor 13 in the vertical direction, and the electrode 14 and the ground conductor 13 are connected by a conductor 16 provided in the via hole 15. Yes. In the manufacturing process of the flexible substrate 1, the via hole 15 is formed by, for example, etching the electrode 14 and the ground conductor 13 to form an opening, and then removing the resin film 11 located at the position where the opening is formed by laser processing. Can be formed.

そして、このフレキシブル基板１の端部のグランド導体１３は、例えば光モジュールなどを構成するためのリジッドな配線基板２の端子電極２２に半田３により接合されている。   The ground conductor 13 at the end of the flexible substrate 1 is joined by solder 3 to a terminal electrode 22 of a rigid wiring substrate 2 for constituting an optical module, for example.

ここで、フレキシブル基板１を配線基板２に半田３で接合する際には、半田３をグランド導体１３と配線基板２の端子電極２２との間に配置した状態で、信号導体１２と電極１４に加熱ツール（図示せず）を接触させて加熱、加圧する。その際、電極１４とグランド導体１３とはバイアホール１５内の導体１６でつながっているので、熱は電極１４からバイアホール１５内の導体１６およびグランド導体１３を経由して半田３に効率良く伝導される。この場合、半田３の融点（例えばＳｎＡｇＣｕの場合は２１８℃）以上で、かつフレキシブル基板１の基材である樹脂フィルム１１の耐熱温度以下の状態で温度を伝えることができるため、半田３をバイアホール１５直下のみでなく、その周りも均一に溶融することができ、グランド導体１３を配線基板２の端子電極２１に容易かつ確実に半田付けすることが可能となる。   Here, when the flexible substrate 1 is joined to the wiring substrate 2 with the solder 3, the signal conductor 12 and the electrode 14 are connected with the solder 3 disposed between the ground conductor 13 and the terminal electrode 22 of the wiring substrate 2. A heating tool (not shown) is contacted to heat and pressurize. At this time, since the electrode 14 and the ground conductor 13 are connected by the conductor 16 in the via hole 15, heat is efficiently conducted from the electrode 14 to the solder 3 via the conductor 16 in the via hole 15 and the ground conductor 13. Is done. In this case, since the temperature can be transmitted in a state that is higher than the melting point of the solder 3 (for example, 218 ° C. in the case of SnAgCu) and lower than the heat resistance temperature of the resin film 11 that is the base material of the flexible substrate 1, Not only directly below the hole 15 but also the periphery thereof can be melted uniformly, and the ground conductor 13 can be easily and reliably soldered to the terminal electrode 21 of the wiring board 2.

また、この実施の形態１では、グランド導体１３を貫通してバイアホール１５が形成されているので、熔融した半田３がバイアホール１５内を充填する。このため、半田３はバイアホール１５内で突起を形成することになり、半田３とフレキシブル基板１との接触面積が増える。その結果、半田付けによる機械的強度を向上させることができ、長期信頼性を確保することができる。   In the first embodiment, since the via hole 15 is formed through the ground conductor 13, the melted solder 3 fills the via hole 15. For this reason, the solder 3 forms protrusions in the via hole 15, and the contact area between the solder 3 and the flexible substrate 1 increases. As a result, the mechanical strength by soldering can be improved, and long-term reliability can be ensured.

実施の形態２．
図３は本発明の実施の形態２におけるフレキシブル基板をリジッドな配線基板に接続した状態を示す斜視図、図４は図３のＢ−Ｂ線に沿う断面図である。なお、図１および図２に示した実施の形態１と対応する構成部分には同一の符号を付す。 Embodiment 2. FIG.
3 is a perspective view showing a state in which the flexible substrate in Embodiment 2 of the present invention is connected to a rigid wiring substrate, and FIG. 4 is a cross-sectional view taken along line BB in FIG. Components corresponding to those in the first embodiment shown in FIGS. 1 and 2 are denoted by the same reference numerals.

