JP2008186871A - Light-emitting module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting module assuring safety of output light and also stably operating against a variation in an ambient temperature. <P>SOLUTION: Surface emitting laser 16 is molded with a resin member 20 comprising an epoxy resin and a filler added as an additive for dispersing light output from the surface emitting laser 16, whereby the light-emitting module 10 inhibits a drop in an average light output against a change in the ambient temperature and its operation is stabilized without increasing light emission delay time. In addition, if driving current larger than threshold current for illuminating the surface emitting laser 16 is applied to the laser 16, the light output from the laser 16 is attenuated to a safety level (class 1 level in the international standard) when passing through the resin member 20 and then emitted from a surface M of the resin member 20. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting module configured by sealing a laser diode with a resin member.

  In a light emitting module using a laser diode as a light emitting element, a light receiving element (photodiode) for monitoring light output from the laser diode is mounted together with the laser diode in a metal package having a diameter of about 5 mm (patent). Reference 1).

  In this light emitting module, the light output from the laser diode is received and monitored by the photodiode, and the monitoring result is fed back to the laser diode driver to change the drive current, so that even if the environmental temperature fluctuates, it is always A constant light output can be obtained from the laser diode.

  Incidentally, in recent years, there has been a demand for downsizing and cost reduction of light emitting modules, and light emitting modules using a package made of a resin mold instead of a metal package have been proposed. Further, by using no monitoring photodiode, a light-emitting module that is smaller and less expensive can be obtained.

  The fluctuation amount of the light output with respect to the temperature of the laser diode becomes large when the drive current is set in the vicinity of the threshold current (current value that can cause the laser diode to emit laser light). At this time, a phenomenon called light emission delay is also remarkable. The light emission delay is the time from when the drive current is applied to the laser diode until the light is output from the laser diode. When the light emission delay increases, the pulse width distortion increases, so that high-speed transmission becomes difficult.

In order to stably operate the light emitting module due to the fluctuation of the environmental temperature, it is necessary to set the driving current for driving the light emitting module to be larger than the threshold current. However, when the drive current applied to the laser diode is increased, the output light of the light emitting module exceeds a level that does not affect the human body (value defined in international standard class 1).
JP-A-2005-86067

  It is an object of the present invention to obtain a light emitting module that ensures the safety of output light and operates stably with respect to environmental temperature fluctuations.

  According to the first aspect of the present invention, there is provided a resin member that seals the laser diode and transmits light output from the laser diode; and a light attenuating unit that attenuates the amount of light transmitted through the resin member. It is characterized by having.

  According to the first aspect of the present invention, a drive current is applied to the laser diode, and the light output from the laser diode is transmitted through the resin member that seals the laser diode, and is attenuated and emitted by the light attenuating means. The

  That is, the light output from the laser diode is attenuated to a safe level (for example, the international standard, class 1 level of IEC 60825-1 Am2) by the optical attenuation means. By adjusting the attenuation factor of the light attenuating means, the light output from the emission surface of the resin member is adjusted, so that the safety of the light emitted from the light emitting module can be ensured.

  The invention described in claim 2 is characterized in that the laser diode is a surface emitting laser.

  In the invention described in claim 2, by using a surface emitting laser as the laser diode, the laser diode can be easily molded into a resin.

  The invention according to claim 3 is characterized in that the light attenuating means is an additive that is added to the resin member and absorbs or scatters the light output from the laser diode.

  In the invention according to claim 3, any additive that absorbs or scatters light is added to the resin member. Thereby, the light output from the laser diode is absorbed or scattered in the resin member, so that attenuated light is emitted from the emission surface of the resin member.

  The invention according to claim 4 is characterized in that an output surface of the laser diode is covered with a transparent resin.

  In the invention according to claim 4, the output surface of the laser diode is covered with a transparent resin, and the light output from the laser diode is absorbed or scattered by the additive that is transmitted through the transparent resin and added to the resin member. Is done.

