JP2008186986A - Component built-in substrate, electronic equipment using the same, and manufacturing methods of component built-in substrate and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize low electronic equipment by solving the problem wherein the height of the electronic equipment is determined by high electronic components. <P>SOLUTION: In a process for burying electronic components 6 with a resin content flowing out of a resin layer 21 containing a resin base material, a resin inflow prevention body 15 is provided on a component mount land 17 to which the electronic component 3 is placed and the component placement region of the electronic component 3 while surrounding a gap 23 for preventing the resin content from flowing into the gap 23 and for forming the gap 23. Then, for placing the electronic component 3 at the component mount land 17, a component mount hole 24 connected to the gap 23 is provided at least at the upper portion of the component placement region of the electronic component 3, thus realizing a component built-in substrate 11 capable of placing the electronic component 3 at the component placement land at the bottom of the gap 23 and realizing the low electronic equipment 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component-embedded substrate incorporating an electronic component, an electronic device using the same, and a manufacturing method used for the same.

  Hereinafter, an electronic apparatus using the conventional component-embedded substrate 1 will be described with reference to the drawings. FIG. 14 is a cross-sectional view of an electronic apparatus using the conventional component-embedded substrate 1. In FIG. 14, the conventional electronic device 2 has an electronic component 3 and an electronic component 4 mounted on the upper surface of the component-embedded substrate 1.

  Here, in the component-embedded substrate 1, an electronic component 6 is mounted on the upper surface of the wiring substrate 5, and a component-embedded layer 7 is formed so as to cover the electronic component 6. The height of the electronic component 3 is higher than the height of the electronic component 4 and larger than the thickness of the component built-in layer 7.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
JP 2005-158770 A

  However, in the electronic device 2 using the conventional component built-in substrate 1, the electronic component 3 is larger than the thickness of the component built-in layer 7 and protrudes from the component built-in layer 7 when incorporated in the component built-in substrate 1. It cannot be built in the component built-in substrate 1. Therefore, when the electronic component 3 is mounted on the component-embedded substrate 1, the height 8 of the electronic device 2 is determined by the height of the electronic component 3 having a high height. Therefore, the electronic device 2 has a problem that the height 8 cannot be reduced.

  SUMMARY OF THE INVENTION The present invention solves this problem and aims to provide a component-embedded substrate that can reduce the height of an electronic device.

  In order to achieve this object, the component-embedded substrate of the present invention has a gap provided on a component mounting land on which the second electronic component is mounted and a component mounting area on which the second electronic component is mounted. In order to prevent the resin from being buried, a resin inflow prevention portion is provided between the gap portion and the resin buried portion. Then, in order to allow the second electronic component to be mounted on the component mounting land, a component mounting hole connected to the gap is provided at least above the component mounting area.

  As described above, according to the present invention, the wiring board, the first electronic component mounted on one surface of the wiring board via the connection member, and the first electronic component on the one surface side of the wiring board. And a wiring layer provided on the resin-buried part, provided on one side of the wiring board and mounted with a second electronic component, A gap provided on a component mounting land and a component mounting area on which the second electronic component is mounted; a resin inflow blocking portion provided between the gap and the resin buried portion; and It is connected to the gap portion above the resin inflow prevention portion, and has a component mounting hole for forming an opening at least above the component mounting region.

  As a result, a component-embedded substrate in which a gap is formed can be realized, so that the second electronic component can be mounted on the component mounting land at the bottom of the gap. Even when the second electronic component having a high height is mounted on the component mounting land, the protruding height from the upper surface of the component-embedded substrate to the top surface of the second electronic component can be reduced. Accordingly, the height of the electronic device becomes difficult to be determined by the height of the electronic component having a high height, so that the height of the electronic device can be reduced.

(Embodiment 1)
Hereinafter, an electronic device 12 using the component-embedded substrate 11 in the present embodiment will be described with reference to the drawings. FIG. 1 is a cross-sectional view of an electronic device 12 using a component built-in substrate 11 in the present embodiment, and FIG. 2 is a top view of the component built-in substrate 11. 1 and 2, the same reference numerals are used for the same components as those in FIG. 14, and the description thereof is simplified here.