この実施の形態２のフレキシブル基板１の特徴は、バイアホール１５がグランド導体１３と樹脂フィルム１１を共に貫通しているが電極１４までは貫通しておらず、第１の面１１ａにおいて電極１４がバイアホール１５を覆って形成されていることである。なお、バイアホール１５は、フレキシブル基板１の製造過程において、例えばグランド導体１３の一部をエッチングして開口部を形成してからその開口部の形成箇所に位置する樹脂フィルム１１をレーザ加工により削除して形成することができる。   The characteristic of the flexible substrate 1 of the second embodiment is that the via hole 15 penetrates both the ground conductor 13 and the resin film 11 but does not penetrate to the electrode 14, and the electrode 14 is formed on the first surface 11 a. It is formed so as to cover the via hole 15. In the manufacturing process of the flexible substrate 1, the via hole 15 is formed, for example, by etching a part of the ground conductor 13 to form an opening, and then removing the resin film 11 located at the position where the opening is formed by laser processing. Can be formed.

したがって、この実施の形態２では、電極１４はバイアホール１５による開口部を有しないため、半田付けの際、溶融した半田３がバイアホール１５を経由して第１の面１１ａまで這い上がってくるのを防止することができる。これにより、一対の信号導体１２がバイアホール１５を経由してはい上がってきた半田によって短絡するおそれがなくなり、信頼性をさらに向上させることができる。
その他の構成および作用効果は、実施の形態１の場合と同様であるから、ここでは詳しい説明は省略する。 Therefore, in the second embodiment, since the electrode 14 does not have an opening by the via hole 15, the molten solder 3 crawls up to the first surface 11a via the via hole 15 during soldering. Can be prevented. As a result, there is no possibility that the pair of signal conductors 12 will be short-circuited by the solder that has risen through the via hole 15, and the reliability can be further improved.
Other configurations and operational effects are the same as those in the first embodiment, and thus detailed description thereof is omitted here.

実施の形態３．
図５は本発明の実施の形態３におけるフレキシブル基板をリジッドな配線基板に接続した状態を示す斜視図、図６は同フレキシブル基板の半田付け端部の第２の面を示す平面図である。なお、図３および図４に示した実施の形態２と対応する構成部分には同一の符号を付す。 Embodiment 3 FIG.
FIG. 5 is a perspective view showing a state in which the flexible substrate according to Embodiment 3 of the present invention is connected to a rigid wiring substrate, and FIG. 6 is a plan view showing a second surface of the soldering end portion of the flexible substrate. Components corresponding to those in the second embodiment shown in FIGS. 3 and 4 are denoted by the same reference numerals.

この実施の形態３のフレキシブル基板１の特徴は、バイアホール１５の断面形状が楕円形に形成されていることである。また、実施の形態２の場合と同様、第１の面１１ａにおいて電極１４がバイアホール１５を覆って形成されている。このように、バイアホール１５の断面形状が楕円形に形成されることにより、実施の形態２の場合よりも配線基板２に対する接合強度を向上させることができる。
その他の構成および作用効果は、実施の形態２の場合と同様であるから、ここでは詳しい説明は省略する。 A feature of the flexible substrate 1 of the third embodiment is that the cross-sectional shape of the via hole 15 is formed in an elliptical shape. Further, as in the case of the second embodiment, the electrode 14 is formed so as to cover the via hole 15 on the first surface 11a. Thus, by forming the via hole 15 to have an elliptical cross-sectional shape, the bonding strength to the wiring board 2 can be improved as compared with the second embodiment.
Other configurations and operational effects are the same as those in the second embodiment, and thus detailed description thereof is omitted here.