  When an additive that absorbs light is added to the resin member, the resin member absorbs light and rises in temperature. However, since the output surface of the laser diode is covered with a transparent resin and is not in direct contact with the resin member, the heat of the resin member is difficult to conduct to the laser diode. As a result, the laser diode is not affected by heat, leading to a longer life of the laser diode. Moreover, there is no possibility of causing malfunction of the laser diode.

  The invention according to claim 5 is characterized in that the light attenuating means is a diffraction grating provided on an emission surface of the resin member.

  According to the fifth aspect of the present invention, a diffraction grating is provided on the emission surface of the resin member, and the light output from the laser diode passes through the resin member and is emitted from the emission surface. The part is reflected by the diffraction grating, attenuated and emitted.

  The invention described in claim 6 is characterized in that a condensing part for condensing the light output from the laser diode is provided on the emission surface of the resin member.

  In the invention according to claim 6, the light output from the laser diode is collected by the light collecting unit and emitted by providing the light collecting unit on the emission surface of the resin member.

  The invention according to claim 7 is characterized in that a positioning portion of a light guide path through which light output from the laser diode is guided is provided on the emission surface of the resin member.

  According to the seventh aspect of the present invention, the light guide path can be easily connected to the light emitting module by providing the light guide path positioning portion for guiding the light output from the laser diode on the emission surface of the resin member.

  The invention according to claim 8 is characterized in that the additive has conductivity, and the resin member is electrically connected to a cathode electrode of the laser diode.

  In the invention according to claim 8, the additive absorbs or scatters light and has conductivity, and the resin member to which the additive is added is electrically connected to the cathode electrode of the laser diode. Yes. Thereby, the resin member to which the additive is added functions as an electromagnetic shield that blocks electromagnetic waves.

  Since the present invention has the above configuration, the safety of the output light can be ensured, and the light emitting module can be stably operated against the fluctuation of the environmental temperature.

  Next, the light emitting module 10 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. 1 is a perspective view of the light emitting module 10, FIG. 2A is a front view of the light emitting module 10, and FIG. 2B is a side view.

  As shown in FIGS. 1 and 2, the light emitting module 10 has two lead frames 12 and 14, and a surface emitting laser (VCSEL) 16 is mounted on one lead frame 12. . The surface emitting laser 16 outputs light perpendicular to the surface of the lead frame 12.

  The other lead frame 14 is electrically connected to the surface emitting laser 16 by wire bonding 18.

  A part of the surface emitting laser 16 and the lead frames 12 and 14 is an epoxy resin (refractive index of 1.57) that can transmit light and a titanium oxide filler (refractive index of 2.76, average particle diameter of 20 μm) of 70. It is molded with the resin member 20 to which% is added.

  Thereby, a part of the light transmitted through the resin member 20 is emitted from the surface M of the resin member 20 while being scattered (diffused) by the difference in refractive index between the epoxy resin and the filler, and the rest is a side surface of the resin member 20. And emitted from the back surface. That is, the light output from the surface emitting laser 16 is attenuated and emitted from the surface M of the resin member 20.

  In the present embodiment, the distance from the light emitting point (position N in the drawing) of the surface emitting laser 16 to the surface M of the resin member 20 is set to 300 μm. At this time, the amount of light emitted from the surface M of the resin member 20 is 35% of the amount of light output from the surface emitting laser 16 before molding (before the surface emitting laser 16 is molded with the resin member 20). The light attenuation factor is 65%.

  Here, the relationship between the light output and the light emission delay time with respect to the environmental temperature when a drive current is applied to the light emitting module 10 having the above configuration will be described based on experimental results.