  In FIG. 1, the wiring board 13 is a multilayer board, and wiring patterns are formed on the upper and lower surfaces thereof. On the upper surface of the wiring board 13, a component land 14 to which the electronic component 6 is mounted, a connection land 16 to which the resin inflow blocking body 15 is mounted, and a component mounting land 17 to which the electronic component 3 is mounted are formed. . In the present embodiment, the connection land 16 is connected to the ground pattern on the wiring board 13.

  The wiring board 13 in the present embodiment is also provided with an inner layer pattern, a through hole (not shown), and the like. In the present embodiment, the electronic component 4 is mounted only on the upper surface of the wiring substrate 13, but it may be mounted on both the upper and lower surfaces of the wiring substrate 13.

  The electronic component 6 is mounted on the component land 14, the resin inflow blocking body 15 is mounted on the connection land 16, and the electronic component 3 is mounted on the component mounting land 17. The component land 14 and the electronic component 6 are connected by solder 18 (used as a part of the connection member). In the present embodiment, the resin inflow blocking body 15 is a metal body, and the connection land 16 and the resin inflow blocking body 15 are also connected by solder 18. On the other hand, the component mounting land 17 and the electronic component 3 are connected by solder 19. Here, the melting point of the solder 18 may be higher than that of the solder 19. In this embodiment, the solder 18 is a lead-free solder having a melting point of about 220 ° C., and the solder 19 is a lead-free solder having a melting point of about 200 ° C. As described above, since the resin inflow blocking body 15 in the present embodiment is a metal body, it is not necessary to provide a connection portion for connecting to the connection land 16 separately.

  On the upper surface side of the wiring board 13, the electronic component 6 and the resin inflow blocking body 15 have a resin embedded portion 20 embedded in a thermosetting resin. A base material-containing resin layer 21 is formed on the upper surface of the wiring board 13 in the present embodiment so as to surround the resin buried portion 20. In addition, the base material in the resin layer 21 with a base material in this Embodiment is a glass woven fabric, and resin is an epoxy resin. And the wiring layer 22 is provided on these resin embedding parts 20 and the resin layer 21 with a base material. Patterns are formed on the upper and lower surfaces of the wiring layer 22 and are connected by through holes (not shown). A land on which the electronic component 4 is mounted is formed on the upper surface of the wiring layer 22.

  The resin inflow blocking body 15 is composed of a top surface and a side surface standing around the top surface, and an end portion of the side surface is opened. The opening 23 is mounted so as to face the wiring board 13, thereby forming a gap 23 on the wiring board 13. The vicinity of the end portion of the side surface and the front end portion (used as an example of the connection portion) of the side surface are connected to the connection land 16 by the solder 18. Thereby, it becomes the structure by which the resin inflow prevention body 15 is provided between the space | gap part 23 and the resin embedding part 20. FIG. The resin inflow blocking body 15 is a metal body and is formed by squeezing. Here, it is important that the size of the gap portion 23 surrounds the component mounting land 17 and a region where the electronic component 3 may be mounted (hereinafter referred to as a component mounting region).

  In addition, although the metal body was used for the resin inflow prevention body 15 in this Embodiment, you may use a thermosetting resin for this. However, in this case, a conductor film by plating or the like is provided in the vicinity of the opening side end of the resin inflow blocking body 15 or on the side end, and this conductor film is used as the connection portion. Alternatively, metal plating may be applied to the entire inner periphery or outer peripheral surface of the resin inflow blocking body 15.

  And since the resin inflow prevention body 15 in this Embodiment is a metal body, the circumference | surroundings of the electronic component 3 will be enclosed by a metal body. This makes it difficult for interference to occur between the electronic component 3 and the circuit on the wiring board 13 or the electronic component 6 mounted on the wiring board 13. Further, since the connection land 16 is connected to the ground pattern on the wiring board 13, the electronic component 3 can be more firmly shielded. In the present embodiment, a metal body is used as the resin inflow blocking body 15, but it is also possible to use a metal plate on the surface of a thermosetting resin.