実施の形態４．
図７は本発明の実施の形態４におけるフレキシブル基板を用いた光モジュールの平面図、図８は図７のＣ−Ｃ線に沿う断面図である。なお、図３および図４に示した実施の形態２と対応する構成部分には同一の符号を付す。 Embodiment 4 FIG.
FIG. 7 is a plan view of an optical module using a flexible substrate according to Embodiment 4 of the present invention, and FIG. 8 is a cross-sectional view taken along the line CC of FIG. Components corresponding to those in the second embodiment shown in FIGS. 3 and 4 are denoted by the same reference numerals.

この実施の形態４の光モジュール４は、ケース５内に光電変換用の光素子６、配線基板としてのモジュール端子２、およびフレキシブル基板１が収納され、また、ケース５を内外に貫通して外部信号端子７が設けられている。そして、モジュール端子２の上に光素子６が搭載されるとともに、フレキシブル基板１のグランド導体１３がモジュール端子２の端子電極２２に半田３で接合されている。また、光素子６とフレキシブル基板１の各信号導体１２の一端がリードワイヤ８を介してそれぞれ電気的に接続され、各信号導体１２の他端側は外部信号端子７に接続されている。   In the optical module 4 according to the fourth embodiment, an optical element 6 for photoelectric conversion, a module terminal 2 as a wiring board, and a flexible substrate 1 are housed in a case 5, and the case 5 penetrates the inside and outside of the case 5 to the outside. A signal terminal 7 is provided. The optical element 6 is mounted on the module terminal 2, and the ground conductor 13 of the flexible substrate 1 is joined to the terminal electrode 22 of the module terminal 2 with the solder 3. Further, one end of each signal conductor 12 of the optical element 6 and the flexible substrate 1 is electrically connected via the lead wire 8, and the other end side of each signal conductor 12 is connected to the external signal terminal 7.

この実施の形態４のように、光素子６と外部信号端子７とを電気的に接続する線路としてこのようなフレキシブル基板１を用いれば、微細配線が形成できるために光モジュール４を小型化できるという利点が得られる。しかも、このフレキシブル基板１の基材となる樹脂フィルム１１は熱伝導率が低いので、ケース５の外部から光素子６への熱流入を抑えることができる。このため、光素子６の特性劣化を有効に防止することができる。   If such a flexible substrate 1 is used as a line for electrically connecting the optical element 6 and the external signal terminal 7 as in the fourth embodiment, the optical module 4 can be miniaturized because fine wiring can be formed. The advantage is obtained. Moreover, since the resin film 11 serving as the base material of the flexible substrate 1 has low thermal conductivity, heat inflow from the outside of the case 5 to the optical element 6 can be suppressed. For this reason, the characteristic deterioration of the optical element 6 can be effectively prevented.

なお、上記の実施の形態１〜３では、グランド導体１３が半田３でリジッドな配線基板２に接続された構成について説明したが、これに限定されるものではなく、例えば樹脂フィルム１１の第１の面１１ａにグランド導体１３を、第２の面１１ｂに信号導体１２をそれぞれ形成し、信号導体１２を半田３で配線基板２に接続する構成であっても、本発明を適用することが可能である。   In the first to third embodiments, the configuration in which the ground conductor 13 is connected to the rigid wiring board 2 with the solder 3 has been described. However, the present invention is not limited to this, and for example, the first of the resin film 11 is used. Even if the ground conductor 13 is formed on the first surface 11a and the signal conductor 12 is formed on the second surface 11b, and the signal conductor 12 is connected to the wiring board 2 with the solder 3, the present invention can be applied. It is.