  A surface emitting laser 16 having a threshold current of 1.5 mA, a differential efficiency of 0.4 W / A, and an emission wavelength of 850 nm was used at an environmental temperature of 20 ° C. The threshold current of the surface emitting laser 16 varied depending on the environmental temperature. At the environmental temperature of 70 ° C., the threshold current was 2.2 mA. Further, the drive condition of the light emitting module 10 (Ilow = 2.73 mA, Ihigh = 10 Gbps, the average light output is 620 μW corresponding to the laser safety class 1 standard, the extinction ratio is 8 dB, the modulation speed is 1 Gbps, the duty ratio is 50%. 9.18 mA) was set, and the light emitting module 10 was driven. And when the light emission delay time of the light emitting module 10 in environmental temperature 20 degreeC was measured, it was 30 ps. Here, Ilow refers to the current value on the low side of the pulsed drive current, and Ihigh refers to the current value on the high side.

  Under this driving condition, when the environmental temperature was set to 70 ° C., the average light output of the light emitting module 10 was reduced to 530 μW, and the light emission delay time was 50 ps.

  On the other hand, a surface emitting laser having the same characteristics as the present embodiment is molded with a resin member (only an epoxy resin) to which a filler is not added to form a light emitting module. The modulation speed is 1 Gbps, the duty ratio is 50%, and the average The light emitting module driving conditions (Ilow = 1.94 mA, Ihigh = 4.24 mA) were set so that the light output was 620 μW and the extinction ratio was 8 dB, and the light emitting module was driven.

  Under this driving condition, the light emission delay time of the light emitting module at an environmental temperature of 20 ° C. was 50 ps, and at the environmental temperature of 70 ° C., the average light output decreased to 400 μW and the light emission delay time increased to 110 ps.

  From this, as in the present embodiment, the surface emitting laser 16 is molded with the resin member 20 in which the filler as an additive that scatters the light output from the surface emitting laser 16 is added to the epoxy resin, By attenuating the light output of the surface emitting laser 16, the average light output of the light emitting module 10 with respect to changes in environmental temperature while maintaining the light output from the light emitting module below the upper limit specified by laser safety. It can be seen that the operation is stabilized without suppressing the decrease in light emission and without increasing the light emission delay time.

  Therefore, since the light output from the surface M of the resin member 20 is adjusted by adjusting the blending amount of the filler of the resin member 20 that molds the surface emitting laser 16, the safety of the light emitted from the light emitting module 10 is adjusted. Can be secured.

  FIG. 3 shows the relationship between the average light output with respect to the light attenuation rate of the light emitting module 10 and the light emission delay time with respect to the light attenuation rate at an environmental temperature of 70 ° C. From this graph, it can be seen that the characteristics of the light emitting module 10 are stabilized when the light attenuation factor is 50 to 80%, more preferably 65 to 80%. That is, when the light emission delay time is 30 to 50 ps, the light output of the light emitting module 10 satisfies the value specified in the class 1 of the international standard.

  Therefore, when the predetermined driving current is supplied to the light emitting module 10, the surface emitting laser 16 is molded with the resin member 20 such that the light attenuation rate of the light emitting module 10 is 50 to 80%, more preferably 65 to 80%. By doing so, the light emitting module 10 can obtain stable characteristics with respect to changes in the environmental temperature.

  The light attenuation rate of the light emitting module 10 needs to be changed according to the characteristics of the surface emitting laser 16 and the laser safety standard to be adapted. This light attenuation factor can be controlled by the thickness of the resin member 20 (distance from the light emitting point N of the surface emitting laser 16 to the surface M of the resin member 20), the characteristic value (average particle diameter) of the filler, and the amount added.

  Moreover, the larger the refractive index difference between the filler and the resin to which the filler is added, the higher the light attenuation factor. Note that the difference in refractive index between the two materials is preferably 0.4 or more.

  Furthermore, when the average particle diameter of the filler is small, the light scattering effect is small, and thus the light attenuation rate of the light emitting module 10 is small. In order to obtain the light emitting module 10 having a high light attenuation rate, it is necessary to increase (thicken) the thickness of the resin member 20. However, when the thickness of the resin member 20 is large, it is difficult to uniformly disperse the filler added in the resin, and the light attenuation rate varies. For this reason, the particle size of the filler is desirably 5 to 30 μm.