  The component mounting hole 24 is provided so as to penetrate the wiring layer 22, the top surface of the resin inflow prevention body 15, and the resin embedding portion 20 between the top surface of the resin inflow prevention body 15 and the wiring layer 22. The top surface of the resin inflow blocking body 15 is connected to the gap 23. As a result, an opening is formed above the component mounting area. Here, since the electronic component 3 is mounted on the wiring board 13 through the component mounting hole 24, it is important that the size of the component mounting hole 24 is larger than the electronic component 3 so that the electronic component 3 can be mounted. It is. In other words, the component mounting hole 24 is larger than the component mounting region of the electronic component 3 and allows the entire component mounting region to be seen when viewed from above the component-embedded substrate 11. For this purpose, a gap larger than the mounting displacement dimension generated when the electronic component 3 is mounted is provided between the component mounting hole 24 and the electronic component 3. As a result, even when the electronic component 3 is mounted out of position, it can be mounted.

  Here, the electronic component 3 is higher than the height of the electronic component 4. When the electronic component 3 is mounted on the wiring board 13, the top surface of the electronic component 3 protrudes from the upper surface of the wiring layer 22. That is, the electronic component 3 is a component that cannot be embedded in the component-embedded substrate 11 like the electronic component 6. In particular, this is useful for parts that are taller than general chip parts and that may affect electrical characteristics due to differences in the dielectric constant from the atmosphere when embedded in resin. . That is, since the gap 23 is provided, it becomes easy to obtain substantially the same characteristics as when mounted on the wiring layer 22.

  With the above configuration, the component-embedded substrate 11 in which the gap 23 is formed can be realized, so that the electronic component 3 can be mounted on the component mounting land 17 at the bottom of the gap 23. Thereby, the protrusion height from the upper surface of the component-embedded substrate 11 to the top surface of the second electronic component can be lowered. Accordingly, the height of the electronic device 12 is difficult to be determined by the height of the electronic component 3 having a high height, so that the height of the electronic device 12 can be reduced.

  Next, a method for manufacturing electronic device 12 in the present embodiment will be described with reference to the drawings. First, the manufacturing method of the component built-in substrate 11 will be described. FIG. 3 is a manufacturing flowchart of the component-embedded substrate 11 in the present embodiment. In FIG. 3 and FIGS. 4 to 10 used in the following description, the same reference numerals are used for the same components as those in FIGS. 1 and 2, and the description is simplified. Hereinafter, a method of manufacturing the component-embedded substrate 11 in the present embodiment will be described in the order of the steps shown in the manufacturing flowchart of FIG.

  FIG. 4 is a cross-sectional view of the wiring board 13 in the solder application step 31. 3 and 4, a wiring pattern (not shown), a component land 14, a connection land 16, and a component mounting land 17 are formed on the upper surface of the wiring substrate 13. In the present embodiment, the copper foil is formed on the entire lower surface side of the wiring substrate 13, but a wiring pattern may be formed on the lower surface side in advance. The connection land 16 has a “B” shape and is formed so as to surround the periphery of the component mounting land 17.

  The mounting process 32 is a process of mounting the electronic component 6 on the upper surface of the wiring board 13, and includes a solder application process 31, a mounting process 33, and a reflow process 34. In the mounting process 32, first, cream-like solder 18 and solder 19 are applied to the upper surface of the wiring board 13 using a metal mask or the like. The electronic component 3 is taller than the electronic component 6 and requires a large amount of solder. Therefore, in the solder application step 31 in the present embodiment, first, the cream-like solder 18 is applied on the connection lands 16 and the component lands 14 using a thin metal mask. Next, solder 19 is applied onto the component mounting land 17 using a thick metal mask. The thick metal mask has a recess formed at a position corresponding to the application location of the solder 18, and this metal mask is formed on the wiring substrate 13 so that the recess faces the solder 18 when the solder 19 is applied. Placed. In the present embodiment, the solder 19 is supplied on the component mounting land 17, but the solder 18 may be used. In this case, solder can be applied on the wiring board 13 at a time, so that it can be produced efficiently. Further, the solder 19 may be applied by transfer using a pin or the like, or application using a dispenser or the like.