本発明の実施の形態１におけるフレキシブル基板をリジッドな配線基板に接続した状態を示す斜視図である。It is a perspective view which shows the state which connected the flexible substrate in Embodiment 1 of this invention to the rigid wiring board. 図１のＡ−Ａ線に沿う断面図である。It is sectional drawing which follows the AA line of FIG. 本発明の実施の形態２におけるフレキシブル基板をリジッドな配線基板に接続した状態を示す斜視図である。It is a perspective view which shows the state which connected the flexible substrate in Embodiment 2 of this invention to the rigid wiring board. 図３のＢ−Ｂ線に沿う断面図である。It is sectional drawing which follows the BB line of FIG. 本発明の実施の形態３におけるフレキシブル基板をリジッドな配線基板に接続した状態を示す斜視図である。It is a perspective view which shows the state which connected the flexible substrate in Embodiment 3 of this invention to the rigid wiring board. 同フレキシブル基板の半田付け端部における第２の面を示す平面図である。It is a top view which shows the 2nd surface in the soldering end part of the flexible substrate. 本発明の実施の形態４におけるフレキシブル基板を用いた光モジュールの平面図である。It is a top view of the optical module using the flexible substrate in Embodiment 4 of this invention. 図７のＣ−Ｃ線に沿う断面図である。It is sectional drawing which follows the CC line of FIG.

符号の説明Explanation of symbols

１ フレキシブル基板、２ 配線基板、３ 半田、４ 光モジュール、６ 光素子、
１１ 樹脂フィルム、１１ａ 第１の面、１１ｂ 第２の面、
１２ 信号導体（第１導体）、１３ グランド導体（第２導体）、１４ 電極、
１５ バイアホール、１６ 導体。 1 Flexible board, 2 Wiring board, 3 Solder, 4 Optical module, 6 Optical element,
11 resin film, 11a first surface, 11b second surface,
12 signal conductor (first conductor), 13 ground conductor (second conductor), 14 electrodes,
15 via holes, 16 conductors.

Claims (4)

可撓性の樹脂フィルムの互いに対向する第１と第２の面上にそれぞれ第１導体と第２導体が形成され、上記第１の面には、上記第１導体と分離した位置に電極が設けられ、この電極と上記第２の面に形成された第２導体とがバイアホール内の導体を介して接続されていることを特徴とするマイクロストリップ線路を有するフレキシブル基板。 A first conductor and a second conductor are respectively formed on the first and second surfaces of the flexible resin film facing each other, and electrodes are provided on the first surface at positions separated from the first conductor. A flexible substrate having a microstrip line, wherein the electrode is connected to a second conductor formed on the second surface via a conductor in a via hole. 上記電極は、上記第１の面においてバイアホールを覆って形成されていることを特徴とするマイクロストリップ線路を有するフレキシブル基板。 The flexible substrate having a microstrip line, wherein the electrode is formed so as to cover a via hole on the first surface. 上記バイアホールは断面形状が楕円形に形成されていることを特徴とする請求項１または請求項２に記載のマイクロストリップ線路を有するフレキシブル基板。 The flexible substrate having a microstrip line according to claim 1 or 2, wherein the via hole has an elliptical cross-sectional shape. 上記請求項１〜３のいずれか１項に記載のマイクロストリップ線路を有するフレキシブル基板を備えてなる光モジュール。 An optical module comprising a flexible substrate having the microstrip line according to any one of claims 1 to 3.
JP2007018859A 2007-01-30 2007-01-30 Flexible board with microstrip line, and optical module using the same Pending JP2008187428A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
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WO2012029912A1 (en) * 2010-09-03 2012-03-08 日亜化学工業株式会社 Light emitting device, and package array for light emitting device
JP7457497B2 (en) 2019-12-20 2024-03-28 ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 optical module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012029912A1 (en) * 2010-09-03 2012-03-08 日亜化学工業株式会社 Light emitting device, and package array for light emitting device
CN103190009A (en) * 2010-09-03 2013-07-03 日亚化学工业株式会社 Light emitting device, and package array for light emitting device
JP5803926B2 (en) * 2010-09-03 2015-11-04 日亜化学工業株式会社 Light emitting device and light emitting device package array
US9461207B2 (en) 2010-09-03 2016-10-04 Nichia Corporation Light emitting device, and package array for light emitting device
JP7457497B2 (en) 2019-12-20 2024-03-28 ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 optical module

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