  In this embodiment, titanium oxide is used as the filler. In addition to titanium oxide, inorganic material systems such as zircon oxide, zinc oxide, calcium carbonate, alumina, silica, crosslinked polymethyl methacrylate, crosslinked polystyrene, etc. These organic material systems are used as fillers.

  In the present embodiment, the surface emitting laser 16 is mounted. However, the surface emitting lasers 16 are arranged one-dimensionally or two-dimensionally (a plurality of surface-emitting lasers 16 are arranged in an array). The present invention can also be applied to a light emitting module.

  Next, a light emitting module 22 according to a second embodiment of the present invention will be described with reference to FIG. In addition, the description about the part similar to 1st Embodiment is omitted.

  As shown in FIG. 4, the surface emitting laser 16 and the lead frames 12, 14 are molded with a resin member 24 in which an insulating carbon black as a black pigment is added to an epoxy resin.

  Thereby, part of the light output from the surface emitting laser 16 is absorbed by the insulating carbon black added to the epoxy resin when passing through the resin member 24. That is, the light output from the surface emitting laser 16 is attenuated and emitted from the surface M of the resin member 24.

  Therefore, even if the surface emitting laser 16 is driven with a light output larger than class 1, the light output from the surface M of the resin member 24 is adjusted by adjusting the insulating carbon black added to the epoxy resin. Therefore, the safety of the light emitted from the light emitting module 22 can be ensured.

  Note that the light attenuation rate of the light emitting module 22 is controlled by the average particle diameter and the amount of insulating carbon black added to the epoxy resin.

  Next, a light emitting module 26 according to a third embodiment of the present invention will be described with reference to FIG. In addition, the description about the part similar to 1st Embodiment is omitted.

  As shown in FIG. 5, the light emitting point N of the surface emitting laser 16 is covered with a transparent resin 30 such as silicone having low thermal conductivity, and the surface emitting laser 16 and the transparent resin 30 are black on an epoxy resin. Molded with a resin member 31 to which insulating carbon black is added as a pigment.

  As a result, the light output from the surface emitting laser 16 passes through the transparent resin 30 and is partially absorbed by the insulating carbon black contained in the resin member 31. That is, the light output from the surface emitting laser 16 is attenuated and emitted from the surface M of the resin member 31.

  At this time, the resin member 31 absorbs light and rises in temperature, but since the resin member 31 is not in contact with the light emitting point N of the surface emitting laser 16 directly, the heat of the resin member 31 is heated by the surface emitting laser 16. Does not conduct. As a result, the surface-emitting laser 16 is not affected by heat, leading to a longer life of the surface-emitting laser 16. Further, there is no possibility of causing the malfunction of the surface emitting laser 16.

  In the present embodiment, the transparent resin 30 provided around the light emitting point N of the surface emitting laser 16 is molded with a resin member 31 formed of a material in which an insulating carbon black is added to an epoxy resin. However, the transparent resin 30 may be molded with a material in which a titanium oxide filler is added to an epoxy resin.

  Next, a light emitting module 32 according to a fourth embodiment of the present invention will be described with reference to FIG. In addition, the description about the part similar to 1st Embodiment is omitted.

  As shown in FIG. 6, the surface emitting laser 16 and the lead frames 12, 14 are molded with a resin member 36 in which a titanium oxide filler is added to an epoxy resin. In addition, the resin member 36 is molded with a light absorbing resin 38 in which an insulating carbon black is added to the epoxy resin as a black pigment on the surface other than the light output surface (the surface M of the resin member 36).

  Thereby, a part of the light output from the surface emitting laser 16 is emitted from the surface M of the resin member 36 while being scattered (diffused) when passing through the resin member 36. The remainder of the light output from the surface emitting laser 16 is absorbed by the light absorbing resin 38 adjacent to the side surface and the back surface of the resin member 36. That is, the light output from the surface emitting laser 16 is attenuated and emitted from the surface M of the resin member 36.