  FIG. 5 is a cross-sectional view of the wiring board 13 after the mounting process 32 is completed. 3 and 5, in the mounting step 33, the electronic component 6 and the resin inflow blocking body 15 are mounted on the upper surface of the wiring board 13 after the solder application step 31. At this time, the electronic component 6 is mounted on the component land 14, and the resin inflow blocking body 15 is mounted on the connection land 16. The resin inflow blocking body 15 has a top surface and a side surface erected from the periphery of the top surface, and has an opening on a single side of the top surface. The resin inflow blocking body 15 is mounted such that the tip of the side surface on the opening side faces the connection land 16. In this embodiment, since both the electronic component 6 and the resin inflow blocking body 15 can be simultaneously mounted in this mounting step 32, the productivity is very good.

  In the reflow process 34, after the mounting process 33, the creamy solder 18 and the solder 19 are melted, and the electronic component 6 and the resin inflow blocking body 15 are soldered and connected to the wiring board 13. At this time, the temperature of the reflow process 34 is set higher than the melting point of the solder 18. Accordingly, since the melting point of the solder 19 is lower than the melting point of the solder 18, the solder 19 is also melted, and a protective layer is formed by the solder 19 on the component mounting land 17.

  Next, FIG. 6 is a cross-sectional view of the component built-in substrate 11 in the lamination step 35 in the present embodiment, and FIG. 7 is a top view of the component built-in substrate 11 before the wiring layer 22 is laminated in the lamination step 35. 3, 6, and 7, the stacking step 35 is a step of mounting an uncured thermoplastic resin 36 on the electronic component 6 mounting surface side of the wiring board 13 after the mounting step 32. A hole 38 is formed in the resin 36 at a position corresponding to the electronic component 6, the resin inflow blocking body 15, and the solder 18 in advance by a hole processing step 37. In the lamination step 35, the resin 36 is laminated so that the holes 38 correspond to the electronic components 6. In the present embodiment, the resin 36 is an uncured prepreg in which a glass substrate is impregnated with an epoxy resin.

  Since the resin 36 to be laminated here is a single layer, the number of laminations is reduced and the productivity is improved. Conversely, when a plurality of thin prepregs are laminated, the thickness of the component built-in substrate 11 can be easily adjusted by adjusting the number of laminated layers. Further, if this prepreg and the inner layer substrate that has been wired and the connection between the upper and lower surfaces is alternately laminated, an inner layer conductor layer can also be formed between the wiring substrate 13 and the wiring layer 22.

  Here, a gap 39 is formed between the hole 38 and the electronic component 6 and between the hole 38 and the resin inflow blocking body 15. This is provided for facilitating the lamination of the resin 36 on the wiring board 13, and for this purpose, the gap 39 between the hole 38 and the electronic component 6, and the hole 38 and the resin inflow blocking body 15 are not provided. The size of the gap 39 is preferably equal to or greater than the sum of the mounting displacement size of the electronic component 6 and the resin inflow blocking body 15 and the displacement size when the resin 36 is mounted on the wiring board 13.

  The wiring layer 22 is laminated on the resin 36 thus laminated, and the hole 38 is blocked by the wiring layer 22. At this time, the gap 39 is also formed between the electronic component 6 or the resin inflow blocking body 15 and the wiring layer 22. This is because the thickness of the resin 36 decreases due to compression in the component embedding process described later.

  FIG. 8 is a cross-sectional view of the component built-in substrate 11 in the component embedding process 40 of the present embodiment. 3 and 8, the component embedding process 40 melts an uncured resin 36 (shown in FIG. 6) after the laminating process 35, and flows the melted resin 36 to cause a gap 39 (shown in FIG. 6). Is filled with the resin 36. Therefore, in the component embedding process 40, the resin 36 and the wiring layer 22 are laminated on the wiring board 13 and heated and compressed in the vertical direction. As a result, only the resin component flows out from the resin 36, and the gap 39 is filled with the resin component that flows out. In this state, the resin 36 is cured by raising the temperature to a temperature equal to or higher than the curing temperature of the resin 36. Thereafter, cooling is performed to complete the component embedding process 40.