  As described above, by providing the light absorbing resin 38 in a portion other than the surface M of the resin member 36, the light output from the surface emitting laser 16 does not leak from the surface other than the surface M of the resin member 36. Therefore, there is no possibility of causing malfunctions of electronic components mounted around the light emitting module 32.

  Next, a light emitting module 40 according to a fifth embodiment of the present invention will be described with reference to FIG. In addition, the description about the part similar to 1st Embodiment is omitted.

  As shown in FIG. 7, the surface-emitting laser 16 and the lead frames 12 and 14 are molded with a transparent resin 42, and the light is output from the surface-emitting laser 16 on the surface M of the transparent resin 42. Is provided with a diffraction grating 44.

  Thereby, when the light output from the surface emitting laser 16 is emitted from the surface M of the transparent resin 42, a part of the light is reflected by the diffraction grating 44 and is attenuated and emitted.

  The diffraction grating 44 is molded on the surface M of the transparent resin 42 by forming a diffraction pattern in advance in a mold for molding the transparent resin 42. The light attenuation rate of the transparent resin 42 is controlled by the shape of the diffraction grating 44.

  Next, a light emitting module 46 according to a sixth embodiment of the present invention will be described with reference to FIG. In addition, the description about the part similar to 1st Embodiment is omitted.

  As shown in FIG. 8, the surface emitting laser 16 is molded with a light absorbing resin 48 in which an insulating carbon black is added as a black pigment to an epoxy resin, and the light is condensed on the surface M of the light absorbing resin 48. The lens 50 is provided integrally.

  Thereby, a part of the light output from the surface emitting laser 16 is absorbed by the insulating carbon black and attenuated, and is condensed by the condenser lens 50 and emitted.

  In this embodiment, the surface-emitting laser 16 is molded with the light-absorbing resin 48 in which insulating carbon black is added as a black pigment to the epoxy resin. However, the resin that molds the surface-emitting laser 16 is described. In addition to the above, the member may be a resin member in which a titanium oxide filler is added to an epoxy resin as in the first embodiment. Further, as in the third embodiment, a light emitting module configured by providing a transparent resin around the light emitting point N of the surface emitting laser 16 and molding the surface emitting laser 16 and the transparent resin with a light absorbing resin, As in the fourth embodiment, the surface emitting laser 16 is molded with a resin member in which a titanium oxide filler is added to an epoxy resin, and the surfaces other than the light emission surface of the resin member are light-absorbed. A light-emitting module configured by molding with resin may be provided with a condenser lens as in the present embodiment.

  Next, a light emitting module 52 according to a seventh embodiment of the present invention will be described with reference to FIG. In addition, the description about the part similar to 1st Embodiment is omitted.

  As shown in FIG. 9, the surface emitting laser 16 is molded with a resin material 54 in which an insulating carbon black is added as a black pigment to an epoxy resin, and a cylindrical sleeve is formed on the surface M of the resin material 54. 56 is projected.

  A ferrule 60 that holds the optical fiber 58 can be inserted into the sleeve 56. When the ferrule 60 is inserted into the sleeve 56, the output direction (optical axis) of light output from the surface-emitting laser 16 is changed. The optical axes of the optical fibers 58 coincide with each other.

  With such a configuration, a part of the light output from the surface emitting laser 16 is absorbed by the insulating carbon black, and the light output from the surface emitting laser 16 is attenuated from the surface M of the resin material 54. And emitted. At this time, the light emitted from the surface M of the resin material 54 enters the optical fiber 58.

  Therefore, just by inserting the ferrule 60 into the light emitting module 52, the optical axis of the light output from the surface emitting laser 16 and the optical axis of the optical fiber 58 coincide with each other. For this reason, the connection work is not complicated, and the cost can be kept low.