  By doing so, the electronic component 6 is built in the component built-in substrate 11, and the resin embedded portion 20 is formed around the electronic component 6 and the resin inflow blocking body 15. At this time, since the base material in the resin 36 does not flow out into the gap 39, the base material-containing resin layer 21 is formed around the resin embedding portion 20. By this process, the gap formed between the electronic component 6 and the wiring board 13 or between the semiconductor element flip-chip mounted face down by solder bumps and the wiring board 13 also flows out of the resin 36. Filled with. Therefore, it is not necessary to fill a resin (so-called underfill) between the semiconductor element mounted on the flip chip and the wiring substrate 5, and the productivity is also good.

  In the present embodiment, the resin inflow blocking body 15 is formed by drawing so that the resin component flowing out from the resin 36 does not enter the resin inflow blocking body 15 by pressurization in the component embedding process 40. There is no break between the top surface and the side surface or between the adjacent side surfaces. Furthermore, the connection land 16 and the solder 18 (used as an example of a sealing material) are connected around the entire periphery of the side end on the opening side of the resin inflow blocking body 15. By doing so, the resin inflow prevention body 15 can prevent the molten resin component from flowing into the gap 23 from between the wiring board 13 and the resin inflow prevention body 15. As a result, the resin inflow prevention body 15 is embedded in the resin embedding part 20, and the resin inflow prevention body 15 is provided so as to partition the gap 23 and the resin embedding part 20. The resin inflow blocking body 15 is mounted on the wiring board 13 to form a resin inflow blocking portion, and the gap portion 23 can be formed in the resin inflow blocking portion. Further, since the solder 18 is also used as a sealing material, a separate sealing material is not required. Further, it is not necessary to perform a separate sealing process, and productivity is good.

  In the wiring processing step 41, after the component embedding step 40, wiring processing of the upper and lower surfaces of the component-embedded substrate 11 and processing of through holes for connecting the upper and lower surfaces are performed.

  FIG. 9 is a cross-sectional view of the component built-in substrate 11 in the component mounting hole forming step 42 of the present embodiment, and FIG. 10 is a top view of the same. 3, 9, and 10, the component mounting hole forming step 42 is a step of forming the component mounting hole 24 above the component mounting region after the wiring processing step 41. In the component mounting hole forming step 42, the component mounting hole 24 is formed, and the component built-in substrate 11 is completed. Here, the component mounting hole 24 is processed from above the component-embedded substrate 11 and penetrates the wiring layer 22, the top surface of the resin inflow blocking body 15, and the resin embedded portion 20 between the top surface and the wiring layer 22, It is connected with the part 23. Thereby, an opening can be formed above the component mounting area of the electronic component 3.

  Here, the component mounting hole 24 is a hole for mounting the electronic component 3 through the component mounting hole 24. Therefore, the component mounting hole 24 needs to be able to see through the component mounting region of the electronic component 3 (shown in FIG. 1) and be larger than the electronic component 3. It should be noted that it is desirable to provide an interval larger than the mounting displacement amount of the electronic component 3 between the component mounting hole 24 and the electronic component 3.

  In the present embodiment, since the solder 19 is provided in advance on the component mounting land 17, it is not necessary to supply solder on the cream in the mounting process of the electronic component 3 described later. However, when the solder 19 is not provided in advance, it is necessary to supply solder onto the component mounting land 17 in a later process, so that the component mounting hole 24 is larger than the component mounting area including the component mounting land 17. To do. In this way, the solder 19 can be easily supplied onto the component mounting land 17 in a later process. Further, the component mounting hole 24 may be larger than the top surface of the resin inflow blocking body 15. In this case, the opening can be reliably formed above the component mounting region regardless of the positional accuracy of the hole processing of the component mounting hole 24 in the component mounting hole forming step 42.

  Through the steps as described above, the component built-in substrate 11 in which the gap 23 is formed on the component mounting region can be realized. Therefore, the electronic component 3 can be mounted through the component mounting hole 24 to the component mounting land 17 provided at the bottom of the gap 23. Therefore, even if the electronic component 3 having a high height is mounted on the component mounting land 17, the protruding height from the upper surface of the component-embedded substrate 11 to the top surface of the electronic component 3 can be reduced. Accordingly, the height of the electronic device 12 cannot be determined by the height of the electronic component 3 having a high height, and the height of the electronic device 12 can be reduced accordingly.