  In the present embodiment, the resin member in which insulating carbon black is added as a black pigment to an epoxy resin and the surface emitting laser 16 is molded is described. However, the resin member for molding the surface emitting laser 16 is described. In addition to the above, a resin member in which a titanium oxide filler is added to an epoxy resin may be used as in the first embodiment. Further, as in the third embodiment, a light emitting device configured by providing a transparent resin around the light emitting point N of the surface emitting laser 16 and molding the surface emitting laser 16 and the transparent resin with a light absorbing resin. As in the fourth embodiment, the surface emitting laser 16 is molded with a resin member in which a titanium oxide filler is added to an epoxy resin, and a surface other than the light emission surface of the resin member is formed. A light emitting module configured by molding with a light absorbing resin may also be provided with a sleeve, as in the present embodiment.

  In the present embodiment, the light output from the surface-emitting laser 16 is incident on the optical fiber 58 positioned by the sleeve 56. However, a condensing lens is provided on the sleeve 56, and the surface-emitting laser is provided. The light output from 16 may enter the optical fiber 58 positioned on the sleeve 56 via a condenser lens.

  Further, at this time, a diffraction grating is provided on the surface M of the resin material 54, and the light output from the surface emitting laser 16 enters the optical fiber 58 positioned on the sleeve 56 through the diffraction grating and the condenser lens. You may do it.

  Next, a light emitting module 62 according to an eighth embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 10, the light emitting module 62 has a chip carrier 64 such as a glass epoxy substrate, a ceramic substrate, or a polyimide substrate. A die bonding pad 66 and a wire bonding pad 68 are provided on one surface of the chip carrier 64. Is provided.

  On the other side of the chip carrier 64, a cathode electrode 70 connected to the ground and an anode electrode 72 connected to an external power source are provided. The die bonding pad 66 and the cathode electrode 70 are connected to the through hole 74. The wire bonding pad 68 and the anode electrode 72 are conducted through the through hole 76.

  A surface emitting laser 78 is mounted on the die bonding pad 66, and the surface emitting laser 78 is connected to the wire bonding pad 68 via the wire bonding 80.

  On the other hand, a part of the die bonding pad 66, the surface emitting laser 78, the wire bonding 80, and the wire bonding pad 68 are sealed on one surface of the chip carrier 64 so as to have an insulating property. Is provided. This insulating resin 82 is molded with a conductive light absorbing resin 84 in which conductive carbon black is added to a filler.

  As a result, the light output from the surface emitting laser 78 passes through the insulating resin 82, and a part thereof is absorbed by the conductive carbon black of the conductive light absorbing resin 84. In other words, the light output from the surface emitting laser 78 is attenuated and emitted from the surface M of the conductive light absorbing resin 84.

  At this time, the conductive light absorbing resin 84 is in contact with the die bonding pad 66. That is, the conductive light absorbing resin 84 is connected to the cathode electrode 70 via the die bonding pad 66, and the cathode electrode 70 of the light emitting module 62 is connected to the ground pattern of the printed board (not shown) by soldering or the like. Therefore, the conductive light absorbing resin 84 functions as an electromagnetic shield that blocks electromagnetic waves. Therefore, malfunction of the light emitting module 62 due to electromagnetic noise generated from other electronic components mounted on the printed circuit board 64 can be prevented. Further, electromagnetic noise generated from the light emitting module 62 can be reduced, and malfunction of electronic components and devices provided around the light emitting module can be prevented.

  In the present embodiment, a part of the die bonding pad 66, the surface emitting laser 78, and the insulating resin 82 that seals the wire bonding pad 68 are molded with the conductive light-absorbing resin 84 having an insulating property. However, the insulating resin 82 may be molded with a light-absorbing resin obtained by adding an insulating carbon black as a black pigment to an epoxy resin.

  In addition, instead of the conductive light absorbing resin 84 in which the conductive carbon black of the present embodiment is added to the filler, surface emission is achieved by using a metal member or a resin member in which conductive particles obtained by applying metal plating to the resin are added as a filler. The mold laser 78 and the insulating resin 82 may be molded.

  Next, a light emitting module 86 according to a ninth embodiment of the present invention will be described with reference to FIG. Note that a description of the same parts as those in the eighth embodiment is omitted.