  Next, a method for manufacturing the electronic device 12 using the component-embedded substrate 11 manufactured as described above will be described with reference to the drawings. FIG. 11 is a manufacturing flowchart of an electronic device using the component built-in substrate 11 in the present embodiment. In FIG. 11, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is simplified.

  In the flux application step 51, the flux 52 is applied on the component mounting land 17 of the component built-in substrate 11. In the solder application process 53, after the flux application process 51, the cream-like solder 19 is supplied onto the wiring layer 22 using a metal mask or the like. At this time, since there is no unevenness on the wiring layer 22, the solder 19 can be easily applied by general screen printing.

  At this time, since the solder 19 is provided on the component mounting land 17 in advance, it is not necessary to separately supply solder when the electronic component 3 is mounted in the state of the component-embedded substrate 11. As a result, the component mounting hole 24 does not need to have a size allowing the component mounting land 17 to be seen, and the opening by the component mounting hole 24 can be reduced. Therefore, a region where the wiring pattern can be formed in the wiring layer 22 and a region where the electronic component 4 can be mounted can be increased. In this embodiment, the solder 19 is supplied in the solder application step 31. However, the solder 19 can be applied to the completed component-embedded substrate 11 by a method such as pin transfer before mounting the electronic component 3.

  In the mounting step 54, the electronic component 4 is mounted on the wiring layer 22 and the electronic component 3 is mounted on the component mounting land 17 after the solder application step 53. Then, by melting the solder 19 in the reflow process 55, the electronic component 3 and the electronic component 4 are mounted on the component built-in substrate 11, and the electronic device 12 is completed. After the reflow process 55, the component built-in board 11 may be divided into child boards, or a cover may be attached to each child board.

  As described above, since the gap portion 23 is formed on the component mounting area in the component-embedded substrate 11, the electronic component 3 is mounted to the component mounting land 17 provided at the bottom of the gap portion 23 through the component mounting hole 24. Is done. Thereby, even if the electronic component 3 having a high height is mounted on the component mounting land 17, the protruding height from the upper surface of the component-embedded substrate 11 to the top surface of the electronic component 3 can be reduced. Accordingly, the height of the electronic device 12 cannot be determined by the height of the electronic component 3 having a high height, and the height of the electronic device 12 can be reduced accordingly.

  In addition, since the resin inflow prevention body 15 in this Embodiment is a metal body, it can be easily fixed to the connection land 16 using the solder 18. Further, the resin inflow blocking body 15 is connected to the ground terminal of the wiring board 13. Thereby, the side surface of the electronic component 3 is covered with metal, and the electronic component 3 can be shielded. This is useful when the electronic device 12 is a device that handles high-frequency signals, and is particularly useful when the electronic component 3 is a crystal oscillator that easily interferes with the high-frequency circuit.

  In the present embodiment, one hole 38 is provided for one electronic component 6, but this may be one hole 38 for a plurality of electronic components 6. This is useful when the interval between the electronic components 6 is narrow.

  Further, in the present embodiment, the electronic component 6 in the hole 38 is embedded by the resin component flowing out from the resin 36. This is because the resin 36 is laminated on the wiring substrate 13 in the laminating step 35 and then pasted in the hole 38. Resin may be supplied. Even in this case, the resin inflow blocker 15 can block the molten paste resin from flowing into the gap 23. Therefore, the electronic component 3 can be mounted on the component mounting land 17.

  At this time, the prepreg is prepared by filling a conductive paste in a via hole provided in advance, and alternately laminating this prepreg and the inner layer substrate that has been wired and completed the connection between the upper and lower surfaces in the laminating step 35. Thus, connection between inner layer conductors is also possible.

  In this case, the resin may be screen printed. In this case, the opening of the metal mask is made smaller than the hole 38. Then, a prepreg is inserted between the resin 36 and the wiring layer 22. This makes it difficult for the paste-like resin supplied to the hole 38 to enter between the wiring layer 22 and the resin layer 21 with the base material. Therefore, the connection reliability between the inner layer conductor of the substrate, the wiring substrate 13 and the wiring layer 22 is good.

  Furthermore, in the laminating step 35 in the present embodiment, the prepreg whose base material is impregnated with the resin is laminated with the hole 38 processed, but the resin that does not process the hole 38 may be laminated on the electronic component 6. good. At this time, the resin is placed on the electronic component 6, and the gap 39 formed between the side surface of the electronic component 6 and the electronic component 6 and the wiring substrate 13 flows out in the component embedding process 40. Thus, a resin buried portion is formed. In this case, if a gel-like resin is used as the resin, the hole 38 need not be processed.

  Alternatively, in the laminating step 35, a paste-like resin may be laminated on the wiring board 13 on which the electronic component 6 has been mounted by a dispenser, screen printing, or the like. In this case, a gap 39 is mainly formed between the electronic component 6 and the wiring board 13. In the component embedding process 40, the resin paste is formed by the paste resin flowing into the gap 39.

  Further, in the present embodiment, the vicinity of the side edge and the front end of the side are used as the connection portion, but a flange that opposes the connection land 16 is formed at the front end, and this flange portion can be used as the connection portion. good. In this case, since the area where the connection portion and the connection land 16 face each other can be increased, the gap portion 23 can be reliably sealed, and the resin can be prevented from flowing into the gap portion 23.

  FIG. 12 is a cross-sectional view of the component-embedded substrate in the second example. In FIG. 12, the same reference numerals are used for the same components as those in FIG. 1, and the description thereof is omitted here. In the component-embedded substrate 61 of the second example, the distance between the wiring substrate 13 and the wiring layer 62 is smaller than the height of the resin inflow blocking body 15 with respect to the component-embedded substrate 11. In this case, the wiring layer 62 is previously provided with a hole 63 larger than the resin inflow blocking body 15 before lamination. As a result, the component-embedded substrate 61 that is thinner than the component-embedded substrate 11 can be realized.

  FIG. 13 is a top view of the component-embedded substrate of the third example in the stacking step 35. In FIG. 13, the same reference numerals are used for the same components as those in FIG. 1, and the description thereof is omitted here. In the third example, a hole 73 is formed in the resin 72 laminated on the wiring board 13 so as to surround a region where the plurality of electronic components 6 and the resin inflow blocking body 15 are mounted. In this way, the productivity is good because only one hole 73 needs to be processed.

  The component-embedded substrate according to the present invention has an effect that the height of the electronic device can be reduced, and is useful as a component-embedded substrate used for portable devices and the like that are required to be thin.

Sectional drawing of the electronic device using the component built-in board in this Embodiment Same as above, top view of component built-in board Same as above, manufacturing flowchart of component built-in board Cross-sectional view of wiring board in solder application process Cross-sectional view of the wiring board after the mounting process is completed Cross-sectional view of component built-in board in the same lamination process Same as above, top view of component built-in board before wiring layer lamination in the lamination process Same as above, sectional view of component-embedded substrate in component embedding process Same as above, sectional view of component built-in board in component mounting hole forming process Same top view Same as above, manufacturing flowchart of electronic equipment using component-embedded substrate Sectional view of the component built-in board according to the second example Same as above, top view of component built-in substrate of third example in lamination process Sectional view of a conventional electronic device using a component-embedded substrate

Explanation of symbols

DESCRIPTION OF SYMBOLS 3 Electronic component 6 Electronic component 13 Wiring board 15 Resin inflow blocker 17 Component mounting land 18 Solder 20 Resin embedding part 22 Wiring layer 23 Cavity part 24 Component mounting hole

Claims (16)