  As shown in FIG. 11, a light transmitting resin 88 made of a transparent resin is provided on one surface of the chip carrier 64, and the light transmitting resin 88 is made of a scattering resin 90 (for example, epoxy, silicone, etc.). A transparent resin molded with inorganic material such as titanium oxide, zircon oxide, zinc oxide, calcium carbonate, alumina, silica, or organic material such as crosslinked polymethyl methacrylate or crosslinked polystyrene). ing.

  Thereby, a part of the light output from the surface emitting laser 78 is emitted from the surface M of the scattering resin 90 while being transmitted through the light-transmitting resin 88 and being scattered by the filler of the scattering resin 90. That is, the light output from the surface emitting laser 78 is attenuated and emitted from the surface M of the scattering resin 90.

  At this time, since the filler in the scattering resin 90 does not contact the surface emitting laser 78 and the wire bonding 80, mechanical damage to the surface emitting laser 78 due to the filler in the scattering resin 90 and disconnection of the wire bonding 80 are prevented. Can be suppressed. Therefore, the yield is improved.

It is a perspective view of the light emitting module of the 1st Embodiment of this invention. It is a figure which shows the light emitting module of the 1st Embodiment of this invention, (A) is a front view, (B) is a side view. It is a graph which shows the relationship of the light emission delay time with respect to the average light output with respect to the optical attenuation factor of the light emitting module with respect to environmental temperature, and an optical attenuation factor. It is a figure which shows the light emitting module of the 2nd Embodiment of this invention, (A) is a front view, (B) is a side view. It is a figure which shows the light emitting module of the 3rd Embodiment of this invention, (A) is a front view, (B) is a side view. It is a figure which shows the light emitting module of the 4th Embodiment of this invention, (A) is a front view, (B) is a side view. It is a figure which shows the light emitting module of the 5th Embodiment of this invention, (A) is a front view, (B) is a side view. It is side surface sectional drawing of the light emitting module of the 6th Embodiment of this invention. It is side surface sectional drawing of the light emitting module of the 7th Embodiment of this invention. It is a figure which shows the light emitting module of the 8th Embodiment of this invention, (A) is a front view, (B) is a side view. It is side surface sectional drawing of the light emitting module of the 9th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Light emitting module 16 Surface emitting laser 20 Resin member 22 Light emitting module 24 Resin member 26 Light emitting module 30 Transparent resin (resin member)
31 resin member 32 light emitting module 40 light emitting module 42 transparent resin (resin member)
44 Diffraction grating (light attenuation means)
46 Light Emitting Module 48 Light Absorbing Resin (Resin Member)
50 Condensing lens (Condensing member)
52 Light Emitting Module 54 Resin Material 56 Sleeve (Positioning Member)
58 Optical fiber (conduction path)
60 Ferrule (conductive member)
62 Light Emitting Module 78 Surface Emitting Laser 84 Conductive Light Absorbing Resin (Resin Member)
86 Light emitting module 90 Scattering resin (resin member)

Claims (8)

A resin member that seals the laser diode and transmits light output from the laser diode;
A light attenuating means for attenuating the amount of light transmitted through the resin member;
A light emitting module comprising: a light emitting module.   The light emitting module according to claim 1, wherein the laser diode is a surface emitting laser.   3. The light emitting module according to claim 1, wherein the light attenuating means is an additive that is added to the resin member and absorbs or scatters light output from the laser diode. 4.   The light emitting module according to claim 3, wherein an output surface of the laser diode is covered with a transparent resin.   The light emitting module according to claim 1, wherein the light attenuating unit is a diffraction grating provided on an emission surface of the resin member.   The light emission according to any one of claims 1 to 5, wherein a condensing part that condenses the light output from the laser diode is provided on an emission surface of the resin member. module.   The light exiting surface of the resin member is provided with a light guide positioning portion through which light output from the laser diode is guided. The light emitting module as described.   The light emitting module according to claim 4, wherein the additive has conductivity, and the resin member is electrically connected to a cathode electrode of the laser diode.

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