A wiring board, a first electronic component mounted on one side of the wiring board via a connecting member, a resin embedded part in which the first electronic component is embedded on one side of the wiring board, and A wiring layer provided on the resin-buried portion, provided on one side of the wiring board and mounted with a second electronic component, and the component mounting land and the second electronic A gap provided above a component mounting area on which a component is mounted; a resin inflow blocking portion provided between the gap and the resin buried portion; and the gap above the resin inflow blocking portion. A component-embedded substrate having a component mounting hole that is connected to the component and forms an opening at least above the component mounting region. The component built-in board according to claim 1, wherein the resin inflow prevention portion is formed by mounting a resin inflow prevention body on one surface of the wiring board. The component built-in board according to claim 2, wherein a sealing member is provided between the resin inflow blocking body and the wiring board. The component built-in board according to claim 3, wherein the resin inflow blocking body is opened at a lower portion, and the sealing member is provided on the entire circumference of the end of the resin inflow blocking body on the opened side. Solder is used as the sealing member, and a connection land formed around the component mounting area is provided on one surface of the wiring board, and a connection portion is provided in the resin inflow blocking body, and the connection land and the The component built-in board according to claim 3, wherein a connection portion is connected with the solder. A component-embedded board according to claim 1, a third electronic component mounted on a wiring layer of the component-embedded substrate, and a second electronic component mounted on a component mounting land, An electronic device in which the height of the second electronic component is higher than the height of the third electronic component, and the top surface of the second electronic component protrudes from the wiring layer. The electronic device according to claim 6, wherein at least a side surface of the resin inflow prevention portion has a metal portion, and the metal portion is provided so as to surround the second electronic component. The electronic device according to claim 7, wherein a ground terminal is formed on one surface of the wiring board, and the metal portion is connected to the ground terminal. A first mounting step of mounting a first electronic component on one surface of the wiring board by a connecting member, and the first electronic component on one surface side of the wiring substrate after the first mounting step A resin is placed as if a first gap is provided around the substrate, and a laminating step of laminating a wiring layer on the resin, and after the laminating step, the uncured resin is melted to the gap. A component embedding step of filling the resin and forming a resin embedding portion that covers the first electronic component and forming a wiring layer on the resin embedding portion, at least before the component embedding step, And mounting the resin inflow blocking body on the one surface so as to surround the component mounting land and the component mounting region so as to form a gap on the component mounting region, and in the component embedding step, Resin flows into the gap It prevents the, at least the part manufacturing process of the component-embedded substrate having a component mounting hole forming step of forming a component mounting hole above the attachment area after said component embedding step. The method for manufacturing a component built-in substrate according to claim 9, wherein the step of mounting the resin inflow blocking body on the wiring substrate is a first mounting step. The resin inflow blocking body is a metal body, and has a top surface and a side surface formed by standing around the top surface, and the side surface is formed by squeezing processing. A method for manufacturing a substrate. In the laminating step, a plate-like resin having holes formed in advance at positions corresponding to the first electronic components is laminated on one surface of the wiring board, and the first gap is formed between the holes and the first electronic components. The method for manufacturing a component-embedded substrate according to claim 9, which is provided between the components. In the laminating step, a plate-like resin having a hole formed in advance at a position corresponding to the resin inflow blocking body is stacked on one surface of the wiring board, and the first gap is between the hole and the resin inflow blocking body. The method for manufacturing a component-embedded substrate according to claim 9, wherein the component-embedded substrate is provided. The connecting member uses solder, and in the first mounting step, a first solder application step of applying a cream-like first solder to a component land on which the first electronic component is mounted, and the first solder A mounting step of mounting the first electronic component on the component land after the coating step, and a reflow step of melting the solder after the mounting step, and at least before the reflow step, the component mounting The method for manufacturing a component-embedded board according to claim 9, wherein a solder that can be melted at a temperature of the reflow process is applied to the land. The electronic component manufacturing method according to claim 6, wherein the component-embedded substrate is the component-embedded substrate manufactured by the component-embedded substrate manufacturing method according to claim 9, and is formed on the wiring layer of the component-embedded substrate. The second electronic component having a height higher than the height of the third electronic component and higher than the thickness of the resin-embedded portion in the second mounting step. Manufacturing method of electronic equipment that attaches to component mounting land. The electronic component manufacturing method according to claim 6, wherein the component-embedded substrate is the component-embedded substrate manufactured by the component-embedded substrate manufacturing method according to claim 14, and the cream is formed on the wiring layer of the component-embedded substrate. A second solder application step of applying a second solder in the form of at least a flux on the component mounting land, and mounting the third electronic component on the wiring layer after the second solder application step And mounting a second electronic component higher than the third electronic component on the component mounting land, and mounting the second solder and the component after the second mounting step. A method of manufacturing an electronic device, wherein the second and third electronic components are connected to the component-embedded substrate by melting solder formed on the land.

Images